CN107237411A - Dual-layer insulation board - Google Patents

Dual-layer insulation board Download PDF

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Publication number
CN107237411A
CN107237411A CN201710615972.5A CN201710615972A CN107237411A CN 107237411 A CN107237411 A CN 107237411A CN 201710615972 A CN201710615972 A CN 201710615972A CN 107237411 A CN107237411 A CN 107237411A
Authority
CN
China
Prior art keywords
frame
thermal
insulation core
upper ledge
lower frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710615972.5A
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Chinese (zh)
Inventor
吴小松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Deqing Jinwei Building Heat Insulating Material Co Ltd
Original Assignee
Zhejiang Deqing Jinwei Building Heat Insulating Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Deqing Jinwei Building Heat Insulating Material Co Ltd filed Critical Zhejiang Deqing Jinwei Building Heat Insulating Material Co Ltd
Priority to CN201710615972.5A priority Critical patent/CN107237411A/en
Publication of CN107237411A publication Critical patent/CN107237411A/en
Pending legal-status Critical Current

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Classifications

    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/62Insulation or other protection; Elements or use of specified material therefor
    • E04B1/74Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
    • E04B1/76Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
    • E04B1/78Heat insulating elements
    • E04B1/80Heat insulating elements slab-shaped

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Acoustics & Sound (AREA)
  • Electromagnetism (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Building Environments (AREA)

Abstract

The present invention relates to a kind of Dual-layer insulation board, it includes thermal-insulation core, lower thermal-insulation core, locating support, and locating support is that it includes the upper ledge being connected with upper thermal-insulation core with flexible frame structure, and the lower frame being connected with lower thermal-insulation core, upper ledge and lower frame disjunctor;Upper ledge and lower frame are equipped with least one swallow-tailed convex frame, and the frame side of upper ledge, lower frame in addition to convex frame is horizontal sides, and the horizontal sides of upper ledge and the horizontal sides of lower frame are parallel;Upper thermal-insulation core, lower thermal-insulation core are equipped with the set hole that the convex frame socket with corresponding upper ledge, lower frame coordinates, and are inserted in hole by the plastic deformation of convex frame between convex frame and set hole, and convex frame plastic deformation forms locking positioning after resetting with set hole.Above-mentioned thermal-insulation core fixed form is relatively simple, and structural strength is preferable, not easily broken and damage, and can design multi-layer heat preserving core body, effectively increases the heat insulation effect of warming plate.

Description

Dual-layer insulation board
Technical field
It is a kind of Dual-layer insulation board the present invention relates to building thermal insulation material.
Background technology
Warming plate is the sheet material commonly used in building field, primarily serves insulation, heat-insulated etc. and acts on.Existing warming plate is usual It is made up of, because thermal-insulation core is mostly fragile cystosepiment, therefore is needed during cast to cystosepiment thermal-insulation core and outer pouring layer Effectively positioning and protection, to prevent from causing because of cystosepiment low intensity the problem of easy fragmentation of warming plate is with damaging.It is existing conventional Means are to intert reinforcement in thermal-insulation core, so as to be combined using reinforcement with castable, effectively improve warming plate entirety Intensity.Although more reliably, stably, operation is relatively complicated, when especially thermal-insulation core is larger for this kind of structure, interts and strengthen Muscle is manually more wasted time and energy, and efficiency is more relatively low.In addition, existing warming plate also has the direct perforate on thermal-insulation core, Castable enters in the pouring hole of thermal-insulation core when enabling to pour, so that overall intensity is improved, but this mode is not suitable for Multi-layer heat preserving core body is designed, multilayer core body is essentially consisted in and is still unfavorable for warming plate bulk strength.Therefore, based on above mentioned problem, Need to be improved existing warming plate.
The content of the invention
To overcome above-mentioned deficiency, a kind of Dual-layer insulation board of present invention design makes it solve existing warming plate thermal-insulation core and consolidated It is fixed more inconvenient, it is difficult to set the technical problem of multi-layer heat preserving core body.It adopts the following technical scheme that realization.
A kind of Dual-layer insulation board, it includes thermal-insulation core, lower thermal-insulation core, locating support, it is characterised in that described fixed Position support is that, with flexible frame structure, the frame structure includes the upper ledge being connected with upper thermal-insulation core, and with lower insulation The lower frame of core body connection, upper ledge and lower frame disjunctor, and in symmetrical structure;The upper ledge and lower frame are equipped with least one dovetail shaped Convex frame, the frame side of upper ledge, lower frame in addition to convex frame is horizontal sides, and the horizontal sides of upper ledge and the horizontal sides of lower frame are parallel;Institute State thermal-insulation core, lower thermal-insulation core and be equipped with the set hole that the convex frame socket with corresponding upper ledge, lower frame coordinates, and convex frame and set hole Between be inserted in hole by the plastic deformation of convex frame, convex frame plastic deformation forms locking positioning after resetting with set hole, and locking is positioned When, left between the end of the convex frame and set bore ends and pour hole, the horizontal sides of upper ledge and the bottom surface of upper thermal-insulation core are put down Face offsets, and the horizontal sides of lower frame and the top surface plane of lower thermal-insulation core offset.By above-mentioned locating support, it can realize and be protected to upper When being filled between effective fixation of warm core body, lower thermal-insulation core, and the convex frame of upper ledge and the convex frame of lower frame with warming plate castable Filling is formed, after castable solidifies, upper thermal-insulation core is connected naturally with lower thermal-insulation core, and sound construction degree is higher, by force Degree and high insulating effect, it is not easily broken.
In above-mentioned Dual-layer insulation board, the upper ledge of the locating support, the horizontal sides of lower frame are described provided with raised rectangle frame The bottom surface of upper thermal-insulation core is provided with the upper groove coordinated with the rectangle frame of upper ledge, and the top surface of the lower thermal-insulation core is provided with and lower frame Rectangle frame coordinate low groove.By setting rectangle frame, enable upper ledge, the stretching regulation of lower frame appropriateness, so as to facilitate convex Frame and the contraposition in set hole coordinate.
In above-mentioned Dual-layer insulation board, the locating support forms upper ledge and lower frame, and upper ledge by flexible folded sheet Horizontal sides and lower frame horizontal sides between be provided with spacing, between the spacing correspondence upper thermal-insulation core, lower thermal-insulation core Spacing.By setting the spacing, the warming plate is set to form an intensity between upper thermal-insulation core and lower thermal-insulation core after pouring Reliable interlayer, so as to improve the overall intensity of warming plate.
In above-mentioned Dual-layer insulation board, to fold position between described upper ledge one end and lower frame one end, the upper ledge other end is with Fixed between the frame other end by connector.Folded portion is convenient to be carried out folding as needed forming above-mentioned required spacing, when After the completion of folding, then fixed by connector, so as to keep the stabilization of upper ledge and lower frame.
In above-mentioned Dual-layer insulation board, the upper thermal-insulation core, the set hole of lower thermal-insulation core are trapezoidal hole.By the structure, Trapezoidal hole is set to coordinate more close reliable with swallow-tailed convex frame.
In above-mentioned Dual-layer insulation board, the positioning branch provided with two groups and the above between the upper thermal-insulation core, lower thermal-insulation core Frame.Multigroup locating support improves the stability of support.
The advantage of the invention is that thermal-insulation core fixed form is relatively simple, structural strength is preferable, not easily broken and damage, And multi-layer heat preserving core body can be designed, effectively increase the heat insulation effect of warming plate.
Brief description of the drawings
Fig. 1 is cross section structure diagram of the present invention.
Fig. 2 is the dimensional structure diagram that thermal-insulation core in the present invention, lower thermal-insulation core are connected by locating support.
Fig. 3 is Fig. 2 configuration schematic diagram.
Sequence number and entitled in figure:1st, pouring layer, 2, upper thermal-insulation core, 201, upper groove, 3, lower thermal-insulation core, 301, under Groove, 4, locating support, 401, upper ledge, 402, lower frame, 403, convex frame, 404, rectangle frame, 405, horizontal sides, 231, set hole.
Embodiment
In conjunction with accompanying drawing, the present invention is described as follows.
As Figure 1-3, the Dual-layer insulation board includes upper thermal-insulation core 2, lower thermal-insulation core 3, locating support 4, San Zhexiang The Dual-layer insulation board is constituted by being externally formed with LIFT 1, that is, again after mutually fixing.Concrete structure is:Locating support 4 be with The material of certain flexibility folds to form frame structure, and the frame structure includes the upper ledge 401 being connected with upper thermal-insulation core 2, and The lower frame 402 being connected with lower thermal-insulation core 3, to fold position between the one end of upper ledge 401 and the one end of lower frame 402, upper ledge 401 is another End is not connected fixation with the other end original state of lower frame 402, and fixation can be formed by connector connection.Upper ledge 401 and lower frame 402 are equipped with two swallow-tailed convex frames 403 in symmetrical structure up and down, upper ledge 401 and lower frame 402, and upper ledge 401, lower frame 402 are removed Frame side beyond convex frame 403 is horizontal sides 405, and the horizontal sides 405 of upper ledge 401 are parallel with the horizontal sides 405 of lower frame 402, and on Spacing, spacing correspondence upper thermal-insulation core 2, lower insulation are provided between the horizontal sides 405 of frame 401 and the horizontal sides 405 of lower frame 402 Spacing between core body 3.Upper thermal-insulation core 2, lower thermal-insulation core 3 are equipped with 403 sets of the convex frame with corresponding upper ledge 401, lower frame 402 The set hole 231 of cooperation is connect, set hole 231 is the plastic deformation set that convex frame 403 is relied between trapezoidal hole, and convex frame 403 and set hole 231 Enter to cover hole 231, the convex plastic deformation of frame 403 forms locking positioning after resetting with set hole 231, during locking positioning, the end of convex frame 403 Left between the set end of hole 231 and pour hole, the horizontal sides 405 of upper ledge 401 and the soffit plane of upper thermal-insulation core 2 offset, The horizontal sides 405 of lower frame 402 and the top surface plane of lower thermal-insulation core 3 offset.
Above-mentioned convex frame 403 and the contraposition in set hole 231 coordinate for convenience, the upper ledge 401 of locating support 4, the middle position of lower frame 402 Horizontal sides 405 between respective two convex frames 403 provided with raised rectangle frame 404, the bottom surface of upper thermal-insulation core 2 be provided with it is upper The upper groove 201 that the rectangle frame 404 of frame 401 coordinates, the top surface of lower thermal-insulation core 3 coordinates provided with the rectangle frame 404 with lower frame 402 Low groove 301.

Claims (6)

1. a kind of Dual-layer insulation board, it includes thermal-insulation core (2), lower thermal-insulation core (3), locating support (4), it is characterised in that The locating support (4) is that, with flexible frame structure, the frame structure includes the upper ledge being connected with upper thermal-insulation core (2) (401) lower frame (402), and with lower thermal-insulation core (3) being connected, upper ledge (401) and lower frame (402) disjunctor, and in symmetrical junction Structure;The upper ledge (401) and lower frame (402) are equipped with least one swallow-tailed convex frame (403), upper ledge (401), lower frame (402) the frame side in addition to convex frame (403) is horizontal sides (405), and horizontal sides (405) and the lower frame (402) of upper ledge (401) Horizontal sides (405) are parallel;The upper thermal-insulation core (2), lower thermal-insulation core (3) are equipped with and corresponding upper ledge (401), lower frame (402) the set hole (231) that convex frame (403) socket coordinates, and by convex frame (403) between convex frame (403) and set hole (231) Hole (231) is inserted in plastic deformation, and convex frame (403) plastic deformation forms locking positioning, locking positioning after resetting with set hole (231) When, left between the end and set hole (231) end of the convex frame (403) and pour hole, the horizontal sides (405) of upper ledge (401) Offseted with the soffit plane of upper thermal-insulation core (2), the horizontal sides (405) of lower frame (402) and the top surface plane of lower thermal-insulation core (3) Offset.
2. Dual-layer insulation board according to claim 1, it is characterised in that upper ledge (401), the lower frame of the locating support (4) (402) horizontal sides (405) are provided with raised rectangle frame (404), and the bottom surface of the upper thermal-insulation core (2) is provided with and upper ledge (401) upper groove (201) that rectangle frame (404) coordinates, the top surface of the lower thermal-insulation core (3) is provided with and lower frame (402) The low groove (301) that rectangle frame (404) coordinates.
3. Dual-layer insulation board according to claim 1, it is characterised in that the locating support (4) is rolled over by flexible sheet material It is folded to form upper ledge (401) and lower frame (402), and upper ledge (401) horizontal sides (405) and lower frame (402) horizontal sides (405) it Between be provided with spacing, the spacing between the spacing correspondence upper thermal-insulation core (2), lower thermal-insulation core (3).
4. Dual-layer insulation board according to claim 3, it is characterised in that described upper ledge (401) one end and lower frame (402) one To fold position between end, fixed between upper ledge (401) other end and lower frame (402) other end by connector.
5. Dual-layer insulation board according to claim 1, it is characterised in that the upper thermal-insulation core (2), lower thermal-insulation core (3) Set hole (231) be trapezoidal hole.
6. Dual-layer insulation board according to claim 1, it is characterised in that the upper thermal-insulation core (2), lower thermal-insulation core (3) Between the locating support (4) provided with two groups and the above.
CN201710615972.5A 2017-07-26 2017-07-26 Dual-layer insulation board Pending CN107237411A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710615972.5A CN107237411A (en) 2017-07-26 2017-07-26 Dual-layer insulation board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710615972.5A CN107237411A (en) 2017-07-26 2017-07-26 Dual-layer insulation board

Publications (1)

Publication Number Publication Date
CN107237411A true CN107237411A (en) 2017-10-10

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Family Applications (1)

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CN201710615972.5A Pending CN107237411A (en) 2017-07-26 2017-07-26 Dual-layer insulation board

Country Status (1)

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CN (1) CN107237411A (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2654742Y (en) * 2003-11-25 2004-11-10 梁成宪 Sandwiched heat insulating building block
CN202627402U (en) * 2012-06-28 2012-12-26 牛智勇 Ultra-light foaming-cement insulation and decoration integrating plate for outer wall of building
CN102979219A (en) * 2012-12-19 2013-03-20 沈阳建筑大学 Connecting structure for inner wall and outer wall of sandwich heat insulating outer wallboard
CN204282581U (en) * 2014-12-09 2015-04-22 张静 A kind of heat insulating and sound insulating combined type shear wall
CN204531084U (en) * 2015-04-07 2015-08-05 李顺田 A kind of integral structure architecture heat preservation non-dismantling formwork
US20160168849A1 (en) * 2012-04-17 2016-06-16 Kevin Patrick Ryan Stay-in-place concrete form connector
CN205421692U (en) * 2016-03-02 2016-08-03 山东唐弘节能新材料有限公司 Cast in situ concrete integration compound insulation block
CN205531306U (en) * 2016-01-15 2016-08-31 许璇璇 Building heat insulation template
JP2017008578A (en) * 2015-06-22 2017-01-12 株式会社タイガーマシン製作所 Form panel and concrete construction method
CN207003694U (en) * 2017-07-26 2018-02-13 浙江德清金威建筑保温材料有限公司 Dual-layer insulation board

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2654742Y (en) * 2003-11-25 2004-11-10 梁成宪 Sandwiched heat insulating building block
US20160168849A1 (en) * 2012-04-17 2016-06-16 Kevin Patrick Ryan Stay-in-place concrete form connector
CN202627402U (en) * 2012-06-28 2012-12-26 牛智勇 Ultra-light foaming-cement insulation and decoration integrating plate for outer wall of building
CN102979219A (en) * 2012-12-19 2013-03-20 沈阳建筑大学 Connecting structure for inner wall and outer wall of sandwich heat insulating outer wallboard
CN204282581U (en) * 2014-12-09 2015-04-22 张静 A kind of heat insulating and sound insulating combined type shear wall
CN204531084U (en) * 2015-04-07 2015-08-05 李顺田 A kind of integral structure architecture heat preservation non-dismantling formwork
JP2017008578A (en) * 2015-06-22 2017-01-12 株式会社タイガーマシン製作所 Form panel and concrete construction method
CN205531306U (en) * 2016-01-15 2016-08-31 许璇璇 Building heat insulation template
CN205421692U (en) * 2016-03-02 2016-08-03 山东唐弘节能新材料有限公司 Cast in situ concrete integration compound insulation block
CN207003694U (en) * 2017-07-26 2018-02-13 浙江德清金威建筑保温材料有限公司 Dual-layer insulation board

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Application publication date: 20171010