CN107116186B - A kind of slim slab copper plate of crystallizer of compound cooling structure - Google Patents
A kind of slim slab copper plate of crystallizer of compound cooling structure Download PDFInfo
- Publication number
- CN107116186B CN107116186B CN201710285764.3A CN201710285764A CN107116186B CN 107116186 B CN107116186 B CN 107116186B CN 201710285764 A CN201710285764 A CN 201710285764A CN 107116186 B CN107116186 B CN 107116186B
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- cooling water
- water hole
- bosh
- cooling
- copper plate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/04—Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
- B22D11/055—Cooling the moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/04—Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
- B22D11/059—Mould materials or platings
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Continuous Casting (AREA)
Abstract
The invention belongs to conticaster crystallizer technical fields, a kind of slim slab copper plate of crystallizer of compound cooling structure is specifically disclosed, it is working face including front, the back side is the copper plate bodies of cooling surface, overleaf and in the lower part of meniscus surface area multiple boshes are set, overleaf and in meniscus surface area multiple cooling water holes are set, the centerline parallel of cooling water hole is in copper coin front, the center line of cooling water hole is with cooling water channel center line apart from described positive apart from equal, the translot of the two is connected to the setting of bosh boundary position in cooling water hole, the quantity of cooling water hole is more than the quantity of the bosh, and cooling water hole is spaced set.This structure design can meet the characteristics of sink easy processing, it is avoided that liquid molten steel even phenomenon of inhomogeneous cooling in the region of meniscus surface area and initial solidification shell again simultaneously, the generation for the defects of causing steel billet to bring crackle makes green shell be formed and be grown evenly in meniscus surface area, and billet quality is more preferable.
Description
Technical field
The invention belongs to conticaster crystallizer technical field, more particularly to the slim slab of a kind of compound cooling structure crystallizes
Device copper coin.
Background technology
With development in science and technology, metallurgical technology both domestic and external, especially large iron and steel enterprise pass through improvement to equipment and pipe
Reason method it is perfect, can produce high alloy, high-quality, high crack sensitivity steel grade, especially big cross section strand continuous casting
The development of technology so that the compression ratio of steel increases, the product quality of steel is quickly improved, and wherein strand is in conticaster knot
It is cooled down when molding in brilliant device, which needs to use the copper plate of crystallizer with bosh.
Wherein, slim slab copper plate of crystallizer is usually there are two types of cooling pattern, and one is full sink structures, but because of sink surface
Threaded hole with water tank drawing is set, and since the gusset where threaded hole there will be one fixed width, this results in bosh
Spacing is presented non-uniform phenomenon and just increases corresponding cooling water hole on the gusset where threaded hole to make up this phenomenon；
Another kind is full outlet hole structure, and this water hole processing, it is suitable for reading to get into always copper coin for mouth under copper coin；The structure of above two copper coin
Design all has that water hole difficulty of processing is big, and the higher problem of rejection rate virtually increases the cost input of enterprise.
To disclose a kind of wide-surface copper plate of crystallizer of continuous slab casting machine cold for the patent document that notification number is CN202155493U
But structure, including wide face copper coin, cooling water channel is arranged on wide face copper coin, and the cooling water channel is in non-uniform Distribution, wherein in steel
The active upper recirculation zone cooling water channel spacing of water is 16-21 millimeters, and other position cooling water channel spacing are 17-23 millimeters.It should
Structure is unreasonable for current broadside copper board of continuous casting crystallizer for thin slab blank cooling structure, and wide face copper coin and strand temperature is caused to cool down
It is uneven, easily cause the problems such as low copper coin severe crack, service life, slab quality defect and improved, to Wide-surface copper plate of crystallizer
Cooling water channel is optimized design, and cooling water channel diameter reduces, quantity increases, and according to liquid steel temperature distribution situation into
Row reasonable layout is effectively improved the wide face intensity of cooling of crystallizer, improves the wide face Temperature Distribution of crystallizer, reduces copper plate of crystallizer table
Face temperature difference improves slab quality.
Authorization Notice No. CN102581239 B disclose a kind of Wide-surface copper plate of crystallizer for High Efficiency Slab Caster, packet
Wide face copper coin ontology and several columns screw hole thereon are included, the huyashi-chuuka (cold chinese-style noodles) of wide face copper coin ontology is equipped with bosh, the cooling water
Slot includes the different bendway and shallow-water tank of depth；Between adjacent two row screw hole, two bendways are symmetrical close to screw hole
Setting, center line symmetrical setting of two shallow-water tanks close to two row screw holes；The center line of the bendway is away from its nearest row
The center line distance of screw hole is 16 ~ 18mm, the center line distance of the center line of the shallow-water tank away from its nearest bendway for 16 ~
20mm。
Above two structure is disadvantageous in that：The problem of equally existing big water hole difficulty of processing, high rejection rate.
Invention content
In view of this, in view of the deficiencies of the prior art, it is an object of the present invention to provide a kind of the ultra-thin of compound cooling structure
The characteristics of Slab Crystallizer Bronze Plate, this structure design can meet sink easy processing, while being avoided that liquid molten steel in bent moon again
The even phenomenon of inhomogeneous cooling in face region and the region of initial solidification shell, the generation for the defects of causing steel billet to bring crackle, makes green shell exist
Meniscus surface area is formed and is grown evenly, and billet quality is more preferable.
In order to achieve the above objectives, the present invention uses following technical scheme：
A kind of slim slab copper plate of crystallizer of compound cooling structure, including front is working face, the back side is cooling surface
Copper plate bodies are arranged multiple boshes at the back side and in the lower part of meniscus surface area, edge are arranged in the bosh
Item, the panel form cooling water channel, the lower end of the panel and the bosh by locating piece and bosh bottom
Lower wall between reserve inlet opening, at the back side and in meniscus surface area, multiple cooling water holes, the cooling water hole are set
Centerline parallel in copper coin front, the center line of the cooling water hole and the cooling water channel center line apart from it is described just
For identity distance from equal, the cooling water hole is threaded plug on the top of copper plate bodies, below the screw plug and
Apopore is arranged in the top of meniscus surface area, and the apopore is perpendicular to the copper coin back side, the apopore and the cooling water hole
Connection is connected to the translot of the two, the number of the cooling water hole in the cooling water hole with the setting of bosh boundary position
Amount is more than the quantity of the bosh, and the cooling water hole is spaced set.
Further, expansion joint laterally or vertically is set on the back side between the apopore and the translot
Or telescopic hole, the bottom end of the expansion joint or telescopic hole are not less than 5mm apart from cooling water hole.
The beneficial effects of the invention are as follows：
1. it is of the invention by the way that multiple cooling water holes are arranged close to the upper surface of meniscus surface area in copper plate bodies, and cold
But translot is opened up between water hole and bosh, the type of cooling combined using cooling water hole and bosh is being made first
In technique, bosh and translot compared with the prior art in through type bosh difficulty of processing it is relatively low, can both solve strand
Hidden danger of quality is brought since bosh one leads to bottom inhomogeneous cooling in forming process, also solves the problem that a cooling water hole for leading to bottom
The problem of difficult processing, effectively save cost of manufacture reduce scrappage；
In particular, setting is connected to the translot of the two between cooling water hole and bosh, using bottom in and top out mode
During slab cooling, this structure design is reassigned to cooling water after so that the cooling water in bosh is collected in translot
The problem of cooling water is unevenly distributed effectively is prevented in hole, improves casting blank formation quality.
2. in the production process, because slim slab crystallizer copper plate thickness is larger, sink is deeper, from machining angle cooling water
Slot is relatively wide, is just conducive to the intensity for maintaining cutter, while water hole is more, and the Temperature Distribution inside copper plate bodies is more uniform,
So sink width is greater than the diameter of cooling water hole, i.e. the quantity of cooling water hole is more than the quantity of bosh.
3. panel is arranged in bosh, panel forms cooling water channel by locating piece and bosh bottom, panel
Inlet opening is reserved between lower end and the lower wall of bosh, inlet opening goes out connection setting inlet tank, copper plate bodies rear end face
Apopore is set, and apopore is arranged close to meniscus surface area, and the bottom end of apopore is connected with cooling water hole；This structure design is logical
It crosses and panel is set in bosh, cooling water channel is made to narrow, that is, increase the water velocity in cooling water channel, it is whole to improve
The heat-transfer capability and cooling efficiency of a crystallizer.
4. expansion joint laterally or vertically or telescopic hole are arranged on the back side between apopore and translot, expansion joint or stretch
Spacing of the bottom end of shrinkage cavity apart from cooling water hole is not less than 5mm；This structure design passes through the cast entrance setting in copper plate bodies
Expansion joint or telescopic hole so that expanding with heat and contract with cold for copper plate bodies high temperature position is able to adequate compensation, reduces copper plate bodies and is poured into
The prestressing force and deformation size of mouth position increase the service life of copper coin due to the phenomenon that preventing copper coin line from splitting and deforming.
Description of the drawings
Fig. 1 is the structural schematic diagram of the embodiment of the present invention one；
Fig. 2 is cross section structure schematic diagram of the embodiment of the present invention one along cast direction；
Fig. 3 is the structural schematic diagram of the embodiment of the present invention two；
Fig. 4 is cross section structure schematic diagram of the embodiment of the present invention two along cast direction；
Fig. 5 is the cross section structure schematic diagram that three panel of the embodiment of the present invention is inclined-plane；
Fig. 6 is that three panel of the embodiment of the present invention is step-like cross section structure schematic diagram.
Figure label：1- working faces, 2- boshes, 3- meniscus surface areas, 4- cooling water holes, 5- translots, 6- panels, 7-
Cooling water channel, 8- positioning plates, 9- positioning bolts, the inlet openings 10-, 11- intake chambers, 12- water inlet lines, 13- apopores, 14- go out
Hydroecium, 15- outlet conduits, 16- telescopic holes, 17- screw plugs, the upper portion end surfaces of 61-, 62- lower parts end face.
Specific implementation mode
The invention will be further described with reference to the accompanying drawings and examples.
Embodiment one
As depicted in figs. 1 and 2, it is working face 1, the copper plate bodies that the back side is cooling surface that the present invention, which includes front, the back side and
The copper plate bodies of nine boshes 2 are set in the lower part of meniscus surface area 3, bosh 2 is located under meniscus surface area 3
Side, bosh 2 is interior to be arranged panel 6, and panel 6 passes through locating piece and cooling water channel 7, locating piece packet are formed on 2 bottom of bosh
Positioning plate 8 and positioning bolt 9 are included, panel 6 is fixedly connected by positioning bolt 9 with positioning plate 8, and the both ends of positioning plate 8 are fixed on
The surface of copper plate bodies, between the lower end and the lower wall of bosh 2 of panel 6 reserve inlet opening 10, inlet opening 10 be arranged into
Hydroecium 11 and water inlet line 12, intake chamber 11 is between inlet opening 10 and water inlet line 12；
At the back side of copper plate bodies and in meniscus surface area, multiple cooling water holes 4, the centerline parallel of cooling water hole 4 are set
In the positive burnishing surface of copper coin, the center line of cooling water hole 3 is with 7 center line of cooling water channel apart from copper plate bodies front apart from phase
Deng cooling water hole 4 is threaded plug 17 on the top of copper plate bodies, below screw plug 17 and in meniscus surface area 3
Top apopore 13 is set, perpendicular to the back side of copper plate bodies, lower end and the cooling water hole 4 of apopore 13 connect apopore 13
Logical, the bottom end of apopore 13 is connected with cooling water hole 4, and the outer end setting water-supplying chamber 14 of apopore 13 and outlet conduit 15 go out
Hydroecium 14 is connected to the two between outlet conduit 15 and apopore 13, in cooling water hole 4 with the setting of 2 boundary position of bosh
Translot 5, the quantity of cooling water hole 4 is more than the quantity of bosh 2, and cooling water hole 4 is spaced set；It need to point out
It is cooling water hole 4 with circular hole parallel with working face in Fig. 1 to be.
Embodiment two
As shown in Figure 3 and Figure 4, it is working face 1, the copper plate bodies that the back side is cooling surface that the present invention, which includes front, the back side and
The copper plate bodies of nine boshes 2 are set in the lower part of meniscus surface area 3, bosh 2 is located under meniscus surface area 3
Side, bosh 2 is interior to be arranged panel 6, and panel 6 passes through locating piece and cooling water channel 7, locating piece packet are formed on 2 bottom of bosh
Positioning plate 8 and positioning bolt 9 are included, panel 6 is fixedly connected by positioning bolt 9 with positioning plate 8, and the both ends of positioning plate 8 are fixed on
The surface of copper plate bodies, between the lower end and the lower wall of bosh 2 of panel 6 reserve inlet opening 10, inlet opening 10 be arranged into
Hydroecium 11 and water inlet line 12, intake chamber 11 is between inlet opening 10 and water inlet line 12；
At the back side of copper plate bodies and in meniscus surface area, multiple cooling water holes 4, the centerline parallel of cooling water hole 4 are set
In the positive burnishing surface of copper coin, the center line of cooling water hole 3 is with 7 center line of cooling water channel apart from copper plate bodies front apart from phase
Deng cooling water hole 4 is threaded plug 17 on the top of copper plate bodies, below screw plug 17 and in meniscus surface area 3
Top apopore 13 is set, perpendicular to the back side of copper plate bodies, lower end and the cooling water hole 4 of apopore 13 connect apopore 13
Logical, the bottom end of apopore 13 is connected with cooling water hole 4, and the outer end setting water-supplying chamber 14 of apopore 13 and outlet conduit 15 go out
Hydroecium 14 is connected to the two between outlet conduit 15 and apopore 13, in cooling water hole 4 with the setting of 2 boundary position of bosh
Translot 5, the quantity of cooling water hole 4 is more than the quantity of bosh 2, and cooling water hole 4 is spaced set；13 He of apopore
Telescopic hole 16 is equipped between translot 5, the bottom end of telescopic hole 16 must not contact cooling water hole 4 and the spacing apart from cooling water hole 4 is
5mm。
Embodiment three
The present embodiment and the structure of embodiment two are essentially identical, unlike：Panel 6 is in 2 bottom of bosh
End face includes upper and lower two parts, and upper portion end surface 61 is smaller than lower part end face 62 apart from cooling with 2 bottom of bosh
The spacing of 2 bottom of sink, as shown in figure 5, upper portion end surface 61 is an inclined design, as shown in fig. 6, the inner face of panel 6
For step-like structure, in cooling water from bottom to top flow process, water temperature gradually rises again, compared with embodiment two, this structure
Design the identical water-flowing amount the case where under, effectively improve lower half cooling water enter the first half cooling water channel 7 flow
Speed further improves cooling efficiency to reduce cooling water in the water temperature of the copper coin first half.
Finally illustrate, the above examples are only used to illustrate the technical scheme of the present invention and are not limiting, this field is common
Other modifications or equivalent replacement that technical staff makes technical scheme of the present invention, without departing from technical solution of the present invention
Spirit and scope, be intended to be within the scope of the claims of the invention.
Claims (2)
1. a kind of slim slab copper plate of crystallizer of compound cooling structure, including front are working face, the copper that the back side is cooling surface
Multiple cooling water holes are arranged at the back side and in meniscus surface area in plate body, and the centerline parallel of the cooling water hole is in institute
State copper coin front, the center line of the cooling water hole and the cooling water channel center line are described apart from described positive apart from equal
Cooling water hole is threaded plug on the top of copper plate bodies, below the screw plug and in the top of meniscus surface area
Apopore is set, and the apopore is perpendicular to the copper coin back side, it is characterised in that：At the back side and in the lower part of meniscus surface area
Multiple boshes are set, panel are set in the bosh, the panel is formed by locating piece and bosh bottom
Cooling water channel, between the lower end of the panel and the lower wall of the bosh reserve inlet opening, the apopore with it is described
Cooling water hole is connected to, and is connected to the translot of the two, the cooling with the setting of bosh boundary position in the cooling water hole
The quantity in water hole is more than the quantity of the bosh, and the cooling water hole is spaced set.
2. a kind of slim slab copper plate of crystallizer of compound cooling structure according to claim 1, it is characterised in that：Institute
State expansion joint or the telescopic hole being arranged on the back side between apopore and the translot laterally or vertically, the expansion joint or
The bottom end of telescopic hole is not less than 5mm apart from cooling water hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710285764.3A CN107116186B (en) | 2017-04-27 | 2017-04-27 | A kind of slim slab copper plate of crystallizer of compound cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710285764.3A CN107116186B (en) | 2017-04-27 | 2017-04-27 | A kind of slim slab copper plate of crystallizer of compound cooling structure |
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| CN107116186A CN107116186A (en) | 2017-09-01 |
| CN107116186B true CN107116186B (en) | 2018-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2936495Y (en) * | 2006-07-15 | 2007-08-22 | 西峡龙成特种材料有限公司 | Heat top crystallizer form work of meniscus area narrow shallow water channel |
| CN201211556Y (en) * | 2008-07-01 | 2009-03-25 | 西峡龙成特种材料有限公司 | Binary cooling type thin slab continuous casting crystallizer |
| CN206662223U (en) * | 2017-04-27 | 2017-11-24 | 西峡龙成特种材料有限公司 | A kind of wide face copper coin of new type superthin plate slab crystallizer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4582861B2 (en) * | 2000-05-01 | 2010-11-17 | 新日鉄エンジニアリング株式会社 | Stave cooler |
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2017
- 2017-04-27 CN CN201710285764.3A patent/CN107116186B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2936495Y (en) * | 2006-07-15 | 2007-08-22 | 西峡龙成特种材料有限公司 | Heat top crystallizer form work of meniscus area narrow shallow water channel |
| CN201211556Y (en) * | 2008-07-01 | 2009-03-25 | 西峡龙成特种材料有限公司 | Binary cooling type thin slab continuous casting crystallizer |
| CN206662223U (en) * | 2017-04-27 | 2017-11-24 | 西峡龙成特种材料有限公司 | A kind of wide face copper coin of new type superthin plate slab crystallizer |
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| CN107116186A (en) | 2017-09-01 |
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