CN107103989B - Coil component - Google Patents
Coil component Download PDFInfo
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- CN107103989B CN107103989B CN201710090463.5A CN201710090463A CN107103989B CN 107103989 B CN107103989 B CN 107103989B CN 201710090463 A CN201710090463 A CN 201710090463A CN 107103989 B CN107103989 B CN 107103989B
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- spiral conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2871—Pancake coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The present invention provides a kind of coil component, can obtain high transmission characteristic by improving characteristic impedance.Coil component of the invention includes: the spiral conductor (41 mutually equal set on winding number, 42) insulating layer (32) between, set on the mutually equal spiral conductor (43 of winding number, 44) insulating layer (34) between, spiral conductor (41,43) short circuit and constitute coil C1, spiral conductor (42,44) short circuit and constitute coil C2, spiral conductor (41,42) winding number is than spiral conductor (43,44) winding number is more, and the film thickness of insulating layer (32) is thinner than the film thickness of insulating layer (34).According to the present invention, in the relatively more spiral conductor (41 of winding number, 42) relatively thin insulating layer (32) is equipped between, in the relatively little of spiral conductor (43 of winding number, 44) relatively thick insulating layer (34) is equipped between, therefore, the difference of the characteristic impedance between spiral conductor is reduced.
Description
Technical field
The present invention relates to coil components, more particularly, to the coil component for being laminated 4 spiral conductors.
Background technique
General common-mode filter has is laminated two spiral conductors on Magnetic Substrate, as a result, two spiral conductor phases
The composition of mutual magnetic coupling.But when spiral conductor is two, it is difficult to ensure that enough conductors are wide while increasing winding number
Degree.As a method of solving this problem, 4 spiral conductors of stacking can be enumerated, two short circuits therein are set as first coil,
Remaining two short circuits are set as to the method (referring to patent document 1,2) of the second coil.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2015-5628 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2007-200923 bulletin
Problems to be solved by the invention
But in the case where 4 spiral conductors are laminated, according to winding number needed for each coil of short circuit, sometimes upper layer
Spiral conductor winding number it is different from the winding number of the spiral conductor of lower layer.In this case, spiral conductor more than winding number and
The characteristic impedance of the few spiral conductor of winding number will appear difference, and the transmission characteristic of signal deteriorates.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of coil components, even if winding number is discrepant between spiral conductor
In the case of, by improving characteristic impedance, it can also obtain high transmission characteristic.
A technical solution to solve project
The present invention provides a kind of coil component, which is characterized in that has first, be layered on top of each other via multiple insulating layers
Two, third and the 4th spiral conductor, the multiple insulating layer include: to lead set on first spiral conductor and second spiral
The first insulating layer between body, the second insulating layer between the third spiral conductor and the 4th spiral conductor, institute
It states the first spiral conductor and third spiral conductor short circuit and constitutes first coil, second spiral conductor and the described 4th
Spiral conductor is short-circuit and constitutes the second coil, and first spiral conductor and the winding number of second spiral conductor are mutually mutual
Deng the winding number of the third spiral conductor and the 4th spiral conductor is mutually equal, first and second described spiral conductor
Winding number it is more than the winding number of the third and the 4th spiral conductor, the film thickness of first insulating layer is than second insulation
The film thickness of layer is thin.
According to the present invention, the first relatively thin insulation is equipped between first and second relatively more spiral conductor of winding number
Layer is equipped with relatively thick second insulating layer between the relatively little of third of winding number and the 4th spiral conductor, therefore, reduces spiral and leads
The difference of characteristic impedance between body.Thereby, it is possible to obtain than existing higher transmission characteristic.
In the present invention, it is preferred that the conductor width of first spiral conductor and second spiral conductor is mutual
Equal, the conductor width of the third spiral conductor and the 4th spiral conductor is mutually equal, the third and the 4th spiral
The conductor width of conductor is wider than the conductor width of first and second spiral conductor.Hereby it is possible to further decrease direct current
Resistance.
In the present invention, it is preferred that described first, second, third and the 4th spiral conductor be laminated in magnetism in order
On substrate.Accordingly, first and second spiral conductor can be configured in the higher low layer position of flatness, it therefore, can be easily
Form first and second spiral conductor more than winding number.
In the present invention, it is preferred that the winding number of first and second spiral conductor and the third and the 4th spiral shell
The difference for revolving the winding number of conductor is odd number.In this case, become difficult the winding number of each spiral conductor unanimously, still, even if
In this case, it can also ensure that high transmission characteristic.
In the present invention, it is preferred that described first, second, third and the 4th spiral conductor respectively include: have regulation
Conductor width regulation circle, positioned at side more inner than the regulation circle and conductor width it is narrower than the defined conductor width
Inner circumferential circle, positioned at the periphery circle wider than the defined conductor width than the outer side of the regulation circle and conductor width.Especially
Be, it is preferred that constitute described first, second, third and the 4th the respective multiple circles of spiral conductor from inner circumferential side towards periphery
The conductor width of side is continuous or periodically broadens.Accordingly, it also can reduce the inclined of the characteristic impedance in identical spiral conductor
Therefore difference can obtain higher transmission characteristic.
Invention effect
According to the present invention, even if also can reduce characteristic impedance in the case that winding number has difference between spiral conductor
Difference can obtain higher transmission characteristic.
Detailed description of the invention
Fig. 1 is the approximate stereogram for indicating the appearance of coil component 10 of the preferred embodiment of the present invention;
Fig. 2 is the figure for illustrating the construction of layered structure 20;
Fig. 3 is the equivalent circuit diagram of coil component 10;
Fig. 4 is the partial cutaway view of the layered structure 20 of stacking direction;
Fig. 5 is the process chart for illustrating the forming method of layered structure 20;
Fig. 6 is the process chart for illustrating the forming method of layered structure 20;
Fig. 7 is the partial plan layout for indicating a part of the first spiral conductor 41 of variation.
Symbol description
10 coil components
11 Magnetic Substrates
12,13 magnetic resin layers
20 layered structures
31~35 insulating layers
31H~35H through-hole
32a~32f, 33a~33f, 34a~34f, 35a~35d through-hole
36 ion(ic) etching masks
The opening portion 36H
41~44 spiral conductors
411~416Conductor
52~55,61,63~65,71,72,74,75,81~83,85 connection conductors
41a~44a outer circumference end
41b~44b inner circumferential end
C1, C2 coil
E1~E4 terminal electrode
M1~M4 conductor layer
Specific embodiment
In the following, the preferred embodiment that present invention will be described in detail with reference to the accompanying.
Fig. 1 is the approximate stereogram for indicating the appearance of coil component 10 of the preferred embodiment of the present invention, is to make to install
The figure that state inverts upside down.
As shown in Figure 1, the coil component 10 of present embodiment is the common mode filter of the surface installing type of approximately cuboid shape
Wave device, has: Magnetic Substrate 11, the layered structure 20 on Magnetic Substrate 11, in layered structure 20
One~forth terminal electrode E1~E4 and magnetic resin layer 12.The specifically composition of layered structure 20 is aftermentioned.Without special
It limits, still, for the size of coil component 10, the length in the direction x is that the width in the direction 0.65mm, y is the direction 0.5mm, z
Height be 0.3mm.During installation, inverted upside down from state shown in FIG. 1, be provided with first~forth terminal electrode E1~
It is installed with the aspectant mode of printed base plate in the face xy of E4.The coil component 10 of present embodiment is on Magnetic Substrate 11
Be laminated with the film coil part of laminated type made of layered structure 20, on magnetive cord or spool winding cables form
So-called winding-type coil component type it is different.
Substrate when Magnetic Substrate 11 is both by the stacking of layered structure 20, also, again physical protection lit-par-lit structure
Body 20, and constitute the magnetic circuit of coil component 10.As the material of Magnetic Substrate 11, ferrite sintered body, compound iron oxygen can be used
Body (resin containing ferrite powder) etc., however, it is preferable to use the ferrite sintered body of high mechanical strength and having excellent magnetic properties.
First~forth terminal electrode E1~E4 is configured at arbitrary corner.Therefore, terminal electrode E1~E4 is in coil zero
Expose three sides (face xy, the face xz, the face yz) of part 10.Although there is no particular limitation, terminal electrode E1~E4 passes through
Thick film galvanoplastic are formed, and thickness is sufficiently thick compared with the electrode pattern formed by sputtering method and silk-screen printing.
Magnetic resin layer 12 is physical protection layered structure 20, also, fixed, bearing first~forth terminal electrode
The layer of E1~E4 is arranged with filling the mode around first~forth terminal electrode E1~E4.Magnetic resin layer 12 it is upper
Surface (face xy) and the upper surface (face xy) of first~forth terminal electrode E1~E4 constitute same plane.As magnetic resin layer
12 material is, it is preferable to use complex ferrite.Magnetic resin layer 12 has high magnetic characteristic, collectively forms magnetic with Magnetic Substrate 11
Road.
Fig. 2 is the outline exploded perspective view of coil component 10, in particular for illustrate layered structure 20 construction figure.
It is laminated in order as shown in Fig. 2, layered structure 20 has from 11 side of Magnetic Substrate towards 12 side of magnetic resin layer
Insulating layer 31~35,4 conductor layer M1~M4 are formed between these insulating layers 31~35.Insulating layer 31~35 is by for example setting
Rouge is constituted, and plays the role of for the first~the 4th conductor layer M1~M4 being separated from each other.
First~the 4th conductor layer M1~M4 respectively includes the first~the 4th spiral conductor 41~44.Wherein, first and
(right-hand rotation) clockwise winding, third and the 4th spiral conductor are pressed from outer circumference end towards inner circumferential end when two spiral conductors 41,42 are overlooked
43,44, which press (left-hand rotation) counterclockwise towards inner circumferential end from outer circumference end when overlooking, winds.In the present embodiment, first and second spiral
The winding number of conductor 41,42 is 6 circles, third and the 4th spiral conductor 43, and 44 winding number is 5 circles.That is, its difference is 1 circle.
The outer circumference end 41a of first spiral conductor 41 is connect via connection conductor 61,71,81 with first terminal electrode E1.The
The outer circumference end 42a of two spiral conductors 42 is connect via connection conductor 72,82 with second terminal electrode E2.Third spiral conductor 43
Outer circumference end 43a is connect via connection conductor 83 with third terminal electrode E3.The outer circumference end 44a of 4th spiral conductor 44 and the 4th end
Sub-electrode E4 connection.
The inner circumferential end 41b of first spiral conductor 41 connects via the inner circumferential end 43b of connection conductor 65 and third spiral conductor 43
It connects.The inner circumferential end 42b of second spiral conductor 42 is connect via connection conductor 75 with the inner circumferential end 44b of the 4th spiral conductor 44.
As a result, as shown in equivalent circuit diagram, that is, Fig. 3, the first spiral conductor 41 and the short circuit of third spiral conductor 43 constitute the
One coil C1.In addition, 44 short circuit of the second spiral conductor 42 and the 4th spiral conductor, constitutes the second coil C2.First coil C1 exists
It is connected in series between first terminal electrode E1 and third terminal electrode E3, the second coil C2 is in second terminal electrode E2 and the 4th end
It is connected in series between sub-electrode E4.Therefore, the coil component 10 of present embodiment constitutes common-mode filter circuit.
As shown in Fig. 2, there is magnetic resin layer 12 part corresponding with first~forth terminal electrode E1~E4 to dig through
Shape.In addition, being respectively equipped with through-hole 31H~35H on insulating layer 31~35, set in a manner of burying these through-holes 31H~35H
Set magnetic resin layer 13.Magnetic resin layer 13 is a part of magnetic resin layer 12, and the two has the construction of one.
Fig. 4 is the partial cutaway view of the layered structure 20 on stacking direction.
As shown in figure 4, each circle for constituting the second spiral conductor 42 of each circle and composition of the first spiral conductor 41 is located at from z
Observe the position to coincide with one another in direction.Equally, it constitutes each circle of third spiral conductor 43 and constitutes each of the 4th spiral conductor 44
Circle is located at the position to coincide with one another from the direction z.First spiral conductor 41 and the second spiral conductor 42 magnetic coupling each other as a result,
It closes, third spiral conductor 43 and the 4th spiral conductor 44 are magnetically coupling to one another.In the present embodiment, first and second spiral conductor
41,42 with third and the 4th spiral conductor 43,44 are also overlapped in a z-direction, and still, the winding number of the two is different, therefore,
Constitute each circle of first and second spiral conductor 41,42 and each circle for constituting third and the 4th spiral conductor 43,44 and incorrect
Ground is overlapped.
Moreover, the conductor width of first and second spiral conductor 41,42 is set as W1, by third and the 4th spiral conductor
In the case that 43,44 conductor width is set as W2:
W1 < W2
As an example, W1=10 μm, W2=12 μm.Why by third and the conductor width of the 4th spiral conductor 43,44
W2 is designed wider, is because compared to the winding number (such as 6 circles) of first and second spiral conductor 41,42, third and the 4th
The winding number (such as 5 circles) of spiral conductor 43,44 is few, and still having makes the broader leeway of conductor width.Thereby, it is possible to reduce third and
The D.C. resistance of 4th spiral conductor 43,44.
In addition, the film thickness of the insulating layer 32 between it will separate first and second spiral conductor 41,42 is set as H1, will separate
Three and the 4th spiral conductor 43, in the case that the film thickness of the insulating layer 34 between 44 is set as H2,
H1 < H2.
As an example, H1=6 μm, H2=8 μm.
Why the film thickness H1 of insulating layer 32 is set as thinner than the film thickness H2 of insulating layer 34, be because, with third and the
The winding number (such as 5 circles) of four spiral conductors 43,44 is compared, the winding number (such as 6 circles) of first and second spiral conductor 41,42
More.This is because inductance becomes larger when winding number becomes more, correspondingly, the inductance ingredient of leakage also increases, and therefore, is posted by making
Raw capacitive component increases and realizes equilibrium, and thereby, it is possible to so that characteristic impedance is become desired value.That is, being located at volume by being thinned
The film thickness H1 of the insulating layer 32 between first and second spiral conductor 41,42 more than winding number, makes first and second spiral conductor 41,42
Parasitic capacitance component increase, on the other hand, be located at the few third and the 4th spiral conductor 43 of winding number by thickening, between 44
The film thickness H2 of insulating layer 34, makes third and the 4th spiral conductor 43, and 44 parasitic capacitance component is reduced.It is each thereby, it is possible to reduce
Therefore the deviation of the characteristic impedance of spiral conductor 41~44 can obtain high transmission characteristic.
The film thickness H3 of insulating layer 33 is not particularly limited, if H1=6 μm, H2=8 μm, as long as being set as H3=
5~10 μm of degree.
And xy in addition, in the present invention, " width " of conductor refers to the side in the section on the stacking direction of spiral conductor, i.e.,
The length on the parallel side of plane.In addition, in the present invention, " film thickness " or " height " of conductor refers to the stacking direction of spiral conductor
On section side, i.e. the length on the side on the direction z.
In the present embodiment, the winding number of first and second spiral conductor 41,42 is 6 circles, and third and the 4th spiral are led
The winding number of body 43,44 is 5 circles, and difference is 1 circle, and still, the present invention is not limited only to this, and the difference of winding number is also possible to any circle
Number.Here, the difference of winding number be even number in the case where, by reduce winding number more than spiral conductor winding number, increase volume
The winding number of the two can be set as same number by the winding number of the few spiral conductor of winding number, but in the feelings that the difference of winding number is odd number
Under condition, it is impossible to realize.Therefore, the present invention is especially effective in the case where the difference of winding number is odd number.
In addition, " winding number " in the present invention leaves the end number generated due to the extraction to terminal electrode out of consideration.Example
Such as, strictly speaking first and second spiral conductor 41,42 is 6.25 circles, third and the 4th spiral conductor 43, strictly speaking 44 are
5.25 circles, still, 0.25 circle of each spiral conductor 41~44 are the end generated due to the extraction to terminal electrode E1~E4
Number, therefore, is counted as long as ignoring the end number.
In the following, being illustrated to the forming method of layered structure 20.
Fig. 5 and Fig. 6 is the process chart for illustrating the forming method of layered structure 20 shown in Fig. 2.
Firstly, prepare the Magnetic Substrate 11 that is made of the ferrite sintered body etc. with defined thickness, surface shape on it
At insulating layer 31.Then, it as shown in Fig. 5 (a), is formed in the upper surface of insulating layer 31 by the first spiral conductor 41 and connection conductor
52~55 conductor layer M1 constituted.The winding number of first spiral conductor 41 is, for example, 6 circles, and as illustrated by using Fig. 4, conductor is wide
Degree is W1.As the forming method of these conductors, preferably after foring base metal film using thin-film techniques such as sputtering methods, make
Its plating is set to grow to desired film thickness with electrolytic plating method.Forming method about the other conductors formed later is also same
Sample.
Secondly, in a manner of covering conductor layer M1, foring insulation in the upper surface of insulating layer 31 as shown in Fig. 5 (b)
After layer 32, through-hole 32a~32f is formed on insulating layer 32.Specifically, leading to after having applied resin material by spin-coating method Tu
It crosses photoetching process and forms defined pattern, thereby, it is possible to form the insulating layer 32 with through-hole 32a~32f.About what is formed later
The forming method of insulating layer is also the same.As illustrated by using Fig. 4, the film thickness of insulating layer 32 is H1.The through-hole as shown in Fig. 5 (b)
32a is formed in the position for exposing the outer circumference end 41a of the first spiral conductor 41, and through-hole 32e, which is formed in, makes the first spiral conductor 41
The position exposed inner circumferential end 41b, through-hole 32b, 32c, 32d, 32f are formed in the position for exposing each connection conductor 52~55
It sets.
Then, it as shown in Fig. 5 (c), is formed in the upper surface of insulating layer 32 by the second spiral conductor 42 and connection conductor 61,
63~65 conductor layer M2 constituted.As illustrated by using Fig. 4, each circle of the second spiral conductor is with same with the first spiral conductor 41
The mode that one circle is correctly overlapped is aligned.The outer circumference end 42a and inner circumferential end 42b of second spiral conductor are formed in and each through-hole
The corresponding position 32b, 32f, connection conductor 61,63~65 are formed in and each through-hole 32a, 32c, 32d, the corresponding position 32e.
As a result, the outer circumference end 42a of the second spiral conductor 42 with connect conductor 52 connect, the inner circumferential end 42b of the second spiral conductor with connect
Conductor 55 connects, and connection conductor 61,65 is connect with the outer circumference end 41a of the first spiral conductor 41 and inner circumferential end 41b respectively, and connection is led
Body 63,64 respectively with connect conductor 53,54 connect.
Then, as shown in Fig. 5 (d), in a manner of covering conductor layer M2, insulating layer is formd in the upper surface of insulating layer 32
After 33, through-hole 33a~33f is formed on insulating layer 33.Through-hole 33b shown in Fig. 5 (d), which is formed in, makes the second spiral conductor 42
The position that outer circumference end 42a exposes, through-hole 33f are formed in the position for exposing the inner circumferential end 42b of the second spiral conductor 42, through-hole
33a, 33c, 33d, 33e are formed in the position for exposing each connection conductor 61,63~65.
Then, it as shown in Fig. 6 (a), is formed in the upper surface of insulating layer 33 by third spiral conductor 43 and connection conductor 71,
The 72,74,75 conductor layer M3 constituted.The winding number of third spiral conductor 43 is such as 5 circles, as using Fig. 4 explanation,
Conductor width is W2 (> W1).The outer circumference end 43a and inner circumferential end 43b of third spiral conductor are formed in and each through-hole 33c, 33e
Corresponding position, connection conductor 71,72,74,75 are formed in and each through-hole 33a, 33b, 33d, the corresponding position 33f.As a result,
The outer circumference end 43a of third spiral conductor is connected with conductor 63 is connect, and the inner circumferential end 43b of third spiral conductor connects with conductor 65 is connect
It connects, connection conductor 72,75 is connect with the outer circumference end 42a of the second spiral conductor 42 and inner circumferential end 42b respectively, connects conductor 71,74
Respectively with connect conductor 61,64 connect.
Then, as shown in Fig. 6 (b), in a manner of covering conductor layer M3, insulating layer is formd in the upper surface of insulating layer 33
After 34, through-hole 34a~34f is formed on insulating layer 34.As illustrated by using Fig. 4, the film thickness of insulating layer 34 is H2 (> H1).Figure
Through-hole 34c shown in 6 (b) is formed in the position for exposing the outer circumference end 43a of third spiral conductor 43, and through-hole 34e, which is formed in, to be made
The position that the inner circumferential end 43b of third spiral conductor 43 exposes, through-hole 34a, 34b, 34d, 34f, which is formed in, makes each connection conductor
71,72,74,75 positions exposed.
Then, it as shown in Fig. 6 (c), is formed in the upper surface of insulating layer 34 by the 4th spiral conductor 44 and connection conductor 81
~83,85 conductor layer M4 constituted.As using illustrated by Fig. 4, each circle of the 4th spiral conductor with third spiral conductor 43
The mode that same circle is correctly overlapped is aligned.The outer circumference end 44a and inner circumferential end 44b of 4th spiral conductor are formed in and each through-hole
The corresponding position 34d, 34f, connection conductor 81~83,85 are formed in and each through-hole 34a, 34b, 34c, the corresponding position 34e.
The outer circumference end 44a of the 4th spiral conductor is connected with conductor 74 is connect as a result, and the inner circumferential end 44b of the 4th spiral conductor is led with connection
Body 75 connects, and connection conductor 83,85 is connect with the outer circumference end 43a of third spiral conductor 43 and inner circumferential end 43b respectively, connects conductor
81,82 respectively with connect conductor 71,72 connect.
Then, as shown in Fig. 6 (d), in a manner of covering conductor layer M4, insulating layer is formd in the upper surface of insulating layer 34
After 35, through-hole 35a~35d is formed on insulating layer 35.Through-hole 35a~35c shown in Fig. 6 (d), which is formed in, leads each connection
The position that body 81~83 exposes, through-hole 35d are formed in the position for exposing the outer circumference end 44a of the 4th spiral winding 44.
Then, as shown in Fig. 6 (e), first~forth terminal electrode E1~E4 is formed on the surface of insulating layer 35.First~
The forming method of forth terminal electrode E1~E4 is as follows.Firstly, in the periphery of connection conductor 81~83 and the 4th spiral winding 44
The Cu film of substrate is formed into the entire surface for the insulating layer 35 that end 44a exposes by sputtering method.Later, against corrosion is pasted, is led to
Overexposure and development are selectively removed against corrosion for being located at the region that form first~forth terminal electrode E1~E4, make
The Cu film in the region exposes.Moreover, in this state, forming first~forth terminal electrode E1~E4 of heavy wall by being electroplated.
Later, against corrosion is removed, unwanted Cu film is removed by etching entire surface, forms columnar first~forth terminal electrode
E1~E4.
Then, as shown in Fig. 6 (f), the ion(ic) etching mask 36 with opening portion 36H is formed, is carried out in this state
Ion(ic) etching.Through-hole 31H~35H is formed on insulating layer 31~35 as a result, exposes Magnetic Substrate 11 in the position.Moreover,
The cream that complex ferrite is formed in entire surface, as long as being allowed to solidify, it will be able to formation landfill first~forth terminal electrode E1~
The magnetic resin layer 13 of magnetic resin layer 12, embedment through-hole 31H~35H around E4.Later, as long as removing the first~the 4th
The upper unwanted complex ferrite of terminal electrode E1~E4, can be completed the coil component 10 of present embodiment.
As mentioned above, the coil component 10 of present embodiment, the winding number (6 of first and second spiral conductor 41,42
Circle) than third and the 4th spiral conductor 43,44 winding number (5 circle) is more, and the film thickness H1 of insulating layer 32 is than the film of insulating layer 34
Thick H2 is thin, and therefore, the deviation of characteristic impedance caused by difference in inductance, can obtain height caused by being able to suppress because of winding number difference
Transmission characteristic.
Moreover, the third that winding number is lacked and the 4th spiral conductor 43,44 conductor width W2 is set as more than winding number
The conductor width W1 of first and second spiral conductor 41,42 is wider, therefore, compared with being set as in the case where identical conductor width
Also it can reduce D.C. resistance.
Fig. 7 is the partial plan layout for indicating a part of the first spiral conductor 41 of variation.
In variation shown in Fig. 7, the conductor width of the first spiral conductor 41 broadens from inner circumferential side towards peripheral side.
That is, the first~the 6th circle of the first spiral conductor 41 is set to conductor 411~416In the case where, conductor 411~416's
Conductor width W11~W16 are as follows:
W11 < W12 < W13 < W14 < W15 < W16
It is preferred that the space between adjacent conductor is certain.
It is not shown in figure, but in the case where the first spiral conductor 41 has this flat shape, the second spiral is led
Body 42 is also required to consistent with the flat shape of the first spiral conductor 41.That is, each circle of the second spiral conductor 42 is needed with first
The same circle of spiral conductor 41 becomes the mode of same conductor width, broadens from inner circumferential side towards peripheral side.For third spiral
Conductor 43 and the 4th spiral conductor 44 are also the same, broaden from inner circumferential side towards peripheral side.
According to this composition, the deviation of characteristic impedance is able to suppress in same spiral conductor.This is because
In the spiral conductor of plane, there is inner circumferential circle, leakage inductance ingredient is smaller, and periphery circle leakage inductance ingredient is bigger
Tendency.That is, inner circumferential circle, more reduces parasitic capacitance component, more by making conductor width broaden from inner circumferential side towards peripheral side
It is periphery circle, more increases parasitic capacitance component, thereby, it is possible to deviations in the face of rejection characteristic impedance, therefore, can obtain higher
Transmission characteristic.
In addition, in the case where making conductor width broaden from inner circumferential side towards peripheral side, it can also be from inner circumferential side outside
Side makes conductor width continuously broaden, and conductor width can also be made gradually to broaden from inner circumferential side towards peripheral side.In addition, not leading
Body width all must be different in all circles, can also in a part of circle conductor width it is identical.It as an example, can also be with
It is:
W11=W12 < W13=W14 < W15=W16
In this case, by conductor 413,414It is set as in the case where being located in the middle regulation circle, conductor 411,412It constitutes more
Narrow inner circumferential circle, conductor 415,416Constitute broader periphery circle.
More than, a specific embodiment of the invention is illustrated, still, the present invention is not limited only to above-mentioned embodiment party
Formula, can carry out various changes without departing from the spirit and scope of the invention, these are also included within of the invention certainly
In range.
For example, in the above-described embodiment, terminal electrode E1~E4 has the convex shape of embedment magnetic resin layer 12,
But in the present invention, the shape and construction of terminal electrode are not limited only to this.Accordingly it is also possible to be printed using on the surface of matrix
The terminal electrode made of connection terminal metalwork on matrix also can be used in terminal electrode made of brush silver paste etc..
Claims (5)
1. a kind of coil component, which is characterized in that
Have first, second, third and the 4th spiral conductor being layered on top of each other via multiple insulating layers,
The multiple insulating layer includes: the first insulation between first spiral conductor and second spiral conductor
Layer, the second insulating layer between the third spiral conductor and the 4th spiral conductor,
First spiral conductor and the third spiral conductor short circuit and constitute first coil,
Second spiral conductor and the 4th spiral conductor short circuit and constitute the second coil,
The winding number of first spiral conductor and second spiral conductor is mutually equal,
The winding number of the third spiral conductor and the 4th spiral conductor is mutually equal,
The winding number of first and second spiral conductor is more than the winding number of the third and the 4th spiral conductor,
The film thickness of first insulating layer is thinner than the film thickness of the second insulating layer,
The conductor width of first spiral conductor and second spiral conductor is mutually equal,
The conductor width of the third spiral conductor and the 4th spiral conductor is mutually equal,
The conductor width of the third and the 4th spiral conductor is wider than the conductor width of first and second spiral conductor.
2. coil component according to claim 1, which is characterized in that
Described first, second, third and the 4th spiral conductor be laminated in that order on Magnetic Substrate.
3. coil component according to claim 1, which is characterized in that
The difference of the winding number of the winding number of first and second spiral conductor and the third and the 4th spiral conductor is odd number.
4. a kind of coil component, which is characterized in that
Have first, second, third and the 4th spiral conductor being layered on top of each other via multiple insulating layers,
The multiple insulating layer includes: the first insulation between first spiral conductor and second spiral conductor
Layer, the second insulating layer between the third spiral conductor and the 4th spiral conductor,
First spiral conductor and the third spiral conductor short circuit and constitute first coil,
Second spiral conductor and the 4th spiral conductor short circuit and constitute the second coil,
The winding number of first spiral conductor and second spiral conductor is mutually equal,
The winding number of the third spiral conductor and the 4th spiral conductor is mutually equal,
The winding number of first and second spiral conductor is more than the winding number of the third and the 4th spiral conductor,
The film thickness of first insulating layer is thinner than the film thickness of the second insulating layer,
Described first, second, third and the 4th spiral conductor respectively include: regulation circle with defined conductor width is located at
The inner circumferential circle narrower than the defined conductor width than the inner side of the regulation circle and conductor width is located at than the regulation circle
Outer side and the conductor width periphery circle wider than the defined conductor width.
5. coil component according to claim 4, which is characterized in that
Constitute described first, second, third and the 4th conductor of the respective multiple circles of spiral conductor from inner circumferential side towards peripheral side
Width is continuous or periodically broadens.
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JP2016031584A JP6547653B2 (en) | 2016-02-23 | 2016-02-23 | Coil parts |
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JP6743836B2 (en) * | 2018-02-07 | 2020-08-19 | 株式会社村田製作所 | Common mode choke coil |
JP2022055129A (en) * | 2020-09-28 | 2022-04-07 | Tdk株式会社 | Coil component |
JP7452358B2 (en) * | 2020-09-28 | 2024-03-19 | Tdk株式会社 | coil parts |
JP2023047891A (en) * | 2021-09-27 | 2023-04-06 | Tdk株式会社 | Laminated coupling coil component and circuit board having the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1577648A (en) * | 2003-07-28 | 2005-02-09 | Tdk株式会社 | Coil part and manufacturing method thereof |
JP2007200923A (en) * | 2006-01-23 | 2007-08-09 | Fdk Corp | Laminated common mode choke coil |
CN103578687A (en) * | 2012-08-08 | 2014-02-12 | 佳邦科技股份有限公司 | Thin-film common-mode filter |
CN203931711U (en) * | 2013-06-21 | 2014-11-05 | 松下电器产业株式会社 | Common-mode noise filter |
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JP2003124027A (en) * | 2001-10-19 | 2003-04-25 | Murata Mfg Co Ltd | Common mode choke coil and method for adjusting common mode impedance thereof |
JP2007129291A (en) * | 2005-11-01 | 2007-05-24 | Matsushita Electric Ind Co Ltd | Noise filter and noise filter circuit |
JP4952776B2 (en) * | 2009-11-10 | 2012-06-13 | Tdk株式会社 | Inductor component manufacturing method and inductor component |
JP5126338B2 (en) * | 2010-10-21 | 2013-01-23 | Tdk株式会社 | Transformer parts |
JP5961814B2 (en) * | 2010-11-18 | 2016-08-02 | パナソニックIpマネジメント株式会社 | Common mode noise filter |
JP6024418B2 (en) * | 2012-11-28 | 2016-11-16 | Tdk株式会社 | Common mode filter |
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CN1577648A (en) * | 2003-07-28 | 2005-02-09 | Tdk株式会社 | Coil part and manufacturing method thereof |
JP2007200923A (en) * | 2006-01-23 | 2007-08-09 | Fdk Corp | Laminated common mode choke coil |
CN103578687A (en) * | 2012-08-08 | 2014-02-12 | 佳邦科技股份有限公司 | Thin-film common-mode filter |
CN203931711U (en) * | 2013-06-21 | 2014-11-05 | 松下电器产业株式会社 | Common-mode noise filter |
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