CN107195572A - One kind heating plummer and its control method, thin-film package equipment - Google Patents
One kind heating plummer and its control method, thin-film package equipment Download PDFInfo
- Publication number
- CN107195572A CN107195572A CN201710552534.9A CN201710552534A CN107195572A CN 107195572 A CN107195572 A CN 107195572A CN 201710552534 A CN201710552534 A CN 201710552534A CN 107195572 A CN107195572 A CN 107195572A
- Authority
- CN
- China
- Prior art keywords
- heating
- temperature
- heater
- plummer
- pipeline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
Abstract
Present invention design display technology field, a kind of open heating plummer and its control method, thin-film package equipment, heating plummer include：Plummer body；First heater, first heater forms the first heating region on plummer body；Secondary heating mechanism, secondary heating mechanism forms the second heating region on plummer body, and the second heating region is set around the first heating region；Temperature control device, temperature control device is connected with first heater and secondary heating mechanism respectively, and for controlling the temperature of first heater and secondary heating mechanism, so that temperature of the secondary heating mechanism in heating process is higher than temperature of the first heater in heating process, and the temperature of first heater is set gradually to be reduced in heating process.The problem of can improving that heating plummer of the prior art causes the encapsulation film edge consistency of OLED not enough and the organic material life-span declines, and then cause the reliability and yield of OLED to reduce.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of heating plummer and its control method, thin-film package are set
It is standby.
Background technology
OLED(Organic Light-Emitting Diode；Organic electroluminescent) device have it is low in energy consumption, light, bright
The features such as degree height, the wide visual field and high-contrast and fast reaction speed, consumption electronic product market is had been widely used at present.For
The service life of OLED is improved, needs to seal OLED using packaging technology in the production process of OLED
Dress, the erosion caused is permeated to reduce water oxygen during use.Thin-film package is a kind of current conventional method for packing, by
The film for setting one or more layers to be formed by organic material or inorganic material in OLED, can play makes OLED and the external world
Environment isolation, the effect for slowing down water oxygen infiltration.
It is many using PECVD ((Plasma Enhanced Chemical Vapor in current packaging technology
Deposition；Plasma enhanced chemical vapor deposition) method is packaged the preparation of film, and PECVD methods are by making into
The gas ionization of membrane material simultaneously forms plasma, and required film is then gone out in deposition on substrate.In potting process,
The substrate for being formed with OLED is positioned on heating plummer, as substrate is heated to certain temperature, the plasma bodily form
The encapsulating material of state is deposited in OLED, so as to form packaging film.However, heating plummer of the prior art easily makes
Basal plate heated is uneven, so as to cause the edge compactness extent of the packaging film of deposition not enough, in the use process of OLED
In easily penetrate into water oxygen；And heating plummer accumulates the OLED heat on substrate during being heated to substrate, easily
It is tired excessively to cause temperature to rise too high, reduce the service life of the organic material in OLED.Therefore, in the prior art
Heating plummer the encapsulation film edge consistency of OLED can be caused not enough and the problem of the organic material life-span declines, reduction
The reliability and yield of OLED.
The content of the invention
The invention provides one kind heating plummer and its control method, thin-film package equipment, for solving prior art
In heating plummer cause the encapsulation film edge consistency of OLED not enough and the organic material life-span declines, and then cause
The problem of reliability and yield of OLED are reduced.
To achieve the above object, the present invention provides following technical scheme：
One kind heating plummer, including：
Plummer body；
First heater, the first heater forms the first heating region on the plummer body；
Secondary heating mechanism, the secondary heating mechanism forms the second heating region on the plummer body, described
Second heating region is set around first heating region；
Temperature control device, the temperature control device is connected with the first heater and the secondary heating mechanism respectively, and
Temperature for controlling the first heater and secondary heating mechanism, so that the secondary heating mechanism is in heating process
Temperature be higher than temperature of the first heater in heating process, and make the temperature of the first heater in heating
During gradually reduce.
In the heating plummer that the present invention is provided, first heater has the first heating region, is used in heating process
In the core of heating substrate, secondary heating mechanism has the second heating region set around the first heating region, added
It is used for the marginal portion for heating substrate in thermal process, in heating process, the temperature of temperature control device control secondary heating mechanism is high
In first heater, the temperature of the marginal portion of substrate is higher than the core of substrate, encapsulating material can be made on substrate side
The film that edge point deposition is formed is finer and close, improves the consistency at packaging film edge, reduces water oxygen by packaging film side
The probability that edge penetrates into, temperature control device also controls first heater temperature in heating process to be gradually reduced, can reduce substrate
Thermal accumlation of the core in heating process, reduces the temperature of the organic material of OLED, improves heating temperature
The problem of organic material service life declines caused by too high.Therefore, the heating plummer that the present invention is provided can improve existing skill
Heating plummer in art causes the encapsulation film edge consistency of OLED not enough and the decline of organic material life-span, and then causes
The problem of reliability and yield of OLED are reduced.
Alternatively, the first heater includes the first heating pipeline, and the first heating pipeline winding escalator is into described
First heating region；
The secondary heating mechanism includes the second heating pipeline, and the second heating pipeline is around the described first heating pipeline
Form second heating region.
Further, the first heater includes the first circulation mechanism with the described first heating pipeline connection, institute
Stating first circulation mechanism is used to make the heat-conducting liquid after heating heat pipeline internal circulation flow described first；
The secondary heating mechanism includes the second circulation mechanism with the described second heating pipeline connection, the second circulation
Mechanism is used to make the heat-conducting liquid after heating heat pipeline internal circulation flow described second.
Further, the heat-conducting liquid is water or heat transfer oil.
Further, prepared by the first heating tube route copper or aluminum, the second heating tube route copper or aluminium
It is prepared by material.
A kind of control method of the heating plummer provided present invention also offers above-mentioned technical proposal, the temperature control device
Temperature of the secondary heating mechanism in heating process is controlled to be higher than temperature of the first heater in heating process,
And control the temperature of the first heater gradually to be reduced in heating process.
Alternatively, the temperature control device controls temperature of the secondary heating mechanism in heating process to be higher than described first
5 DEG C -8 DEG C of temperature of the heater in heating process.
Further, the temperature control device controls the temperature of the first heater per minute after heating process starts
5 DEG C of reduction.
Further, the temperature control device controls the temperature of the first heater to be declined in heating process by 80 DEG C
To 65 DEG C.
Present invention also offers a kind of thin-film package equipment, including such as the heating plummer of above-mentioned technical scheme offer.
Brief description of the drawings
Fig. 1 is the structural representation of heating plummer provided in an embodiment of the present invention.
Reference：
100, plummer body；101, the first heating region；102, the second heating region；
200, first heater；210, the first heating pipeline；220, first circulation mechanism；
300, secondary heating mechanism；310, the second heating pipeline；320, second circulation mechanism；
400, temperature control device.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based on this
Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example is applied, the scope of protection of the invention is belonged to.
Embodiment one：
It is shown in Figure 1, a kind of heating plummer is present embodiments provided, including：
Plummer body 100, in specific implementation, plummer body 100 is provided with the loading end of bearing substrate；
First heater 200, first heater 200 forms the first heating region 101 on plummer body 100,
In specific implementation, the first heating region 101 is arranged on loading end；
Secondary heating mechanism 300, secondary heating mechanism 300 forms the second heating region 102 on plummer body 100,
Second heating region 102 is set around the first heating region 101, in specific implementation, and the second heating region 102 is arranged at loading end
On；
Temperature control device 400, the temperature control device 400 is filled with the first heater 200 and second heating respectively
300 connections are put, and for controlling the temperature of the first heater 200 and secondary heating mechanism 300, so that described second adds
Temperature of the thermal 300 in heating process is higher than temperature of the first heater 200 in heating process, and makes described
The temperature of first heater 200 is gradually reduced in heating process.
In the heating plummer that the present embodiment is provided, first heater 200 forms first on plummer body 100 and added
Thermal region 101, is used for the core for heating substrate, secondary heating mechanism 300 is on plummer body 100 in heating process
The second heating region 102 set around the first heating region 101 is formed, the edge part for heating substrate is used in heating process
Point.
In heating process, the temperature of the control secondary heating mechanism 300 of temperature control device 400 is higher than first heater 200,
The temperature of the marginal portion of substrate is higher than the core of substrate, encapsulating material can be made to deposit what is formed in substrate edge part
Film is finer and close, improves the consistency at packaging film edge, reduces the probability that water oxygen is penetrated into by packaging film edge.Temperature control
Device 400 also controls the temperature in heating process of first heater 200 to be gradually reduced, and the core that can reduce substrate is adding
Thermal accumlation in thermal process, reduces the temperature of the organic material of OLED, improve heating temperature it is too high caused by have
The problem of machine materials'use life-span declines.
Therefore, the heating plummer that the present invention is provided can improve heating plummer of the prior art and cause OLED
Encapsulate film edge consistency deficiency and the organic material life-span declines, and then cause the reliability of OLED and asking for yield reduction
Topic.
Shown in Figure 1 in a kind of embodiment, first heater 200 includes the first heating pipeline 210, the
The one heating coiling of pipeline 210 forms the first heating region 101；Secondary heating mechanism 300 includes the second heating pipeline 310, second
Pipeline 310 is heated around the first heating the second heating region 102 of formation of pipeline 210.The first heating heating tube of pipeline 210 and second
The coiled fashion on road 310 should be able to make the first heating region 101 and the consistent heat generation of the second heating region 102, to make in substrate
Center portion point and marginal portion are heated properly, and heat the coiling side of pipeline 310 in this implementation to the first heating pipeline 210 and second
Formula is not limited.
In specific implementation, the first heating heating pipeline 310 of pipeline 210 and second can be heated using heating wire, also may be used
The heat-conducting liquid circulated is passed through into heating pipeline to be heated.Specifically, pipeline 210 and second is heated to improve first
The heat conductivility of pipeline 310 is heated, and then, the first heating pipeline 210 is prepared by copper or aluminum, and the second heating pipeline 310
Prepared by copper or aluminum, the heat conductivility of copper and aluminium preferably, can improve the first heating pipeline 210 and the second heating pipeline 310
The efficiency of heating surface.
When the first heating heating pipeline 310 of pipeline 210 and second is heated using heat-conducting liquid, it is necessary to make conductive fluid
Body is in the first heating heating internal circulation flow of pipeline 310 of pipeline 210 and second, so that the first heating pipeline 210 and second is heated
The heating pipeline 310 of pipeline 210 and second is heated in the outflow first in time after temperature drop of heat-conducting liquid in pipeline 310, and to
The higher heat-conducting liquid of temperature is supplemented in time in the first heating heating pipeline 310 of pipeline 210 and second, it is ensured that the first heating pipeline
210 and second heat the temperature of pipeline 310 in required heated perimeter.It is shown in Figure 1, a kind of embodiment
In, first heater 200 includes the first circulation mechanism 220 connected with the first heating pipeline 210, first circulation mechanism 220
For making the heat-conducting liquid after heating in the first heating internal circulation flow of pipeline 210；Secondary heating mechanism 300 includes adding with second
The second circulation mechanism 320 that pipe line 310 is connected, second circulation mechanism 320 is used to make the heat-conducting liquid after heating second add
The internal circulation flow of pipe line 310.
Specifically, first circulation mechanism 220 and second circulation mechanism 320 include being used to make what heat-conducting liquid was circulated
Circulating pump, temperature control device 400 include being connected with first circulation mechanism 220 and second circulation mechanism 320 respectively and for control with
The control unit that first circulation mechanism 220 and second circulation mechanism 320 are started or stoped, in addition to treat inflow first for heating
The heating unit of the heat-conducting liquid of the heating pipeline 310 of pipeline 210 and second is heated, and for detecting the first heating region 101
With the temperature sensing unit of the temperature of the second heating region 102, heat-conducting liquid is heated to required temperature by heating unit, in temperature
When sensing unit detects the temperature of the first heating region 101 or the second heating region 102 less than default operating temperature, control
Unit control first circulation mechanism 220 or second circulation mechanism 320 start, and the heating tube of pipeline 210 or second is heated in discharge first
The lowered heat-conducting liquid of temperature in road 310, and the heat-conducting liquid of required temperature is flowed into the first heating pipeline 210 or the second
Heat in pipeline 310, so as to ensure that the first heating pipeline 210 and the second heating pipeline 310 keep required heating-up temperature.Specifically
In implementation, heat-conducting liquid can be water or heat transfer oil.
Embodiment two
A kind of control method for heating plummer provided such as above-mentioned embodiment one, the control method are be provided
Specifically include：
Temperature control device 400 controls temperature of the secondary heating mechanism 300 in heating process to exist higher than first heater 200
Temperature in heating process, and control the temperature of first heater 200 gradually to be reduced in heating process.
Current OLED in use, generally from the edge of packaging film penetrate into and cause OLED by water oxygen
Service life decline, so improve packaging film marginal portion compactness, it is possible to decrease water oxygen penetrate into probability.In encapsulation
In the deposition process of film, the temperature of substrate has a major impact to the property and structural stability of packaging film, improves substrate
Temperature can make the gas molecule group of encapsulating material have certain surface migration ability after substrate is reached, in the position that potential energy is minimum
Put and be attached to substrate up, so that the packaging film internal stress formed is smaller and compact structure.In specific implementation, to ensure
The consistency at packaging film edge, the heating temperature to the core of substrate is higher than to the heating-up temperature of the marginal portion of substrate
Degree, the temperature range being higher by is at 5 DEG C -8 DEG C.In current thin film encapsulation processes, to prevent OLED from causing due to overheat
Loss, to the heating-up temperature general control of substrate at 80 DEG C or so, because the marginal portion of substrate is typically not provided with organic light emission
Device, therefore when being not provided with organic luminescent device in the marginal portion of substrate, improves the heating-up temperature of substrate edge part, pair sets
The influence for being placed in the organic luminescent device of substrate center part is smaller.
To ensure heating-up temperature of the heating-up temperature higher than the core to substrate to the marginal portion of substrate, one kind tool
In body embodiment, temperature control device controls temperature of the secondary heating mechanism in heating process higher than first heater in heating
During 5 DEG C -8 DEG C of temperature, specifically, the heating-up temperature of secondary heating mechanism can higher than 5 DEG C of first heater, 6 DEG C, 7
DEG C or 8 DEG C.
In current packaging technology, the film forming speed of packaging film is in 250nm/min or so, in the thickness needed for acquisition
When, the surface temperature of substrate can rise 20 DEG C or so, and average temperature rise rate is about 6 DEG C/min.It is deposited in packaging film
Afterwards, due to the accumulation of heat, the temperature of substrate typically can all add OLED and damage caused because temperature is too high more than 80 DEG C
The probability of wound.
In the control method that the present embodiment is provided, to reduce the thermal accumlation of substrate, in a kind of embodiment, temperature
Control device control first heater temperature after heating process starts it is per minute reduction by 5 DEG C, i.e. fall off rate be 5 DEG C/
min.When initial heating temperature is 80 DEG C, further, the temperature of temperature control device control secondary heating mechanism is in heating process
In drop to 65 DEG C by 80 DEG C., can be with the temperature on control base board surface by controlling the temperature of secondary heating mechanism gradually to reduce
Accumulation, reduces the temperature that substrate rises in packaging technology, and reduction OLED causes the probability of damage due to overheat.
By experiment test, packaging technology of the prior art can make the temperature of substrate reach more than 80 DEG C, and this implementation
The control method that example is provided makes the temperature of controllable substrate at 70 DEG C or so in packaging technology.
The control method that the present embodiment is provided is in heating process, and the temperature of temperature control device control secondary heating mechanism is higher than
First heater, makes the temperature of the marginal portion of substrate be higher than the core of substrate, can make encapsulating material in substrate edges
The film that part deposition is formed is finer and close, improves the consistency at packaging film edge, reduces water oxygen by packaging film edge
The probability of infiltration.Temperature control device also controls first heater temperature in heating process to be gradually reduced, and can reduce in substrate
Thermal accumlation of the center portion point in heating process, reduces the temperature of the organic material of OLED, improves heating temperature mistake
The problem of organic material service life declines caused by high.
Embodiment three
Based on same inventive concept, present invention also offers a kind of thin-film package equipment, including as above-mentioned embodiment one is carried
The heating plummer of confession.In specific implementation, the thin-film package equipment also includes plasma gas generator.
The thin-film package equipment that the present embodiment is provided equally is apt to heating plummer of the prior art and causes OLED
Encapsulate film edge consistency deficiency and the organic material life-span declines, and then cause the reliability of OLED and asking for yield reduction
Topic.Its principle and specific implementation are repeated no more referring to above-described embodiment one.
Obviously, those skilled in the art can carry out various changes and modification without departing from this hair to the embodiment of the present invention
Bright spirit and scope.So, if these modifications and variations of the present invention belong to the claims in the present invention and its equivalent technologies
Within the scope of, then the present invention is also intended to comprising including these changes and modification.
Claims (10)
1. one kind heating plummer, it is characterised in that including：
Plummer body；
First heater, the first heater forms the first heating region on the plummer body；
Secondary heating mechanism, the secondary heating mechanism forms the second heating region, described second on the plummer body
Heating region is set around first heating region；
Temperature control device, the temperature control device is connected with the first heater and the secondary heating mechanism respectively, and is used for
The temperature of the first heater and secondary heating mechanism is controlled, so that temperature of the secondary heating mechanism in heating process
Degree is higher than temperature of the first heater in heating process, and makes the temperature of the first heater in heating process
In gradually reduce.
2. heating plummer according to claim 1, it is characterised in that the first heater includes the first heating tube
Road, described first heats pipeline winding escalator into first heating region；
The secondary heating mechanism includes the second heating pipeline, and the second heating pipeline is formed around the described first heating pipeline
Second heating region.
3. heating plummer according to claim 2, it is characterised in that the first heater includes and described first
The first circulation mechanism of pipeline connection is heated, the first circulation mechanism is used to make the heat-conducting liquid after heating described first add
Pipe line internal circulation flow；
The secondary heating mechanism includes the second circulation mechanism with the described second heating pipeline connection, the second circulation mechanism
For making the heat-conducting liquid after heating in the described second heating pipeline internal circulation flow.
4. heating plummer according to claim 3, it is characterised in that the heat-conducting liquid is water or heat transfer oil.
5. heating plummer according to claim 2, it is characterised in that the first heating tube route copper or aluminum system
Standby, prepared by the second heating tube route copper or aluminum.
6. a kind of control method of heating plummer as described in claim any one of 1-5, it is characterised in that the temperature control dress
Put and control temperature of the secondary heating mechanism in heating process to be higher than temperature of the first heater in heating process
Degree, and control the temperature of the first heater gradually to be reduced in heating process.
7. the control method of heating plummer according to claim 6, it is characterised in that the temperature control device control is described
Temperature of the secondary heating mechanism in heating process is higher than 5 DEG C -8 DEG C of temperature of the first heater in heating process.
8. the control method of heating plummer according to claim 6, it is characterised in that the temperature control device control is described
5 DEG C of the reduction per minute after heating process starts of the temperature of first heater.
9. the control method of heating plummer according to claim 5, it is characterised in that the temperature control device control is described
The temperature of first heater drops to 65 DEG C in heating process by 80 DEG C.
10. a kind of thin-film package equipment, it is characterised in that including the heating plummer as described in claim any one of 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710552534.9A CN107195572B (en) | 2017-07-07 | 2017-07-07 | A kind of heating plummer and its control method, thin-film package equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710552534.9A CN107195572B (en) | 2017-07-07 | 2017-07-07 | A kind of heating plummer and its control method, thin-film package equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107195572A true CN107195572A (en) | 2017-09-22 |
| CN107195572B CN107195572B (en) | 2019-11-05 |
Family
ID=59883522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710552534.9A Active CN107195572B (en) | 2017-07-07 | 2017-07-07 | A kind of heating plummer and its control method, thin-film package equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107195572B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050110404A1 (en) * | 2002-05-23 | 2005-05-26 | Park Jin-Woo | Method for encapsulating organic electroluminescent device and an organic electroluminescent panel using the same |
| CN104022234A (en) * | 2014-06-24 | 2014-09-03 | 深圳市华星光电技术有限公司 | OLED encapsulating equipment and encapsulating method of OLED panel |
| CN104183785A (en) * | 2014-06-27 | 2014-12-03 | 京东方科技集团股份有限公司 | OLED device packaging method, OLED display panel and OLED display device |
| CN104377158A (en) * | 2014-11-17 | 2015-02-25 | 上海华力微电子有限公司 | Heating bearing platform of laser annealing machine table |
-
2017
- 2017-07-07 CN CN201710552534.9A patent/CN107195572B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050110404A1 (en) * | 2002-05-23 | 2005-05-26 | Park Jin-Woo | Method for encapsulating organic electroluminescent device and an organic electroluminescent panel using the same |
| CN104022234A (en) * | 2014-06-24 | 2014-09-03 | 深圳市华星光电技术有限公司 | OLED encapsulating equipment and encapsulating method of OLED panel |
| CN104183785A (en) * | 2014-06-27 | 2014-12-03 | 京东方科技集团股份有限公司 | OLED device packaging method, OLED display panel and OLED display device |
| CN104377158A (en) * | 2014-11-17 | 2015-02-25 | 上海华力微电子有限公司 | Heating bearing platform of laser annealing machine table |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107195572B (en) | 2019-11-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105226186B (en) | The production method of flexible display apparatus and flexible display apparatus obtained | |
| CN105870327A (en) | Manufacturing method for flexible OLED and flexible OLED | |
| JP5994844B2 (en) | Gas barrier film and electronic device | |
| CN102560434B (en) | Metal organic compound chemical vapor deposition equipment | |
| CN109037460A (en) | A kind of flexible substrate and preparation method thereof | |
| US20180355703A1 (en) | Steam driven submersible pump | |
| WO2016086532A1 (en) | Flexible oled substrate and flexible oled packaging method | |
| US8808494B2 (en) | Bonding material, method, and structure | |
| CN106920813A (en) | The preparation method of flexible display | |
| CN103730194A (en) | Multilayer structure composite transparent conducting thin film based on silver nanowires and preparation method thereof | |
| CN106427180A (en) | Preparation method of bifacial adhesive films with uniform heat conduction | |
| US9590206B2 (en) | OLED package device and package method of OLED panel | |
| CN105538128A (en) | Polishing solution heating device and polishing temperature control method | |
| JP3180463U (en) | Elevating and transporting chemical bath deposition equipment | |
| JPWO2016009801A6 (en) | Gas barrier film and electronic device | |
| CN107195572B (en) | A kind of heating plummer and its control method, thin-film package equipment | |
| Liu et al. | Phase Aggregation Suppression of Homogeneous Perovskites Processed in Ambient Condition toward Efficient Light‐Emitting Diodes | |
| CN106906445A (en) | A kind of evaporation source | |
| US10954592B2 (en) | Evaporation source heating system with soaking layer | |
| CN105047810B (en) | The preparation method of Bi-based high-temperature superconductive material | |
| CN107195756A (en) | The pre-package structure and semiconductor light-emitting apparatus of semiconductor light-emitting apparatus | |
| CN105063576A (en) | Low-temperature film coating method using tetraethyl orthosilicate (TEOS) source | |
| JP2006156358A (en) | Distributed electroluminescent element | |
| JP2008226813A (en) | Manufacturing method and device of superconductive tape in an integrated process | |
| CN205342774U (en) | Polish heating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |