CN107065068A - The electric field measurement sensor-packaging structure coupled based on tapered fiber planar waveguide - Google Patents
The electric field measurement sensor-packaging structure coupled based on tapered fiber planar waveguide Download PDFInfo
- Publication number
- CN107065068A CN107065068A CN201611234416.5A CN201611234416A CN107065068A CN 107065068 A CN107065068 A CN 107065068A CN 201611234416 A CN201611234416 A CN 201611234416A CN 107065068 A CN107065068 A CN 107065068A
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- China
- Prior art keywords
- groove
- tapered fiber
- planar waveguide
- electric field
- measurement sensor
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/12—Measuring electrostatic fields or voltage-potential
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12138—Sensor
Abstract
For the electric field measurement sensor based on tapered fiber planar waveguide coupled modes quickly grown at present, the present invention proposes a kind of electric field measurement sensor-packaging structure coupled based on tapered fiber planar waveguide.Including substrate, there is V-groove on substrate, the surface of V-groove, which is scribbled, shelters film;Tapered fiber is positioned in V-groove, and planar waveguide is provided with V-groove.Wherein, backing material selection is monocrystalline silicon.Optical fiber can be fixed and keep the spacing of optical fiber La Zhui areas and planar waveguide to fix by the present invention, can effectively solve waveguide and optical fiber mode fields matching and coupling collimation all with very big randomness the problem of.
Description
Technical field
The invention belongs to the encapsulation field of measurement sensor, the particularly electric field to tapered fiber planar waveguide coupled modes
A kind of encapsulating structure that measurement sensor is proposed.
Background technology
Mainly the method for packing of the stochastic problems of the matching and coupling of solution waveguide and optical fiber mode fields has at present:
(1)Directly finely tune optical fiber align method.But due to it, to adjust free degree too many, adds the difficulty of adjustment, at the same optical fiber with
The phenomenon such as coupling and degeneration easily occurs for waveguide.
(2)" upside-down mounting " coupling and structure.Although this method has higher coupling and precision.But it is larger using silicon chip, ripple is influenceed
The electrical contact led and the high frequency performance of device.Furthermore the thermal expansivity Different Effects coupling of silicon chip and waveguide and heat endurance.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of simple technique, low cost, spacing and fix and can protect
Hold the encapsulation knot of the electric field measurement sensor based on tapered fiber planar waveguide coupled modes that waveguide and optical fiber mode fields are effectively matched
Structure.
The technical solution adopted by the present invention is as follows to achieve these goals:The electricity coupled based on tapered fiber planar waveguide
There is V-groove, the surface of V-groove, which is scribbled, shelters film on field measurement sensor-packaging structure, including substrate, substrate;Tapered fiber
It is positioned in V-groove, the tapering region in tapered fiber stage casing is located at the middle position of V-groove, tapered fiber tapering region institute
Locate on the V-groove of position across being provided with planar waveguide.
There is coupling and oil in the V-groove of tapered fiber tapering region present position, make tapered fiber and planar waveguide
It is relatively fixed.For the tapering region of tapered fiber, the vertical depth of V-groove is smaller, and in other region V-grooves of optical fiber
Vertical depth is larger.
In such scheme, the material of the substrate is monocrystalline silicon, and V-groove is obtained using wet etching corrosion.In wet etching
Using anisotropic corrosive liquid.
The opening direction of the V-groove must be parallel or perpendicular to monocrystalline silicon(110)Crystal orientation.The inclination angle of V-groove is
54.74 degree, the cone-apex angle of V-groove is 70.52 degree.
By the relevant parameter for calculating tapering region V-groove so that the distance of tapering region and V-groove horizontal plane is optimal
Coupling value.Planar waveguide is placed on the horizontal plane on the region of tapering, using the coupling and oil of tapering area filling, both realized
Good coupling and, the tapering region of tapered fiber and being relatively fixed for planar waveguide position are realized again.
Advantages of the present invention:Due to the special microcosmic mechanism of monocrystalline silicon, being accurately positioned not with temperature for optical fiber can be achieved
Change and shift so that the collimation performance of the matching and coupling of waveguide and optical fiber mode fields is good.The design of V-groove can be square
Just it is, stable to make planar waveguide and tapered fiber bore area to reach designed coupling and spacing.
Brief description of the drawings
Fig. 1 is each crystal face schematic diagram of V-groove of the present invention;
The encapsulating structure schematic diagram of Fig. 2 fibre optical sensors of the present invention;
In figure:1- substrates, 2- tapered fibers, 3- planar waveguides, 4- taperings region.
Embodiment
The present embodiment is from single crystal silicon material as substrate 1, and monocrystalline silicon must be selected(100)Crystal orientation.It is required that crystal orientation is accurate, it is no
Then V-groove can be askew, influences it to use;Single crystal silicon material defect is few, particularly without fault, meeting when otherwise being made using etching process
It is uneven in fault location, it is too many it to be influenceed to use.
The corrosive liquid of silicon has many kinds, has plenty of anisotropy, has plenty of isotropism.Anisotropy must be selected first
Corrosive liquid, for example can select highly basic K, organic matter I and water ternary system.The matter of each composition in K- I- water ternary corrosive liquids
Measuring percentage ratio is:K:I:Water=23.4%:13.3%:63.3%.Corrosion temperature is at 80 degrees Celsius, and corrosion rate is low, through corrosion
V-groove quality it is relatively good, groove sidewall is smooth, and bottom land hillock is less, and geometric accuracy is high.In order to ensure each composition of corrosive liquid in system
It is basically unchanged during work, it is necessary to use a set of water-bath with reflux.It can be automatic by temperature control equipment
Control corrosion rate temperature is 80 degrees Celsius.Add water condensing tube to be wrapped on the volatilization pipe of corrosion liquid container, make the corrosive liquid of volatilization
Return to container and ensure that its concentration and proportioning do not change.The hand basket of corrosion is placed in corrosive liquid vertically, in corrosion by silicon
Piece is fixed on hand basket vertically, corrosive liquid is flowed down along V-groove, it is to avoid impurity stays in bottom land and produces hillock during corrosion.In addition,
Hand basket can also control the height of silicon chip, to prevent the magazine that corrosive liquid rolling takes up during heating to be attached on groove.
The opening direction of V-groove must be parallel or perpendicular to monocrystalline silicon(110)Crystal orientation, referring to Fig. 1, if direction is not to
Standard, V-groove can be deformed.
With corresponding corrosion resistant film is sheltered for the corrosive liquid of selection, it is desirable to which the adhesiveness for sheltering film must be fine,
Quality is fine and close, and certain thickness will be had by also having, such as makees mask with silica.SiO is grown using high temperature wet oxidation method2,
Thickness about 0.5um.The advantage of this method is SiO2Firmly, compactness is good, and more time saving than dry-oxygen oxidation for film.Completing
Afterwards, it is necessary to assure shelter that film is smooth steep, impulse- free robustness and without the quality required by the normal photolithographic process such as undercutting.It is certainly to shelter film
Body oxide layer, is not coating.Sheltering film should be added in after corrosion V-groove, protect substrate.
The inclination angle of application claims V-groove is 54.74 degree, under this angle the physicochemical properties of V-groove it is more stable,
Reliability is higher.Corrosion depth and the cooperation value of face width are also met just simultaneously.Now the cone-apex angle of V-groove is 70.52
Degree.
For corrosion depth, the obvious lateral encroaching of V-groove can be caused greatly very much so that the width of V-groove, which is more than, to be set
Evaluation, it is usually the case that, the value of corrosion depth will be approached or small with 0.707 times of face width.
According to requirements above, corroded using wet etching on substrate and V-groove, processed very simple.
Referring to Fig. 2, the electric field measurement sensor-packaging structure coupled based on tapered fiber planar waveguide, including substrate 1, lining
There is V-groove, the surface of V-groove, which is scribbled, shelters film on bottom;Tapered fiber 2 is positioned in V-groove, makes the cone in tapered fiber stage casing
Portion region 4, which is located on the middle position of V-groove, the V-groove of the present position of tapered fiber tapering region 4, is crossed with planar waveguide 3.
There is coupling and oil in the V-groove of the present position of tapered fiber tapering region 4, make tapered fiber 2 relatively solid with planar waveguide 3
It is fixed.
The present invention uses monocrystalline silicon as substrate, can meet the micron accuracies requirement of optical fiber.V-groove can profit simultaneously
Accurate fiber orientation is realized with above-mentioned etching process, non-fiber is shifted at high temperature, with high reliability.Can effectively it solve
The problem of certainly collimation of the matching and coupling of waveguide and optical fiber mode fields is all with very big randomness.It is demonstrated experimentally that adopting
With this method for packing optical fiber and the insertion loss of fiber waveguide can be made to be less than 7dB.
One embodiment of the present invention is the foregoing is only, is not all of or unique embodiment, this area is common
Technical staff faces any equivalent conversion that the technology of the present invention method is taken by reading description of the invention, is the present invention
Claim covered.
Claims (8)
1. the electric field measurement sensor-packaging structure coupled based on tapered fiber planar waveguide, it is characterised in that:Including substrate, lining
There is V-groove, the surface of V-groove, which is scribbled, shelters film on bottom;Tapered fiber is positioned in V-groove, makes the cone in tapered fiber stage casing
Portion region is located at the middle position of V-groove, across being provided with flat board ripple on the V-groove of tapered fiber tapering region present position
Lead.
2. the electric field measurement sensor-packaging structure coupled according to claim 1 based on tapered fiber planar waveguide, it is special
Levy and be:There is coupling and oil in the V-groove of tapered fiber tapering region present position, make tapered fiber and planar waveguide phase
To fixation.
3. the electric field measurement sensor-packaging structure according to claim 1 or claim 2 coupled based on tapered fiber planar waveguide, its
It is characterised by:The material of the substrate is monocrystalline silicon.
4. the electric field measurement sensor-packaging structure coupled according to claim 3 based on tapered fiber planar waveguide, it is special
Levy and be:The V-groove is obtained using wet etching corrosion.
5. the electric field measurement sensor-packaging structure coupled according to claim 4 based on tapered fiber planar waveguide, it is special
Levy and be:The wet etching uses anisotropic corrosive liquid.
6. the electric field measurement sensor-packaging structure coupled according to claim 3 based on tapered fiber planar waveguide, it is special
Levy and be:The opening direction of the V-groove must be parallel or perpendicular to monocrystalline silicon(110)Crystal orientation.
7. the electric field measurement sensor envelope coupled according to claim 1 or 2 or 4 or 5 or 6 based on tapered fiber planar waveguide
Assembling structure, it is characterised in that:The vertical depth of the V-groove of tapered fiber tapering region present position be less than V-groove remaining
The vertical depth in region.
8. the electric field measurement sensor-packaging structure coupled according to claim 7 based on tapered fiber planar waveguide, it is special
Levy and be:The inclination angle of the V-groove is 54.74 degree, and the cone-apex angle of V-groove is 70.52 degree.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112068255A (en) * | 2020-08-28 | 2020-12-11 | 任恒江 | Optical fiber coupling alignment structure, preparation method and optical fiber coupling method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050029455A1 (en) * | 2000-12-26 | 2005-02-10 | National Research Council Of Canada | High speed and high efficiency Si-based photodetectors using waveguides formed with silicide for near IR applications |
CN102159975A (en) * | 2008-09-17 | 2011-08-17 | 英特尔公司 | Method and apparatus for efficient coupling between silicon photonic chip and optical fiber |
CN102520264A (en) * | 2011-11-30 | 2012-06-27 | 西安交通大学 | Tapered fiber-slab waveguide coupling structure-based electric field sensor and measurement system |
CN105589136A (en) * | 2016-02-26 | 2016-05-18 | 浙江工业大学 | Optical comb filter based on lithium niobate and tapered filter and production method thereof |
-
2016
- 2016-12-28 CN CN201611234416.5A patent/CN107065068A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050029455A1 (en) * | 2000-12-26 | 2005-02-10 | National Research Council Of Canada | High speed and high efficiency Si-based photodetectors using waveguides formed with silicide for near IR applications |
CN102159975A (en) * | 2008-09-17 | 2011-08-17 | 英特尔公司 | Method and apparatus for efficient coupling between silicon photonic chip and optical fiber |
CN102520264A (en) * | 2011-11-30 | 2012-06-27 | 西安交通大学 | Tapered fiber-slab waveguide coupling structure-based electric field sensor and measurement system |
CN105589136A (en) * | 2016-02-26 | 2016-05-18 | 浙江工业大学 | Optical comb filter based on lithium niobate and tapered filter and production method thereof |
Non-Patent Citations (4)
Title |
---|
SHAOFEI DONG 等: ""Investigation of evanescent coupling between tapered fiber and a multimode slab waveguide"", 《APPLIED OPTICS》 * |
刘洋 等: ""高精度Si-V型槽的制备技术研究"", 《天津大学学报》 * |
杨帆 等: ""拉锥光纤平板波导耦合电场测量传感器的参数优化与结构改进"", 《重庆大学学报》 * |
郝永芹: ""光纤定位硅V型槽的设计与制作"", 《中国优秀博硕士学位论文全文数据库信息科技辑》 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112068255A (en) * | 2020-08-28 | 2020-12-11 | 任恒江 | Optical fiber coupling alignment structure, preparation method and optical fiber coupling method |
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