CN107236959A - A kind of polishing fluid - Google Patents
A kind of polishing fluid Download PDFInfo
- Publication number
- CN107236959A CN107236959A CN201710364578.9A CN201710364578A CN107236959A CN 107236959 A CN107236959 A CN 107236959A CN 201710364578 A CN201710364578 A CN 201710364578A CN 107236959 A CN107236959 A CN 107236959A
- Authority
- CN
- China
- Prior art keywords
- water quenching
- polishing fluid
- calcium
- polishing
- sulfuric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of polishing fluid, comprise the following steps that：It is 1 by mass ratio：1.3 calcium oxide and silicon-dioxide powdery is put into graphite crucible, is sufficiently mixed, then to be heated to 1,600 1650 DEG C, is then incubated the reaction product that 40 50min obtain calcium oxide and silica；The reaction product of obtained calcium oxide and silica is subjected to Water Quenching, water quenching calcium silicates is obtained；Obtained water quenching calcium silicates is dried, crushed, sieve after extracting screen underflow obtain water quenching calcium silicate powder, be ground into 100 120 mesh powder；Certain density sulfuric acid solution is prepared, obtained water quenching calcium silicate powder is slowly added under conditions of stirring, the mass ratio of the water quenching calcium silicates and sulfuric acid is 1：1.2 1.4, suction filtration after the completion of reaction, as isolated water white transparency filtrate, high-purity silicasol.Advantages of the present invention is：The water quenching calcium silicates that is obtained with high-temperature water quenching of the present invention prepares Ludox with sulfuric acid reaction, not only not metal ion in product, and impurity content is seldom.
Description
Technical field
The invention belongs to technical field of chemical material preparation, more particularly to a kind of polishing fluid.
Background technology
With the progress of society and the development of science and technology, stainless steel metal product is each in the life of industry, agricultural and people
The utilization in individual field is more and more extensive, while also giving social creativity increasing value.In recent years, a kind of slim stainless steel
Substrate because of its plurality of advantages, such as lightweight, rollable, high temperature resistant processing procedure, radiation hardness, block water oxygen, manufacturing cost it is cheap and
Obtain convenient etc., by the preferred ideal material for flexible display substrate, however, table of the FPD industry to stainless steel substrate
Surface roughness requires high, need to carry out sufficient polishing to stainless steel substrate.
At present, the method that metal-working industry is polished to stainless steel substrate mainly have mechanical polishing, chemical polishing and
Electrochemical polish etc..In these methods, mechanical polishing cost is higher, the high equipment needed for high temperature pickling and mechanical polishing of cost and
On its auxiliary material and power consumption；Although preferably, cost is higher, is easily limited by electric force lines distribution, shadow for electrochemical polish polishing effect
Ring color and luster；Chemical polishing cost is low, polishing comprehensive, bright in mirror surface after polishing, but polishing effect is matched somebody with somebody due to chemical polishing solution used
Fang Butong and more difference is presented；And applied to the polishing of the stainless steel substrate in FPD industry, both require fortune
Row cost is low, requires that smooth effect and brightness effect are splendid after polishing again.
The content of the invention
It is an object of the invention to provide a kind of polishing fluid for significantly improving polishing degree.
The technical solution adopted by the present invention is：
A kind of polishing fluid, its innovative point is that the polishing fluid includes chelating agent, oxidant, additive and distilled water, the throwing
Light liquid each component content is：350~400ml/L of chelating agent, 50~110ml/L of oxidant, 50~70ml/L of additive, distilled water
450~600ml/L.
Further, the dicarboxylic acids, polybasic carboxylic acid, amino carboxylic acid, citric acid, at least one of oxalic acid and its salt.
Further, the oxidant includes at least the one of hydrogen peroxide, carbamide peroxide, persulfate and periodate
Kind.
Further, the additive is included in persulfate, periodate, polycarboxylic acids, organic multicomponent phosphoric acid at least
It is a kind of.
Beneficial effects of the present invention are as follows：
Present invention is disclosed a kind of polishing fluid, polishing fluid materials rationally, prepare convenient, with low cost, after polishing fluid polishing
Stainless steel substrate surface roughness it is low, polishing comprehensively, bright in mirror surface, it is shown that splendid smooth effect and brightness effect.
Embodiment
Embodiment 1
A kind of polishing fluid, the polishing fluid includes chelating agent, oxidant, additive and distilled water, and the polishing fluid each component contains
Measure and be：Chelating agent 350ml/L, oxidant 50ml/L, additive 50ml/L, distilled water 450ml/L.The dicarboxylic acids, polynary carboxylic
Acid, amino carboxylic acid, citric acid, at least one of oxalic acid and its salt.The oxidant include hydrogen peroxide, carbamide peroxide,
At least one of persulfate and periodate.The additive includes persulfate, periodate, polycarboxylic acids, organic multicomponent
At least one of phosphoric acid.
Embodiment 2
A kind of polishing fluid, the polishing fluid includes chelating agent, oxidant, additive and distilled water, and the polishing fluid each component contains
Measure and be：Chelating agent 400ml/L, oxidant 110ml/L, additive 70ml/L, distilled water 600ml/L.The dicarboxylic acids, polynary carboxylic
Acid, amino carboxylic acid, citric acid, at least one of oxalic acid and its salt.The oxidant include hydrogen peroxide, carbamide peroxide,
At least one of persulfate and periodate.The additive includes persulfate, periodate, polycarboxylic acids, organic multicomponent
At least one of phosphoric acid.
Embodiment 3
A kind of polishing fluid, the polishing fluid includes chelating agent, oxidant, additive and distilled water, and the polishing fluid each component contains
Measure and be：Chelating agent 380ml/L, oxidant 85ml/L, additive 60ml/L, distilled water 550ml/L.The dicarboxylic acids, polynary carboxylic
Acid, amino carboxylic acid, citric acid, at least one of oxalic acid and its salt.The oxidant include hydrogen peroxide, carbamide peroxide,
At least one of persulfate and periodate.The additive includes persulfate, periodate, polycarboxylic acids, organic multicomponent
At least one of phosphoric acid.
Described above is the preferred embodiment of the present invention, it is impossible to the interest field of the present invention is limited with this.It should refer to
Go out, for those skilled in the art, technical scheme is modified or equivalent substitution, all
Protection scope of the present invention is not departed from.
Claims (4)
1. a kind of polishing fluid, it is characterised in that the polishing fluid includes chelating agent, oxidant, additive and distilled water, the throwing
Light liquid each component content is：350~400ml/L of chelating agent, 50~110ml/L of oxidant, 50~70ml/L of additive, distilled water
450~600ml/L.
2. a kind of polishing fluid according to claim 1, it is characterised in that the dicarboxylic acids, polybasic carboxylic acid, amino carboxylic acid,
Citric acid, at least one of oxalic acid and its salt.
3. a kind of polishing fluid according to claim 1, it is characterised in that the oxidant includes hydrogen peroxide, peroxidating
At least one of hydrogen urea, persulfate and periodate.
4. a kind of polishing fluid according to claim 1, it is characterised in that the additive includes persulfate, periodic acid
At least one of salt, polycarboxylic acids, organic multicomponent phosphoric acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710364578.9A CN107236959A (en) | 2017-05-22 | 2017-05-22 | A kind of polishing fluid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710364578.9A CN107236959A (en) | 2017-05-22 | 2017-05-22 | A kind of polishing fluid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107236959A true CN107236959A (en) | 2017-10-10 |
Family
ID=59985566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710364578.9A Pending CN107236959A (en) | 2017-05-22 | 2017-05-22 | A kind of polishing fluid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107236959A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1333317A (en) * | 2000-01-18 | 2002-01-30 | 普莱克斯·S·T·技术有限公司 | Polishing slurry |
| CN1616572A (en) * | 2004-09-24 | 2005-05-18 | 中国科学院上海微系统与信息技术研究所 | Nano polishing liquid for sulfuric compound phase changing material chemical mechanical polishing and its use |
| CN101636465A (en) * | 2007-01-31 | 2010-01-27 | 高级技术材料公司 | The stabilization that is used for the polymer-silica dispersions of chemical mechanical polishing slurry application |
| CN102453439A (en) * | 2010-10-22 | 2012-05-16 | 安集微电子（上海）有限公司 | Chemical mechanical polishing liquid |
| CN102757731A (en) * | 2011-04-25 | 2012-10-31 | 中芯国际集成电路制造(上海)有限公司 | Polishing solution |
-
2017
- 2017-05-22 CN CN201710364578.9A patent/CN107236959A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1333317A (en) * | 2000-01-18 | 2002-01-30 | 普莱克斯·S·T·技术有限公司 | Polishing slurry |
| CN1616572A (en) * | 2004-09-24 | 2005-05-18 | 中国科学院上海微系统与信息技术研究所 | Nano polishing liquid for sulfuric compound phase changing material chemical mechanical polishing and its use |
| CN101636465A (en) * | 2007-01-31 | 2010-01-27 | 高级技术材料公司 | The stabilization that is used for the polymer-silica dispersions of chemical mechanical polishing slurry application |
| CN102453439A (en) * | 2010-10-22 | 2012-05-16 | 安集微电子（上海）有限公司 | Chemical mechanical polishing liquid |
| CN102757731A (en) * | 2011-04-25 | 2012-10-31 | 中芯国际集成电路制造(上海)有限公司 | Polishing solution |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171010 |
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| WD01 | Invention patent application deemed withdrawn after publication |