CN107062012A - A kind of bulb for LED illumination lamp - Google Patents
A kind of bulb for LED illumination lamp Download PDFInfo
- Publication number
- CN107062012A CN107062012A CN201610742904.0A CN201610742904A CN107062012A CN 107062012 A CN107062012 A CN 107062012A CN 201610742904 A CN201610742904 A CN 201610742904A CN 107062012 A CN107062012 A CN 107062012A
- Authority
- CN
- China
- Prior art keywords
- cylinder body
- bulb
- radiating
- radiator
- led illumination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
- F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
Abstract
The invention discloses a kind of bulb for LED illumination lamp, include radiator, mounting groove be provided with the radiator upper end, it is characterised in that：Pcb board is provided with the mounting groove, LED lamp bead is provided with the pcb board.Lamp holder is provided with radiating cylinder body lower end, connecting portion is provided with the radiating cylinder body lower end, heat emission hole is provided with the connecting portion, the lamp holder is connected by wire with pcb board, and the wire is arranged in heat emission hole.The invention aims to overcome weak point of the prior art, there is provided a kind of bulb for LED illumination lamp.
Description
Technical field
The present invention relates to a kind of bulb for LED illumination lamp.
Background technology
Existing LED bulb is due to the defect in design, and its light efficiency or radiating effect are all unsatisfactory, it is impossible to which satisfaction is used
The demand of person, existing LED bulb typically uses the radiator heat-dissipation of solid shape, in order to increase area of dissipation, is typically dissipating
Gather radiating fin on the outer wall of hot device, but heat-dense is in radiator outer wall in radiation processes, and radiating effect is not ideal,
So as to have a strong impact on its service life.
The volume for being currently used for the radiator of LED in addition is relatively large, it is necessary to which larger memory space, increase is transported into
This.
The content of the invention
The invention aims to overcome weak point of the prior art there is provided a kind of for LED illumination lamp
Bulb.
In order to achieve the above object, the present invention uses following scheme：
A kind of bulb for LED illumination lamp, includes radiator, and mounting groove is provided with the radiator upper end, its
It is characterised by：Pcb board is provided with the mounting groove, LED lamp bead is provided with the pcb board, the radiator includes scattered
Hot cylinder, provided with the radiator body that can be rotated relative to radiating cylinder body in the radiating cylinder body, in the radiator body
Outer wall is provided with multiple radiating thin slices that can be crispaturaed on radiator body, and multiple guide grooves are provided with the radiating cylinder body,
The radiating thin slice is arranged in the guide groove, is provided with connecting portion in the radiating cylinder body bottom, is set on the connecting portion
There is heat emission hole, provided with exhaust fan device on the connecting portion.Lamp holder is provided with radiating cylinder body lower end, under the radiating cylinder body
End is provided with connecting portion, and heat emission hole is provided with the connecting portion, and the lamp holder is connected by wire with pcb board, the wire
It is arranged in heat emission hole.
A kind of bulb for LED illumination lamp as described above, it is characterised in that the exhaust fan device includes
Gas mounting seat, is provided with fan in the ventilative mounting seat.
A kind of bulb for LED illumination lamp as described above, it is characterised in that in radiating cylinder body upper end inwall
Provided with connection concave station, in the radiator body upper end provided with connection boss, the connection boss is movably arranged on connection concave station
Interior, the mounting groove is arranged on connection boss.
A kind of bulb for LED illumination lamp as described above, it is characterised in that set in the radiator body end
There is the knob that radiator body can be driven to rotate.
A kind of bulb for LED illumination lamp as described above, it is characterised in that set on the radiating cylinder body outer wall
There is the heat emission hole inside and outside connection radiating cylinder body.
A kind of bulb for LED illumination lamp as described above, it is characterised in that described guide groove runs through heat-dissipating cylinder
The upper end of body.
A kind of bulb for LED illumination lamp as described above, it is characterised in that the radiating thin slice and radiator master
Body by integral forming.
A kind of bulb for LED illumination lamp as described above, it is characterised in that covered in the connection outer wall of boss
Provided with bearing.
In summary, the present invention is relative to prior art its advantage：
The present invention can be simple in construction, the radiating thin slice tensible on radiator body, effective increasing heat radiation area, heat
Amount is delivered to away from expandable type radiator, so as to greatly improve radiating effect.The thin slice that radiated in the present invention can crispatura in radiating
Device body outer wall, so as to reduce volume, is easy to deposit and transports.
Brief description of the drawings
Fig. 1 is diagrammatic cross-section of the invention；
Fig. 2 is the schematic perspective view of radiator of the present invention；
Fig. 3 is the schematic cross-section of radiator of the present invention.
Embodiment
With reference to embodiment, the invention will be further described：
A kind of bulb for LED illumination lamp, includes radiator 100 as shown in Figures 1 to 3, in the radiator 100
Upper end is provided with mounting groove 101, and pcb board 102 is provided with the mounting groove 101, and LED lamp bead is provided with the pcb board 102
103, the radiator 100 includes radiating cylinder body 1, is provided with what can be rotated relative to radiating cylinder body 1 in the radiating cylinder body 1
Radiator body 2, is provided with multiple radiating thin slices 3 that can be crispaturaed on radiator body 2 on the outer wall of radiator body 2,
Multiple guide grooves 4 are provided with the radiating cylinder body 1, the radiating thin slice 3 is arranged in the guide groove 4, in the radiating
The bottom of cylinder 1 is provided with connecting portion 9, and heat emission hole 8 is provided with the connecting portion 9, provided with exhaust fan device on the connecting portion 9
10.Lamp holder 308 is provided with the lower end of radiating cylinder body 1, connecting portion 9 is provided with the lower end of radiating cylinder body 1, on the connecting portion 9
Provided with heat emission hole 8, the lamp holder 308 is connected by wire with pcb board, and the wire is arranged in heat emission hole 8.
Exhaust fan device 10 of the present invention includes ventilative mounting seat 1001, is provided with the ventilative mounting seat 1001
Fan 1002.
Set in the present invention in the upper end inwall of radiating cylinder body 1 provided with connection concave station 5 in the upper end of radiator body 2
There is connection boss 6, the connection boss 6 is movably arranged in connection concave station 5, and the mounting groove 101 is arranged on connection boss 6
On.The partial heat of radiator body 2 is delivered to radiating cylinder body 1 by connecting boss 6, so as to strengthen radiating effect.
In the present invention bearing is arranged with the connection outer wall of boss 6.
The knob 7 that radiator body 2 can be driven to rotate is provided with the present invention in the end of radiator body 2.This hair
The stretching, extension of radiating thin slice 3 can be controlled by turn knob portion 7 in bright and crispaturaed.
The heat emission hole 8 inside and outside radiating cylinder body 1 is communicated with the outer wall of radiating cylinder body 1 in the present invention.Described dissipates
Hot hole 8 is conducive to heat exchange inside and outside radiating cylinder body 1, improves radiating effect.
Heretofore described guide groove 4 runs through the upper end of radiating cylinder body 1.Radiating cylinder body 1 with radiating thin slice 3 install when
Wait, radiating thin slice 3 need to be only placed sequentially in guide groove 4, then rotation heat sink main body 2 makes radiating thin slice 3 crispatura storage
On radiator body 2, limited block can be set in radiating thin slice 3 end in the present invention, prevent radiating thin slice 3 from excessively crispaturaing.
It is provided with to be provided with the connecting portion 9 in connecting portion 9, the present invention in the lower end of radiating cylinder body 1 in the present invention and dissipates
Hot hole 8.Good heat dissipation effect.
Heretofore described radiating thin slice 3 is integrally formed with radiator body 2.
The one of which implementation of the present invention, described radiator body 2 and radiating thin slice 3 are by foam aluminium alloy material
Material is made, and the foamed Al-allov is composed of the following components by weight percentage：
Alundum (Al2O3) 10-45%
Zinc oxide 15-30%
Magnesium powder 5-35%
Graphite 8-30%.
Embodiment 1
Foamed Al-allov of the present invention is composed of the following components by weight percentage：
Alundum (Al2O3) 10%
Zinc oxide 30%
Magnesium powder 35%
Graphite 25%.
Embodiment 2
Foamed Al-allov of the present invention is composed of the following components by weight percentage：
Alundum (Al2O3) 10%
Zinc oxide 25%
Magnesium powder 35%
Graphite 30%.
Embodiment 3
Foamed Al-allov of the present invention is composed of the following components by weight percentage：
Alundum (Al2O3) 45%
Zinc oxide 15%
Magnesium powder 10%
Graphite 30%.
Embodiment 4
Foamed Al-allov of the present invention is composed of the following components by weight percentage：
Alundum (Al2O3) 45%
Zinc oxide 25%
Magnesium powder 5%
Graphite 25%.
Heretofore described radiator body 2 and radiating thin slice 3 can also be aluminium alloy or copper.
Thermal dispersant coatings are coated with the radiator outer wall in the present invention, effectively the radiating effect of enhancing radiator.This
Invention thermal dispersant coatings include following components by weight：
The invention is further illustrated by the following examples thermal dispersant coatings：
Embodiment 1
Thermal dispersant coatings of the present invention include following components by weight：
The organic siliconresin of modified Nano particle is prepared by the following method：
A, take the parts by weight of MTES 40, add in 600 parts of water, add the Catalyzed by Formic Acid of 0.06 parts by weight
Agent, is hydrolyzed 1 hour at 0 DEG C, is warming up to 70 DEG C of progress polymerisations, and reaction carries out vacuum distillation after terminating, obtains organosilicon
Resin；
B, by the organic siliconresin in step A, 1- Trifluoromethyl-1s, the parts by weight of 3 butadiene 8, the weight of titanate catalyst 0.1
Measure part and the parts by weight of ethyl acetate 10 well mixed, under the protection of argon gas, be heated to 100 DEG C of dehydration condensations 1 hour, obtain
Modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 75 DEG C, adds 2 parts of silester and react 1 hour, reaction knot
Cool after beam, vacuum distillation removes solvent, produces the organic siliconresin for including modified Nano particle.
Method is prepared as follows in wherein described polyether-containing aminopolysiloxane, comprises the following steps：
S1：In equipped with agitator, condenser pipe, the three-necked flask of thermometer, the silica of 300 parts by weight prestox ring four is added
Alkane, stirring is warming up to 100 DEG C, adds the parts by weight of catalyst TMAH 0.15, is incubated 20min, adds coupling agent N-
β (aminoethyl)-γ-parts by weight of aminopropyltriethoxy dimethoxy silane 18,100 DEG C of temperature control 6 hours, obtains amido silicon oil；
S2：Equipped with agitator, condenser pipe, the three-necked flask of thermometer, the amino of 180 parts by weight step A synthesis is added
Silicone oil, 130 parts by weight of activated polyethers, 90 parts by weight of isopropyl alcohol, at 70 DEG C, carry out back flow reaction, to reactant it is transparent after, followed by
Continuation of insurance temperature 4 hours, finally cooling decompression sloughs isopropanol under the conditions of 0.005MPa, produces.
The CNT of described surface hydroxylation is prepared by the following method：
By multi-walled carbon nanotube and potassium hydroxide by weight being 1 in ball grinder:20 ratio mixing, plus appropriate second
Alcohol, ball milling is washed with deionized to neutrality after 12 hours, obtains compound, and compound is put into vacuum drying chamber at 100 DEG C
Dry 12 hours, produce.
The solvent is dimethylbenzene and methyl iso-butyl ketone (MIBK) according to weight ratio 2：1 mixture.
The preparation method of heat radiation coating of the present invention：
After epoxy resin, acrylic resin, the organic siliconresin comprising modified Nano particle, solvent are mixed, it is warming up to
40 DEG C stir, and add CNT, polyether-containing aminopolysiloxane, Al-Mg alloy powder, the aluminium nitride of surface hydroxylation, stirring
It is uniform to obtain mixture, 30-50 μm will be ground in mixture addition paint grinder mill, ultrasonic disperse is uniform, adds poly-vinegar
Vinyl acetate stirs.
Embodiment 2
Thermal dispersant coatings of the present invention include following components by weight：
The organic siliconresin of modified Nano particle is prepared by the following method：
A, take the parts by weight of MTES 60, add in 900 parts of water, add the Catalyzed by Formic Acid agent of 0.8 parts by weight,
Hydrolyze 5 hours at 5 DEG C, be warming up to 90 DEG C of progress polymerisations, reaction carries out vacuum distillation after terminating, obtains organosilicon tree
Fat；
B, by the organic siliconresin in step A, 1- Trifluoromethyl-1s, the parts by weight of 3 butadiene 18, titanate catalyst 0.6
Parts by weight and the parts by weight of ethyl acetate 25 are well mixed, under the protection of argon gas, are heated to 120 DEG C of dehydration condensations 3 hours,
Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 95 DEG C, adds 14 parts of silester and react 2 hours, reaction
Cool after end, vacuum distillation removes solvent, produces the organic siliconresin for including modified Nano particle.
Method is prepared as follows in wherein described polyether-containing aminopolysiloxane, comprises the following steps：
S1：In equipped with agitator, condenser pipe, the three-necked flask of thermometer, the silica of 500 parts by weight prestox ring four is added
Alkane, stirring is warming up to 125 DEG C, adds the parts by weight of catalyst TMAH 0.35, is incubated 40min, adds coupling agent N-
β (aminoethyl)-γ-parts by weight of aminopropyltriethoxy dimethoxy silane 22,125 DEG C of temperature control 6 hours, obtains amido silicon oil；
S2：Equipped with agitator, condenser pipe, the three-necked flask of thermometer, the amino of 220 parts by weight step A synthesis is added
Silicone oil, 180 parts by weight of activated polyethers, 120 parts by weight of isopropyl alcohol, at 95 DEG C, carry out back flow reaction, to reactant it is transparent after, then
Continue to be incubated 6 hours, finally cooling decompression sloughs isopropanol under the conditions of 0.01MPa, produces.
The CNT of described surface hydroxylation is prepared by the following method：
By multi-walled carbon nanotube and potassium hydroxide by weight being 1 in ball grinder:30 ratio mixing, plus appropriate second
Alcohol, ball milling is washed with deionized to neutrality after 24 hours, obtains compound, and compound is put into vacuum drying chamber at 130 DEG C
Dry 16 hours, produce.
The solvent is dimethylbenzene and methyl iso-butyl ketone (MIBK) according to weight ratio 2：1 mixture.
The preparation method of heat radiation coating of the present invention：
After epoxy resin, acrylic resin, the organic siliconresin comprising modified Nano particle, solvent are mixed, it is warming up to
50 DEG C stir, and add CNT, polyether-containing aminopolysiloxane, Al-Mg alloy powder, the aluminium nitride of surface hydroxylation, stirring
It is uniform to obtain mixture, 30-50 μm will be ground in mixture addition paint grinder mill, ultrasonic disperse is uniform, adds poly-vinegar
Vinyl acetate stirs.
Embodiment 3
Thermal dispersant coatings of the present invention include following components by weight：
The organic siliconresin of modified Nano particle is prepared by the following method：
A, take the parts by weight of MTES 50, add in 750 parts of water, add the Catalyzed by Formic Acid agent of 0.3 parts by weight,
Hydrolyzed 3 hours at 2 DEG C, be warming up to 80 DEG C of progress polymerisations, reaction carries out vacuum distillation after terminating, obtains organosilicon tree
Fat；
B, by the organic siliconresin in step A, 1- Trifluoromethyl-1s, the parts by weight of 3 butadiene 12, titanate catalyst 0.3
Parts by weight and the parts by weight of ethyl acetate 15 are well mixed, under the protection of argon gas, are heated to 110 DEG C of dehydration condensations 2 hours,
Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 85 DEG C, adds 6 parts of silester and react 1.5 hours, reaction
Cool after end, vacuum distillation removes solvent, produces the organic siliconresin for including modified Nano particle.
Method is prepared as follows in wherein described polyether-containing aminopolysiloxane, comprises the following steps：
S1：In equipped with agitator, condenser pipe, the three-necked flask of thermometer, the silica of 400 parts by weight prestox ring four is added
Alkane, stirring is warming up to 110 DEG C, adds the parts by weight of catalyst TMAH 0.25, is incubated 30min, adds coupling agent N-
β (aminoethyl)-γ-parts by weight of aminopropyltriethoxy dimethoxy silane 20,110 DEG C of temperature control 6 hours, obtains amido silicon oil；
S2：Equipped with agitator, condenser pipe, the three-necked flask of thermometer, addition 180-220 parts by weight steps A is synthesized
Amido silicon oil, the parts by weight of activated polyethers of 130-180,90-120 parts by weight of isopropyl alcohol, at 70~95 DEG C, carries out back flow reaction, extremely
After reactant is transparent, insulation 4-6 hours is further continued for, finally cooling decompression sloughs isopropanol under the conditions of 0.005-0.01MPa, i.e.,
.
The CNT of described surface hydroxylation is prepared by the following method：
By multi-walled carbon nanotube and potassium hydroxide by weight being 1 in ball grinder:25 ratio mixing, plus appropriate second
Alcohol, ball milling is washed with deionized to neutrality after 18 hours, obtains compound, and compound is put into vacuum drying chamber at 120 DEG C
Dry 14 hours, produce.
The solvent is dimethylbenzene and methyl iso-butyl ketone (MIBK) according to weight ratio 2：1 mixture.
The preparation method of heat radiation coating of the present invention：
After epoxy resin, acrylic resin, the organic siliconresin comprising modified Nano particle, solvent are mixed, it is warming up to
45 DEG C stir, and add CNT, polyether-containing aminopolysiloxane, Al-Mg alloy powder, the aluminium nitride of surface hydroxylation, stirring
It is uniform to obtain mixture, 30-50 μm will be ground in mixture addition paint grinder mill, ultrasonic disperse is uniform, adds poly-vinegar
Vinyl acetate stirs.
Embodiment 4
Thermal dispersant coatings of the present invention include following components by weight：
The wherein organic siliconresin of modified Nano particle, polyether-containing aminopolysiloxane, solvent and heat radiation coating of the present invention
Preparation method it is in the same manner as in Example 3.
Embodiment 5
Thermal dispersant coatings of the present invention include following components by weight：
The wherein organic siliconresin of modified Nano particle, polyether-containing aminopolysiloxane, solvent and heat radiation coating of the present invention
Preparation method it is in the same manner as in Example 3.
Embodiment 6
Thermal dispersant coatings of the present invention include following components by weight：
The wherein organic siliconresin of modified Nano particle, polyether-containing aminopolysiloxane, solvent and heat radiation coating of the present invention
Preparation method it is in the same manner as in Example 3.
Embodiment 7
Thermal dispersant coatings of the present invention include following components by weight：
The wherein organic siliconresin of modified Nano particle, polyether-containing aminopolysiloxane, solvent and heat radiation coating of the present invention
Preparation method it is in the same manner as in Example 3.
Embodiment 8
Thermal dispersant coatings of the present invention include following components by weight：
The wherein organic siliconresin of modified Nano particle, polyether-containing aminopolysiloxane, solvent and heat radiation coating of the present invention
Preparation method it is in the same manner as in Example 3.
Embodiment 9
Thermal dispersant coatings of the present invention include following components by weight：
The wherein organic siliconresin of modified Nano particle, polyether-containing aminopolysiloxane, solvent and heat radiation coating of the present invention
Preparation method it is in the same manner as in Example 3.
Embodiment 10
Thermal dispersant coatings of the present invention include following components by weight：
The wherein organic siliconresin of modified Nano particle, polyether-containing aminopolysiloxane, solvent and heat radiation coating of the present invention
Preparation method it is in the same manner as in Example 3.
Embodiment 11
Thermal dispersant coatings of the present invention include following components by weight：
The wherein organic siliconresin of modified Nano particle, polyether-containing aminopolysiloxane, solvent and heat radiation coating of the present invention
Preparation method it is in the same manner as in Example 3.
Embodiment 12
Thermal dispersant coatings of the present invention include following components by weight：
The wherein organic siliconresin of modified Nano particle, polyether-containing aminopolysiloxane, solvent and heat radiation coating of the present invention
Preparation method it is in the same manner as in Example 3.
Embodiment 13
Thermal dispersant coatings of the present invention include following components by weight：
The wherein organic siliconresin of modified Nano particle, polyether-containing aminopolysiloxane, solvent and heat radiation coating of the present invention
Preparation method it is in the same manner as in Example 3.
The general principle and principal character and advantages of the present invention of the present invention has been shown and described above.The skill of the industry
Art personnel are it should be appreciated that the present invention is not limited to the above embodiments, and described in above-described embodiment and specification is explanation
The principle of the present invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these
Changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and
Its equivalent thereof.
Claims (8)
1. a kind of bulb for LED illumination lamp, includes radiator (100), in the radiator (100) upper end provided with peace
Tankage (101), it is characterised in that：Pcb board (102) is provided with the mounting groove (101), is provided with the pcb board (102)
LED lamp bead (103), the radiator (100) includes radiating cylinder body (1), provided with can be relative in the radiating cylinder body (1)
The radiator body (2) that radiating cylinder body (1) is rotated, can crispatura in radiating on the radiator body (2) outer wall provided with multiple
Radiating thin slice (3) in device main body (2), is provided with multiple guide grooves (4), the radiating thin slice (3) on the radiating cylinder body (1)
It is arranged in the guide groove (4), is provided with connecting portion (9) in the radiating cylinder body (1) bottom, is set on the connecting portion (9)
There is heat emission hole (8), provided with exhaust fan device (10) on the connecting portion (9), lamp holder is provided with radiating cylinder body (1) lower end
(308) connecting portion (9), is provided with the radiating cylinder body (1) lower end, heat emission hole (8) is provided with the connecting portion (9), it is described
Lamp holder (308) is connected by wire with pcb board, and the wire is arranged in heat emission hole (8).
2. a kind of bulb for LED illumination lamp according to claim 1, it is characterised in that the exhaust fan device
(10) include ventilative mounting seat (1001), fan (1002) is provided with the ventilative mounting seat (1001).
3. a kind of bulb for LED illumination lamp according to claim 1, it is characterised in that in the radiating cylinder body
(1) upper end inwall is provided with connection concave station (5), and in the radiator body (2) upper end provided with connection boss (6), the connection is convex
Platform (6) is movably arranged in connection concave station (5), and the mounting groove (101) is arranged on connection boss (6).
4. a kind of bulb for LED illumination lamp according to claim 1, it is characterised in that in the radiator body
(2) end is provided with the knob (7) that radiator body (2) can be driven to rotate.
5. a kind of bulb for LED illumination lamp according to claim 1, it is characterised in that in the radiating cylinder body
(1) heat emission hole (8) inside and outside radiating cylinder body (1) is communicated with outer wall.
6. a kind of bulb for LED illumination lamp according to claim 1, it is characterised in that described guide groove (4)
Upper end through radiating cylinder body (1).
7. a kind of bulb for LED illumination lamp according to claim 1, it is characterised in that the radiating thin slice (3)
It is integrally formed with radiator body (2).
8. a kind of bulb for LED illumination lamp according to claim 2, it is characterised in that in the connection boss
(6) it is arranged with bearing on outer wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610742904.0A CN107062012A (en) | 2016-08-28 | 2016-08-28 | A kind of bulb for LED illumination lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610742904.0A CN107062012A (en) | 2016-08-28 | 2016-08-28 | A kind of bulb for LED illumination lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107062012A true CN107062012A (en) | 2017-08-18 |
Family
ID=59617177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610742904.0A Withdrawn CN107062012A (en) | 2016-08-28 | 2016-08-28 | A kind of bulb for LED illumination lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107062012A (en) |
-
2016
- 2016-08-28 CN CN201610742904.0A patent/CN107062012A/en not_active Withdrawn
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Application publication date: 20170818 |
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