CN107210088B

CN107210088B - Device for generating, distributing and/or using electrical energy and assembly for such a device

Info

Publication number: CN107210088B
Application number: CN201580067629.0A
Authority: CN
Inventors: A.迪-吉安尼; M.伯格斯布洛姆; T.A.鲍尔; J.曼蒂拉弗洛雷兹; M-D.布尔格勒; O.克斯萨特; S.格罗布
Original assignee: ABB Schweiz AG
Current assignee: Hitachi Energy Co ltd; ABB Schweiz AG
Priority date: 2014-12-12
Filing date: 2015-12-14
Publication date: 2021-09-10
Anticipated expiration: 2035-12-14
Also published as: KR102429605B1; EP3230987A1; CN107210088A; US20170287588A1; WO2016091274A1; EP3230987B8; US10818407B2; WO2016092115A1; KR20170094273A; EP3230987B1

Abstract

The invention relates to an electrical device having an insulating space (4), the insulating space (4) containing a dielectric insulating fluid (3, 31) comprising an organofluorine compound. At least one solid component (2) of the device which is directly exposed to the insulating fluid (3, 31) comprises a base body (5) made of a first material and a protective layer (10) made of a second material different from the first material, the protective layer (10) being applied directly or indirectly on the base body (5) and having a thickness of at least 50 [ mu ] m. The organofluorine compound is selected from the group consisting of fluoroethers, fluoroketones, fluoroolefins, fluoronitriles and mixtures thereof, and the first material comprises or consists of a material selected from the group consisting of: polymeric materials, ceramics, composites, and mixtures or combinations thereof.

Description

Device for generating, distributing and/or using electrical energy and assembly for such a device

The present invention relates to devices for generating, transmitting, distributing and/or using electrical energy, assemblies for such devices, and methods of making such assemblies.

Dielectric insulation media in liquid or gaseous form are commonly used for the insulation of electrically conductive parts of various devices, such as switchgears, Gas Insulated Substations (GIS), Gas Insulated Lines (GIL), transformers or others.

In medium or high voltage metal-encapsulated switchgears, for example, the electrically conductive part is arranged in a gas-tight housing which defines an insulating space which comprises an insulating gas and separates the housing from the electrically conductive part without letting current pass through the insulating space. In order to interrupt the current flow, for example, in high-voltage switchgear assemblies, insulating gases are also used as quenching gases.

Recently, it has been proposed to use organofluorine compounds in dielectric insulating gases. In particular, WO-A-2010/142346 discloses dielectric insulation mediA comprising fluoroketones containing from 4 to 12 carbon atoms. Furthermore, WO-A-2012/080246 discloses that mixtures of fluoroketones comprising exactly 5 carbon atoms (hereinafter referred to as "C5K") with dielectric insulating gas components other than said C5K are particularly preferred.

Fluoroketones have been shown to have high insulating capabilities, in particular high dielectric strength, and high arc quenching capabilities. At the same time, they have very low Global Warming Potentials (GWPs) and very low toxicity. The combination of these features makes these fluoroketones very suitable as a possible alternative to conventional insulating gases.

Despite the above-mentioned excellent properties of fluoroketone-containing insulating gases, it has surprisingly been found that care must be taken to avoid a reduction in their insulating and arc-extinguishing properties with prolonged operating times. Otherwise, it may eventually happen that the maintenance interval is shortened or the operation of the device is interrupted prematurely to replace at least a part of the insulating gas.

Additionally, it has been unexpectedly discovered that care should also be taken to avoid the functionality of device components directly exposed to the fluoroketone-containing insulating gas, which can be adversely affected during exposure to extended operating times. Also, this may eventually lead to the above-mentioned situation, i.e. a shortened maintenance interval or a premature interruption of the operation of the device, in which case the respective component is replaced. For example, it has been surprisingly found that seal assemblies made from commercially available polymeric materials are sensitive to exposure to C5K under operating conditions.

The above findings regarding potential reduction of the performance of the insulating gas and the functionality of certain components are contrary to the general assumption that fluoroketones are non-reactive under the operating conditions of the device. There is virtually no report in the published prior art of potential instability and incompatibility problems that can arise with the use of fluoroketones in general, and C5K in particular, reflecting the general assumptions.

The not yet published international patent application PCT/EP2014/071274 of the same applicant relates to a device wherein at least some of the components of the device directly exposed to the insulating gas are made of a material which remains unchanged during the exposure to the insulating gas.

WO2014/037566Al discloses medium or high voltage devices having a dielectric insulating gas comprising heptafluoroisobutyronitrile mixed with a diluent gas and an electrical conductor or electrode covered by a solid dielectric layer of variable thickness.

The selection of particular materials for particular components of the device is a result of a long and often tedious development process. For SF₆The material showing the best performance of the insulating device does not necessarily have to be for using non-SF₆Devices in which the gas is dielectrically insulating are compatible. However, use of SF₆Replacement of a compatible material with another material is often accompanied by a reduction in a desired property or performance other than compatibility with the insulating fluid. This can lead to situations where the specifications do not match or are more difficult to match.

In view of the above, the problem underlying the present invention is therefore to provide a device for the generation, transmission, distribution and/or use of electrical energy, which comprises a dielectric insulating fluid containing an organofluorine compound and which fully complies with the technical requirements for its componentsWhile maintaining high integrity of the insulating fluid and the assembly even after prolonged exposure of the assembly to the insulating fluid. In particular, the invention will allow the components of the device to hold SF₆Mechanical and electrical properties of the insulating device component while being compatible with insulating fluids comprising organofluorine compounds.

This problem is solved by the subject matter of claim 1. Preferred embodiments of the invention are defined in the dependent claims as well as in combinations of the claims.

The invention relates to a device for generating, transmitting, distributing and/or using electrical energy, according to claim 1. As further defined in claim 1, the device comprises a housing enclosing an insulating space and an electrically conductive member arranged in the insulating space, the insulating space containing a dielectric insulating fluid comprising an organofluorine compound, at least one solid component of the device being directly exposed to the insulating fluid.

According to the invention, the at least one solid component directly exposed to the insulating fluid comprises a base body made of a first material and a protective layer made of a second material different from the first material, which protective layer is applied directly or indirectly on the base body and has a thickness of at least 50 [ mu ] m.

Thus, the present invention allows the determined usage for SF₆The component materials of the insulation device are also used in devices that use an insulation fluid containing an organofluorine compound, regardless of the potential incompatibility of the component materials with the organofluorine compound. The present invention thus avoids the cumbersome development of fully organofluorine compatible materials that match all other technical requirements.

This is achieved by the protective layer preventing the substrate of the solid component from directly contacting the insulating fluid, in particular the organofluorine compound contained in the insulating fluid.

In other words, the invention allows to shield the matrix from reactions with the insulating fluid, in particular organofluorine compounds, which may have an impact on the integrity of the insulating fluid as well as the solid components.

Finally, the functionality of the components is maintained, so that there is no need to regularly replace the components, ultimately resulting in a device with a long service life and low maintenance.

Furthermore, nucleophilic substitution with decomposition reactions of organofluorine compounds, such as carbonyl groups of fluoroketones or nitrile groups of fluoronitriles, is effectively prevented, the integrity of the insulating gas and correspondingly its insulating and arc-extinguishing properties are also maintained, which further contributes to a long service life and low maintenance of the device.

Furthermore, according to this aspect of the invention, safety or health risks that may be caused by decomposition products are reduced or even eliminated. This is particularly relevant in the case where one potential decomposition product is Hydrogen Fluoride (HF), which is highly corrosive and extremely toxic.

The fact that some decomposition products may open a closed reaction pathway for the organofluorine compound on which the decomposition product is based, further underscores the relevance of reducing or eliminating the decomposition product. This is true, for example, for copper, which is likely to react with the decomposition products of C5K, but not with C5K itself. Such secondary reactions are effectively reduced or even eliminated by the present invention.

The term "solid component" is to be understood in a broad sense and shall include any solid part having a surface which is at least partially or at least for a certain period of time exposed to said insulating fluid. In particular, the term "solid component" includes any part or portion of the housing wall that contacts the insulating fluid. Additionally, seal assemblies, particularly seal rings and the like, are encompassed by the term "solid components".

The term "solid component" relates in particular to a solid component comprising or consisting of a polyamide or polyamide composite material, to a component comprising alkali metal or alkaline earth metal cations, for example to a fibre-reinforced composite material and/or to an elastomer, for example comprising MgO or CaO as filler, since for these materials the problems of incompatibility are particularly relevant and the effect obtained according to the invention is therefore particularly pronounced.

The term "at least one component" as used in the context of the present invention may relate to only one component, two or more components, and/or all components being directly exposed to, i.e. in direct contact with, said insulating fluid.

According to the invention, the first material, i.e. the material of the matrix of the at least one solid component, comprises or consists of a material selected from the group consisting of: polymeric materials, ceramics, composites, and mixtures or combinations thereof. In particular, the material is a polymeric material, in particular a thermoplastic material, or a composite material comprising a polymeric material. Also relevant to this embodiment is that only one component, two or more components, and/or the matrix of all components may comprise or consist of the materials mentioned above.

In particular, the first material of the matrix is a non-conductive material or a dielectric material or an electrically insulating material. Further in particular, the protective cover or its first material, respectively, forms a non self-supporting structure. In other words, only the solid component or its base together with the protective cover form a self-supporting structure in the device.

For example, the solid component comprising the matrix or the matrix of the device itself is a solid insulator or a column insulator or a chamber insulator or a GIS insulator, in particular arranged or intended for arrangement in a medium voltage GIS or a high voltage GIS, or a GIL insulator or a transformer insulator, for solid insulation in a gas-insulated transformer, or a gas-insulated cable. In particular in this case, the protective layer is made of a dielectric material or a semiconductor material or a slightly conductive material, or forms a multilayer comprising a combination of these materials. According to the invention, the insulator or its matrix respectively has a protective cap on its surface facing the dielectric fluid containing the organofluorine compound, said protective cap preventing chemical reactions occurring between the solid component or its matrix and the organofluorine compound and its degradation products present in the dielectric insulating fluid. This extends the integrity or lifetime of the dielectric insulating fluid and the solid component or its matrix.

As another example, the solid component of the device comprising the substrate or the substrate itself is the sealed component of the device. In particular in this case, the protective layer is made of a semiconductor material or a slightly conductive material or a metallic material, or forms a multilayer comprising a combination of these materials.

As mentioned above, the first material may in particular be a proven materialParticularly for conventional installations, more particularly SF₆The material of the insulation means, regardless of its potential incompatibility with the insulation fluid containing the organofluorine compound.

In an embodiment, the second material is a dielectric material. According to a particular embodiment, the second material comprises or consists of a polymeric material selected from: an epoxy resin; polyolefins, in particular hydrogenated polyolefins or fluorinated polyolefins, more particularly polytetrafluoroethylene; a polyurethane; and mixtures thereof. It has been found that these materials exhibit a high compatibility with organofluorine compounds, in particular with fluoroketones or fluoronitriles, and further prevent gas permeation of the organofluorine compounds.

Among the polymeric materials mentioned, epoxy resins have been shown to be particularly preferred. This is not only due to its high compatibility, but also to the fact that the epoxy resin can achieve a high crosslinking density, ensuring low gas permeation through the protective layer. Thus, organofluorine compounds, in particular fluoroketones or fluoronitriles, are prevented from passing through the protective layer and thus from contacting the substrate, even in the case of relatively thin protective layers. As a further advantage, epoxy resins allow relatively high glass transition temperatures to be achieved, which makes these materials also suitable for devices, in particular switching devices, in which relatively high temperatures occur. In particular, a high glass transition temperature contributes to a low gas permeation through the protective layer also at high temperatures.

According to a particular embodiment, the solid component has, in use of the device, a first side exposed to or facing the insulating fluid and a second side remote from the first side and not exposed to or avoiding the insulating fluid. In this embodiment, the protective layer is preferably applied on the side of the substrate facing the first side of the solid component, more preferably only on this side; thus, in particular, a direct contact between the matrix and the insulating fluid is prevented. In this context, the term "away from said first side" is to be interpreted in particular as referring to the far side relative to the first side. Thus, the use of polymeric materials may be limited to the areas where it is actually needed. The characteristics of the material of the solid component are therefore only influenced to the minimum extent necessary by the protective layer and only to the extent that the substrate is protected from reaction with the insulating fluid.

It is further preferred that the surface of the protective layer is directly exposed to the insulating fluid on the side facing away from the substrate. In this context, the term "away from the substrate" refers to the distal side of the protective layer relative to the substrate.

Since according to a further preferred embodiment the reactivity of the second material towards the organofluorine compound is lower than the reactivity of the first material under the operating conditions of the device, the degradation of the organofluorine compound as well as the solid components can be reduced or even eliminated.

According to a particularly preferred embodiment, the second material is inert towards the organofluorine compound or any degradation product thereof under the operating conditions of the apparatus, which means that it is completely non-reactive towards these components under the operating conditions of the apparatus.

It is further preferred that the second material is constituted such that it remains unchanged during exposure to the insulating fluid for more than 1 year, in particular for more than 3 years or 5 years or 10 years or 20 years, under the operating conditions of the device. Most preferably, neither the solid component nor the organofluorine compound undergoes degradation for at least one year, in particular at least 3 years or 5 years or 10 years or 20 years.

According to the invention, the organofluorine compound is selected from: fluoroethers, in particular hydrofluoroethers, such as hydrofluoromonoethers, or perfluoroethers; fluoroketones, in particular perfluoroketones; fluoroolefins, in particular hydrofluoroolefins; and fluoronitriles, particularly perfluoronitriles; and mixtures thereof.

It is therefore particularly preferred that the insulating fluid comprises a fluoroketone containing from 4 to 12 carbon atoms, preferably containing exactly 5 carbon atoms, or exactly 6 carbon atoms, or a mixture thereof. The advantages achieved by the present invention are particularly evident when the insulating fluid comprises a fluoroketone as defined above, since any problems that might otherwise be caused by the ketone group undergoing nucleophilic substitution can be avoided.

The term "fluoroketone" as used in this application should be interpreted broadly and shall encompass both perfluoroketones and hydrofluoroketones and shall further encompass both saturated and unsaturated compounds, i.e. compounds comprising double and/or triple bonds between carbon atoms. The at least partially fluorinated alkyl chain of the fluoroketone may be linear or branched, or may form a ring, optionally substituted with one or more alkyl groups. In exemplary embodiments, the fluoroketone is a perfluoroketone. In further exemplary embodiments, the fluoroketones have branched alkyl chains, in particular at least partially fluorinated alkyl chains. In still further exemplary embodiments, the fluoroketone is a fully saturated compound.

As mentioned above, it is particularly preferred that the insulating fluid comprises a fluoroketone containing exactly 5 carbon atoms, or exactly 6 carbon atoms, or a mixture thereof. Fluoroketones containing 5 or 6 carbon atoms have the advantage of a relatively low boiling point compared to fluoroketones having a larger chain length of more than 6 carbon atoms. Thus, problems that may be accompanied by liquefaction can be avoided, even when the device is used at low temperatures.

According to an embodiment, the fluoroketone is at least one compound selected from the group of compounds defined by the following structural formulae, wherein at least one hydrogen atom is replaced by a fluorine atom:

fluoroketones containing 5 or more carbon atoms are further advantageous because they are generally non-toxic, with a significant margin of human safety. This is in contrast to fluoroketones having less than 4 carbon atoms, such as hexafluoroacetone (or hexafluoroacetone), which are toxic and very reactive. In particular, fluoroketones containing exactly 5 carbon atoms, abbreviated herein as C5K, and fluoroketones containing exactly 6 carbon atoms are thermally stable up to 500 ℃.

In embodiments of the present invention, fluoroketones having branched alkyl chains, particularly C5K, are preferred because they have boiling points lower than the boiling points of the corresponding compounds having linear alkyl chains (i.e., compounds having the same formula).

According to an embodiment, C5K is a perfluoroketone, in particular of formula C₅F₁₀O, i.e. fully saturated, with no double or triple bonds between carbon atoms. Fluoroketone C5K may more preferably be selected from 1,1,1,3,4,4, 4-heptafluoro-3- (trifluoromethyl) butan-2-one (also known as decafluoro-2-methylbutan-3-one); 1,1,1,3,3,4,4,5,5, 5-decafluoropentan-2-one; 1,1,1,2,2,4,4,5,5, 5-decafluoropentan-3-one; and octafluorocyclopentanone, most preferably 1,1,1,3,4,4, 4-heptafluoro-3- (trifluoromethyl) butan-2-one.

1,1,1,3,4,4, 4-heptafluoro-3- (trifluoromethyl) butan-2-one may be represented by the following structural formula (I):

has been found to have the formula CF₃C(O)CF(CF₃)₂Or C₅F₁₀The O1, 1,1,3,4,4, 4-heptafluoro-3- (trifluoromethyl) butan-2-one is particularly preferred for high and medium voltage insulation applications because of its high dielectric insulation properties, especially very low GWP when mixed with a dielectric carrier gas, and its low boiling point. The ODP is 0, and the paint is basically nontoxic.

According to embodiments, even higher insulating capabilities may be obtained by combining mixtures of different fluoroketone components. In embodiments, fluoroketones containing exactly 5 carbon atoms, as described above and referred to herein simply as C5K, and fluoroketones containing exactly 6 carbon atoms or exactly 7 carbon atoms, referred to herein simply as fluoroketones C6K or C7K, may advantageously be used simultaneously as part of the dielectric insulation. Thus, an insulating fluid with more than one fluoroketone may be obtained, each contributing itself to the dielectric strength of the insulating fluid.

In embodiments, the other fluoroketone C6K or C7K is at least one compound selected from compounds defined by the following structural formula wherein at least one hydrogen atom is replaced by a fluorine atom:

and any fluoroketone containing exactly 6 carbon atoms, wherein the at least partially fluorinated alkyl chain of said fluoroketone forms a ring, which ring is substituted with one or more alkyl groups (IIh);

and/or is at least one compound selected from the group consisting of compounds defined by the following structural formulae, wherein at least one hydrogen atom is replaced by a fluorine atom:

(IIIa),

(IIIb),

(IIIc),

(IIId),

(IIIe),

(IIIf),

(IIIg),

(IIIh),

(IIIi),

(IIIj),

(IIIk),

(IIIl),

(IIIm), and

(IIIn), for example dodecafluoro-cycloheptanone,

and any fluoroketone containing exactly 7 carbon atoms, wherein the at least partially fluorinated alkyl chain of said fluoroketone forms a ring, which ring is substituted with one or more alkyl groups (IIIo).

The invention comprises each compound or each combination of compounds selected from the group consisting of the compounds of the formulae (Ia) to (Ii), (IIa) to (IIh), (IIIa) to (IIIo) and mixtures thereof.

Depending on the specific application of the device of the invention, fluoroketones containing exactly 6 carbon atoms (belonging to the above-mentioned designation "C6K") may be preferred; the fluoroketone is nontoxic and has significant safety margin for human body.

In embodiments, the fluoroketone C6K is a perfluoroketone, like C5K, and/or has a branched alkyl chain, in particular an at least partially fluorinated alkyl chain, and/or the fluoroketone C6K comprises a fully saturated compound. In particular, said fluoroketone C6K has the formula C₆F₁₂O, i.e. fully saturated, with no double or triple bonds between carbon atoms. More preferably, the fluoroketone C6K may be selected from 1,1,1,2,4,4,5,5, 5-nonafluoro-2- (trifluoromethyl) pentan-3-one (also known as dodecafluoro-2-methylpentan-3-one), 1,1,1,3,3,4,5,5, 5-nonafluoro-4- (trifluoromethyl) pentan-2-one (also known as dodecafluoro-4-methylpentan-2-one), 1,1,1,3,4,4,5,5, 5-nonafluoro-3- (trifluoromethyl) pentan-2-one (also known as dodecafluoro-3-methylpentan-2-one), 1,1,1,4,4, 4-hexafluoro-3, 3-bis- (trifluoromethyl) butan-2-one (also known as dodecafluoro-3, 3- (dimethyl) butan-2-one), dodecafluorohex-2-one, dodecafluorohex-3-one, in particular the mentioned 1,1,1,2,4,4,5,5, 5-nonafluoro-2- (trifluoromethyl) pentan-3-one; or may be of formula C₆F₁₀Decafluorocyclohexanone of O.

1,1,1,2,4,4,5,5, 5-nonafluoro-2- (trifluoromethyl) pentan-3-one (also known as dodecafluoro-2-methylpentan-3-one) may be represented by the following structural formula (II):

it has been found that 1,1,1,2,4,4,5,5, 5-nonafluoro-4- (trifluoromethyl) pentan-3-one (referred to herein simply as "C6-one", having the formula C₂F₅C(O)CF(CF₃)₂) It is particularly preferred for high voltage insulation applications because of its high insulation properties and its very low GWP. In particular, the field strength of reduced-voltage breakdown is about 240 kV/(cm bar), which is much higher than that of air with much lower dielectric strength (E)_cr= 25 kV/(cm bar). It has an ozone depletion potential of 0 and is non-toxic (LC50 is about 100000 ppm). Therefore, the influence on the environment is low while a significant human safety margin is achieved.

Additionally or alternatively, the insulating fluid preferably comprises a hydrofluoro monoether containing at least three carbon atoms.

As mentioned above, the organofluorine compound may also be a fluoroolefin, particularly a hydrofluoroolefin. More particularly, the fluoroolefins or hydrofluoroolefins each contain exactly three carbon atoms.

According to a particular embodiment, the hydrofluoroolefin is therefore selected from 1,1,1, 2-tetrafluoropropene (HFO-1234yf), 1,2,3, 3-tetrafluoro-2-propene (HFO-1234yc), 1,1,3, 3-tetrafluoro-2-propene (HFO-1234zc), 1,1,1, 3-tetrafluoro-2-propene (HFO-1234ze), 1,1,2, 3-tetrafluoro-2-propene (HFO-1234ye), 1,1,1,2, 3-pentafluoropropene (HFO-1225ye), 1,1,2,3, 3-pentafluoropropene (HFO-1225yc), 1,1,1,3, 3-pentafluoropropene (HFO-1225zc), (Z)1,1,1, 3-tetrafluoropropene (HFO-1234zeZ), (Z)1,1,2, 3-tetrafluoro-2-propene (HFO-1234yeZ), (E)1,1,1, 3-tetrafluoropropene (HFO-1234zeE), (E)1,1,2, 3-tetrafluoro-2-propene (HFO-1234yeE), (Z)1,1,1,2, 3-pentafluoropropene (HFO-1225yeZ), (E)1,1,1,2, 3-pentafluoro-propene (HFO-1225yeE), and combinations thereof.

As mentioned above, the organofluorine compound may also be a fluoronitrile, in particular a perfluoronitrile. In particular, the organofluorine compound may be a fluoronitrile, in particular a perfluoronitrile, containing 2,3 or 4 carbon atoms.

More particularly, the fluoronitrile may be a perfluoroalkylnitrile, in particular perfluoroacetonitrile, perfluoropropionitrile (C)₂F₅CN) and/or perfluorobutanenitrile (C)₃F₇CN)。

Most particularly, the fluoronitrile may be perfluoroisobutyronitrile (according to formula (CF)₃)₂CFCN) and/or perfluoro-2-methoxypropionitrile (according to formula CF)₃CF(OCF₃) CN). Among them, perfluoroisobutyronitrile is particularly preferable because of its low toxicity.

According to another preferred embodiment, the insulating fluid comprises carbon dioxide (CO)₂). Additionally or alternatively, the insulating fluid comprises air or at least one air component, in particular selected from oxygen (O)₂) Nitrogen (N)₂) Carbon dioxide (CO)₂) And mixtures thereof.

According to a particular embodiment, the insulating fluid comprises carbon dioxide mixed with oxygen. It is therefore preferred that the ratio of the amount of carbon dioxide to the amount of oxygen is from 50:50 to 100: 1.

In particular in view of interrupting the current in the high-voltage switchgear, it is further preferred that the ratio of the amount of carbon dioxide to the amount of oxygen is from 80:20 to 95:5, more preferably from 85:15 to 92:8, even more preferably from 87:13 to below 90:10, in particular about 89: 11. In this regard, it has been found that, on the one hand, the presence of oxygen in a mole fraction of at least 5% allows to prevent soot formation even after repeated current interruption events with high current arcs. On the other hand, the presence of oxygen in a molar fraction of at most 20% (i.e. 20% or less), more particularly at most 15% (i.e. 15% or less), reduces the risk of degradation of the material of the electrical device by oxidation.

The term "device" or "electrical device" is used in the context of the present invention, in particular relating to gas-insulated devices. In particular, it is a component of or a device: high voltage device, medium voltage device, low voltage device, direct current device, switchgear, air-insulated switchgear, a component or assembly of air-insulated switchgear, gas-insulated metal-encapsulated switchgear (GIS), a component or assembly of gas-insulated metal-encapsulated switchgear, a gas-insulated transmission line (GIL), a bus, a bushing, a gas-insulated cable, a cable joint, a current transformer, a voltage transformer, a sensor, a humidity sensor, a surge arrester, a capacitor, an inductor, a resistor, a current limiter, a high voltage switch, a grounding switch, a disconnector, a combined disconnector and grounding switch, a load break switch, a circuit breaker, a gas-insulated vacuum circuit breaker, a generator circuit breaker, a medium voltage switch, a ring main unit, a recloser, a sectionalizer, a low voltage switch, any type of gas-insulated switch, a transformer, a gas-insulated switchgear, a gas-insulated vacuum circuit breaker, a gas-insulated switchgear, distribution transformer, power transformer, tap changer, transformer bushing, rotating electrical machine, generator, engine, driver, semiconductor device, power converter, converter station, converter building; and components and/or combinations of these devices.

In addition to the above-described device, the invention also relates to a solid component for such a device, at least a part of the surface of which component is directly exposed to an insulating fluid comprising an organofluorine compound. Similar to what is described above, the solid component contains a base body made of a first material and a protective layer made of a second material and applied directly or indirectly on the base body, the second material being different from the first material, the protective layer having a thickness of at least 50 μm.

Thus, a solid component having reduced reactivity or complete non-reactivity to organofluorine compounds may be provided while complying with the technical requirements of the solid component within the apparatus. Since for the matrix, it can be chosen to be well defined for SF₆The material of the insulating means and thus the heavy development of fully organofluorine compatible materials matching all other technical requirements can be avoided.

The preferred features described above for the device of the invention are also disclosed for the solid component and vice versa. In particular, the matrix of at least some of the solid components comprises or consists of: a polymeric material; a ceramic; composite materials, in particular insulating composite materials; and mixtures or combinations thereof.

Further similar to that described above for the device of the present invention, the second material preferably comprises or consists of a polymeric material selected from: an epoxy resin; polyolefins, in particular hydrogenated polyolefins or fluorinated polyolefins, more particularly polytetrafluoroethylene; a polyurethane; and mixtures thereof.

According to specific embodiments of the solid module and the corresponding apparatus, the thickness of the protective layer is at least 100 μm, preferably at least 200 μm, more preferably at least 300 μm, most preferably at least 500 μm. Thus, low gas permeation through the protective layer can be ensured. Thus, it is further preferred that the thickness of the protective layer is between 50 μm and 100mm, preferably between 200 μm and 50mm, more preferably between 300 μm and 10mm, most preferably between 500 μm and 5mm, providing low gas permeation, but while keeping the amount of protective layer to a minimum.

In embodiments, the polymeric material of the protective layer, in particular the epoxy resin, has a glass transition temperature higher than 100 ℃ in view of the high temperature resistance to be achieved. As mentioned, this is particularly helpful with low gas permeation through the protective layer also at high temperatures.

In particular, the polymeric material of the protective layer, in particular the epoxy resin, has a crosslinking density in the range 50% to 100%, taking into account the very low gas permeation through the protective layer. As used herein, the crosslink density refers to the proportion of functional groups that react to form crosslinks. When the polymeric material is an epoxy resin, 50% to 100% of the epoxy groups thus react to form crosslinks.

Alternatively or additionally, according to a further preferred embodiment, the gas permeation can be reduced by a protective layer applied indirectly on the substrate and a reinforcement layer provided between the substrate and the protective layer. In this respect, it is particularly preferred that the reinforcement layer comprises or consists of polyester.

In addition to the device and solid components described above, the invention also relates to a method of preventing a reaction of at least one solid component of an electrical device for generating, transporting, distributing and/or using electrical energy, said device comprising a housing enclosing an insulating space containing a dielectric insulating fluid comprising an organofluorine compound, and an electrically conductive part arranged in said insulating space, at least one solid component of the device being directly exposed to the insulating fluid.

The method comprises the following steps:

a) providing a substrate of the at least one solid component, the substrate being made of a first material, and

b) a protective layer made of a second material is applied to the surface of the substrate,

wherein the second material has a lower reactivity for the organofluorine compound than the first material under operating conditions of the device.

In particular, the material of the protective layer is at least approximately inert to the insulating fluid under the operating conditions of the device.

The preferred features described above for the apparatus and solid components of the invention are also disclosed herein for use in the method and vice versa.

Furthermore, the present invention also relates to the use of a polymeric material, in particular in the device disclosed herein, said polymeric material being selected from the group consisting of epoxy resins; polyolefins, in particular hydrogenated polyolefins or fluorinated polyolefins, more particularly polytetrafluoroethylene; a polyurethane; and mixtures thereof for protecting layers against reactions between organofluorine compounds and solid components reactive with organofluorine compounds.

Throughout this disclosure, the term "protective layer" is used in the context of the present invention to include any coating, such as a dielectric or semiconductive coating or a slightly conductive coating or a metallic coating or a multilayer coating, for example comprising a combination of such coatings, suitable for use on said substrate, in particular in the form of a paint and/or paint, such as a dielectric paint and/or dielectric paint. Thus, the protective layer 10 is made of a dielectric material or a semiconductor material or a slightly conductive material or a metallic material, or forms a multilayer comprising a combination of such materials.

According to a second aspect of the invention, the protective layer protects the device against dielectric breakdown. According to this aspect, the invention also relates to a method of improving the dielectric properties of an electrical device for generating, transmitting, distributing and/or using electrical energy, said device comprising a housing enclosing an insulating space and an electrically conductive part arranged in said insulating space, said insulating space containing a dielectric insulating fluid comprising an organofluorine compound, at least one solid component of the device being directly exposed to the insulating fluid, said method comprising the steps of:

A) providing a matrix of the at least one solid component,

B) and applying a coating on the surface of the substrate,

wherein the surface of the coating applied in step B) is smoother than the surface of the substrate of step A).

It has been found that the coating improves the dielectric properties (dielectric breakdown limit) of electrical devices, in particular switchgear, more in particular relays. If the coating is applied to a substrate of a solid component arranged in a switchgear, the substrate surface becomes smoother. Thus, the sensitivity to particles is reduced.

The effect can be explained by the fact that a partial discharge event is triggered by the presence of particles. The requirement for partial discharge to occur is due to the local electric field enhancement of the particle size beyond the starting voltage of the insulating gas. This is also true for rough surfaces with microscopic protrusions: the local field enhancement at these protrusions can initiate a partial discharge event. This is effectively avoided by smoothing the surface of the substrate by the method according to the invention. Thus, the conductive component can withstand an electric field that exceeds the breakdown field of the uncoated insulation system without dielectric failure. In other words, the breakdown limit of the coated contacts is increased.

In particular with respect to this second aspect, the protective layer is preferably painted. In this connection, Powder lacquers, in particular on epoxy binders, such as "RELEST Powder lacquers EP PROTECT grey/grau S/M", or water-based lacquers, in particular on epoxy binders, such as "SEEVENAX-Schutzlack 312-55", may be used.

If a relatively thick coating, in particular in the range of 1mm to 10mm in thickness, is to be applied to the substrate, the material of the coating is preferably selected from the group consisting of polytetrafluoroethylene, polyimide, polyethylene, polypropylene, polystyrene, polycarbonate, polymethyl methacrylate, polysulfone, polyetherimide, polyetheretherketone, parylene N^TM、Nuflon^TMSilicone, epoxy, and combinations thereof.

If a relatively thin coating, in particular in the thickness range of 60 μm (micrometer) to 100 μm (micrometer), is to be applied on the substrate, the material of the coating is preferably selected from the group consisting of polytetrafluoroethylene, polyimide, polyethylene, polypropylene, polystyrene, parylene N^TM(i.e., aromatic polymers), Nuflon^TM(i.e., fluorinated polymers), polyamides, ethylene-chlorotrifluoroethylene copolymers, more particularly HALAR^TMAnd HAAR^TMC and combinations thereof.

The invention is further illustrated by the accompanying drawings, in which

FIG. 1 is a schematic representation of a cross-section of a region near the surface of a solid component according to the present invention;

figure 2 relates to the volume concentration of heptafluoropropane, a decomposition product in an insulating fluid containing an organofluorine compound, after subjecting the insulating fluid to various solid components at 100 ℃ for 1 month under wet or dry conditions; and

figure 3 relates to the volume concentration of the decomposition product hexafluoropropylene in an insulation fluid containing an organofluorine compound after subjecting the insulation fluid to various solid components for 1 month at 100 ℃ under wet or dry conditions.

In the device or electrical device according to the invention, the solid component 2 shown in fig. 1 is arranged in such a way that it is directly exposed to the insulating fluid 3 contained in the insulating space 4 of the device. In the embodiment shown, the insulating fluid 3 is, for example, an insulating gas 31. It may also be a liquid.

The solid component 2 comprises a base body 5 made of a first material. In particular, the material may be well defined, for example for SF₆Any material of the insulating means, such as polyamide. In the particular case shown in fig. 1, the first material is an insulator.

In the embodiment shown, the solid component 2 has a first side 6 exposed to the insulating fluid and a second side (not shown) remote from the first side and not exposed to the insulating fluid 31.

On the side 8 of the base body 5 facing the first side 6 of the solid component 2, a protective layer 10 is applied, which is made of a second material different from the first material. Thus, on the side facing away from the substrate 5, the surface of the protective layer 10 is directly exposed to the insulating fluid.

In the embodiment shown, the protective layer 10 is applied directly on the substrate 5, which means that no intermediate layer is formed between said substrate 5 and the protective layer 10. However, it is also conceivable to provide intermediate layers, such as adhesion promoters and/or primers, between the substrate 5 and the protective layer 10. In this case, the protective layer is applied indirectly to the substrate 5.

The second material comprises or consists of a polymeric material selected from: an epoxy resin; polyolefins, in particular hydrogenated polyolefins or fluorinated polyolefins, more particularly polytetrafluoroethylene; a polyurethane; and mixtures thereof.

In an embodiment, the protective layer 10 is made of a dielectric material. In a further embodiment, the protective layer 10 is a coating, lacquer, paint or a combination thereof applied on the substrate 5.

By preventing the matrix 5 from being in direct contact with the insulating fluid, said protective layer 10 shields the first material from reacting with the organofluorine compound or any other component of the insulating fluid, such as degradation products of the organofluorine compound. The integrity of both the insulating fluid and the solid component can thus be ensured.

Among the various polymeric materials mentioned above, epoxy resins are highly preferred, as shown in fig. 2 and 3. According to fig. 2 and 3, the exposure of different epoxy resin grades to an insulating fluid containing an organofluorine compound results in most cases in the production of hardly any of the various decomposition products heptafluoropropane and hexafluoropropene. In specific cases, a mixture of C5K and process air (80% N)₂And 20% CO₂) A combination was used as the carrier gas, where the ratio of C5K to carrier gas varied with the application temperature, the ratio being chosen to have the maximum partial pressure of C5K, but to avoid condensation in the device.

Heptafluoropropane and hexafluoropropylene are the major decomposition products of the organofluorine compounds used and can therefore be used as indicators of the compatibility of the material of the solid component with the insulating fluid. The highest concentration of these decomposition products has been determined for epoxy grades 4A-PG-04N and 4A-PG-04D. However, the concentrations determined for this scale are still far lower than for the development of SF₆Conventional sealing and thermoplastic materials of the insulation means (both containing basic fillers and additives, such as MgO, CaO, NaO, amines and phenols): although these seals and thermoplastics produce a concentration of heptafluoropropane of greater than 4% after exposure to an insulating fluid containing an organofluorine compound, epoxy grade 4A-PG-04 produces a concentration of only about 1.8%.

As described above, the protective layer according to the present invention has a thickness of at least 50 μm. It has been found that with a protective layer of this thickness, gas permeation, in particular of organofluorine compounds, is negligible. Thus, the protective layer prevents the penetration of the organofluorine compound into the first material that is potentially reactive with the organofluorine compound. This is of great importance not only for dielectric insulation fluids, which maintain their function for an extended period of time since the organofluorine compounds are not subjected to degradation reactions. Also, the solid component made of dielectric insulation material or its matrix retains its insulating function for an extended period of time, since it is not chemically attacked by the dielectric insulation fluid.

For example, the commonly observed problem of polyamide components becoming extremely brittle upon exposure to fluoroketones, which themselves degrade upon such exposure, can be avoided. The solid polyamide component according to the invention covered with a protective layer is less prone to damage under mechanical stress and the dielectric properties of the insulating fluid are maintained for an extended period of time compared to an unprotected polyamide component.

The same applies to solid components comprising or consisting of polyamide or polyamide composites or matrices thereof, to solid components or matrices thereof containing alkali metal or alkaline earth metal cations, for example to fibre-reinforced composites and/or elastomers, for example containing MgO or CaO as filler, since these materials tend to undergo nucleophilic substitution of ketone moieties, for example fluoroketones, or nitrile moieties of fluoronitriles, without the protective layer according to the invention.

Also as noted above, the second material has a lower reactivity to the organofluorine compound than the first material under operating conditions of the device. In particular, the term "reactive" is used in the context of the present invention to refer to the ability or tendency of a material to attack an organofluorine compound or any degradation product, in particular its functional group, more particularly the ketone moiety when the organofluorine compound is or comprises a fluoroketone or the nitrile moiety when the organofluorine compound is or comprises a fluoronitrile, under operating conditions. Accordingly, the term "inert" or "inertness" means that the tendency of a material to chemically attack an organofluorine compound or any degradation product thereof under operating conditions is absent or negligible.

In the particular case where the material of the protective layer is at least approximately inert to the insulating fluid under the operating conditions of the device, said protective layer has the dual function of firstly withdrawing the reactive groups from the surface of the solid component or its substrate directly exposed to the insulating fluid, and secondly of preventing the organofluorine compound from reacting with the first material, which reaction may occur in the event of permeation of the organofluorine compound through the layer.

For example, a suitable protective layer is cured by an epoxy system that includes a multifunctional epoxy resin, a hardener, and an accelerator. In an even more specific aspect, a cured epoxy system comprising Araldite CY179 (as a polyfunctional epoxy resin), Aradur 917 (as a hardener), and Accelerator DY 070 (all available from Huntsman) may be used.

As also mentioned above, the first material, i.e. the material of the solid component or of the matrix of the at least one solid component, comprises or consists of a material selected from the group consisting of: a polymeric material; a ceramic; composite materials, in particular insulating composite materials; and mixtures or combinations thereof. In other words, the first material is a dielectric insulating material. The present invention is thus clearly distinguished from the teaching of WO2014/037566, according to which a solid dielectric layer is applied on an electrical conductor or electrode. Thus, the technical problem that the teachings of WO2014/037566 attempt to solve is also quite different, namely providing a hybrid dielectric insulation.

As further mentioned above, the polymeric material of the protective layer, in particular the epoxy resin, has a glass transition temperature (Tg) higher than 100 ℃. However, when the solid component is a seal, a material having a lower Tg may be preferred, since a relatively lower Tg flexible material is generally preferred for sealing.

According to an embodiment of the invention, the density of the second material is higher than 120 kg/m³Preferably higher than 150 kg/m³More preferably higher than 170 kg/m³Most preferably higher than 220 kg/m³. According to this embodiment, the density is thus higher than that of an insulating foam, for example to be used in a cable, in particular a low loss foam as disclosed in WO 2004/094526. In fact, in order to prevent the reaction of the organofluorine compound contained in the dielectric insulating fluid and thus also to provide a low gas permeation into the first material of the substrate, the protective layer according to the invention differs significantly from the foam of WO2004/094526 not only in its density but also in its function, the foam of WO2004/094526 also not being exposed to the insulating fluid containing the organofluorine compound.

Furthermore, the protective layer of the invention clearly distinguishes itself from any self-supporting component which is not applied to the substrate, for example the cover according to WO2014/037395, which protects the gas opening the cavity of the measurement chamber from particle contamination.

All embodiments disclosed for the device and the corresponding claims apply also for the solid component of the device and vice versa throughout the present application. Furthermore, all method or use embodiments also apply to the device and the solid component, and vice versa.

List of reference numerals

Claims

1. Device for generating, transmitting, distributing and/or using electrical energy, comprising a housing enclosing an insulating space (4) and an electrically conductive part arranged in the insulating space (4), said insulation space (4) containing a dielectric insulation fluid (3, 31) comprising an organofluorine compound, at least one solid component (2) of the device being directly exposed to the insulation fluid (3, 31), the solid component (2) comprises any part or portion of the housing wall that contacts the insulating fluid, wherein the at least one solid component (2) directly exposed to the insulating fluid (3, 31) comprises a base body (5) made of a first material and a protective layer (10) made of a second material different from the first material, the protective layer (10) is applied directly or indirectly on the substrate (5) and has a thickness of at least 50 [ mu ] m.，Wherein the organofluorine compound is selected from the group consisting of fluoroethers, fluoroketones, fluoroolefins, fluoronitriles and mixtures thereof, and

wherein the first material is an insulating material and is comprised of a material selected from the group consisting of: polymeric materials, ceramics, composites, and mixtures or combinations thereof,

and wherein the second material comprises a polymeric material selected from the group consisting of: epoxy resins, polyurethanes, and mixtures thereof.

2. Device for generating, transmitting, distributing and/or using electrical energy, comprising a housing enclosing an insulating space (4) and arranged in the insulating space (4)The insulation space (4) containing a dielectric insulation fluid (3, 31) comprising an organofluorine compound, at least one solid component (2) of the device being directly exposed to the insulation fluid (3, 31), the solid component (2) comprising any part or portion of the housing wall that is in contact with the insulation fluid, wherein the at least one solid component (2) that is directly exposed to the insulation fluid (3, 31) comprises a base body (5) made of a first material and a protective layer (10) made of a second material different from the first material, the protective layer (10) being applied directly or indirectly on the base body (5)，Wherein the organofluorine compound is selected from the group consisting of fluoroethers, fluoroketones, fluoroolefins, fluoronitriles and mixtures thereof, and

and wherein the second material comprises a polymeric material selected from the group consisting of: polyimide, polypropylene, polystyrene, polycarbonate, polymethylmethacrylate, polysulfone, polyetherimide, polyetheretherketone, aromatic hydrocarbon polymers, fluorinated polymers, silicone, and combinations thereof, and the protective layer (10) has a thickness of 1mm to 10 mm.

3. Device for generating, transmitting, distributing and/or using electrical energy, comprising a housing enclosing an insulating space (4) and an electrically conductive part arranged in the insulating space (4), the insulating space (4) containing a dielectric insulating fluid (3, 31) comprising an organofluorine compound, at least one solid component (2) of the device being directly exposed to the insulating fluid (3, 31), the solid component (2) comprising any part or portion of the housing wall that is in contact with the insulating fluid, wherein the at least one solid component (2) directly exposed to the insulating fluid (3, 31) comprises a base body (5) made of a first material and a protective layer (10) made of a second material different from the first material, the protective layer (10) being applied directly or indirectly on the base body (5)，Wherein the organofluorine compound is selected from the group consisting of fluoroethers, fluoroketones, fluoroolefins, fluoronitriles and mixtures thereof, and

and wherein the second material comprises a polymeric material selected from the group consisting of: polyimide, polypropylene, polystyrene, aromatic hydrocarbon polymer, fluorinated polymer, polyamide, ethylene-chlorotrifluoroethylene copolymer, and combinations thereof, and the protective layer (10) has a thickness of 60 [ mu ] m to 100 [ mu ] m.

4. The device according to claim 1, wherein the protective layer (10) has a thickness of at least 100 μm.

5. The device according to claim 1, wherein the protective layer (10) has a thickness of at least 200 μm.

6. The device according to claim 1, wherein the protective layer (10) has a thickness of at least 300 μm.

7. The device according to claim 1, wherein the protective layer (10) has a thickness of at least 500 μm.

8. The device according to claim 1, wherein the protective layer (10) has a thickness of 50 μm-100 mm.

9. The device according to claim 1, wherein the protective layer (10) has a thickness of 200 μm-50 mm.

10. The device according to claim 1, wherein the protective layer (10) has a thickness of 300 μm-10 mm.

11. The device according to claim 1, wherein the protective layer (10) has a thickness of 500 μm-5 mm.

12. Device according to claim 1, wherein the polymeric material of the protective layer (10) has a glass transition temperature higher than 100 ℃ and/or wherein the polymeric material of the protective layer (10) has a cross-linking density of 50% -100%.

13. A device according to claim 12, wherein the polymeric material of the protective layer (10) is an epoxy resin.

14. Device according to claim 1, wherein the protective layer (10) is in the form of a lacquer.

15. Device according to claim 14, wherein the protective layer (10) is in the form of a powder paint or a water-based paint.

16. Device according to claim 14, wherein the protective layer (10) is in the form of a powder paint on an epoxy base or in the form of a water-based paint on an epoxy base.

17. The device according to claim 1, wherein the solid component (2) has a first side (6) facing the insulating fluid (3, 31) and a second side facing away from the first side (6) and not facing the insulating fluid (3, 31), the protective layer (10) being applied on a side (8) of the substrate (5) facing the first side (6) of the solid component (2).

18. A device according to claim 1, wherein the surface of the protective layer (10) is directly exposed to the insulating fluid (3, 31) on the side (12) remote from the substrate (5).

19. The device according to claim 1, wherein the second material has a lower reactivity for the organofluorine compound than the first material under operating conditions of the device.

20. The device according to claim 1, wherein the second material is non-reactive to the organofluorine compound or any degradation product thereof under operating conditions of the device; and/or the protective layer is used to protect the substrate (5) from reaction with the insulating fluid.

21. A device according to claim 1, wherein the second material is of such a composition that it remains unchanged during exposure to the insulating fluid (3, 31) for more than 1 year under the operating conditions of the device.

22. The device according to claim 1, wherein the protective layer (10) forms a non self-supporting structure.

23. The device according to claim 1, wherein the organofluorine compound is selected from the group consisting of: hydrofluoroethers, perfluoroethers, perfluoroketones, hydrofluoroolefins, perfluoronitriles, and mixtures thereof.

24. The apparatus according to claim 1, wherein said organofluorine compound is a hydrofluoro monoether.

25. Device according to claim 1, wherein the insulating fluid (3, 31) comprises a fluoroketone containing 4-12 carbon atoms or a mixture thereof.

26. The device according to claim 25, wherein the insulating fluid (3, 31) comprises a fluoroketone comprising 5 carbon atoms or 6 carbon atoms.

27. The device according to claim 1, wherein said insulating fluid (3, 31) comprises a hydrofluoro monoether containing at least 3 carbon atoms.

28. The device according to claim 1, wherein the insulating fluid (3, 31) comprises air.

29. Device according to claim 1, wherein the insulating fluid (3, 31) comprises at least one air component selected from oxygen (O)₂) Nitrogen (N)₂) Carbon dioxide (CO)₂) And mixtures thereof.

30. Device according to claim 1, wherein the insulating fluid (3, 31) comprises a di-oxideCarbon (CO)₂)。

31. The device according to claim 1, wherein the insulating fluid (3, 31) comprises carbon dioxide (CO) mixed with oxygen₂)。

32. The device according to claim 30, wherein the insulating fluid (3, 31) comprises carbon dioxide and oxygen and the ratio of the amount of carbon dioxide to the amount of oxygen is between 50:50 and 100: 1.

33. The device according to claim 30, wherein the insulating fluid (3, 31) comprises carbon dioxide and oxygen and the ratio of the amount of carbon dioxide to the amount of oxygen is between 80:20 and 95: 5.

34. The device according to claim 30, wherein the insulating fluid (3, 31) comprises carbon dioxide and oxygen, and the ratio of the amount of carbon dioxide to the amount of oxygen is from 85:15 to 92: 8.

35. The device according to claim 30, wherein the insulating fluid (3, 31) comprises carbon dioxide and oxygen and the ratio of the amount of carbon dioxide to the amount of oxygen is 87:13 to below 90: 10.

36. The device according to claim 30, wherein the insulating fluid (3, 31) comprises carbon dioxide and oxygen, and the ratio of the amount of carbon dioxide to the amount of oxygen is 89: 11.

37. The device of claim 1, wherein the device is a high pressure device.

38. The device according to claim 1, wherein the device is a medium voltage device.

39. The device of claim 1, wherein the device is a low pressure device.

40. The device of claim 1, wherein the device is a direct current device.

41. The apparatus of claim 1, wherein the apparatus is a switchgear.

42. The device of claim 1, wherein the device is a bus bar.

43. The device of claim 1, wherein the device is a bushing.

44. The device according to claim 1, wherein the device is a gas insulated cable.

45. The device of claim 1, wherein the device is a cable connector.

46. The apparatus of claim 1, wherein the apparatus is a current transformer.

47. The apparatus of claim 1, wherein the apparatus is a voltage transformer.

48. The device of claim 1, wherein the device is a sensor.

49. The device of claim 1, wherein the device is a surge arrester.

50. The device of claim 1, wherein the device is a capacitor.

51. The device of claim 1, wherein the device is an inductor.

52. The device of claim 1, wherein the device is a resistor.

53. The device of claim 1, wherein the device is a flow restrictor.

54. The device of claim 1, wherein the device is a circuit breaker.

55. The apparatus of claim 1, wherein the apparatus is a ring main unit.

56. The apparatus of claim 1, wherein the apparatus is a tap changer.

57. The device of claim 1, wherein the device is a transformer bushing.

58. The device of claim 1, wherein the device is a rotating electrical machine.

59. The device of claim 1, wherein the device is a power converter.

60. The device of claim 1, wherein the device is a transformer.

61. The device of claim 1, wherein the device is an automatic switch.

62. The device of claim 1, wherein the device is a sectionalizer.

63. The device of claim 1, wherein the device is a gas-insulated device.

64. The apparatus of claim 1, wherein the apparatus is a gas insulated metal encapsulated switchgear (GIS).

65. The device of claim 1, wherein the device is a humidity sensor.

66. The device of claim 1, wherein the device is a high voltage switch.

67. The device of claim 1, wherein the device is an earthing switch.

68. The device of claim 1, wherein the device is a disconnector.

69. The device of claim 1, wherein the device is a load disconnect switch.

70. The device of claim 1, wherein the device is a generator circuit breaker.

71. The device of claim 1, wherein the device is a medium voltage switch.

72. The device of claim 1, wherein the device is a low voltage switch.

73. The device according to claim 1, wherein the device is any type of gas-insulated switch.

74. The device of claim 1, wherein the device is a power transformer.

75. The device of claim 1, wherein the device is a driver.

76. The apparatus of claim 1, wherein the apparatus is a combined isolation switch and grounding switch.

77. The apparatus of claim 1, wherein the apparatus is an air insulated switchgear.

78. The device of claim 1, wherein the device is a generator or an engine.

79. The device of claim 1, wherein the device is a gas circuit breaker.

80. The apparatus of claim 1, wherein the apparatus is a gas insulated vacuum interrupter.

81. A solid component (2) for an apparatus according to claim 1, wherein at least a part of a surface of the solid component (2) is to be directly exposed to an insulation fluid (3, 31) comprising an organofluorine compound, the solid component (2) comprising any part or portion of a housing wall that is in contact with the insulation fluid, the solid component (2) containing a substrate (5) made of a first material and a protective layer (10) made of a second material and applied directly or indirectly on the substrate (5), the second material being different from the first material, and the protective layer (10) having a thickness of at least 50 μm, wherein the organofluorine compound is selected from the group consisting of fluoroethers, fluoroketones, fluoroolefins, fluoronitriles and mixtures thereof, and

82. Solid component (2) for an apparatus according to claim 2, wherein at least part of the surface of the solid component (2) is to be directly exposed to an insulation fluid (3, 31) comprising an organofluorine compound, the solid component (2) comprising any part or portion of a housing wall that is in contact with the insulation fluid, the solid component (2) containing a substrate (5) made of a first material and a protective layer (10) made of a second material and applied directly or indirectly on the substrate (5), the second material being different from the first material, wherein the organofluorine compound is selected from the group consisting of fluoroethers, fluoroketones, fluoroolefins, fluoronitriles and mixtures thereof, and

83. A solid component (2) for an apparatus according to claim 3, wherein at least part of the surface of the solid component (2) is to be directly exposed to an insulation fluid (3, 31) comprising an organofluorine compound, the solid component (2) comprising any part or portion of a housing wall that is in contact with the insulation fluid, the solid component (2) containing a substrate (5) made of a first material and a protective layer (10) made of a second material and applied directly or indirectly on the substrate (5), the second material being different from the first material, wherein the organofluorine compound is selected from the group consisting of fluoroethers, fluoroketones, fluoroolefins, fluoronitriles and mixtures thereof, and

84. The solid assembly (2) according to claim 81, wherein the protective layer (10) has a thickness of at least 100 μm.

85. The solid assembly (2) according to claim 81, wherein the protective layer (10) has a thickness of at least 200 μm.

86. The solid assembly (2) according to claim 81, wherein the protective layer (10) has a thickness of at least 300 μm.

87. The solid assembly (2) according to claim 81, wherein the protective layer (10) has a thickness of at least 500 μm.

88. The solid assembly (2) according to claim 81, wherein the protective layer (10) has a thickness of 50 μm-100 mm.

89. The solid assembly (2) according to claim 81, wherein the protective layer (10) has a thickness of 200 μm-50 mm.

90. The solid assembly (2) according to claim 81, wherein the protective layer (10) has a thickness of 300 μm-10 mm.

91. The solid assembly (2) according to claim 81, wherein the protective layer (10) has a thickness of between 500 μm and 5 mm.

92. Solid component (2) according to claim 81, wherein the polymeric material of the protective layer (10) has a glass transition temperature higher than 100 ℃.

93. The solid component (2) according to claim 92, wherein the polymeric material of the protective layer (10) is an epoxy resin.

94. A solid component (2) according to claim 81, wherein the polymeric material of the protective layer (10) has a cross-linking density of 50% to 100%.

95. The solid component (2) according to claim 94, wherein the polymeric material of the protective layer (10) is an epoxy resin.

96. The solid component (2) according to claim 81, wherein the protective layer (10) is applied indirectly on the base body (5) and a reinforcing layer is provided between the base body (5) and the protective layer (10).

97. The solid component (2) according to claim 96, wherein said reinforcement layer comprises polyester.

98. The solid component (2) according to claim 81, wherein said protective layer (10) is made of a dielectric material.

99. The solid component (2) according to claim 81, wherein the protective layer (10) is a coating applied on the substrate (5).

100. The solid component (2) according to claim 81, wherein said protective layer (10) forms a non self-supporting structure.

101. Solid component (2) according to claim 81, wherein the solid component (2) or its matrix (5) is a solid insulator or a column insulator or a chamber insulator or a GIS insulator.

102. Solid component (2) according to claim 81, wherein the solid component (2) or its matrix (5) is arranged in a medium-voltage GIS or a high-voltage GIS.

103. A solid state component (2) according to claim 81, wherein said solid state component (2) or substrate (5) thereof is a sealed component.

104. Method for preventing a reaction of at least one solid component (2) of a device for the generation, transmission, distribution and/or use of electrical energy according to any of the preceding claims 1 to 80 or a solid component for such a device according to any of the claims 81 to 103, the device comprising a housing enclosing an insulating space (4) and an electrically conductive part arranged in the insulating space (4), the insulating space (4) containing a dielectric insulating fluid (3, 31) comprising an organofluorine compound, the at least one solid component (2) of the device being directly exposed to the insulating fluid (3, 31), the solid component (2) comprising any part or portion of the housing wall that is in contact with the insulating fluid, the method comprising the steps of:

a) providing a base body (5) of the at least one solid component (2), the base body (5) being made of a first material, and

b) applying a protective layer (10) made of a second material to the surface of the substrate (5),

105. A method according to claim 104, wherein the material of the protective layer (10) is non-reactive with respect to the insulating fluid (3, 31) under the operating conditions of the device.

106. Use of a polymeric material in a device for the generation, transmission, distribution and/or use of electrical energy according to claim 1 or in a solid component for such a device according to claim 81, said polymeric material being selected from: epoxy resins, polyurethanes and mixtures thereof, for the protective layer (10) to prevent reactions between organofluorine compounds and solid components (2) reactive towards organofluorine compounds.

107. Method for enhancing the dielectric properties of an electrical device for the generation, transmission, distribution and/or use of electrical energy according to any of the preceding claims 1 to 80 or in a solid component for such a device according to any of the claims 81 to 103, the device comprising a housing enclosing an insulating space (4) and an electrically conductive part arranged in the insulating space (4), the insulating space (4) containing a dielectric insulating fluid (3, 31) comprising an organofluorine compound, at least one solid component (2) of the device being directly exposed to the insulating fluid (3, 31), the solid component (2) comprising any part or portion of the housing wall that is in contact with the insulating fluid, the method comprising the steps of:

A) providing a base body (5) of the at least one solid component (2), and

B) applying a protective layer (10) on the surface of the substrate (5),

wherein the surface of the protective layer (10) applied in step B) is smoother than the surface of the substrate (5) of step A).