CN107209612A - The adjusting process and calibration apparatus of capacitance touch module - Google Patents
The adjusting process and calibration apparatus of capacitance touch module Download PDFInfo
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- CN107209612A CN107209612A CN201580073626.8A CN201580073626A CN107209612A CN 107209612 A CN107209612 A CN 107209612A CN 201580073626 A CN201580073626 A CN 201580073626A CN 107209612 A CN107209612 A CN 107209612A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
Abstract
The calibration apparatus (100) and adjusting process of a kind of capacitance touch module (200).First, control touching device (110) touches the presumptive test point (80) of the capacitance touch module (200) to obtain the output numerical value (S1) of the process chip (220) of the capacitance touch module (200).Then, compare the output numerical value with standard figures to obtain difference value (S2).Finally, the sensitivity (S3) of the judgement activation threshold value or the sensor (210) of the presumptive test point (80) of the capacitance touch module (200) is adjusted according to the difference value.Above-mentioned adjusting process adjustment is quick, accurate, and easily realizes automation adjustment.
Description
The present invention relates to capacitance touch mould group, in particular to a kind of the adjusting process and calibration apparatus of capacitance touch mould group.
The capacitance touch mould group used on the control panels such as some household electrical appliance at present includes multiple capacitance sensors and the processing chip connecting with capacitance sensor, multiple capacitance sensors form multiple touch points, processing chip exports corresponding numerical value when touching each touch point, therefore can detect touch operation according to the numerical value of processing chip output.
However, being limited to production technology, even touching identical touch point, the numerical value of two processing chip outputs may also be different, it is therefore desirable to adjustment with series-produced two capacitance touch mould group.
Summary of the invention
The present invention is directed at least solve one of the technical problems existing in the prior art.
The main purpose of the present invention is to provide a kind of adjusting process of capacitance touch mould group, the adjusting process includes:
Rate-determining steps, control touching device touch the presumptive test point of the capacitance touch mould group to obtain the output numerical value of the processing chip of the capacitance touch mould group；
Comparison step, the output numerical value and standard figures are to obtain difference value；And
Set-up procedure adjusts the sensitivity for determining activation threshold value or corresponding sensor of the presumptive test point of the capacitance touch mould group according to the difference value.
In some embodiments, the presumptive test point includes multiple；
The capacitance touch mould group includes multiple sensors；
The numerical value of the output of corresponding each presumptive test point is determined by the sensor of the sensor or surrounding below the presumptive test point.
In some embodiments, each sensor corresponds to multiple output numerical values and multiple difference values；The set-up procedure includes:
Sub-step is adjusted, the sensor is adjusted according to the multiple difference value corresponding with the sensor.
In some embodiments, the adjustment sub-step includes:
A first adjustment sub-step, the corresponding difference value of more each sensor, and adjust the maximum sensor of the difference value；And
Repeat described a first adjustment sub-step.
In some embodiments, the sensor includes multiple parameters；The adjustment sub-step includes:
The second adjustment sub-step, compare the difference value and discrepancy threshold, and the multiple parameter of the sensor corresponding with the difference value is adjusted when the absolute value of the difference value is greater than the discrepancy threshold, or a parameter of the sensor corresponding with the difference value is finely tuned when the absolute value of the difference value is less than or equal to the discrepancy threshold.
In some embodiments, the sensor includes capacitor；The rate-determining steps include:
Sub-step is controlled, control touching device touches the presumptive test point of the capacitance touch mould group to obtain capacitance variations value；And
Sub-step is calculated, the output numerical value is calculated according to the capacitance variations value.
In some embodiments, the adjusting process includes:
The rate-determining steps are repeated to obtain output numerical value described in multiple groups；And
The higher difference value of reliability is obtained according to output numerical value described in the multiple groups.
The calibration apparatus of embodiment of the present invention is used for adjustment capacitance touch mould group, which is characterized in that the capacitance touch mould group includes processing chip and sensor；The calibration apparatus includes:
Touching device；
Control module touches the presumptive test point of the capacitance touch mould group for controlling the touching device to obtain the output numerical value of the processing chip；
Processing module, for the output numerical value and standard figures to obtain difference value；And
The adjustment module being connect with the processing module, the sensitivity for determining activation threshold value or the sensor of the presumptive test point for adjusting the capacitance touch mould group according to the difference value.
In some embodiments, the presumptive test point includes multiple；
The capacitance touch mould group includes multiple sensors；The output numerical value of corresponding each presumptive test point is determined by the sensor of the sensor or surrounding below the presumptive test point.
In some embodiments, each sensor corresponds to multiple output numerical values and multiple difference values；The adjustment module is used to adjust the sensor according to the multiple difference value corresponding with the sensor.
In some embodiments, the processing module is used for the corresponding difference value of more each sensor to obtain maximum different value；
The adjustment module is for adjusting the corresponding sensor of the maximum different value.
In some embodiments, the sensor includes multiple parameters；
The processing module is used for the difference value and discrepancy threshold；
The adjustment module is used for the multiple parameter of the adjustment sensor corresponding with the difference value when the absolute value of the difference value is greater than the discrepancy threshold；
The adjustment module is also used to a parameter of the fine tuning sensor corresponding with the difference value when the absolute value of the difference value is less than or equal to the discrepancy threshold.
In some embodiments, the sensor includes capacitor；
The control module touches the presumptive test point of the capacitance touch mould group for controlling touching device to obtain capacitance variations value；
The calibration apparatus further includes processing module, and the processing module is used to calculate the output numerical value according to the capacitance variations value.
In some embodiments, the control module is used to control the touching device and repeats to touch the presumptive test point of the capacitance touch mould group to obtain output numerical value described in multiple groups；
The processing module obtains the higher difference value of reliability for the output numerical value according to the multiple groups.
Using the adjusting process and calibration apparatus of embodiment of the present invention, adjustment quickly, accurately, and easily realizes automation adjustment.
Additional aspect and advantage of the invention will be set forth in part in the description, and partially will become apparent from the description below, or practice through the invention is recognized.
Above-mentioned and/or additional aspect and advantage of the invention will be apparent and be readily appreciated that in the description from combination following accompanying drawings to embodiment, in which:
Fig. 1 is the flow diagram of the adjusting process of embodiment of the present invention.
Fig. 2 is the functional block diagram of the calibration apparatus of embodiment of the present invention.
Fig. 3 is the schematic diagram of the capacitance touch mould group of embodiment of the present invention.
Fig. 4 is the schematic diagram of another capacitance touch mould group of embodiment of the present invention.
Fig. 5 is the schematic side view of the capacitance touch mould group of embodiment of the present invention.
Fig. 6 is the capacitance touch mould group of embodiment of the present invention and the schematic side view of touching device.
Fig. 7 is the comparison schematic diagram of presumptive test the point corresponding output numerical value and standard figures of the capacitance touch mould group of embodiment of the present invention.
Fig. 8 is the schematic diagram of the corresponding difference value of presumptive test point of the capacitance touch mould group of embodiment of the present invention.
Fig. 9 is the flow diagram of the adjustment sub-step of the adjusting process of embodiment of the present invention.
Figure 10 is the flow diagram of the adjustment sub-step of the adjusting process of embodiment of the present invention.
Figure 11 is the flow diagram of the rate-determining steps of the adjusting process of embodiment of the present invention.
Figure 12 is the flow diagram of the adjusting process of embodiment of the present invention.
The embodiment of embodiments of the present invention is described below in detail, the example of the embodiment is shown in the accompanying drawings,
In which the same or similar labels are throughly indicated same or similar element or elements with the same or similar functions.
Fig. 1~2 are please referred to, the adjusting process of embodiment of the present invention can be realized by the calibration apparatus 100 of embodiment of the present invention, and be used for adjustment capacitance touch mould group 200.
It is now widely used for the capacitance touch mould group of the high-end electronic devices such as the mobile phone or tablet computer processing chip more using the capacitance sensor of dense distribution and channel, and is applied on glass panel, can support the functions such as multiple point touching and coordinate identification.
However, there are also the capacitance touch mould group processing chips less using less, better simply capacitance sensor and channel, applied in the non-glass panel material such as flexible circuit board, circuit board and transparent conductive film, and can be applied in digital product (such as wearable device) and the input panel of household appliances.
Referring to Fig. 3, in some embodiments, capacitance touch mould group 200 is mutual capacitance type capacitance touch mould group, and including transmitting capacitance sensor Tx0 and three reception capacitance sensors Rx0, Rx1, Rx2.
Emitting capacitance sensor Tx0 includes the first ring electrode and the second ring electrode.The diameter of first ring electrode is bigger than the diameter of the second ring electrode.Three reception capacitance sensors Rx0, Rx1, Rx2 are arranged between the first ring electrode and the second ring electrode.Three reception capacitance sensors Rx0, Rx1, Rx2 all have arc pectinate texture, i.e., substantially arc-shaped and be respectively formed pectination at both ends.Three reception capacitance sensors Rx0, Rx1, Rx2 are mutually nested.
Emit mutual induction between capacitance sensor Tx0 and three reception capacitance sensors Rx0, Rx1, Rx2, therefore when touching predetermined touch point, capacitor between transmitting capacitance sensor Tx0 and three reception capacitance sensors Rx0, Rx1, Rx2 can change, and the processing chip of capacitance touch mould group is caused to export corresponding numerical value.
Referring to Fig. 4, in other embodiment, capacitance touch mould group is self-tolerant capacitance touch mould group, and including three reception capacitance sensors Rx3, Rx4, Rx5.
Reception capacitance sensor Rx3 is two and half comb electrodes, and is oppositely arranged.Receive capacitance sensor Rx4, Rx5 be arranged in receive capacitance sensor Rx3 two and half comb electrodes between, receive the both ends capacitance sensor Rx4, Rx5 in pectination and it is mutually nested and with receive two and half comb electrodes of capacitance sensor Rx3 it is mutually nested.
Please again refering to fig. 1~2, the adjusting process of embodiment of the present invention includes:
S1, control touching device 110 touch the presumptive test point of capacitance touch mould group 200 to obtain the output numerical value of the processing chip 220 of capacitance touch mould group 200；
S2, the output numerical value for comparing processing chip 220 and standard figures are to obtain difference value；And
S3 adjusts the sensitivity for determining activation threshold value or corresponding sensor 210 of the presumptive test point of capacitance touch mould group 200 according to difference value.
Referring to Fig. 2, the calibration apparatus 100 of embodiment of the present invention, is used for adjustment capacitance touch mould group 200, capacitance touch mould group 200 includes processing chip 220 and sensor 210.The calibration apparatus 100 of embodiment of the present invention includes touching device 110, control module 120, processing module 130 and adjustment module 140.
In some embodiments, step S1 can be realized by control module 120, and step S2 can be realized by processing module 130, and step S3 can be realized by adjustment module 140.That is, control module 120, which is used to control touching device 110, touches the presumptive test point of capacitance touch mould group 200 to obtain the output numerical value of processing chip 220.After touching device 110 touches presumptive test point, sensor 200 generates capacitance variations, and processing chip 220 converts capacitance variations to the numerical value of output.Processing module 130 is used to compare the numerical value that processing chip 220 exports and standard figures to obtain difference value.Adjust the sensitivity for determining activation threshold value or corresponding sensor 210 that module 140 is used to adjust the presumptive test point of capacitance touch mould group 200 according to difference value.
Presumptive test point can be the touch key-press of capacitance touch mould group 200, can export corresponding numerical value by touching corresponding presumptive test point processing chip 220 to make the electronic device (not shown) using capacitance touch mould group 200 realize corresponding function.
Illustrate the adjusting process and calibration apparatus of embodiment of the present invention by taking the capacitance touch mould group 200 of Fig. 4 as an example below, however, it is appreciated that adjusting process and calibration apparatus of the invention should not can suitably change within the spirit of the invention according to demand in embodiments discussed below.
Referring to Fig. 5, capacitance touch mould group 200 may include 90 touch screen 230 of touch screen and the sensor 210 for being set to 90 touch screen of touch screen, 230 lower section, presumptive test point 80 is located on 90 touch screen 230 of touch screen.The output numerical value and presumptive test point 80 for handling chip 220 correspond, related with the output of sensor 210 near presumptive test point 80, are numerical value obtained from the output of sensor 210 is handled 220 COMPREHENSIVE CALCULATING of chip as preset algorithm.Determine that activation threshold value can avoid erroneous judgement by adjusting presumptive test point 80, promotes the precision for determining triggering.
Such as it is 500 that design capacitance, which touches the output numerical value of the processing chip 220 of the presumptive test point 80-10 of mould group 200, original, which sets decision threshold, to be made to determine range 495~505, but the output of the processing chip 220 of the 200 presumptive test point 80-1 of certain capacitance touch mould group of actual production is 493, cause to determine misalignment, even judge by accident, make to determine range 490~505 by adjusting decision threshold, the above problem can be solved.Alternatively, with the output numerical value of change processing chip 220, the sensitivity in example as above by adjusting sensor 210 makes output numerical value become other numerical value between 500 or 495 and 505, i.e. adjustment success, it is accurate to make to determine by adjusting the sensitivity of sensor 210.
Referring to Fig. 6, touching device may include using metal bar 111, metal bar 111 includes by the ground terminal 1111 of capacity earth and the touch end 1113 for touching capacitance touch mould group 200.Touching device may also include stepper motor 113 and guide rail (not shown) etc., by driving stepper motor 113 to slide metal bar 111 can along required track.It is often moved to corresponding presumptive test point 80, processing module 130 receives and processes related data to obtain output numerical value.
Referring to Fig. 5, in some embodiments, capacitance touch mould group 200 can have multiple presumptive test points 80.In addition, capacitance touch mould group 200 may include multiple sensors 210.The output numerical value of the processing chip 220 of corresponding each presumptive test point 80 is determined by the sensor 210 of 80 lower section of presumptive test point or the sensor 210 of surrounding.Each presumptive test point 80 can correspond to one or more sensors 210.The corresponding output numerical value of each presumptive test point 80 can with one or
The sensing output of multiple sensors 210 is related.
For example, each presumptive test point 80 and associated sensor 210 are respectively as follows: in Fig. 5
Presumptive test point 80-1 --- sensor 210-1；
Presumptive test point 80-2 --- sensor 210-1；
Presumptive test point 80-3 --- sensor 210-1 and sensor 210-2；
Presumptive test point 80-4 --- sensor 210-1 and sensor 210-2；
Presumptive test point 80-5 --- sensor 210-2；
Presumptive test point 80-6 --- sensor 210-2；
Presumptive test point 80-7 --- sensor 210-2 and sensor 210-3；
Presumptive test point 80-8 --- sensor 210-2 and sensor 210-3；
Presumptive test point 80-9 --- sensor 210-3；
Presumptive test point 80-10 --- sensor 210-3；
Manpower generally will affect the sensing output of multiple sensors 210 around touch point when touching capacitance touch mould group 200, for example, the capacitance that touch will lead to multiple capacitors changes if sensor 210 uses capacitance sensor 210.Therefore, the corresponding output numerical value of each presumptive test point 80 also should export to obtain according to the sensing of one or more sensors 210 relevant to presumptive test point 80, be conducive to the precision for promoting judgement in this way.
In some embodiments, the output numerical value and multiple difference values of the corresponding multiple processing chips 220 of each sensor 210, step S3 include:
S31 adjusts sensor 210 according to multiple difference values corresponding with sensor 210.
In some embodiments, step S31 can be realized by adjustment module 140, specifically, adjustment module 140 is used to adjust sensor 210 according to multiple difference values corresponding with sensor 210.
Wherein adjustment sensor 210 can be the sensitivity of adjustment sensor 210.If being appreciated that, the corresponding output numerical value of each presumptive test point 80 can be related with multiple sensors 210, and the sensing output of each sensor 210 can also influence the corresponding output numerical value of multiple presumptive test points 80 or difference value.So multiple difference values relevant to the sensor 210 should be referred to when adjusting sensor 210.
For example, referring to Figure 7 together and Fig. 8, Fig. 7 be each presumptive test point 80 standard figures with processing chip 220 output numerical value compared with, Fig. 8 is the corresponding difference value of each presumptive test point.In Fig. 7, the corresponding difference value of presumptive test point 80-3,80-4,80-5,80-6 is larger, it is believed that is that sensor 210-2 misalignment causes, therefore adjusts sensor 210-2 with reference to the difference value of presumptive test point 80-3,80-4,80-5,80-6.
For example, each sensor 210 and the corresponding presumptive test point 80 of the difference value being affected by it are respectively as follows: in Fig. 5
Sensor 210-1 --- presumptive test point 80-1,80-2,80-3 and 80-4
Sensor 210-2 --- presumptive test point 80-3,80-4,80-5,80-6,80-7 and 80-8
Sensor 210-3 --- presumptive test point 80-7,80-8,80-9 and 80-10
That is, it can refer to the corresponding difference value of presumptive test point 80-1,80-2,80-3 and 80-4 when adjusting sensor 210-1, it can refer to presumptive test point 80-3,80-4,80-5,80-6,80-7 and 80-8 corresponding difference value when adjusting sensor 210-2, can refer to the corresponding difference value of presumptive test point 80-7,80-8,80-9 and 80-10 when adjusting sensor 210-3.
Referring to Fig. 9, in some embodiments, step S31 can further comprise:
S311, the corresponding difference value of more each sensor 210, and adjust the maximum sensor 210 of difference value；And
S312 repeats step S311.
In some embodiments, processing module 130 can be used in step S311 and adjustment module 140 is realized, i.e. processing module 130 obtains maximum different value for the corresponding difference value of more each sensor 210, and adjustment module 140 is for adjusting the corresponding sensor 210 of maximum different value.Wherein, the corresponding sensor 210 of adjustment maximum different value can be the sensitivity of adjustment sensor 210.
Each sensor 210 can correspond to the difference value of multiple presumptive test points 80, therefore, sensor 210 is a kind of comprehensive comparison compared with the correspondence difference value between sensor 210, such as, the average value of the corresponding multiple difference values of each sensor 210 can first be calculated, which sensor 210 first adjusted with judgement for average value of more each sensor 210 again.
For example, the absolute value of the average value of discovery sensor 210-2 is larger by the average value for seeking each difference value corresponding with each sensor 210, therefore first adjust sensor 210-2.Step S311 is repeated to refer to, it is every adjust one sensor 210, then compare and judge the maximum sensor 210 of corresponding difference value again and it is adjusted, by the way that the process of above-mentioned comparison and adjustment is repeated, gradually each sensor 210 is adjusted and is finished.Such benefit is to adjust all preferential biggish sensor 210 of adjustment deviation each time, so that there is no the biggish sensors 210 of deviation to exist after guaranteeing repeatedly adjustment.
Such as, please refer to Fig. 7, the maximum absolute value of the corresponding difference value of sensor 210-2, the absolute value of the corresponding difference value of sensor 210-3 takes second place, first adjust sensor 210-2, if the absolute value of the corresponding difference value of sensor 210-2 adjusts sensor 210-3 less than sensor 210-3 after the completion of adjustment.
The mode that repeats to compare in this way and adjust also helps realization automation control, and by writing program setting rule, Lai Shixian automatic implementation is above-mentioned to repeat the step of adjusting.
Referring to Fig. 10, in some embodiments, sensor 210 may include multiple parameters, such as parameter a, parameter b and parameter c.Step S31 can include:
Step S313, comparing difference value and discrepancy threshold, and the multiple parameters of sensor 210 corresponding with difference value are adjusted when the absolute value of difference value is greater than discrepancy threshold, or a parameter of sensor 210 corresponding with difference value is finely tuned when the absolute value of difference value is less than or equal to discrepancy threshold.
Step S313 can be realized by processing module 130 and adjustment module 140.Processing module 130 is used for comparing difference value and discrepancy threshold, and adjustment module 140 is used for the multiple parameters of the adjustment sensor 210 corresponding with difference value when the absolute value of difference value is greater than discrepancy threshold.Adjustment module 140 is also used to a parameter of the fine tuning sensor 210 corresponding with difference value when the absolute value of difference value is less than or equal to discrepancy threshold.
The adjustment of sensor 210 is related to the multiple parameters of sensor 210, when difference value is larger, can be adjusted to the multiple parameters of sensor 210, such as adjusts separately mono- unit of parameter a, b, c or multiple units；When difference value is smaller, can one of parameter in the multiple parameters to sensor 210 be adjusted, such as mono- unit of adjusting parameter a.
Taken into account and regulated the speed and precision in this way, multiple parameters have been adjusted so that the absolute value of the corresponding difference value of sensor 210 reduces as early as possible, it is small to a certain extent after be finely adjusted again, further promoted so as to touch the precision determined.By the way that this step is repeated, it is accurate gradually to adjust the parameter of sensor 210.
The mode for the adjustment for carrying out different number of parameters for different difference value sizes in this way also helps realization automation control, by writing program setting rule, the above-mentioned adjustment of Lai Shixian automatic implementation.By the recursive call program, it is accurate gradually to adjust the parameter of sensor 210.
Figure 11 is please referred to, in some embodiments, sensor 210 includes capacitor.
Step S1 can include:
Step S11, control touching device touch the presumptive test point 80 of capacitance touch mould group 200 to obtain capacitance variations value；And
Step S13, according to the output numerical value of capacitance variations value calculation processing chip 220.
Step S11 in present embodiment can be realized that step S13 can be realized by the processing module 130 of calibration apparatus 100 by control module 120.Control module 120 is used to control touching device and touches the presumptive test point 80 of capacitance touch mould group 200 to obtain capacitance variations value.Processing module 130 is used for the output numerical value according to capacitance variations value calculation processing chip 220.
Principle using capacitance sensor 210 is that, when finger or other earth conductors touch, the capacitance of capacitance sensor 210 can change, import input signal in the initialization circuit where capacitor, obtain the output signal comprising capacitance variations value.Output numerical value corresponding with the presumptive test point 80 can be obtained through processing 220 integrated treatment of chip in the output signal of one or more capacitor output end relevant to certain presumptive test point 80.
Figure 12 is please referred to, in some embodiments, adjusting process includes:
Step S4 repeats step S1 to obtain the output numerical value of multiple groups processing chip 220；And
Step S5 obtains the higher difference value of reliability according to the output numerical value that multiple groups handle chip 220.
Wherein step S4 can be realized that step S5 can be realized by processing module 130 by the control module 120 of the calibration apparatus 100 of embodiment of the present invention.Control module 120 is used to control touching device and repeats to touch the presumptive test point 80 of capacitance touch mould group 200 to obtain the output numerical value that multiple groups handle chip 220.The output numerical value that processing module 130 is used to handle chip 220 according to multiple groups obtains the higher difference value of reliability.
In step s 5, the output numerical value that can multiple groups be handled with chip 220 carries out integrated treatment, such as deletes and differ biggish group, or calculating average value etc. with other group of data, obtains the higher one group of difference Value Data of reliability by integrated treatment.The difference value data reliability obtained in this way is higher, can be used for adjustment.The present invention also provides a kind of capacitance touch mould group 200, the calibration apparatus 100 that embodiment of the present invention can be used carries out adjustment.
In the description of embodiments of the present invention, it will be appreciated that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", " preceding ", " rear ", " left side ", " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside", " clockwise ", the orientation or positional relationship of instructions such as " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, it is merely for convenience of description embodiments of the present invention and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, it is constructed and operated in a specific orientation, therefore it should not be understood as the limitation to embodiments of the present invention.In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicate the quantity of indicated technical characteristic." first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.In the description of embodiments of the present invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of embodiments of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, it may be a detachable connection, or be integrally connected；It can be mechanical connection, be also possible to be electrically connected or can mutually communicate；It can be directly connected, the connection inside two elements or the interaction relationship of two elements can also be can be indirectly connected through an intermediary.For the ordinary skill in the art, the concrete meaning of above-mentioned term in embodiments of the present invention can be understood as the case may be.
In embodiments of the present invention, unless otherwise clearly defined and limited, fisrt feature second feature "upper" or "lower" may include that the first and second features directly contact, may include the first and second features be not direct contact but by the other characterisation contact between them yet.Moreover, fisrt feature includes fisrt feature right above second feature and oblique upper above the second feature " above ", " above " and " above ", or first feature horizontal height is merely representative of higher than second feature.Fisrt feature includes fisrt feature right above second feature and oblique upper under the second feature " below ", " below " and " below ", or is merely representative of first feature horizontal height less than second feature.
Following disclosure provides many different embodiments or example is used to realize the different structure of embodiments of the present invention.In order to simplify the disclosure of embodiments of the present invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and is not intended to limit the present invention.In addition, embodiments of the present invention repeat reference numerals and/or reference letter, this repetition can be for purposes of simplicity and clarity, itself not indicate the relationship between discussed various embodiments and/or setting in different examples.In addition, the example of various specific techniques and material that embodiments of the present invention provide, but those of ordinary skill in the art may be aware that the application of other techniques and/or the use of other materials.
In the description of this specification, the description of reference term " embodiment ", " some embodiments ", " exemplary embodiment ", " example ", specific examples or " some examples " etc. means to be contained at least one embodiment or example of the invention in conjunction with the embodiment or example particular features, structures, materials, or characteristics described.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be combined in any suitable manner in any one or more embodiments or example.
Any process described otherwise above or method description are construed as in flow chart or herein, indicate the module, segment or the part that include the steps that one or more codes for realizing specific logical function or the executable instruction of process, and the range of the preferred embodiment of the present invention includes other realization, sequence shown or discussed can not wherein be pressed, including according to related function by it is basic simultaneously in the way of or in the opposite order, function is executed, this should understand by the embodiment of the present invention person of ordinary skill in the field.
Expression or logic and/or step described otherwise above herein in flow charts, such as, it is considered the order list of the executable instruction for realizing logic function, it may be embodied in any computer-readable medium, for instruction execution system, device or equipment (such as computer based system, including the system of processing module or other can be from instruction execution system, device or equipment instruction fetch and the system executed instruction) use, or used in conjunction with these instruction execution systems, device or equipment.For the purpose of this specification, " computer-readable medium " can be it is any may include, store, communicate, propagate, or transport program is for instruction execution system, device or equipment or the device used in conjunction with these instruction execution systems, device or equipment.The more specific example (non-exhaustive list) of computer-readable medium include the following: there is the electrical connection section (electronic device) of one or more wirings, portable computer diskette box (magnetic device), random access memory (RAM), read-only memory (ROM), erasable edit read-only storage (EPROM or flash memory), fiber device and portable optic disk read-only storage (CDROM).In addition, computer-readable medium can even is that the paper that can print described program on it or other suitable media, because can be for example by carrying out optical scanner to paper or other media, then it edited, interpreted or is handled when necessary with other suitable methods electronically to obtain described program, is then stored in computer storage.
It should be appreciated that each section of embodiments of the present invention can be realized with hardware, software, firmware or their combination.In the above-described embodiment, multiple steps or method can be executed in memory and by suitable instruction execution system with storage software or firmware is realized.Such as, if realized with hardware, in another embodiment, it may be implemented using any one or a combination of the following techniques well known in the art: there is the discrete logic for realizing the logic gates of logic function to data-signal, specific integrated circuit with suitable combinational logic gate circuit, programmable gate array (PGA), field programmable gate array (FPGA) etc..
Those skilled in the art are understood that realize that all or part of the steps of above-described embodiment method carrying is that relevant hardware can be instructed to complete by program, and the program can store in a kind of computer-readable storage medium
In matter, which when being executed, includes the steps that one or a combination set of embodiment of the method.
In addition, each functional unit in various embodiments of the present invention can integrate in a processing module, it is also possible to each unit and physically exists alone, can also be integrated in two or more units in a module.Above-mentioned integrated module both can take the form of hardware realization, can also be realized in the form of software function module.If the integrated module is realized and when sold or used as an independent product in the form of software function module, also can store in a computer readable storage medium.
Storage medium mentioned above can be read-only memory, disk or CD etc..
Although the embodiments of the present invention has been shown and described above, it can be understood that, above-described embodiment is exemplary, and is not considered as limiting the invention, and those skilled in the art can make changes, modifications, alterations, and variations to the above described embodiments within the scope of the invention.
Claims (14)
- A kind of adjusting process of capacitance touch mould group, which is characterized in that the adjusting process includes:Rate-determining steps, control touching device touch the presumptive test point of the capacitance touch mould group to obtain the output numerical value of the processing chip of the capacitance touch mould group；Comparison step, the output numerical value and standard figures are to obtain difference value；AndSet-up procedure adjusts the sensitivity for determining activation threshold value or corresponding sensor of the presumptive test point of the capacitance touch mould group according to the difference value.
- The adjusting process of capacitance touch mould group as described in claim 1, which is characterized in that the presumptive test point includes multiple；The capacitance touch mould group includes multiple sensors；The numerical value of the output of corresponding each presumptive test point is determined by the sensor of the sensor or surrounding below the presumptive test point.
- The adjusting process of capacitance touch mould group as described in claim 1, which is characterized in that each sensor corresponds to multiple output numerical values and multiple difference values；The set-up procedure includes:Sub-step is adjusted, the sensor is adjusted according to the multiple difference value corresponding with the sensor.
- The adjusting process of capacitance touch mould group as claimed in claim 3, which is characterized in that the adjustment sub-step includes:A first adjustment sub-step, the corresponding difference value of more each sensor, and adjust the maximum sensor of the difference value；AndRepeat described a first adjustment sub-step.
- The adjusting process of capacitance touch mould group as claimed in claim 3, which is characterized in that the sensor includes multiple parameters；The adjustment sub-step includes:The second adjustment sub-step, compare the difference value and discrepancy threshold, and the multiple parameter of the sensor corresponding with the difference value is adjusted when the absolute value of the difference value is greater than the discrepancy threshold, or a parameter of the sensor corresponding with the difference value is finely tuned when the absolute value of the difference value is less than or equal to the discrepancy threshold.
- The adjusting process of capacitance touch mould group as described in claim 1, which is characterized in that the sensor includes capacitor；The rate-determining steps include:Sub-step is controlled, control touching device touches the presumptive test point of the capacitance touch mould group to obtain capacitance variations value；AndSub-step is calculated, the output numerical value is calculated according to the capacitance variations value.
- The adjusting process of capacitance touch mould group as described in claim 1, which is characterized in that the adjusting process includes:The rate-determining steps are repeated to obtain output numerical value described in multiple groups；AndThe higher difference value of reliability is obtained according to output numerical value described in the multiple groups.
- A kind of calibration apparatus is used for adjustment capacitance touch mould group, which is characterized in that the capacitance touch mould group includes processing chip and sensor；The calibration apparatus includes:Touching device；Control module touches the presumptive test point of the capacitance touch mould group for controlling the touching device to obtain the output numerical value of the processing chip；Processing module, for the output numerical value and standard figures to obtain difference value；AndThe adjustment module being connect with the processing module, the sensitivity for determining activation threshold value or the sensor of the presumptive test point for adjusting the capacitance touch mould group according to the difference value.
- Calibration apparatus as claimed in claim 8, which is characterized in that the presumptive test point includes multiple；The capacitance touch mould group includes multiple sensors；The output numerical value of corresponding each presumptive test point is determined by the sensor of the sensor or surrounding below the presumptive test point.
- Calibration apparatus as claimed in claim 8, which is characterized in that each sensor corresponds to multiple output numerical values and multiple difference values；The adjustment module is used to adjust the sensor according to the multiple difference value corresponding with the sensor.
- Calibration apparatus as claimed in claim 10, which is characterized in that the processing module is used for the corresponding difference value of more each sensor to obtain maximum different value；The adjustment module is for adjusting the corresponding sensor of the maximum different value.
- Calibration apparatus as claimed in claim 10, which is characterized in that the sensor includes multiple parameters；The processing module is used for the difference value and discrepancy threshold；The adjustment module is used for adjustment and the difference value when the absolute value of the difference value is greater than the discrepancy threshold The multiple parameter of the corresponding sensor；The adjustment module is also used to a parameter of the fine tuning sensor corresponding with the difference value when the absolute value of the difference value is less than or equal to the discrepancy threshold.
- Calibration apparatus as claimed in claim 8, which is characterized in that the sensor includes capacitor；The control module touches the presumptive test point of the capacitance touch mould group for controlling touching device to obtain capacitance variations value；The calibration apparatus further includes processing module, and the processing module is used to calculate the output numerical value according to the capacitance variations value.
- Calibration apparatus as claimed in claim 8, which is characterized in that the control module is used to control the touching device and repeats to touch the presumptive test point of the capacitance touch mould group to obtain output numerical value described in multiple groups；The processing module obtains the higher difference value of reliability for the output numerical value according to the multiple groups.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/100154 WO2017113310A1 (en) | 2015-12-31 | 2015-12-31 | Adjustment method and adjustment apparatus for capacitive touch module |
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| CN107209612A true CN107209612A (en) | 2017-09-26 |
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| CN201580073626.8A Pending CN107209612A (en) | 2015-12-31 | 2015-12-31 | The adjusting process and calibration apparatus of capacitance touch module |
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| WO (1) | WO2017113310A1 (en) |
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| CN109984579B (en) * | 2017-12-29 | 2022-08-02 | 浙江绍兴苏泊尔生活电器有限公司 | Processing method and device of touch key and cooking appliance |
| CN117075758B (en) * | 2023-10-13 | 2024-01-30 | 武汉海微科技有限公司 | Method, device, equipment and storage medium for automatically adjusting screen sensitivity |
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| WO2017113310A1 (en) | 2017-07-06 |
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