CN107083224A - Cantilever bridging structure glue - Google Patents
Cantilever bridging structure glue Download PDFInfo
- Publication number
- CN107083224A CN107083224A CN201710423249.7A CN201710423249A CN107083224A CN 107083224 A CN107083224 A CN 107083224A CN 201710423249 A CN201710423249 A CN 201710423249A CN 107083224 A CN107083224 A CN 107083224A
- Authority
- CN
- China
- Prior art keywords
- parts
- structure glue
- bridging structure
- component
- cantilever
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/60—Amines together with other curing agents with amides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/06—Polymer mixtures characterised by other features having improved processability or containing aids for moulding methods
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/22—Mixtures comprising a continuous polymer matrix in which are dispersed crosslinked particles of another polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to a kind of cantilever bridging structure glue, road is formed with cold welding seam agent by first component and second component hybrid modulation, and the raw material that the first component is matched by following portions by weight is made：100 parts of bisphenol A type epoxy resin, 5 10 parts of toughener, 38 parts of reactive diluent, 50 100 parts of filler；The raw material that the second component is matched by following portions by weight is made：Compound 35 55 parts of curing agent, 13 parts of accelerator, 14 parts of coupling agent, 35 parts of thixotropic agent, 30 50 parts of filler.This cantilever bridging structure glue have have good workability, it is not stratified, the characteristics of do not isolate, do not trickle, hence it is evident that save glue consumption, acid and alkali-resistance erosion medium resistance, solidify at normal temperatures, without fugitive constituent, nontoxic is environment-friendly type structure glue, adhesion strength is high, with good toughness and impact resistance.
Description
Technical field
The present invention relates to cantilever bridgework Material Field, more particularly to a kind of cantilever for bridge prefabrication section assembling
Bridging structure glue.
Background technology
Cantilever bridging structure glue, is that a kind of clear and bright seam for being used to use Bridge Erector to carry out bridge prefabrication section assembling is constructed
Special glue kind.Often price is high for external import cantilever bridging structure glue, adds production cost, and domestic similar cantilever is built bridge
Structure glue generally existing filler is excessive, easy laminated segregation, phenomenon of trickling, and toughness of material is not enough, has both wasted structure glue raw material,
Construction environment is influenceed again.
The content of the invention
It is an object of the invention to overcome deficiency of the prior art, there is provided a kind of cantilever bridging structure glue.
The present invention is achieved by the following technical solutions：A kind of cantilever bridging structure glue, is mixed by first component and second component
Close modulation to form, the raw material that the first component is matched by following portions by weight is made：100 parts of bisphenol A type epoxy resin, toughener
5-10 parts, 3-8 parts of reactive diluent, 50-100 parts of filler；The raw material that the second component is matched by following portions by weight is made：It is multiple
With 35-55 parts of curing agent, 1-3 parts of accelerator, 1-4 parts of coupling agent, 3-5 parts of thixotropic agent, 30-50 parts of filler.
Preferably, the first component is 3 according to mass ratio with second component:1 ratio is adjusted
Preferably, the bisphenol A type epoxy resin is by bisphenol A type epoxy resin E-44 and bisphenol A type epoxy resin E-51
It is 2 according to mass ratio:1 ratio uniform is mixed.
Preferably, the toughener is strange scholar's toughener.
Preferably, the filler is made up of granularity for the silicon powder of 400 mesh.
Preferably, the reactive diluent is benzyl glycidyl ether.
Preferably, the compounding curing agent is that ester cyclammonium and low molecular polyamides compounding are formed.
Preferably, the accelerator is DMP-30.
Preferably, the coupling agent is KH-550 silane couplers.
Preferably, the thixotropic agent is white carbon.
The beneficial effects of the present invention are：The cantilever bridging structure glue that the present invention is provided have have good workability, it is not stratified,
The characteristics of not isolating, do not trickle, hence it is evident that save glue consumption, acid and alkali-resistance erosion medium resistance solidifies at normal temperatures, without fugitive constituent, nothing
Harmless poison is environment-friendly type structure glue, and adhesion strength is high, with good toughness and impact resistance.
The present invention is from host of the compounding bisphenol A type epoxy resin as cantilever bridging structure glue so that this structure glue
Viscosity and adhesion strength be all guaranteed, contain active group in toughener polymer backbone molecule, and in epoxy resin
Active group reacts, and is formed using CC dispersed phases as " island ", links " island structure " that phase epoxy resin is " sea ", reaches toughness reinforcing
Purpose so that tensile shear strength is increased substantially.
Benzyl glycidyl ether can both reduce the viscosity of high thixotroping cantilever bridging structure glue, change as reactive diluent
Enter its fluidity and wellability, epoxy resin cure reaction can be participated in because of active group in structure again, it is last as main fat
A part for the network structure of formation, overcome makes the defect of glue-line cohesive force decline because solvent volatilizees.
Curing agent is compounded using low molecular polyamides and ester cyclammonium, remains the big proportional quantity of polyamide, low exothermic peak is matched somebody with somebody
Square scope is wide, good, the advantages of tenacity is high of rigidity, and aliphatic cyclic amine and low molecular polyamides can learn from other's strong points to offset one's weaknesses, both reduce
The viscosity of system, keeps its lasting caloric value to promote sub- molecular weight polyamide solidification, can add filler more again, reduce again
Cost and performance does not decline, improve heat resistance, can also be applied in -10 DEG C of environment, greatly expand high thixotroping cantilever frame
The application of bridge structure glue.
Compounding curing agent liquefied is mixed easily with epoxy resin, and intermiscibility is good, is matched without too strict, moreover it is possible to improve tree
Fat and original, the compatibility of auxiliary material, altax P-30 addition, further improve ability to cure, and coupling agent is molecule two ends
Compound containing heterogeneity group, two end groups can be combined with gluing agent molecule and adhesive respectively, play " bridge ",
Substantially increase the molecule cohesive force between the base materials such as glue-line and bridge subsection.
White carbon as thixotropic agent introducing so that cantilever bridging structure glue under external force viscosity reduce, be easy to apply
Smear, viscosity increase when static, glue will not arbitrarily trickle, glue consumption is saved about than similar high thixotroping cantilever bridging structure glue
15%.
Embodiment
Technical solution of the present invention and technique effect are specifically described below according to specific embodiment.
Embodiment 1
The cantilever bridging structure glue of the present embodiment, according to mass ratio is 3 by first component and second component:1 ratio is being stirred
It is well mixed and forms in mixing equipment, the preparation method of wherein first component is as follows, by 60kg bisphenol A type epoxy resins E-51,40kg
The strange scholar's toughener of bisphenol A type epoxy resin E-44,14kg, 5kg benzyl glycidyl ethers, the mesh silicon powders of 100kg 400 are in stirring
It is well mixed and forms in equipment.The preparation method of second component is as follows, by 20kg esters cyclammonium, 20kg low molecular polyamides, 1.5kg
DMP-30,2kg KH-550,3kg white carbon, 40kg400 mesh silicon powders are well mixed in mixing plant and formed, gained cantilever
The Product checking result of bridging structure glue is as shown in subordinate list one.
Embodiment 2
The cantilever bridging structure glue of the present embodiment, according to mass ratio is 3 by first component and second component:1 ratio is being stirred
It is well mixed and forms in mixing equipment, the preparation method of wherein first component is as follows, by 60kg bisphenol A type epoxy resins E-51,40kg
The strange scholar's toughener of bisphenol A type epoxy resin E-44,13kg, 6kg benzyl glycidyl ethers, the mesh silicon powders of 100kg 400 are in stirring
It is well mixed and forms in equipment.The preparation method of second component is as follows, by 15kg esters cyclammonium, 25kg low molecular polyamides, 1.5kg
DMP-30,2kg KH-550,2kg white carbon, 40kg400 mesh silicon powders are well mixed in mixing plant and formed, gained cantilever
The Product checking result of bridging structure glue is as shown in subordinate list one.
Embodiment 3
The cantilever bridging structure glue of the present embodiment, according to mass ratio is 3 by first component and second component:1 ratio is being stirred
It is well mixed and forms in mixing equipment, the preparation method of wherein first component is as follows, by 65kg bisphenol A type epoxy resins E-51,35kg
The strange scholar's toughener of bisphenol A type epoxy resin E-44,12kg, 7kg benzyl glycidyl ethers, the mesh silicon powders of 75kg 400 are set in stirring
Standby interior be well mixed forms.The preparation method of second component is as follows, by 20kg esters cyclammonium, 20kg low molecular polyamides, 1.5kg
DMP-30,2kg KH-550,2kg white carbon, 50kg400 mesh silicon powders are well mixed in mixing plant and formed, gained cantilever
The Product checking result of bridging structure glue is as shown in subordinate list one.
Embodiment 4
The cantilever bridging structure glue of the present embodiment, according to mass ratio is 3 by first component and second component:1 ratio is being stirred
It is well mixed and forms in mixing equipment, the preparation method of wherein first component is as follows, by 70kg bisphenol A type epoxy resins E-51,30kg
The strange scholar's toughener of bisphenol A type epoxy resin E-44,15kg, 5kg benzyl glycidyl ethers, the mesh silicon powders of 75kg 400 are set in stirring
Standby interior be well mixed forms.The preparation method of second component is as follows, by 15kg esters cyclammonium, 25kg low molecular polyamides, 1.5kg
DMP-30,2kg KH-550,2kg white carbon, 50kg400 mesh silicon powders are well mixed in mixing plant and formed, gained cantilever
The Product checking result of bridging structure glue is as shown in subordinate list one.
The Product checking result of the cantilever bridging structure glue of subordinate list one
For the ordinary skill in the art, simply the present invention is exemplarily described for specific embodiment,
The obvious present invention, which is implemented, to be not subject to the restrictions described above, and is entered as long as employing the inventive concept and technical scheme of the present invention
The improvement of capable various unsubstantialities, or it is not improved by the present invention design and technical scheme directly apply to other occasions
, within protection scope of the present invention.
Claims (10)
1. a kind of cantilever bridging structure glue, is formed by first component and second component hybrid modulation, it is characterised in that the first component by
The raw material of following portions by weight proportioning is made：100 parts of bisphenol A type epoxy resin, 5-10 parts of toughener, 3-8 parts of reactive diluent,
50-100 parts of filler；The raw material that the second component is matched by following portions by weight is made：Compound 35-55 parts of curing agent, accelerator
1-3 parts, 1-4 parts of coupling agent, 3-5 parts of thixotropic agent, 30-50 parts of filler.
2. cantilever bridging structure glue according to claim 1, it is characterised in that the first component is with second component according to mass ratio
For 3:1 ratio is allocated.
3. cantilever bridging structure glue according to claim 1, it is characterised in that the bisphenol A type epoxy resin is by bisphenol A-type
Epoxy resin E-44 and bisphenol A type epoxy resin E-51 epoxy resin are 2 according to mass ratio:1 ratio uniform is mixed.
4. cantilever bridging structure glue according to claim 1, it is characterised in that the toughener is strange scholar's toughener.
5. cantilever bridging structure glue according to claim 1, it is characterised in that the filler is micro- for the silicon of 400 mesh by granularity
Powder is constituted.
6. cantilever bridging structure glue according to claim 1, it is characterised in that the reactive diluent is benzyl glycidol
Ether.
7. cantilever bridging structure glue according to claim 1, it is characterised in that the compounding curing agent is ester cyclammonium and low point
Son amount polyamide compounding is formed.
8. cantilever bridging structure glue according to claim 1, it is characterised in that the accelerator is DMP-30.
9. cantilever bridging structure glue according to claim 1, it is characterised in that the coupling agent is that KH-550 is silane coupled
Agent.
10. cantilever bridging structure glue according to claim 1, it is characterised in that the thixotropic agent is white carbon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710423249.7A CN107083224A (en) | 2017-06-07 | 2017-06-07 | Cantilever bridging structure glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710423249.7A CN107083224A (en) | 2017-06-07 | 2017-06-07 | Cantilever bridging structure glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107083224A true CN107083224A (en) | 2017-08-22 |
Family
ID=59608074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710423249.7A Pending CN107083224A (en) | 2017-06-07 | 2017-06-07 | Cantilever bridging structure glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107083224A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107698939A (en) * | 2017-10-24 | 2018-02-16 | 孙会娟 | A kind of bridge pad heightens filler and production technology |
| CN110903796A (en) * | 2019-12-10 | 2020-03-24 | 南京工程学院 | High-toughness bridge reinforcing structure adhesive |
| CN113913144A (en) * | 2021-08-20 | 2022-01-11 | 杭州固安科技有限公司 | Normal-temperature-cured steel-bonding adhesive with high humidity resistance, heat resistance and thermal aging resistance |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010407A (en) * | 2016-06-02 | 2016-10-12 | 北京中德新亚建筑技术有限公司 | High-thixotropy modified epoxy resin steel sticking glue |
-
2017
- 2017-06-07 CN CN201710423249.7A patent/CN107083224A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010407A (en) * | 2016-06-02 | 2016-10-12 | 北京中德新亚建筑技术有限公司 | High-thixotropy modified epoxy resin steel sticking glue |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107698939A (en) * | 2017-10-24 | 2018-02-16 | 孙会娟 | A kind of bridge pad heightens filler and production technology |
| CN110903796A (en) * | 2019-12-10 | 2020-03-24 | 南京工程学院 | High-toughness bridge reinforcing structure adhesive |
| CN113913144A (en) * | 2021-08-20 | 2022-01-11 | 杭州固安科技有限公司 | Normal-temperature-cured steel-bonding adhesive with high humidity resistance, heat resistance and thermal aging resistance |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106010407A (en) | High-thixotropy modified epoxy resin steel sticking glue | |
| CN102977557B (en) | A kind of room temperature curing epoxy composition and method of making the same | |
| CN105925228A (en) | Multi-purpose modified epoxy resin adhesive | |
| CN102875057B (en) | High-strength quick-curing epoxy mortar and preparation method thereof | |
| CN103756610B (en) | A kind of two component color inhibition epoxyn and preparation method thereof | |
| CN104245875B (en) | Epoxy adhesive composition | |
| CN103571413B (en) | Dry-hanging stone curtain wall epoxy adhesive and preparation method thereof | |
| CN103232588B (en) | Two-component liquid pad composition | |
| CN107083224A (en) | Cantilever bridging structure glue | |
| CN102391817B (en) | Underwater epoxy structure adhesive and preparation method thereof | |
| CN102453458B (en) | Nano rubber modified room temperature cured high temperature resistant structure adhesive | |
| CN101205129B (en) | Dual-component bisphenol A epoxide-resin puddle for construction joint filling and preparation thereof | |
| CN101348701B (en) | Optical light color low stress modified epoxy adhesive and preparation of | |
| CN105176465B (en) | A kind of epoxy mortar and preparation method thereof | |
| CN106010406A (en) | Modified epoxy resin anchor adhesive with high strength and toughness | |
| CN102533193A (en) | Bi-component epoxy resin construction adhesive and preparation method thereof | |
| CN104312508B (en) | A kind of epoxy resin adhesive and preparation method thereof | |
| CN103450835A (en) | Epoxy resin adhesive and preparation method thereof | |
| CN103965820B (en) | High strength underwater structure glue and preparation method thereof | |
| CN101255325A (en) | Synthesis technique of dual-component wet and heat ageing resistant epoxy building structure strengthening adhesive | |
| CN108003824A (en) | A kind of reinforcing steel bonding glue of low temperature resistant toughness reinforcing and preparation method thereof | |
| CN103694637B (en) | A kind of High-tenacity vacuum slow epoxy resin for wind power blade and preparation method thereof | |
| CN113046008A (en) | Special epoxy elastic adhesive for high-mechanical-property steel bar sleeve | |
| PL2029656T3 (en) | Coating system | |
| CN106085321A (en) | A kind of epoxy construction adhesive for the carbon plate that bonds and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Xuezhen Inventor after: Huang Xiaolin Inventor after: Wang Feifei Inventor after: Ma Chunfeng Inventor after: Ji Junjie Inventor after: Dong Liancheng Inventor after: Li Wei Inventor after: Guo Zonglin Inventor before: Wang Xuezhen Inventor before: Ji Junjie Inventor before: Dong Liancheng Inventor before: Li Wei Inventor before: Guo Zonglin |
|
| CB03 | Change of inventor or designer information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170822 |
|
| RJ01 | Rejection of invention patent application after publication |