CN107118705A - It is a kind of for aeroge compound heat-insulation piece of electronic product and preparation method thereof - Google Patents
It is a kind of for aeroge compound heat-insulation piece of electronic product and preparation method thereof Download PDFInfo
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- CN107118705A CN107118705A CN201710461597.3A CN201710461597A CN107118705A CN 107118705 A CN107118705 A CN 107118705A CN 201710461597 A CN201710461597 A CN 201710461597A CN 107118705 A CN107118705 A CN 107118705A
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- aeroge
- heat
- layer
- thermal insulation
- insulation layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a kind of for aeroge compound heat-insulation piece of electronic product and preparation method thereof.A kind of aeroge compound heat-insulation piece for electronic product, including at least one layer of unit thermal insulation layer；Unit thermal insulation layer includes aerogel particle thermal insulation layer and heat-resistant fireproof layers of two-sided；The aerogel particle layer upper surface of the superiors' unit thermal insulation layer is provided with fire retardant insulating protective layer；The heat-resistant fireproof layers of two-sided lower surface of most lower level unit thermal insulation layer is provided with mould release membrance.Preparation method：First, aeroge molecule is prepared；2nd, heat-resistant fireproof double faced adhesive tape is prepared；3rd, spray；4th, multilayer is repeated；5th, patch fire retardant insulating protective layer and mould release membrance.A kind of aeroge compound heat-insulation piece for electronic product of the present invention, it is non-friable, there are good mechanical strength and resistance to pressure；Thermal conductivity factor is low, can self bonding, it is bent, have stronger pliability, volume can be made, can be in blocks, preparation method is simple and easy to apply, widely applicable.
Description
Technical field
The present invention relates to the heat-insulated field of electronic product heat generating component, more particularly to a kind of airsetting for electronic product
Glue compound heat-insulation piece and preparation method thereof.
Background technology
With developing rapidly for microelectronics integrated technology and high density PCB package technique, packing density is improved rapidly,
Electronic component, thousands of times of ground of logic circuit volume reduce, and notebook computer increasingly develops towards light, thin, small direction, at present
Notebook CPU is coordinates its speed of service, and usual CPU need to run at high speed, therefore local pyrexia amount can be significantly increased, together
When display screen require high brightness, make LED light emitting diodes quantity increase, the caloric value of equipment is also increased, while because of power consumption
Increase, battery capacity also needs increase, and the heat energy produced by internal battery impedance is substantially improved, and such as the heat energy sent can not be allowed to have
Sequence sheds and isolated, CPU, video card, LED light emitting diodes, the heat-sensitive element on these thermal source peripheries of battery because temperature is too high and
Shorten the life-span or loss of function, especially, the electronic product casing temperature of near heating sources are too high, on the one hand can cause user
Discomfort, still further aspect, due to the excessive temperature that shell is born, causes to influence the service life of shell and causes casing appearance
Deterioration.The heat-insulated of electronic product is normally applied glass fibre in the market, but glass fibre thermal conductivity factor is higher, easily falls bits,
Bound edge is needed to press it because its thermal-insulation function can be reduced after pressure exhaust, processing technology is also complex.Common bulk gas
Gel is frangible, no intensity, not plastic, it is impossible to be directly used in the heat-insulated of electronic product.
The content of the invention
In order to solve the above technical problems, the invention provides a kind of aeroge compound heat-insulation piece for electronic product and its
Preparation method, bent, non-friable, thermal conductivity factor is low, and preparation method is simple and easy to apply, easy to operate.
The technical solution adopted for the present invention to solve the technical problems is：A kind of aeroge for electronic product it is compound every
Backing, it includes at least one layer of unit thermal insulation layer；The unit thermal insulation layer includes aerogel particle thermal insulation layer and heat-resistant fireproof
Layers of two-sided；The upper surface of the aerogel particle layer of the unit thermal insulation layer of the superiors is provided with fire retardant insulating protective layer；It is described most
The lower surface of the heat-resistant fireproof layers of two-sided of the unit thermal insulation layer of lower floor is provided with mould release membrance.
The gross thickness of the aeroge compound heat-insulation piece is 0.1-50mm；The thickness of the fire retardant insulating protective layer is
0.005-0.1mm；The thickness of the aerogel particle thermal insulation layer is 0.005-0.1mm；The heat-resistant fireproof layers of two-sided
Thickness is 0.02-0.1mm.
The fire retardant insulating protective layer is that polyester flame-retardant thinfilm protective coating, polyimide film protective layer, polyvinyl fluoride are thin
Film protective layer or fire-retardant polycarbonate fire-retardant film protective layer.
The aerogel particle thermal insulation layer is to be sprayed on by aeroge molecule in heat-resistant fireproof layers of two-sided.
The particle diameter of the aeroge molecule of the aerogel particle thermal insulation layer is 0.1-100 μm.
The diameter of cavity between the aeroge molecule of the aerogel particle thermal insulation layer is less than 69nm.
The heat-resistant fireproof layers of two-sided is polyester flame-retardant film double-sided glue-line, polyimide film layers of two-sided, gathered
Fluoroethylene film layers of two-sided, fire-retardant polycarbonate fire-retardant film layers of two-sided.
The aeroge molecule of the aerogel particle thermal insulation layer is inorganic aerogels, organic aerogel or inorganic/have
Machine hybrid aerogel.
The inorganic aerogels include SiO2Aeroge, Al2O3Aeroge, TiO2Aeroge or SiC aeroges.
A kind of preparation method of aeroge compound heat-insulation piece for electronic product, possesses and carries out according to the following steps：
First, block aeroge is crushed to particle diameter for 0.1-100 μm, forms aeroge molecule；
2nd, heat-resistant fireproof double faced adhesive tape is prepared；
3rd, by the aeroge molecule even application of step one on the surface of heat-resistant fireproof double faced adhesive tape, airsetting is formed
Glue particle thermal insulation layer；
When the 4th, preparing the aeroge compound heat-insulation piece of a layer unit thermal insulation layer, step 5 is directly entered；Prepare and be more than one layer
The aeroge compound heat-insulation piece of unit thermal insulation layer, the heat-resistant fireproof for being coated with aeroge molecule in step 3 is two-sided
The surface of glue re-lays one layer of heat-resistant fireproof double faced adhesive tape, then repeat step three, until reaching that the multilevel-cell of needs is heat-insulated
Layer, then, into step 5；
5th, one is rolled on the outermost aerogel particle thermal insulation layer of one or more layers unit thermal insulation layer prepared by step 4
Layer states one layer of mould release membrance of rolling on fire retardant insulating protective layer, outermost heat-resistant fireproof double faced adhesive tape.
Beneficial effects of the present invention：A kind of aeroge compound heat-insulation piece for electronic product of the present invention, it is non-friable, have
Good mechanical strength and resistance to pressure；The porosity of aerogel particle thermal insulation layer is greatly increased, and reduces the heat conduction system of aeroge
Number, can self bonding, it is bent, have stronger pliability, volume can be made, can be in blocks, preparation method is simple and easy to apply, widely applicable.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of aeroge compound heat-insulation piece for electronic product of the present embodiment.
Embodiment
In order to deepen the understanding of the present invention, the present invention is done below in conjunction with drawings and examples and further retouched in detail
State, the embodiment is only used for explaining the present invention, protection scope of the present invention is not constituted and limited.
Embodiment
As shown in figure 1, present embodiments providing a kind of aeroge compound heat-insulation piece for electronic product, it is included at least
One layer unit thermal insulation layer；The unit thermal insulation layer includes aerogel particle thermal insulation layer 200 and heat-resistant fireproof layers of two-sided 300；
The upper surface of the aerogel particle layer 200 of the unit thermal insulation layer of the superiors is provided with fire retardant insulating protective layer 100；The orlop
The lower surface of heat-resistant fireproof layers of two-sided 300 of unit thermal insulation layer be provided with mould release membrance 400；The aeroge compound heat-insulation
The gross thickness of piece is 0.1-50mm；The thickness of the fire retardant insulating protective layer 100 is 0.005-0.1mm；The aerogel particle
The thickness of thermal insulation layer 200 is 0.005-0.1mm；The thickness of the heat-resistant fireproof layers of two-sided 300 is 0.02-0.1mm；It is described
Fire retardant insulating protective layer 100 be polyester flame-retardant thinfilm protective coating, polyimide film protective layer, polyvinyl fluoride thin film protective layer or
Fire-retardant polycarbonate fire-retardant film protective layer；The aerogel particle thermal insulation layer 200 is to be sprayed on by aeroge molecule
In heat-resistant fireproof layers of two-sided 300；The particle diameter of the aeroge molecule of the aerogel particle thermal insulation layer 200 is 0.1-
100μm；The diameter of cavity between the aeroge molecule of the aerogel particle thermal insulation layer 200 is less than 69nm；It is described resistance to
High temperature flame-proof layers of two-sided 300 is polyester flame-retardant film double-sided glue-line, polyimide film layers of two-sided, polyvinyl fluoride thin film pair
Face glue-line, fire-retardant polycarbonate fire-retardant film layers of two-sided；The aeroge molecule of the aerogel particle thermal insulation layer 200 is
Inorganic aerogels, organic aerogel or inorganic/organic hybrid aeroge；The inorganic aerogels include SiO2Aeroge, Al2O3
Aeroge, TiO2Aeroge or SiC aeroges.
A kind of preparation method of aeroge compound heat-insulation piece for electronic product of the present embodiment, possesses according to the following steps
Carry out：First, block aeroge is crushed to particle diameter for 0.1-100 μm, forms aeroge molecule；2nd, high temperature resistant is prepared
Fire-retardant double faced adhesive tape；3rd, by the aeroge molecule even application of step one on the surface of heat-resistant fireproof double faced adhesive tape, gas is formed
Gel particle thermal insulation layer；When the 4th, preparing the aeroge compound heat-insulation piece of a layer unit thermal insulation layer, step 5 is directly entered；Prepare
More than the aeroge compound heat-insulation piece of a layer unit thermal insulation layer, the high temperature resistant for being coated with aeroge molecule in step 3
The surface of fire-retardant double faced adhesive tape re-lays one layer of heat-resistant fireproof double faced adhesive tape, then repeat step three, until reaching the multilayer of needs
Unit thermal insulation layer, then, into step 5；5th, one or more layers outermost airsetting of unit thermal insulation layer prepared in step 4
One layer of rolling is stated on glue particle thermal insulation layer rolls a leafing type on fire retardant insulating protective layer, outermost heat-resistant fireproof double faced adhesive tape
Film.
A kind of aeroge compound heat-insulation piece for electronic product of the present embodiment, thermal conductivity factor can reach 0.028-
0.20W/MK；It is breakdown voltage resistant to be more than 500V；The heatproof of heat-resistant fireproof layers of two-sided therein is more than 260 DEG C.
A kind of spraying method of aeroge compound heat-insulation piece for electronic product of the present embodiment includes and is not limited to
Aerial spraying, airless spraying, mixed gas blowout painting, air electrostatic spraying, mixed gas blowout apply the methods such as electrostatic.
A kind of airsetting in the aeroge compound heat-insulation piece for electronic product of the present embodiment, aerogel particle thermal insulation layer
Cavity new one by one is formed between glue molecule, this cavity diameter is less than the 69nm of the average value free path of air molecule,
And then the porosity of aerogel particle layer is added, significantly reduce the thermal conductivity factor of aeroge compound heat-insulation piece.
A kind of aeroge compound heat-insulation piece for electronic product of the present embodiment, can effectively separate the heat around thermal source
Sensing element, increase heat-sensitive element service life and the normal operation for ensureing heat-sensitive element；Meanwhile, it can also eliminate electronics production
The point heat problem of product；Effectively the casing spot temperature of reduction near heating sources, reduces the possibility scalded, because reducing part
High temperature and add user contact electronic product when comfort level.
A kind of aeroge compound heat-insulation piece for electronic product of the present embodiment, it is non-friable, there is good mechanical strength
And resistance to pressure；The porosity of aerogel particle thermal insulation layer is greatly increased, and reduces the thermal conductivity factor of aeroge, can self bonding, can
Bending, has stronger pliability, can make volume, can be in blocks, and preparation method is simple and easy to apply, widely applicable.
Above-described embodiment should not in any way limit the present invention, all to be obtained by the way of equivalent substitution or equivalency transform
Technical scheme all fall within protection scope of the present invention.
Claims (10)
1. a kind of aeroge compound heat-insulation piece for electronic product, it is characterised in that：It includes at least one layer of unit thermal insulation layer；
The unit thermal insulation layer includes aerogel particle thermal insulation layer and heat-resistant fireproof layers of two-sided；The gas of the unit thermal insulation layer of the superiors
The upper surface of gel particle layer is provided with fire retardant insulating protective layer；The heat-resistant fireproof of the undermost unit thermal insulation layer is two-sided
The lower surface of glue-line is provided with mould release membrance.
2. a kind of aeroge compound heat-insulation piece for electronic product according to claim 1, it is characterised in that：The gas
The gross thickness of gel compound heat-insulation piece is 0.1-50mm；The thickness of the fire retardant insulating protective layer is 0.005-0.1mm；The gas
The thickness of gel particle thermal insulation layer is 0.005-0.1mm；The thickness of the heat-resistant fireproof layers of two-sided is 0.02-0.1mm.
3. a kind of aeroge compound heat-insulation piece for electronic product according to claim 2, it is characterised in that：The resistance
Combustion insulating protective layer is polyester flame-retardant thinfilm protective coating, polyimide film protective layer, polyvinyl fluoride thin film protective layer or fire-retardant
Polycarbonate flame retardant thinfilm protective coating.
4. a kind of aeroge compound heat-insulation piece for electronic product according to claim 2, it is characterised in that：The gas
Gel particle thermal insulation layer is to be sprayed on by aeroge molecule in heat-resistant fireproof layers of two-sided.
5. a kind of aeroge compound heat-insulation piece for electronic product according to claim 4, it is characterised in that：The gas
The particle diameter of the aeroge molecule of gel particle thermal insulation layer is 0.1-100 μm.
6. a kind of aeroge compound heat-insulation piece for electronic product according to claim 5, it is characterised in that：The gas
The diameter of cavity between the aeroge molecule of gel particle thermal insulation layer is less than 69nm.
7. a kind of aeroge compound heat-insulation piece for electronic product according to claim 2, it is characterised in that：It is described resistance to
High temperature flame-proof layers of two-sided is that polyester flame-retardant film double-sided glue-line, polyimide film layers of two-sided, polyvinyl fluoride thin film are two-sided
Glue-line, fire-retardant polycarbonate fire-retardant film layers of two-sided.
8. a kind of aeroge compound heat-insulation piece for electronic product according to claim 6, it is characterised in that：The gas
The aeroge molecule of gel particle thermal insulation layer is inorganic aerogels, organic aerogel or inorganic/organic hybrid aeroge.
9. a kind of aeroge compound heat-insulation piece for electronic product according to claim 8, it is characterised in that：The nothing
Machine aeroge includes SiO2Aeroge, Al2O3Aeroge, TiO2Aeroge or SiC aeroges.
10. a kind of preparation method of aeroge compound heat-insulation piece for electronic product as described in claim 1-9, its feature
It is：Preparation method possesses to be carried out according to the following steps：
First, block aeroge is crushed to particle diameter for 0.1-100 μm, forms aeroge molecule；
2nd, heat-resistant fireproof double faced adhesive tape is prepared；
3rd, by the aeroge molecule even application of step one on the surface of heat-resistant fireproof double faced adhesive tape, aeroge is formed
Grain thermal insulation layer；
When the 4th, preparing the aeroge compound heat-insulation piece of a layer unit thermal insulation layer, step 5 is directly entered；Prepare and be more than a layer unit
The aeroge compound heat-insulation piece of thermal insulation layer, the heat-resistant fireproof double faced adhesive tape for being coated with aeroge molecule in step 3
Surface re-lays one layer of heat-resistant fireproof double faced adhesive tape, then repeat step three, until reaching the multilevel-cell thermal insulation layer of needs, so
Afterwards, into step 5；
5th, one layer of rolling is stated on the outermost aerogel particle thermal insulation layer of one or more layers unit thermal insulation layer prepared by step 4
One layer of mould release membrance is rolled on fire retardant insulating protective layer, outermost heat-resistant fireproof double faced adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710461597.3A CN107118705A (en) | 2017-06-19 | 2017-06-19 | It is a kind of for aeroge compound heat-insulation piece of electronic product and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710461597.3A CN107118705A (en) | 2017-06-19 | 2017-06-19 | It is a kind of for aeroge compound heat-insulation piece of electronic product and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107118705A true CN107118705A (en) | 2017-09-01 |
Family
ID=59718558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710461597.3A Withdrawn CN107118705A (en) | 2017-06-19 | 2017-06-19 | It is a kind of for aeroge compound heat-insulation piece of electronic product and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN107118705A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108587510A (en) * | 2018-05-08 | 2018-09-28 | 王宏宁 | Aerogel heat-proof piece |
| CN109536070A (en) * | 2018-12-10 | 2019-03-29 | 佛山市佳世达薄膜科技有限公司 | A kind of high temperature resistant non-silicon release film |
| CN112940636A (en) * | 2021-02-03 | 2021-06-11 | 东莞市鸿亿导热材料有限公司 | Aerogel material for electronic products and preparation method thereof |
-
2017
- 2017-06-19 CN CN201710461597.3A patent/CN107118705A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108587510A (en) * | 2018-05-08 | 2018-09-28 | 王宏宁 | Aerogel heat-proof piece |
| CN109536070A (en) * | 2018-12-10 | 2019-03-29 | 佛山市佳世达薄膜科技有限公司 | A kind of high temperature resistant non-silicon release film |
| CN112940636A (en) * | 2021-02-03 | 2021-06-11 | 东莞市鸿亿导热材料有限公司 | Aerogel material for electronic products and preparation method thereof |
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Application publication date: 20170901 |
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