CN107152649B - Thick-wall condenser structure for enclosing peripheral parts and mounting method thereof - Google Patents
Thick-wall condenser structure for enclosing peripheral parts and mounting method thereof Download PDFInfo
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- CN107152649B CN107152649B CN201710386499.8A CN201710386499A CN107152649B CN 107152649 B CN107152649 B CN 107152649B CN 201710386499 A CN201710386499 A CN 201710386499A CN 107152649 B CN107152649 B CN 107152649B
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- 230000002093 peripheral effect Effects 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000001746 injection moulding Methods 0.000 claims abstract description 43
- 238000000465 moulding Methods 0.000 claims abstract description 15
- 238000009434 installation Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 abstract description 11
- 230000007547 defect Effects 0.000 abstract description 5
- 239000000843 powder Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 12
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000012945 sealing adhesive Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 206010033546 Pallor Diseases 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
- B29C2045/0027—Gate or gate mark locations
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Finishing Walls (AREA)
Abstract
A thick-wall condenser structure for enclosing peripheral parts and a method thereof are characterized in that the thick-wall condenser structure is formed by injection molding a thick-wall condenser and peripheral parts thereof by double-shot molding so that the thick-wall condenser and the peripheral parts thereof are integrated. According to the invention, the LED circuit board can be directly positioned with the condenser, and the positioning is reliable and good, so that the optical performance is ensured; the thick-wall injection-molded condenser and the reflector are integrated through double-shot injection molding, and meanwhile, the number of parts is reduced, and the cost of the whole lamp is reduced, so that the phenomenon of powder discharge caused by friction of the two parts in the high-frequency vibration process is avoided; the complex mounting structure in the lamp is improved, and more space is saved for the lamp; the number of the dies is reduced, and the cost is reduced; lighting defects due to the mounting structure are reduced.
Description
Technical Field
The invention relates to a projection type lighting device for a car lamp, in particular to a thick-wall condenser structure, and more particularly relates to a mounting structure and a mounting method of double-shot molding of a thick-wall condenser and peripheral parts.
Background
The development trend of modern lamps is that the sizes are more and more exquisite and the shapes are more and more unique; in order to pursue the effect of sparkling and translucent after lighting, more host factories tend to select thick-wall injection-molded concentrators as the modeling appearance.
In existing conventional designs, thick-wall concentrators tend to be separately disassembled and thick-wall injection molded concentrators tend to exist as separate parts, as shown in fig. 1 and 2. Wherein 1 is a thick-wall injection-molded condenser part, 2 is an LED circuit board, 3 is a reflector, and 4 is a screw (used for fastening the condenser and the reflector). However, this design method tends to result in unreliable mounting structures due to the relatively high mass of the part itself.
However, the two parts are required to be disassembled separately by using two common injection molds, which causes the following problems:
one is high in cost; secondly, the parts are difficult to install, and the positioning precision is lower than that of a part formed by double-shot injection molding; thirdly, the space is not compact.
In addition, in the traditional thick-wall injection molding condenser mounting process, due to the special property of the thick-wall injection molding condenser material, mounting structures such as screw columns and buckles are often required to be designed on the condenser, and the structures such as the screw columns and the buckles are easy to break, so that during mounting, an LED circuit board is required to be positioned and mounted with a reflector to form a small assembly, and then 4 parts of the LED circuit board is subjected to blanching and 2 parts of screw fastening with the thick-wall condenser, so that direct positioning between an LED light source and the condenser is not caused, the mounting precision of an LED is reduced, and the optical performance is influenced.
Furthermore, the screw mounting positions of the condenser and the reflector are biased to one side, so that when the parts vibrate at high frequency, the condenser and the reflector are easy to rub against each other and produce powder on the side without the screw, and the appearance is affected. Further, the large flange on the condenser emits light when the condenser is lighted, and most mounting structures generate bright spots after the condenser is lighted, resulting in lighting defects.
Therefore, the present invention has a problem in that the problems of mounting the thick-wall condenser and the peripheral components are required to be optimized, and various problems caused by fastening with screws are overcome.
Namely, how to make thick wall injection molding part and its surrounding speculum directly become a whole through double-shot molding in the installation for the LED circuit board can carry out direct reliable location with the spotlight ware, ensures optical property, makes two parts can not appear rubbing the phenomenon of powder in the high frequency vibration in-process, and does not have unnecessary mounting structure or turn-ups on the spotlight ware, reduces because the lighting bright region that the mounting structure leads to. And meanwhile, the appearance and the performance are improved.
Disclosure of Invention
The technical scheme of the thick-wall condenser structure for enclosing the peripheral parts is as follows:
a thick-wall concentrator structure for enclosing peripheral parts, characterized in that,
the thick-wall condenser structure is an integral structure formed by the thick-wall condenser and the peripheral parts thereof, the thick-wall condenser and the peripheral parts thereof are subjected to injection molding by double-color injection molding, so that the thick-wall condenser and the peripheral parts thereof form an integral structure,
the double-shot molding is thick-wall double-shot molding in a wrapped shape.
According to the invention, a thick-walled concentrator structure for enclosing peripheral parts is characterized in that,
the parting positions of the thick-wall condenser and the peripheral parts form planes with the thickness of 2-3mm, so that the parting contact forming positions between the thick-wall condenser and the peripheral parts are plane contact sealing glue.
According to the invention, the parting positions of the thick-wall condenser and the peripheral parts form a plane with the thickness of 2-3mm, so that the parting contact forming position between the two parts is a plane touch sealing adhesive, thereby preventing the side wall of the parts from being scratched by the two mold closing processes of the mold in the injection molding process; the parting structure only needs to ensure the minimum drawing angle capable of drawing the mold, so that the requirement of at least 8-10 DEG drawing angle during side wall sealing is avoided, and the influence on the appearance of the part is small.
According to the invention, a thick-walled concentrator structure for enclosing peripheral parts is characterized in that,
the flange structure is arranged at the parting position of the thick-wall condenser and the peripheral parts thereof, thereby increasing the contact area between the thick-wall condenser and the peripheral parts thereof, ensuring the bonding between the two parts to be firmer,
meanwhile, a gate position is arranged on the flanging structure.
Thereby, melting of the previous injection is facilitated for the subsequent injection.
The gate position needs to be arranged as far as possible at a position where the appearance is invisible and the effect of the ignition is less affected. Since the thick-wall condenser in the thick-wall bicolor injection molded part usually has no redundant structure except the effective optical surface, the selection range of the gate position is smaller, and the influence on the appearance is required to be small, and the optical effective surface is required to be not damaged. In addition, if the section of the pouring gate is too small, the mold filling resistance of the part in the injection molding process is too large, the mold effect is poor, and the appearance is easy to generate shrink marks. The gate is disposed on the additional flange to ensure that the appearance and optical performance are not affected.
Specifically, the gate position is placed at the invisible position of the appearance and is far away from the light-emitting area, and the flanging is locally increased to be more than 10mm and less than 20mm at the gate position, so that the size of the gate can meet the normal injection molding process, and the appearance problem is not caused, as shown in fig. 5.
According to the invention a thick-walled concentrator structure for enclosing peripheral parts,
the flanging structure can be arranged on the back of the parting position of the peripheral part, so that the appearance is invisible and no bright spot defect exists after lighting.
According to the invention, a thick-walled concentrator structure for enclosing peripheral parts is characterized in that,
the die drawing angle is smaller than 8 degrees when the side wall is sealed, and preferably, the die drawing angle is 2-3 degrees when the side wall is sealed.
According to the invention, a thick-walled concentrator structure for enclosing peripheral parts is characterized in that,
the LED circuit board is directly fastened on the back of the thick-wall condenser through screws.
The traditional LED circuit board is generally hung on parts such as a decorative ring or a mounting bracket matched with a thick-wall condenser through screw gold, and the mode is indirect positioning; or the LED circuit board is directly arranged on the thick-wall condenser in a scalding mode, but compared with a screw fastening mode, the scalding technology is soft and fixed and is easy to loosen.
According to the invention, a thick-walled concentrator structure for enclosing peripheral parts is characterized in that,
the thick wall thickness of the thick-wall condenser is 5mm or more.
According to the invention, a thick-walled concentrator structure for enclosing peripheral parts is characterized in that,
the position installation precision between the light source, namely the LED circuit board and the condenser is within +/-0.2 mm.
According to the invention a thick-walled concentrator structure for enclosing peripheral parts,
the peripheral parts comprise a mounting bracket, a reflector, a decorative ring and the like.
The invention also provides a method for mounting the thick-wall condenser for enclosing the peripheral parts, which comprises the following technical scheme:
a method for mounting a thick-wall condenser for mounting peripheral parts is characterized in that,
and (3) carrying out double-shot molding on the thick-wall condenser part and the peripheral parts by adopting a wrapped thick-wall double-shot molding method, and directly forming an integral structure by the thick-wall condenser and the peripheral parts through double-shot molding.
The double-color injection molding is used for injecting two different parts into a whole through twice injection molding, so that the space is saved and the fit tolerance between the parts is reduced.
The double-color injection molding raw material is a transparent PC material, but is not limited to PC materials, transparent PMMA and ABS materials and the like, and can be subjected to double-color injection molding, and only two materials are required to meet two basic compatibility conditions of adhesion compatibility and processing process compatibility. As long as the melting point of the two materials meets the injection sequence determined by the modeling of the mould (the parts with high melting points are injected firstly and the parts with low melting points are injected later).
According to the invention, compared with the prior injection molding, the method of independently disassembling two parts, namely adopting two pairs of common injection molding dies to finish the injection molding, has the advantages of low cost, convenient installation between parts, high positioning precision and more compact space.
The method for mounting the thick-wall condenser for enclosing the peripheral parts according to the invention is characterized in that,
the parting positions of the thick-wall condenser and the peripheral parts form planes with the width of 2-3mm, so that the parting contact forming positions between the thick-wall condenser and the peripheral parts are plane contact sealing glue.
According to the invention, when the thick wall is fixed by injection molding, indentation is avoided at the same time, in addition, the thick wall is injected firstly, and the moving and fixed molds are fixed back and forth, so that the mold is complex to realize, and when the moving and fixed molds of the mold are changed, the influence of the mold change on the appearance of the thick wall part is fully considered. To reduce scratching of the appearance, a suitable parting surface is selected. Therefore, in the early stage of the mold design, the parting surfaces of the two-color parts are set as reasonably as possible, and a plane of 2-3mm is specially added at the parting positions of the two parts so as to prevent the side walls of the parts from being scratched by the two mold clamping processes of the mold in the injection molding process.
The method for mounting the thick-wall condenser for enclosing the peripheral parts according to the invention is characterized in that,
the die drawing angle is smaller than 8 degrees when the side wall is sealed, and preferably, the die drawing angle is 2-3 degrees when the side wall is sealed.
In order to ensure enough demolding angle, the structure of adopting a plane to touch through the sealing adhesive only needs to ensure the minimum demolding angle of 1.5-3 degrees, thereby avoiding the demolding angle requirement of at least 8-10 degrees when the side wall is sealed. Meanwhile, the indentation is generated at a position where the appearance is invisible as much as possible, such as the back surface of the part or the front part of the part is blocked by other parts.
The method for mounting the thick-wall condenser for enclosing the peripheral parts according to the invention is characterized in that,
the flange structure is arranged at the parting position of the thick-wall condenser and the peripheral parts of the thick-wall condenser, so that the contact area between the thick-wall condenser and the peripheral parts of the thick-wall condenser is increased, the bonding between the thick-wall condenser and the peripheral parts of the thick-wall condenser is firmer, and meanwhile, the pouring gate position is arranged on the flange structure.
When carrying out the thick wall bicolor injection molding of parcel form, need consider follow-up injection molding to the melting of moulding plastics in the past, for this reason, need examine different technologies, runner, even material, rationally set up the runner position.
The pouring gate is arranged on the additionally added flanging, so that the appearance and the optical performance are not influenced; and the section of the pouring gate is properly designed to be a little bigger, so that the appearance of the thick-wall part is prevented from being subjected to shrinkage printing.
In addition, in the early stage of the mold design, it is necessary to scale the mold size in advance in consideration of the difference in shrinkage ratio between the thick-wall part and the thin-wall part.
In the process of post injection molding, the technological parameters of injection molding (such as injection molding pressure, dwell time and the like) need to be adjusted according to theory and actual experience of thick-wall projects.
For example, increasing dwell time (dwell time 1.5-2 times that of a normal thickness part) can alleviate surface marking of the appearance of the part; controlling the temperature of the mold to adjust the shrinkage rate of the part so as to ensure the normal molding of the part, wherein the higher the temperature of the mold is, the larger the shrinkage rate is, the lower the temperature of the mold is, and the part is difficult to mold; the temperature of the die is stabilized at a specific temperature as much as possible; 3. the injection molding pressure is controlled to control the shrinkage of the part and avoid the shrinkage of the appearance of the part, and when the injection molding pressure is too low, the shrinkage of the part is increased.
Therefore, the quality of the product is adjusted, and the thick-wall part formed for the first time can be fixed in the original die without position change in the die changing process.
The method for mounting the thick-wall condenser for enclosing the peripheral parts according to the invention is characterized in that,
the LED circuit board is directly fastened on the back of the thick-wall condenser through 3 screws.
The method for mounting the thick-wall condenser for enclosing the peripheral parts according to the invention is characterized in that,
the thick-wall condenser has a wall thickness of 5mm or more.
The method for mounting the thick-wall condenser for enclosing the peripheral parts according to the invention is characterized in that,
the position installation precision between the light source and the condenser is within +/-0.2 mm.
For example, during installation, defining the part-to-part installation as + -0.2 mm; when the my light source is directly mounted with the reflector or the effective optical surface of the part, the mounting accuracy can be within +/-0.2, but if the two parts are independently dismounted, the mounting accuracy becomes +/-0.2 plus or minus 0.2, namely if the light source is not directly mounted with the optical surface, tolerance superposition occurs in accuracy.
According to the invention, the raw materials of the double-color injection molding are transparent or clear PC materials; in fact, materials for double-shot molding are widely used, and PMMA and ABS materials and the like can be subjected to double-shot molding except the materials. Only two materials are required to meet two basic compatibility conditions of adhesion compatibility and process compatibility.
According to the double-shot injection structure and the method for the thick-wall condenser and the peripheral parts, compared with the existing single disassembling method for the thick-wall condenser, the double-shot injection structure and the method for the thick-wall condenser have the following advantages:
the LED circuit board can be directly positioned with the condenser, and the positioning is reliable and good, so that the optical performance is ensured; the thick-wall injection-molded condenser and the reflecting mirror are formed into an integral structure through double-shot injection molding, so that the phenomenon of powder discharge caused by friction can not occur in the high-frequency vibration process of the two parts; the complex mounting structure in the lamp is improved, and more space is saved for the lamp; the number of the dies is reduced, and the cost is reduced; lighting defects due to the mounting structure are reduced.
Drawings
Fig. 1 is a schematic view of a conventional thick-wall condenser and a structure of a peripheral component as a separate detachable member.
Fig. 2 is a cross-sectional view showing a conventional thick-wall condenser and a structure in which peripheral components are separately detached.
FIG. 3 is a schematic view of a thick-wall concentrator for enclosing peripheral parts according to the present invention.
FIG. 4 is a cross-sectional view of a thick-walled concentrator structure for enclosing peripheral components in accordance with the present invention.
FIG. 5 is a cross-sectional view of a flange structure and gate location on the right side of a thick-walled concentrator structure for containing peripheral parts according to the present invention.
In the figure, 1 is a thick-wall injection-molded condenser part, 2 is an LED circuit board, 3 is a reflector, 4 is a screw (for fastening the condenser and the reflector), 5 is a thick-wall condenser part in a double-color injection-molded integral structure composed of a thick-wall condenser and peripheral parts thereof, 6 is an LED circuit board, 7 is a reflector part in a double-color injection-molded integral structure composed of a thick-wall condenser and peripheral parts thereof, 8 is a flange structure, 9 is a gate position, and 10 is a screw hole.
Detailed Description
Examples
A thick-wall condenser structure for including peripheral part, thick-wall condenser wall thickness is at 5-7mm, peripheral part is the speculum, carries out the injection molding with its peripheral part through the thick-wall bicolor injection molding of parcel form with thick-wall condenser for thick-wall condenser and speculum become an entity.
The parting positions of the thick-wall condenser and the reflecting mirror form a plane of 2-3mm, so that parting contact forming positions between two parts are plane contact sealing glue, and the side wall of the parts can be prevented from being scratched by two times of die closing of the die in the injection molding process; and the parting structure only needs to ensure the minimum drawing angle capable of drawing the mold, and has small influence on the appearance of the part.
The requirement of at least 8-10 degrees of die drawing angle during the side wall sealing is avoided, and in the embodiment, the die drawing angle during the side wall sealing is 2-3 degrees.
Fig. 4 shows a flange structure for connecting a reflecting mirror on the left side of the thick-walled condenser, i.e., an everting convex edge portion.
FIG. 5 shows the flange structure on the right side of a thick-walled concentrator and the gate location thereon. In fig. 5, the dimension of the burring structure corresponding to the gate position is in the range of 10mm to 20 mm.
The flange structure is added to the thick-wall condenser, the pouring gate is arranged on the flange, and the section of the pouring gate is properly designed to be a little bigger, so that the appearance of the thick-wall part is prevented from being subjected to shrink printing. In the early stage of mold design, it is necessary to scale the mold in advance in consideration of the difference in shrinkage between the thick-wall part and the thin-wall part.
In the process of post injection molding, the pressure maintaining time is properly increased to relieve the surface shrinkage marks of the appearance of the part; controlling the temperature of the mold to adjust the shrinkage rate of the part; the injection molding pressure is controlled to control the shrinkage of the part and to avoid shrinkage marks in the appearance of the part.
In the die changing process, the thick-wall part formed for the first time can be fixed in the original die without position change.
Then, the LED circuit board is directly fastened on the back of the thick-wall condenser through 3-point screws.
According to the embodiment of the invention, the position installation precision between the LED circuit board (light source) and the condenser is within +/-0.2 mm.
Compared with the existing method for independently disassembling the thick-wall condenser, according to the double-shot injection structure and the method for manufacturing the thick-wall condenser and the peripheral parts, the LED circuit board can be directly positioned with the condenser, positioning is reliable and good, and optical performance is guaranteed; the thick-wall injection-molded condenser and the reflecting mirror are integrated through double-shot injection molding, so that the phenomenon of powder discharge caused by friction of the two parts in the high-frequency vibration process can be avoided; the complex mounting structure in the lamp is improved, and more space is saved for the lamp; the number of the dies is reduced, and the cost is reduced; lighting defects due to the mounting structure are reduced.
Claims (8)
1. A thick-wall concentrator structure for enclosing peripheral parts, characterized in that,
the thick-wall condenser structure is an integral structure formed by the thick-wall condenser and the peripheral parts thereof, the thick-wall condenser and the peripheral parts thereof are subjected to injection molding by double-color injection molding, so that the thick-wall condenser and the peripheral parts thereof form an integral structure, the peripheral parts comprise a mounting bracket, a reflector and a decorative ring,
the double-shot molding is thick-wall double-shot molding of wrapping type,
the parting position of the thick-wall condenser and the peripheral parts thereof, namely the product sealing position forms a plane with the thickness of 2-3mm, so that the parting contact forming position between the thick-wall condenser and the peripheral parts thereof is plane contact sealing glue,
the flange structure is arranged at the parting position of the thick-wall condenser and the peripheral parts thereof, thereby increasing the contact area between the thick-wall condenser and the peripheral parts thereof, ensuring the bonding between the two parts to be firmer,
meanwhile, in order to facilitate the covering of the subsequent injection molding on the previous injection molding, a gate position is arranged on the flanging structure;
the size of the flanging structure corresponding to the gate position is in the range of 10mm-20 mm.
2. A thick-walled concentrator structure for enclosing peripheral components as claimed in claim 1,
the die drawing angle is smaller than 8 degrees when the side wall is sealed.
3. A thick-walled concentrator structure for enclosing peripheral components as claimed in claim 2,
the die drawing angle is 2-3 degrees when the side wall is sealed.
4. A thick-walled concentrator structure for enclosing peripheral components as claimed in claim 1,
the position installation precision between the light source, namely the LED circuit board and the condenser is within +/-0.2 mm.
5. A method for mounting a thick-wall condenser comprising peripheral components, characterized in that,
adopting a wrapped thick-wall double-color injection molding method to perform double-color injection molding on the thick-wall condenser part and the peripheral part thereof, forming an integral structure consisting of the thick-wall condenser and the peripheral part thereof through double-color injection molding, wherein the peripheral part comprises a mounting bracket, a reflector and a decorative ring,
the parting positions of the thick-wall condenser and the peripheral parts form a plane with the thickness of 2-3mm, so that the parting contact forming positions between the thick-wall condenser and the peripheral parts are plane contact sealing glue,
a flanging structure is arranged at the parting position of the thick-wall condenser and the peripheral parts of the thick-wall condenser, so that the contact area between the thick-wall condenser and the peripheral parts of the thick-wall condenser is increased, the bonding between the thick-wall condenser and the peripheral parts of the thick-wall condenser is firmer, and meanwhile, a pouring gate position is arranged on the flanging structure;
the dwell time is increased to be 1.5-2 times of that of the normal thickness part so as to relieve the surface shrinkage marks of the appearance of the part; and/or
Controlling the injection molding pressure to control the shrinkage of the part and avoid shrinkage marks of the appearance of the part; and/or
Controlling the temperature of the mould to adjust the shrinkage rate of the part so as to ensure the normal molding of the part,
therefore, in the die changing process, the thick-wall part formed for the first time can be fixed in the original die without position change.
6. A method for mounting a thick-wall concentrator enclosing peripheral components as recited in claim 5,
the position installation precision between the light source, namely the LED circuit board and the condenser is within +/-0.2 mm.
7. A method for mounting a thick-wall concentrator enclosing peripheral components as recited in claim 5,
the die drawing angle is smaller than 8 degrees when the side wall is sealed.
8. A method of mounting a thick-walled concentrator for containing peripheral components as claimed in claim 7 wherein the side wall is overmolded at an angle of 2-3 °.
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| CN201710386499.8A CN107152649B (en) | 2017-05-26 | 2017-05-26 | Thick-wall condenser structure for enclosing peripheral parts and mounting method thereof |
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| CN201710386499.8A CN107152649B (en) | 2017-05-26 | 2017-05-26 | Thick-wall condenser structure for enclosing peripheral parts and mounting method thereof |
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| CN107152649B true CN107152649B (en) | 2024-01-30 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003025377A (en) * | 2001-07-19 | 2003-01-29 | Ichikoh Ind Ltd | Lens for vehicle lamp, mold for the lens, and method for manufacturing the same |
| CN205174251U (en) * | 2015-12-03 | 2016-04-20 | 上海小糸车灯有限公司 | Car light thick wall light guide structure |
| CN205351100U (en) * | 2015-12-29 | 2016-06-29 | 上海小糸车灯有限公司 | Double -deck double -colored lens of front combination lamp |
| CN106594629A (en) * | 2017-01-23 | 2017-04-26 | 上海小糸车灯有限公司 | Brake lamp/tail lamp optical structure of LED vehicle tail lamp |
| CN207262324U (en) * | 2017-05-26 | 2018-04-20 | 上海小糸车灯有限公司 | A kind of heavy wall concentrator construction for being used to install peripheral component |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6616299B2 (en) * | 2001-02-02 | 2003-09-09 | Gelcore Llc | Single optical element LED signal |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003025377A (en) * | 2001-07-19 | 2003-01-29 | Ichikoh Ind Ltd | Lens for vehicle lamp, mold for the lens, and method for manufacturing the same |
| CN205174251U (en) * | 2015-12-03 | 2016-04-20 | 上海小糸车灯有限公司 | Car light thick wall light guide structure |
| CN205351100U (en) * | 2015-12-29 | 2016-06-29 | 上海小糸车灯有限公司 | Double -deck double -colored lens of front combination lamp |
| CN106594629A (en) * | 2017-01-23 | 2017-04-26 | 上海小糸车灯有限公司 | Brake lamp/tail lamp optical structure of LED vehicle tail lamp |
| CN207262324U (en) * | 2017-05-26 | 2018-04-20 | 上海小糸车灯有限公司 | A kind of heavy wall concentrator construction for being used to install peripheral component |
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| CN107152649A (en) | 2017-09-12 |
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