CN107191795A - A kind of LED lamp based on high heat dispersion - Google Patents
A kind of LED lamp based on high heat dispersion Download PDFInfo
- Publication number
- CN107191795A CN107191795A CN201710419503.6A CN201710419503A CN107191795A CN 107191795 A CN107191795 A CN 107191795A CN 201710419503 A CN201710419503 A CN 201710419503A CN 107191795 A CN107191795 A CN 107191795A
- Authority
- CN
- China
- Prior art keywords
- substrate
- heat sink
- adsorption layer
- thermovent
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/15—Thermal insulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The present invention discloses a kind of LED lamp based on high heat dispersion, including heat sink, and the heat sink is made up of the overcoat, adsorption layer and screen layer being coated on substrate；Thermovent is uniformly provided with a surface of substrate, another surface has been uniformly arranged cynapse；Overcoat is covered in the surface with thermovent of substrate；Adsorption layer is coated on the surface that substrate carries cynapse；Screen layer is compounded in the surface of adsorption layer.The present invention is by using the compound structure design for realizing heat sink of sandwich construction, the surface area for being used to increase heat sink by the taper structure of design, and plays a part of sound insulation；Coordinate the effect of heat insulation for improving heat sink by using insulating moulding coating and thermovent, the adsorption of heat sink is realized by compound adsorption layer.
Description
Technical field
The present invention relates to a kind of LED lamp, specifically a kind of LED lamp based on high heat dispersion.
Background technology
LED is the abbreviation of light emitting diode, be it is a kind of can convert electric energy to the solid luminescent material of luminous energy, due to
The trend of the advantage of its energy-conserving and environment-protective, at present positive substitution conventional light source, LED spotlight is a kind of light fixture of height optically focused, its light
Irradiation, which has, specifies specific target.In order to improve the heat-sinking capability of LED lamp, a kind of scheme is now provided.
The content of the invention
It is an object of the invention to provide a kind of LED lamp based on high heat dispersion.
The purpose of the present invention can be achieved through the following technical solutions：
A kind of LED lamp based on high heat dispersion, including heat sink, the heat sink is by the protection that is coated on substrate
Layer, adsorption layer and screen layer are constituted；Thermovent is uniformly provided with a surface of substrate, another surface has been uniformly arranged cynapse；It is anti-
Sheath is covered in the surface with thermovent of substrate；Adsorption layer is coated on the surface that substrate carries cynapse；Screen layer is compounded in
The surface of adsorption layer.
The substrate uses stainless steel plate or plastic plate；The overcoat is insulating moulding coating；The adsorption layer is magnetic iron powder
End.
The cynapse is diameter 0.1mm-5mm needle-like structures, the highly scope in 1mm-5mm；The thermovent it is interior
Cavity configuration is inverted taper structure.
Beneficial effects of the present invention：The present invention passes through by using the compound structure design for realizing heat sink of sandwich construction
The taper structure of design is used for the surface area for increasing heat sink, and plays a part of sound insulation；By using insulating moulding coating with
Thermovent coordinates the effect of heat insulation for improving heat sink, and the adsorption of heat sink is realized by compound adsorption layer.
Brief description of the drawings
For the ease of it will be appreciated by those skilled in the art that the present invention is further illustrated below in conjunction with the accompanying drawings.
Fig. 1 is the Structure explosion diagram of heat sink of the present invention；
Fig. 2 is Fig. 1 structure top view；
Fig. 3 is the partial structurtes enlarged drawing at A in Fig. 2；
Fig. 4 is the structural representation of substrate.
Embodiment
Technical scheme is clearly and completely described below in conjunction with embodiment, it is clear that described reality
It is only a part of embodiment of the invention to apply example, rather than whole embodiments.Based on the embodiment in the present invention, this area is general
All other embodiment that logical technical staff is obtained under the premise of creative work is not made, belongs to what the present invention was protected
Scope.
A kind of LED lamp based on high heat dispersion, including heat sink, as Figure 1-3, the heat sink is by being coated in base
Overcoat 2, adsorption layer 3 and screen layer 4 on plate 1 are constituted；Thermovent 102, another surface are uniformly provided with a surface of substrate 1
It has been uniformly arranged cynapse 101；Overcoat 2 is covered in the surface with thermovent 102 of substrate 1；Adsorption layer 3 is coated on substrate 1
Surface with cynapse 101；Screen layer 4 is compounded in the surface of adsorption layer 3.
Wherein, as shown in figure 4, substrate 1 uses stainless steel plate or plastic plate, the carrying for the structural strength of the heat sink
Supporting framework.
Wherein, overcoat 2 is insulating moulding coating；Insulating moulding coating is by sodium silicate, porous konilite, asbestos, perlite, polyethylene
Alcohol, mineral wool and water composition, the coatings of formation are on the surface of substrate 1.
Wherein, adsorption layer 3 is ferromagnetic powder, the superficial attractive forces for improving the heat sink.
Wherein, cynapse 101 is diameter 0.1mm-5mm needle-like structures, the highly scope in 1mm-5mm.
Wherein, the inner-cavity structure of thermovent 102 be inverted taper structure, the surface area for increasing heat sink, and
And play a part of sound insulation.
The present invention is used by using the compound structure design for realizing heat sink of sandwich construction by the taper structure of design
In the surface area of increase heat sink, and play a part of sound insulation；Coordinate by using insulating moulding coating and thermovent and improve radiating
The effect of heat insulation of plate, the adsorption of heat sink is realized by compound adsorption layer.
Present invention disclosed above preferred embodiment is only intended to help and illustrates the present invention.Preferred embodiment is not detailed
All details of narration, it is only described embodiment that the invention is not limited yet.Obviously, according to the content of this specification,
It can make many modifications and variations.This specification is chosen and specifically describes these embodiments, is to preferably explain the present invention
Principle and practical application so that skilled artisan can be best understood by and utilize the present invention.The present invention is only
Limited by claims and its four corner and equivalent.
Claims (3)
1. a kind of LED lamp based on high heat dispersion, it is characterised in that including heat sink, the heat sink is by being coated in substrate
(1) overcoat (2), adsorption layer (3) and screen layer (4) on are constituted；Thermovent is uniformly provided with a surface of substrate (1)
(102), another surface has been uniformly arranged cynapse (101)；Overcoat (2) is covered in the table with thermovent (102) of substrate (1)
Face；Adsorption layer (3) is coated on the surface that substrate (1) carries cynapse (101)；Screen layer (4) is compounded in the surface of adsorption layer (3).
2. a kind of LED lamp based on high heat dispersion according to claim 1, it is characterised in that the substrate (1) is adopted
With stainless steel plate or plastic plate；The overcoat (2) is insulating moulding coating；The adsorption layer (3) is ferromagnetic powder.
3. a kind of LED lamp based on high heat dispersion according to claim 1, it is characterised in that the cynapse (101)
For diameter 0.1mm-5mm needle-like structures, the highly scope in 1mm-5mm；The inner-cavity structure of the thermovent (102) is inversion
Taper structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710419503.6A CN107191795A (en) | 2017-06-06 | 2017-06-06 | A kind of LED lamp based on high heat dispersion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710419503.6A CN107191795A (en) | 2017-06-06 | 2017-06-06 | A kind of LED lamp based on high heat dispersion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107191795A true CN107191795A (en) | 2017-09-22 |
Family
ID=59877801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710419503.6A Pending CN107191795A (en) | 2017-06-06 | 2017-06-06 | A kind of LED lamp based on high heat dispersion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107191795A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11345921A (en) * | 1997-11-28 | 1999-12-14 | Robert Bosch Gmbh | Cooling device arranged on printed board and prepared for component of generating heat |
| CN1946550A (en) * | 2004-04-28 | 2007-04-11 | 住友金属工业株式会社 | Coated steel sheet with excellent heat dissipation |
| CN201491372U (en) * | 2009-04-17 | 2010-05-26 | 惠州国展电子有限公司 | Module for directly manufacturing circuit board and electronic component on radiator |
| CN205946359U (en) * | 2016-08-22 | 2017-02-08 | 四川深北电路科技有限公司 | Aluminium base printing board of high heat conduction that heat dispersion is good |
-
2017
- 2017-06-06 CN CN201710419503.6A patent/CN107191795A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11345921A (en) * | 1997-11-28 | 1999-12-14 | Robert Bosch Gmbh | Cooling device arranged on printed board and prepared for component of generating heat |
| CN1946550A (en) * | 2004-04-28 | 2007-04-11 | 住友金属工业株式会社 | Coated steel sheet with excellent heat dissipation |
| CN201491372U (en) * | 2009-04-17 | 2010-05-26 | 惠州国展电子有限公司 | Module for directly manufacturing circuit board and electronic component on radiator |
| CN205946359U (en) * | 2016-08-22 | 2017-02-08 | 四川深北电路科技有限公司 | Aluminium base printing board of high heat conduction that heat dispersion is good |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170922 |
|
| RJ01 | Rejection of invention patent application after publication |