CN107172855A - The method and electronic equipment of electronic equipment dissipating heat - Google Patents
The method and electronic equipment of electronic equipment dissipating heat Download PDFInfo
- Publication number
- CN107172855A CN107172855A CN201710378058.3A CN201710378058A CN107172855A CN 107172855 A CN107172855 A CN 107172855A CN 201710378058 A CN201710378058 A CN 201710378058A CN 107172855 A CN107172855 A CN 107172855A
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- China
- Prior art keywords
- cover
- electronic equipment
- heat radiation
- contact
- module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The disclosure is directed to the method for a kind of electronic equipment radiating and electronic equipment, for improving electronic equipment dissipating heat efficiency, reduce powder consumption of electronic equipment and noise.Methods described includes：Detect the electronic equipment drain pan D cover whether with human contact；The electronic equipment D cover and human body not in contact with when, control the D cover to be connected with the heat radiation module.
Description
Technical field
This disclosure relates to technical field of electronic equipment, more particularly to electronic equipment dissipating heat method and electronic equipment.
Background technology
With continuing to develop for electronics assembly technology, the volume of electronic equipment tends to miniaturization, and system tends to complicate, high
Heat density is into one irresistible development trend.In order to adapt to the demand of high heat density, the radiating hand of fan, radiator etc.
Section has become the standard configuration of electronic equipment, such as Desktop PC, notebook etc..Constantly weed out the old and bring forth the new, the radiating side of novel and high-efficiency
Method emerges in an endless stream.
Radiator is located at electronic equipment internal, the bottom surface (D- that heat is passed through into electronic equipment by air transmitted mode
Cover) conduct, but in the case of radiator fan off-duty, the scattered efficiency of passive radiating of radiator is low；In radiation air
Need that in consumption power supply, and fan running noise can be produced in the case of fan operation, radiator fan is that electronic equipment is whole
The main source of machine noise.
The content of the invention
To overcome problem present in correlation technique, the method and electronics that the disclosure provides a kind of electronic equipment radiating are set
It is standby.
According to the first aspect of the embodiment of the present disclosure there is provided the method that a kind of electronic equipment radiates, including：
Detect the electronic equipment drain pan D-cover whether with human contact；
The electronic equipment D-cover and human body not in contact with when, control the D-cover to connect with the heat radiation module
Connect.
The technical scheme provided by this disclosed embodiment can include the following benefits：Set by detecting the electronics
Standby D-cover and human body not in contact with when, control the D-cover to be connected with the heat radiation module, so due to heat radiation module
It is connected with the D-cover of electronic equipment, it is not necessary to passive by air transmitted heat, heat directly can be passed through into D-
Cover is conducted, and improves the conduction efficiency of heat radiation module heat, so can postpone radiator fan active heat removal when
Between, the power consumption of electronic equipment can be saved and the purpose of noise is reduced.
In one embodiment, methods described also includes：
In the D-cover and human contact of the electronic equipment, the D-cover and the radiating mould component are controlled
From.
The technical scheme provided by this disclosed embodiment can include the following benefits：By in the electronic equipment
Control the D-cover to be separated with the heat radiation module when D-cover is with human contact, thereby may be ensured that radiating module passes through
D-cover causes discomfort when conducting heat to human body.
In one embodiment, methods described also includes：
Detect whether the temperature of the D-cover exceedes preset temperature；
In the D-cover and human contact of the electronic equipment, the D-cover is controlled to be separated with the heat radiation module
Including：
When the D-cover of the electronic equipment exceedes preset temperature with human contact and the D-cover temperature, control
The D-cover is made to separate with the heat radiation module.
The technical scheme provided by this disclosed embodiment can include the following benefits：By detecting the D-cover
Temperature with avoid radiating module by D-cover conduct heat when discomfort is caused to human body, while can also extend as far as possible
The time of heat is conducted by D-cover.
In one embodiment, whether the D-cover of the detection electronic equipment includes with human contact：
By sensor detect the electronic equipment D-cover whether with human contact.
In one embodiment, the electronic equipment control the D-cover be connected with the heat radiation module including:
The electronic equipment controls the D-cover with the heat radiation module by magnetic-adsorption, or passes through machinery hinge
Chain is connected.
According to the second aspect of the embodiment of the present disclosure there is provided a kind of electronic equipment, including：
Human detection module, for detect the electronic equipment drain pan D-cover whether with human contact；
Link control module, for the D-cover in the electronic equipment and human body not in contact with when, control the D-
Cover is connected with the heat radiation module.
In one embodiment, the electronic equipment also includes：
Control module is separated, in the D-cover and human contact of the electronic equipment, controlling the D-cover
Separated with the heat radiation module.
In one embodiment, the electronic equipment also includes：
Temperature detecting module, for detecting whether the temperature of the D-cover exceedes preset temperature；
The separation control module, is additionally operable to the D-cover and human contact and the D-cover in the electronic equipment
Temperature when exceeding preset temperature, control the D-cover to be separated with the heat radiation module.
In one embodiment, the human detection module, is additionally operable to detect the D- of the electronic equipment by sensor
Cover whether with human contact.
In one embodiment, the link control module, is additionally operable to not connect with human body in the D-cover of the electronic equipment
When touching, the D-cover is controlled to be connected with the heat radiation module by magnetic-adsorption, or by mechanical hinge.
According to the third aspect of the embodiment of the present disclosure there is provided a kind of electronic equipment, including：
Processor；
Memory for storing processor-executable instruction；
Wherein, the processor is configured as：
Detect the electronic equipment D-cover whether with human contact；
The electronic equipment D-cover and human body not in contact with when, control the D-cover to connect with the heat radiation module
Connect.
According to the fourth aspect of the embodiment of the present disclosure there is provided a kind of computer-readable recording medium, calculating is stored thereon with
Machine program, it is characterised in that the program realizes following steps when being executed by processor：
Detect the electronic equipment D-cover whether with human contact；
The electronic equipment D-cover and human body not in contact with when, control the D-cover to connect with the heat radiation module
Connect.
It should be appreciated that the general description of the above and detailed description hereinafter are only exemplary and explanatory, not
The disclosure can be limited.
Brief description of the drawings
Accompanying drawing herein is merged in specification and constitutes the part of this specification, shows the implementation for meeting the disclosure
Example, and be used to together with specification to explain the principle of the disclosure.
Fig. 1 is the flow chart of the method for a kind of electronic equipment radiating according to an exemplary embodiment.
Fig. 2 is the flow chart of the method for a kind of electronic equipment radiating according to an exemplary embodiment.
Fig. 3 is the flow chart of the method for a kind of electronic equipment radiating according to an exemplary embodiment.
Fig. 4 is the block diagram of a kind of electronic equipment according to an exemplary embodiment.
Fig. 5 is the block diagram of a kind of electronic equipment according to an exemplary embodiment.
Fig. 6 is the block diagram of a kind of electronic equipment according to an exemplary embodiment.
Fig. 7 is a kind of block diagram of device according to an exemplary embodiment.
Embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Following description is related to
During accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous key element.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the disclosure.On the contrary, they be only with it is such as appended
The example of the consistent apparatus and method of some aspects be described in detail in claims, the disclosure.
In view of the passive D-cover that electronic equipment is conducted heat to by air flow of heat radiation module, then passes through
The radiating efficiency that D-cover conducts heat to outside is low, and is conducted by the heat by heat radiation module of radiator fan active
To D-cover, the problem of causing electronic device energy consumption to increase and produce noise, present disclose provides a kind of electronic equipment radiating
Method, it is intended to by detect the D-cover of the electronic equipment and human body not in contact with when, control the D-cover with it is described
Heat radiation module is connected, so because heat radiation module is connected with the D-cover of electronic equipment, it is not necessary to which passive is passed by air
Heat conduction amount, heat can be conducted directly, improve the conduction efficiency of heat radiation module heat, Jin Erke by D-cover
To postpone the time of radiator fan active heat removal, the power consumption of electronic equipment can be saved and the purpose of noise is reduced.
Fig. 1 is the flow chart of the method for a kind of electronic equipment radiating according to an exemplary embodiment, such as Fig. 1 institutes
Show, this method can be realized by electronic equipment, be comprised the following steps：
S101, the detection electronic equipment drain pan D-cover whether with human contact.
S102, the electronic equipment D-cover and human body not in contact with when, control the D-cover and the radiating
Module is connected.
In one exemplary embodiment, the electronic equipment can detect the D- of the electronic equipment by sensor
Cover whether with human contact, can for example be detected by human body sensor the electronic equipment D-cover whether with human body
Contact, can also detect the pressure that the D-cover of the electronic equipment is born, and then judge the electricity by pressure sensor
The D-cover of sub- equipment whether with human contact.
In one embodiment, the electronic equipment can be set " the control D-cover is connected with the heat radiation module "
Physics indicating mode.When the electronic equipment is provided with the physics of " the control D-cover is connected with the heat radiation module "
After instruction, the electronic equipment D-cover and human body not in contact with when, then can control the D-cover and the radiating
Module is connected.
In one embodiment, the electronic equipment can be set " the control D-cover is connected with the heat radiation module "
Software indicating mode.When the electronic equipment is provided with the software of " the control D-cover is connected with the heat radiation module "
After instruction, the electronic equipment D-cover and human body not in contact with when, then can control the D-cover and the radiating
Module is connected.
In one exemplary embodiment, the electronic equipment control the D-cover to be connected with the heat radiation module can be with
The mode such as control by magnetic-adsorption, or by mechanical hinge.
It should be noted that for realizing the mode that D-cover is connected with the heat radiation module, having many in the prior art
Implementation is planted, the application is intended to improve the radiating efficiency of heat radiation module by way of D-cover is connected with the module, subtracted
Small electronic appliances power consumption and noise, for specifically which kind of mode to realize the connection between D-cover and heat radiation module using, this
Application is not specifically limited.
Fig. 2 is the flow chart of the method for a kind of electronic equipment radiating according to an exemplary embodiment, such as Fig. 2 institutes
Show, this method includes：
S201, the detection electronic equipment D-cover whether with human contact.
S202, the electronic equipment D-cover and human body not in contact with when, control the D-cover and the radiating
Module is connected.
S203, in the D-cover and human contact of the electronic equipment, control the D-cover and the radiating mould
Group separation.
In order to avoid heat radiation module improves radiating efficiency by D-cover and causes D-cover temperature high and causes human body
Discomfort, in the D-cover and human contact of the electronic equipment, then controls the D-cover to be separated with the heat radiation module.
Fig. 3 is the flow chart of the method for a kind of electronic equipment radiating according to an exemplary embodiment, such as Fig. 3 institutes
Show, this method includes：
S301, the detection electronic equipment D-cover whether with human contact.
Whether S302, detection D-cover temperature exceed preset temperature.
S303, the electronic equipment D-cover and human contact and the D-cover temperature exceed preset temperature
When, control the D-cover to be separated with the heat radiation module.
In order to avoid heat radiation module improves radiating efficiency by D-cover and causes D-cover temperature high and causes human body
Discomfort, in the D-cover and human contact of the electronic equipment, then controls the D-cover to be separated with the heat radiation module,
But for that in advance D-cover may be controlled to be separated with heat radiation module in the case that temperature is not also very high under some scenes, can
The efficiency of heat radiation module can be influenceed, therefore, the present embodiment is it is determined that the temperature of the D-cover is just controlled when exceeding preset temperature
Make the D-cover to separate with the heat radiation module, so on the premise of avoiding causing discomfort to human body, while can be to dissipating
The increase rate of the thermal efficiency produces minor impact.
Fig. 4 is the schematic diagram of a kind of electronic equipment according to an exemplary embodiment.Reference picture 4, the device includes：
Human detection module 41, for detect the electronic equipment drain pan D-cover whether with human contact；
Link control module 42, for the D-cover in the electronic equipment and human body not in contact with when, control the D-
Cover is connected with the heat radiation module.
In one embodiment, as shown in figure 5, the electronic equipment also includes：
Control module 43 is separated, in the D-cover and human contact of the electronic equipment, controlling the D-
Cover is separated with the heat radiation module.
In one embodiment, as shown in fig. 6, the electronic equipment also includes：
Temperature detecting module 44, for detecting whether the temperature of the D-cover exceedes preset temperature；
The separation control module 43, is additionally operable to the D-cover and human contact and the D- in the electronic equipment
When cover temperature exceedes preset temperature, the D-cover is controlled to be separated with the heat radiation module.
In one embodiment, the human detection module 41, is additionally operable to detect the D- of the electronic equipment by sensor
Cover whether with human contact.
On the device in above-described embodiment, wherein modules perform the concrete mode of operation in relevant this method
Embodiment in be described in detail, explanation will be not set forth in detail herein.
Fig. 7 is the block diagram of a kind of electronic equipment 700 according to an exemplary embodiment.For example, device 700 can be
Mobile phone, computer, digital broadcast terminal, messaging devices, game console, tablet device, Medical Devices, body-building is set
It is standby, personal digital assistant etc..
Reference picture 7, device 700 can include following one or more assemblies：Processing assembly 702, memory 704, power supply
Component 706, multimedia groupware 708, audio-frequency assembly 710, the interface 712 of input/output (I/O), sensor cluster 714, and
Communication component 716.
The integrated operation of the usual control device 700 of processing assembly 702, such as with display, call, data communication, phase
Machine operates the operation associated with record operation.Processing assembly 702 can refer to including one or more processors 720 to perform
Order, to complete all or part of step of above-mentioned method.In addition, processing assembly 702 can include one or more modules, just
Interaction between processing assembly 702 and other assemblies.For example, processing assembly 702 can include multi-media module, it is many to facilitate
Interaction between media component 708 and processing assembly 702.
Memory 704 is configured as storing various types of data supporting the operation in device 700.These data are shown
Example includes the instruction of any application program or method for being operated on device 700, and contact data, telephone book data disappears
Breath, picture, video etc..Memory 704 can be by any kind of volatibility or non-volatile memory device or their group
Close and realize, such as static RAM (SRAM), Electrically Erasable Read Only Memory (EEPROM) is erasable to compile
Journey read-only storage (EPROM), programmable read only memory (PROM), read-only storage (ROM), magnetic memory, flash
Device, disk or CD.
Power supply module 706 provides power supply for the various assemblies of device 700.Power supply module 706 can include power management system
System, one or more power supplys, and other components associated with generating, managing and distributing power supply for device 700.
Multimedia groupware 708 is included in the screen of one output interface of offer between described device 700 and user.One
In a little embodiments, screen can include liquid crystal display (LCD) and touch panel (TP).If screen includes touch panel, screen
Curtain may be implemented as touch-screen, to receive the input signal from user.Touch panel includes one or more touch sensings
Device is with the gesture on sensing touch, slip and touch panel.The touch sensor can not only sensing touch or sliding action
Border, but also detection touches or slide related duration and pressure with described.In certain embodiments, many matchmakers
Body component 708 includes a front camera and/or rear camera.When device 700 be in operator scheme, such as screening-mode or
During video mode, front camera and/or rear camera can receive the multi-medium data of outside.Each front camera and
Rear camera can be a fixed optical lens system or with focusing and optical zoom capabilities.
Audio-frequency assembly 710 is configured as output and/or input audio signal.For example, audio-frequency assembly 710 includes a Mike
Wind (MIC), when device 700 be in operator scheme, when such as call model, logging mode and speech recognition mode, microphone by with
It is set to reception external audio signal.The audio signal received can be further stored in memory 704 or via communication set
Part 716 is sent.In certain embodiments, audio-frequency assembly 710 also includes a loudspeaker, for exports audio signal.
I/O interfaces 712 is provide interface between processing assembly 702 and peripheral interface module, above-mentioned peripheral interface module can
To be keyboard, click wheel, button etc..These buttons may include but be not limited to：Home button, volume button, start button and lock
Determine button.
Sensor cluster 714 includes one or more sensors, and the state for providing various aspects for device 700 is commented
Estimate.For example, sensor cluster 714 can detect opening/closed mode of device 700, the relative positioning of component is for example described
Component is the display and keypad of device 700, and sensor cluster 714 can be with detection means 700 or a group of device 700
The position of part changes, the existence or non-existence that user contacts with device 700, the orientation of device 700 or acceleration/deceleration and device 700
Temperature change.Sensor cluster 714 can include proximity transducer, be configured to examine in not any physical contact
Survey the presence of object nearby.Sensor cluster 714 can also include optical sensor, such as CMOS or ccd image sensor, for
Used in imaging applications.In certain embodiments, the sensor cluster 714 can also include acceleration transducer, and gyroscope is passed
Sensor, Magnetic Sensor, pressure sensor or temperature sensor.
Communication component 716 is configured to facilitate the communication of wired or wireless way between device 700 and other equipment.Device
700 can access the wireless network based on communication standard, such as WiFi, 2G or 3G, or combinations thereof.In an exemplary implementation
In example, communication component 716 receives broadcast singal or broadcast related information from external broadcasting management system via broadcast channel.
In one exemplary embodiment, the communication component 716 also includes near-field communication (NFC) module, to promote junction service.Example
Such as, NFC module can be based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra wide band (UWB) technology,
Bluetooth (BT) technology and other technologies are realized.
In the exemplary embodiment, device 700 can be believed by one or more application specific integrated circuits (ASIC), numeral
Number processor (DSP), digital signal processing appts (DSPD), PLD (PLD), field programmable gate array
(FPGA), controller, microcontroller, microprocessor or other electronic components are realized, for performing the above method.
In the exemplary embodiment, a kind of non-transitorycomputer readable storage medium including instructing, example are additionally provided
Such as include the memory 704 of instruction, above-mentioned instruction can be performed to complete the above method by the processor 720 of device 700.For example,
The non-transitorycomputer readable storage medium can be ROM, random access memory (RAM), CD-ROM, tape, floppy disk
With optical data storage devices etc..
A kind of electronic equipment, including：
Processor；
Memory for storing processor-executable instruction；
Wherein, the processor is configured as：
Detect the electronic equipment D-cover whether with human contact；
The electronic equipment D-cover and human body not in contact with when, control the D-cover to connect with the heat radiation module
Connect.
The processor can be additionally configured to：
In the D-cover and human contact of the electronic equipment, the D-cover and the radiating mould component are controlled
From.
The processor can be additionally configured to：
Detect whether the temperature of the D-cover exceedes preset temperature；
In the D-cover and human contact of the electronic equipment, the D-cover is controlled to be separated with the heat radiation module
Including：
When the D-cover of the electronic equipment exceedes preset temperature with human contact and the D-cover temperature, control
The D-cover is made to separate with the heat radiation module.
The processor can be additionally configured to：
Whether the D-cover of the detection electronic equipment includes with human contact：
By sensor detect the electronic equipment D-cover whether with human contact.
A kind of computer-readable recording medium, when the instruction in the storage medium is by the computing device of mobile terminal
When so that the method that mobile terminal is able to carry out a kind of electronic equipment radiating, methods described includes：
Detect the electronic equipment D-cover whether with human contact；
The electronic equipment D-cover and human body not in contact with when, control the D-cover to connect with the heat radiation module
Connect.
Instruction in the storage medium can also include：
In the D-cover and human contact of the electronic equipment, the D-cover and the radiating mould component are controlled
From.
Instruction in the storage medium can also include：
Detect whether the temperature of the D-cover exceedes preset temperature；
In the D-cover and human contact of the electronic equipment, the D-cover is controlled to be separated with the heat radiation module
Including：
When the D-cover of the electronic equipment exceedes preset temperature with human contact and the D-cover temperature, control
The D-cover is made to separate with the heat radiation module.
Instruction in the storage medium can also include：
Whether the D-cover of the detection electronic equipment includes with human contact：
By sensor detect the electronic equipment D-cover whether with human contact.
Those skilled in the art will readily occur to its of the disclosure after considering specification and putting into practice invention disclosed herein
Its embodiment.The application is intended to any modification, purposes or the adaptations of the disclosure, these modifications, purposes or
Person's adaptations follow the general principle of the disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as exemplary, and the true scope of the disclosure and spirit are by following
Claim is pointed out.
It should be appreciated that the precision architecture that the disclosure is not limited to be described above and is shown in the drawings, and
And various modifications and changes can be being carried out without departing from the scope.The scope of the present disclosure is only limited by appended claim.
Claims (12)
1. the method for a kind of electronic equipment radiating, it is characterised in that this method includes：
Detect the electronic equipment drain pan D-cover whether with human contact；
The electronic equipment D-cover and human body not in contact with when, control the D-cover to be connected with the heat radiation module.
2. according to the method described in claim 1, it is characterised in that methods described also includes：
In the D-cover and human contact of the electronic equipment, the D-cover is controlled to be separated with the heat radiation module.
3. method according to claim 2, it is characterised in that methods described also includes：
Detect whether the temperature of the D-cover exceedes preset temperature；
In the D-cover and human contact of the electronic equipment, the D-cover is controlled to separate bag with the heat radiation module
Include：
When the D-cover of the electronic equipment exceedes preset temperature with human contact and the D-cover temperature, institute is controlled
D-cover is stated to separate with the heat radiation module.
4. according to the method described in claim 1, it is characterised in that the D-cover of the detection electronic equipment whether with
Human contact includes：
By sensor detect the electronic equipment D-cover whether with human contact.
5. according to the method described in claim 1, it is characterised in that the electronic equipment controls the D-cover to be dissipated with described
Thermal module connection includes:
The electronic equipment controls the D-cover to connect with the heat radiation module by magnetic-adsorption, or by mechanical hinge
Connect.
6. a kind of electronic equipment, it is characterised in that the electronic equipment includes：
Human detection module, for detect the electronic equipment drain pan D-cover whether with human contact；
Link control module, for the D-cover in the electronic equipment and human body not in contact with when, control the D-cover with
The heat radiation module connection.
7. electronic equipment according to claim 6, it is characterised in that the electronic equipment also includes：
Control module is separated, in the D-cover and human contact of the electronic equipment, controlling the D-cover and institute
State heat radiation module separation.
8. electronic equipment according to claim 7, it is characterised in that the electronic equipment also includes：
Temperature detecting module, for detecting whether the temperature of the D-cover exceedes preset temperature；
The separation control module, is additionally operable to the temperature in the D-cover and human contact and the D-cover of the electronic equipment
When degree exceedes preset temperature, the D-cover is controlled to be separated with the heat radiation module.
9. electronic equipment according to claim 6, it is characterised in that the human detection module, is additionally operable to by sensing
Device detect the electronic equipment D-cover whether with human contact.
10. electronic equipment according to claim 6, it is characterised in that the link control module, in the electronics
The D-cover of equipment and human body not in contact with when, control the D-cover to pass through magnetic-adsorption, Huo Zhetong with the heat radiation module
Cross mechanical hinge connection.
11. a kind of electronic equipment, it is characterised in that including：
Processor；
Memory for storing processor-executable instruction；
Wherein, the processor is configured as：
Detect the electronic equipment drain pan D-cover whether with human contact；
The electronic equipment D-cover and human body not in contact with when, control the D-cover to be connected with the heat radiation module.
12. a kind of computer-readable recording medium, is stored thereon with computer program, it is characterised in that the program is by processor
Following steps are realized during execution：
Detect the electronic equipment drain pan D-cover whether with human contact；
The electronic equipment D-cover and human body not in contact with when, control the D-cover to be connected with the heat radiation module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710378058.3A CN107172855A (en) | 2017-05-24 | 2017-05-24 | The method and electronic equipment of electronic equipment dissipating heat |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710378058.3A CN107172855A (en) | 2017-05-24 | 2017-05-24 | The method and electronic equipment of electronic equipment dissipating heat |
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