CN107087374A - A kind of flat-plate minitype loop circuit heat pipe and its fluid injection method for exhausting - Google Patents
A kind of flat-plate minitype loop circuit heat pipe and its fluid injection method for exhausting Download PDFInfo
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- CN107087374A CN107087374A CN201710081747.8A CN201710081747A CN107087374A CN 107087374 A CN107087374 A CN 107087374A CN 201710081747 A CN201710081747 A CN 201710081747A CN 107087374 A CN107087374 A CN 107087374A
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- Prior art keywords
- fluid injection
- steam vent
- heat pipe
- injection steam
- loop circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Abstract
The invention provides a kind of flat-plate minitype loop circuit heat pipe and its exhaust electrolyte filling method, the heat pipe includes mainboard and upper cover plate, the upper cover plate is packaged together with mainboard, the mainboard includes vaporization chamber, condensation chamber, jet chimney and fluid pipeline are connected between vaporization chamber and condensation chamber, also include the first fluid injection steam vent and the second fluid injection steam vent, the first fluid injection steam vent and the second fluid injection steam vent are located at the same side of heat pipe, wherein the first fluid injection steam vent connects fluid pipeline, the second fluid injection steam vent connection jet chimney.The invention provides a kind of heat pipe of Novel structure and its exhaust electrolyte filling method, the insoluble gas in heat pipe can be reduced, heat pipe heat exchanging efficiency is improved.
Description
Technical field
The invention belongs to field of heat exchangers, more particularly to flat-plate minitype loop circuit heat pipe system.
Background technology
With developing rapidly for microelectronics and information technology, the Highgrade integration and miniaturization of device and circuit turn into important
Development trend, but integrated level improves that brought chip unit area calorific intensity is soaring and temperature rise will seriously threaten dress
Put the reliability with equipment.Studies have found that the characteristics of microelectronic chip has surface heat skewness, some parts
Heat flow rate per unit area even up to 1000w/cm2 at focus, it is considered as to cause chip failure or even the key reason of damage.
Therefore, exploitation cools directly to chip and improves the micro cooler of its overall uniform temperature as the research of thermal control in recent years pass
The focus of note.
Miniature loop circuit heat pipe is exactly in recent years for a kind of important micro cooler for adapting to this needs and developing.Make
For gas-liquid two-phase phase-change heat-exchange device, micro heat pipe has compact structure and larger heat can be carried out in less thermograde
The characteristics of amount transmission.
The minitype flat plate hot pipe of currently available technology, exhaust and fluid injection can cause to remain insoluble gas in heat pipe, so that
The heat exchange efficiency of heat pipe is caused to decline.The invention provides a kind of heat pipe of Novel structure and its exhaust electrolyte filling method, it can subtract
Insoluble gas in few heat pipe, improves heat pipe heat exchanging efficiency.
The content of the invention
The present invention is intended to provide a kind of efficient and small flat-plate minitype loop circuit heat pipe system of structure, is improved to minicore
The heat-sinking capability of piece.
To achieve these goals, technical scheme is as follows：A kind of flat-plate minitype loop circuit heat pipe, including mainboard
And upper cover plate, the upper cover plate is packaged together with mainboard, and the mainboard includes vaporization chamber, condensation chamber, vaporization chamber and condensation chamber
Between connection jet chimney and fluid pipeline, it is characterised in that also including the first fluid injection steam vent and the second fluid injection steam vent, institute
State the first fluid injection steam vent and the second fluid injection steam vent is located at the same side of heat pipe, wherein the first fluid injection steam vent connects liquid line
Road, the second fluid injection steam vent connection jet chimney.
Preferably, the first fluid injection steam vent and the second fluid injection steam vent are located at vaporization chamber side.
Preferably, being connected between the fluid pipeline and vaporization chamber by capillary, the first fluid injection steam vent connects
Connect on the capillary.
Preferably, the first fluid injection steam vent connection compensating liquid room, the compensating liquid room is connected by pipeline
Capillary.
Preferably, setting cavity on upper cover plate, the cavity is arranged on the position relative with porous media thin slice, described
Second fluid injection steam vent is not connected directly with vaporization chamber, but connects vaporization chamber by cavity.
Preferably, the cavity is connected with jet chimney, the porosity of described porous media thin slice is K, porous Jie
The thickness of matter is H1, and the thickness of the cavity is H2, then meets following condition：H2=a*Ln (K*H1)-b, wherein 200<a<
210,760<b<770；
Preferably, the fluid injection method for exhausting of loop circuit heat pipe as elucidated before, it is characterised in that comprise the following steps：
Step one, steam is filled into heat pipe from the first fluid injection steam vent, until steam is arranged since the second fluid injection steam vent
Go out；
Step 2, from the first fluid injection steam vent to heat pipe internal-filling liquid body；
Step 3, after the liquid that is filled with is appropriate, the first fluid injection steam vent of sealing and the second fluid injection steam vent.
Preferably, being equipped with control valve on the first fluid injection steam vent connecting copper pipe, copper pipe, control Liquid Flow is come the row of completion
Gas fluid injection.
Preferably, at the second fluid injection steam vent set temperature and air pressure monitoring device, come monitoring device temperature and
The volume of gas in running situation, and air pressure and temperature calculating apparatus by gas, and then the exhaust fluid injection of control device.
Compared with prior art, the present invention has the advantage that：
1) by setting two exhaust liquid injection holes, exhaust and the topping up of heat pipe can be quickly realized, and can reduce
Insoluble gas in heat pipe, improves heat pipe heat exchanging efficiency.
2) steam is filled by being arranged in first exhaust liquid injection hole, topping up body again after first other liquids and gases are discharged,
And steam is finally condensed as heat pipe filling liquid, the insoluble gas in heat pipe can be reduced, heat pipe heat exchanging efficiency is improved.
3) present invention obtains an optimal plate miniature loop circuit heat pipe optimum results, and lead to by test of many times
Overtesting is verified, so as to demonstrate the accuracy of result.
Brief description of the drawings
Fig. 1 is the schematic diagram of the plate miniature loop circuit heat pipe mainboard of the present invention；
Fig. 2 is the plate miniature loop circuit heat pipe cover plate schematic diagram of the present invention；
Fig. 3 is the plate miniature loop circuit heat pipe vaporization chamber Section A-A schematic diagram of the present invention；
Fig. 4 is the plate miniature loop heat pipe air liquid pipe road C-C schematic cross-sections of the present invention；
Fig. 5 is the plate miniature loop circuit heat pipe section B-B schematic diagram of the present invention；
Fig. 6 is the plate miniature loop circuit heat pipe porous media capillary wick schematic diagram of the present invention；
Fig. 7 is the plate miniature loop circuit heat pipe schematic three dimensional views of the present invention.
Reference is as follows：
Reference is as follows：1 mainboard, 2 vaporization chambers, 3 compensating liquid rooms, 4-1,4-2 fluid injection exhaust holes, 5 heat-insulated through holes,
6 fluid pipelines, 7 jet chimneys, 8 condensation chambers, 9 upper cover plate shallow cavity positions, 10 upper cover plates, 11 sheet type porous media capillary wicks
Embodiment
The embodiment to the present invention is described in detail below in conjunction with the accompanying drawings.
As shown in figure 1, a kind of flat-plate minitype loop circuit heat pipe, including mainboard 1 and upper cover plate 10, the upper cover plate 10 is with leading
Plate 1 is packaged together, and the mainboard 1 includes vaporization chamber 2, condensation chamber 8, and jet chimney 7 is connected between vaporization chamber 2 and condensation chamber 8
With fluid pipeline 6, in addition to the first fluid injection steam vent 4-1 and the second fluid injection steam vent 4-2, the first fluid injection steam vent 4-1
It is located at the same side of heat pipe with the second fluid injection steam vent 4-2, such as Fig. 1 is illustrated positioned at the side of vaporization chamber 2.Wherein the first fluid injection is arranged
Stomata 4-1 connects fluid pipeline 6, the second fluid injection steam vent 4-2 connection jet chimneys 7.
By setting two exhaust liquid injection holes, it is possible to achieve a hole topping up body and steam, a hole exhaust and liquid, soon
Fast realizes exhaust and the topping up of heat pipe, and can reduce the insoluble gas in heat pipe, improves heat pipe heat exchanging efficiency.
Fluid pipeline 6 is connected by the first fluid injection steam vent 4-1, the second fluid injection steam vent 4-2 connection jet chimneys 7 can
To realize that the steam of entrance will promote liquid so that liquid is finally discharged when exhaust, just it is easy to judge after discharge liquid
Whether original liquids and gases empty, it is ensured that working fluid in heat pipe it is pure.
Preferably, the first fluid injection steam vent 4-1 and the second fluid injection steam vent 4-2 is located at the side of vaporization chamber 2.
Preferably, being connected between the fluid pipeline 6 and vaporization chamber 2 by capillary, the first fluid injection steam vent
4-1 connections are on the capillary.
Preferably, the first fluid injection steam vent connection compensating liquid room 3, the compensating liquid room 3 is connected by pipeline
Connect capillary.
Preferably, the fluid injection method for exhausting of loop circuit heat pipe as elucidated before, comprises the following steps：
Step one, steam is filled into heat pipe from the first fluid injection steam vent, until steam is arranged since the second fluid injection steam vent
Go out；
Step 2, from the first fluid injection steam vent to heat pipe internal-filling liquid body；
Step 3, after the liquid that is filled with is appropriate, the first fluid injection steam vent of sealing and the second fluid injection steam vent.
Steam is filled by being arranged in first exhaust liquid injection hole, topping up body again after first other liquids and gases are discharged, and
And finally condensation is used as heat pipe filling liquid to steam, it is to avoid introduce other gases, the insoluble gas in heat pipe can be reduced, improve heat
Pipe heat exchange efficiency.
Preferably, exhaust liquid injection hole 4 can connect with extraneous fine copper pipe, control valve is housed on copper pipe, controls gas-liquid
Flow to complete to be vented fluid injection.We seal aperture after the completion of fluid injection, so as to form a set of sealed flat-plate minitype loop
Hot-pipe system.Internal system takes interior circulation.
Of course, it is possible to selection, in order to increase the accuracy of measurement temperature, we can set temperature at exhaust hole
Air pressure monitoring device is spent, carrys out the temperature and running situation of monitoring device, and in the air pressure and temperature calculating apparatus by gas
The volume of gas, and then the exhaust fluid injection of control device.
Above-mentioned heat pipe can be used to be vented and topping up when starting from, and can also be carried out after operation a period of time
Exhaust and topping up so that the operation function of heat pipe recovers.
Preferably, being separated between the jet chimney 7 and fluid pipeline 6 by heat-insulated through hole 5.
The loop circuit heat pipe of the present invention, jet chimney 7 and fluid pipeline 6 is provided entirely on one piece of mainboard 1 so that structure
Miniaturization, can directly fit to microchip surface, heat is directly taken away, and radiating efficiency is high, can be widely applied to electricity
The radiating of the micro-elements such as sub- chip.
Gas-liquid is separated transmission, heat effectively can be gathered in into evaporator by the present invention by setting heat-insulated through hole 5
Place, is radiated so that heat efficiently is transferred into condensation chamber by air-liquid pipeline.Avoid heat diffusion to fluid pipeline, make
Liquid evaporation formation bubble in fluid pipeline, so that the smooth operation entirely circulated is hindered, so that liquid phase point can not be realized
Open this initial principle.
Preferably, described heat-insulated through hole 5 is the channel slot set on mainboard 1.
Preferably, described channel slot runs through whole mainboard 1 in a thickness direction.It is i.e. as shown in Figure 4.By in mainboard
The whole mainboard of insertion on thickness, can thoroughly to separate between jet chimney 7 and fluid pipeline 6, further increase steam
Heat-proof quality between pipeline 7 and fluid pipeline 6.
Preferably, setting the channel slot corresponding with the upper channel groove of mainboard 1 on described upper cover plate 10.
Preferably, setting heat-insulating material in heat-insulated through hole 5, heat is further hindered in jet chimney 7 and liquid line
Transmitted between road 6.
Preferably, the width of heat-insulated through hole 5 is 0.5mm.
Preferably, the vaporization chamber 2 is located at the side of the jet chimney of heat-insulated through hole 5.By being arranged such, Ke Yibao
Jet chimney is directly entered after the evaporation for demonstrate,proving steam, it is ensured that the conveying of gas, reduce flow resistance, it is to avoid the obstruction of passage,
Increase hot-fluid transmission range.
Preferably, setting porous media thin slice 11 in the vaporization chamber 2, thin slice 11 is installed to by interference fit micro-
At the vaporization chamber 2 of type loop circuit heat pipe mainboard 1.
Preferably, the thickness of thin slice 11 is identical with the conduit thickness of mainboard vaporization chamber 2, the upper surface of porous media thin slice 11 can not
More than the upper surface of mainboard 1.By being arranged such, it is to avoid produce gap because can not being combined closely upper cover plate and mainboard, make whole
Failure of apparatus.
The porous media thin slice 11 produces capillary force by porous media capillary wick.
Vaporization chamber 2 absorbs the heat of microchip, and heated porous medium capillary wick position makes surface working solution evaporation, steam
Enter the condensation chamber of miniature loop circuit heat pipe by jet chimney, it is working solution to carry out heat release in condensation chamber and liquefy, in condensation chamber
The evaporator that working solution after the completion of heat release is recycled into miniature loop circuit heat pipe by fluid pipeline again carries out heating evaporation, so that
Complete a circulation.The capillary force that whole device is produced by porous media structure capillary wick provides a part of power, reaches circulation.
Capillary wick is arranged in evaporator, and evaporator not only connects with jet chimney but also connected with fluid pipeline, fluid pipeline, capillary wick with
And compensating liquid room is connected by a small chamber, specifically sees Fig. 1.
Connecting pipe between fluid pipeline 6 and vaporization chamber 2, as shown in figure 1, the pipeline also has capillary force, by steam
Liquid in pipeline 7 is drawn onto in vaporization chamber 2.By the capillary force of porous media thin slice capillary wick by liquid edge in the vaporization chamber 2
Porous media sheet length direction (i.e. Fig. 1 above-below direction) and liquid is drawn onto to the diverse location of vaporization chamber 2, then enter back into
Jet chimney 7, so as to form a circulation.
Find under study for action, along the above-below direction of vaporization chamber 2, the fluid distrbution in jet chimney is uneven, wherein under
Part cloth fluid is more, top distribution less fluid, therefore causes Local Heat Transfer uneven, while causing diverse location jet chimney 7
Fluid distrbution is uneven and temperature distributing disproportionation is even, so as to cause local temperature too high or too low, easily cause heat pipe
Damage.For above-mentioned situation, the present invention is improved, and reaches even fluid distribution, uniformity of temperature profile.
Along the direction (i.e. Fig. 1 bottom to top) of porous media capillary wick capillary force, diverse location it is described porous
The capillary force of medium capillary wick gradually strengthens.Gradually strengthened by the capillary force along bottom to top, capillary wick so that top
Quickly liquid can be sucted, increase the quantity of the fluid on top, so as to enter the steam pipe on top after being evaporated on top
Road 7, so that even fluid distribution is reached, the purpose of uniformity of temperature profile.It is found through experiments that, above-mentioned setting is achieved very well
Technique effect.
Further preferably, along the direction of porous media capillary wick capillary force, the capillary force of capillary wick gradually enhanced width
Degree is increasing.It is found through experiments that, above-mentioned setting can preferably reach the mesh of even fluid distribution, uniformity of temperature profile
's.
Preferably, along above-below direction porous media capillary wick can be divided into polylith, every piece of capillary force is different, its
In along the direction (i.e. Fig. 1 bottom to top) of porous media capillary wick capillary force, the capillary force of different masses gradually strengthens.Enter
Preferably, the enhanced amplitude of capillary force of different masses is increasing for one step.
But if the capillary force of top capillary wick is excessive, again lower flow flow can be caused too small, so as to cause new
It is uneven, therefore the present invention passes through the substantial amounts of relation for testing the capillary force for obtaining optimal capillary wick.
Preferably, the length (i.e. Fig. 1 above-below directions) of porous media thin slice 11 is LAlways, it is most upper in porous media thin slice 11
The capillary force of side is FOn, then the capillary force distribution of porous media thin slice 11 is as follows：F=FOn*(L/LAlways)a, wherein a is coefficient,
1.24<a<1.33.L is the distance of the bottom of positional distance porous media thin slice 11 in porous media thin slice 11.
Above-mentioned relation is obtained by substantial amounts of numerical simulation and its experiment, is tested by substantial amounts of
Card.Capillary force distribution is carried out by above-mentioned relation, enables to fluid distrbution to reach most uniform.
Preferably, 1.27<a<1.29.
Preferably, with L/LAlwaysIncrease, a gradually increases.
Preferably, porous media thin slice 11 sinters to be formed using nickel powder as base by punching press.
Preferably, the size of Ni-based porous media thin slice 11 is, length 5.15mm, width is 3.8mm, and thickness is 150 μ
M, described length is along the direction perpendicular to jet chimney 7 and fluid pipeline.
Preferably, setting cavity 9 on upper cover plate 10, the cavity 9 is arranged on the relative position of porous media thin slice 11,
The cavity 10 is connected with jet chimney 7.
Manufacture the purpose of this cavity quickly to overflow for ease of the steam that working solution heat in capillary wick porous media is evaporated, keep away
Non-evaporating vapour is trapped at capillary wick, so as to block whole porous media structure, causes capillary wick to be evaporated, and makes whole miniature loop heat
Guard system paralyses.The quick discharge of steam can accelerate the circulation inside whole device simultaneously, improve heat transfer radiating efficiency.
Preferably, capillary wick is not connected directly with jet chimney, connected between capillary wick and jet chimney by cavity 9
It is logical.Mainly there is following reason：Working solution is by thermal evaporation in capillary wick, and steam can typically be walked to enter in upper cover plate shallow cavity upwards,
Entered back into by shallow cavity in jet chimney, the resistance that this mode steam is received is smaller, be conducive to improving efficiency.Directly connect not
The efficiency of whole device can be improved, and the flowing of capillary wick internal liquid can be interfered.
Find that cavity is compared with vaporization chamber, it is impossible to excessive, excessive to cause substantial amounts of steam meeting by experiment and numerical analysis
Accumulate in cavity, it is impossible to be sent to condensation chamber in time and exchanged heat, same cavity is compared with vaporization chamber, it is impossible to too small, too small
Steam is also resulted in be trapped at capillary wick, so as to block whole porous media structure, therefore by substantial amounts of numerical analysis and
Its substantial amounts of experiment, sums up the optimum size relation for coming cavity 10 and vaporization chamber.
Preferably, the porosity of described porous media thin slice 11 is K, the thickness of porous media thin slice 11 is H1, institute
The depth for stating cavity 10 is H2, then meets following condition：H2=a*Ln (K*H1)-b, wherein 200<a<210,760<b<770；
140μm<H2<240μm；80μm<K*H1<130μm.
Preferably, 60%<K<80%, 100 μm<H1<200μm.
Preferably, H1=c*H2,0.7<c<0.8.
Preferably, the loop circuit heat pipe also includes compensating liquid room 3, the compensating liquid room 3 and vaporization chamber 2 and liquid
The joint of pipeline 6 is connected.Mainly there are following two effects compensating liquid room：1. by the aperture of compensating liquid room, we can be real
Now exhaust and the big crucial step of fluid injection two.2. be stored in the working solution of compensating liquid room can effectively feed in capillary wick because
Overheat and evaporate working solution rapidly, prevent that liquid is evaporated two and causes capillary wick failure whole device is paralysed completely.
Size as the preferably Ni-based porous media capillary wick of sheet type as shown in Figure 5 is, length 5.15mm, and width is
3.8mm, thickness is 150 μm.Capillary force is larger when wherein Ni-based porosity of porous medium is 60%~80%, device running efficiency
It is higher.
Preferably, the width of jet chimney 7 is 400-500 μm, as preferably 450 μm, preferably there are 10.It is preferred that
Jet chimney 7 from each other at intervals of 200 μm, length is 43mm, and depth is 150 μm.By processing rectangular channel on mainboard
Road, and upper cover plate is engaged to form pipeline with mainboard.
Preferably, the width of jet chimney 7 is 2-5 times, preferably 3 times of fluid pipeline width.By increasing steam pipe
The quantity in road is more, it is therefore intended that reduce the pressure drop of steam, increases the transmission range of steam, improves the operational efficiency of device.
Preferably, the width of fluid pipeline 6 is 150 μm, length is 43mm, and depth is 150 μm, and four liquid are designed altogether
Pipeline, it is middle at intervals of 75 μm.
By fluid pipeline design it is such it is narrow be because：1. slype can provide very big capillary force, by liquid from cold
Evaporation ends are sucked back in solidifying room, the auxiliary power as whole device, and guide effect is produced to the flowing of liquid.2. narrow is logical
Road can bear bigger pressure.
Preferably, it is 8.9mm that the size of condensation chamber 8, which is length and width, depth is 150 μm of shallow cavity.The mesh so selected
For increasing heat radiation area, improve radiating efficiency.The condensation chamber type of cooling can also set many kinds, for example, set air-cooled or water
Cool equipment, we realize the cooling of condensation chamber used here as electronic semi-conductor's cooling element.
For flat-plate minitype loop circuit heat pipe, it is ensured that vaporization chamber porous media capillary wick is not evaporated, and is not generated
Vapor lock, fluid pipeline by bubble block be not maintain whole device trouble-free operation key.It is understood that containing in air
There are many non-condensable gas, when working solution evaporates in flat-plate minitype loop circuit heat pipe, non-condensable gas can be combined production with steam
Raw substantial amounts of bubble, and then block duct and the block liquid pipeline of porous media capillary wick, so that whole device starts not
Or device is paralysed after starting.So the non-condensable gas of discharge whole device is the premise of whole device operation.
For plate miniature loop circuit heat pipe, heat is concentrated at vaporization chamber and absorbed, passes through two phase transformations of working solution
Change is that the latent heat of liquid takes away heat.So ensureing that heat is concentrated acts on the pass that evaporation ends are also device Effec-tive Function
Key.
Preferably, working solution we have multiple choices, main working solution has following several：Water, ammonia, acetone, methanol,
Toluene, freon.Select which kind of working solution mainly relevant with required operating temperature, different liquids are in different operating temperatures
The advantage of performance is different, so selection working solution also needs to determine according to actual conditions.
Although the present invention is disclosed as above with preferred embodiment, the present invention is not limited to this.Any art technology
Personnel, without departing from the spirit and scope of the present invention, can make various changes or modifications, therefore protection scope of the present invention should
It is defined when by claim limited range.
Claims (9)
1. a kind of flat-plate minitype loop circuit heat pipe, including mainboard and upper cover plate, the upper cover plate is packaged together with mainboard, described
Mainboard includes vaporization chamber, condensation chamber, and jet chimney and fluid pipeline are connected between vaporization chamber and condensation chamber, it is characterised in that also
Including the first fluid injection steam vent and the second fluid injection steam vent, the first fluid injection steam vent and the second fluid injection steam vent are located at heat pipe
The same side, wherein the first fluid injection steam vent connect fluid pipeline, the second fluid injection steam vent connection jet chimney.
2. loop circuit heat pipe as claimed in claim 1, it is characterised in that the first fluid injection steam vent and the second fluid injection steam vent are located at
Vaporization chamber side.
3. loop circuit heat pipe as claimed in claim 2, it is characterised in that pass through capillary between the fluid pipeline and vaporization chamber
Connection, the first fluid injection steam vent connection is on the capillary.
4. loop circuit heat pipe as claimed in claim 3, it is characterised in that the first fluid injection steam vent connection compensating liquid room,
The compensating liquid room connects capillary by pipeline.
5. the loop circuit heat pipe as described in one of claim 1-4, it is characterised in that cavity is set on upper cover plate, the cavity is set
Put in the position relative with porous media thin slice, the second fluid injection steam vent is not connected directly with vaporization chamber, but passes through sky
Chamber connects vaporization chamber.
6. loop circuit heat pipe as claimed in claim 5, the cavity is connected with jet chimney, the hole of described porous media thin slice
Gap rate is K, and the thickness of porous media is H1, and the thickness of the cavity is H2, then meets following condition：H2=a*Ln (K*H1)-
B, wherein 200<a<210,760<b<770.
7. the fluid injection method for exhausting of the loop circuit heat pipe as described in claim 1-6, it is characterised in that comprise the following steps：
Step one, steam is filled into heat pipe from the first fluid injection steam vent, until steam is discharged since the second fluid injection steam vent；
Step 2, from the first fluid injection steam vent to heat pipe internal-filling liquid body；
Step 3, after the liquid that is filled with is appropriate, the first fluid injection steam vent of sealing and the second fluid injection steam vent.
8. the fluid injection method for exhausting of loop circuit heat pipe as claimed in claim 7, it is characterised in that
Control valve is housed on the first fluid injection steam vent connecting copper pipe, copper pipe, controls Liquid Flow to complete to be vented fluid injection.
9. the fluid injection method for exhausting of loop circuit heat pipe as claimed in claim 7, it is characterised in that set at the second fluid injection steam vent
Temperature and air pressure monitoring device is put, comes the temperature and running situation of monitoring device, and dress is calculated by the air pressure and temperature of gas
Put the volume of interior gas, and then the exhaust fluid injection of control device.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710081747.8A CN107087374B (en) | 2017-02-15 | 2017-02-15 | A kind of flat-plate minitype loop circuit heat pipe and its fluid injection method for exhausting |
| CN201810171913.8A CN108444320B (en) | 2017-02-15 | 2017-02-15 | A kind of jet chimney width is greater than the flat-plate minitype loop circuit heat pipe of fluid pipeline width |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710081747.8A CN107087374B (en) | 2017-02-15 | 2017-02-15 | A kind of flat-plate minitype loop circuit heat pipe and its fluid injection method for exhausting |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810171913.8A Division CN108444320B (en) | 2017-02-15 | 2017-02-15 | A kind of jet chimney width is greater than the flat-plate minitype loop circuit heat pipe of fluid pipeline width |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107087374A true CN107087374A (en) | 2017-08-22 |
| CN107087374B CN107087374B (en) | 2018-04-13 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710081747.8A Active CN107087374B (en) | 2017-02-15 | 2017-02-15 | A kind of flat-plate minitype loop circuit heat pipe and its fluid injection method for exhausting |
| CN201810171913.8A Active CN108444320B (en) | 2017-02-15 | 2017-02-15 | A kind of jet chimney width is greater than the flat-plate minitype loop circuit heat pipe of fluid pipeline width |
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| CN201810171913.8A Active CN108444320B (en) | 2017-02-15 | 2017-02-15 | A kind of jet chimney width is greater than the flat-plate minitype loop circuit heat pipe of fluid pipeline width |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108489312A (en) * | 2018-03-12 | 2018-09-04 | 上海利正卫星应用技术有限公司 | The loop heat pipe evaporator and loop circuit heat pipe of high heat flux density adaptability |
| CN115143823A (en) * | 2022-06-17 | 2022-10-04 | 北京理工大学 | Porous medium phase change heat transfer structure and system driven by hot-pressing conversion effect |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7305512B2 (en) * | 2019-10-17 | 2023-07-10 | 新光電気工業株式会社 | Loop type heat pipe and its manufacturing method |
| CN115087295A (en) * | 2021-03-12 | 2022-09-20 | 北京小米移动软件有限公司 | Middle frame assembly, manufacturing method of middle frame assembly and mobile terminal |
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| CN1535748A (en) * | 2003-04-11 | 2004-10-13 | 中国科学院工程热物理研究所 | Evaporator for separated heat tube |
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| CN108489312A (en) * | 2018-03-12 | 2018-09-04 | 上海利正卫星应用技术有限公司 | The loop heat pipe evaporator and loop circuit heat pipe of high heat flux density adaptability |
| CN115143823A (en) * | 2022-06-17 | 2022-10-04 | 北京理工大学 | Porous medium phase change heat transfer structure and system driven by hot-pressing conversion effect |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108444320B (en) | 2019-03-29 |
| CN107087374B (en) | 2018-04-13 |
| CN108444320A (en) | 2018-08-24 |
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