CN107186959A - A kind of injection mold of light guide plate motherboard and the processing method of light guide plate - Google Patents
A kind of injection mold of light guide plate motherboard and the processing method of light guide plate Download PDFInfo
- Publication number
- CN107186959A CN107186959A CN201710313113.0A CN201710313113A CN107186959A CN 107186959 A CN107186959 A CN 107186959A CN 201710313113 A CN201710313113 A CN 201710313113A CN 107186959 A CN107186959 A CN 107186959A
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- CN
- China
- Prior art keywords
- light guide
- guide plate
- injection molding
- molding cavity
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
- B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Light Guides In General And Applications Therefor (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses the processing method of a kind of injection mold of light guide plate motherboard and light guide plate.The injection mold includes the first substrate and second substrate being oppositely arranged, the glue-feeder for having the injection molding cavity of light guide plate motherboard between the first substrate and second substrate and being connected with the injection molding cavity；The injection molding cavity includes product region and scrap area, and the product region is wherein alignd with the cavity wall of injection molding cavity on one side, and as the incidence surface of guide-lighting board finished product, cavity wall of three sides than injection molding cavity is inside contracted in addition, formation scrap area；The glue-feeder is connected with scrap area.The injection mold and processing method can solve guide-lighting board finished product edge stress it is bad the problem of, it is good in full screen scanning brightness uniformity, it is adaptable to make the light guide plate of high-end backlight.
Description
Technical field
The present invention relates to injection mold and the processing side of light guide plate of field of backlights, more particularly to a kind of light guide plate motherboard
Method.
Background technology
Light guide plate is part important inside backlight in liquid crystal display module, and effect is that the light for sending LED is beaten
Dissipate, form the area source of uniform.
Light guide plate is typically made by injection molding, and light guide panel material is injected in injection mold, forms guide-lighting after cooling
Board finished product, the size of general injection molding cavity can be identical with the size of guide-lighting board finished product, now, in the glue-feeder of injection molding cavity and four chambers
Easily stress concentration is produced on wall and causes light guide plate to occur the bad problems such as edge bright line, local bright border (point) when in use.
Wherein, one side of light guide plate incidence surface can imitate bad display because the anti-dazzling screen width of the source ends of backlight is larger
Fruit is to covering, still, other three sides generally only 0-0.5mm bigger than viewing area or so of light guide plate, and difficulty has space to add in structure
Other three sides size of big light guide plate, anti-dazzling screen can not also form effective masking on this three side.
In the past, requirement of the client to backlight was relatively low, so generally being pressed a little when detecting the brightness uniformity of backlight
（Such as 5/9/16/25 point）Test, with a certain distance from test point has from the edge of light guide plate, therefore does not have big problem, still,
Raising with client to effect requirements, high-end backlight requirement carries out full screen scanning to detect brightness uniformity, now edge
Reduced with the bad brightness uniformity that can make full screen scanning of stress of glue-feeder.
The content of the invention
In order to solve above-mentioned the deficiencies in the prior art, the present invention provides a kind of injection mold and light guide plate of light guide plate motherboard
Processing method.The injection mold and processing method can solve guide-lighting board finished product edge stress it is bad the problem of, full frame
Swept brilliance uniformity is good, it is adaptable to make the light guide plate of high-end backlight.
The technical problems to be solved by the invention are achieved by the following technical programs：
A kind of injection mold of light guide plate motherboard, including the first substrate and second substrate being oppositely arranged, the first substrate and
The glue-feeder that there is the injection molding cavity of light guide plate motherboard between second substrate and connected with the injection molding cavity；The injection molding cavity includes
Product region and scrap area, the product region wherein while alignd with the cavity wall of injection molding cavity, be used as guide-lighting board finished product
Incidence surface, in addition cavity wall of three sides than injection molding cavity inside contract, formed scrap area；The glue-feeder is connected with scrap area.
Further, one side inside contracting than other both sides of the glue-feeder is connected in three sides that the product region is inside contracted
Amount is big.
Further, the product region is rectangle or non-rectangle.
Further, the injection molding cavity is located at the first substrate towards the side of the second substrate, or, the note
Mould chamber and be located at the second substrate towards the side of the first substrate.
A kind of processing method of light guide plate, comprises the following steps：
Step 1: providing the injection mold of above-mentioned light guide plate motherboard；
Step 2: toward injection light guide panel material in the injection molding cavity of the injection mold of the light guide plate motherboard, being obtained after cooling guide-lighting
Plate motherboard, wherein, the part that the light guide plate motherboard corresponds to product region is guide-lighting board finished product, corresponding to the portion of scrap area
It is divided into guide-lighting board waste material；
Step 3: cutting away the guide-lighting board waste material on the light guide plate motherboard, guide-lighting board finished product is obtained.
Further, the light guide plate removed on the light guide plate motherboard is cut or is cut by laser by cutter in step 3
Waste material.
Further, before step 3 is carried out, first the light guide plate motherboard is fixed on the objective table of cutting machine.
Further, the cutter uses diamond material.
Further, the cutter is connected with heat power supply device.
Further, in addition to step 4：The cut surface of the guide-lighting board finished product is processed by shot blasting.
The present invention has the advantages that：The injection mold and processing method be first molded to be formed with guide-lighting board finished product and
The guide-lighting two-part light guide plate motherboard of board waste material, the guide-lighting board finished product injection when alignd with the cavity wall of the injection molding cavity one
Face as incidence surface be blocked piece masking, other three faces, which are connected and cut with the guide-lighting board waste material, to be removed, the light guide plate into
The display effect of product can be just effectively improved, and meet the requirement that full screen scanning detects brightness uniformity.
Brief description of the drawings
The injection molding cavity schematic diagram of the injection mold for the light guide plate motherboard that Fig. 1 provides for the present invention；
The schematic diagram for the light guide plate motherboard that Fig. 2 provides for the present invention；
The sectional view of the injection mold for the light guide plate motherboard that Fig. 3 provides for the present invention；
The sectional view of another injection mold for the light guide plate motherboard that Fig. 4 provides for the present invention；
The schematic diagram for the guide-lighting board finished product of circular arc light guide plate motherboard and circular arc that Fig. 5 provides for the present invention；
The step schematic diagram of the processing method for the light guide plate that Fig. 6 provides for the present invention；
Side schematic view when being cut in the processing method for the light guide plate that Fig. 7 provides for the present invention to light guide plate motherboard；
Top schematic diagram when being cut in the processing method for the light guide plate that Fig. 8 provides for the present invention to light guide plate motherboard.
Embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples.
Embodiment one
As Figure 1-4, a kind of injection mold of light guide plate motherboard, including the first substrate 1 and second substrate 2 being oppositely arranged,
Between the first substrate 1 and second substrate 2 with light guide plate motherboard 4 injection molding cavity 3 and with entering that the injection molding cavity 3 is connected
Glue mouthful 33；The injection molding cavity 3 includes product region 32 and scrap area 31, wherein one side and the injection molding cavity of the product region 32
3 cavity wall 34 is alignd, as the incidence surface 411 of guide-lighting board finished product 41, and cavity wall 34 of three sides than injection molding cavity 3 is inside contracted in addition, shape
Into scrap area 31；The glue-feeder 33 is connected with scrap area 31.
The light guide plate motherboard 4 formed after injection mold injection has two parts, as shown in Fig. 2 a part is corresponded to
The guide-lighting board finished product 41 of product region 32 a, part corresponds to the guide-lighting board waste material 42 of scrap area 31, the light guide plate into
The one side that product 41 align in injection with the cavity wall 34 of the injection molding cavity 3 is used as incidence surface 411, other three faces and the light guide plate
Waste material 42 is connected, now, and the stress undesirable aggregation of the light guide plate motherboard 4 is in the guide-lighting board waste material 42 and guide-lighting board finished product 41
Incidence surface 411 on, the guide-lighting board waste material 42 can carry out cutting after cooling and shaping and remove, and the guide-lighting board finished product 41 enters
Smooth surface 411 can be blocked piece masking in the backlight.So, the display effect of the guide-lighting board finished product 41 can just be obtained effectively
Improve, meet the requirement that full screen scanning detects brightness uniformity.
Because the stress unfavorable condition on one side with glue-feeder 33 can be more serious than other both sides, so, the finished product
One side that the glue-feeder 33 is connected in three sides that region 32 is inside contracted is bigger than the neck-in on other both sides.
The injection molding cavity 3 is located at the first substrate 1 towards the side of the second substrate 2, such as Fig. 3；Or, the note
Mould chamber 3 and be located at the second substrate 2 towards the side of the first substrate 1, such as Fig. 4.
Product region in the injection molding cavity of the injection mold of the present embodiment is rectangle, the conventional rectangular light guide plate for making
Finished product 41.
Embodiment two
A kind of injection mold of light guide plate motherboard, the difference of itself and embodiment one is the product region 32 in the injection molding cavity 3
To be non-rectangle, for making non-rectangle guide-lighting board finished product 41, include but is not limited to the leaded light of the shapes such as circle, ellipse, abnormity
Board finished product 41.The present embodiment is described further by taking circular light guide plate finished product 41 as an example.
As shown in figure 5, the incidence surface 411 of circular light guide plate finished product 41 is generally plane, in addition to incidence surface 411, other faces
It is circular arc, and plane is generally configured at the glue-feeder 33 of injection mold, it is ensured that injected plastics material is noted toward a direction
Enter, prevent that injection is uneven, but incidence surface 411 is because there is micro-structural to cannot act as glue-feeder 33, if directly pressing circular light guide plate
The size of finished product 41 is molded, then the side of the guide-lighting board finished product 41 after being molded has one section of planar junction at glue-feeder 33
Structure, the planar structure is not only useless, and when assembling backlight, can also take the inner space of backlight, reduce
Pasting area between the glue frame and anti-dazzling screen of backlight.
Therefore, first injection forms the light guide plate motherboard 4 of other side extensions, then other sides of light guide plate motherboard 4 are entered
Row cutting forms circular light guide plate finished product 41, and the plane problem of glue-feeder 33 of circular light guide plate finished product 41 can be solved well.
Embodiment three
As shown in fig. 6, a kind of processing method of light guide plate, comprises the following steps：
Step 1: providing the injection mold of the light guide plate motherboard 4 described in embodiment one or embodiment two；
Step 2: toward injection light guide panel material in the injection molding cavity 3 of the injection mold of the light guide plate motherboard 4, being led after cooling
Tabula rasa motherboard 4, wherein, the part that the light guide plate motherboard 4 corresponds to product region 32 is guide-lighting board finished product 41, corresponding to waste material
The part in region 31 is guide-lighting board waste material 42；
Step 3: cutting away the guide-lighting board waste material 42 on the light guide plate motherboard 4, guide-lighting board finished product 41 is obtained.
Cut or be cut by laser by cutter in step 3 or other cutting modes remove on the light guide plate motherboard 4
Guide-lighting board waste material 42；Before the cutting of step 3 is carried out, the light guide plate motherboard 4 is first fixed on to the objective table of cutting machine
On.
Preferably, as shown in FIG. 7 and 8, if the light guide plate motherboard 4 includes but is not limited to pass through on the objective table 5
Dry tap vacuum hole 51 carrys out negative-pressure adsorption on the objective table 5 of cutting machine, and is provided with protrusion position limiting structure on the carrier table 5
6, the relative position for limiting the light guide plate motherboard 4 can also further be placed with briquetting 7 on the light guide plate motherboard 4,
Increase stability of the light guide plate motherboard 4 in cutting.
If being cut according to cutter 8, the cutter 8 is preferably by diamond material, and when being cut, described
Cutter 8 is connected with heat power supply device, so that the cutter 8 is heated, and carries out fervent；The light guide plate motherboard 4, can when being cut
It is positioned at by modes such as negative-pressure adsorption and/or mechanical position limitations on Cutting platform.
After guide-lighting board finished product 41 is obtained, in addition to step 4：The cut surface of the guide-lighting board finished product 41 is polished
Processing.
Embodiment described above only expresses embodiments of the present invention, and it describes more specific and detailed, but can not
Therefore the limitation to the scope of the claims of the present invention is interpreted as, as long as the skill obtained using the form of equivalent substitution or equivalent transformation
Art scheme, all should fall within the scope and spirit of the invention.
Claims (10)
1. a kind of injection mold of light guide plate motherboard, it is characterised in that：Including the first substrate and second substrate being oppositely arranged, institute
State the injection molding cavity between first substrate and second substrate with light guide plate motherboard and the glue-feeder connected with the injection molding cavity；Institute
Injection molding cavity is stated including product region and scrap area, the product region wherein while alignd with the cavity wall of injection molding cavity, as
The incidence surface of guide-lighting board finished product, in addition cavity wall of three sides than injection molding cavity inside contract, formed scrap area；The glue-feeder and waste material
Regional connectivity.
2. the injection mold of light guide plate motherboard according to claim 1, it is characterised in that the product region inside contract three
One side that the glue-feeder is connected in side is bigger than the neck-in on other both sides.
3. the injection mold of light guide plate motherboard according to claim 1, it is characterised in that the product region be rectangle or
It is non-rectangle.
4. the injection mold of light guide plate motherboard according to claim 1, it is characterised in that the injection molding cavity is located at described the
One substrate towards the side of the second substrate, or, the injection molding cavity is located at the second substrate towards the first substrate
Side.
5. a kind of processing method of light guide plate, it is characterised in that comprise the following steps：
Step 1: providing the injection mold of any described light guide plate motherboard in claim 1-4；
Step 2: toward injection light guide panel material in the injection molding cavity of the injection mold of the light guide plate motherboard, being obtained after cooling guide-lighting
Plate motherboard, wherein, the part that the light guide plate motherboard corresponds to product region is guide-lighting board finished product, corresponding to the portion of scrap area
It is divided into guide-lighting board waste material；
Step 3: cutting away the guide-lighting board waste material on the light guide plate motherboard, guide-lighting board finished product is obtained.
6. the processing method of the light guide plate according to claim 5, it is characterised in that cut in step 3 by cutter
Or laser cutting removes the guide-lighting board waste material on the light guide plate motherboard.
7. the processing method of the light guide plate according to claim 5 or 6, it is characterised in that before step 3 is carried out, first
The light guide plate motherboard is fixed on the objective table of cutting machine.
8. the processing method of the light guide plate according to claim 6, it is characterised in that the cutter uses Buddha's warrior attendant stone material
Matter.
9. the processing method of light guide plate according to claim 6, it is characterised in that the cutter is connected with heat power supply device.
10. the processing method of light guide plate according to claim 5, it is characterised in that also including step 4：To the leaded light
The cut surface of board finished product is processed by shot blasting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710313113.0A CN107186959B (en) | 2017-05-05 | 2017-05-05 | A kind of processing method of light guide plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710313113.0A CN107186959B (en) | 2017-05-05 | 2017-05-05 | A kind of processing method of light guide plate |
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| Publication Number | Publication Date |
|---|---|
| CN107186959A true CN107186959A (en) | 2017-09-22 |
| CN107186959B CN107186959B (en) | 2019-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710313113.0A Active CN107186959B (en) | 2017-05-05 | 2017-05-05 | A kind of processing method of light guide plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108044705A (en) * | 2017-11-30 | 2018-05-18 | 江西合力泰科技有限公司 | A kind of high uniformity shields light guide plate and preparation method thereof comprehensively |
| CN109501137A (en) * | 2018-11-21 | 2019-03-22 | Oppo（重庆）智能科技有限公司 | Mold, light guide plate and its processing method, display screen and electronic equipment |
| CN109501135A (en) * | 2018-11-21 | 2019-03-22 | Oppo（重庆）智能科技有限公司 | Mold, light guide plate and its processing method, display screen and electronic equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204997924U (en) * | 2015-05-07 | 2016-01-27 | 厦门天马微电子有限公司 | Injection mould of light guide plate |
-
2017
- 2017-05-05 CN CN201710313113.0A patent/CN107186959B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204997924U (en) * | 2015-05-07 | 2016-01-27 | 厦门天马微电子有限公司 | Injection mould of light guide plate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108044705A (en) * | 2017-11-30 | 2018-05-18 | 江西合力泰科技有限公司 | A kind of high uniformity shields light guide plate and preparation method thereof comprehensively |
| CN109501137A (en) * | 2018-11-21 | 2019-03-22 | Oppo（重庆）智能科技有限公司 | Mold, light guide plate and its processing method, display screen and electronic equipment |
| CN109501135A (en) * | 2018-11-21 | 2019-03-22 | Oppo（重庆）智能科技有限公司 | Mold, light guide plate and its processing method, display screen and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107186959B (en) | 2019-06-25 |
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