CN107092327A - Mainboard with active temperature control system - Google Patents
Mainboard with active temperature control system Download PDFInfo
- Publication number
- CN107092327A CN107092327A CN201710258012.8A CN201710258012A CN107092327A CN 107092327 A CN107092327 A CN 107092327A CN 201710258012 A CN201710258012 A CN 201710258012A CN 107092327 A CN107092327 A CN 107092327A
- Authority
- CN
- China
- Prior art keywords
- mainboard
- bottom plate
- control system
- cooling
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
- G06F11/3031—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system component is a motherboard or an expansion card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computing Systems (AREA)
- Quality & Reliability (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mathematical Physics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses the mainboard with active temperature control system, including mainboard body, also include the hollow shell fitted with mainboard, support frame as described above includes bottom plate, side plate and the part of top plate three, bottom plate is the rectangular slab for being arranged on mainboard bottom, the length and width of bottom plate are all higher than mainboard, the four edges of the bottom plate upwardly extend to form side plate, extend to form top plate to main plate center at the top of side plate, 2 water-cooling joints being connected with housing hollow are additionally provided with the housing, it is connected with the water-cooling joint on cold row, the cold row and is additionally provided with fan.By unifying layer housing in mainboard outer patch, using the cooling realized to housing progress cooling to whole mainboard of the method for water cooling.It is an advantage of the invention that：Whole mainboard can be cooled, it is to avoid burn out the miscellaneous part on mainboard；Using closed-loop control system, working stability response is rapid.
Description
Technical field
The present invention relates to a kind of mainboard, and in particular to the mainboard with active temperature control system.
Background technology
Computer housing mainboard, is called motherboard, system board or motherboard；It is divided into two kinds of commercial mainboard and industrial master board.It
In cabinet, be microcomputer it is most basic be also one of most important part.The generally rectangular cross-section circuit board of mainboard, it is installed above
The main circuit system of composition computer, typically has BIOS chips, I/O control chips, key and panel control switch interface, refers to
Show that the dc source of lamp plug connector, expansion slot, mainboard and plug-in card is powered the elements such as connector.Cause mainboard damage it is general have with
Lower reason, the failure caused by external environment generally refers to people in the case of unknown or unpredictable, irresistible feelings
Caused by under condition.Such as thunderbolt, mains-supplied are unstable, and it may directly damage mainboard, and people do not have typically in this case
There is method prevention；Another situation caused by external environment, is exactly the failure caused by temperature, humidity and dust etc..It is this
The symptom that situation is showed has：Often crash, restart or can start shooting sometimes sometimes and can not start shooting, so as to cause machine
Performance is unstable.Component quality causes failure, and such case refers to that some component of mainboard is damaged because of quality problems itself
It is bad.Certain partial function that this failure generally results in mainboard can not be used normally, and system can not normally start, in process of self-test
The phenomenon such as report an error.Mainboard is the critical component of whole computer, and vital effect is played in computer.If mainboard produces failure
The work of whole PC system will be influenced whether.
Existing processor cooling system is normally only used for CPU cooling, and in the case of heavier load operation, mainboard
The temperature of itself is also very high, and the cooling of the point type of processor then seems have little significance at this time.
The content of the invention
The technical problems to be solved by the invention are the coolings that existing processor cooling system is normally only used for CPU, and
In the case of heavier load operation, the temperature of mainboard in itself is also very high, and the cooling of the point type of processor then shows at this time
It must have little significance, it is therefore intended that the mainboard with active temperature control system, the problem of solution cools to whole mainboard are provided.
The present invention is achieved through the following technical solutions：
Mainboard with active temperature control system, including mainboard body, in addition to the hollow shell fitted with mainboard, it is described
Support frame includes bottom plate, side plate and the part of top plate three, and bottom plate is the rectangular slab for being arranged on mainboard bottom, and the length and width of bottom plate are big
In mainboard, the four edges of the bottom plate upwardly extend to form side plate, extend to form top plate to main plate center at the top of side plate, institute
State to be additionally provided with housing on 2 water-cooling joints being connected with housing hollow, the water-cooling joint and be connected with cold row, the cold row
On be additionally provided with fan.By unifying layer housing in mainboard outer patch, using the realization pair that cools to housing progress of the method for water cooling
The cooling of whole mainboard.
On the Housing Base and mainboard CPU just to place be additionally provided with temperature sensor, the temperature sensor with
It is connected to the processor connection on fan.Due to the element for most serious of being generated heat on CPU or mainboard, therefore, by temperature sensor
Fortuitous event can be avoided by being arranged on below CPU, and the too high situation of such as cpu temperature occurs.
The bottom plate internal cavity is shaped as square waveform, i.e., start edge and the one of bottom plate since the place matched with water-cooling joint
The parallel direction in bar side is formed toward override interrupt.Using said structure water route can be made to spread all over whole bottom plate, cooling-down effect is brighter
It is aobvious.
The processor, fan and temperature sensor constitute a closed-loop control system.Closed-loop control, from output quantity change
Control signal is taken out as comparative quantity and feeds back to input control input amount, this general withdrawal amount and input quantity opposite in phase,
So be negative feedback control, using closed-loop control can effectively control mainboard temperature in suitable scope.
The present invention compared with prior art, has the following advantages and advantages：
1st, the present invention carries the mainboard of active temperature control system, whole mainboard can be cooled, it is to avoid burn out on mainboard
Miscellaneous part；
2nd, the present invention carries the mainboard of active temperature control system, and using closed-loop control system, working stability response is rapid.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding the embodiment of the present invention, constitutes one of the application
Point, do not constitute the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is schematic structural view of the invention；
Fig. 2 is schematic structural view of the invention；
Fig. 3 is schematic structural view of the invention.
Mark and corresponding parts title in accompanying drawing：
1- mainboards, 2- housings, 3- water-cooling joints, the cold rows of 4-, 5- fans, 6- processors, 7- temperature sensors, 101-CPU,
201- bottom plates, 202- side plates, 203- top plates, 204- cavitys.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, with reference to embodiment and accompanying drawing, to this
Invention is described in further detail, and exemplary embodiment and its explanation of the invention is only used for explaining the present invention, does not make
For limitation of the invention.
Embodiment
As shown in figure 1, the present invention carries the mainboard of active temperature control system, including the body of mainboard 1, in addition to mainboard 1
The hollow shell 2 of laminating, support frame as described above 2 includes bottom plate 201, side plate 202 and the part of top plate 203 3, and bottom plate 201 is to be arranged on
The rectangular slab of the bottom of mainboard 1, the length and width of bottom plate 201 are all higher than mainboard 1, and the four edges of the bottom plate 201 upwardly extend to be formed
Side plate 202, extends to form top plate 203 at the top of side plate 202 to the center of mainboard 1, and 2 and shell are additionally provided with the housing 2
It is connected with the water-cooling joint 3 of the cavity 204 of body 2 connection, the water-cooling joint 3 on cold row 4, the cold row 4 and is additionally provided with fan
5.By unifying layer housing 2 in the outer patch of mainboard 1, realized using the cooling to the progress of housing 2 for method of water cooling to whole mainboard 1
Cooling.The bottom plate 201 of the housing 2 and CPU101 on mainboard 1 just to place be additionally provided with HX15 temperature sensors 7, the temperature
Degree sensor 7 is connected with the AT89S52 processors 6 being connected on fan 5.Due to the member for most serious of being generated heat on CPU or mainboard
Part, therefore, temperature sensor, which is arranged on below CPU, can avoid fortuitous event, and the too high situation of such as CPU temperature occurs.
The internal cavity 204 of bottom plate 201 is shaped as square waveform, i.e., start edge and bottom plate 201 since the place matched with water-cooling joint 3
The parallel direction of a line is formed toward override interrupt.Using said structure water route can be made to spread all over whole bottom plate, cooling-down effect is brighter
It is aobvious.The processor 6, fan 5 and temperature sensor 7 constitute a closed-loop control system.Closed-loop control, takes from output quantity change
Go out control signal as comparative quantity and feed back to input control input amount, this general withdrawal amount and input quantity opposite in phase, institute
To be negative feedback control, using closed-loop control can effectively control mainboard temperature in suitable scope.
Above-described embodiment, has been carried out further to the purpose of the present invention, technical scheme and beneficial effect
Describe in detail, should be understood that the embodiment that the foregoing is only the present invention, be not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution and improvements done etc. all should be included
Within protection scope of the present invention.
Claims (4)
1. the mainboard with active temperature control system, including mainboard (1) body, it is characterised in that also including being fitted with mainboard (1)
Hollow shell (2), support frame as described above (2) include bottom plate (201), side plate (202) and the part of top plate (203) three, bottom plate (201)
To be arranged on the rectangular slab of mainboard (1) bottom, the length and width of bottom plate (201) are all higher than mainboard (1), the four of the bottom plate (201)
Bar side upwardly extends to form side plate (202), extends to form top plate (203), institute to mainboard (1) center at the top of side plate (202)
State to be additionally provided with housing (2) on 2 water-cooling joints (3) being connected with housing (2) cavity (204), the water-cooling joint (3) and connect
It is connected on cold row (4), the cold row (4) and is additionally provided with fan (5).
2. the mainboard according to claim 1 with active temperature control system, it is characterised in that housing (2) bottom plate
(201) with CPU (101) on mainboard (1) just to place be additionally provided with temperature sensor (7), the temperature sensor (7) with even
It is connected on processor (6) connection on fan (5).
3. the mainboard according to claim 1 with active temperature control system, it is characterised in that in the bottom plate (201)
The a line for being shaped as square waveform, i.e., starting edge and bottom plate (201) since the place matched with water-cooling joint (3) of cavity (204)
Parallel direction is formed toward override interrupt.
4. the mainboard according to claim 1 with active temperature control system, it is characterised in that the processor (6), wind
Fan (5) and temperature sensor (7) constitutes a closed-loop control system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710258012.8A CN107092327A (en) | 2017-04-19 | 2017-04-19 | Mainboard with active temperature control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710258012.8A CN107092327A (en) | 2017-04-19 | 2017-04-19 | Mainboard with active temperature control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107092327A true CN107092327A (en) | 2017-08-25 |
Family
ID=59638316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710258012.8A Pending CN107092327A (en) | 2017-04-19 | 2017-04-19 | Mainboard with active temperature control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107092327A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856131A (en) * | 2019-11-14 | 2020-02-28 | 东风设计研究院有限公司 | Digital multifunctional intelligent monitoring terminal and monitoring method |
| CN116594487A (en) * | 2023-07-17 | 2023-08-15 | 松原市何悦科技有限公司 | Computer motherboard heat dissipation protection device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6333849B1 (en) * | 1996-07-01 | 2001-12-25 | Compaq Computer Corporation | Apparatus for liquid cooling of specific computer components |
| CN203407144U (en) * | 2013-09-04 | 2014-01-22 | 酷码科技股份有限公司 | Liquid cooling heat radiation device having flow dividing mechanism |
| CN204229336U (en) * | 2014-11-21 | 2015-03-25 | 李光宇 | A kind of computer cabinet of high heat radiation |
| CN204338450U (en) * | 2014-07-29 | 2015-05-20 | 昆山海为自动化有限公司 | A kind of LED water-cooled UV curing |
| CN104656855A (en) * | 2013-11-19 | 2015-05-27 | 江苏阿尼信息技术有限公司 | Water cooling type mainboard |
| CN104679060A (en) * | 2015-02-10 | 2015-06-03 | 柳州市金旭节能科技有限公司 | Temperature control system for high-power electronic equipment |
| CN204667322U (en) * | 2015-05-29 | 2015-09-23 | 西京学院 | A kind of COMPUTER DETECTION device |
| CN105388977A (en) * | 2015-11-26 | 2016-03-09 | 重庆市泓言科技工程有限公司 | Computer motherboard fixing device with heat dissipation function |
| CN206003023U (en) * | 2016-06-30 | 2017-03-08 | 欧阳红巍 | A kind of computer motherboard fixing device |
-
2017
- 2017-04-19 CN CN201710258012.8A patent/CN107092327A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6333849B1 (en) * | 1996-07-01 | 2001-12-25 | Compaq Computer Corporation | Apparatus for liquid cooling of specific computer components |
| CN203407144U (en) * | 2013-09-04 | 2014-01-22 | 酷码科技股份有限公司 | Liquid cooling heat radiation device having flow dividing mechanism |
| CN104656855A (en) * | 2013-11-19 | 2015-05-27 | 江苏阿尼信息技术有限公司 | Water cooling type mainboard |
| CN204338450U (en) * | 2014-07-29 | 2015-05-20 | 昆山海为自动化有限公司 | A kind of LED water-cooled UV curing |
| CN204229336U (en) * | 2014-11-21 | 2015-03-25 | 李光宇 | A kind of computer cabinet of high heat radiation |
| CN104679060A (en) * | 2015-02-10 | 2015-06-03 | 柳州市金旭节能科技有限公司 | Temperature control system for high-power electronic equipment |
| CN204667322U (en) * | 2015-05-29 | 2015-09-23 | 西京学院 | A kind of COMPUTER DETECTION device |
| CN105388977A (en) * | 2015-11-26 | 2016-03-09 | 重庆市泓言科技工程有限公司 | Computer motherboard fixing device with heat dissipation function |
| CN206003023U (en) * | 2016-06-30 | 2017-03-08 | 欧阳红巍 | A kind of computer motherboard fixing device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856131A (en) * | 2019-11-14 | 2020-02-28 | 东风设计研究院有限公司 | Digital multifunctional intelligent monitoring terminal and monitoring method |
| CN110856131B (en) * | 2019-11-14 | 2021-06-04 | 东风设计研究院有限公司 | Digital multifunctional intelligent monitoring terminal and monitoring method |
| CN116594487A (en) * | 2023-07-17 | 2023-08-15 | 松原市何悦科技有限公司 | Computer motherboard heat dissipation protection device |
| CN116594487B (en) * | 2023-07-17 | 2023-11-21 | 松原市何悦科技有限公司 | Computer motherboard heat dissipation protection device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170825 |