CN107163257A - Light-cured resin and its preparation and curing - Google Patents
Light-cured resin and its preparation and curing Download PDFInfo
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- CN107163257A CN107163257A CN201710553231.9A CN201710553231A CN107163257A CN 107163257 A CN107163257 A CN 107163257A CN 201710553231 A CN201710553231 A CN 201710553231A CN 107163257 A CN107163257 A CN 107163257A
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- resin
- cured resin
- epoxy resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G81/00—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
- C08G81/02—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers at least one of the polymers being obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C08G81/024—Block or graft polymers containing sequences of polymers of C08C or C08F and of polymers of C08G
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
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- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention is its light-cured resin on a kind of light-cured resin and its preparation and curing, and in parts by weight, it includes：Resin：70 130 parts, including acrylic resin, epoxy resin and organic siliconresin；Coupling agent：0.5 1 parts；Catalyst：0.5 1 parts；Solvent：30 80 parts.The present invention in the case of catalysts conditions and heat tracing, obtains both having double bond by a series of reaction of chemical grafts by series plastics, and the low-surface-energy hybrid UV-curing resin containing epoxy radicals.On the one hand the resin can improve shortcoming of the conventional Silicone to base material poor adhesion, on the other hand can reduce the shortcoming of conventional acrylic light-cured resin high shrinkage, such as industry such as automobile, ship has a wide range of applications demand in high-end field.
Description
Technical field
The present invention relates to resins synthesis field, more particularly to a kind of light-cured resin and its preparation and curing.
Background technology
Light-cured resin is due to numerous protrusions such as its curing rate is fast, environment-friendly, energy-output ratio is few, solvent-free volatilizations
Advantage and be widely studied, and promoted rapidly in all trades and professions.But the surface of current light-cured resin can be generally higher,
Limit its application.And low-surface-energy light-cured resin surface tension is low, water contact angle big, available for water proof anti-soil and from clearly
Clean field.But attachment of the light-cured resin of low-surface-energy to base material is generally poor, limits it contour in ship, automobile industry
The application in end field.
The content of the invention
The invention aims to solve shortcoming present in prior art, and a kind of new photocuring tree proposed
Fat and its preparation and curing.
To achieve these goals, present invention employs following technical scheme：A kind of light-cured resin proposed by the present invention,
In parts by weight, it includes：
Resin：70-130 parts, including acrylic resin, epoxy resin and organic siliconresin；
Coupling agent：0.5-1 parts；
Catalyst：0.5-1 parts；
Solvent：30-80 parts.
It is preferred that, foregoing light-cured resin, in parts by weight, it includes：
Acrylic resin：50-80 parts；
Epoxy resin：10-30 parts；
Organic siliconresin：10-20 parts；
Coupling agent：0.5-1 parts；
Catalyst：0.5-1 parts；
Acetone：20-45 parts；
Toluene：10-35 parts.
It is preferred that, foregoing light-cured resin, wherein described acrylic resin is pure acrylic resin, polyethers propylene
At least one of acid resin and polyesters acrylic resin.
It is preferred that, foregoing light-cured resin, wherein described epoxy resin is epoxy resin E-51 and/or epoxy resin
E-20。
It is preferred that, foregoing light-cured resin, wherein described organic siliconresin is the methyl vinyl silicon oil of hydroxyl value 4
And/or the methyl vinyl silicon oil of hydroxyl value 6.
It is preferred that, foregoing light-cured resin, wherein described catalyst is tertiary amine and/or dibutyl tin laurate.
To achieve these goals, present invention employs following technical scheme：A kind of light-cured resin proposed by the present invention
Preparation method, it includes：
1) epoxy resin, acrylic resin are dissolved separately in acetone, obtain epoxy resin acetone soln and acrylic acid tree
Fat acetone soln；
2) described epoxy resin acetone soln, coupling agent and catalyst are added in organic siliconresin, are heated to 65-
75 DEG C of stirrings are mixed 1-2 hours；Described acrylic resin acetone soln and toluene is added, it is small to react 1-2 at 65-75 DEG C
When, obtain mixture；
3) described mixture vacuum distillation is removed into solvent, obtains light-cured resin；
Wherein, described light-cured resin, in parts by weight, it includes：
Acrylic resin：50-80 parts；
Epoxy resin：10-30 parts；
Organic siliconresin：10-20 parts；
Coupling agent：0.5-1 parts；
Catalyst：0.5-1 parts；
Acetone：20-45 parts；
Toluene：10-35 parts.
It is preferred that, the preparation method of foregoing light-cured resin, wherein the vacuum of described vacuum distillation is 650-
750mmHg, the vacuum distillation time is 1-2h.
To achieve these goals, present invention employs following technical scheme：A kind of light-cured resin proposed by the present invention
Curing, by above-mentioned light-cured resin and 1- hydroxy cyclohexyl phenylketones, trimethyl benzoyl diphenyl base phosphine oxide
Mixing, high-pressure sodium lamp solidification.
It is preferred that, the curing of foregoing light-cured resin, wherein described light-cured resin, 1- hydroxy-cyclohexyl benzene
The parts by weight of ketone and trimethyl benzoyl diphenyl base phosphine oxide are 100:1-3:0.5-1.5.
Compared with prior art, the beneficial effects of the invention are as follows：
Light-cured resin of the present invention by coupling agent, catalyst effect by acrylic resin, epoxy resin graft to having
On machine silicones, obtained existing double bond has the siliceous resin of epoxy radicals again；Containing silicone resin can provide low-surface-energy, containing double
The acrylic acid of key can be with photocuring, and the epoxy containing epoxy radicals both can reduce contraction again with photocuring, improve to the attached of base material
Put forth effort.Therefore on the one hand the light-cured resin of the present invention can improve shortcoming of the conventional Silicone to base material poor adhesion, and adhesive force can
Reach 5-8MPa.On the other hand the shortcoming of conventional acrylic light-cured resin high shrinkage can be reduced, shrinkage factor is 5%-15%,
In high-end field, such as industry such as automobile, ship has a wide range of applications demand.
Embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example only a part of embodiment of the invention, rather than whole embodiments.In addition, the specific spy in one or more embodiments
Levy, structure or feature can be combined by any suitable form.
A kind of light-cured resin that one embodiment of the present of invention is proposed, in parts by weight, it includes：
Resin：70-130 parts, including acrylic resin, epoxy resin and organic siliconresin；
Coupling agent：0.5-1 parts；
Catalyst：0.5-1 parts；
Solvent：30-80 parts, including acetone and toluene.
It is preferred that, light-cured resin, in parts by weight, it includes：
Acrylic resin：50-80 parts；
Epoxy resin：10-30 parts；
Organic siliconresin：10-20 parts；
Coupling agent：0.5-1 parts；
Catalyst：0.5-1 parts；
Acetone：20-45 parts；
Toluene：10-35 parts.
It is preferred that, acrylic resin is in pure acrylic resin, polyethers acrylic resin and polyesters acrylic resin
At least one.Acrylic resin provides double bond for light-cured resin, is conducive to the solidification of light-cured resin.
It is preferred that, epoxy resin is epoxy resin E-51 and/or epoxy resin E-20.Epoxy resin can be photocuring tree
Fat provides epoxide group, both can reduce contraction again with photocuring, and improve the adhesive force to base material.
It is preferred that, organic siliconresin is the methyl vinyl silicon oil of hydroxyl value 4 and/or the methyl vinyl silicon oil of hydroxyl value 6.Have
Machine silicones can reduce the surface energy of light-cured resin.
It is preferred that, catalyst is tertiary amine and/or dibutyl tin laurate.Reaction speed can be accelerated, accessory substance is reduced.
It is preferred that, coupling agent is that there is provided adhesive force by A-174.
A kind of preparation method for light-cured resin that one embodiment of the present of invention is proposed, it includes：
1) epoxy resin, acrylic resin are dissolved separately in acetone, obtain epoxy resin acetone soln and acrylic acid tree
Fat acetone soln；
2) described epoxy resin acetone soln, coupling agent and catalyst are added in organic siliconresin, are heated to 65-
75 DEG C of stirrings are mixed 1-2 hours；Described acrylic resin acetone soln and toluene is added, it is small to react 1-2 at 65-75 DEG C
When, obtain mixture；
3) vacuum distillation 1-2h under described mixture 650-750mmHg vacuums is removed into solvent, obtains light-cured resin；
Wherein, described light-cured resin, in parts by weight, it includes：
Acrylic resin：50-80 parts；
Epoxy resin：10-30 parts；
Organic siliconresin：10-20 parts；
Coupling agent：0.5-1 parts；
Catalyst：0.5-1 parts；
Acetone：20-45 parts；
Toluene：10-35 parts.
One embodiment of the present of invention propose a kind of light-cured resin curing, by described light-cured resin with
1- hydroxy cyclohexyl phenylketones, trimethyl benzoyl diphenyl base phosphine oxide are by weight 100:1-3:0.5-1.5 is mixed, high pressure
Mercury lamp solidifies.
Embodiment 1
A kind of preparation method for light-cured resin that one embodiment of the present of invention is proposed, it includes：
1) 15 parts of epoxy resin E-20 are dissolved in 13 parts of acetone, 60 parts of polyethers acrylic resins is dissolved in 30 parts
In acetone, epoxy resin acetone soln and acrylic resin acetone soln are obtained；
2) described epoxy resin acetone soln, 0.7 part of coupling agent A-174,0.5 part of 15 parts of catalyst tertiary amine addition are had
Machine silicones, is heated to 70 DEG C of stirrings and mixes 1 hour；Described acrylic resin acetone soln and 30 parts of toluene is added,
70 DEG C are reacted 1 hour, obtain mixture；
3) vacuum distillation 2h under described mixture 700mmHg vacuums is removed into solvent, obtains light-cured resin.
A kind of light-cured resin that one embodiment of the present of invention is proposed, is prepared by the above method, in parts by weight,
It includes：
Polyethers acrylic resin：60 parts；
Epoxy resin E-20：15 parts；
Organic siliconresin：15 parts；
A-174：0.7 part；
Tertiary amine：0.5 part；
Acetone：43 parts；
Toluene：30 parts.
The curing for a kind of light-cured resin that one embodiment of the present of invention is proposed, by above-mentioned 100 parts of photocuring trees
Fat and 1.2 parts of 1- hydroxy cyclohexyl phenylketones, 1 part of trimethyl benzoyl diphenyl base phosphine oxide, high-pressure sodium lamp solidification.
The water contact angle of the light-cured resin of embodiment 1 is up to 90 °, and the adhesive force with glass and aluminium is up to 6.9Mpa.
Embodiment 2
A kind of preparation method for light-cured resin that one embodiment of the present of invention is proposed, it includes：
1) 20 parts of epoxy resin E-51 are dissolved in 25 parts of acetone, 50 parts of polyesters acrylic resins is dissolved in 20 parts
In acetone, epoxy resin acetone soln and acrylic resin acetone soln are obtained；
2) described epoxy resin acetone soln, 0.5 part of coupling agent A-174,0.6 part of 20 parts of catalyst tertiary amine addition are had
Machine silicones, is heated to 70 DEG C of stirrings and mixes 2 hours；Described acrylic resin acetone soln and 35 parts of toluene is added,
70 DEG C are reacted 1 hour, obtain mixture；
3) vacuum distillation 1.5h under described mixture 700mmHg vacuums is removed into solvent, obtains light-cured resin.
A kind of light-cured resin that one embodiment of the present of invention is proposed, is prepared by the above method, in parts by weight,
It includes：
Polyethers acrylic resin：50 parts；
Epoxy resin E-20：20 parts；
Organic siliconresin：20 parts；
A-174：0.5 part；
Tertiary amine：0.6 part；
Acetone：45 parts；
Toluene：35 parts.
The curing for a kind of light-cured resin that one embodiment of the present of invention is proposed, by above-mentioned 100 parts of photocuring trees
Fat and 1.8 parts of 1- hydroxy cyclohexyl phenylketones, 0.9 part of trimethyl benzoyl diphenyl base phosphine oxide, high-pressure sodium lamp solidification.
The water contact angle of the light-cured resin of embodiment 2 is up to 98 °, and the adhesive force with glass and aluminium is up to 6.1Mpa.
Embodiment 3
A kind of preparation method for light-cured resin that one embodiment of the present of invention is proposed, it includes：
1) 22 parts of epoxy resin E-20 are dissolved in 9 parts of acetone, 70 parts of polyesters acrylic resins is dissolved in 36 parts
In acetone, epoxy resin acetone soln and acrylic resin acetone soln are obtained；
2) described epoxy resin acetone soln, 0.7 part of coupling agent A-174,0.8 part of 18 parts of catalyst tertiary amine addition are had
Machine silicones, is heated to 70 DEG C of stirrings and mixes 1.8 hours；Described acrylic resin acetone soln and 31 parts of toluene is added,
Reacted 2 hours at 70 DEG C, obtain mixture；
3) vacuum distillation 1h under described mixture 700mmHg vacuums is removed into solvent, obtains light-cured resin.
A kind of light-cured resin that one embodiment of the present of invention is proposed, is prepared by the above method, in parts by weight,
It includes：
Polyethers acrylic resin：70 parts；
Epoxy resin E-20：22 parts；
Organic siliconresin：18 parts；
A-174：0.7 part；
Tertiary amine：0.8 part；
Acetone：45 parts；
Toluene：31 parts.
The curing for a kind of light-cured resin that one embodiment of the present of invention is proposed, by above-mentioned 100 parts of photocuring trees
Fat and 1.2 parts of 1- hydroxy cyclohexyl phenylketones, 1 part of trimethyl benzoyl diphenyl base phosphine oxide, high-pressure sodium lamp solidification.
The water contact angle of the light-cured resin of embodiment 3 is up to 94 °, and the adhesive force with glass and aluminium is up to 7.8Mpa.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (10)
1. a kind of light-cured resin, it is characterised in that in parts by weight, it includes：
Resin：70-130 parts, including acrylic resin, epoxy resin and organic siliconresin；
Coupling agent：0.5-1 parts；
Catalyst：0.5-1 parts；
Solvent：30-80 parts.
2. light-cured resin according to claim 1, it is characterised in that in parts by weight, it includes：
Acrylic resin：50-80 parts；
Epoxy resin：10-30 parts；
Organic siliconresin：10-20 parts；
Coupling agent：0.5-1 parts；
Catalyst：0.5-1 parts；
Acetone：20-45 parts；
Toluene：10-35 parts.
3. light-cured resin according to claim 1, it is characterised in that described acrylic resin is pure acrylic acid tree
At least one of fat, polyethers acrylic resin and polyesters acrylic resin.
4. light-cured resin according to claim 1, it is characterised in that described epoxy resin is epoxy resin E-51
And/or epoxy resin E-20.
5. light-cured resin according to claim 1, it is characterised in that described organic siliconresin is the methyl of hydroxyl value 4
The methyl vinyl silicon oil of vinyl silicone oil and/or hydroxyl value 6.
6. light-cured resin according to claim 1, it is characterised in that described catalyst is tertiary amine and/or two bays
Sour dibutyl tin.
7. a kind of preparation method of light-cured resin, it is characterised in that it includes：
1) epoxy resin, acrylic resin are dissolved separately in acetone, obtain epoxy resin acetone soln and acrylic resin third
Ketone solution；
2) described epoxy resin acetone soln, coupling agent and catalyst are added in organic siliconresin, are heated to 65-75 DEG C
Stirring mixing 1-2 hours；Described acrylic resin acetone soln and toluene is added, reacts 1-2 hours, obtains at 65-75 DEG C
To mixture；
3) described mixture vacuum distillation is removed into solvent, obtains light-cured resin；
Wherein, described light-cured resin, in parts by weight, it includes：
Acrylic resin：50-80 parts；
Epoxy resin：10-30 parts；
Organic siliconresin：10-20 parts；
Coupling agent：0.5-1 parts；
Catalyst：0.5-1 parts；
Acetone：20-45 parts；
Toluene：10-35 parts.
8. the preparation method of light-cured resin according to claim 7, it is characterised in that the vacuum of described vacuum distillation
Spend for 650-750mmHg, the vacuum distillation time is 1-2h.
9. a kind of curing of light-cured resin, it is characterised in that by the light-cured resin described in claim any one of 1-6
Mixed with 1- hydroxy cyclohexyl phenylketones, trimethyl benzoyl diphenyl base phosphine oxide, high-pressure sodium lamp solidification.
10. the curing of light-cured resin according to claim 9, it is characterised in that described light-cured resin, 1-
The parts by weight of hydroxy cyclohexyl phenylketone and trimethyl benzoyl diphenyl base phosphine oxide are 100:1-3:0.5-1.5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710553231.9A CN107163257A (en) | 2017-07-07 | 2017-07-07 | Light-cured resin and its preparation and curing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710553231.9A CN107163257A (en) | 2017-07-07 | 2017-07-07 | Light-cured resin and its preparation and curing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107163257A true CN107163257A (en) | 2017-09-15 |
Family
ID=59823381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710553231.9A Pending CN107163257A (en) | 2017-07-07 | 2017-07-07 | Light-cured resin and its preparation and curing |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130331483A1 (en) * | 2010-12-17 | 2013-12-12 | Akzo Nobel Coatings International B.V. | Organic-inorganic hybrid paint composition |
| CN104371086A (en) * | 2014-10-28 | 2015-02-25 | 江南大学 | Preparation method of ultraviolet-curing organosilane acrylic acid polyurethane |
| CN104761994A (en) * | 2015-04-10 | 2015-07-08 | 南昌航空大学 | Preparation method of photocuring organic silicon modified epoxy resin paint film |
-
2017
- 2017-07-07 CN CN201710553231.9A patent/CN107163257A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130331483A1 (en) * | 2010-12-17 | 2013-12-12 | Akzo Nobel Coatings International B.V. | Organic-inorganic hybrid paint composition |
| CN104371086A (en) * | 2014-10-28 | 2015-02-25 | 江南大学 | Preparation method of ultraviolet-curing organosilane acrylic acid polyurethane |
| CN104761994A (en) * | 2015-04-10 | 2015-07-08 | 南昌航空大学 | Preparation method of photocuring organic silicon modified epoxy resin paint film |
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Application publication date: 20170915 |