CN107221435A - A kind of novel aluminium foil nano-filled composite production technology - Google Patents
A kind of novel aluminium foil nano-filled composite production technology Download PDFInfo
- Publication number
- CN107221435A CN107221435A CN201710348401.XA CN201710348401A CN107221435A CN 107221435 A CN107221435 A CN 107221435A CN 201710348401 A CN201710348401 A CN 201710348401A CN 107221435 A CN107221435 A CN 107221435A
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- base material
- aluminium foil
- medium layer
- compound medium
- production technology
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
- H01G9/0032—Processes of manufacture formation of the dielectric layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/07—Dielectric layers
Abstract
The invention discloses a kind of novel aluminium foil nano-filled composite production technology, including (1), selection；(2), thermal spraying；(3), electrochemical treatments.The present invention handles ε by the above methodr70 1500 are can reach, the ε with conventional aluminium electrolutic capacitorrCompare, εrIt is improved significantly, so as to greatly promote capacitance C.
Description
Technical field
The invention belongs to energy storage technology field, specifically, it is related to a kind of novel aluminium foil nano-filled composite production work
Skill.
Background technology
The capacitance size of aluminium electrolutic capacitor, is generally dependent on the size of its surface area, dielectric constant and anode-cathode distance,
Specially：
Wherein ε0- permittivity of vacuum εr- dielectric relative dielectric constant
The distance of the surface area d- poles interpolar of S- electrodes
From the above mentioned it can be seen that such as to improve its capacity, its solution is mainly derived from：
1>Expand anode surface area S.
2>Improve dielectric relative dielectric constant εr。
3>Reduce anode interpolar apart from d, that is, reduce dielectric thickness.
For aluminium electrolutic capacitor, its εrFor fixed alundum (Al2O3) (Al2O3) deielectric-coating, it is left that its value is generally 7.0
The right side, is placed in corrosion extended surface for the lifting general scientific research personnel's focuses of work of C, i.e. the surface area S of raising aluminium anode foil, and this respect
Research work close to the limit.
The content of the invention
In view of the above-mentioned problems, the invention provides a kind of novel aluminium foil nano-filled composite production technology, greatly improving εr,
So as to improve the capacity of capacitor.
The technical solution adopted by the present invention is：
A kind of novel aluminium foil nano-filled composite production technology, it is characterised in that comprise the following steps：
(1), selection：Base material is used as from aluminium foil, etched foil or Waste Acid From Hua Cheng Foil；
(2), thermal spraying：The surface of base material is uniformly applied high-k nanometer materials by plasma thermal sprayed technology
The surface of base material is overlying on, 5-10 μm stable of compound medium layer is formed on the surface of base material；
(3), electrochemical treatments：By electrochemical method by gap that may be present in compound medium layer formed one layer with
Al2O3The fine and close compound medium layer of closely sealed 5-10 μm, so as to improve relative dielectric constant εr。
Preferably, described high-k nanometer materials are titanium, titanium oxide and barium titanate, tin, zirconium, zinc
One or more, the mesh number of the high-k nanometer materials is not more than 100 nanometers, described high-k nanoscale
Material is formed after micron-sized nanometer aggregate by the method for ball milling, then by after 4500-5500 DEG C of heat fusing through etc. from
The plasma gun of sub- spraying equipment is evenly applied to the surface of base material.
Preferably, described electrochemical treatments are the 3-15% aqueous solution that base material is placed in inorganic or organic acid and its salt
In, voltage and current on request carries out electrochemical treatments, to fill up the compound medium layer of substrate surface in thermal spray process
Gap is produced, the surface of base material is formed fine and close compound medium layer.
The present invention handles ε by the above methodr70-1500 is can reach, the ε with conventional aluminium electrolutic capacitorrCompare, εr
It is improved significantly, so as to greatly promote capacitance C.
Embodiment
The present invention is described in further detail below by specific embodiment.
Embodiment 1：
(1), selection：From thickness base material is used as 115 μm of aluminium foil；
(2), thermal spraying：It is titanium, titanium oxide and barium titanate, tin, zirconium, zinc to choose high-k nanometer materials
One or more, the mesh number of high-k nanometer materials is not more than 100 nanometers, and high-k nanometer materials pass through ball
The method of mill is formed after micron-sized nanometer aggregate, then by after 4500-5500 DEG C of heat fusing through plasma spraying equipment
Plasma gun be evenly applied to the surface of base material, 5-10 μm stable of compound medium layer is formed on the surface of base material,；
(3), electrochemical treatments：In the 3-15% aqueous solution that base material is placed in inorganic or organic acid and its salt, on request
Voltage and current carries out electrochemical treatments, and gap, shape are produced in thermal spray process to fill up the compound medium layer of substrate surface
Into one layer and Al2O3The fine and close compound medium layer of closely sealed 5-10 μm, so as to improve relative dielectric constant εr。
Embodiment 2：
(1), selection：From thickness base material is used as 110 μm of etched foil；
(2), thermal spraying：It is titanium, titanium oxide and barium titanate, tin, zirconium, zinc to choose high-k nanometer materials
One or more, the mesh number of high-k nanometer materials is not more than 100 nanometers, and high-k nanometer materials pass through ball
The method of mill is formed after micron-sized nanometer aggregate, then by after 4500-5500 DEG C of heat fusing through plasma spraying equipment
Plasma gun be evenly applied to the surface of base material, 5-10 μm stable of compound medium layer is formed on the surface of base material,；
(3), electrochemical treatments：In the 3-15% aqueous solution that base material is placed in inorganic or organic acid and its salt, on request
Voltage and current carries out electrochemical treatments, and gap, shape are produced in thermal spray process to fill up the compound medium layer of substrate surface
Into one layer and Al2O3The fine and close compound medium layer of closely sealed 5-10 μm, so as to improve relative dielectric constant εr。
Embodiment 3：
(1), selection：From thickness base material is used as 116 μm of Waste Acid From Hua Cheng Foil；
(2), thermal spraying：It is titanium, titanium oxide and barium titanate, tin, zirconium, zinc to choose high-k nanometer materials
One or more, the mesh number of high-k nanometer materials is not more than 100 nanometers, and high-k nanometer materials pass through ball
The method of mill is formed after micron-sized nanometer aggregate, then by after 4500-5500 DEG C of heat fusing through plasma spraying equipment
Plasma gun be evenly applied to the surface of base material, 5-10 μm stable of compound medium layer is formed on the surface of base material,；
(3), electrochemical treatments：In the 3-15% aqueous solution that base material is placed in inorganic or organic acid and its salt, on request
Voltage and current carries out electrochemical treatments, and gap, shape are produced in thermal spray process to fill up the compound medium layer of substrate surface
Into one layer and Al2O3The fine and close compound medium layer of closely sealed 5-10 μm, so as to improve relative dielectric constant εr。
The thickness and compound dielectric of the substrate surface of embodiment 1,2,3 formation composite dielectric film are as follows：
| Type of substrate | Complex media film thickness (μm) | Compound dielectric |
| Aluminium foil | 120-122 | εr max=320 εr min=35 |
| Etched foil | 116-118 | εr max=1532 εr min=800 |
| Waste Acid From Hua Cheng Foil | 121-123 | εr max=530 εr min=230 |
Under equal conditions, aluminium foil, etched foil, three kinds of paillon foils of Waste Acid From Hua Cheng Foil are subjected to specific volume respectively and test its correlation electrically
Energy parameter see the table below (paillon foil formation voltage 520VF)：
| Type of substrate | Specific volume (μ F/cm2) | Compound specific volume (μ F/cm2) |
| Aluminium foil | 0.04 | 1.52 |
| Etched foil | 0.74 | 632 |
| Waste Acid From Hua Cheng Foil | 0.72 | 117 |
As can be seen from the above table, etched foil is after present invention process is handled, εrObtained raising is maximum, being capable of maximum limit
The capacity of degree ground lifting capacitor.
Claims (3)
1. a kind of novel aluminium foil nano-filled composite production technology, it is characterised in that comprise the following steps：
(1), selection：Base material is used as from aluminium foil, etched foil or Waste Acid From Hua Cheng Foil；
(2), thermal spraying：High-k nanometer materials are evenly applied to by the surface of base material by plasma thermal sprayed technology
The surface of base material, forms 5-10 μm stable of compound medium layer on the surface of base material；
(3), electrochemical treatments：Gap that may be present in compound medium layer is formed one layer and Al by electrochemical method2O3It is close
The fine and close compound medium layer of 5-10 μm of conjunction, so as to improve relative dielectric constant εr。
2. a kind of novel aluminium foil nano-filled composite production technology according to claim 1, it is characterised in that described height
Dielectric constant nano level material is titanium, titanium oxide and barium titanate, tin, zirconium, the one or more of zinc, the high-k
The mesh number of nanometer materials is not more than 100 nanometers, and described high-k nanometer materials form micro- by the method for ball milling
After the nanometer aggregate of meter level, then it is uniform by the plasma gun through plasma spraying equipment after 4500-5500 DEG C of heat fusing
It is coated on the surface of base material.
3. a kind of novel aluminium foil nano-filled composite production technology according to claim 1 or 2, it is characterised in that described
Electrochemical treatments base material to be placed in the 3-15% aqueous solution of inorganic or organic acid and its salt, voltage and current on request
Electrochemical treatments are carried out, gap is produced in thermal spray process with the compound medium layer for filling up substrate surface, makes the surface of base material
Form fine and close compound medium layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710348401.XA CN107221435A (en) | 2017-05-17 | 2017-05-17 | A kind of novel aluminium foil nano-filled composite production technology |
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| CN201710348401.XA CN107221435A (en) | 2017-05-17 | 2017-05-17 | A kind of novel aluminium foil nano-filled composite production technology |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962602A (en) * | 2018-07-13 | 2018-12-07 | 四川华保新能源科技有限公司 | A method of improving high-voltage capacitance battery aluminium foil specific volume |
| CN110565140A (en) * | 2019-09-18 | 2019-12-13 | 南通海星电子股份有限公司 | Preparation method of high-dielectric-constant composite film aluminum foil |
| CN110993349A (en) * | 2019-12-19 | 2020-04-10 | 泉州泉石电子科技有限公司 | Flat-stacked capacitor electrode foil based on thermal spraying |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102568858A (en) * | 2012-01-13 | 2012-07-11 | 西安交通大学 | Production method of high dielectric constant composite alumina film |
| CN104576066A (en) * | 2014-12-27 | 2015-04-29 | 西安交通大学 | Preparation method of composite oxide film with high dielectric constant |
| CN105714234A (en) * | 2016-01-27 | 2016-06-29 | 苏州优优电容器制造有限公司 | Method for plasma spraying high-dielectric ceramics film on aluminum foil |
| CN106555151A (en) * | 2016-11-23 | 2017-04-05 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of plasma spraying aluminium base electrothermal device and preparation method thereof |
-
2017
- 2017-05-17 CN CN201710348401.XA patent/CN107221435A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102568858A (en) * | 2012-01-13 | 2012-07-11 | 西安交通大学 | Production method of high dielectric constant composite alumina film |
| CN104576066A (en) * | 2014-12-27 | 2015-04-29 | 西安交通大学 | Preparation method of composite oxide film with high dielectric constant |
| CN105714234A (en) * | 2016-01-27 | 2016-06-29 | 苏州优优电容器制造有限公司 | Method for plasma spraying high-dielectric ceramics film on aluminum foil |
| CN106555151A (en) * | 2016-11-23 | 2017-04-05 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of plasma spraying aluminium base electrothermal device and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962602A (en) * | 2018-07-13 | 2018-12-07 | 四川华保新能源科技有限公司 | A method of improving high-voltage capacitance battery aluminium foil specific volume |
| CN110565140A (en) * | 2019-09-18 | 2019-12-13 | 南通海星电子股份有限公司 | Preparation method of high-dielectric-constant composite film aluminum foil |
| CN110993349A (en) * | 2019-12-19 | 2020-04-10 | 泉州泉石电子科技有限公司 | Flat-stacked capacitor electrode foil based on thermal spraying |
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Effective date of registration: 20180720 Address after: 610000 Xinjin Road, Chengdu, Sichuan, 868 Hope Road 2 building 1-4 unit 1-3 floor Applicant after: Sichuan Hua Bao new energy technology Co., Ltd. Address before: 313100 3 rd floor, R & D workshop, 1553 Taihu Road, Changxing County Economic Development Zone, Huzhou, Zhejiang. Applicant before: Changxin Zhejiang Xin Yuan Yuan Electronic Technology Co., Ltd. |
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