CN107168492B - Information processing method and electronic equipment - Google Patents
Information processing method and electronic equipment Download PDFInfo
- Publication number
- CN107168492B CN107168492B CN201710200538.0A CN201710200538A CN107168492B CN 107168492 B CN107168492 B CN 107168492B CN 201710200538 A CN201710200538 A CN 201710200538A CN 107168492 B CN107168492 B CN 107168492B
- Authority
- CN
- China
- Prior art keywords
- switch
- state
- assembly
- component
- parameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
Abstract
The invention discloses an information processing method, a heat dissipation device and electronic equipment, wherein the heat dissipation device comprises: the device comprises a first assembly, a second assembly connected with the first assembly and a switch; the first assembly is used for receiving heat conducted by a heat source of the electronic equipment and dissipating heat based on a heat conduction mode; the switch is used for controlling the second component to generate airflow for absorbing heat conducted by the first component in the first air channel based on the rotation of the blade when the switch is in a first state, and the generated airflow is transmitted to the outside of the electronic equipment; the first gas channel is a space formed by the switch, the first assembly and the shell of the electronic equipment when the switch is in a first state; the switch is further used for controlling the second assembly to generate airflow for absorbing heat in the first assembly based on the rotation of the blade when the switch is in the second state, and the generated airflow is transmitted to the outside of the electronic equipment through the air channel of the first assembly.
Description
Technical Field
The present invention relates to information processing technologies, and in particular, to an information processing method and an electronic device.
Background
With the development of thinning and lightening of the notebook, the distance between the heat dissipation fins and the heat pipe area in the notebook and the D surface (D-cover) of the notebook is smaller and smaller, and the temperature of the D-cover is higher and higher. To lower the temperature of the heat sink fins and the surface D of the heat pipe area, the temperature of the fins must be lowered, so that high performance copper fins are necessary, which increases the cost; alternatively, the temperature is decreased by adding a thermal diffusion material, as shown in fig. 1, however, the thermal diffusion material only diffuses the temperature in this area, resulting in a generally higher temperature in this area.
Disclosure of Invention
The embodiment of the invention provides an information processing method and electronic equipment, which can realize rapid cooling of the electronic equipment and have low cost and good effect.
The technical scheme of the embodiment of the invention is realized as follows:
an embodiment of the present invention provides a heat dissipation apparatus, including: the device comprises a first assembly, a second assembly connected with the first assembly and a switch; wherein the content of the first and second substances,
the first component is used for receiving heat conducted by a heat source of the electronic equipment, and heat dissipation is carried out in the first component based on a heat conduction mode;
the switch is used for controlling the second component to generate airflow for absorbing heat conducted by the first component in the first gas channel based on the rotation of the blade when the switch is in a first state, and transmitting the generated airflow to the outside of the electronic equipment; the first gas channel is a space formed by the switch, the first assembly and the shell of the electronic equipment when the switch is in a first state;
the switch is further used for controlling the second assembly to generate airflow for absorbing heat in the first assembly based on the rotation of the blade when the switch is in a second state, and the generated airflow is transmitted to the outside of the electronic equipment through the air channel of the first assembly.
In the above scheme, the first state is a state of the switch when a first parameter representing a temperature of the first component and/or a second parameter representing a blade rotation speed of the second component meet a preset condition;
the second state is a state of the switch when the first parameter and/or the second parameter do not satisfy the preset condition.
In the above solution, the switch is further configured to control the second component to generate an airflow for absorbing heat conducted by the first component in the first gas channel based on rotation of the blade by using a specific switch angle when the switch is in the first state, and to transfer the generated airflow to the outside of the electronic device;
wherein the particular switch angle corresponds to the first parameter or the second parameter.
In the above solution, the heat dissipation device further includes:
a third component for generating a gas flow for absorbing heat conducted by the first component in a second gas passage based on a rotation of a blade when the switch is in the second state, and transferring the generated gas flow to the outside of the electronic apparatus;
the second gas channel is a space formed by the switch, the first component and the shell of the electronic device when the switch is in the second state.
In the above scheme, the switch is composed of a rotating shaft located at one end of the second component and a blocking piece with one end connected with the rotating shaft.
The embodiment of the invention also provides an information processing method which is applied to a heat dissipation device, wherein the heat dissipation device comprises: the heat dissipation device comprises a first assembly, a second assembly and a switch, wherein the first assembly is used for receiving heat conducted by a heat source of electronic equipment and dissipating heat based on a heat conduction mode; the method comprises the following steps:
acquiring a state judgment parameter of the switch; the state judgment parameter comprises at least one of a first parameter representing the temperature of the first assembly and a second parameter representing the rotating speed of the blade of the second assembly;
controlling the switch to be in a first state based on the state judgment parameter, controlling the second component to generate airflow for absorbing heat conducted by the first component in the first gas channel based on the rotation of the blade, and transmitting the generated airflow to the outside of the electronic equipment; the first gas channel is a space formed by the switch, the first assembly and the shell of the electronic equipment when the switch is in a first state;
or controlling the switch to be in a second state, and controlling the second assembly to generate a gas flow for absorbing heat in the first assembly based on the rotation of the blade, and transmitting the generated gas flow to the outside of the electronic device through the gas passage of the first assembly.
In the above scheme, the method further comprises:
controlling the switch to be in a first state when a first parameter indicative of the temperature of the first component and/or a second parameter indicative of the rotational speed of the blades of the second component satisfy a preset condition;
and when the first parameter and/or the second parameter do not meet the preset condition, controlling the switch to be in a second state.
In the foregoing solution, when the switch is controlled to be in the first state based on the state determination parameter, the method further includes:
controlling the switch to control the second component to generate an airflow for absorbing heat conducted by the first component in the first gas channel based on blade rotation with a specific switch angle and to transfer the generated airflow to the outside of the electronic device;
wherein the particular switch angle corresponds to the first parameter or the second parameter.
In the above solution, the heat dissipation device further includes a third component; controlling the switch to be in a second state, the method further comprising:
controlling the third assembly to generate a gas flow for absorbing heat conducted by the first assembly in a second gas passage based on rotation of the blades and to transfer the generated gas flow to the outside of the electronic device;
the second gas channel is a space formed by the switch, the first component and the shell of the electronic device when the switch is in the second state.
An embodiment of the present invention further provides an electronic device, where the electronic device includes: a heat sink and a processor; wherein, heat abstractor includes: the heat dissipation device comprises a first assembly, a second assembly and a switch, wherein the first assembly is used for receiving heat conducted by a heat source of electronic equipment and dissipating heat based on a heat conduction mode;
the processor is used for acquiring the state judgment parameters of the switch; the state judgment parameter comprises at least one of a first parameter representing the temperature of the first assembly and a second parameter representing the rotating speed of the blade of the second assembly;
and controlling the switch to be in a first state based on the state judgment parameter, controlling the second component to generate airflow for absorbing heat conducted by the first component in the first gas channel based on the rotation of the blade, and transmitting the generated airflow to the outside of the electronic equipment; the first gas channel is a space formed by the switch, the first assembly and the shell of the electronic equipment when the switch is in a first state;
or controlling the switch to be in a second state, and controlling the second assembly to generate a gas flow for absorbing heat in the first assembly based on the rotation of the blade, and transmitting the generated gas flow to the outside of the electronic device through the gas passage of the first assembly.
According to the heat dissipation device, the electronic equipment and the information processing method provided by the embodiment of the invention, the state judgment parameter for judging the switch state is obtained, the switch state of the switch is further controlled, when the switch is in the first state, the second component is controlled to generate the airflow for absorbing the heat conducted by the first component in the first gas channel based on the rotation of the blade, and the generated airflow is transmitted to the outside of the electronic equipment. Therefore, a channel for transmitting and absorbing heat airflow is equivalently added in the electronic equipment, the cooling speed of the electronic equipment is accelerated, and the cooling device is low in cost and good in effect.
Drawings
FIG. 1 is a schematic diagram of a heat dissipation structure of an electronic device with an added thermal diffusion material;
FIG. 2 is a first schematic structural diagram of a heat dissipation device according to an embodiment of the present invention;
FIG. 3 is a first schematic view of a heat dissipation device disposed in an electronic apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a heat dissipation structure of an electronic device with the thermal diffusion material removed;
FIG. 5 is a schematic diagram of a second exemplary embodiment of a heat dissipation device disposed in an electronic device;
FIG. 6 is a third schematic view of a heat dissipation device disposed in an electronic apparatus according to an embodiment of the present invention;
FIG. 7 is a second schematic view of a heat dissipation device according to an embodiment of the present invention;
fig. 8 is a fourth schematic structural diagram illustrating a heat dissipation device in an electronic device according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a heat dissipation device in an electronic apparatus according to an embodiment of the present invention;
FIG. 10 is a flowchart illustrating an information processing method according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the figures and specific examples.
It should be noted that the terms "first \ second \ third" related to the embodiments of the present invention are merely used for distinguishing similar objects, and do not represent a specific ordering for the objects, and it should be understood that "first \ second \ third" may exchange a specific order or sequence order if allowed. It should be understood that the terms first, second, and third, as used herein, are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in other sequences than those illustrated or otherwise described herein.
Fig. 2 is a schematic structural diagram of a heat dissipation device in an embodiment of the present invention, and as shown in fig. 2, an electronic apparatus in an embodiment of the present invention includes: a first component 11, a second component 12 connected with the first component, and a switch 13; wherein the content of the first and second substances,
the first component 11 is configured to receive heat conducted by a heat source of the electronic device, and dissipate heat in the first component based on a heat conduction manner; in practical applications, the first component may be a heat sink and a heat pipe connected to a heat source of the electronic device, and the heat of the heat source is conducted based on the heat conduction performance of the heat sink and the heat pipe.
The switch 13 is used for controlling the second component 12 to generate an air flow for absorbing heat conducted by the first component 11 in the first air channel based on the rotation of the blade and transmitting the generated air flow to the outside of the electronic device when the switch is in the first state; the first gas channel is a space formed by the switch, the first component 11 and the shell of the electronic device when the switch is in the first state;
in one embodiment, the second component 12 may be a fan in an electronic device; the switch 13 may be composed of a rotating shaft at one end of the second assembly and a blocking piece with one end connected with the rotating shaft; the rotation shaft rotates to drive the blocking piece to rotate (open/close), and then the mode of cooling the electronic equipment is controlled.
In an embodiment, the first state is a state in which the switch 13 is "on", as shown in fig. 3, and the first state is a state of the switch when a first parameter indicative of the temperature of the first component and/or a second parameter indicative of the rotational speed of the blades of the second component satisfy a preset condition; that is, in practical implementation, the condition for determining whether to open the switch may be based on one parameter (e.g., based on only the first parameter) or two parameters (e.g., the first parameter and the second parameter), and one example is: determining that the condition that the switch is in the first state/the second state (i.e., the on/off state) is based on the first parameter, and when the temperature of the first component reaches a preset temperature threshold (which may be specifically set according to an actual condition, such as 50 °), determining that the first parameter representing the temperature of the first component meets the preset condition, that is, the condition that the switch is turned on is met; and when the condition for judging that the switch is in the first state/the second state (i.e. the on/off state) is based on the second parameter, when the rotating speed of the blades of the second assembly reaches a preset rotating speed threshold (which can be specifically set according to the actual condition, such as 4700rpm), determining that the second parameter representing the rotating speed of the blades of the second assembly meets the preset condition, that is, the condition for opening the switch is met.
In the embodiment of the present invention, no thermal diffusion material exists above the D-side housing of the electronic device, i.e., the thermal diffusion material in the electronic device is removed, so that a certain air space (gap) is generated between the D-side of the electronic device and the heat dissipation fins and the heat pipe region, as shown in fig. 4. When the switch is in the first state, i.e. the switch is open, the switch, the first component 11 and the housing (D-side) of the electronic device form a certain gas space, and the formed gas space is the first gas channel. In practical implementation, when the switch is turned on, the fan is controlled to generate air flow for absorbing heat conducted by the heat dissipation fins and the heat pipe in the first air channel based on rotation of the fan blades, and the generated air flow is transmitted to the outside of the electronic device through the first air channel, so that the surface temperature of the electronic device is reduced. Therefore, the embodiment of the invention adds the heat dissipation gas channel on the basis that the fan radiates heat through the heat dissipation fins, so that when the temperature of a central processing unit of the electronic equipment is higher or the rotating speed of the fan is overhigh, the temperature of the electronic equipment is further reduced through the heat dissipation gas channel, and the temperature reduction performance of the electronic equipment is enhanced.
The switch 13 is further configured to control the second assembly 12 to generate a gas flow for absorbing heat in the first assembly 11 based on the rotation of the blade and to transmit the generated gas flow to the outside of the electronic device through the gas passage of the first assembly 11 when the switch is in a second state (i.e., an "off" state) as shown in fig. 5.
Here, the second state is a state of the switch when the first parameter and/or the second parameter do not satisfy the preset condition; in one embodiment, the second state is the switch 13 being in the off state; for example: when the condition of judging whether to open the switch is based on first parameter and second parameter, then the temperature of first subassembly does not reach predetermined temperature threshold, and when the blade rotation speed of second subassembly does not reach predetermined rotational speed threshold, confirms first parameter and second parameter all do not satisfy the predetermined condition, the condition of opening is unsatisfied to the switch promptly, this moment first gas passage is in "closed" state, dispels the heat just to electronic equipment promptly and produces the air current that absorbs heat in the first subassembly based on the blade rotation through the second subassembly, and pass through produced air current the gas passage of first subassembly transmits to electronic equipment's outside. Another example is: when judging whether the switch is turned on or not based on the second parameter, when the rotating speed of the fan of the electronic equipment does not reach the preset rotating speed threshold value, the preset rotating speed condition is determined to be not met, namely the switch does not meet the turning-on condition, the switch is in an 'off' state, at the moment, the electronic equipment generates airflow for absorbing heat of the radiating fins and the heat pipe area through the rotation of the fan in the heat dissipation process, and the generated airflow is transmitted to the outside of the electronic equipment through the air channels of the radiating fins.
By applying the above embodiment of the present invention, when the preset first parameter and/or the second parameter meets the preset condition, the switch is in the first state (open state, as shown in fig. 3), and further the second component 12 is controlled to generate the airflow absorbing the heat conducted by the first component 11 in the first air channel based on the rotation of the blade, and transmit the generated airflow to the outside of the electronic device, that is, an air duct (i.e., the first air channel) is added, and the airflow absorbing the heat generated by the second component is transmitted from the air duct, so that the electronic device is cooled in a proper manner based on the load degree of the electronic device and other conditions, and the electronic device is low in cost and good in cooling effect.
Example two
Fig. 2 is a schematic structural diagram of a heat dissipation device in an embodiment of the present invention, fig. 6 is a schematic structural diagram of an embodiment of an electronic device with a heat dissipation device located therein, and with reference to fig. 2 and 6, the electronic device in an embodiment of the present invention includes: a first component 11, a second component 12 connected with the first component, and a switch 13; wherein the content of the first and second substances,
the first component 11 is configured to receive heat conducted by a heat source of the electronic device, and dissipate heat in the first component based on a heat conduction manner; in practical applications, the first component may be a heat sink and a heat pipe connected to a heat source of the electronic device, and the heat of the heat source is conducted based on the heat conduction performance of the heat sink and the heat pipe.
The switch 13 is used for controlling the second component 12 to generate an air flow for absorbing heat conducted by the first component 11 in the first air channel based on the rotation of the blade and transmitting the generated air flow to the outside of the electronic equipment when the switch is in a first state; the first gas channel is a space formed by the switch 13, the first component 11 and the shell of the electronic device when the switch is in a first state;
in the embodiment of the present invention, no thermal diffusion material exists above the D-side housing of the electronic device, i.e., the thermal diffusion material in the electronic device is removed, so that a certain air space (gap) is generated between the D-side of the electronic device and the heat dissipation fins and the heat pipe region, as shown in fig. 4.
In one embodiment, the switch 13 may be composed of a rotating shaft located at one end of the second component, and a blocking piece connected to the rotating shaft at one end; the rotation shaft rotates to drive the blocking piece to rotate (open/close), and then the mode of cooling the electronic equipment is controlled. In practical applications, the second component 12 may be a fan of an electronic device.
In one embodiment, the first state is a state in which the switch 13 is in an on state, and the first state is a state of the switch when a first parameter representing a temperature of the first component and/or a second parameter representing a rotational speed of a blade of the second component satisfies a preset condition; that is, in practical implementation, the condition for determining whether to open the switch may be based on one parameter (e.g., based on only the first parameter) or two parameters (e.g., the first parameter and the second parameter), for example: the condition for judging that the switch is in the first state/the second state (namely, the on/off state) is based on the first parameter, and when the temperature of the first component reaches a preset temperature threshold (which can be specifically set according to actual conditions, such as 50 degrees), the first parameter representing the temperature of the first component is determined to meet the preset condition; and when the condition for judging that the switch is in the first state/the second state (i.e. the on/off state) is based on the second parameter, when the blade rotation speed of the second assembly reaches a preset rotation speed threshold (which may be specifically set according to an actual situation, such as 4700rpm), determining that the second parameter representing the blade rotation speed of the second assembly meets the preset condition.
In practical applications, when the switch is in the first state, that is, the switch is opened, as shown in fig. 3, the blocking piece in the switch is in the open state, and the switch, the first component 11 and the housing (D-side) of the electronic device form a certain gas space, and the formed gas space is the first gas channel. One example is that when the switch is turned on, the fan is controlled to generate an air flow for absorbing heat conducted by the heat dissipation fins and the heat pipe in the first air channel based on the rotation of the fan blades, and the generated air flow is transmitted to the outside of the electronic device through the first air channel, so as to reduce the surface temperature of the electronic device. Therefore, the embodiment of the invention adds the heat dissipation gas channel on the basis that the fan radiates heat through the heat dissipation fins, so that when the temperature of a central processing unit of the electronic equipment is higher or the rotating speed of the fan is overhigh, the temperature of the electronic equipment is further reduced through the heat dissipation gas channel, and the temperature reduction performance of the electronic equipment is enhanced.
The switch 13 is further configured to control the second assembly 12 to generate a gas flow for absorbing heat in the first assembly 11 based on the rotation of the blade and to transmit the generated gas flow to the outside of the electronic device through the gas passage of the first assembly 11 when the switch is in a second state (i.e., an "off" state) as shown in fig. 5.
Here, when the switch 13 is in the "off" state, as shown in fig. 5, the flap in the switch 13 is placed on the heat pipe in the first component, and the airflow generated by the fan of the electronic apparatus to absorb heat cannot be transmitted from the air passage formed between the D-surface of the electronic apparatus and the area of the heat pipe, but is blown to the outside of the electronic apparatus through the air passage of the heat dissipating fin.
In an embodiment, the second state is a state of the switch when the first parameter and/or the second parameter do not satisfy the preset condition; in one embodiment, the second state is the switch 13 being in the off state; for example: when judging whether the switch is closed or not based on two parameters, namely a first parameter and a second parameter, the temperature of the first component does not reach a preset temperature threshold value, and when the rotating speed of the blades of the second component does not reach a preset rotating speed threshold value, the first parameter and the second parameter are determined to be not met with the preset condition. At this time, the first air passage is in an "off" state, that is, the electronic device is only cooled by the second component to generate an air flow absorbing heat in the first component based on the rotation of the blade, and the generated air flow is transmitted to the outside of the electronic device through the air passage of the first component. Another example is: whether the switch is turned off or not is judged based on the second parameter, when the rotating speed of the fan of the electronic equipment does not reach a preset rotating speed threshold value, the preset rotating speed condition is determined to be not met, the switch is in an off state, at the moment, the electronic equipment generates airflow for absorbing heat of the radiating fins and the heat pipe area through the rotation of the fan in the radiating process, and the generated airflow is transmitted to the outside of the electronic equipment through the airflow of the radiating fins.
In one embodiment, the switch 13 is further configured to control the second component to generate an airflow for absorbing heat conducted by the first component in the first gas channel based on the rotation of the blade with a specific switch angle when the switch is in the first state, and to transfer the generated airflow to the outside of the electronic device; as shown in fig. 6.
Wherein the particular switch angle corresponds to the first parameter or the second parameter.
Here, in practical applications, when the switch is in the open state, the open angle of the switch may be controlled based on the actual conditions of the electronic device (such as the rotation speed of the fan, the temperature of the central processing unit, and the like), in an embodiment, when the first parameter is within the range of the first parameter value, the switch is at the first open angle, and when the first parameter is between the first parameter value and the second parameter value (the second parameter value is greater than the first parameter value), the switch is at the second open angle; in another embodiment, the switch is at a first open angle when the second parameter is within a third parameter value range and at a second open angle when the second parameter is between the third parameter value and a fourth parameter value (the fourth parameter value is greater than the third parameter value).
By applying the embodiment of the invention, when the preset condition is met, the switch is in the open state, so that the fan of the electronic equipment is controlled to generate the airflow for absorbing the heat conducted by the heat dissipation fins and the heat pipes in the first air channel based on the rotation of the blades, the generated airflow is transmitted to the outside of the electronic equipment, namely, an air channel (namely, the first air channel) is added, the airflow for absorbing the heat generated by the fan is transmitted from the air channel, and the opening angle of the switch can be controlled according to the actual condition (such as the temperature of a central processing unit) of the electronic equipment, so that the electronic equipment is cooled in a proper mode based on the conditions such as the load degree of the electronic equipment, and the electronic equipment is low in cost and good in cooling effect.
EXAMPLE III
Fig. 7 is a schematic structural diagram of a heat dissipation device in an embodiment of the present invention, fig. 8 and 9 are schematic structural diagrams of a heat dissipation device in an embodiment of the present invention located in an electronic apparatus, and with reference to fig. 7 to 9, the components of the electronic apparatus in an embodiment of the present invention include: a first component 21, a second component 22 connected with the first component, a switch 23 and a third component 24; wherein the content of the first and second substances,
the first component 21 is configured to receive heat conducted by a heat source of the electronic device, and dissipate heat in the first component based on a heat conduction manner; in practical applications, the first component may be a heat sink and a heat pipe connected to a heat source of the electronic device, and the heat of the heat source is conducted based on the heat conduction performance of the heat sink and the heat pipe.
The switch 23 is used for controlling the second component 22 to generate an air flow for absorbing heat conducted by the first component 21 in the first air channel based on the rotation of the blade and transmitting the generated air flow to the outside of the electronic device when the switch is in the first state; the first gas channel is a space formed by the switch 23, the first component 21 and the housing of the electronic device when the switch is in the first state;
in the embodiment of the present invention, no thermal diffusion material exists above the D-side housing of the electronic device, i.e., the thermal diffusion material in the electronic device is removed, so that a certain air space (gap) is generated between the D-side of the electronic device and the heat dissipation fins and the heat pipe region, as shown in fig. 4.
In one embodiment, the switch 23 may be composed of a rotating shaft located at one end of the second component, and a blocking piece with one end connected to the rotating shaft; the rotation shaft rotates to drive the blocking piece to rotate (open/close), and then the mode of cooling the electronic equipment is controlled. In practical applications, the second component 22 may be a first fan of an electronic device.
In one embodiment, the first state is a state in which the switch 23 is in an on state, and the first state is a state of the switch when a first parameter representing a temperature of the first component and/or a second parameter representing a rotational speed of a blade of the second component satisfies a preset condition; that is, in practical implementation, the condition for determining whether to open the switch may be based on one parameter (e.g., based on only the first parameter) or two parameters (e.g., the first parameter and the second parameter), for example: the condition for judging that the switch is in the first state/the second state (namely, the on/off state) is based on the first parameter, and when the temperature of the first component reaches a preset temperature threshold (which can be specifically set according to actual conditions, such as 60 degrees), the first parameter representing the temperature of the first component is determined to meet the preset condition; and when the condition for judging that the switch is in the first state/the second state (i.e. the on/off state) is based on the second parameter, when the rotating speed of the blade of the second assembly reaches a preset rotating speed threshold (which may be set according to actual conditions, for example 4600rpm), determining that the second parameter representing the rotating speed of the blade of the second assembly meets the preset condition.
In practical applications, when the switch is in the first state, that is, the switch is opened, as shown in fig. 8, the blocking piece in the switch is in the open state, and the switch, the first component 11 and the housing (D-side) of the electronic device form a certain gas space, and the formed gas space is the first gas channel. One example is that when the switch is turned on, the first fan is controlled to generate an air flow for absorbing heat conducted by the heat dissipation fins and the heat pipe in the first air channel based on the rotation of the fan blades, and the generated air flow is transmitted to the outside of the electronic device through the first air channel, so as to reduce the surface temperature of the electronic device. Therefore, in the embodiment of the invention, the heat dissipation gas channel is added on the basis that the first fan dissipates heat through the heat dissipation fins, so that when the temperature of a central processing unit of the electronic equipment is higher or the rotating speed of the fan is overhigh, the temperature of the electronic equipment is further reduced through the heat dissipation gas channel, and the temperature reduction performance of the electronic equipment is enhanced.
The switch 23 is further configured to control the second module 22 to generate a gas flow for absorbing heat in the first module 21 based on the rotation of the blade and to transmit the generated gas flow to the outside of the electronic device through the gas passage of the first module 21 when the switch is in a second state (i.e., an "off" state), as shown in fig. 9.
Here, when the switch 23 is in the off state, as shown in fig. 9, the flap in the switch 23 is placed on the heat pipe in the first component, and the airflow generated by the first fan of the electronic apparatus to absorb heat cannot be transmitted from the air passage formed between the D-surface of the electronic apparatus and the area of the heat pipe, but is blown to the outside of the electronic apparatus through the air passage of the heat dissipating fin.
In an embodiment, the second state is a state of the switch when the first parameter and/or the second parameter do not satisfy the preset condition; in one embodiment, the second state is the switch 23 being in the off state; for example: when judging whether the switch is closed or not based on two parameters, namely a first parameter and a second parameter, the temperature of the first component does not reach a preset temperature threshold value, and when the rotating speed of the blades of the second component does not reach a preset rotating speed threshold value, the first parameter and the second parameter are determined to be not met with the preset condition. Another example is: whether the switch is turned off or not is judged based on the second parameter, when the rotating speed of the first fan of the electronic equipment does not reach a preset rotating speed threshold value, the preset rotating speed condition is determined to be not met, the switch is in an off state, at the moment, the first fan of the electronic equipment rotates to generate airflow for absorbing heat of the radiating fins and the heat pipe area, and the generated airflow is transmitted to the outside of the electronic equipment through the air of the radiating fins.
In one embodiment, a third component 24 for generating a gas flow for absorbing heat conducted by the first component in the second gas passage based on the rotation of the blade and transferring the generated gas flow to the outside of the electronic device when the switch 23 is in the second state;
the second gas channel is a space formed by the switch 23, the first component 21 and the housing of the electronic device when the switch 23 is in the second state.
Here, in practical applications, the third component 24 may be a second fan of the electronic device, which is located below the first fan, as shown in fig. 9, and in an embodiment, when the switch is in the closed state, the third component (the second fan) is in the working state, and generates the airflow absorbing heat and transmits the airflow to the outside of the electronic device through the second air channel; the second gas channel is a gas space formed by the D-surface shell of the electronic device, the first component, the second component and the switch when the switch is closed. Therefore, the two fans are arranged in the electronic equipment and used for cooling the electronic equipment, and the speed of reducing the temperature of the shell of the electronic equipment is increased.
With the above embodiment of the present invention, when the switch is in the on state, the first fan of the electronic device is in the working state, and generates the airflow for absorbing heat and transmits the airflow to the outside of the electronic device through the first air channel; when the switch is in a closed state, the first fan and the second fan of the electronic equipment are both in a working state, the airflow which is generated by the first fan and absorbs heat is transmitted to the outside of the electronic equipment through the air channels of the radiating fins, and the airflow which is generated by the second fan and absorbs heat is transmitted to the outside of the electronic equipment through the second air channels; therefore, different heat dissipation modes are adopted based on the actual condition of the electronic equipment, and the good control of the surface temperature of the electronic equipment is realized.
Example four
Fig. 10 is a schematic flowchart of an information processing method according to an embodiment of the present invention, where the method is applied to an electronic device, where the electronic device includes a heat dissipation apparatus, and the heat dissipation apparatus includes: the heat dissipation device comprises a first assembly, a second assembly and a switch, wherein the first assembly is used for receiving heat conducted by a heat source of electronic equipment and dissipating heat based on a heat conduction mode; as shown in fig. 10, the information processing method in the embodiment of the present invention includes:
step 101: acquiring a state judgment parameter of the switch; the state judgment parameter includes at least one of a first parameter indicative of a temperature of the first component, and a second parameter indicative of a blade rotation speed of the second component.
Here, in practical applications, the first component may be a heat sink and a heat pipe connected to a heat source of the electronic device, and the heat of the heat source is conducted based on the heat conduction performance of the heat sink and the heat pipe; the second component may be a fan in the electronic device that generates an air flow for absorbing heat based on the rotation of the blades.
In practical implementation, the states of the switch include a first state (i.e., the switch is in an open state), a second state (i.e., the switch is in a closed state); and determining the state of the switch may be based on one parameter (e.g., only the first parameter) or two parameters (e.g., the first parameter and the second parameter), and controlling the switch to be in the first state when the first parameter representing the temperature of the first component and/or the second parameter representing the rotational speed of the blade of the second component satisfies a preset condition; and when the first parameter and/or the second parameter do not meet the preset condition, controlling the switch to be in a second state. One example is: determining that the condition that the switch is in the first state/the second state (i.e., the on/off state) is based on the first parameter, and when the temperature of the first component reaches a preset temperature threshold (which may be specifically set according to an actual condition, such as 50 °), determining that the first parameter representing the temperature of the first component meets the preset condition, that is, the condition that the switch is turned on is met; and when the condition for judging that the switch is in the first state/the second state (i.e. the on/off state) is based on the second parameter, when the rotating speed of the blades of the second assembly reaches a preset rotating speed threshold (which can be specifically set according to the actual condition, such as 4700rpm), determining that the second parameter representing the rotating speed of the blades of the second assembly meets the preset condition, that is, the condition for opening the switch is met. Correspondingly, when it is determined based on the state determination parameter that the preset condition is not satisfied, the switch is in the second state, i.e., the switch is in the closed state.
Step 102: controlling the switch to be in a first state based on the state judgment parameter, controlling the second component to generate airflow for absorbing heat conducted by the first component in the first gas channel based on the rotation of the blade, and transmitting the generated airflow to the outside of the electronic equipment; or controlling the switch to be in a second state, and controlling the second assembly to generate a gas flow for absorbing heat in the first assembly based on the rotation of the blade, and transmitting the generated gas flow to the outside of the electronic device through the gas passage of the first assembly.
Here, the first gas channel is a space formed by the switch, the first component and the housing of the electronic device when the switch is in the first state.
In the embodiment of the present invention, no thermal diffusion material exists above the D-side housing of the electronic device, i.e., the thermal diffusion material in the electronic device is removed, so that a certain air space (gap) is generated between the D-side of the electronic device and the heat dissipation fins and the heat pipe region, as shown in fig. 4. When the switch is in the first state, that is, the switch is turned on, as shown in fig. 3, a certain gas space is formed by the switch, the first component and the housing (D-surface) of the electronic device, and the formed gas space is the first gas channel. In practical implementation, when the switch is turned on, the fan is controlled to generate air flow for absorbing heat conducted by the heat dissipation fins and the heat pipe in the first air channel based on rotation of the fan blades, and the generated air flow is transmitted to the outside of the electronic device through the first air channel, so that the surface temperature of the electronic device is reduced. Therefore, the embodiment of the invention adds the heat dissipation gas channel on the basis that the fan radiates heat through the heat dissipation fins, so that when the temperature of a central processing unit of the electronic equipment is higher or the rotating speed of the fan is overhigh, the temperature of the electronic equipment is further reduced through the heat dissipation gas channel, and the temperature reduction performance of the electronic equipment is enhanced.
In an embodiment, when the switch is controlled to be in the first state based on the state judgment parameter, the method further includes:
controlling the switch to control the second component to generate an airflow for absorbing heat conducted by the first component in the first gas channel based on blade rotation with a specific switch angle and to transfer the generated airflow to the outside of the electronic device;
wherein the particular switch angle corresponds to the first parameter or the second parameter.
Here, in practical applications, when the switch is in the open state, the open angle of the switch may be controlled based on the actual conditions of the electronic device (such as the rotation speed of the fan, the temperature of the central processing unit, and the like), in an embodiment, when the first parameter is within the range of the first parameter value, the switch is at the first open angle, and when the first parameter is between the first parameter value and the second parameter value (the second parameter value is greater than the first parameter value), the switch is at the second open angle; in another embodiment, the switch is at a first open angle when the second parameter is within a third parameter value range and at a second open angle when the second parameter is between the third parameter value and a fourth parameter value (the fourth parameter value is greater than the third parameter value).
In one embodiment, the heat dissipation device further comprises a third component; correspondingly, when the switch is controlled to be in the second state, the method further comprises the following steps:
controlling the third assembly to generate a gas flow for absorbing heat conducted by the first assembly in a second gas passage based on rotation of the blades and to transfer the generated gas flow to the outside of the electronic device;
the second gas channel is a space formed by the switch, the first component and the shell of the electronic device when the switch is in the second state.
Here, in practical application, the third component is a fan, and may be located below the second component, and when the switch is in the closed state, the third component (the second fan) is in the working state, and generates an air flow absorbing heat and transmits the air flow to the outside of the electronic device through the second air channel; the second gas channel is a gas space formed by the D-surface shell of the electronic device, the first component, the second component and the switch when the switch is closed. Therefore, the two fans are arranged in the electronic equipment and used for cooling the electronic equipment, and the speed of reducing the temperature of the shell of the electronic equipment is increased.
EXAMPLE five
FIG. 11 is a schematic diagram of a component structure of an electronic device according to an embodiment of the invention; as shown in fig. 11, the electronic device includes a processor 31 and a heat dissipation device 32, and the heat dissipation device includes: the heat dissipation device comprises a first assembly, a second assembly and a switch, wherein the first assembly is used for receiving heat conducted by a heat source of electronic equipment and dissipating heat based on a heat conduction mode; wherein the content of the first and second substances,
the processor 31 is configured to obtain a state judgment parameter of the switch; the state judgment parameter includes at least one of a first parameter indicative of a temperature of the first component and a second parameter indicative of a rotational speed of a blade of the second component.
Here, in actual implementation, the processor may acquire the state judgment parameter of the switch based on a temperature sensor of the electronic device or the like. In practical application, the first component can be a heat dissipation fin and a heat pipe which are connected with a heat source of the electronic equipment, and the heat of the heat source is conducted based on the heat conduction performance of the heat dissipation fin and the heat pipe; the second component may be a fan in the electronic device that generates an air flow for absorbing heat based on the rotation of the blades.
In practical implementation, the states of the switch include a first state (i.e., the switch is in an open state), a second state (i.e., the switch is in a closed state); and determining the state of the switch may be based on one parameter (e.g., only the first parameter) or two parameters (e.g., the first parameter and the second parameter), and controlling the switch to be in the first state when the first parameter representing the temperature of the first component and/or the second parameter representing the rotational speed of the blade of the second component satisfies a preset condition; and when the first parameter and/or the second parameter do not meet the preset condition, controlling the switch to be in a second state. One example is: determining that the condition that the switch is in the first state/the second state (i.e., the on/off state) is based on the first parameter, and when the temperature of the first component reaches a preset temperature threshold (which may be specifically set according to an actual condition, such as 50 °), determining that the first parameter representing the temperature of the first component meets the preset condition, that is, the condition that the switch is turned on is met; and when the condition for judging that the switch is in the first state/the second state (i.e. the on/off state) is based on the second parameter, when the blade rotation speed of the second assembly reaches a preset rotation speed threshold (which may be specifically set according to an actual situation, such as 4700rpm), determining that the second parameter representing the blade rotation speed of the second assembly meets the preset condition, i.e. the condition for opening the switch is met. Correspondingly, when it is determined based on the state determination parameter that the preset condition is not satisfied, the switch is in the second state, i.e., the switch is in the closed state.
The processor 31 is further configured to control the switch to be in a first state based on the state judgment parameter, and control the second component to generate an airflow for absorbing heat conducted by the first component in the first gas channel based on the rotation of the blade, and transmit the generated airflow to the outside of the electronic device; or controlling the switch to be in a second state, and controlling the second assembly to generate a gas flow for absorbing heat in the first assembly based on the rotation of the blade, and transmitting the generated gas flow to the outside of the electronic device through the gas passage of the first assembly.
Here, the first gas channel is a space formed by the switch, the first component and the housing of the electronic device when the switch is in the first state.
In the embodiment of the present invention, no thermal diffusion material exists above the D-side housing of the electronic device, i.e., the thermal diffusion material in the electronic device is removed, so that a certain air space (gap) is generated between the D-side of the electronic device and the heat dissipation fins and the heat pipe region, as shown in fig. 4. When the switch is in the first state, that is, the switch is turned on, as shown in fig. 3, a certain gas space is formed by the switch, the first component and the housing (D-surface) of the electronic device, and the formed gas space is the first gas channel. In practical implementation, when the switch is turned on, the fan is controlled to generate air flow for absorbing heat conducted by the heat dissipation fins and the heat pipe in the first air channel based on rotation of the fan blades, and the generated air flow is transmitted to the outside of the electronic device through the first air channel, so that the surface temperature of the electronic device is reduced. Therefore, the embodiment of the invention adds the heat dissipation gas channel on the basis that the fan radiates heat through the heat dissipation fins, so that when the temperature of a central processing unit of the electronic equipment is higher or the rotating speed of the fan is overhigh, the temperature of the electronic equipment is further reduced through the heat dissipation gas channel, and the temperature reduction performance of the electronic equipment is enhanced.
The processor 31 is further configured to control the switch to adopt a specific switch angle to control the second component to generate an airflow for absorbing heat conducted by the first component in the first gas channel based on blade rotation and transmit the generated airflow to the outside of the electronic device when the switch is controlled to be in the first state based on the state judgment parameter;
wherein the particular switch angle corresponds to the first parameter or the second parameter.
Here, in practical applications, when the switch is in the open state, the open angle of the switch may be controlled based on the actual conditions of the electronic device (such as the rotation speed of the fan, the temperature of the central processing unit, and the like), in an embodiment, when the first parameter is within the range of the first parameter value, the switch is at the first open angle, and when the first parameter is between the first parameter value and the second parameter value (the second parameter value is greater than the first parameter value), the switch is at the second open angle; in another embodiment, the switch is at a first open angle when the second parameter is within a third parameter value range and at a second open angle when the second parameter is between the third parameter value and a fourth parameter value (the fourth parameter value is greater than the third parameter value).
The heat sink further includes a third component; correspondingly, the processor 31 is further configured to control the third component to generate a gas flow for absorbing heat conducted by the first component in the second gas channel based on the rotation of the blade when the switch is in the second state, and to transmit the generated gas flow to the outside of the electronic device;
the second gas channel is a space formed by the switch, the first component and the shell of the electronic device when the switch is in the second state.
Here, in practical application, the third component is a fan, and may be located below the second component, and when the switch is in the closed state, the third component (the second fan) is in the working state, and generates an air flow absorbing heat and transmits the air flow to the outside of the electronic device through the second air channel; the second gas channel is a gas space formed by the D-surface shell of the electronic device, the first component, the second component and the switch when the switch is closed. Therefore, the two fans are arranged in the electronic equipment and used for cooling the electronic equipment, and the speed of reducing the temperature of the shell of the electronic equipment is increased.
Those of ordinary skill in the art will understand that: all or part of the steps for implementing the method embodiments may be implemented by hardware related to program instructions, and the program may be stored in a computer readable storage medium, and when executed, the program performs the steps including the method embodiments; and the aforementioned storage medium includes: a mobile storage device, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
Alternatively, the integrated unit of the present invention may be stored in a computer-readable storage medium if it is implemented in the form of a software functional module and sold or used as a separate product. Based on such understanding, the technical solutions of the embodiments of the present invention may be essentially implemented or a part contributing to the prior art may be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the methods described in the embodiments of the present invention. And the aforementioned storage medium includes: a removable storage device, a ROM, a RAM, a magnetic or optical disk, or various other media that can store program code.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (9)
1. A heat dissipating device, comprising: the device comprises a first assembly, a second assembly connected with the first assembly and a switch; wherein the content of the first and second substances,
the first component is used for receiving heat conducted by a heat source of the electronic equipment, and heat dissipation is carried out in the first component based on a heat conduction mode;
the switch comprises a rotating shaft and a baffle plate; the baffle plate is connected with the rotating shaft and can rotate around the rotating shaft; the position of the blocking piece when the switch is in the first state is different from the position of the blocking piece when the switch is in the second state;
the switch is in the second state, and a second gas channel is formed among the shell of the electronic equipment, the second assembly and the first assembly;
the switch is in the first state, the blocking piece blocks the second gas channel, and a first gas channel is formed among the shell of the electronic equipment, the second assembly and the first assembly;
the second assembly is juxtaposed with the first assembly, the second assembly comprising: a blade for generating an air flow for absorbing heat conducted by the first component based on rotation of the blade and transferring the generated air flow to an outside of the electronic apparatus.
2. The heat dissipating device of claim 1,
the first state is a state of the switch when a first parameter representing the temperature of the first component and/or a second parameter representing the blade rotation speed of the second component meet a preset condition;
the second state is a state of the switch when the first parameter and/or the second parameter do not satisfy the preset condition.
3. The heat dissipating device of claim 2,
the switch is further used for controlling the second component to generate airflow for absorbing heat conducted by the first component in the first gas channel based on the rotation of the blade by adopting a specific switch angle when the switch is in a first state, and transmitting the generated airflow to the outside of the electronic equipment;
wherein the particular switch angle corresponds to the first parameter or the second parameter.
4. The heat dissipating device of claim 1, further comprising:
a third component for generating a gas flow for absorbing heat conducted by the first component in the second gas passage based on the rotation of the blade when the switch is in the second state, and transferring the generated gas flow to the outside of the electronic apparatus.
5. An information processing method applied to a heat dissipation device, the heat dissipation device comprising: the electronic device comprises a first assembly, a second assembly and a switch, wherein the first assembly is used for receiving heat conducted by a heat source of the electronic device and dissipating heat based on a heat conduction mode in the first assembly; the method comprises the following steps:
acquiring a state judgment parameter of the switch; the state judgment parameter comprises at least one of a first parameter representing the temperature of the first component and a second parameter representing the blade rotation speed of the second component;
the switch comprises a rotating shaft and a baffle plate; the baffle plate is connected with the rotating shaft and can rotate around the rotating shaft; the position of the blocking piece when the switch is in the first state is different from the position of the blocking piece when the switch is in the second state;
controlling the switch to be in a second state based on the state judgment parameter, wherein a second gas channel is formed among the shell of the electronic equipment, the second assembly and the first assembly; or, the switch is controlled to be in the first state, the blocking piece blocks the second gas channel, and a first gas channel is formed among the shell of the electronic device, the second assembly and the first assembly;
and controlling the second assembly juxtaposed with the first assembly, wherein the second assembly comprises: a blade for generating an air flow for absorbing heat conducted by the first component based on rotation of the blade, and transferring the generated air flow to an outside of the electronic apparatus.
6. The method of claim 5, further comprising:
controlling the switch to be in a first state when a first parameter indicative of the temperature of the first component and/or a second parameter indicative of the rotational speed of the blades of the second component satisfy a preset condition;
and when the first parameter and/or the second parameter do not meet the preset condition, controlling the switch to be in a second state.
7. The method of claim 6, wherein controlling the switch to be in the first state based on the state determination parameter further comprises:
controlling the switch to control the second component to generate an airflow for absorbing heat conducted by the first component in the first gas channel based on blade rotation with a specific switch angle and to transfer the generated airflow to the outside of the electronic device;
wherein the particular switch angle corresponds to the first parameter or the second parameter.
8. The method of claim 5, wherein the heat sink further comprises a third component; controlling the switch to be in a second state, the method further comprising:
controlling the third assembly to generate a gas flow for absorbing heat conducted by the first assembly in the second gas passage based on rotation of the blades, and to transfer the generated gas flow to the outside of the electronic device.
9. An electronic device, characterized in that the electronic device comprises: a heat sink and a processor; wherein, heat abstractor includes: the electronic device comprises a first assembly, a second assembly and a switch, wherein the first assembly is used for receiving heat conducted by a heat source of the electronic device and dissipating heat based on a heat conduction mode in the first assembly;
the processor is used for acquiring the state judgment parameters of the switch; the state judgment parameter comprises at least one of a first parameter representing the temperature of the first component and a second parameter representing the blade rotation speed of the second component;
the switch comprises a rotating shaft and a baffle plate; the baffle plate is connected with the rotating shaft and can rotate around the rotating shaft; the position of the blocking piece when the switch is in the first state is different from the position of the blocking piece when the switch is in the second state;
controlling the switch to be in a second state based on the state judgment parameter, wherein a second gas channel is formed among the shell of the electronic equipment, the second assembly and the first assembly; or, the switch is controlled to be in the first state, the blocking piece blocks the second gas channel, and a first gas channel is formed among the shell of the electronic device, the second assembly and the first assembly;
and controlling the second assembly juxtaposed with the first assembly, wherein the second assembly comprises: a blade for generating an air flow for absorbing heat conducted by the first component based on rotation of the blade, and transferring the generated air flow to an outside of the electronic apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710200538.0A CN107168492B (en) | 2017-03-29 | 2017-03-29 | Information processing method and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710200538.0A CN107168492B (en) | 2017-03-29 | 2017-03-29 | Information processing method and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107168492A CN107168492A (en) | 2017-09-15 |
| CN107168492B true CN107168492B (en) | 2021-10-22 |
Family
ID=59849523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710200538.0A Active CN107168492B (en) | 2017-03-29 | 2017-03-29 | Information processing method and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107168492B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1767750A (en) * | 2004-10-27 | 2006-05-03 | 台达电子工业股份有限公司 | Heat radiation assembly and its flow direction control structure |
| CN103781332A (en) * | 2012-10-22 | 2014-05-07 | 华硕电脑股份有限公司 | Heat dissipation device |
| CN104460880A (en) * | 2014-11-12 | 2015-03-25 | 杭州华为数字技术有限公司 | Cabinet server and control method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6437978B1 (en) * | 1998-12-04 | 2002-08-20 | Sony Corporation | Cooling device, cooling method, and electronic apparatus |
| TW201001141A (en) * | 2008-06-25 | 2010-01-01 | Micro Star Int Co Ltd | Wind guiding structure |
| CN101896051A (en) * | 2009-05-21 | 2010-11-24 | 英业达股份有限公司 | Double-fan heat radiation module and electronic device using same |
-
2017
- 2017-03-29 CN CN201710200538.0A patent/CN107168492B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1767750A (en) * | 2004-10-27 | 2006-05-03 | 台达电子工业股份有限公司 | Heat radiation assembly and its flow direction control structure |
| CN103781332A (en) * | 2012-10-22 | 2014-05-07 | 华硕电脑股份有限公司 | Heat dissipation device |
| CN104460880A (en) * | 2014-11-12 | 2015-03-25 | 杭州华为数字技术有限公司 | Cabinet server and control method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107168492A (en) | 2017-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8848363B2 (en) | Heat dissipation system | |
| US7215541B2 (en) | Multi-stage low noise integrated object and system cooling solution | |
| TWI487475B (en) | Heat dissipation module | |
| TWM309144U (en) | Accommodation box of hard disk with cooling device | |
| US6118655A (en) | Cooling fan with heat pipe-defined fan housing portion | |
| US20100061052A1 (en) | Electronic apparatus | |
| JP2009169752A (en) | Electronic equipment | |
| JP2007019256A (en) | Air-cooled heat exchanger with automatic opening and closing shutter | |
| TW201626698A (en) | Motor with heat dissipation structure capable of restraining temperature therein | |
| WO2020134729A1 (en) | Electronic device heat dissipation method and electronic device | |
| CN114265475A (en) | Shell structure and terminal equipment | |
| US20200025215A1 (en) | Fan housing with metal foam and fan having the fan housing | |
| CN107168492B (en) | Information processing method and electronic equipment | |
| US20210378142A1 (en) | Heat dissipation device and server using same | |
| JP2007198703A (en) | Air conditioner | |
| US20140334094A1 (en) | Heat-Dissipation Structure and Electronic Apparatus Using the Same | |
| JP4496978B2 (en) | Electronics | |
| JP2018006701A (en) | Electronic apparatus | |
| US9057384B2 (en) | Integrated fan | |
| US20160234965A1 (en) | Cooling module | |
| JP2017126639A (en) | Cooling device for electronic apparatus, electronic apparatus equipped with the same, and cooling method for electronic apparatus | |
| US20190281728A1 (en) | Thermal control system | |
| JP2014207294A (en) | Electrical equipment | |
| CN110865692B (en) | Server | |
| JP2007250596A (en) | Outdoor installation base station equipment equipped with wind pressure opening/closing louver |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |