CN107041079A - A kind of conducting wire typography method based on color ink jet printed technology - Google Patents

A kind of conducting wire typography method based on color ink jet printed technology Download PDF

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Publication number
CN107041079A
CN107041079A CN201710313329.7A CN201710313329A CN107041079A CN 107041079 A CN107041079 A CN 107041079A CN 201710313329 A CN201710313329 A CN 201710313329A CN 107041079 A CN107041079 A CN 107041079A
Authority
CN
China
Prior art keywords
ink
metal ion
reducing agent
conducting wire
method based
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710313329.7A
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Chinese (zh)
Inventor
严辉
蔡文冉
张永哲
汪浩
刘禹
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Beijing University of Technology
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Beijing University of Technology
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Publication date
Application filed by Beijing University of Technology filed Critical Beijing University of Technology
Priority to CN201710313329.7A priority Critical patent/CN107041079A/en
Publication of CN107041079A publication Critical patent/CN107041079A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793Aqueous alkaline solution, e.g. for cleaning or etching

Abstract

A kind of conducting wire typography method based on color ink jet printed technology, belongs to the manufacturing technology field of electronic component.The substrate surface containing amido link is handled using alkaline solution so that substrate surface reaches hydrophily and amido link is occurred sufficient hydrolysis;Metal ion ink and reducing agent ink are prepared respectively;Metal ion ink and reducing agent ink are individually positioned in the different print cartridges of color inkjet printer, on the base material that the two print processing is crossed in ink-jet, printing of the printing of metal ion ink prior to reducing agent ink, complete the graphical of metal ion and metal ion is reduced into metal simple-substance, form conductive metal layer.Can rapid shaping, without last handling process, used ink is free of solid particle, is not easily blocked printer head, rapid draing can solidify at room temperature, effectively lift manufacture efficiency, its layer printed circuit board consistency prepared is high, and defect is few, surface-brightening, electrical conductivity is high, and the adhesion with organic substrate is strong.

Description

A kind of conducting wire typography method based on color ink jet printed technology
Technical field
The invention belongs to the manufacturing technology field of electronic component, it is related to one kind and prepares electronics device using in-situ reducing technology The method of part or circuit diagram.
Background technology
The present situation in field is manufactured according to China electronic device, formed the conventional method of conducting wire mainly include etching method, Silk screen print method, vacuum deposition method, method of spin coating etc., the above method have process complexity, processing time length, waste former material The problems such as material, low yield, high cost.Therefore printed electronic is particularly new in the last few years by increasing people institute extensive concern Emerging electronic equipment manufacturing industry.Printed electronics are primarily due to mainly by the making of electronic product and text pattern Printing technology combines so that itself have increases material manufacturing technology the characteristics of, this technology realize it is frivolous, flexible, wear-resisting, light Matter, personalized customization production and environment-friendly aspect have very big advantage so that traditional electronic equipment manufacturing mode has New selection.
Printed electronics using inkjet printing as mode of printing are of great interest in recent years, this new skill Art is compared with other printing modes, with certain advantage.Particularly, inkjet technology is a kind of non-contacting print Mode processed, can be effectively protected the surface of backing material will not be destroyed in the typography of contact.While its It is a kind of droplet forming technique, compared with the modes such as silk-screen printing, intaglio printing and the letterpress at present, is not required to The making of printing mould is carried out before printing, the cost of die sinking is reduced.Finally, in the not high application of some required precisions Occasion, such as antenna and electrode, common commercial ink-jet printer just can meet the requirement of size and precision, reduce technology difficult Degree and cost.
But, it generally there are following problem using the printed electronic technique of ink-jet printing technology at present:
1st, ink is generally nanoparticle form and organometallic precursor ink, and this two kinds of ink frequently can lead to inkjet printing Blocking and needing follow-up high-temperature heat treatment process for machine shower nozzle, not only results in the complexity of technological process and to macromolecule The selection that base material is has very big limitation.
2nd, above-mentioned sayed ink-making process is complex, and easily reunites and decompose in preservation for a long time.
3rd, in existing terahertz wave quasi-optics, the one-step shaping of conductive pattern can not be often realized, is required to after printing Carry out the processing of additional process.
The content of the invention
Therefore, for above-mentioned deficiency, the present invention provides a kind of mode of utilization inkjet printing by metal ion oil Ink is printed on substrate, while using the color theory of color inkjet printer, printed while realizing reducing agent ink, and then The method that electronic component or circuit diagram are prepared by way of metal ion in-situ reducing.
The technical scheme that the present invention is provided:
A kind of conducting wire typography method based on color ink jet printed technology, process comprises the following steps:
(1) base material treatment:The substrate surface containing amido link is handled using alkaline solution so that substrate surface reaches To hydrophily and amido link is set to occur sufficient hydrolysis;
(2) prepared by ink:Metal ion ink is made in dissolving metal salts in solvent 1, reducing agent is dissolved in solvent 2 In be made reducing agent ink, complete the preparation of ink;
(3) printing shaping of conductive pattern:The metal ion ink and reducing agent ink of preparation are individually positioned in colored spray In the different print cartridges of black printer, the two is printed upon on the treated base material of step (1) by ink-jet, metal ion ink The printing prior to reducing agent ink is printed, the mistake graphical and that metal ion is reduced into metal simple-substance of metal ion is completed Journey, forms conductive metal layer, that is, completes the preparation of metal electron device or circuit diagram.
It is preferred that, base material is selected from polyimides, PEI in step (1).Alkaline solution described in step (1) is The NaOH aqueous solution, concentration is 3mol/L, and processing time is 30~120min, and treatment temperature is 50 DEG C.
It is preferred that, it is formalin, sodium borohydride solution, ascorbic acid solution and hypophosphorous acid that reducing agent, which is selected from, in step (2) One or more in sodium;Metal ion is silver ion.
It is preferred that, solvent 1 is selected from one or both of water and ethanol mixture, the volume ratio of further preferred water and ethanol For 1:10~10:1 mixture;Solvent 2 is water, and the sodium hydrate aqueous solution of formaldehyde is preferred to use during using formalin;
It is preferred that, reducing agent solute concentration is 1~10wt%;The concentration of metal ion ink is 0.5~2mol/L.
Metal ion ink and reducing agent ink need to be positioned in the print cartridge for belonging to different colours in step (3), and full Foot is first printed and reducing agent ink is printed after metal ion ink.
Preferably, in the design of printing figures, color color matching pattern should be adjusted to CMYK patterns, and black is prohibited With.
Preferably, the method for the present invention for preparing electronic device or circuit diagram finally can also be by annealing at Reason program, further to increase the suppleness and service life of electronic device.
The operation principle of this method is:This technique mainly beats the self-metallization reaction principle and color jet-ink of polyimides The toning mechanism of print machine combines, and is put into the hydrolysis process that depth is carried out in hot alkaline solution to PI films first, is formed more Amide group, different colours ink is printed on substrate by certain priority printing order in by using color printer This characteristic on material, by the mixing color of computer, realizes that many materials of silver ion ink and various concentrations reducing agent are beaten Print.First the silver ion of high concentration is printed on the PI films of surface hydrolysis, there occurs that ion exchange makes silver ion knot Close in PI film surfaces.Then reducing agent ink is printed on same position again, has realized the reduction of silver ion, form The silver-colored simple substance conductive pattern of gloss.
By adopting the above-described technical solution, the beneficial effects of the invention are as follows:
1st, the invention is provided electronic device or circuit diagram preparation method, metal ion materials of the whole process to printing Sufficient utilization has been carried out, cost is effectively reduced.
2nd, the method that the present invention is provided, attached by the bonding action of chemical bond between the metallic particles and substrate of substrate surface In on substrate so that conductive metal layer has good adhesive force with substrate.
3rd, the method that the present invention is provided, without being post-processed to made sample, prints one-step shaping, during saving Between, improve operating efficiency.
4th, it can be regulated and controled in the present invention by the color matching to design configuration, by the printing mode of color printer, to reach To the quantitative printing of many materials, the different printings of metal ion and reducing agent ink can be reached by controlling the ratio of color Ratio, time-saving and efficiency.
5th, the metal of printing is nano particle, and nano particle is uniform, and the metal level of gained is fine and close thin layer, electric conductivity It is good.
Brief description of the drawings
Fig. 1 is a kind of conducting wire typography schematic flow sheet based on inkjet printing provided by the present invention;
Fig. 2 is the circuit diagram prepared on polyimides (PI) base material of the embodiment of the present invention 1;
Fig. 3 is the surface SEM shape appearance figures of the circuit diagram prepared on polyimides (PI) base material of the embodiment of the present invention 1;
Comparison diagram before and after the silver-colored pattern adhesive force that Fig. 4 is printed by the embodiment of the present invention 1 is tested.
Embodiment
Below in conjunction with the accompanying drawings and embodiment the present invention is described in further detail.But this should not be interpreted as The scope of the above-mentioned theme of the present invention is only limitted to following embodiment, all to belong to this hair based on the technology that present invention is realized Bright scope.
Embodiment 1:
A kind of conducting wire typography based on color ink jet printed technology, comprises the following steps:
(1) base material treatment:Kapton is flushed three times successively using absolute ethyl alcohol with deionized water respectively, by film The impurity on surface is got rid of.Then the PI films cleaned are put into the NaOH solution that 50 DEG C of concentration is 3mol/L and soaked Bubble.Then, treated PI films are cleaned repeatedly repeatedly with deionized water, dried after wash clean standby;
(2) prepared by ink:It is 1 with volume ratio:1 deionized water and ethanol is as solvent, and compound concentration is 1mol/L's AgNO3As metal ion ink, reducing agent ink is mainly the alkaline solution of formaldehyde, the reducing agent ink specific formula used For:Contain sodium hydroxide in weight/mass percentage composition 30-40wt% formalin 8.5ml, reducing agent ink per L reducing agent ink Concentration be 7.5g/L;
(3) printing shaping of conductive pattern:AgNO prepared by step (2)3Ink and formaldehyde ink injection ME-10 types are general In the print cartridge of logical ink-jet printer, original-pack ink therein is changed into be configured to Ag+ ink and reducing agent ink respectively, be specifically Cyan (Cyan) print cartridge is put into AgNO3Ink, formaldehyde ink is put into the print cartridge of yellow (Yellow) or carmetta (Magenta) In, conductive silver figure just can be made into by color jet-ink printing.
Resistivity measurement is carried out to coating with four probe method, test result is 5.56 × 10-6Ω·cm.Adhesive force test is adopted Adhesive tape method is used, is pulled on the conductive square of printing with cross-cut tester so that uniform pressure is parallel, cuts through coating to counterdie, then with same Method vertical direction pull, formed 1mm × 1mm grid, sticked with 3M adhesive tapes coating and with hand pressing make itself and coating Completely attach to, then pull open rapidly, its coating does not come off a bit.
Its preparation method can be realized by color inkjet printer realizes the fast of conductive pattern on Kapton Rapid-result type, no last handling process, used ink is metal ion type ink, without solid particle, is not easily blocked printer Shower nozzle, can solidify, effectively lift manufacture efficiency, its layer printed circuit board consistency prepared is high, defect in rapid draing at room temperature Few, surface-brightening, electrical conductivity is high, and the adhesion with organic substrate is strong.
The invention is not limited in foregoing embodiment.The present invention, which is expanded to, any in this manual to be disclosed New feature or any new combination, and disclose any new method or process the step of or any new combination.

Claims (7)

1. a kind of conducting wire typography method based on color ink jet printed technology, it is characterised in that process includes as follows Step:
(1) base material treatment:The substrate surface containing amido link is handled using alkaline solution so that substrate surface reaches parent It is aqueous and amido link is occurred sufficient hydrolysis;
(2) prepared by ink:Metal ion ink is made in dissolving metal salts in solvent 1, reducing agent is dissolved in solvent 2 and made Into reducing agent ink, the preparation of ink is completed;
(3) printing shaping of conductive pattern:The metal ion ink and reducing agent ink of preparation are individually positioned in color jet-ink and beaten In the different print cartridges of print machine, the two is printed upon on the treated base material of step (1) by ink-jet, the printing of metal ion ink Prior to the printing of reducing agent ink, the process graphical and that metal ion is reduced into metal simple-substance of metal ion, shape are completed Into conductive metal layer, that is, complete the preparation of metal electron device or circuit diagram.
2. according to a kind of conducting wire typography method based on color ink jet printed technology described in claim 1, it is special Levy and be, base material is selected from polyimides, PEI in step (1).
3. according to a kind of conducting wire typography method based on color ink jet printed technology described in claim 1, it is special Levy and be, the alkaline solution described in step (1) is the NaOH aqueous solution, concentration is 3mol/L, and processing time is 30~120min, Treatment temperature is 50 DEG C.
4. according to a kind of conducting wire typography method based on color ink jet printed technology described in claim 1, it is special Levy and be, it is formalin, sodium borohydride solution, ascorbic acid solution and sodium hypophosphite that reducing agent ink, which is selected from, in step (2) In one or more;Metal ion is silver ion.
5. according to a kind of conducting wire typography method based on color ink jet printed technology described in claim 4, it is special Levy and be, solvent 1 is selected from one or both of water and ethanol mixture, solvent 2 is water.
6. according to a kind of conducting wire typography method based on color ink jet printed technology described in claim 5, it is special Levy and be, solvent 1 is that the volume ratio of water and ethanol is 1:10~10:1 mixture;Reducing agent ink is adopted when using formalin With the sodium hydrate aqueous solution of formaldehyde.
7. according to a kind of conducting wire typography method based on color ink jet printed technology described in claim 5, it is special Levy and be, reducing agent solute concentration is 1~10wt%;The concentration of metal ion ink is 0.5~2mol/L.
CN201710313329.7A 2017-05-05 2017-05-05 A kind of conducting wire typography method based on color ink jet printed technology Pending CN107041079A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108541146A (en) * 2018-04-24 2018-09-14 珠海元盛电子科技股份有限公司 A kind of fully-additive process technology of full printing single layer FPC
CN110446336A (en) * 2019-09-11 2019-11-12 哈尔滨工业大学 The electro-reduction reaction connection method in situ and its application in printed electronic device of a kind of metal nano ink
CN110876255A (en) * 2018-08-31 2020-03-10 德州迈特新材料研究中心 Preparation technology of microwave band metamaterial wave absorber

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101580657A (en) * 2008-05-13 2009-11-18 富葵精密组件(深圳)有限公司 Ink and method for manufacturing conductive wires by ink
CN101712823A (en) * 2009-10-26 2010-05-26 李世洁 Group of ink for printing conductive film and use method thereof
CN101855679A (en) * 2007-11-13 2010-10-06 世联株式会社 Process for producing transparent electroconductive member
CN102300414A (en) * 2011-08-22 2011-12-28 电子科技大学 Addition preparation method of printed circuit
CN102823335A (en) * 2010-04-02 2012-12-12 印可得株式会社 Method for manufacturing a double-sided printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101855679A (en) * 2007-11-13 2010-10-06 世联株式会社 Process for producing transparent electroconductive member
CN101580657A (en) * 2008-05-13 2009-11-18 富葵精密组件(深圳)有限公司 Ink and method for manufacturing conductive wires by ink
CN101712823A (en) * 2009-10-26 2010-05-26 李世洁 Group of ink for printing conductive film and use method thereof
CN102823335A (en) * 2010-04-02 2012-12-12 印可得株式会社 Method for manufacturing a double-sided printed circuit board
CN102300414A (en) * 2011-08-22 2011-12-28 电子科技大学 Addition preparation method of printed circuit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108541146A (en) * 2018-04-24 2018-09-14 珠海元盛电子科技股份有限公司 A kind of fully-additive process technology of full printing single layer FPC
CN110876255A (en) * 2018-08-31 2020-03-10 德州迈特新材料研究中心 Preparation technology of microwave band metamaterial wave absorber
CN110446336A (en) * 2019-09-11 2019-11-12 哈尔滨工业大学 The electro-reduction reaction connection method in situ and its application in printed electronic device of a kind of metal nano ink
CN110446336B (en) * 2019-09-11 2022-03-01 哈尔滨工业大学 In-situ electro-reduction reaction connection method of metal nano ink and application of metal nano ink in printed electronic device

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Application publication date: 20170811

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