CN107141812A - A kind of high temperature resistant type high-temperature silicon disulfide rubber and preparation method thereof - Google Patents
A kind of high temperature resistant type high-temperature silicon disulfide rubber and preparation method thereof Download PDFInfo
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Abstract
The present invention relates to a kind of high temperature resistant type high-temperature silicon disulfide rubber, according to the mass fraction including following components：100 parts of rubber, 10 100 parts of reinforced filling, 1 100 parts of nanoscale heat-resistant filler, 1 100 parts of micron order heat-resistant filler, 0.5 20 parts of small molecule heat-resistant agent, 3 15 parts of antistructurizing agent, 1 10 parts of surface-treated agent, 0.1 10 parts of heat resistant type surface conditioning agent, 0.1 10 parts of interior demolding aids.High temperature resistant type high-temperature silicon disulfide rubber of the present invention is adapted to the various products moulding process, plastic variously-shaped high temperature resistant work device such as molding, extrusion, injection.High-temperature resistant result is excellent after product vulcanization, it is possible to by synchronous adjustment formula and technique adjustment hardness, meets the use requirement of varying environment, and can keep good mechanical performance in long-time hot environment, protects working environment, keeps equipment even running.
Description
Technical field
The invention belongs to the technical field of organic silicon compounded rubber stock, a kind of high temperature resistant type high-temperature silicon disulfide rubber is specifically related to
And preparation method thereof.
Background technology
High-temperature silicon disulfide rubber is the polymer based on the silicon rubber of linear high molecular weight, be mixed into reinforcing agent, filler,
Constitution controller etc., elastomer-forming is vulcanized under heating, pressurized conditions.Silicon rubber is the elastomer of excellent combination property, is had very
Many peculiar properties, including excellent weatherability, resistance to ozone, arc resistant, electric insulating quality, chemical-resistant resistance, highly-breathable and life
Thing inertia, some fillers for possessing special nature and mixing silicon rubber are molded, then can more protrude the excellent properties of silicon rubber.It is logical
In the case of often, the silicon rubber of sulfidization molding continuous permanent at 150 DEG C can be used, can be in the short time when temperature is more than 200 DEG C
Interior continuously to use, when temperature is more than 300 DEG C, the performance of material drastically declines, and loses application value.With the development of science and technology
The increasingly sophisticated harshness of electronic and electrical equipment working environment, the particularly development of national defence and sophisticated technology, are carried to the temperature tolerance of material
Go out more stringent requirement, therefore the heat resistance of material then turns into study hotspot.
In the research and production announced, there are following two methods to improve the heat resistance of elastomeric compound：1st, silicon rubber is changed
Body construction improve the heat resistance of elastomeric compound, be specifically that phenyl or other anti-degraded bases are introduced on main chain or side chain
Group, improves the heat resistance of silicon rubber from body.Including based on phenyl siloxane rubber, phenylene silicone rubber or fluorosioloxane rubber
The elastomeric compound of production.The production technology and equipments that raw material is rare, needs are special, production cost required for above-mentioned special silicone rubber
Costliness, in view of industrial technology is limited at present, product is rare and expensive and cannot get extensive promotion and application.It is same with this
When, introduce after the specific groups such as phenyl, the compatibility reduction of silicon rubber and filler adds the difficulty of production elastomeric compound.2nd, lead to
Cross and largely fill the heat resistance that certain single heat resistance powder improves elastomeric compound, commonly using powdered heat-resistant agent includes cerium oxide, oxidation
Iron, iron hydroxide, zinc oxide etc., this method can improve elastomeric compound heat resistance by a small margin, heat-resisting to be limited in scope, in 300 DEG C of rings
Under border, aging decays more than 60%.Simultaneously because there is the heavy powder of very big proportion in elastomeric compound system, cause elastomeric compound combination property
Will under significantly.
It is therefore proposed that of the invention.
The content of the invention
For the above-mentioned technical problem of prior art, it is an object of the invention to provide a kind of high temperature resistant type high-temperature vulcanized silicon rubber
Glue and preparation method thereof, the heat-resisting powder of nanoscale is proportioned with the heat-resisting powder of micron order and used, and is compounded with heat resistant structure
Response type small molecule high-temperature silicon disulfide rubber, also known as high temperature resistant type elastomeric compound maintains conventional mixing after sulfidization molding
The mechanical strength of glue, mechanical strength can be adjusted according to actual needs, while there is resistance to elevated temperatures, can be in 300 DEG C of building rings
Good performance is kept in border, and is used for a long time, and simple production process is easy to operate, raw material is easy to get, cheap.
To reach above-mentioned purpose, the present invention is achieved by the following technical solutions：
A kind of high temperature resistant type high-temperature silicon disulfide rubber, according to the mass fraction including following components：100 parts of rubber, reinforced filling 5-
100 parts, 1-100 parts of nanoscale heat-resistant filler, 1-100 parts of micron order heat-resistant filler, 0.5-20 parts of low molecule heat-resistant agent, structuring
3-15 parts of controlling agent, 1-10 parts of surface-treated agent, 0.1-10 parts of heat resistant type surface conditioning agent, interior demolding aids 0.1-10
Part.
Described rubber is ethenyl blocking or the linear poly-organosilicon siloxanes of methyl blocking, and its molecular weight is 500000-
800000g/mol, contents of ethylene is 0.03-5mol%.
The rubber is the linear high molecular weight poly-organosilicon siloxanes of two or more different contents of ethylene
Mixture.
The reinforced filling be precipitated silica, fume colloidal silica, diatomite, super-fine silicon micro-powder, nano-calcium carbonate,
One or more in silica flour, zirconium silicate, titanium dioxide, kaolin.To reduce white carbon surface hydroxyl quantity, it can knead
It is surface-treated in journey, can also shifts to an earlier date independent surface preparation.
Described nanoscale heat-resistant filler is iron powder, di-iron trioxide, ferrous oxide, ferroso-ferric oxide, iron hydroxide, grass
Sour iron, Organosilylferrocene, iron tin composite, tin oxide, cerium oxide, zinc oxide, silicon powder, aluminium powder, aluminum oxide, aluminium nitride,
Magnesia, magnesium hydroxide, zirconium oxide, calcium oxide, titanium nitride, carborundum, boron carbide, boron nitride, silicon nitride, boron phosphide, phosphatization
One or several kinds of mixing in silicon, rare earth, cadmium powder, graphite, carbon fiber or glass fibre, its average grain diameter is 1-1000nm.
Described micron order heat-resistant filler is iron powder, di-iron trioxide, ferrous oxide, ferroso-ferric oxide, iron hydroxide, grass
Sour iron, Organosilylferrocene, iron tin composite, tin oxide, cerium oxide, zinc oxide, silicon powder, aluminium powder, aluminum oxide, aluminium nitride,
Magnesia, magnesium hydroxide, zirconium oxide, calcium oxide, titanium nitride, carborundum, boron carbide, boron nitride, silicon nitride, boron phosphide, phosphatization
One or several kinds of mixing in silicon, rare earth, cadmium powder, graphite, carbon fiber or glass fibre, its average grain diameter is 1-1000 μm.
Described low molecule heat-resistant agent is the silicone compounds of the network-like crosslinking containing phenyl or phenylene, and described contains
The silicone compounds of the network-like crosslinking of phenyl or phenylene are phenyl methyl silicones, phenyl vinyl polysiloxane, phenyl
Hydrogeneous silicones, phenyl MQ silicones, the cagelike silsesquioxane containing phenyl or one kind in polyphenylsilsesquioxane or
It is several.
Described antistructurizing agent is hydroxy silicon oil, dihydric alcohol, two organic basic ring silicon ethers, HMDS or ring
One or more in silazane, and the viscosity of antistructurizing agent is 20-50 mPas.The selection of antistructurizing agent is needed
Selection, handling process and the filler surface treatment degree of reference fillers surface conditioning agent.
Described surface-treated agent is tetramethoxy-silicane, tetraethoxysilane, tetrapropoxysilane, four butoxy
Silane, MTMS, MTES, epoxy radicals triethoxysilane, epoxy radicals trimethoxy silane,
Vinyltrimethoxy silane, VTES, dimethyldimethoxysil,ne, dimethyldiethoxysilane,
Diethyldiethoxysilane, vinyl methyl dimethoxysilane or vinyl methyl diethoxy silane it is therein a kind of or
It is several.During online production, it should be considered according to the actual surface conditioning agent selected, filler treating capacity, degree for the treatment of from not
Same time and temperature.
Described heat resistant type surface conditioning agent is the low-molecular-weight siloxane containing phenyl, the low-molecular-weight silicon containing phenyl
Oxygen alkane is diphenyl silanediol, octaphenylcyclotetrasiloxane, phenyl triethoxysilane, phenyltrimethoxysila,e, diphenyl
Dimethoxysilane or diphenyl diethoxy silane is therein several or one kind.
Described interior demolding aids are at least one of aliphatic salt, aliphatic acid or fatty alcohol or a variety of.It is preferably fatty
Salt.
A kind of preparation method of high temperature resistant type high-temperature silicon disulfide rubber, comprises the following steps：It is poly- with linear high molecular weight
Polymer based on organosiloxane, be aided with reinforced filling, heat-resistant filler, heat resistant type surface conditioning agent, low molecule heat-resistant agent,
Surface-treated agent, interior demolding aids, are prepared from by shear agitation, high temperature banburying, mill and filtering.
1-5% vulcanizing agent is added during sulfidization molding, described vulcanizing agent is peroxide vulcanizing agent or platinum vulcanizing agent.
High temperature resistant type high-temperature silicon disulfide rubber of the present invention and preparation method thereof has the advantages that：
1st, the present invention compounds nanoscale and micron-sized powder heat-resistant agent, as main heat-resistant agent, on the premise of a small amount of addition,
The ratio of the heat-resisting powder of different-grain diameter is compounded, the dimensional effect for making it give full play to heat-resisting powder ensure that elastomeric compound machine
While tool intensity, elastomeric compound heat resistance is improved；
2nd, present invention introduces the response type small molecule with heat resistant structure, in mixing process, by itself and main heat-resistant agent and silicon rubber
React, further improve and consolidate elastomeric compound heat resistance.The heat resistant type high-temperature silicon disulfide rubber prepared by this method,
On the premise of ensure that strength, heat resistance is good, under the conditions of 300 DEG C, and aging decay is less than 40%.While raw material
It is easy to get, technique is simple, it is easy to generally produce and promote.
3rd, the various products moulding process such as the suitable molding of the present invention, extrusion, injection, plastic variously-shaped seal,
Silica gel roller, hot pressing peritonaeum, silica gel mould, tubing etc..Product preparation flow is simple, with low cost, the product high temperature resistant after shaping
Excellent performance, can work long hours in hot environment, and keep good hardness, elasticity, tear strength and tensile strength.
Embodiment
With reference to specific embodiment, the present invention is further illustrated, but protection scope of the present invention is not limited to
This.
Embodiment 1
Take 100 parts of rubbers, 4 parts of hydroxy silicon oils, 0.4 part of stearic acid, 2 parts of vinyl methyl dimethoxysilanes, 20 parts compare surface
Product is 150m2/ g white carbon, after banburying is uniform, after 150 DEG C of heat treatment 30min, adds 5 parts of nanometer ferro oxides, 15 parts micro-
The iron hydroxide of meter level, 2 parts of methyl phenyl silicone resins, 1 part of diphenyl silanediol, after banburying is uniform, 200 DEG C of heat treatment 40min,
Vacuum 1h, removes low molecule, cooling discharging.
Embodiment 2
Prior step be the same as Example 1, adds 5 parts of nanometer ferro oxides, 10 parts of micron iron hydroxides, 2 parts of phenyl MQ after heat treatment
Silicones, 1 part of phenyl triethoxysilane, after banburying is uniform, 150 DEG C of heat treatments 40min, vacuum 1h remove low molecule, cooling
Discharging.
Embodiment 3
Prior step be the same as Example 1, adds 5 parts of nanoscale ceriums, 15 parts of micron silicon micro mists, 2 parts of phenyl MQ after heat treatment
Silicones, 1 part of phenyl triethoxysilane, after banburying is uniform, 150 DEG C of heat treatments 40min, vacuum 1h remove low molecule, cooling
Discharging.
Embodiment 4
Prior step be the same as Example 1, adds 5 parts of nanometer silicon carbides, 15 parts of micron grade aluminum oxides, 2 parts of phenyl second after heat treatment
Alkenyl silicones, 1 part of phenyl triethoxysilane, after banburying is uniform, 150 DEG C of heat treatments 40min, vacuum 1h remove low molecule,
Cooling discharging.
Embodiment 5
Prior step be the same as Example 1, adds 5 parts of nanoscale aluminium nitride, 15 parts of micron grade aluminum oxides, 2 parts of phenyl second after heat treatment
Alkenyl silicones, 1 part of phenyl triethoxysilane, after banburying is uniform, 150 DEG C of heat treatments 40min, vacuum 1h remove low molecule,
Cooling discharging.
Embodiment 6
Weigh 100 parts of rubbers, 5 parts of hydroxy silicon oils, 0.4 part of stearic acid, 2 parts of diethyldiethoxysilanes, 25 parts of specific surface areas
For 200 m2/ g white carbon, banburying is uniform, 160 DEG C of heat treatment 30min, and 10 parts of nanoscale di-iron trioxides are added after cooling,
25 parts of micron order di-iron trioxides, 2 parts of methyl phenyl silicone resins, 1 part of Vinylphenyl silicon resin, 1.5 parts of phenyl methyl bases two
Ethoxysilane, banburying is uniform, 160 DEG C of heat treatments 40min, vacuum 1h, is discharged after removing low molecule.
Embodiment 7
Prior step be the same as Example 6, adds 10 parts of nanoscale aluminium nitride, 25 parts of micron grade aluminum oxides, 2 parts of phenyl second after heat treatment
Alkenyl silicones, 1 part of phenyl triethoxysilane, after banburying is uniform, 150 DEG C of heat treatments 40min, vacuum 1h remove low molecule,
Cooling discharging.
Embodiment 8
Prior step be the same as Example 6, adds 10 parts of nanoscale boron nitride, 25 parts of micron order zinc oxide, 2 parts of phenyl MQ after heat treatment
Silicones, 1 part of phenyl methyl diethoxy silane, after banburying is uniform, 150 DEG C of heat treatments 40min, vacuum 1h remove low molecule,
Cooling discharging.
Embodiment 9
Prior step be the same as Example 6, adds 10 parts of nanoscale di-iron trioxides, 25 parts of micron order di-iron trioxides, 2 after heat treatment
Part phenyl MQ silicones, 1 part of phenyl methyl diethoxy silane, after banburying is uniform, 150 DEG C of heat treatments 40min, vacuum 1h take off
Except low molecule, cooling discharging.
Embodiment 10
Prior step be the same as Example 6, adds 10 parts of nano grade iron powders, 25 parts of micron order aluminium hydroxides, 2 parts of phenyl MQ after heat treatment
Silicones, 1 part of phenyl methyl diethoxy silane, after banburying is uniform, 150 DEG C of heat treatments 40min, vacuum 1h remove low molecule,
Cooling discharging.
Comparative example 1
Weigh 100 parts of phenyl rubbers, 4 parts of hydroxy silicon oils, 0.4 part of stearic acid, 2 parts of diethyldiethoxysilanes, 20 parts compare table
Area is 150m2/ g white carbon, banburying is uniform, 170 DEG C of heat treatments 40 min, vacuum 1h, is discharged after removing low molecule.
Comparative example 2
Weigh 100 parts of phenyl rubbers, 6 parts of hydroxy silicon oils, 0.4 part of stearic acid, 2 parts of dimethyldimethoxysil,nes, 25 parts compare table
Area is 2002/ g white carbon, banburying is uniform, 170 DEG C of heat treatments 40 min, vacuum 1h, is discharged after removing low molecule.
Comparative example 3
Weigh 100 parts of rubbers, 4 parts of hydroxy silicon oils, 0.4 part of stearic acid, 2 parts of diethyldiethoxysilanes, 2 parts of cerium oxide, 20
Part specific surface area is 150m2/ g white carbon, banburying is uniform, 170 DEG C of heat treatments 40 min, vacuum 1h, goes out after removing low molecule
Material.
Comparative example 4
Weigh 100 parts of rubbers, 6 parts of hydroxy silicon oils, 0.4 part of stearic acid, 2 parts of dimethyldimethoxysil,nes, 2 parts of cerium oxide, 25
Part specific surface area is 2002/ g white carbon, banburying is uniform, 170 DEG C of heat treatments 40 min, vacuum 1h, goes out after removing low molecule
Material.
Comparative example 5
Weigh 100 parts of rubbers, 4 parts of hydroxy silicon oils, 4 parts of diethyldiethoxysilanes, 0.4 part of stearic acid, 20 parts of specific surface areas
For 1502/ g white carbon, banburying is uniform, after 170 DEG C of 40 min of heat treatment, adds 40 parts of di-iron trioxides, 170 DEG C of heat treatments
Discharged after 40 min, vacuum 1h, removing low molecule.
Comparative example 6
Weigh 100 parts of rubbers, 4 parts of hydroxy silicon oils, 4 parts of diethyldiethoxysilanes, 0.4 part of stearic acid, 25 parts of specific surface areas
For 2002/ g white carbon, banburying is uniform, after 170 DEG C of 40 min of heat treatment, adds 60 parts of zinc oxide, 170 DEG C of heat treatments 40
Discharged after min vacuum 1h, removing low molecule.
Performance test
After all high temperature resistant type high-temperature silicon disulfide rubbers are vulcanized, hardness, intensity are according to standard GBT 531.1-2008, GBT 528-
2009th, GBT 529-2008 are detected.Hot sky thermal acceleration senile experiment and heat resistance test are entered according to GB/T 3512-2001
OK.In order to preferably detect the heat resistance of heat-resistant adhesive, according to national standard content, by oven temperature regulation to 300 DEG C, sample is continuous
Aging 24h.In order to avoid small molecule is migrated in silicon rubber, it is to avoid while the product of aging multiple formulations in same ageing oven.
5 samples of every batch of test are averaged, and as a result see the table below：
As seen from the above table, organosilicon material of the invention belongs to thermosets, after being molded through hot setting, can tolerate for a long time
Hot operation.The high-temperature resistant rubber compound of the present invention is controlled by rubber, reinforced filling, heat-resistant filler, small molecule heat-resistant agent, structuring
Agent, surface-treated agent, heat resistant type surface conditioning agent, interior demolding aids etc. are constituted, and formula need to be matched completely with technique, are fed
Sequentially, the pretreatment of raw material, technical process etc. determines the realization of the Basic Physical Properties and high-temperature resistant result of final silicone rubber products.
High-temperature resistant rubber compound in the present invention in addition to the characteristic with conventional silicone rubber, because its production when used it is resistance to
Hot filler simultaneously coordinates the product after low molecule heat-resistant agent, curing molding to have high-temperature stability, at 300 DEG C, under the conditions of 24h, firmly
Degree increase is no more than 20%, and tensile strength, elongation at break, tear-proof characteristic, which decline, is no more than 30%, the same terms, with phenyl silicon
Elastomeric compound based on rubber, heat aging performance declines 35% or so, and conventional elastomeric compound, and hardness significantly rises, tensile strength,
Elongation at break, tearing toughness decline more than 60%, lose practicality.The high-temperature resistant rubber compound of the present invention, can effectively prolong
Service life of the silicon rubber in hot environment is grown, effect is obvious.In high-temperature-resisting silicon rubber field, currently without find can be with
On the premise of silicon rubber body construction is not changed, and realize silastic product resistant to elevated temperatures technical scheme for a long time.The present invention
High-temperature resistant rubber compound, can be controlled by by synchronous adjustment formula and technique, can produce the high-temperature resistant rubber compound of different hardness,
The requirement that can be applied under complex environment is realized, and air heat ageing can be resistant in hot environment, and is kept well
Mechanical performance, increases the service life, and reduces the loss of work device.High-temperature-resisting silicon rubber of the present invention coordinate be adapted to molding, extrusion,
The various products moulding process, plastic variously-shaped high temperature resistant work device such as injection.
Above-described embodiment is only used for illustrating the inventive concept of the present invention, rather than the restriction to rights protection of the present invention,
All changes for carrying out unsubstantiality to the present invention using this design, all should fall into protection scope of the present invention.
Claims (13)
1. a kind of high temperature resistant type high-temperature silicon disulfide rubber, it is characterised in that according to the mass fraction including following components：Rubber 100
Part, 5-100 parts of reinforced filling, 1-100 parts of nanoscale heat-resistant filler, 1-100 parts of micron order heat-resistant filler, low molecule heat-resistant agent
0.5-20 parts, it is 3-15 parts of antistructurizing agent, 1-10 parts of surface-treated agent, 0.1-10 parts of heat resistant type surface conditioning agent, interior
0.1-10 parts of demolding aids.
2. a kind of high temperature resistant type high-temperature silicon disulfide rubber according to claim 1, it is characterised in that：Described rubber is second
Alkenyl is blocked or the linear poly-organosilicon siloxanes of methyl blocking, and its molecular weight is 500000-800000g/mol, contents of ethylene
For 0.03-5mol%.
3. a kind of high temperature resistant type high-temperature silicon disulfide rubber according to claim 2, it is characterised in that：The rubber is two kinds
Or the mixture of the linear high molecular weight poly-organosilicon siloxanes of two or more different contents of ethylene.
4. a kind of high temperature resistant type high-temperature silicon disulfide rubber according to claim 1, it is characterised in that：The reinforced filling is
Precipitated silica, fume colloidal silica, diatomite, super-fine silicon micro-powder, nano-calcium carbonate, silica flour, zirconium silicate, titanium dioxide,
One or more in kaolin.
5. a kind of high temperature resistant type high-temperature silicon disulfide rubber according to claim 1, it is characterised in that：Described nanoscale is resistance to
Hot filler is iron powder, di-iron trioxide, ferrous oxide, ferroso-ferric oxide, iron hydroxide, ferric oxalate, Organosilylferrocene, iron tin
Compound, tin oxide, cerium oxide, zinc oxide, silicon powder, aluminium powder, aluminum oxide, aluminium nitride, magnesia, magnesium hydroxide, zirconium oxide,
Calcium oxide, titanium nitride, carborundum, boron carbide, boron nitride, silicon nitride, boron phosphide, phosphatization silicon, rare earth, cadmium powder, graphite, carbon fiber
Or one or several kinds of mixing in glass fibre, its average grain diameter is 1-1000nm.
6. a kind of high temperature resistant type high-temperature silicon disulfide rubber according to claim 1, it is characterised in that：Described micron order is resistance to
Hot filler is iron powder, di-iron trioxide, ferrous oxide, ferroso-ferric oxide, iron hydroxide, ferric oxalate, Organosilylferrocene, iron tin
Compound, tin oxide, cerium oxide, zinc oxide, silicon powder, aluminium powder, aluminum oxide, aluminium nitride, magnesia, magnesium hydroxide, zirconium oxide,
Calcium oxide, titanium nitride, carborundum, boron carbide, boron nitride, silicon nitride, boron phosphide, phosphatization silicon, rare earth, cadmium powder, graphite, carbon fiber
Or one or several kinds of mixing in glass fibre, its average grain diameter is 1-1000 μm.
7. a kind of high temperature resistant type high-temperature silicon disulfide rubber according to claim 1, it is characterised in that：Described low molecule is resistance to
Thermit powder is the silicone compounds of the network-like crosslinking containing phenyl or phenylene, the network-like friendship containing phenyl or phenylene
The silicone compounds of connection are phenyl methyl silicones, phenyl vinyl polysiloxane, the hydrogeneous silicones of phenyl, phenyl MQ silicon trees
One or several kinds in fat, the cagelike silsesquioxane containing phenyl or polyphenylsilsesquioxane.
8. a kind of high temperature resistant type high-temperature silicon disulfide rubber described in claim 1, it is characterised in that：Described antistructurizing agent
For the one or more in hydroxy silicon oil, dihydric alcohol, two organic basic ring silicon ethers, HMDS or cyclosilazane, and knot
The viscosity of structure controlling agent is 20-50 mPas.
9. a kind of high temperature resistant type high-temperature silicon disulfide rubber according to claim 1, it is characterised in that：Described filler surface
Inorganic agent be tetramethoxy-silicane, tetraethoxysilane, tetrapropoxysilane, four butoxy silanes, MTMS,
MTES, epoxy radicals triethoxysilane, epoxy radicals trimethoxy silane, vinyltrimethoxy silane, second
Alkenyl triethoxysilane, dimethyldimethoxysil,ne, dimethyldiethoxysilane, diethyldiethoxysilane, second
Enylmethyl dimethoxysilane or vinyl methyl diethoxy silane one or more therein.
10. a kind of high temperature resistant type high-temperature silicon disulfide rubber according to claim 1, it is characterised in that：Described heat resistant type
Surface conditioning agent be the low-molecular-weight siloxane containing phenyl, the low-molecular-weight siloxane containing phenyl be diphenyl silanediol,
Octaphenylcyclotetrasiloxane, phenyl triethoxysilane, phenyltrimethoxysila,e, dimethoxydiphenylsilane or diphenyl
Diethoxy silane is therein several or one kind.
11. a kind of high temperature resistant type high-temperature silicon disulfide rubber according to claim 1, it is characterised in that：The described interior demoulding
Auxiliary agent is at least one of aliphatic salt, aliphatic acid or fatty alcohol or a variety of.
12. a kind of preparation method of high temperature resistant type high-temperature silicon disulfide rubber, it is characterised in that comprise the following steps：Rubbed with linear height
Polymer based on your quality polysiloxane, be aided with reinforced filling, heat-resistant filler, heat resistant type surface conditioning agent, low point
Sub- heat-resistant agent, surface-treated agent, interior demolding aids, are prepared from by shear agitation, high temperature banburying, mill and filtering.
13. the preparation method of high temperature resistant type high-temperature silicon disulfide rubber according to claim 12, it is characterised in that：It is sulfided into
1-5% vulcanizing agent is added during type, described vulcanizing agent is peroxide vulcanizing agent or platinum vulcanizing agent.
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