CN107234812A - Pressurize tool - Google Patents
Pressurize tool Download PDFInfo
- Publication number
- CN107234812A CN107234812A CN201710552387.5A CN201710552387A CN107234812A CN 107234812 A CN107234812 A CN 107234812A CN 201710552387 A CN201710552387 A CN 201710552387A CN 107234812 A CN107234812 A CN 107234812A
- Authority
- CN
- China
- Prior art keywords
- tool
- pressurize
- bonded assembly
- mating surface
- receiving space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
- B29C66/7422—Aluminium or alloys of aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
- B29C66/8145—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
- B29C66/8161—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps said pressing elements being supported or backed-up by springs or by resilient material
- B29C66/81611—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps said pressing elements being supported or backed-up by springs or by resilient material by resilient material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
- B29L2031/3437—Cellular phones
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Automatic Assembly (AREA)
Abstract
The disclosure provides a kind of pressurize tool, it includes the first tool and the second tool, first tool can coordinate with the second tool to be assembled, and form receiving space between the first mating surface of the first tool and the second mating surface of the second tool, receiving space is used to house the bonded assembly being made up of at least two workpiece, to carry out pressurize to bonded assembly；Wherein, cushion is also contained in receiving space, cushion is located at least one of the first mating surface, second mating surface between bonded assembly, and in the receiving space along along pressurize force direction and cushion interference fit.The pressurize tool of the disclosure is to bonded assembly pressurize, the dependence to professional press equipment can be eliminated, and because the preparation cost of single pressurize tool is extremely cheap than for professional press equipment, substantial amounts of pressurize tool can be prepared under identical cost, the quantity limitation of professional press equipment is broken through, so as to help to lift the pressurize efficiency and production efficiency to bonded assembly.
Description
Technical field
This disclosure relates to press equipment technical field, more particularly to a kind of pressurize tool.
Background technology
In correlation technique, the battery cover of mobile phone includes aluminium alloy stamping parts and plastic.When assembling mobile phone battery cover, elder generation is needed
The aluminium alloy stamping parts of battery cover and plastic dispensing are assembled, then aluminium alloy stamping parts and plastic carried out using press equipment
Pressurize until glue condense so that obtain by two assembling components into battery cover.
However, pressurize aluminium alloy stamping parts and plastic need to take a certain time, each battery cover is in pressure maintaining period
A press equipment need to be used.In the case where ensureing the battery cover dwell time, the needs that increase productivity if desired increase pressure
Number of devices is closed, press equipment price is higher to increase production cost.Therefore pressurize life is carried out to battery cover using press equipment
Production, also limit the production production capacity to battery cover to a certain extent.
The content of the invention
The disclosure provides a kind of pressurize tool, to solve the deficiency in correlation technique.
According to the first aspect of the embodiment of the present disclosure, there is provided a kind of pressurize tool.The pressurize tool include the first tool and
Second tool, first tool can with second tool coordinate assemble, and first tool the first mating surface with
Receiving space is formed between second mating surface of second tool, the receiving space is used to house by least two workpiece groups
Into bonded assembly, with to the bonded assembly carry out pressurize；Wherein, cushion is also contained in the receiving space, it is described
Cushion is located at least one of first mating surface, described second mating surface between the bonded assembly, along pressurize
It is interference fitted on force direction between the receiving space and the cushion.
Optionally, the bonded assembly is included towards at least one of first mating surface and second mating surface
Appearance, the cushion covers at least a portion of the appearance.
Optionally, pressurize tool also includes the fixing device being arranged on first tool, and the fixing device is used for
The bonded assembly is fixed on first tool so that the bonded assembly can be contained in the receiving space；Its
In, the receiving space is arranged on second tool.
Optionally, pressurize tool also includes the fixing device being arranged in the receiving space, and the fixing device is used for
The bonded assembly is fixed in the receiving space.
Optionally, the fixing device includes at least two clamping elements, and at least two clamping element is respectively used to clamping
At least one set of symmetrical sides of the bonded assemblies.
Optionally, the clamping element include body, the body provided with deformations and with the bonded assembly
The clamping part of cooperation, the clamping part is connected by deformations with the body.
Optionally, the fixing device also includes position limiting structure, and the position limiting structure is used to position the bonded assembly
Placement location.
Optionally, the position limiting structure includes the first limiting section, and first limiting section is used for the spacing bonded assembly
At least one set of symmetrical sides.
Optionally, the position limiting structure also includes the second limiting section, and second limiting section is used for and the bonded assembly
Mounting hole coordinate.
Optionally, when the bonded assembly is the back board structure of electronic equipment, the mounting hole is the back board structure
On camera hole and/or fingerprint hole.
Optionally, pressurize tool also includes locating dowel and the positioning hole used cooperatively；The locating dowel is arranged at described
In one mating surface and second mating surface on any structure, the positioning hole is located in another structure.
Optionally, pressurize tool also includes buckle and notch；The buckle is arranged at first mating surface and institute
State in the second mating surface on any structure, the notch is located in another structure, and the buckle and the notch are matched somebody with somebody
Share in connection first tool and second tool.
According to the second aspect of the embodiment of the present disclosure, there is provided a kind of pressurize tool.Pressurize tool includes the first tool and the
Two tools, first tool can coordinate with second tool to be assembled, and the first mating surface in first tool and institute
Formed between the second mating surface for stating the second tool and cushion, the receiving space are provided with receiving space, the receiving space
For housing the bonded assembly being made up of at least two workpiece, to carry out pressurize to the bonded assembly；Wherein, along packing pressure
It is interference fitted on direction between the bonded assembly and the cushion.
The disclosure combines the pressurize tool formed with the second tool to bonded assembly pressurize by using by the first tool, can
To eliminate the dependence to professional press equipment, and due to single pressurize tool preparation cost than professional press equipment for
It is extremely cheap, substantial amounts of pressurize tool can be prepared under identical cost, the quantity limitation of professional press equipment is broken through, so as to have
Help pressurize efficiency and production efficiency of the lifting to bonded assembly.Meanwhile, it is bonded assembly pressurize by using cushion, can be with
Make bonded assembly by packing pressure in a balanced way, pressurize tool can also be avoided to scratch the appearance of bonded assembly.
Brief description of the drawings
Fig. 1 is that receiving space is located on the first tool in a kind of pressurize tool shown in the exemplary embodiment of the disclosure one
Schematic diagram.
Fig. 2 is that receiving space is located at the first tool and the in a kind of pressurize tool shown in the exemplary embodiment of the disclosure one
Schematic diagram on two tools.
Fig. 3 is the explosive view of a kind of pressurize tool shown in the exemplary embodiment of the disclosure one and bonded assembly.
Fig. 4 is the structural representation of clamping element in a kind of pressurize tool shown in the exemplary embodiment of the disclosure one.
Fig. 5 is the structural representation of the first tool in a kind of pressurize tool shown in the exemplary embodiment of the disclosure one.
Fig. 6 is the structural representation of the second tool in a kind of pressurize tool shown in the exemplary embodiment of the disclosure one.
Fig. 7 is the structural representation at the first tool back side in a kind of pressurize tool shown in the exemplary embodiment of the disclosure one
Figure.
Fig. 8 is the structural representation at the second tool back side in a kind of pressurize tool shown in the exemplary embodiment of the disclosure one
Figure.
Fig. 9 is a kind of structural representation of pressurize tool shown in disclosure another exemplary embodiment.
Embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Following description is related to
During accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous key element.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the disclosure.On the contrary, they be only with it is such as appended
The example of the consistent apparatus and method of some aspects be described in detail in claims, the disclosure.
The term used in the disclosure is the purpose only merely for description specific embodiment, and is not intended to be limiting the disclosure.
" one kind ", " described " and "the" of singulative used in disclosure and the accompanying claims book are also intended to including majority
Form, unless context clearly shows that other implications.It is also understood that term "and/or" used herein refers to and wrapped
It may be combined containing one or more associated any or all of project listed.
It will be appreciated that though various information, but this may be described using term first, second, third, etc. in the disclosure
A little information should not necessarily be limited by these terms.These terms are only used for same type of information being distinguished from each other out.For example, not departing from
In the case of disclosure scope, the first information can also be referred to as the second information, similarly, and the second information can also be referred to as
One information.Depending on linguistic context, word as used in this " if " can be construed to " ... when " or " when ...
When " or " in response to determining ".
Fig. 1 is that the disclosure one applies receiving space in the pressurize tool exemplified and is formed at the schematic diagram on the first tool.Please
Refering to Fig. 1, the pressurize tool includes the first tool 1 and the second tool 2, and the first tool 1 can coordinate with the second tool 2 to be assembled.The
One tool 1 includes the first mating surface 11, and the second tool 2 includes the second mating surface 21, is controlled coordinating assembling the first tool 1 and second
When having 2, first mating surface 11 is opposite with the second mating surface 21.Wherein, receiving space 22 is additionally provided with the second tool 2, should
Receiving space 22 is formed in the second mating surface 21.Bonded assembly and cushion are housed in receiving space 22, pressurize tool
Pressurize can be carried out to bonded assembly.As a variant embodiment of the present embodiment, receiving space 22 can also be controlled located at first
Tool 1, is formed in the first mating surface 11.
Fig. 2 be the disclosure one apply receiving space in the pressurize tool exemplified be formed on the first tool and the second tool on
Schematic diagram.It can be controlled referring to Fig. 2, the pressurize tool includes the first tool 1a and the second tool 2a, the first tool 1a with second
Have 2a and coordinate assembling.First tool 1a includes the first mating surface 11a, and the second tool 2a includes the second mating surface 21a, with charge-coupled
When filling the first tool 1a and the second tool 2a, the first mating surface 11a and the second mating surface 21a are opposite.Wherein, the second tool
Receiving space 22a is additionally provided with 2a, receiving space 22a is formed on the second mating surface 21a.Bonded assembly and cushion are received
Hold in receiving space 22a, pressurize tool can carry out pressurize to bonded assembly.
The set location that pressurize tool in above-described embodiment differs only in receiving space is different, but the pressurize used is former
Reason is identical, can reach the pressurize effect to bonded assembly.In order to make it easy to understand, below mainly for the implementation shown in Fig. 1
Example, technical scheme of this disclosure is described in detail.
Fig. 3 is the explosive view of a kind of pressurize tool that the implementation of the disclosure one is exemplified and bonded assembly.As shown in figure 3, false
Determine bonded assembly 3 to be made up of the first workpiece 31 and second workpiece 32, during the pressurize bonded assembly 3, the first workpiece 31 need to be placed
Dispensing is combined on second workpiece 32, and then the first workpiece 31 and second workpiece 32 of bonding are put into receiving space 32；The
One workpiece 31 is located at the side of the first tool 1 of pressurize tool, and second workpiece 32 is located at the side of the second tool 2.Certainly, in others implementation
In example, bonded assembly 3 can also be made up of the workpiece of three or more quantity, and the disclosure is not limited this.
In the present embodiment, bonded assembly 3 can be the housing of electronic equipment, such as mobile phone battery cover, and the disclosure is simultaneously
This is not limited.Bonded assembly 3 is contained in together with cushion 23 in the receiving space 22 of pressurize tool, along packing pressure
Receiving space 22 is interference fitted with cushion 23 on direction.As shown in figure 3, in the X-direction of sign, the size of receiving space 22
Less than the size sum of bonded assembly 3 and cushion 23, when bonded assembly 3 is contained in the receiving space 22 together with cushion 23
When middle, because receiving space 22 is interference fitted with cushion 23, so pressurize tool may be such that elastic deformation occurs for cushion 23,
And give the packing pressure of bonded assembly 3.In this embodiment, the cushion 23 can be silica gel, excellent power glue or wait that the disclosure is not
This is limited.
From above-described embodiment, the disclosure combines the pressurize tool formed with the second tool by using by the first tool
To bonded assembly pressurize, the dependence to professional press equipment can be eliminated, and due to single pressurize tool preparation cost compared with
Specialty press equipment for it is extremely cheap, can be prepared under identical cost substantial amounts of pressurize tool, break through specialty pressing set
Standby quantity limitation, so as to help to lift the pressurize efficiency and production efficiency to bonded assembly.Also, by setting cushion
23, on the one hand the cushion 23 can realize and preferably contacts with bonded assembly 3, on the other hand can also make bonded assembly 3 by
To packing pressure in a balanced way, it is ensured that each bonding region between the first workpiece 31 and second workpiece 32 is realized firm bonding.
Simultaneously as limited by production technology, the actual size of the receiving space 22 of pressurize tool often with design
There is certain foozle between size, and cushion 23 can be made using the appropriate support of its resilient characteristic offer and buffering
With to make up the foozle problem of receiving space 22, so as to can both ensure to complete pressurize work(when receiving space 22 is excessive
Can, it can avoid that bonded assembly 3 is caused to damage when receiving space 22 is too small again.
In addition, by the way that cushion 23 is covered on the position that bonded assembly 3 is contacted with pressurize tool, the energy of cushion 23
It is enough that the appearance of bonded assembly 3 is covered in larger area, thus can prevent pressurize tool from scratching the outward appearance of bonded assembly 3
Face.By taking Fig. 3 as an example, the appearance 322 of second workpiece 32 is placed towards the second tool 2, and the appearance 322 is controlled with second during pressurize
The contact of tool 2 is easily scratched.Cushion 23 is arranged in the appearance 322 for being covered in second workpiece 32, makes the appearance 322 not
It can be contacted with the second tool 2, you can prevent bonded assembly 3 to be scratched.In other embodiments, the appearance can also be first
Cushion 23 can be arranged on the surface of first workpiece 31 and first and control by the surface of workpiece 31, the surface towards the first tool 1
Have 1 tool, cushion 23 is covered the surface of first workpiece 31.Or, the surface of the first workpiece 31 and second workpiece 32
The appearance that surface is collectively constituted, the surface of the first workpiece 31 and the surface of second workpiece 32 are respectively facing the first tool 1 and
Two tools 3, cushion 23 are covered each by the surface of the first workpiece 31 and second workpiece 32.
In the above-described embodiments, pressurize tool can also include fixing device, and the fixing device includes at least two and clamped
Part 12, the clamping element 12 is used for fixed bonding component 3 and it is positioned.As shown in figure 3, being additionally provided with and clamping on the second tool 2
What part 12 coordinated keeps away bit architecture 27, and this keeps away bit architecture 27 for bar-shaped trough, in receiving space 22, and with the top of clamping element 12
Coordinate.
Fig. 4 is the structural representation of clamping element in a kind of pressurize tool that the implementation of the disclosure one is exemplified.As shown in figure 4,
Clamping element 12 include body 121, the body 121 provided with deformations 122 and with the folder for clamping bonded assembly 122
Portion 123 is held, clamping part 123 is connected by deformations 122 with body 121.In the present embodiment, clamping element 12 is controlled located at first
On tool 1.Wherein, body 121 is arranged in the first mating surface 11 and is obliquely installed towards bonded assembly 3, and deformations 122 are one
Arcuate structure and as the top of clamping element 12, the deformations 122 can be deformed upon so that clamping part 123 clamps bonded assembly
3。
The structural representation of first tool in a kind of pressurize tool that the implementation of Fig. 5 disclosure one is exemplified.Referring to Fig. 5,
Clamping element 12 is arranged on the first tool 1, can be fixed on bonded assembly 3 on first tool 1, to be positioned to bonded assembly 3.
In the present embodiment, six clamping elements 12 are provided with the first mating surface 11 of the first tool 1, wherein three clamping elements 12 are used for
A side 311 of bonded assembly 3 is clamped, the other three clamping element 12 is used for another side 312 for clamping bonded assembly 3.Certainly,
The clamping element 12 of other numbers can also be set, positioning bonding component 3 is met, the disclosure is not limited this.
In other embodiments, clamping element 12 can also be arranged in receiving space 22, and bonded assembly 3 is directly anchored to house empty
Between in 33.
Further, elastically-deformable elastic component can occur for clamping element 12, and the clamping element 12 can hang down with packing pressure X-direction
A clamping force is provided on straight direction (Y-direction as shown in Figure 3), prevents second workpiece 32 from deforming.By above-described embodiment
Understand, packing pressure X-direction is axially vertical with the first workpiece 31, packing pressure can make second workpiece 32 occur shape in pressure maintaining period
Become, such as two ends of the first workpiece 31 are upturned, so as to cause the first workpiece 31 of bonding and the local generation seam of second workpiece 31
Gap etc..In the present embodiment, clamping element 12 is arranged on the two ends of the first workpiece 31, and the clamping part 123 of multiple clamping elements 12 is distinguished
Two sides 311,312 of the first workpiece are clamped, packing pressure can be overcome to make the problem of the first workpiece 31 is deformed, so as to carry
The pressurize quality of high pressurize tool.
For the placement location of more preferable positioning bonding component 3, fixing device also includes position limiting structure, and the position limiting structure is used for
The placement location of positioning bonding component 3.
In one embodiment, as shown in figure 5, position limiting structure can be used for including the first limiting section 13 first limiting section 13
At least one set of symmetrical sides of spacing bonded assembly 3.For example in embodiment, the first limiting section 13 is arranged on the first mating surface 11
On, it can be used cooperatively with above-mentioned clamping element 12；First limiting section 13 and clamping element 12 are separately positioned on one group pair of bonded assembly 3
Claim by side.When binding agent 3 is housed in receiving space 22, the bonding in the presence of the limiting section 13 of clamping element 12 and first
Component 3 will not be moved, it is ensured that the pressurize effect of bonded assembly 3.
In another embodiment, position limiting structure can also include the second limiting section 14, and second limiting section 14 is used for gluing
The mounting hole 321 of connected components 3 coordinates.As shown in figure 5, the second limiting section 14 is a column construction, the first mating surface 11 is arranged at
On, when bonded assembly 3 is the back board structure of electronic equipment, mounting hole 321 is camera hole and/or fingerprint on the back board structure
Hole, the second limiting section 14 can coordinate to position the back board structure with the mounting hole 321.Second limiting section 14 can be used as placement
It is bonded the location structure of connected components 3.
Please continue to refer to Fig. 5, a holding part 18 is additionally provided with the first tool 1, the holding part 18 is in the first mating surface 11
Depression is set, and its four side is respectively close to the limiting section 13 of clamping element 12 and first.Above-mentioned second limiting section 14 may be disposed at this and house
Extend in portion 18 and to the first mating surface 11.Reinforcement 17 is additionally provided with the holding part 18, to increase the strong of the first tool 1
Degree.
Fig. 6 is the structural representation of the second tool in a kind of pressurize tool that the implementation of the disclosure one is exemplified.Refer to figure
6, the second tool 2 is provided with the bit-avoiding slot 24 of the first limiting section 13 of correspondence, and the bit-avoiding slot 24 is located at the second cooperation of the second tool 2
On face 22.
In embodiment more than, pressurize tool also includes buckle 26 and notch 16, buckle 26 and notch 16
Coordinate for connecting the first tool 1 and the second tool 2 so that the first tool 1 and the snapping of the second tool 2.Shown in Fig. 5 and Fig. 6
Embodiment in, notch 16 can be arranged in the first mating surface 11, and buckle 26 is arranged in the second mating surface 21.At it
In his embodiment, notch 16 can be arranged at the second mating surface 21, and buckle 26 is arranged in the first mating surface 11.For
The particular location of buckle 26 and notch 16, the disclosure is not limited this.
Further, as shown in Figure 5 and Figure 6, pressurize tool also includes locating dowel 15 and the positioning hole 25 used cooperatively.It is fixed
Position post 15 is arranged at the corner location of the first mating surface 11, corresponding, and positioning hole 25 is arranged at the corner position of the second mating surface 21
Put, when the first tool 1 and the second tool 2 coordinate assembling, positioning hole 25 is placed in positioning hole 25.Locating dowel 15 and positioning hole 25
Setting be easy to the assembling of the first tool 1 and the second tool 2.In other examples, locating dowel 15 is arranged at the second cooperation
Face 21, positioning hole 25 is arranged in the first mating surface 11, and the disclosure is not limited this.
Fig. 7 is the structure schematic diagram of the first tool 1, and Fig. 8 is the structural representation of the second tool 2.Refer to Fig. 7-
8, the back side of the first tool 1 and the second tool 2 is designed with floor 4, and the first tool 1 and the second tool 2 can be reduced using floor 4
Materials, and do not weaken the intensity of the first tool 1 and the second tool 2.First tool 1 and the second tool 2 can be by casting
The metalwork being made or the plastic being made up of Shooting Technique.Can using the first tool 1 and the second tool 2 of plastic
To produce the pressurize tool with extremely low cost, substantial amounts of pressurize tool can be prepared under identical cost, specialty pressing is broken through
The quantity limitation of equipment, so as to help to lift the pressurize efficiency and production efficiency to bonded assembly.
From above-described embodiment, the disclosure combines the pressurize tool formed with the second tool by using by the first tool
To bonded assembly pressurize, the dependence to professional press equipment can be eliminated, and due to single pressurize tool preparation cost compared with
Specialty press equipment for it is extremely cheap, can be prepared under identical cost substantial amounts of pressurize tool, break through specialty pressing set
Standby quantity limitation, so as to help to lift the pressurize efficiency and production efficiency to bonded assembly.Cushion is used for bonding group
Part pressurize, can make bonded assembly by packing pressure in a balanced way, pressurize tool can also be avoided to scratch the appearance of bonded assembly.
The disclosure also provides another pressurize tool, and its part unlike the embodiments above is, is set in the pressurize tool
Flexible pad, the cushion is placed in receiving space, and the cushion can be silica gel, excellent power glue or other flexible portions
Part, the disclosure is not construed as limiting to this, and other structures are identical with the pressurize tool in a upper embodiment.As shown in figure 9, Fig. 9 is
A kind of structural representation of pressurize tool shown in disclosure another exemplary embodiment.Pressurize tool includes the He of the first tool 1
Second tool 2, first tool 1 can coordinate with second tool 2 to be assembled, and first in first tool 1 coordinates
Formed between face 11 and the second mating surface 21 of second tool 2 in receiving space 22, the receiving space 22 provided with elasticity
Pad 23, the receiving space 22 is used to house the bonded assembly 3 being made up of at least two workpiece, to enter to the bonded assembly 3
Row pressurize；Wherein, it is interference fitted along along pressurize force direction between the bonded assembly 3 and the cushion 23.
The preferred embodiment of the disclosure is the foregoing is only, not to limit the disclosure, all essences in the disclosure
God is with principle, and any modification, equivalent substitution and improvements done etc. should be included within the scope of disclosure protection.
Claims (13)
1. a kind of pressurize tool, it is characterised in that including the first tool and the second tool, first tool can be with described second
Tool coordinates assembling, and formation is received between the first mating surface of first tool and the second mating surface of second tool
Hold space, the receiving space is used to house the bonded assembly being made up of at least two workpiece, to be carried out to the bonded assembly
Pressurize；Wherein, cushion is also contained in the receiving space, the cushion is located at first mating surface, described second
Between at least one of mating surface and the bonded assembly, in the receiving space along along pressurize force direction and the cushion mistake
It is full of cooperation.
2. pressurize tool according to claim 1, it is characterised in that the bonded assembly includes coordinating towards described first
The appearance at least one of face and second mating surface, the cushion covers at least a portion of the appearance.
3. pressurize tool according to claim 1, it is characterised in that the also fixation including being arranged on first tool
Device, the fixing device is used to the bonded assembly being fixed on first tool so that the bonded assembly can be received
It is dissolved in the receiving space；Wherein, the receiving space is arranged on second tool.
4. pressurize tool according to claim 1, it is characterised in that the also fixation including being arranged in the receiving space
Device, the fixing device is used to the bonded assembly being fixed in the receiving space.
5. the pressurize tool according to claim 3 or 4, it is characterised in that the fixing device includes at least two and clamped
Part, at least two clamping element is respectively used to clamp at least one set of symmetrical sides of the bonded assemblies.
6. pressurize tool according to claim 5, it is characterised in that the clamping element includes body, the body
The clamping part coordinated provided with deformations and with the bonded assembly, the clamping part is connected by deformations and the body
Connect.
7. the pressurize tool according to claim 3 or 4, it is characterised in that the fixing device also includes position limiting structure, institute
State the placement location that position limiting structure is used to position the bonded assembly.
8. pressurize tool according to claim 7, it is characterised in that the position limiting structure includes the first limiting section, described
First limiting section is used at least one set of symmetrical sides of the spacing bonded assembly.
9. pressurize tool according to claim 8, it is characterised in that the position limiting structure also includes the second limiting section, institute
Stating the second limiting section is used for the mounting hole cooperation with the bonded assembly.
10. pressurize tool according to claim 9, it is characterised in that when the backboard that the bonded assembly is electronic equipment
During structure, the mounting hole is the camera hole and/or fingerprint hole on the back board structure.
11. pressurize tool according to claim 1, it is characterised in that also including with the use of locating dowel and positioning hole；
The locating dowel is arranged in first mating surface and second mating surface on any structure, and the positioning hole is located at another
In structure.
12. pressurize tool according to claim 1, it is characterised in that also including buckle and notch；The buckle is set
It is placed in first mating surface and second mating surface on any structure, the notch is located in another structure, institute
State buckle and the notch coordinates for connecting first tool and second tool.
13. a kind of pressurize tool, it is characterised in that including the first tool and the second tool, first tool can be with described
Two tools coordinate assembling, and are formed between the first mating surface of first tool and the second mating surface of second tool
Cushion is provided with receiving space, the receiving space, the receiving space is used to house by gluing that at least two workpiece are constituted
Connected components, to carry out pressurize to the bonded assembly；Wherein, along along pressurize force direction the bonded assembly state between cushion
Interference fit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710552387.5A CN107234812A (en) | 2017-07-07 | 2017-07-07 | Pressurize tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710552387.5A CN107234812A (en) | 2017-07-07 | 2017-07-07 | Pressurize tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107234812A true CN107234812A (en) | 2017-10-10 |
Family
ID=59991453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710552387.5A Pending CN107234812A (en) | 2017-07-07 | 2017-07-07 | Pressurize tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107234812A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108000402A (en) * | 2017-12-29 | 2018-05-08 | 努比亚技术有限公司 | Screen localization tool |
| CN112443546A (en) * | 2019-08-29 | 2021-03-05 | 北京小米移动软件有限公司 | Pressure maintaining jig |
| CN112822582A (en) * | 2020-12-22 | 2021-05-18 | 东莞华贝电子科技有限公司 | TWS earphone mainboard positioning jig |
| CN112873873A (en) * | 2020-12-07 | 2021-06-01 | 广东长盈精密技术有限公司 | Hot pressing jig |
| CN114644203A (en) * | 2020-12-18 | 2022-06-21 | 北京小米移动软件有限公司 | Reflow method of processing tool, reflow device and processing system |
| CN114645889A (en) * | 2020-12-18 | 2022-06-21 | 北京小米移动软件有限公司 | Pressure maintaining jig and general jig |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203863557U (en) * | 2014-03-20 | 2014-10-08 | 华为终端有限公司 | Pressure-maintaining clamp |
| CN204755508U (en) * | 2015-06-02 | 2015-11-11 | 惠州Tcl移动通信有限公司 | Mobile device pressurize anchor clamps |
| CN206181716U (en) * | 2016-08-31 | 2017-05-17 | 惠州市赛睿实业有限公司 | Electronic product screen bonding pressurize tool |
| CN206287537U (en) * | 2016-12-29 | 2017-06-30 | 杭州耕德电子有限公司 | A kind of pressurize tool |
-
2017
- 2017-07-07 CN CN201710552387.5A patent/CN107234812A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203863557U (en) * | 2014-03-20 | 2014-10-08 | 华为终端有限公司 | Pressure-maintaining clamp |
| CN204755508U (en) * | 2015-06-02 | 2015-11-11 | 惠州Tcl移动通信有限公司 | Mobile device pressurize anchor clamps |
| CN206181716U (en) * | 2016-08-31 | 2017-05-17 | 惠州市赛睿实业有限公司 | Electronic product screen bonding pressurize tool |
| CN206287537U (en) * | 2016-12-29 | 2017-06-30 | 杭州耕德电子有限公司 | A kind of pressurize tool |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108000402A (en) * | 2017-12-29 | 2018-05-08 | 努比亚技术有限公司 | Screen localization tool |
| CN112443546A (en) * | 2019-08-29 | 2021-03-05 | 北京小米移动软件有限公司 | Pressure maintaining jig |
| CN112873873A (en) * | 2020-12-07 | 2021-06-01 | 广东长盈精密技术有限公司 | Hot pressing jig |
| CN114644203A (en) * | 2020-12-18 | 2022-06-21 | 北京小米移动软件有限公司 | Reflow method of processing tool, reflow device and processing system |
| CN114645889A (en) * | 2020-12-18 | 2022-06-21 | 北京小米移动软件有限公司 | Pressure maintaining jig and general jig |
| CN114644203B (en) * | 2020-12-18 | 2023-08-04 | 北京小米移动软件有限公司 | Reflow method, reflow apparatus and processing system for processing tool |
| CN112822582A (en) * | 2020-12-22 | 2021-05-18 | 东莞华贝电子科技有限公司 | TWS earphone mainboard positioning jig |
| CN112822582B (en) * | 2020-12-22 | 2024-04-26 | 东莞华贝电子科技有限公司 | TWS earphone mainboard positioning jig |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107234812A (en) | Pressurize tool | |
| CN101685932B (en) | Chip card fixedly holding structure | |
| TW201338294A (en) | Chip card latching device and electronic device using same | |
| JPH06222859A (en) | Extended module | |
| CN102231767B (en) | Portable electronic device and chip card holding device | |
| CN115053197B (en) | Hinge structure and foldable electronic device including the same | |
| CN101599596A (en) | Chip card clamping module and use the electronic installation of this fixing module | |
| CN101662535B (en) | Fixing and holding structure of chip card | |
| CN108600602A (en) | A kind of camera module of mobile terminal and mobile terminal | |
| CN102036518A (en) | Clamping component and portable electronic device with same | |
| US20060072293A1 (en) | Interface module for electronic devices | |
| TWI335788B (en) | Mobile phones and memory card fixing devices | |
| WO2014073757A1 (en) | Mobile phone case integrated with mounting pad | |
| CN112095086A (en) | Jig, curved surface structural part, coating method for curved surface structural part and coating device | |
| CN216882183U (en) | Auxiliary structure for welding flexible circuit board | |
| US20070084711A1 (en) | Systems and methods for storing and transferring personal data | |
| CN101729619B (en) | Portable electronic device | |
| TWI251381B (en) | Electronic card connection devices | |
| CN210670154U (en) | Electronic device | |
| US9456534B2 (en) | Portable terminal and method of manufacturing a module thereof | |
| CN206388754U (en) | Battery tray and battery installation unit | |
| CN112863351A (en) | A kind of tool | |
| JP6128685B2 (en) | Card connector | |
| CN210895700U (en) | Assembly structure and mobile terminal auxiliary equipment applying same | |
| CN209625669U (en) | Flexible display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171010 |
|
| RJ01 | Rejection of invention patent application after publication |