CN107222976A - A kind of preparation method of flexible and transparent circuit - Google Patents
A kind of preparation method of flexible and transparent circuit Download PDFInfo
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- CN107222976A CN107222976A CN201710356712.0A CN201710356712A CN107222976A CN 107222976 A CN107222976 A CN 107222976A CN 201710356712 A CN201710356712 A CN 201710356712A CN 107222976 A CN107222976 A CN 107222976A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000004020 conductor Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000002861 polymer material Substances 0.000 claims abstract description 22
- 238000007711 solidification Methods 0.000 claims abstract description 17
- 230000008023 solidification Effects 0.000 claims abstract description 17
- 239000002904 solvent Substances 0.000 claims abstract description 12
- 239000011521 glass Substances 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 25
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 18
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 18
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 18
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 18
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 18
- 239000000017 hydrogel Substances 0.000 claims description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 239000002070 nanowire Substances 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910021389 graphene Inorganic materials 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000012780 transparent material Substances 0.000 claims description 5
- 238000010146 3D printing Methods 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000009738 saturating Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- 239000000376 reactant Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 11
- 230000002349 favourable effect Effects 0.000 abstract description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 76
- 239000000243 solution Substances 0.000 description 34
- 235000019441 ethanol Nutrition 0.000 description 24
- 239000007788 liquid Substances 0.000 description 12
- 239000004372 Polyvinyl alcohol Substances 0.000 description 10
- 230000005611 electricity Effects 0.000 description 10
- 229920002451 polyvinyl alcohol Polymers 0.000 description 10
- 238000004528 spin coating Methods 0.000 description 7
- 239000002390 adhesive tape Substances 0.000 description 6
- 239000002041 carbon nanotube Substances 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000002042 Silver nanowire Substances 0.000 description 5
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 5
- 239000000969 carrier Substances 0.000 description 5
- 229910001338 liquidmetal Inorganic materials 0.000 description 5
- 238000001259 photo etching Methods 0.000 description 5
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 4
- -1 polytetrafluoroethylene Polymers 0.000 description 4
- 229920005573 silicon-containing polymer Polymers 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Polymers C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- OZFIGURLAJSLIR-UHFFFAOYSA-N 1-ethenyl-2h-pyridine Chemical class C=CN1CC=CC=C1 OZFIGURLAJSLIR-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- 229920001661 Chitosan Polymers 0.000 description 1
- 229910000807 Ga alloy Inorganic materials 0.000 description 1
- SXRSQZLOMIGNAQ-UHFFFAOYSA-N Glutaraldehyde Chemical class O=CCCCC=O SXRSQZLOMIGNAQ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000011837 N,N-methylenebisacrylamide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- WBUZNMHGYZJJTL-UHFFFAOYSA-N ethanol;gold Chemical compound [Au].CCO WBUZNMHGYZJJTL-UHFFFAOYSA-N 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004540 pour-on Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Materials For Medical Uses (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The present invention relates to a kind of preparation method of flexible and transparent circuit.What this method was realized in：By preparing master die, the solidification transparent carrier with fluted circuit structure is made of flexible and transparent high polymer material on master die, the applying conductive material solution in the groove of solidification transparent carrier, after the solvent is volatilized, obtains the circuit with the high grade of transparency and electric conductivity.Conductive material of the present invention is solid-state and whole circuit is all transparent, and circuit board conductive and the transparency are more preferable.Circuit can be designed and prepare as needed, and precision can reach micron or Nano grade.Meanwhile, the inventive method is simple, and favorable reproducibility, the circuit of preparation is lighter.Circuit can be with multi-drawing, bending or twisting.Simultaneously circuit light weight, with good biocompatibility.Circuit prepared by this method is expected to be applied to intelligent invisible glasses, rollable transparent electronic device, the various fields such as electronic skin.
Description
Technical field
The invention belongs to circuit and field of circuit boards, and in particular to the preparation method of flexible and transparent circuit.
Background technology
With wearable Medical Devices and transparent electronic device industry fast development, flexible and transparent circuit starts by increasingly
Many researcher's concerns, the breakthrough of flexible and transparent circuit material and method all has great importance to two above field.
At present, only report of the very few on flexible and transparent circuit, wherein the most commonly used material is graphene.But on graphite
The transparent circuitry of alkene formation, with following weakness：
1. graphene film easily forms the graphene film of fold, especially large area
2. graphene film is difficult to carry out easily producing breakage on accurate quality control, film
3. graphene film is difficult to be mass produced
4. best graphene film square resistance is in 100 ohms, transparency only reaches 90%
Recently, the method for having researcher to apply patterned surface, flexible and transparent circuit is constructed with nano-particle.But it is this
Method complex process, circuit control is inaccurate, and circuit can not obtain good electric conductivity, transparency and pliability simultaneously, limitation
It is applied.
Chinese patent CN101505575A discloses a kind of preparation side of the flexible circuit based on PDMS biological compatibilities
Method, although patent base material PDMS is transparent, but circuit part liquid metal tin indium Gallium alloys are nontransparent, that is, are formed
Be base material is transparent and conductive materials are opaque circuit.Meanwhile, current-carrying part is liquid metal, conductor in the flexible circuit
Liquid leakage easily occurs for the place of part and wire and liquid metal contacts, it is impossible at will plug, otherwise can cause circuit malfunction.
Because the current-carrying part of flexible circuit is liquid metal, it is necessary to a piece of sheet material in addition is covered on the base material with duct, makes piece
Material and base material are collectively forming a complete closing duct, and such conducting metal liquid, which can be just maintained in duct, not to be lost in, because
This is very high for the sealing requirements in duct, closes bad, easily occurs the leakage of liquid metal, cause short circuit.
The content of the invention
To make up prior art blank, the present invention provides a kind of preparation method of flexible and transparent circuit, prepared by this method
Not only base material is transparent to flexible and transparent circuit, and circuit conductor part is also transparent, realizes transparent electricity truly
Road.The transparent circuitry not only good conductivity, also with excellent stretching, bending, distortion performance.The transparent circuitry is to flexible and transparent
The exploitation of electronic equipment and the exploitation of wearable Medical Devices are significant.
To achieve the above object, the present invention is adopted the following technical scheme that.A kind of preparation method of flexible and transparent circuit, including
Following steps：
S1, prepare master die；
S2, the transparent load of the solidification with fluted circuit structure is made of flexible and transparent high polymer material on master die
Body；
S3, solidification transparent carrier groove in be coated with the solution containing conductive material, after the solvent is volatilized, conductive material
It is present in groove circuit structure, the conductive material formed outside flexible and transparent circuit removing groove forms transparent flexible circuit.
The shape of prepared master die in step S1, size, circuit length can according to actual needs from
By being designed.Circuit pattern is not limited to linear pattern one kind, can be designed as needed, i.e., circuit can be curve
Type, broken line type, square wave type, waveform, circle, ellipse, annular etc. are variously-shaped, or above shape any combination.Electricity
The length of every circuit is all to be changed as needed in road.Master die is also not limited to plane one kind, also
Can be curved surface, or 3D.
Preferably, the step S1 on hard slippery material by photoetching, processing, thermoplastic, electropolishing, 3D printing etc.
Any method prepares the circuit with prominent surface texture, obtains master die；Prominent surface texture refers to electricity in the present invention
The height of road pattern is above integral material plane, that is, circuit protrudes on master die.Hard in the present invention
Lubricious material can be any in silicon chip, metal, high polymer material, and the high polymer material can be thermoresponsive material
Material, such as phenolic resin or rigid high polymer material, such as polytetrafluoroethylene (PTFE).
Step S2 of the present invention can be realized by two ways.
First way：The mixed liquor of the monomer mixture or reactant that constitute flexible and transparent high polymer material is poured into
The surface of master die, after transparent polymer material carries out curing reaction, the transparent material of solidification is shelled from master die
From obtaining the solidification transparent carrier with groove circuit structure；
By the A liquid and B liquid of flexible and transparent high polymer material monomer mixture such as dimethyl silicone polymer, or reactant is mixed
Close liquid and such as prepare silicone-hydrogel mixed liquor, prepare the mixed liquor of hydrogel, said mixture or mixed liquor are poured into electricity
In the template on road, curing reaction is carried out, flexible and transparent high polymer material is initially liquid, be finally solid-state, and energy by reaction
It is always maintained at solid shape.The different materials that above-mentioned flexible and transparent high polymer material is not limited to enumerate can also be included as poly-
Polyvinyl alcohol hydrogel, the material such as aquagel.The circuit pattern of master die protrusion, causes the flexible and transparent high score of solidification
There is fluted body circuit pattern on son.Some high polymer materials such as polyvinyl alcohol hydrogel needs bubble removing before curing, most
Transparent polymer material exists in transparent solid form afterwards.
The second way：Using 3D printing technique, direct application flexibility transparent polymer material such as PDMS, silicone-hydrogel,
Aquagel etc. carries out 3D printing, obtains the solidification transparent carrier with groove circuit structure.
In step S3, conductive material is scattered in volatilizable solvent first, is coated with the groove of solidification transparent carrier
Solution containing conductive material, and the conductive material being applied to outside groove is cleaned out.After the solvent is volatilized, conductive material with
Solid forms are present in groove circuit structure, form flexible and transparent circuit；The conductive material is not limited to nano silver wire, copper
In nano wire, nanowires of gold, conductive hydrogel, CNT, graphene, nanometer gold chain or nano-particle it is a kind of or it is a kind of with
On.The applying conductive material in the groove of solidification transparent carrier, can be sprayed, any coating such as spin coating using being directly coated with
Form.
After circuit is formed, in order to protect the conductive material in groove, stability of the increase conductive material in residuite
And inoxidizability, step S4 can be increased：Flexible and transparent high polymer material is sprawled on the surface of flexible and transparent circuit.By folder circuit
The heart can play a part of protection circuit and anti-oxidation in two kinds of transparent material centers.Between conductive material in groove mutually
Connection is mutually formed, conductive material is evenly distributed in groove, circuit board is had good electric conductivity.
Step S5 can also be included in the above method：Transparent flexible circuit is turned on extraneous.The conducting is conduction material
Expect to realize by the connection with electronic device or extraneous power supply or the wire for being capable of conduction.Flexible circuit and electronic device or electricity
The conducting in source, is by the way that the current-carrying part or wire of electronic device are connected into shape with the conductive materials in flexible and transparent circuit groove
Into loop.Electronic device or wire can be with pre-buried or be inserted into flexible and transparent conductive material internal.
Another object of the present invention is that a kind of layer flexible transparent circuitry is claimed, according to any side of the present invention
Method prepares at least two flexible and transparent circuits, is superimposed, is run through by conductive material, obtains the transparent electricity of layer flexible
Road.
Compared with prior art, the beneficial effects of the invention are as follows：
The present invention formed flexible circuit there is the high grade of transparency, not only the flexible high molecular material carrier of circuit be it is transparent,
And conductive material is also transparent.With excellent electric conductivity, the conductive materials for forming circuit are dry state, and bottom groove need not
Closing, conductive devices and wire can insert or pull out circuit at any time, and conductive materials will not be lost in and cause circuit malfunction.This hair
Bright flexible transparent support is lightweight, the characteristics of be respectively provided with biological compatibility, the transparent electricity formed in flexible transparent support
Road can conveniently be attached at the body surface of human or animal or implant, and circuit will not be influenceed and be stopped by the action of animal or people
Only work.Using the flexibility of flexible substrates, stretching, distortion and the bending performance of circuit well are realized, conductive devices is inserted and leads
Line carries out positive and negative 180 degree and repeatedly folded, and still keeps outstanding resistant to bending, stretching and distortion performance.Circuit is set as needed
Meter and preparation, precision can reach micron or Nano grade.
Preparation process of the present invention is simple, and favorable reproducibility, the circuit of acquisition is lighter.This method prepares circuit and is expected to application
In intelligent invisible glasses, rollable transparent electronic device, the various fields such as electronic skin.
Brief description of the drawings
Accompanying drawing of the present invention totally four width：
Fig. 1 is flexible and transparent circuit preparation flow figure；
Using the silicon chip template with photoetching agent pattern as master die, using nano silver wire as conductive material, formation has
The flexible and transparent circuit preparation method flow chart of micro-structural.
Fig. 2 is the conductive material for preparing of the inventive method through repeatedly resistance change curves after positive and negative bending；
Fig. 3 is tensile diagram of the flexible and transparent circuit of the invention prepared in the case of bright light；
Fig. 4 is the bright light photo of flexible and transparent circuit prepared by the present invention.
Embodiment
With reference to specific embodiment to technical scheme further instruction, but the present invention is not in any form
It is limited to embodiment content.Experimental method described in embodiment is conventional method unless otherwise specified, unless otherwise specified,
The chemical reagent and material, are commercially obtained.Following non-limiting examples can make the common skill of this area
The present invention, but do not limit the invention in any way is more fully understood in art personnel.Ethanol used in the present invention, is top pure grade.
Embodiment 1
Nano silver wire (AgNWs) ethanol solution used in the present invention, specification is：Diameter 30nm, length 100~200um are dense
20mg/ml is spent, solvent is absolute ethyl alcohol.
(1) master die is prepared
Using photoetching technique, the electricity with prominent surface texture is carved on 4 inches of silicon chip with SU-2050 photoresists
Road, obtains master die.
(2) PDMS transparent carriers are prepared
By the A liquid and B liquid of dimethyl silicone polymer (Polydimethylsiloxane, PDMS) according to 10:1 ratio is mixed
Close uniform, pour into and use up in the template that the silicon chip for being carved with circuitous pattern is made, be put into the bubble in PDMS in vacuum desiccator
Drain only, 1 hour or so used time, be heating and curing in the baking oven for placing into 80 DEG C 1 hour, obtain the solidification with circuit groove saturating
Bright PDMS carriers.
(3) flexible and transparent circuit is prepared
A. AgNWs ethanol solutions 0.3mg/ml is configured.
B. AgNWs solution 40uL drops are drawn in the transparent PDMS carrier surfaces of solidification, and in spin coating acceleration 300rpm, spin coating
Spin coating 40s under conditions of rotating speed 3000rpm.
C. repeat step B twice, AgNWs ethanol solutions are coated in circuit board recess, wait ethanol solution to wave completely
After hair, AgNWs unnecessary outside groove is sticked out using 3M adhesive tapes, flexible and transparent circuit board is obtained, the probe resistance of hand-held four is utilized
Instrument surveys its sheet resistance, and its transmitance under 550nm wavelength is surveyed using ultraviolet specrophotometer.Obtaining resistance after tested is
3.21 Ω, transmitance is 92.48% transparent flexible circuit.
Embodiment 2
Copper nano-wire (CuNWs) ethanol solution used in the present invention, specification is：Diameter 20nm, length 80um, concentration
20mg/ml, solvent is absolute ethyl alcohol.
(1) master die is prepared
Using photoetching technique, the template of circuit needed for being carved with SU-2050 photoresists on 4 inches of silicon chip.
(2) PDMS transparent carriers are prepared
By the A liquid and B liquid of dimethyl silicone polymer (Polydimethylsiloxane, PDMS) according to 10:1 ratio is mixed
Close uniform, pour into and use up in the template that the silicon chip for being carved with circuitous pattern is made, be put into the bubble in PDMS in vacuum desiccator
Drain and be heating and curing 1 hour in net, 1 hour used time, the baking oven for placing into 80 DEG C, obtain the transparent loads of the PDMS with circuit groove
Body.
(3) flexible and transparent circuit is prepared
A. CuNWs ethanol solutions 0.4mg/ml is configured.
B. CuNWs solution 60uL drops are drawn in PDMS transparent carriers surface, and in spin coating acceleration 300rpm, spin coating rotating speed
Spin coating 40s under conditions of 3000rpm.
C. repeat in B step twice, wait after ethanol solution volatilizees completely, stick out CuNWs in groove using 3M adhesive tapes, obtain
To transparent flexible circuit board, its sheet resistance is surveyed using the probe resistance instrument of hand-held four, using ultraviolet specrophotometer survey its
Transmitance under 550nm wavelength.Resistance is obtained after tested for 5.62 Ω, and transmitance is 93.17% transparent flexible circuit.
Embodiment 3
Nanowires of gold (AuNWs) ethanol solution used in the present invention, specification is：Diameter 3nm, length 50um, concentration 20mg/
Ml, solvent is absolute ethyl alcohol.
(1) master die is prepared
Using photoetching technique, the template of circuit needed for being carved with SU-2050 photoresists on 4 inches of silicon chip.
(2) PDMS transparent carriers are prepared
By the A liquid and B liquid of dimethyl silicone polymer (Polydimethylsiloxane, PDMS) according to 10:1 ratio is mixed
Close uniform, pour into and use up on the mould that the silicon chip for being carved with circuitous pattern is made, be put into the bubble in PDMS in vacuum desiccator
Drain and be heating and curing 1 hour in net, general 1 hour used time, the baking oven for placing into 80 DEG C, obtain the PDMS with circuit groove saturating
Bright carrier.
(3) flexible and transparent circuit is prepared
A. AuNWs ethanol solutions 0.5mg/ml is configured.
B. AuNWs solution 30uL drops are drawn after in the groove of transparent silicon hydrogel chip, waiting ethanol solution to volatilize, followed by
Continuous painting is twice.
C. wait after ethanol solution volatilization completely, the AuNWs outside groove is sticked out using 3M adhesive tapes, transparent flexible circuit is obtained
Plate, its sheet resistance is surveyed using the probe resistance instrument of hand-held four, and it is saturating under 550nm wavelength to survey it using ultraviolet specrophotometer
Cross rate.Resistance is obtained after tested for 2.38 Ω, and transmitance is 95.02% transparent flexible circuit.
Embodiment 4
Nanowires of gold (AuNWs) ethanol solution used in the present invention, specification is：Diameter 3nm, length 50um, concentration 20mg/
Ml, solvent is absolute ethyl alcohol；
(1) master die is prepared
Using Al-alloy metal process technology, the electricity with prominent surface texture of circuit needed for being polished on aluminium alloy
Road template.
(2) silicone-hydrogel flexible transparent support is prepared
By initiator azodiisobutyronitrile (consumption is the 0.2wt% of accumulated dose) and crosslinking agent N, N- methylene bisacrylamide acid
Acid amides (consumption is the 1.0wt% of accumulated dose) is dissolved completely in 8:1:The hydroxyethyl methacrylate of 1 mass ratio, N- vinylpyridines
In pyrrolidone and γ-(methacryloxypropyl) propyl trimethoxy silicane mixed solution, magnetic agitation 30 minutes, uniform mixing is each
After material and filtering, pour on aluminum alloy mould plate, be put into 90 DEG C of vacuum drying ovens and react 2 hours, curing and demolding is carried
The silicone-hydrogel flexible transparent support of circuit groove.
(3) flexible and transparent circuit is prepared
A. nanowires of gold ethanol solution 0.5mg/ml is configured.
B. nanowires of gold solution 30uL drops are drawn after in the groove of transparent silicon hydrogel chip, waiting ethanol solution to volatilize,
It is further continued for applying twice.
C. wait after ethanol solution volatilization completely, the nanowires of gold outside duct is sticked out using 3M adhesive tapes, obtain transparent flexible electricity
Road plate, surveys its sheet resistance using the probe resistance instrument of hand-held four, it is surveyed under 550nm wavelength using ultraviolet specrophotometer
Transmitance.Resistance is obtained after tested for 4.52 Ω, and transmitance is 94.36% transparent flexible circuit.
Embodiment 5
CNT (CNTs) used in the present invention is the long nanotube of hydroxylated single wall, and specification is：Diameter 1.1nm, it is long
50um is spent, solvent is ethanol solution.
(1) master die is prepared
Using grinding technology, required circuit is polished on polytetrafluoroethylene (PTFE).
(2) polyvinyl alcohol (PVA) hydrogel transparent carrier is prepared
The PVA samples that 5 grams of degree of polymerization are 1750 ± 50 are weighed, the 1g/mL PVA aqueous solution is configured by solvent of distilled water.
The PVA aqueous solution configured is placed in ground flask, 90 DEG C are heated to water bath with thermostatic control, stirring is to being completely dissolved.At 60 DEG C
30 minutes are stood, the bubble in solution is removed.It is subsequently poured on the master die of polytetrafluoroethylene (PTFE), enters in -20 DEG C of refrigerators
The very fast cooling of row.Take out and thaw 6 hours at room temperature after 15 hours.Continue to be put into after defrosting in -20 DEG C of refrigerators carry out it is very fast
Cooling.Take out and thaw 6 hours at room temperature after 15 hours.Repeated freezing-thaw cycles 10 times.Obtain hardness higher and have
Polyvinyl alcohol (PVA) hydrogel transparent carrier of groove circuit structure.
(3) flexible and transparent circuit is prepared
A. CNTs ethanol solution 0.5mg/ml is configured.
B. CNTs ethanol solution 30uL drops are drawn in the groove of polyvinyl alcohol hydrogel transparent carrier, ethanol solution is waited
After volatilization, it is further continued for applying twice.
C. wait after ethanol solution volatilization completely, the unnecessary CNTs outside groove is sticked out using 3M adhesive tapes, transparent flexible is obtained
Circuit board, surveys its sheet resistance using the probe resistance instrument of hand-held four, it is surveyed under 550nm wavelength using ultraviolet specrophotometer
Transmitance.Resistance is obtained after tested for 24.52 Ω, and transmitance is 80.36% transparent flexible circuit.
Embodiment 6
Gold nano chain used in the present invention, specification is：Diameter 5nm, length 90um, concentration 0.5mg/ml, solvent is ethanol
Solution.
(1) master die is prepared
Using thermoplastic techniques, the circuit with prominent surface texture is made on phenolic resin.
(2) aquagel transparent carrier is prepared
1.2 grams of chitosans are weighed in clean beaker, 40mL2% acetum, stirring and dissolving is added；Add
16mL3% glutaraldehydes, stirring, 55 DEG C of constant temperature 1h obtain yellow transparent aquagel solution；Solution is poured into circuit
In the template of phenoplasts, place 48 hours at room temperature.Obtain the aquagel carrier of yellow transparent.
(3) flexible and transparent circuit is prepared
A. gold nano chain ethanol solution 1mg/ml is configured.
B. gold nano chain solution 30uL drops are drawn after in the groove of transparent silicon hydrogel chip, waiting ethanol solution to volatilize,
It is further continued for applying twice.
C. wait after ethanol solution volatilization completely, gold nano chain unnecessary outside groove is sticked out using 3M adhesive tapes, obtains transparent soft
Property circuit board, surveys its sheet resistance using the probe resistance instrument of hand-held four, it is surveyed in 550nm wavelength using ultraviolet specrophotometer
Under transmitance.Resistance is obtained after tested for 7.52 Ω, and transmitance is 93.21% transparent flexible circuit.
Performance test is carried out to flexible and transparent circuit prepared by the present invention.
As shown in Figure 2 using PDMS as transparent polymer material, using nano silver wire as conductive material, formation have linear pattern
The bending experimental data of the material of circuit.The circuit has carried out the bending of positive and negative 180 degree, positive and negative with the increase of the bending number of degrees
The resistance of circuit is basically unchanged after bending.The positive and negative bending of 2500 times can be carried out through circuit, resistance is increased slightly after bending, but
It is increased amount very little.
As shown in Figure 3 using PDMS as transparent polymer material, using nano silver wire as conductive material, formation have linear pattern
The stretching experiment of circuit.The patency of the bright explanation circuit of LED, LED is in no stretching and tensile elongation nearly 35%, lamp
Brightness do not change substantially, illustrate the stretchable functional of the circuit.
As shown in Figure 4 using PDMS as the complex circuit board of clear flexible material, LED is inserted in central circular circuit,
The width of circuit is 200 microns.Illustrate that the inventive method can prepare the flexible and transparent circuit of micron level.
Claims (10)
1. a kind of preparation method of flexible and transparent circuit, it is characterised in that comprise the following steps：
S1. the circuit with prominent surface texture is prepared on hard slippery material, master die is obtained；
S2. the solidification transparent carrier with fluted circuit structure is made of flexible and transparent high polymer material on master die；
S3. the solution containing conductive material is coated with the groove of solidification transparent carrier, after the solvent is volatilized, conductive material is present
In groove circuit structure, the conductive material formed outside flexible and transparent circuit removing groove forms transparent flexible circuit.
2. the preparation method of flexible and transparent circuit according to claim 1, it is characterised in that step S2 is specially：By group
The mixed liquor of monomer mixture or reactant into flexible and transparent high polymer material is poured into the surface of master die, treats transparent height
Molecular material is carried out after curing reaction, and the transparent material of solidification is peeled off from master die, obtained with groove circuit structure
Solidification transparent carrier.
3. the preparation method of flexible and transparent circuit according to claim 1, it is characterised in that step S2 can also be：Will
Flexible and transparent high polymer material obtains the solidification transparent carrier with groove circuit structure by 3D printing.
4. the preparation method of flexible and transparent circuit according to claim 1, it is characterised in that also including step S4. soft
Flexible and transparent high polymer material is sprawled on the surface of property transparent circuitry.
5. the preparation method of flexible and transparent circuit according to claim 1, it is characterised in that will also be walked including step S5.
The flexible and transparent circuit of rapid S4 formation is turned on extraneous.
6. the preparation method of flexible and transparent circuit according to claim 1, it is characterised in that hard light in the step S1
Sliding material includes any in silicon chip, metal, high polymer material.
7. the preparation method of flexible and transparent circuit according to claim 1, it is characterised in that in the step S2, flexible
Transparent polymer material includes any in PDMS, silicone-hydrogel or hydrogel.
8. the preparation method of flexible and transparent circuit according to claim 1, it is characterised in that the conductive material includes silver
It is a kind of in nano wire, copper nano-wire, nanowires of gold, conductive hydrogel, CNT, graphene, nanometer gold chain or nano-particle
Or more than one.
9. a kind of layer flexible transparent circuitry, it is characterised in that prepare at least two according to claim 1 methods described flexible saturating
Bright circuit, is superimposed, and is run through by conductive material, obtains layer flexible transparent circuitry.
10. flexible and transparent circuit prepared by claim 1 methods described is in transparent electronic device, intelligent invisible glasses, electronics skin
The application in the fields such as skin.
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| CN201711358016.XA CN107846785B (en) | 2017-05-19 | 2017-05-19 | Method for preparing flexible transparent circuit |
| CN201711358044.1A CN108112177B (en) | 2017-05-19 | 2017-05-19 | Preparation method of flexible transparent circuit |
| CN201710356712.0A CN107222976B (en) | 2017-05-19 | 2017-05-19 | A kind of preparation method of flexible and transparent circuit |
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Cited By (5)
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| CN108078543A (en) * | 2017-11-23 | 2018-05-29 | 韩金玲 | A kind of preparation method of high sensitivity electronic skin |
| CN110312372A (en) * | 2019-06-18 | 2019-10-08 | 西安交通大学 | A kind of manufacturing method of three-dimension curved surface circuit |
| WO2019196221A1 (en) * | 2018-04-11 | 2019-10-17 | 深圳市百柔新材料技术有限公司 | 3d printing method for circuit board |
| CN110675972A (en) * | 2019-10-15 | 2020-01-10 | 上海幂方电子科技有限公司 | Liquid metal electrode and preparation method thereof |
| CN113189769A (en) * | 2021-04-23 | 2021-07-30 | 歌尔股份有限公司 | Eyeball tracking module and glasses |
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| CN108882526B (en) * | 2018-05-31 | 2021-02-19 | 深圳大学 | Flexible recyclable circuit and manufacturing method thereof |
| CN113113187B (en) * | 2021-03-19 | 2022-06-28 | 中山大学 | Stretchable transparent conductive film, preparation method and electronic device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108112177B (en) | 2020-02-14 |
| CN107846785A (en) | 2018-03-27 |
| CN108112177A (en) | 2018-06-01 |
| CN107222976B (en) | 2019-11-15 |
| CN107846785B (en) | 2020-09-15 |
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Effective date of registration: 20240119 Address after: No. 5-4-1, Building 27-5, Shengsheng 3rd Road, Dalian Economic and Technological Development Zone, Liaoning Province, 116600 (4) Patentee after: Counterclockwise Chip Technology (Dalian) Co.,Ltd. Address before: 116622 No. 10, Xuefu Avenue, Dalian economic and Technological Development Zone, Liaoning Patentee before: DALIAN University |