CN107167950B - Display substrate, manufacturing method thereof and display device - Google Patents

Abstract

The invention discloses a display substrate, a manufacturing method thereof and a display device, and belongs to the field of display. The display substrate comprises a display area and a frame glue setting area, wherein the frame glue setting area is located outside the display area, a current limiting array is arranged at the edge of one side, away from the display area, of the frame glue setting area, the current limiting array comprises at least two glue containing grooves, and the at least two glue containing grooves are arranged along the direction away from the display area. The frame glue overflowing outwards sequentially flows into the plurality of glue containing grooves arranged from inside to outside, so that the current limiting array in the invention can limit or prevent the frame glue from overflowing outwards and protect structures on the outer side from being covered by the frame glue.

Description

Display substrate, manufacturing method thereof and display device

Technical Field

The invention relates to the field of display, in particular to a display substrate, a manufacturing method thereof and a display device.

Background

Thin Film Transistor-Liquid Crystal displays (TFT-LCDs) have been the mainstream products in the Display field after the last decades of development. Generally, in mobile display products, a display area to the edge of a display screen is defined as a bezel. The existence of the frame can reduce the visual effect of the whole display screen, and particularly, the larger the frame area is, the poorer the visual effect is. Therefore, the narrow-frame and even frameless visual effect becomes the mainstream trend of high-quality display screens.

In a display panel formed by dividing a mother substrate of the display panel along a cutting line, sealant surrounding a display region generally needs to be as far away from the cutting line as possible to reserve a sufficient allowable space for the sealant to overflow. However, as the frame of the TFT-LCD panel is gradually narrowed, the distance between the edge of the sealant and the cutting line is closer and closer, which is easy to cause various serious problems in the subsequent processes due to the overflow of the sealant, for example, the overflowing sealant covers the alignment mark, so that the subsequent alignment process is difficult to perform; if the overflowed frame glue crosses the cutting line or is adhered to the adjacent frame glue, the subsequent cutting process is seriously influenced, poor breaking, liquid crystal leakage and the like are easily generated, and the trouble of high rejection rate is caused.

Disclosure of Invention

The invention provides an organic electroluminescent device, a manufacturing method thereof and a light-emitting device, which can reduce the influence of the overflow of frame glue on the subsequent process.

In a first aspect, the present invention provides a display substrate, which includes a display region and a sealant setting region, wherein the sealant setting region is located outside the display region,

the edge of one side, far away from the display area, of the frame glue setting area is provided with a current limiting array, the current limiting array comprises at least two glue containing grooves, and the at least two glue containing grooves are arranged along the direction far away from the display area.

In a possible implementation manner, the sealant setting region includes at least one corner region, and one side of each corner region, which is far away from the display region, is provided with one current limiting array.

In a possible implementation manner, in any current limiting array arranged on one side of the corner region, an edge line of the glue containing groove closest to the corner region is tangent to or partially coincides with an edge line of the corner region.

In a possible implementation manner, the display substrate includes a surface dielectric layer for contacting the sealant, and the sealant accommodating grooves are all disposed in the surface dielectric layer.

In a possible implementation manner, a cutting line is arranged on the display substrate, and the current limiting arrays are all arranged on one side of the cutting line close to the display area.

In a possible implementation manner, at least two glue containing grooves included in the current limiting array are parallel to the edge of one side of the frame glue setting region, which is far away from the display region.

In a possible implementation manner, the glue containing groove is in a straight strip shape or an arc shape which is bent towards a direction far away from the display area.

In a possible implementation manner, in at least two glue containing grooves included in the current limiting array, the volumes of the glue containing grooves are sequentially reduced along a direction in which the frame glue setting region is far away from the display region.

In a second aspect, the present invention further provides a method for manufacturing any one of the above display substrates, including:

and forming a surface dielectric layer for contacting the frame glue, wherein the glue accommodating grooves are all arranged in the surface dielectric layer.

In a third aspect, the present invention also provides a display device, which includes any one of the above display substrates.

According to the technical scheme, the frame glue overflowing outwards sequentially flows into the plurality of glue containing grooves arranged from inside to outside, the current limiting array in the invention can limit or prevent the frame glue from overflowing outwards, and the structure on the outer side is protected from being covered by the frame glue, so that the influence of the overflowing of the frame glue on the subsequent process can be reduced, and the yield is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic perspective view of a sealant portion of a display device according to an embodiment of the present invention;

FIG. 2 is a schematic top view of a display substrate according to an embodiment of the invention;

FIG. 3 is a schematic perspective view of a current limiting array according to an embodiment of the present invention;

FIG. 4 is a schematic diagram illustrating the overflow principle of a current limiting array according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a top view of a mother substrate of a display panel according to an embodiment of the present invention;

FIG. 6 is a schematic diagram illustrating a top view of a current limiting array in accordance with an embodiment of the present invention;

FIG. 7 is a schematic diagram of a perspective view of a current limiting array in accordance with an embodiment of the present invention;

FIG. 8 is a schematic diagram illustrating a top view of a current limiting array in accordance with an embodiment of the present invention;

fig. 9 is a schematic perspective view of a current limiting array according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a schematic perspective view of a sealant portion of a display device according to an embodiment of the present invention. Referring to fig. 1, the display device includes a display substrate 11 and a sealant 12 disposed on the display substrate 11; for clarity, other parts of the display device and a part of the structure of the display substrate 11 and the sealant 12 are not shown in fig. 1. It should be noted that the display device may be any product or component with a display function, such as a display panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator; the display substrate may be, for example, a finished product or an intermediate product of an array substrate, a color film substrate, a touch panel, or other plate structures; the sealant is a structure mainly playing a role in sealing in the display device, and in some implementation modes, the sealant is formed on the display substrate in a coating and post-curing mode.

Fig. 2 is a schematic top view of a display substrate according to an embodiment of the invention, and particularly shows a top view of the display substrate 11 shown in fig. 1. Referring to fig. 1 and 2, the display substrate 11 includes a display Area a1 and a sealant disposing Area a2, wherein the display Area a1 may be, for example, an Active Area (AA), and the sealant disposing Area a2 refers to an Area on the display substrate for disposing sealant, for example, a coating Area when a sealant forming material is coated. Fig. 1 shows the shape of the sealant 12 by taking the case where the actual setting region of the sealant 12 and the sealant setting region a2 are completely overlapped, but it should be understood that the actual setting region and the shape of the sealant 12 may not completely correspond to the sealant setting region a2 due to material, process, sealant overflow, and other reasons. As shown in fig. 1 and fig. 2, the sealant disposing region a2 on the display substrate 11 is located outside the display region a 1.

Referring to fig. 1 and fig. 2, the display substrate 11 is further provided with current limiting arrays 21, and the current limiting arrays 21 are all disposed at the edge of one side of the sealant disposing region a2 away from the display region a 1. Specifically, the sealant disposing area a2 with a substantially rectangular frame includes corner areas respectively located at four corners of the rectangle, and one side of each corner area away from the display area a1 is respectively disposed with a current limiting array 21.

Fig. 3 is a schematic perspective view of a current limiting array in an embodiment of the present invention, and specifically shows an enlarged perspective structure of the current limiting array 21 marked by a dashed circle in fig. 1. Referring to fig. 1 to 3, the current limiting array 21 includes three glue receiving grooves arranged in a direction away from the display area a 1. For convenience of description, the three glue receiving grooves are referred to as a first glue receiving groove G1, a second glue receiving groove G2 and a third glue receiving groove G3, respectively, in the order of arrangement along the direction away from the display area a 1. Referring to fig. 1 to 3, the three glue containing grooves of the current limiting array 21 are all in a straight strip shape, and have the same groove depth, but the cross-sectional areas on the horizontal plane are sequentially reduced along the direction away from the display area a1, so that the volumes are also sequentially reduced along the direction away from the display area a 1; moreover, the edge line of the first glue containing groove G1 closest to the corner region is tangent to the edge line of the sealant setting region a2, and the first glue containing groove G1, the second glue containing groove G2 and the third glue containing groove G3 are arranged in parallel along the direction away from the display region a 1.

Fig. 4 is a schematic view of an overflow principle of a current limiting array in an embodiment of the present invention, and specifically shows a longitudinal cross section of the structure shown in fig. 1 at a position of the current limiting array 21 when the frame glue 12 overflows. As shown in fig. 4, the display substrate 11 includes a lower substrate 11a and a surface dielectric layer 11b (the lower substrate 11a and the surface dielectric layer 11b may respectively include one or more layer structures) located on the lower substrate 11a, the first glue containing groove G1, the second glue containing groove G2, and the third glue containing groove G3 included in the current limiting array 21 are all disposed in the surface dielectric layer 11b, and the sealant 12 is disposed on the surface dielectric layer 11 b. As shown in fig. 4, when the sealant 12 disposed in the sealant disposing region a2 overflows in a direction away from the display region a1, the sealant will flow into the first sealant containing groove G1 first, and will not overflow continuously until the whole first sealant containing groove G1 is filled. In this process, the first glue containing groove G1 plays a role in containing the overflowing sealant 12 and limiting the overflowing range thereof in the groove. After the first glue-holding groove G1 is filled, the sealant 12 flowing out to the periphery flows into the second glue-holding groove G2, and does not flow out to the periphery until the second glue-holding groove G2 is filled. In this process, the second glue containing groove G2 plays a role in containing the overflowing sealant 12 and limiting the overflowing range thereof in the groove. After the second glue containing groove G2 is filled, the sealant 12 flowing out to the periphery flows into the third glue containing groove G3, and does not flow out to the periphery until the whole third glue containing groove G3 is filled. In this process, the third glue containing groove G3 plays a role in containing the overflowing sealant 12 and limiting the overflowing range thereof in the groove.

It can be seen that the recessed glue accommodating space provided by the current limiting array can limit the overflow range of the sealant by accommodating the overflowing sealant, thereby reducing adverse effects of the overflow of the sealant on the periphery of the current limiting array, especially on the structure (such as alignment marks, conductor pads, and the like) of the current limiting array far away from the sealant setting region. It can be understood that, compared with the method of using the retaining wall to limit the frame glue from overflowing, the embodiment of the invention hardly enables the overflowing frame glue to overflow in other directions after being blocked, but stably limits the frame glue in the glue containing groove, thereby realizing a better effect of limiting the frame glue from overflowing. Of course, the flow limiting array in the embodiment of the invention can also be arranged in cooperation with the retaining wall, so that the required effect of limiting the overflow of the frame glue is achieved. Therefore, the frame glue overflowing outwards sequentially flows into the glue containing grooves arranged from inside to outside, the current limiting array in the embodiment of the invention can limit or prevent the frame glue from overflowing outwards, so that the structure on the outer side is protected from being covered by the frame glue, the influence of the overflow of the frame glue on the subsequent process can be reduced, and the yield is improved.

It is to be understood that the structures shown in fig. 1 to 4 are only examples for making the objects, technical solutions and advantages of the present invention clearer, and the possible embodiments of the present invention are not limited thereto. In the following, possible variations of the above-described structure will be exemplified.

As an example of the display substrate, which is an intermediate product, the display substrate is a mother substrate of a display panel, which is cut to obtain at least two display panels. Fig. 5 is a schematic top view of a mother board of a display panel according to an embodiment of the present invention. Referring to fig. 5, the display substrate 11 in this example includes display panel regions a0 arranged in A3 × 3 array, each display panel region a0 has a display region a1 and sealant setting region a2, and a current limiting array 21. In each display panel region a0, the sealant setting region a2 is located outside the display region a1, a current limiting array 21 is disposed at an edge of one side of the sealant setting region a2 away from the display region a1, the current limiting array 21 includes at least two sealant accommodating grooves (only two are taken as an example in fig. 5), and the at least two sealant accommodating grooves are arranged along a direction away from the display region a 1. A cutting line is provided between the adjacent display panel regions a0, and the display substrate 11 can be divided into 9 display panels by cutting along the cutting line. Within each display panel area a0, the current limiting arrays 21 are disposed on the side of the cutting line close to the display area a 1. Of course, the implementation of the mother board with a plate-shaped structure other than the display panel is similar, and the description thereof is omitted. In addition, since the frame glue overflow is a problem faced by various display substrates, and can be limited by setting the current limiting array in the above manner, the present invention is not limited by the factors of the size, shape, display type, and the like of the display substrate.

As an example of the forming manner of the current limiting array, in the manufacturing method of any of the display substrates, a step of forming a surface dielectric layer for contacting with the sealant may be included, and the sealant accommodating grooves are all disposed in the surface dielectric layer, as shown in fig. 4. In a possible implementation manner, the step specifically includes: depositing a layer of dielectric material (material can be, for example, silicon oxide, silicon nitride, resin material, etc., and the process can be, for example, chemical vapor deposition, physical vapor deposition, etc.) on the underlying substrate 11 a; depositing a layer of photoresist on the dielectric material layer; exposing the glue containing groove setting area or the area outside the glue containing groove setting area by using a mask plate so as to solidify the photoresist outside the glue containing groove setting area; removing the uncured photoresist through development to expose the dielectric material layer in the photoresist accommodating groove setting area; etching the exposed dielectric material layer to form the glue accommodating groove; and stripping the photoresist. Of course, when the manufacturing method of the display substrate originally includes the patterning process of the dielectric material layer, the manufacturing of the glue accommodating groove can be performed simultaneously in the patterning process by changing the pattern of the mask plate. In another possible implementation manner, the lower substrate may be etched simultaneously in the etching process, so that the glue-accommodating groove penetrates through the surface dielectric layer and is partially located in the lower substrate. In another possible implementation manner, the glue-accommodating groove is directly formed on the substrate of the display substrate (the substrate surface is directly contacted with the frame glue). In another possible implementation manner, the process of etching to form the glue accommodating groove may sequentially etch the dielectric material layer at different positions through a Half Tone Mask (HTM), so that the glue accommodating groove with different groove depths may be obtained. It can be understood that when the glue accommodating grooves of the current limiting matrix have the same groove depth, the etching process can be simplified; however, in order to obtain the required volume of the glue containing grooves, different groove depths can be formed between the glue containing grooves of the same current limiting matrix. In addition, the groove depth of the glue containing grooves can be changed along with the position, for example, the bottom of any one or more glue containing grooves is set to be in a shape that the groove depth gradually decreases from the middle to two sides along the extending direction of the glue containing grooves. Of course, the inner shape of the glue-receiving grooves and the relation between the glue-receiving grooves can be not limited to the above form.

As an example of the optional shape of the glue containing groove in the flow limiting array, fig. 6 and 7 are a schematic top view structure and a schematic perspective structure of the flow limiting array in which the glue containing groove is arc-shaped, respectively. It can be seen that the glue-holding grooves as shown in fig. 6 and 7 are both in the shape of an arc curved away from the display area, and the edge line of the glue-holding groove closest to the corner area is tangent to the edge line of the corner area. As another example, fig. 8 and 9 are a schematic top view structure and a schematic perspective structure of a current limiting array with another arc-shaped glue containing groove, respectively. It can be seen that the glue containing grooves shown in fig. 8 and 9 are both in an arc shape which is bent towards the direction away from the display area, and the edge line of the glue containing groove closest to the corner area on the side close to the corner area coincides with the edge line of the corner area. As can be seen from comparison, the groove shapes shown in fig. 6 and 7 are closer to the curved shape of the corner region than the groove shapes shown in fig. 1 to 4, so that the original curved shape can be better maintained when the sealant overflows, and the layout space outside the current limiting array can be saved. The groove shapes shown in fig. 8 and 9 are closer to the curved shape of the corner region than the groove shapes shown in fig. 6 and 7, so that the original curved shape can be maintained when the sealant overflows, and the layout space outside the current limiting array can be further saved. Of course, the shape of the glue-containing groove in the flow-limiting array is not limited to this.

In the above three examples of selectable shapes of the glue containing grooves, each current limiting array includes three glue containing grooves arranged in parallel as an example, but in other possible implementation manners, each current limiting array on the display substrate may include any required number of glue containing grooves, and may be different from each other, so as to adapt to different application requirements, which is not limited by the present invention.

In the above three optional shape examples of the glue containing groove, the volume of the glue containing groove of each current limiting array is sequentially reduced along the direction of the frame glue setting area away from the display area, and the setting can enable the current limiting array to occupy smaller layout space under the same effect, thereby being beneficial to narrowing of the frame. Of course, the volume size relationship between the glue containing grooves can be set according to the actual application requirements, for example, the volumes are the same or are increased after being decreased along the direction of the display area, so as to achieve the required effect of limiting the overflow of the glue.

In the above three examples of the selectable shapes of the glue containing grooves, the glue containing grooves included in the current limiting array shown in fig. 8 and 9 are all parallel to the edge of the side of the sealant setting region away from the display region. Compared with a non-parallel implementation mode, the setting mode is more favorable for keeping the original bent shape when the frame glue overflows, and the layout space outside the flow limiting array can be saved. In an example, the center positions of the arcs of the glue containing grooves in the current limiting arrays shown in fig. 6 and 7 may be sequentially farther away from or closer to the center of the display area to form arcs that are not parallel to each other, so as to achieve the required effect of limiting the overflow of the sealant.

In the above three examples of alternative shapes of the glue containing groove, the edge line of the glue containing groove closest to the corner region in the flow limiting array shown in fig. 8 and 9 and the edge line of the corner region are in partially overlapped relationship with overlapped sections, while the edge line of the glue containing groove closest to the corner region in the flow limiting array shown in fig. 1 to 4 and the edge line of the corner region in the flow limiting array shown in fig. 6 and 7 are in tangent relationship. After comparison, the overflow of the sealant in the tangential arrangement mode starts from the tangent point and gradually spreads to both sides, while the overflow of the sealant in the partially overlapped arrangement mode flows into the sealant containing groove at the edge line similar to a waterfall, and obviously, the former is more favorable for controlling the shape of the sealant after the overflow than the latter. Of course, a gap may also be provided between an edge line of the glue accommodating groove closest to the corner region in the current limiting array and an edge line of the corner region, for example, any one of the current limiting arrays is translated to a horizontal direction away from the display region by a predetermined distance, so that the sealant flows into the glue accommodating groove from the beginning to have a certain degree of buffering. Of course, the relationship between the edge line of the glue containing groove closest to the glue setting region in the current limiting array and the edge line of the glue setting region far from the display region may not be limited to the above forms.

In the above three examples of the selectable shapes of the glue containing grooves, the flow limiting arrays are all disposed on the side of the corner region of the sealant disposing region away from the display region, so that the corner region which is most difficult to control the sealant overflow can be limited in the sealant overflow. In addition, according to different requirements on the aspect of limiting frame glue overflow, a flow limiting array can be arranged at other outer edges of the frame glue arrangement region. For example, for the case that the alignment mark is disposed outside the sealant setting region of the display substrate, the current limiting array may be disposed at the edge of the sealant setting region closest to the alignment mark, so as to prevent the sealant from overflowing to the alignment mark to cover the alignment mark. For another example, at least two circles of annular sealant accommodating grooves may be further disposed along the outer edge of the sealant disposing region to limit the sealant at each position from overflowing. In addition, in order to achieve the effect of limiting the overflow of the sealant, the current limiting array does not need to be strictly located outside the sealant setting region actually, for example, any one of the current limiting arrays is translated to a direction close to the display region on the original basis, so that the outer edge of the sealant setting region falls into the sealant accommodating groove closest to the sealant setting region in the current limiting array, and the current limiting array is still actually located at the edge of the side of the sealant setting region far from the display region. Of course, the number and the positions of the current limiting arrays may not be limited to the above forms.

It should be noted that, within a possible range, the above deformation modes in various aspects may be combined to obtain a display substrate and a display device that are suitable for different application requirements related to frame glue overflow, which is not limited in the present invention.

Based on the same inventive concept, another embodiment of the present invention provides a method for manufacturing any one of the above display substrates, including: and forming a surface dielectric layer for contacting the frame glue, wherein the glue accommodating grooves are all arranged in the surface dielectric layer. Examples of the steps in the manufacturing method are described in detail above, and other steps may be adaptively set according to a structure to be manufactured, which is not described herein again. The method of the embodiment of the invention can manufacture the display substrate, thereby reducing the influence of the overflow of the frame glue on the subsequent process and being beneficial to the improvement of the yield.

Based on the same inventive concept, still another embodiment of the present invention provides a display device including the display substrate of any one of the above. Specific examples of the display device have been described in detail above, and other components that may be included may be configured according to actual needs, and are not described herein again. The display device may be any product or component having a display function, such as a display panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator. The display device provided by the embodiment of the invention comprises the display substrate, so that the influence of the overflow of the frame glue on the subsequent process can be reduced, and the improvement of the yield is facilitated.

The above description is only exemplary of the present invention and should not be taken as limiting the invention, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. A display substrate comprises a display area and a frame glue setting area, wherein the frame glue setting area is positioned outside the display area,

a current limiting array is arranged at the edge of one side, away from the display area, of the frame glue setting area, the current limiting array comprises at least two glue containing grooves, the at least two glue containing grooves are located outside the frame glue setting area, and the at least two glue containing grooves are arranged along the direction away from the display area; wherein the content of the first and second substances,

the frame glue setting area comprises at least one corner area, and one side of each corner area, which is far away from the display area, is provided with one current limiting array;

in any current limiting array arranged on one side of the corner area, the edge line of the glue containing groove closest to the corner area is tangent to or partially overlapped with the edge line of the corner area.

2. The display substrate according to claim 1, wherein the display substrate comprises a surface dielectric layer for contacting the sealant, and the sealant accommodating grooves are all arranged in the surface dielectric layer.

3. The display substrate according to claim 1, wherein a cutting line is disposed on the display substrate, and the current limiting arrays are disposed on a side of the cutting line close to the display area.

4. The display substrate according to claim 1, wherein the at least two glue accommodating grooves included in the current limiting array are parallel to an edge of one side of the frame glue setting region away from the display region.

5. The display substrate according to any one of claims 1 to 4, wherein the glue receiving groove is in a shape of a straight bar or an arc bending away from the display area.

6. The display substrate according to any one of claims 1 to 4, wherein the at least two glue containing grooves included in the current limiting array sequentially decrease in volume along a direction in which the sealant disposing region is away from the display region.

7. A method of fabricating a display substrate according to any one of claims 1 to 6, comprising:

and forming a surface dielectric layer for contacting the frame glue, wherein the glue accommodating grooves are all arranged in the surface dielectric layer.

8. A display device comprising the display substrate according to any one of claims 1 to 6.

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