CN107214391A - Many selective wave-crest soldering machines of spray tin mouth formula - Google Patents

Many selective wave-crest soldering machines of spray tin mouth formula Download PDF

Info

Publication number
CN107214391A
CN107214391A CN201710568696.1A CN201710568696A CN107214391A CN 107214391 A CN107214391 A CN 107214391A CN 201710568696 A CN201710568696 A CN 201710568696A CN 107214391 A CN107214391 A CN 107214391A
Authority
CN
China
Prior art keywords
tin
nitrogen
spray
bath
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710568696.1A
Other languages
Chinese (zh)
Inventor
宋国明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201710568696.1A priority Critical patent/CN107214391A/en
Publication of CN107214391A publication Critical patent/CN107214391A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • B23K1/085Wave soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0653Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses the selective wave-crest soldering machine of the formula of spray tin mouth more than one kind, the tin soldering machine includes soldering mechanism, molten tin bath, the tin in molten tin bath is transported to the confession tin mechanism and heating arrangements of soldering mechanism, soldering mechanism is arranged on molten tin bath, it is arranged on for tin mechanism in molten tin bath, and heating arrangements are fixedly connected on the bottom of molten tin bath;Offered on soldering mechanism and extend one and more than one spray Xi Zui on multiple nitrogen outlets, and each nitrogen outlet.Sprayed, and flowed back to from nitrogen outlet in molten tin bath by the way that liquid tin is transported in the spray tin mouth in soldering mechanism for tin mechanism in invention;Compared to prior art, multiple spray Xi Zui are provided with soldering mechanism of the invention, compared to prior art, its processing efficiency is lifted at double, and device volume is small, and processing cost is low, consuming energy, low and fault rate is low;In addition, being each surrounded with the nitrogen of nitrogen outlet release on spray Xi Zui, anti-oxidation effect can be played to tin liquor, it is ensured that the quality of scolding tin.

Description

Many selective wave-crest soldering machines of spray tin mouth formula
Technical field
The invention belongs to tin soldering equipment technical field, more particularly to a kind of many selective wave-crest soldering machines of spray tin mouth formula.
Background technology
With the arrival of information age, the utilization of electronic product is more and more extensive, and most of electronic product be required for through Scolding tin processing is crossed, this make it that status of the tin soldering machine in production and living is more and more important.
There is selective wave-crest soldering machine in existing product, mainly based on Germany technology, also there is the life of part producer in China Production, this is a kind of equipment for substituting traditional wave-crest soldering machine to the accurate scolding tin of wiring board progress, and its core component is tin stove, tin High-temperature liquid state tin in the course of the work, is pumped out and carries out scolding tin to wiring board by stove by pump by spout, while adding on stannum export Nitrogen protection device is filled to prevent tin from aoxidizing.But generally there is problems with existing selective wave-crest soldering machine:
1st, the structure of existing tin stove is generally single spraying Xi Zui, and improves action by multiple single spraying Xi Zui tin stove combination Efficiency.On the whole, such way has that efficiency is low, and space during work shared by device is big, purchase and attending device Cost is high, big energy consumption and the problems such as high fault rate, be unfavorable for producer and produce and use on a large scale;
2nd, existing tin stove, which has, be present without using nitrogen protection device, in the case where no nitrogen is protected, tin Surface can form layer oxide film, so that scolding tin quality when can not ensure assist side scolding tin;
3rd, also exist in existing tin stove when providing nitrogen protection, using the nitrogen forms of protection of integral sealed, so The device scope of application it is very limited, and nitrogen consumption is big, and maintenance, maintenance and operation difficulty are big, and cost is high.
4th, exist in existing scolding tin industry between scolding tin quality and scolding tin efficiency contradiction, i.e. scolding tin quality and scolding tin efficiency without Method ensures simultaneously.
In view of the above-mentioned problems, urgently producing a kind of selective wave-crest soldering machine that can solve the problem that above mentioned problem.
The content of the invention
To solve the above problems, it is an object of the invention to provide the selective wave-crest soldering machine of the formula of spray tin mouth more than one kind, should Tin soldering machine contains multiple spray Xi Zui, and small volume, high in machining efficiency, low cost, power consumption is low and fault rate is low;In addition, each spraying tin Mouth surrounding is all covered with nitrogen, tin can be carried out anti-oxidation.
To achieve the above object, technical scheme is as follows.
The present invention provides much a kind of selective wave-crest soldering machines of spray tin mouth formulas, the tin soldering machine include soldering mechanism, molten tin bath, general Tin in molten tin bath is transported to the confession tin mechanism and heating arrangements of soldering mechanism, and the soldering mechanism is arranged on molten tin bath, described to supply Tin mechanism is arranged in molten tin bath, and the heating arrangements are fixedly connected on the bottom of molten tin bath;Offered on the soldering mechanism many Extend one and more than one spray Xi Zui on individual nitrogen outlet, and each nitrogen outlet.In invention, pass through heating arrangements Tin in molten tin bath is heated to liquid, then sprayed by the way that liquid tin is transported in the spray tin mouth in soldering mechanism for tin mechanism, And flowed back to from nitrogen outlet in molten tin bath;Compared to prior art, multiple spray Xi Zui, phase are provided with soldering mechanism of the invention Than in prior art, its processing efficiency is lifted at double, and device volume is small, and processing cost is low, consuming energy, low and fault rate is low;Separately Outside, the nitrogen of nitrogen outlet release is surrounded with each spray Xi Zui, anti-oxidation effect can be played to tin liquor, it is ensured that weldering The quality of tin.
Further, the soldering mechanism also includes nitrogen cell body, nitrogen atomizer and many spray tin-tubes, the nitrogen Cell body is fixedly connected on molten tin bath, and the multiple nitrogen outlet is opened on the top surface of nitrogen cell body, the nitrogen atomizer peace In nitrogen bath body, the corresponding spray Xi Zui connections in one end of every spray tin-tube, and every spray tin-tube the other end with For the connection of tin mechanism.In the present invention, nitrogen atomizer manufactures the nitrogen of atomization in nitrogen bath body, makes to be full of in nitrogen bath body The nitrogen of atomization, the nitrogen of atomization can be gushed out from the nitrogen outlet opened up, and be looped around around spray Xi Zui and play and put oxidation Effect.In the prior art, spray Xi Zui is single, and is provided with matched nitrogen atomization device, its work on each spray Xi Zui It is limited only to supply nitrogen to its corresponding spray Xi Zui as process, and the setting of the nitrogen atomizer and nitrogen cell body in the present invention A large amount of liquid nitrogens and interim storing liquid nitrogen can be manufactured, and nitrogen outlet is opened up on nitrogen cell body and is pacified as needed Dress spray Xi Zui, liquid nitrogen is that can gush out from the nitrogen opening opened up, it is not limited to service single spray Xi Zui, Neng Gou great The greatly overall processing efficiency of strong tin soldering machine, and its fault rate is low.
Further, the top of the nitrogen cell body offers nitrogen inlet, the nitrogen inlet and nitrogen atomizer Connection.In the present invention, by opening up nitrogen inlet on the top of nitrogen cell body, directly outside supplying nitrogen enters nitrogen atomization It is atomized in device, supplies nitrogen device compared to being set directly in nitrogen bath body, can continue efficiently to ensure the fortune of tin soldering machine OK, and it is easy to reduce tin soldering machine and refers to and reduce maintenance difficulty.
Further, the confession tin device is included for tin motor, the first tin runner, the second tin runner, second tin Runner is located at the top of the first tin runner;The confession tin motor is fixedly connected in molten tin bath, and supplies tin motor and the first tin runner Input connection, the output end of the first tin runner is connected with the input of the second tin runner, the second tin runner Output end is connected with the other end of every spray tin-tube.In the present invention, set for tin motor, the first tin runner, the second tin runner, Tin liquor in molten tin bath, which passes through to drive for tin motor, enters the first tin runner, enters back into the second tin runner, eventually pass spray tin-tube from Gush out in spray tin mouth, in this process, the second tin runner is located at the top of the first tin runner, compared to making tin liquor directly from the One tin runner enters in spray tin-tube, can alleviate the tin liquor that a difference in height brings gush stability the problem of, make tin liquor from spray More stablize when being sprayed in tin mouth.
Further, three spray Xi Zui are extended on each nitrogen outlet, three sprays Xi Zui is arranged at intervals, and middle part Spray the spray Xi Zui that Xi Zui is more than both sides.In actual use, three spray Xi Zui are arranged on same nitrogen outlet, mutually Between operationally have and slightly influence, so three is arranged at intervals, and middle spray Xi Zui is more than two side spray tin mouths and can effectively delayed Influencing each other between solution spray tin mouth.
Further, each spray Xi Zui is in cylinder.Spray Xi Zui's is set to cylinder and can better ensure that tin liquor Circulation spray tin processing stability, be not in that tin liquor is gushed situation about flashing, it is ensured that the crudy of tin soldering machine.
Further, the nitrogen cell body includes nitrogen bath phosphor bodies and nitrogen outlet plate, and the nitrogen outlet plate is removable The top for being connected to nitrogen bath phosphor bodies is unloaded, and the nitrogen outlet is opened on the nitrogen outlet plate.Nitrogen bath phosphor bodies With the setting of nitrogen outlet plate, it is possible to achieve different nitrogen outlet plates are changed for different processing objects, so as to reach Change the purpose of nitrogen outlet quantity so that the device goes for the processing of various types of wiring boards.
Advantage of the invention is that:Compared to prior art,
1st, the multiple spray Xi Zui of multiple nitrogen outlets are provided with tin soldering machine of the invention, operating efficiency is compared to prior art Lifted at double, compared to existing many single heads scolding tin machine combination work, its device volume is small, cost is low, power consumption is small and failure Rate is low.
2nd, there is nitrogen protection on each spray Xi Zui on tin soldering machine of the present invention, tin surfaces will not form layer oxide film, So as to ensure that scolding tin quality during circuit boards solder;
3rd, the contradiction between scolding tin quality and scolding tin efficiency in existing scolding tin industry is solved, the matter of scolding tin had both been ensure that Amount, also improves scolding tin efficiency.
Brief description of the drawings
Fig. 1 is the stereogram of the selective wave-crest soldering machine of the formula of spray tin mouth more than the present invention;
Fig. 2 is the cross section structure diagram of the selective wave-crest soldering machine of the formula of spray tin mouth more than the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and It is not used in the restriction present invention.
To achieve the above object, technical scheme is as follows.
Referring to shown in Fig. 1-2, the present invention provides a kind of many selective wave-crest soldering machines of spray tin mouth formula, and the tin soldering machine includes weldering Tin mechanism 1, molten tin bath 2, the confession tin mechanism 3 and heating arrangements 4 that the tin in molten tin bath 2 is transported to soldering mechanism 1, soldering mechanism 1 are pacified On molten tin bath 2, it is arranged on for tin mechanism 3 in molten tin bath 2, and heating arrangements 4 are fixedly connected on the bottom of molten tin bath 2;Soldering mechanism 1 On offer multiple nitrogen outlets 5, and extend one and more than one spray tin mouth 11 on each nitrogen outlet 5.In invention In, the tin in molten tin bath 2 is heated to liquid by heating arrangements 4, then by the way that liquid tin is transported into soldering mechanism for tin mechanism 3 Spray, and flowed back to from nitrogen outlet 5 in molten tin bath 2 in spray tin mouth 11 in 1;Compared to prior art, tin soldering machine of the invention Multiple spray tin mouths 11 are provided with structure, compared to prior art, its processing efficiency is lifted at double, and device volume is small, is processed into This is low, and consuming energy, low and fault rate is low;In addition, the nitrogen of the release of nitrogen outlet 5 is each surrounded with spray tin mouth 11, can be to tin Liquid plays anti-oxidation effect, it is ensured that the quality of scolding tin.
In the present embodiment, soldering mechanism 1 also includes nitrogen cell body 12, nitrogen atomizer 13 and many spray tin-tubes 14, nitrogen Air drain body 12 is fixedly connected on molten tin bath 2, and multiple nitrogen outlets 5 are opened on the top surface of nitrogen cell body 12, nitrogen atomizer 13 In nitrogen cell body 12, the spray tin mouth 11 that one end of every spray tin-tube 14 is corresponding is connected, and every spray tin-tube 14 The other end is connected with for tin mechanism 3.In the present invention, the nitrogen of the manufacture atomization in nitrogen cell body 12 of nitrogen atomizer 13, Make the nitrogen full of atomization in nitrogen cell body 12, the nitrogen of atomization can be gushed out from the nitrogen outlet 5 opened up, and be looped around spray tin Play a part of putting oxidation around mouth 11.In the prior art, spray tin mouth 11 is single, and is provided with and it on each spray tin mouth 11 The nitrogen atomization device of matching, its course of work is limited only to supply nitrogen to its corresponding spray Xi Zui, and the nitrogen in the present invention The setting of aerosolization device 13 and nitrogen cell body 12 can manufacture a large amount of liquid nitrogens and interim storing liquid nitrogen, and as needed Nitrogen outlet 5 is opened up on nitrogen cell body and spray tin mouth 11 is installed, liquid nitrogen is that can be gushed from the nitrogen opening 5 opened up Go out, it is not limited to service single spray Xi Zui, the overall processing efficiency of tin soldering machine can be greatly reinforced, and its fault rate is low.
In the present embodiment, the top of nitrogen cell body 12 offers nitrogen inlet 6, nitrogen inlet 6 and nitrogen atomizer 13 Connection.In the present invention, by opening up nitrogen inlet 6 on the top of nitrogen cell body 12, directly outside supplying nitrogen enters nitrogen It is atomized in atomizer 13, supplies nitrogen device compared to being set directly in nitrogen bath body, can continue efficiently to ensure scolding tin The operation of machine, and be easy to reduce tin soldering machine and refer to and reduce maintenance difficulty.
In the present embodiment, include for tin device 3 for tin motor 31, the first tin runner 32, the second tin runner 33, the second tin Runner 33 is located at the top of the first tin runner 32;It is fixedly connected on for tin motor 31 in molten tin bath 2, and supplies tin motor 31 and the first tin The input connection of runner 32, the output end of the first tin runner 32 is connected with the input of the second tin runner 33, the second tin runner 33 output end is connected with the other end of every spray tin-tube 14.In the present invention, set for tin motor 31, the first tin runner 32, Tin liquor in second tin runner 33, molten tin bath 2, which passes through to drive for tin motor, enters the first tin runner 32, enters back into the second tin runner 33, eventually pass spray tin-tube 14 and gush out from spray tin mouth 11, in this process, the second tin runner 33 is located at the first tin runner 32 Top, compared to make tin liquor directly from the first tin runner 32 enter spray tin-tube 14 in, can alleviate what a difference in height was brought Tin liquor gush stability the problem of, make tin liquor from spray tin mouth in spray when more stablize.
In the present embodiment, three spray tin mouths 11 are extended on each nitrogen outlet 5, three spray tin mouths 11 are arranged at intervals, And middle part spray tin mouth 11 is more than the spray tin mouth 11 of both sides.In actual use, three spray tin mouths 11 are arranged on same nitrogen In gas outlet 5, operationally have slightly influences each other, so three is arranged at intervals, and middle spray tin mouth 11 is more than two Side spray tin mouth 11 can effectively alleviate influencing each other between spray tin mouth 11.
In the present embodiment, each spray tin mouth 11 is in cylinder.The cylinder that is set to for spraying tin mouth 11 can be preferably Ensure the stability of the circulation spray tin processing of tin liquor, be not in that tin liquor is gushed situation about flashing, it is ensured that the processing of tin soldering machine Quality.Certainly, spray Xi Zui shape is not limited to cylinder in the present invention, can also be other shapes.
In the present embodiment, nitrogen cell body 12 includes nitrogen bath phosphor bodies 121 and nitrogen outlet plate 122, nitrogen outlet plate 122 are detachably connected on the top of nitrogen bath phosphor bodies 121, and nitrogen outlet 5 is opened on nitrogen outlet plate 122.Nitrogen bath The setting of phosphor bodies 121 and nitrogen outlet plate 122, it is possible to achieve different nitrogen outlet plates are changed for different processing objects 122, so as to reach the purpose for changing the quantity of nitrogen outlet 5 so that the device goes for various types of wiring boards Processing.
Advantage of the invention is that:Compared to prior art,
1st, multiple more than 5 spray tin mouths 11 of nitrogen outlet are provided with tin soldering machine of the invention, operating efficiency is compared to existing Technology is lifted at double, compared to existing many single heads scolding tin machine combination work, its device volume is small, cost is low, power consumption is small and Fault rate is low.
2nd, there is nitrogen protection on each spray tin mouth 11 on tin soldering machine of the present invention, tin surfaces will not form one layer of oxidation Film, so that scolding tin quality when ensure that circuit boards solder;
3rd, the contradiction between scolding tin quality and scolding tin efficiency in existing scolding tin industry is solved, the matter of scolding tin had both been ensure that Amount, also improves scolding tin efficiency.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.

Claims (7)

1. a kind of many selective wave-crest soldering machines of spray tin mouth formula, the tin soldering machine includes soldering mechanism, molten tin bath, transports the tin in molten tin bath The confession tin mechanism and heating arrangements of soldering mechanism are sent to, the soldering mechanism is arranged on molten tin bath, and the confession tin mechanism is arranged on In molten tin bath, and the heating arrangements are fixedly connected on the bottom of molten tin bath;Multiple nitrogen outlets are offered on the soldering mechanism, and Extend one and more than one spray Xi Zui on each nitrogen outlet.
2. many selective wave-crest soldering machines of spray tin mouth formula as claimed in claim 1, it is characterised in that the soldering mechanism is also wrapped Nitrogen cell body, nitrogen atomizer and many spray tin-tubes are included, the nitrogen cell body is fixedly connected on molten tin bath, the multiple nitrogen Outlet be opened on the top surface of nitrogen cell body, the nitrogen atomizer be arranged on nitrogen bath body in, one end of every spray tin-tube with Its corresponding spray Xi Zui connection, and the other end of every spray tin-tube is connected with for tin mechanism.
3. many selective wave-crest soldering machines of spray tin mouth formula as claimed in claim 2, it is characterised in that the top of the nitrogen cell body End offers nitrogen inlet, and the nitrogen inlet is connected with nitrogen atomizer.
4. many selective wave-crest soldering machines of spray tin mouth formula as claimed in claim 2, it is characterised in that the confession tin device includes For tin motor, the first tin runner, the second tin runner, the second tin runner is located at the top of the first tin runner;The confession tin electricity Machine is fixedly connected in molten tin bath, and is connected for tin motor with the input of the first tin runner, the output end of the first tin runner It is connected with the input of the second tin runner, the output end of the second tin runner is connected with the other end of every spray tin-tube.
5. many selective wave-crest soldering machines of spray tin mouth formula as claimed in claim 1, it is characterised in that prolong on each nitrogen outlet Three spray Xi Zui are stretched out, three sprays Xi Zui is arranged at intervals, and middle part spray Xi Zui is more than the spray Xi Zui of both sides.
6. many selective wave-crest soldering machines of spray tin mouth formula as claimed in claim 1, it is characterised in that each spray Xi Zui is in circle Cylindricality.
7. many selective wave-crest soldering machines of spray tin mouth formula as claimed in claim 1, it is characterised in that the nitrogen cell body includes Nitrogen bath phosphor bodies and nitrogen outlet plate, the nitrogen outlet plate are detachably connected on the top of nitrogen cell body, and the nitrogen Outlet is opened on the nitrogen outlet plate.
CN201710568696.1A 2017-07-13 2017-07-13 Many selective wave-crest soldering machines of spray tin mouth formula Pending CN107214391A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710568696.1A CN107214391A (en) 2017-07-13 2017-07-13 Many selective wave-crest soldering machines of spray tin mouth formula

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710568696.1A CN107214391A (en) 2017-07-13 2017-07-13 Many selective wave-crest soldering machines of spray tin mouth formula

Publications (1)

Publication Number Publication Date
CN107214391A true CN107214391A (en) 2017-09-29

Family

ID=59953503

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710568696.1A Pending CN107214391A (en) 2017-07-13 2017-07-13 Many selective wave-crest soldering machines of spray tin mouth formula

Country Status (1)

Country Link
CN (1) CN107214391A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107999920A (en) * 2017-12-06 2018-05-08 上海赢双电机有限公司 Electromagnetic wire accurately controls soldering frock and its application method with hookup wire soldering length
CN109719361A (en) * 2017-10-31 2019-05-07 康普技术有限责任公司 The device and method that selective wave soldering connects
CN110202232A (en) * 2019-04-26 2019-09-06 东莞市科立电子设备有限公司 A kind of selectivity wave-soldering automatic tin welding machine

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5397049A (en) * 1991-12-06 1995-03-14 Electrovert Ltd. Gas shrouded solder wave with reduced solder splatter
JP2002305372A (en) * 2001-04-05 2002-10-18 Suzuki Motor Corp Method and device for partial soldering
CN201089051Y (en) * 2007-08-03 2008-07-23 陈许松 Leadless wave peak soldering machine
EP3040149A1 (en) * 2014-12-09 2016-07-06 Messer Austria GmbH Soldering device with gas distribution
CN205817017U (en) * 2016-06-13 2016-12-21 孙玉荣 Nitrogen protection device
CN206912430U (en) * 2017-07-13 2018-01-23 宋国明 More spray tin mouth formula selectivity wave-crest soldering machines

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5397049A (en) * 1991-12-06 1995-03-14 Electrovert Ltd. Gas shrouded solder wave with reduced solder splatter
JP2002305372A (en) * 2001-04-05 2002-10-18 Suzuki Motor Corp Method and device for partial soldering
CN201089051Y (en) * 2007-08-03 2008-07-23 陈许松 Leadless wave peak soldering machine
EP3040149A1 (en) * 2014-12-09 2016-07-06 Messer Austria GmbH Soldering device with gas distribution
CN205817017U (en) * 2016-06-13 2016-12-21 孙玉荣 Nitrogen protection device
CN206912430U (en) * 2017-07-13 2018-01-23 宋国明 More spray tin mouth formula selectivity wave-crest soldering machines

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109719361A (en) * 2017-10-31 2019-05-07 康普技术有限责任公司 The device and method that selective wave soldering connects
CN107999920A (en) * 2017-12-06 2018-05-08 上海赢双电机有限公司 Electromagnetic wire accurately controls soldering frock and its application method with hookup wire soldering length
CN110202232A (en) * 2019-04-26 2019-09-06 东莞市科立电子设备有限公司 A kind of selectivity wave-soldering automatic tin welding machine
CN110202232B (en) * 2019-04-26 2024-02-13 广东盛控达智能科技有限公司 Automatic soldering tin machine of selectivity wave soldering

Similar Documents

Publication Publication Date Title
CN107214391A (en) Many selective wave-crest soldering machines of spray tin mouth formula
CN206912430U (en) More spray tin mouth formula selectivity wave-crest soldering machines
CN101252815B (en) Solder tray local tin plating method on circuit board
CN203124190U (en) Gum dipping tank, gum dipping device with gum dipping tank, and gluing machine
CN206500729U (en) A kind of net belt type controls atmosphere continuous brazing furnace
CN103052270A (en) Method for plating copper and tin on metal circuit board through pattern plating
JPS56102598A (en) Method and device for supply of plating solution to metal stacked
CN107099825A (en) The electroplate liquid formulation and lead tin plating technique of electronic component lead tin plating technique
CN105772893B (en) Plant the equipment of tin automatically with vision
CN106521565A (en) Vertical environment-friendly novel copper foil production device
CN206173292U (en) Yellow rice wine is made with evaporating a meter device
CN205253765U (en) Copper line tinning stack
CN107911955A (en) A kind of chip replacing options
CN202865359U (en) Local electroplating device for inner holes
CN207519520U (en) A kind of biscuit automatic oil spout is atomized retracting device
CN208661568U (en) A kind of seamless point glue equipment of novel injection valve
CN207498482U (en) The device structure that a kind of gold plating thickness uniformity and plating speed are promoted
CN201415263Y (en) Novel cooling device of narrow-face foot-roller of crystallizer
CN207806829U (en) A kind of rosin circulatory system
CN206204419U (en) A kind of electroless copper equipment with cleaning device
CN104779174B (en) The production method of power module
CN207908327U (en) Ultra tiny enamelled wire stator brine spray test device
CN103207542B (en) Device for maintaining developing solution stability
CN202430287U (en) Compensation spray device
CN206413277U (en) A kind of OSP organic protective films coating machine

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned

Effective date of abandoning: 20240119

AD01 Patent right deemed abandoned