CN107201184B - Composite structure heat dissipation film and manufacturing process thereof - Google Patents
Composite structure heat dissipation film and manufacturing process thereof Download PDFInfo
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- CN107201184B CN107201184B CN201710575415.5A CN201710575415A CN107201184B CN 107201184 B CN107201184 B CN 107201184B CN 201710575415 A CN201710575415 A CN 201710575415A CN 107201184 B CN107201184 B CN 107201184B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
- C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2433/00—Presence of (meth)acrylic polymer
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Abstract
The invention belongs to the field of heat dissipation films, and particularly relates to a composite structure heat dissipation film and a manufacturing process thereof. The composite structure heat dissipation film provided by the invention comprises a first release film layer, a first heat dissipation adhesive layer, a second heat dissipation adhesive layer, a third heat dissipation adhesive layer and a second release film layer which are sequentially contacted; the first heat dissipation adhesive layer is formed by curing first heat dissipation adhesive layer adhesive liquid, and the first heat dissipation adhesive layer adhesive liquid comprises organic silicon pressure sensitive adhesive and SiC; the second heat dissipation adhesive layer is formed by solidifying a second heat dissipation adhesive layer glue solution, and the second heat dissipation adhesive layer glue solution comprises acrylic resin glue and carbon fibers; the third heat dissipation adhesive layer is formed by solidifying third heat dissipation adhesive layer glue liquid, and the third heat dissipation adhesive layer glue liquid comprises acrylic resin glue water and copper-aluminum alloy powder. The heat dissipation film provided by the invention is provided with 3 heat dissipation layers with different components, and the heat dissipation film provided by the invention has a good heat dissipation effect through mutual matching of the 3 heat dissipation layers.
Description
Technical Field
The invention belongs to the field of heat dissipation films, and particularly relates to a composite structure heat dissipation film and a manufacturing process thereof.
Background
As electronic devices continue to integrate more powerful functions into smaller components, the rise in temperature can result in slower device operation, device failures during operation, size space limitations, and many other performance issues. Temperature control has become one of the most important challenges in design, namely how to effectively remove more heat generated by a larger unit of power with a compact architecture and a smaller and smaller operating space.
The heat dissipation film can solve the problems to a certain extent, but the heat dissipation performance of the existing heat dissipation film is still difficult to satisfy.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a composite structure heat dissipation film and a manufacturing process thereof.
The invention provides a composite structure heat dissipation film, which comprises a first release film layer, a first heat dissipation adhesive layer, a second heat dissipation adhesive layer, a third heat dissipation adhesive layer and a second release film layer which are contacted in sequence;
the first heat dissipation adhesive layer is formed by curing first heat dissipation adhesive layer adhesive liquid, and the first heat dissipation adhesive layer adhesive liquid comprises organic silicon pressure sensitive adhesive and SiC;
the second heat dissipation adhesive layer is formed by solidifying a second heat dissipation adhesive layer glue solution, and the second heat dissipation adhesive layer glue solution comprises acrylic resin glue and carbon fibers;
the third heat dissipation adhesive layer is formed by solidifying third heat dissipation adhesive layer glue liquid, and the third heat dissipation adhesive layer glue liquid comprises acrylic resin glue water and copper-aluminum alloy powder.
Preferably, the mass ratio of the organic silicon pressure-sensitive adhesive to the SiC is (60-80): (80-90).
Preferably, in the glue solution of the second heat dissipation glue layer, the mass ratio of the acrylic resin glue solution to the carbon fibers is (85-90): (70-90).
Preferably, in the third heat dissipation glue layer glue solution, the mass ratio of the acrylic resin glue solution to the copper-aluminum alloy powder is (85-90): (65-80).
Preferably, the diameter of the carbon fiber is 50-150 nm, and the length of the carbon fiber is 10-30 μm.
Preferably, the copper content of the copper-aluminum alloy powder is 30-50 wt%.
The invention provides a preparation method of the composite structure heat dissipation film, which comprises the following steps:
a) the glue solution of the second heat dissipation glue layer is coated and then cured to obtain a second heat dissipation glue layer;
b) coating a first heat dissipation adhesive layer glue solution on one side of the second heat dissipation adhesive layer, and curing to obtain a first heat dissipation adhesive layer; then, covering a first release film layer on the first heat dissipation glue layer;
c) coating a third heat dissipation adhesive layer glue solution on one side of the second release film layer, and curing to obtain a third heat dissipation adhesive layer;
d) and covering the other side of the second heat dissipation adhesive layer and the third heat dissipation adhesive layer to obtain the composite structure heat dissipation film.
Preferably, in the step a), the second heat dissipation glue layer glue solution is cured by an LED lamp; the power of the LED lamp is 50-300W, and the output wavelength is 360-400 nm.
Preferably, in step b), the curing manner is thermal curing; the temperature of the thermocuring is 170-200 ℃.
Preferably, in the step c), the glue solution of the third heat dissipation glue layer is cured by an LED lamp; the power of the LED lamp is 50-300W, and the output wavelength is 360-400 nm.
Compared with the prior art, the invention provides a composite structure heat dissipation film and a manufacturing process thereof. The composite structure heat dissipation film provided by the invention comprises a first release film layer, a first heat dissipation adhesive layer, a second heat dissipation adhesive layer, a third heat dissipation adhesive layer and a second release film layer which are sequentially contacted; the first heat dissipation adhesive layer is formed by curing first heat dissipation adhesive layer adhesive liquid, and the first heat dissipation adhesive layer adhesive liquid comprises organic silicon pressure sensitive adhesive and SiC; the second heat dissipation adhesive layer is formed by solidifying a second heat dissipation adhesive layer glue solution, and the second heat dissipation adhesive layer glue solution comprises acrylic resin glue and carbon fibers; the third heat dissipation adhesive layer is formed by solidifying third heat dissipation adhesive layer glue liquid, and the third heat dissipation adhesive layer glue liquid comprises acrylic resin glue water and copper-aluminum alloy powder. The heat dissipation film provided by the invention is provided with 3 heat dissipation layers with different components, and the heat dissipation film provided by the invention has a good heat dissipation effect through mutual matching of the 3 heat dissipation layers. Meanwhile, the heat dissipation film also has higher tensile strength and good viscosity. The experimental results show that: the composite structure heat dissipation film provided by the invention has a vertical heat conductivity coefficient of 8-16W/(m.K), a horizontal heat conductivity coefficient of 400-650W/(m.K), and a tensile strength of 20-28N/mm2The 180 DEG peeling force is 1500-2100 gf/25 mm.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a composite structure heat dissipation film according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a composite structure heat dissipation film, which comprises a first release film layer, a first heat dissipation adhesive layer, a second heat dissipation adhesive layer, a third heat dissipation adhesive layer and a second release film layer which are contacted in sequence;
the first heat dissipation adhesive layer is formed by curing first heat dissipation adhesive layer adhesive liquid, and the first heat dissipation adhesive layer adhesive liquid comprises organic silicon pressure sensitive adhesive and SiC;
the second heat dissipation adhesive layer is formed by solidifying a second heat dissipation adhesive layer glue solution, and the second heat dissipation adhesive layer glue solution comprises acrylic resin glue and carbon fibers;
the third heat dissipation adhesive layer is formed by solidifying third heat dissipation adhesive layer glue liquid, and the third heat dissipation adhesive layer glue liquid comprises acrylic resin glue water and copper-aluminum alloy powder.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a composite structure heat dissipation film according to an embodiment of the present invention.
The invention provides a composite structure heat dissipation film which comprises a first release film layer, a first heat dissipation adhesive layer, a second heat dissipation adhesive layer, a third heat dissipation adhesive layer and a second release film layer which are sequentially contacted. The first release film layer and the second release film layer are protection layers of the heat dissipation film, and the first heat dissipation adhesive layer, the second heat dissipation adhesive layer and the third heat dissipation adhesive layer form a use layer of the heat dissipation film.
In the invention, the material of the first release film layer is preferably polyethylene terephthalate (PET for short); the light transmittance of the first release film layer is preferably more than 92 percent; the fog of the first release film is preferably less than 1 percent, and more preferably 0; the thickness of the first release film layer is preferably 23-75 μm, and specifically can be 23 μm, 24 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm or 75 μm.
In the invention, the first heat dissipation adhesive layer is formed by curing first heat dissipation adhesive layer adhesive liquid, and the first heat dissipation adhesive layer adhesive liquid comprises organic silicon pressure sensitive adhesive and SiC. The viscosity of the organic silicon pressure-sensitive adhesive at 25 ℃ is preferably 5000-20000 C.P.S, and specifically can be 5000C.P.S, 5500C.P.S, 6000C.P.S, 6500C.P.S, 7000C.P.S, 7500C.P.S, 8000C.P.S, 8500C.P.S, 9000C.P.S, 9500C.P.S, 10000C.P.S, 10500C.P.S, 11000C.P.S, 11500C.P.S, 12000C.P.S, 12500C.P.S, 13000C.P.S, 13500C.P.S, 14000C.P.S, 14500C.P.S, 15000C.P.S, 15500C.P.S, 16000C.P.S, 16500C.P.S, 19000C.P.S, 17500C.P.S, 19500C.P.S, or 18500 C.P.S. In the invention, the mass ratio of the organic silicon pressure-sensitive adhesive to the SiC is preferably (60-80): (80-90), more preferably 70: (80-90), specifically 70: 85. in the invention, the thickness of the first heat dissipation adhesive layer is preferably 10-15 μm, and specifically may be 10 μm, 11 μm, 12 μm, 13 μm, 14 μm or 15 μm.
In the invention, the second heat dissipation adhesive layer is formed by curing a second heat dissipation adhesive layer adhesive solution, wherein the second heat dissipation adhesive layer adhesive solution comprises acrylic resin adhesive solution and carbon fibers. Wherein the acrylic resin glue comprises acrylic resin, and the acrylic resin comprises but is not limited to homopolymer polymerized by butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate or N-hydroxymethyl acrylamide, or copolymer copolymerized by several of the above. In one embodiment provided by the present invention, the acrylic resin is prepared according to the following method: butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, N-hydroxymethyl acrylamide and azobisisobutyronitrile are mixed and reacted in nitrogen atmosphere to obtain the acrylic resin. Wherein the molar ratio of the butyl acrylate, the 2-ethylhexyl acrylate, the methyl methacrylate and the N-hydroxymethyl acrylamide is preferably (5-7): (0.5-2): (3-5): (0.5-2), specifically 6:1:4: 1; the ratio of the total mass of the butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate and N-methylolacrylamide to azobisisobutyronitrile is preferably 10: (0.1 to 0.3), specifically 10: 0.2; the reaction temperature is preferably 50-60 ℃, and particularly can be 55 ℃; the reaction time is preferably 4-6 h, and specifically can be 5 h. In the invention, the acrylic resin glue also comprises a photoinitiator; the photoinitiator includes but is not limited to alkyl benzophenone initiators and/or benzophenone initiators, and specifically can be benzophenone; the mass ratio of the acrylic resin to the photoinitiator in the acrylic resin glue is preferably (85-110): (0.5 to 2), more preferably 100: 2. in the invention, the acrylic resin glue also comprises a coupling agent; the coupling agents include, but are not limited to, amino hydrocarbyl coupling agents and/or acryloxy hydrocarbyl coupling agents; the mass ratio of the acrylic resin to the coupling agent in the acrylic resin glue is preferably (85-110): (0.005 to 0.01), more preferably 100: 0.005. in the invention, the acrylic resin glue further comprises a solvent; such solvents include, but are not limited to, toluene and/or xylene; the mass ratio of the acrylic resin to the solvent in the acrylic resin glue is preferably (85-110): (40-60), more preferably 100: 50. in the present invention, the acrylic resin glue preferably further comprises a plasticizer; the plasticizer includes, but is not limited to, one or more of dicyclohexyl phthalate, dibutyl phthalate, and diisobutyl phthalate; the mass ratio of the acrylic resin to the plasticizer in the acrylic resin glue is preferably (85-110): (0.1 to 2), more preferably 100: 1.5. in the present invention, the acrylic resin glue preferably further comprises a stabilizer; the stabilizer includes but is not limited to a salicylate-based stabilizer, preferably methyl salicylate; the mass ratio of the acrylic resin to the stabilizer in the acrylic resin glue is preferably (85-110): (0.05 to 0.09), more preferably 100: 0.05. in the invention, the diameter of the carbon fiber is preferably 50-150 nm, and specifically can be 50nm, 75nm, 100nm, 125nm or 150 nm; the length of the carbon fiber is preferably 10-30 μm, and specifically can be 10 μm, 15 μm, 20 μm, 25 μm or 30 μm. In the invention, the mass ratio of the acrylic resin to the carbon fibers in the glue solution of the second heat dissipation glue layer is preferably (85-90): (70-90), specifically 85: 70. 85: 80 or 85: 90. in the invention, the thickness of the second heat dissipation glue layer is preferably 15-25 μm, and specifically can be 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm or 25 μm.
In the invention, the third heat dissipation adhesive layer is formed by solidifying a third heat dissipation adhesive layer glue solution, and the third heat dissipation adhesive layer glue solution comprises acrylic resin glue and copper-aluminum alloy powder. The composition and content of the acrylic resin glue can refer to the acrylic resin glue in the second heat dissipation glue layer glue solution described above, and are not described herein again. In the invention, the copper content of the copper-aluminum alloy powder is preferably 30-50 wt%, and specifically can be 30 wt%, 35 wt%, 40 wt%, 45 wt% or 50 wt%; the granularity of the copper-aluminum alloy powder is preferably 100-500 meshes, and specifically can be 100 meshes, 200 meshes, 300 meshes, 400 meshes or 500 meshes. In the invention, the mass optimal ratio of the acrylic resin glue to the copper-aluminum alloy powder in the third heat dissipation glue layer glue solution is (85-90): (65-80), specifically 90: 65. 90: 75 or 90: 80. in the invention, the thickness of the third heat dissipation adhesive layer is preferably 15-25 μm, and specifically may be 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm or 25 μm.
In the present invention, the second release film layer is preferably a silicone oil release film layer; the second release film layer preferably has a release force of 35-50 gf/25mm, namely belonging to a heavy release film layer; the residual adhesion rate of the second release film layer is preferably more than 90%; the haze of the second release film layer is preferably less than 1%; the light transmittance of the second release film layer is preferably more than 92%. In the invention, the thickness of the second release film layer is 75-125 μm, and specifically may be 75 μm, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm or 125 μm.
The heat dissipation film provided by the invention is provided with 3 heat dissipation layers with different components, and the heat dissipation film provided by the invention has a good heat dissipation effect through mutual matching of the 3 heat dissipation layers. Meanwhile, the heat dissipation film also has higher tensile strength and good viscosity. The experimental results show that: the vertical heat conductivity coefficient of the composite structure heat dissipation film provided by the invention is 8-16W/(m)K) horizontal thermal conductivity of 400 to 650W/(m.K) tensile strength of 20 to 28N/mm2The 180 DEG peeling force is 1500-2100 gf/25 mm.
The invention provides a preparation method of the composite structure heat dissipation film as defined in claim 1, which comprises the following steps:
a) the glue solution of the second heat dissipation glue layer is coated and then cured to obtain a second heat dissipation glue layer;
b) coating a first heat dissipation adhesive layer glue solution on one side of the second heat dissipation adhesive layer, and curing to obtain a first heat dissipation adhesive layer; then, covering a first release film layer on the first heat dissipation glue layer;
c) coating a third heat dissipation adhesive layer glue solution on one side of the second release film layer, and curing to obtain a third heat dissipation adhesive layer;
d) and covering the other side of the second heat dissipation adhesive layer and the third heat dissipation adhesive layer to obtain the composite structure heat dissipation film.
In the preparation method provided by the invention, the glue solution of the second heat dissipation glue layer is coated at first. The coating method is preferably comma blade coating or slot coating. In the invention, the second heat dissipation adhesive layer glue solution is preferably coated on a third release film, and the third release film is preferably a heavy release film with a release force of 35-50 gf/25 mm. And curing after the glue solution is uniformly coated. In the invention, the glue solution of the second heat dissipation glue layer is preferably cured by adopting an LED lamp; the LED lamp is preferably arranged above the glue solution coating surface; the power of the LED lamp is preferably 50-300W, and specifically can be 50W, 100W, 150W, 200W, 250W or 300W; the output wavelength of the LED lamp is 360-400 nm, and specifically can be 360nm, 369nm, 370nm, 380nm, 390nm or 400 nm; the time for curing the glue solution of the second heat-dissipation glue layer by using the LED lamp is not particularly limited, and the glue solution can be completely cured. And obtaining a second heat dissipation adhesive layer after the curing is finished. In the invention, preferably, the fourth release film is coated on the surface of the obtained second heat dissipation glue layer, and then the second heat dissipation glue layer is rolled. Wherein, the fourth release film layer is preferably a light release film with the release force of 5-15 gf/25 mm.
And then coating a first heat dissipation adhesive layer glue solution on one side of the second heat dissipation adhesive layer, and curing. The coating method is preferably comma blade coating or slot coating. In the present invention, the curing means is preferably thermal curing; the temperature of the thermal curing is preferably 170-200 ℃, and specifically can be 170 ℃, 180 ℃, 190 ℃ or 200 ℃; the thermal curing is preferably carried out in an oven; in the present invention, the time for the thermosetting is not particularly limited, and the adhesive solution may be completely cured. And after the curing is finished, obtaining a first heat dissipation adhesive layer, and covering a first release film layer on the first heat dissipation adhesive layer. In the present invention, it is preferable to wind the film after coating the first release film layer.
And then coating a third heat dissipation glue layer glue solution on one side of the second release film layer, and curing. The coating method is preferably comma blade coating or slot coating. In the invention, the glue solution of the third heat-dissipation glue layer is preferably cured by adopting an LED lamp; the LED lamp is preferably arranged above the glue solution coating surface; the power of the LED lamp is preferably 50-300W, and specifically can be 50W, 100W, 150W, 200W, 250W or 300W; the output wavelength of the LED lamp is 360-400 nm, and specifically can be 360nm, 369nm, 370nm, 380nm, 390nm or 400 nm; the time for curing the glue solution of the third heat-dissipation glue layer by using the LED lamp is not particularly limited, and the glue solution can be completely cured. And obtaining a third heat dissipation adhesive layer after the curing is finished.
And finally, laminating the other side of the second heat dissipation adhesive layer and a third heat dissipation adhesive layer to obtain the composite structure heat dissipation film. In the present invention, it is preferable to wind after the coating.
The preparation method provided by the invention is simple in process, and the heat dissipation film with high tensile strength, excellent heat dissipation performance and excellent viscosity can be prepared.
For the sake of clarity, the following examples are given in detail.
In the following examples, the acrylic resin was copolymerized from butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate and N-methylolacrylamide in a molar ratio of 6:1:4:1, and was prepared as follows: and mixing the monomers in the molar ratio, adding the azobisisobutyronitrile according to the mass ratio of the monomer mixture to the azobisisobutyronitrile of 10:0.2, and introducing nitrogen gas to the mixture for mixing reaction at 55 ℃ for 5 hours to obtain the acrylic resin.
Example 1
1) Preparing acrylic resin glue:
100 parts by weight of acrylic resin, 2 parts by weight of benzophenone (photoinitiator), 0.005 part by weight of acryloxyalkyl coupling agent, 1.5 parts by weight of dibutyl phthalate (plasticizer), 0.05 part by weight of methyl salicylate (stabilizer) and 50 parts by weight of toluene (solvent) were mixed to obtain acrylic resin glue.
2) Preparing a composite structure heat dissipation film having the structure shown in fig. 1:
a) and (3) coating 85 parts by weight of the acrylic resin glue and 70 parts by weight of mixed glue of carbon fibers (the length is 25 mu m, the diameter is 100nm) on the heavy release film by adopting slit coating, curing by an LED lamp to obtain a second heat dissipation glue layer, and then covering the light release film for rolling. The LED lamp is used for curing, the power of the D ultraviolet diode is 300W, the output wavelength is 369nm, the LED lamp is arranged above the film, and the thickness of the second heat dissipation glue layer is 15 microns.
b) And coating 70 parts by weight of organic silicon pressure-sensitive adhesive (mixed glue of 15000C.P.S (25 ℃) and 80 parts by weight of SiC) on one surface of the second heat dissipation adhesive layer by adopting slit coating, curing the mixture by using an oven to form a first heat dissipation layer, and then coating a stripping film for winding. Wherein the oven temperature is 180 ℃, and the thickness of the first heat dissipation layer is 10 μm.
c) And (3) coating 90 parts by weight of the acrylic resin glue and 65 parts by weight of mixed glue of copper-aluminum alloy powder (the copper content is 40 wt%, and the granularity is 300 meshes) on the heavy release film by adopting slit coating, curing by using an LED lamp to form a third heat dissipation layer, and then rolling the other surface covered with the second heat dissipation layer to obtain a finished product. The LED lamp is used for curing, the power of the D ultraviolet diode is 300W, the output wavelength is 369nm, the LED lamp is arranged above the film, and the thickness of the third heat dissipation glue layer is 15 microns.
The performance of the obtained composite structure heat dissipation film is tested, and the result is as follows: the Shore hardness is 75A, the vertical thermal conductivity is 8W/(m.K), the horizontal thermal conductivity is 400W/(m.K),tensile strength of 22.5N/mm2The 180-degree peel force was 1900gf/25 mm.
Example 2
1) Preparing acrylic resin glue:
100 parts by weight of acrylic resin, 2 parts by weight of benzophenone (photoinitiator), 0.005 part by weight of acryloxyalkyl coupling agent, 1.5 parts by weight of dibutyl phthalate (plasticizer), 0.05 part by weight of methyl salicylate (stabilizer) and 50 parts by weight of toluene (solvent) were mixed to obtain acrylic resin glue.
2) Preparing a composite structure heat dissipation film having the structure shown in fig. 1:
a) and (3) coating 85 parts by weight of acrylic resin glue and 80 parts by weight of mixed glue of carbon fibers (the length is 25 mu m, and the diameter is 100nm) on the heavy release film by adopting slit coating, curing by an LED lamp to obtain a second heat dissipation glue layer, and then covering the light release film for rolling. The LED lamp is used for curing, the power of the D ultraviolet diode is 300W, the output wavelength is 369nm, the LED lamp is arranged above the film, and the thickness of the second heat dissipation glue layer is 15 microns.
b) And coating 70 parts by weight of mixed glue of organic silicon pressure-sensitive adhesive (the viscosity is 15000C.P.S (25 ℃) and 85 parts by weight of SiC) on one surface of the second heat dissipation glue layer by adopting slit coating, curing by an oven to form a first heat dissipation layer, and then coating a stripping film and rolling. Wherein the oven temperature is 170 ℃, and the thickness of the first heat dissipation layer is 10 μm.
c) And (3) coating 90 parts by weight of the acrylic resin glue and 75 parts by weight of mixed glue of copper-aluminum alloy powder (the copper content is 40 wt%, and the granularity is 300 meshes) on the heavy release film by adopting slit coating, curing by using an LED lamp to form a third heat dissipation layer, and then rolling the other surface covered with the second heat dissipation layer to obtain a finished product. The LED lamp is used for curing, the power of the D ultraviolet diode is 300W, the output wavelength is 369nm, the LED lamp is arranged above the film, and the thickness of the third heat dissipation glue layer is 15 microns.
The performance of the obtained composite structure heat dissipation film is tested, and the result is as follows: shore hardness is 75A, vertical thermal conductivity is 11W/(m.K), horizontal thermal conductivity is 453W/(m.K), tensile strength is 23N/mm2180 degree peel force of 1760gf/25mm。
Example 3
1) Preparing acrylic resin glue:
100 parts by weight of acrylic resin, 2 parts by weight of benzophenone (photoinitiator), 0.005 part by weight of acryloxyalkyl coupling agent, 1.5 parts by weight of dibutyl phthalate (plasticizer), 0.05 part by weight of methyl salicylate (stabilizer) and 50 parts by weight of toluene (solvent) were mixed to obtain acrylic resin glue.
2) Preparing a composite structure heat dissipation film having the structure shown in fig. 1:
a) and (3) coating 85 parts by weight of acrylic resin glue and 90 parts by weight of mixed glue of carbon fibers (the length is 25 mu m, and the diameter is 100nm) on the heavy release film by adopting slit coating, curing by an LED lamp to obtain a second heat dissipation glue layer, and then covering the light release film for rolling. The LED lamp is used for curing, the power of the D ultraviolet diode is 300W, the output wavelength is 369nm, the LED lamp is arranged above the film, and the thickness of the second heat dissipation glue layer is 15 microns.
b) And coating 70 parts by weight of mixed glue of organic silicon pressure-sensitive adhesive (the viscosity is 15000C.P.S (25 ℃) and 90 parts by weight of SiC) on one surface of the second heat dissipation glue layer by adopting slit coating, curing by an oven to form a first heat dissipation layer, and then coating a stripping film and rolling. Wherein the oven temperature is 180 ℃, and the thickness of the first heat dissipation layer is 10 μm.
c) And (3) coating 90 parts by weight of the acrylic resin glue and 80 parts by weight of mixed glue of copper-aluminum alloy powder (the copper content is 40 wt%, and the granularity is 300 meshes) on the heavy release film by adopting slit coating, curing by using an LED lamp to form a third heat dissipation layer, and then rolling the other surface covered with the second heat dissipation layer to obtain a finished product. The LED lamp is used for curing, the power of the D ultraviolet diode is 300W, the output wavelength is 369nm, the LED lamp is arranged above the film, and the thickness of the third heat dissipation glue layer is 15 microns.
The performance of the obtained composite structure heat dissipation film is tested, and the result is as follows: shore hardness is 75A, vertical thermal conductivity is 14W/(m.K), horizontal thermal conductivity is 580W/(m.K), tensile strength is 24.8N/mm2And 180 degree peel force of 1600gf/25 mm.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (5)
1. A composite structure heat dissipation film comprises a first release film layer, a first heat dissipation adhesive layer, a second heat dissipation adhesive layer, a third heat dissipation adhesive layer and a second release film layer which are sequentially contacted;
the first heat dissipation adhesive layer is formed by solidifying first heat dissipation adhesive layer adhesive liquid, the first heat dissipation adhesive layer adhesive liquid comprises organic silicon pressure-sensitive adhesive and SiC, and the mass ratio of the organic silicon pressure-sensitive adhesive to the SiC is (60-80): (80-90); the thickness of the first heat dissipation adhesive layer is 10-15 microns;
the second heat dissipation glue layer is formed by solidifying second heat dissipation glue layer glue solution, the second heat dissipation glue layer glue solution includes acrylic resin glue and carbon fiber, and the mass ratio of acrylic resin glue to carbon fiber is (85-90): (70-90); the diameter of the carbon fiber is 50-150 nm, and the length of the carbon fiber is 10-30 mu m; the thickness of the second heat dissipation adhesive layer is 15-25 micrometers;
the third heat dissipation adhesive layer is formed by solidifying third heat dissipation adhesive layer glue liquid, the third heat dissipation adhesive layer glue liquid comprises acrylic resin glue water and copper-aluminum alloy powder, and the mass ratio of the acrylic resin glue water to the copper-aluminum alloy powder is (85-90): (65-80); the copper content of the copper-aluminum alloy powder is 30-50 wt%; the thickness of the third heat dissipation adhesive layer is 15-25 mu m;
the vertical thermal conductivity coefficient of the composite structure heat dissipation film is 8-16W/(m.K), and the horizontal thermal conductivity coefficient of the composite structure heat dissipation film is 400-650W/(m.K).
2. A method of making the composite structural heat spreading film of claim 1 comprising the steps of:
a) the glue solution of the second heat dissipation glue layer is coated and then cured to obtain a second heat dissipation glue layer;
b) coating a first heat dissipation adhesive layer glue solution on one side of the second heat dissipation adhesive layer, and curing to obtain a first heat dissipation adhesive layer; then, covering a first release film layer on the first heat dissipation glue layer;
c) coating a third heat dissipation adhesive layer glue solution on one side of the second release film layer, and curing to obtain a third heat dissipation adhesive layer;
d) and covering the other side of the second heat dissipation adhesive layer and the third heat dissipation adhesive layer to obtain the composite structure heat dissipation film.
3. The preparation method according to claim 2, wherein in the step a), the second heat-dissipation glue layer glue solution is cured by an LED lamp; the power of the LED lamp is 50-300W, and the output wavelength is 360-400 nm.
4. The method according to claim 2, wherein in step b), the curing is carried out by thermal curing; the temperature of the thermocuring is 170-200 ℃.
5. The preparation method according to claim 2, wherein in the step c), the third heat-dissipation glue layer glue solution is cured by an LED lamp; the power of the LED lamp is 50-300W, and the output wavelength is 360-400 nm.
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| US20080206544A1 (en) * | 2005-08-05 | 2008-08-28 | You-Hoon Kim | Heat-Transferring Adhesive Tape With Improved Functionality |
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
| CN102433092A (en) * | 2011-09-05 | 2012-05-02 | 青岛海信电器股份有限公司 | Pressure-sensitive acrylic acid thermally conductive adhesive, preparation method for same and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20080206544A1 (en) * | 2005-08-05 | 2008-08-28 | You-Hoon Kim | Heat-Transferring Adhesive Tape With Improved Functionality |
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
| CN102433092A (en) * | 2011-09-05 | 2012-05-02 | 青岛海信电器股份有限公司 | Pressure-sensitive acrylic acid thermally conductive adhesive, preparation method for same and application thereof |
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