CN107236096A - A kind of transparent SLA photosensitive resin compositions - Google Patents
A kind of transparent SLA photosensitive resin compositions Download PDFInfo
- Publication number
- CN107236096A CN107236096A CN201710590607.3A CN201710590607A CN107236096A CN 107236096 A CN107236096 A CN 107236096A CN 201710590607 A CN201710590607 A CN 201710590607A CN 107236096 A CN107236096 A CN 107236096A
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- Prior art keywords
- transparent
- photosensitive resin
- resin compositions
- sla
- compositions according
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- 239000011342 resin composition Substances 0.000 title claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 150000003254 radicals Chemical class 0.000 claims abstract description 6
- -1 glycidyl ester Chemical class 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 2
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- 238000012663 cationic photopolymerization Methods 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-trimethylbenzene Chemical class CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 claims 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 125000006267 biphenyl group Chemical group 0.000 claims 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical group C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 239000012745 toughening agent Substances 0.000 abstract description 4
- 150000001768 cations Chemical class 0.000 abstract description 3
- 239000003999 initiator Substances 0.000 abstract description 3
- 238000003848 UV Light-Curing Methods 0.000 abstract description 2
- 238000000016 photochemical curing Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 10
- 229920005862 polyol Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 150000003077 polyols Chemical class 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- 238000010146 3D printing Methods 0.000 description 3
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 3
- 229920001610 polycaprolactone Polymers 0.000 description 3
- 239000004632 polycaprolactone Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- GTACSIONMHMRPD-UHFFFAOYSA-N 2-[4-[2-(benzenesulfonamido)ethylsulfanyl]-2,6-difluorophenoxy]acetamide Chemical compound C1=C(F)C(OCC(=O)N)=C(F)C=C1SCCNS(=O)(=O)C1=CC=CC=C1 GTACSIONMHMRPD-UHFFFAOYSA-N 0.000 description 2
- YYPNJNDODFVZLE-UHFFFAOYSA-N 3-methylbut-2-enoic acid Chemical compound CC(C)=CC(O)=O YYPNJNDODFVZLE-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical class OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 description 1
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 description 1
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 1
- 101710130081 Aspergillopepsin-1 Proteins 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 102100031007 Cytosolic non-specific dipeptidase Human genes 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-N Formic acid Chemical class OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical class OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- PTIXVVCRANICNC-UHFFFAOYSA-N butane-1,1-diol;hexanedioic acid Chemical compound CCCC(O)O.OC(=O)CCCCC(O)=O PTIXVVCRANICNC-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- ZOJPTQRKWVDKTP-UHFFFAOYSA-N decane methanol prop-2-enoic acid Chemical compound C(C=C)(=O)O.C(C=C)(=O)O.CO.CO.CCCCCCCCCC ZOJPTQRKWVDKTP-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- PODOEQVNFJSWIK-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethoxyphenyl)methanone Chemical compound COC1=CC(OC)=CC(OC)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 PODOEQVNFJSWIK-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229940068918 polyethylene glycol 400 Drugs 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/02—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonates or saturated polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
Abstract
The invention discloses a kind of transparent SLA photosensitive resin compositions, using PCDL as modified toughened dose, its consumption is the 3~15% of total resin weight, in addition to following mass percent component：Cation photocuring component 45~70%, radical UV curing component 20~40%, cation light initiator 2~10%, free radical photo-initiation 1~8%.The present invention from PCDL as system toughener can equilibrium water absorption, transparency and impact strength well, while nor affecting on the mechanical tensile strength of system.Bubble-free is produced during product, and product water absorption rate is low, and toughness and transparency are good, and the requirement that client builds to Transparent Parts can be met well.
Description
【Technical field】
The present invention relates to a kind of transparent SLA photosensitive resin compositions.
【Background technology】
Material for photocureable rapid shaping is liquid photocurable resin, or liquid photosensitive resin, mainly by oligomerisation
Thing, light trigger, diluent composition.Nearly 2 years, photosensitive resin had just been used for 3D printing emerging industry, because its outstanding characteristic
And it is interest in industry with paying attention to.
In the prior art, transparent SLA photosensitive resins are if it is intended to obtaining, there is good impact strength to be typically necessary
Polyalcohol is added in formula system as toughener, and the problems such as due to Miscibility and poor polyalcohol hydrolytic resistance,
The introducing of general polyester, polyethers or polycaprolactone polyol can cause system transparency to decline, and water absorption rate rises, and then cause system
Part sends out mist, and durability and dimensional stability decline.
The present invention is based on the deficiency and the deficiencies in the prior art of above product and produced.
【The content of the invention】
The purpose of the present invention is to overcome the deficiencies in the prior art good there is provided a kind of transparency, has good mechanical stretching concurrently
The transparent SLA photosensitive resin compositions of intensity and impact strength, it is adaptable in 3D printing, photocureable coating or photoresist.
The present invention to achieve the above object, using following technical scheme：
Transparent SLA photosensitive resin compositions, it is characterised in that using PCDL as modified toughened dose, it is tied
Structure formula is as follows：
N=1-7 therein, wherein R1, R2Structural formula be selected from following one of which：
M=1-5 therein；
The consumption of the PCDL is the 3~15% of total resin weight.
PCDL compares other kinds of polyalcohol, such as polyester polyol, polycaprolactone polyol or poly-
Carbonate group in tetrahydrofuran polyalcohol etc., its molecular structure compares ester group, and its anti-hydrolytic performance is more excellent, than poly- four
In hydrogen furan polyols the acid-proof alkaline of ehter bond and UV resistant performance more preferably, and in SLA 3D printings, the sun used from
Sub-light initiator is a kind of strong-acid type material, and resin needs long-time to be worked under the conditions of ultraviolet light irradiation, therefore, using poly-
Esters, polycaprolactone or polytetrahydrofuran polyol carry out toughening modifying, and resin material can be caused to divide caused by ultraviolet light irradiation
Subchain be broken or other side reactions generation, be unfavorable for part performance stability keep, and under strong acid condition ester group hydrolysis
Product polar groups can be directly resulted in increase, the rise of product water absorption rate, so as to cause product durability to decline, is unfavorable for thereafter
The application of phase.
The transparent SLA photosensitive resin compositions of the present invention, it is characterised in that including following mass percent component：
Further, transparent SLA photosensitive resin compositions of the invention, it is characterised in that including following mass percent group
Point：
Cation photocuring component in the present invention is glycidyl ether type epoxy resin, glycidol esters asphalt mixtures modified by epoxy resin
One or more in fat, cycloaliphatic epoxy resin and vinyl ethers monomer.It is preferred that bis-phenol A glycidyl ether (NPEL-
128), hydrogenated bisphenol A glycidol ether (0575), 3,4- epoxycyclohexyl-methyls 3,4- epoxycyclohexyls formic acid esters (TTA21),
One or more in double (7- oxabicyclos [4.1.0] 3- methyl in heptan) adipate esters (TTA26).
Radical UV curing component in the present invention is made up of acrylate monomer and its prepolymer.It is preferred that epoxy acrylic
Ester (CN104NS), trimethylolpropane trimethacrylate (SR351), polyethylene glycol 400 dimethylacrylate (SR644), 1,
6- hexanediyl esters (SR238TFN), tricyclic decane Dimethanol Diacrylate (SR833S), (2) ethoxylated bisphenol A
One or more in dimethylacrylate (SR348L NS).
The preferred liquid hexafluoro antimonate (TR-PAG-20002) of cationic light trigger of the present invention and 50% diphenyl-
The one or two of the carbonic allyl ester solution (CPI-101A) of (4- phenyl sulphur) phenyl sulfonium hexafluoro antimonate.
The preferred 1- hydroxy-cyclohexyl-phenyls ketone (Irgacure184) of the luminous initiator of free radical in the present invention, 2- hydroxyls
Base -2- methyl isophthalic acids-phenyl -1- acetone (Daracur 1173), diphenyl (2,4,6- trimethylbenzoyl) phosphorous oxide
One or more in (Lucirin TPO).
(wherein R1, R2 structure are shown in chemistry to modified toughened dose of preferred PCDL BH-100 in the present invention respectively
Formula (1) and (3), n ≈ 3)；PCDL PH-50 (R1, R2 structure are shown in chemical formula (1) and (2), n ≈ 1 respectively)；Poly- carbon
Acid esters dihydric alcohol UHC-50-200 (R1, R2 structural formula are shown in chemical formula (1) and (5), wherein m=2, n ≈ 4 respectively)；Makrolon
One kind in dihydric alcohol UM-90 (1/1) (wherein R1, R2 structure are shown in chemical formula (1) and (4), n ≈ 3 respectively).
Toughener in the market also has the PEPA (CMA-1044) based on butanediol-adipic acid, gathers oneself
One kind in lactone polyols (PCL303T), polytetrahydrofuran polyol (PTMG1000).
When prepared by the present invention transparent SLA photosensitive resin compositions, each raw material components are mixed for (20-40 DEG C) at ambient temperature
Conjunction stirs.
Compared with prior art, the present invention has the following advantages：
The present invention from PCDL as system toughener can well equilibrium water absorption, transparency and
Impact strength, while nor affecting on the mechanical tensile strength of system.Bubble-free is produced during product, and product water absorption rate is low,
Toughness and transparency are good, and the requirement that client builds to Transparent Parts can be met well.
【Embodiment】
Further more detailed description is done to the present invention below in conjunction with specific embodiment.
Table 1：Embodiment A-G each component degree
Table 2：Embodiment H-K and comparative example 1-4 each component degree
To embodiment A-K, comparative example 1-4 is tested, and test result is as shown in table 3, wherein：Critical phototonus energy EcWith
Curing depth DpTest：
Using SLA 3D printers, in known laser power PL, laser scanning interval hsIn the case of, using different laser
Sweep speed Vs, Single Slice Mode solidification is carried out, different-thickness C is obtaineddExemplar, according to formula Cd=Dpln[PL/(Vs*hs)]-
DplnEc, corresponding straight line is drawn, wherein curing depth D can be tried to achieve by the slope and slope of straight linep, and critical phototonus energy
Ec。
Work filling sweep speed：
Using SLA 3D printers, in constant power PLIn the case of=280mW, solidification is scanned, wherein can be taken
Make fluent material curing molding, it is possible to take out the maximum filling sweep speed cleaned and fill scanning for the work of the material
Speed.The index directly reflects the solidification rate of the light-sensitive material, and the work filling sweep speed of wherein material is higher, the material
The shaping efficiency of material is higher, and in SLA 3D printers, building same product, the required time greatly shortens, greatly
Ground improves operating efficiency, reduces time cost.
The test of tensile strength and stretch modulus：
According to standard ASTM D638, measured using computermatic tensile testing machine (Dongguan section key KJ-1065)；
Shore hardness D test：
According to standard ASTM D2240, measured using shore durometer D types 0-100HD；Notched Izod impact hit intensity
Test：
According to standard ASTM D256, measured using digital display balance weight impact testing machine (Dongguan section key KJ-3090).
The test of transparency：
Make method of testing by oneself, take 15 ± 0.2g liquid resins to pour into PP plastic cups, stand to be put into after still it is ultraviolet after
Solidification case irradiates 20min, and taking-up is inverted into irradiates 20min again, and transparency contrast is carried out with standard 1cm thickness PMMA plates, wherein
Standard PMMA plate transparencies are set as 5.
Table 3：Embodiment A-H and comparative example 1-4 DCO Comparative result tables
A-K of embodiment of the present invention SLA photosensitive resins are equal in terms of transparency it can be seen from the performance indications in table 3
Better than comparative example, and its water absorption rate is relatively low, and product dimensional stability in use and machinery can be effectively ensured
The holding of intensity, its mechanical tensile strength and toughness are also more excellent, balance the threes' such as intensity, toughness and water absorption rate well
Contradictory relation, can effectively meet the performance requirements to transparent resin material in SLA3D printings.To sum up surface, of the invention
The transparent photosensitive resin being related to is greatly improved relative to prior art tool, is worthy of popularization.
Embodiment described above is only that the preferred embodiment of the present invention is described, not to the model of the present invention
Enclose and be defined, on the premise of design spirit of the present invention is not departed from, skill of this area ordinary skill technical staff to the present invention
Within various modifications and improvement that art scheme is made, the protection domain that claims of the present invention determination all should be fallen into.
Claims (7)
1. transparent SLA photosensitive resin compositions, it is characterised in that modified toughened dose, its structure are used as using PCDL
Formula is as follows：
N=1-7 therein, wherein R1, R2Structural formula be selected from following one of which：
M=1-5 therein,
The consumption of the PCDL is the 3~15% of total resin weight.
2. transparent SLA photosensitive resin compositions according to claim 1, it is characterised in that including following mass percent group
Point：
3. transparent SLA photosensitive resin compositions according to claim 2, it is characterised in that including following mass percent group
Point：
4. the transparent SLA photosensitive resin compositions according to Claims 2 or 3, it is characterised in that described cationic photopolymerization is consolidated
It is glycidyl ether type epoxy resin, glycidyl ester epoxy resin, cycloaliphatic epoxy resin and vinyl ethers to change component
One or more in monomer.
5. the transparent SLA photosensitive resin compositions according to Claims 2 or 3, it is characterised in that described free radical light light
Curing component is made up of acrylate monomer and its prepolymer.
6. the transparent SLA photosensitive resin compositions according to Claims 2 or 3, it is characterised in that described cationic photopolymerization draws
Send out the carbonic allyl ester solution that agent is selected from liquid hexafluoro antimonate and 50% diphenyl-(4- phenyl sulphur) phenyl sulfonium hexafluoro antimonate
One or two.
7. the transparent SLA photosensitive resin compositions according to Claims 2 or 3, it is characterised in that described free radical triggers
Agent is selected from 1- hydroxy-cyclohexyl-phenyl ketone, 2- hydroxy-2-methyl -1- phenyl -1- acetone, diphenyl (2,4,6- trimethylbenzenes
Formoxyl) one or more in phosphorous oxide.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590607.3A CN107236096B (en) | 2017-07-19 | 2017-07-19 | Transparent SLA photosensitive resin composition |
| PCT/CN2018/078545 WO2019015335A1 (en) | 2017-07-19 | 2018-03-09 | Transparent sla photosensitive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590607.3A CN107236096B (en) | 2017-07-19 | 2017-07-19 | Transparent SLA photosensitive resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107236096A true CN107236096A (en) | 2017-10-10 |
| CN107236096B CN107236096B (en) | 2020-05-26 |
Family
ID=59990613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710590607.3A Active CN107236096B (en) | 2017-07-19 | 2017-07-19 | Transparent SLA photosensitive resin composition |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107236096B (en) |
| WO (1) | WO2019015335A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN109517340A (en) * | 2018-11-21 | 2019-03-26 | 中山大简科技有限公司 | A kind of transparent 3D printing photosensitive resin of heatproof |
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| WO2019015335A1 (en) * | 2017-07-19 | 2019-01-24 | 中山大简科技有限公司 | Transparent sla photosensitive resin composition |
| WO2019124232A1 (en) * | 2017-12-22 | 2019-06-27 | キヤノン株式会社 | Photocurable resin composition |
| JP2019112517A (en) * | 2017-12-22 | 2019-07-11 | キヤノン株式会社 | Photocurable resin composition |
| US11578169B2 (en) | 2017-12-22 | 2023-02-14 | Canon Kabushiki Kaisha | Photocurable resin composition |
| JP7227695B2 (en) | 2017-12-22 | 2023-02-22 | キヤノン株式会社 | Photocurable resin composition |
| CN109517340A (en) * | 2018-11-21 | 2019-03-26 | 中山大简科技有限公司 | A kind of transparent 3D printing photosensitive resin of heatproof |
| CN109517340B (en) * | 2018-11-21 | 2021-03-23 | 中山大简科技有限公司 | Temperature-resistant transparent photosensitive resin for 3D printing |
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| Publication number | Publication date |
|---|---|
| WO2019015335A1 (en) | 2019-01-24 |
| CN107236096B (en) | 2020-05-26 |
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