CN107039734B - Laminated sheet type power distribution module and manufacturing method thereof - Google Patents
Laminated sheet type power distribution module and manufacturing method thereof Download PDFInfo
- Publication number
- CN107039734B CN107039734B CN201610404705.9A CN201610404705A CN107039734B CN 107039734 B CN107039734 B CN 107039734B CN 201610404705 A CN201610404705 A CN 201610404705A CN 107039734 B CN107039734 B CN 107039734B
- Authority
- CN
- China
- Prior art keywords
- electrode
- power distribution
- dielectric layer
- inner electrode
- bypass capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention provides a laminated sheet type power distribution module which comprises an input electrode, an output electrode, an upper cover, a lower cover and an intermediate layer, wherein the intermediate layer comprises a bypass capacitor inner electrode, power distribution coils and a coupling capacitor inner electrode which are laminated; one end of the bypass capacitor inner electrode is connected with the common end of the power distribution coil, and the other end of the bypass capacitor inner electrode is grounded; the common end of each power distribution coil is connected with an input electrode, and the non-common end of each power distribution coil is connected with an output electrode; and a coupling capacitor inner electrode is connected between the non-common ends of every two parallel power distribution coils. The bypass capacitor inner electrode, the power distribution coil and the coupling capacitor inner electrode are manufactured between the upper cover and the lower cover in a laminated mode, the whole product is highly integrated, small in size, convenient to assemble, good in weldability, suitable for high-density surface mounting, small in insertion loss, high in isolation, excellent in phase balance and amplitude balance, and capable of meeting assembling requirements and electrical performance requirements.
Description
Technical Field
The invention belongs to the technical field of electronics, and particularly relates to a laminated sheet type power distribution module and a manufacturing method thereof.
Background
With the rapid development of electronic equipment towards miniaturization, light weight and integration, the volumes of electronic complete machines and systems are smaller and smaller, and the installation density of components is also larger and larger, so that the corresponding components are required to be continuously developed towards miniaturization. The microwave power distribution module is a component which divides one path of input signal energy into two paths or multiple paths of output equal or unequal energy. Traditional power distribution module is mostly the equipment type device, and is bulky, and the mounting means is complicated, and insertion loss is big, and the isolation is not high, can not satisfy the demand in performance and assembly type, consequently need provide a neotype power distribution module in order to solve above-mentioned problem.
Disclosure of Invention
The invention mainly aims to provide a laminated sheet type power distribution module, and aims to solve the problems of large occupied space, inconvenience in assembly, low isolation and large insertion loss of the traditional power distribution module.
The invention is realized in this way, a laminated sheet type power distribution module, which comprises an input electrode, an output electrode, an upper cover, a lower cover and an intermediate layer positioned between the upper cover and the lower cover, wherein the intermediate layer comprises a bypass capacitor inner electrode, a power distribution coil and a coupling capacitor inner electrode which are laminated, and the number of the power distribution coils is at least two and the power distribution coils are mutually connected in parallel; one end of the bypass capacitor inner electrode is electrically connected with the common end of the power distribution coil, and the other end of the bypass capacitor inner electrode is grounded; the public end of the power distribution coil is electrically connected with the input electrode, and the non-public end of each power distribution coil is connected with one output electrode; and a coupling capacitor inner electrode is connected between the non-common ends of every two parallel power distribution coils.
Another object of the present invention is to provide a method for manufacturing a stacked chip power distribution module, including the steps of:
fully ball-milling and mixing the matrix material, an adhesive, a solvent, a dispersant and a plasticizer to form slurry;
manufacturing the slurry into a lower cover and an upper cover;
and (3) laminating and manufacturing between the upper cover and the lower cover:
a first dielectric layer, and manufacturing a bypass capacitor inner electrode on the first dielectric layer;
a second dielectric layer, at least two parallel power distribution coils are manufactured on the second dielectric layer, and the common end of the power distribution coils is connected with one end of the inner electrode of the bypass capacitor;
a third dielectric layer, wherein a coupling capacitor inner electrode is manufactured on the third dielectric layer, and the non-common ends of two power distribution coils which are mutually connected in parallel are respectively connected with the two ends of the coupling capacitor inner electrode to form a semi-finished product;
cutting, chamfering, glue discharging, sintering and separating the semi-finished product to obtain a semi-finished product monomer;
and arranging an input electrode, an output electrode and a grounding electrode on the outer surface of the semi-finished product monomer, connecting the input electrode with the common end of the power distribution coil, connecting the output electrode with the non-common end of the power distribution coil, and connecting the other end of the inner electrode of the bypass capacitor with the grounding electrode to obtain the laminated chip type power distribution module.
The invention replaces the traditional structure of assembling the coupling capacitor device, the bypass capacitor device and the power distribution device into a module whole, and the bypass capacitor inner electrode, the power distribution coil and the coupling capacitor inner electrode are manufactured between the upper cover and the lower cover in a laminated manner, so that the whole product has high integration, small volume, convenient assembly, good weldability, high reliability, suitability for high-density surface mounting, high mounting efficiency, small insertion loss, high isolation degree, phase balance and excellent amplitude balance; each part achieves organic matching, realizes signal energy distribution serialization, ensures that products meet power distribution requirements of different frequency bands, and is a power distribution module which not only meets assembly requirements but also improves electrical performance.
Drawings
Fig. 1 is a perspective view of a stacked chip power distribution module provided by an embodiment of the present invention;
fig. 2 is an exploded schematic view of a stacked chip power distribution module according to an embodiment of the present invention;
fig. 3 is an equivalent circuit diagram of a stacked chip power distribution module provided by an embodiment of the invention;
fig. 4 is a perspective view of a stacked chip power distribution module provided by an embodiment of the present invention;
fig. 5 is a flowchart of a method for manufacturing a stacked chip power distribution module according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It should be noted that the terms of orientation such as left, right, up and down in the embodiments of the present invention are only relative to each other or are referred to the normal use state of the product, and should not be considered as limiting.
Referring to fig. 1 to 3, the present invention provides a stacked chip power distribution module, including an input electrode 01, an output electrode 02, an upper cover 03, a lower cover 04, and an intermediate layer located between the upper cover 03 and the lower cover 04, where the intermediate layer includes a bypass capacitor inner electrode 05, a power distribution coil 06, and a coupling capacitor inner electrode 07, which are stacked in sequence, and the number of the power distribution coils 06 is at least two and are connected in parallel; one end of the bypass capacitor inner electrode 05 is connected with the common end 061 (namely the input end) of the power distribution coil 06, and the other end is grounded; the common end 061 of the power distribution coils 06 is connected with the input electrode 01, and the non-common end 062 (i.e., the output end) of each power distribution coil 06 is connected with an output electrode 02; a coupling capacitor inner electrode 07 is connected between the non-common ends 062 of the two power distribution coils 06 connected in parallel, that is, the two non-common ends 062 are respectively connected with two pole pieces of the coupling capacitor inner electrode 07. It can be understood that when the number of the power distribution coils 06 is two, the number of the output electrodes 02 is two, the number of the coupling capacitor inner electrodes 07 is one, when the number of the power distribution coils 06 is three, the number of the corresponding output electrodes 02 is three, the number of the coupling capacitor inner electrodes 07 is three, every two power distribution coils 06 are connected in parallel, and a coupling capacitor inner electrode 07 is connected between every two power distribution coils 06 connected in parallel. Similarly, when there are more power distribution coils 06, more parallel circuits can be formed, that is, one input is distributed as multiple outputs. This embodiment is not illustrated one by one.
Specifically, the upper cover 03 and the lower cover 04 are outermost structures of the multilayer chip power distribution module, and an intermediate layer is sandwiched between the upper cover 03 and the lower cover 04, and the intermediate layer is formed by the bypass capacitor inner electrode 05, the power distribution coil 06, and the coupling capacitor inner electrode 07, and the three layers are stacked. The bypass capacitor inner electrode 05 and the coupling capacitor inner electrode 07 naturally each include two pole pieces, i.e., a double-layer structure, and the power distribution coil 06 is a multi-layer structure, and is usually spirally wound by a plurality of turns of the conducting wire 063 to form the power distribution coil 06. In this embodiment, the bypass capacitor inner electrode 05, the power distribution coil 06, and the coupling capacitor inner electrode 07 are all supported by a sheet-shaped dielectric layer, that is, each capacitor pole piece and each circle of conducting wire 063 are supported by a sheet-shaped dielectric layer, and a part of the dielectric layer is further provided with a conductive through hole for communicating the corresponding electrodes or coils above and below the dielectric layer, so as to implement a circuit connection relationship.
With further reference to fig. 2, the bypass capacitor inner electrode 05 includes a bypass capacitor upper electrode 051 and a bypass capacitor lower electrode 052, and is carried by a first dielectric layer 08, where the first dielectric layer 08 includes at least two first sub-dielectric layers 081, which respectively carry the bypass capacitor upper electrode 051 and the bypass capacitor lower electrode 052; the power distribution coil 06 is carried by a second dielectric layer 09, the second dielectric layer 09 at least comprises a plurality of second sub-dielectric layers 091, and each second sub-dielectric layer 091 carries a circle of conducting wires 063; the coupling capacitor inner electrode 07 comprises a coupling capacitor upper electrode 071 and a coupling capacitor lower electrode 072, which are carried by a third dielectric layer 10, wherein the third dielectric layer 10 at least comprises two third sub-dielectric layers 101, which respectively carry the coupling capacitor upper electrode 071 and the coupling capacitor lower electrode 072. A first intermediate dielectric layer 11 may be further disposed between the first dielectric layer 08 and the second dielectric layer 09, and a second intermediate dielectric layer 12 may be further disposed between the second dielectric layer 09 and the third dielectric layer 10.
With continued reference to fig. 2, a first connection point 13, which may be in particular a conductive via, is provided on each of the two third sub-dielectric layers 101 and the second intermediate dielectric layer 12, which first connection point 13 connects the non-common end 062 of one power distribution coil 06 to the coupling capacitor upper electrode 071. A second connection point 14, which may be a conductive through hole, is respectively disposed on the third sub-dielectric layer 101 and the second intermediate dielectric layer 12 that bear the coupling capacitor lower electrode 072, the second connection point 14 connects the non-common end 062 of another power distribution coil 06 with the coupling capacitor lower electrode 072, and further connects the non-common end 062 of two power distribution coils 06 that are connected in parallel with each other with two electrode pieces of one coupling capacitor inner electrode, respectively. In addition, the common end 061 and the non-common end 062 of the power distribution coil 06 may be led out to the side of the second dielectric layer 09 to be connected to the input electrode 01 and the output electrode 02, respectively, or of course, the coupling capacitor upper electrode 071 and the coupling capacitor lower electrode 072 may be led out to the side of the third dielectric layer 10 to be connected to the output electrode 01 and the output electrode 02, thereby realizing power distribution. Further, a third connection point 15, which may be a conductive through hole, is respectively disposed on the first intermediate dielectric layer 11 and the first sub-dielectric layer 081 carrying the bypass capacitor upper electrode 051, and the third connection point 15 connects the bypass capacitor upper electrode 051 and the common end 061 of the power distribution coil 06, so as to connect one end of the bypass capacitor inner electrode 05 with the common end 061 of the power distribution coil 06 and the input electrode 01.
Further referring to fig. 1, the input electrode 01 and the output electrode 02 are disposed at the side of the upper cover 03, the lower cover 04, and the intermediate layer, or at the side of the upper cover 03, the lower cover 04, and the intermediate layer and extend to the upper surface of the upper cover 03 and the lower surface of the lower cover 04, which is the structure shown in fig. 1. The capacitor can be further provided with a grounding electrode 16 which is arranged on the side surfaces of the upper cover 03, the lower cover 04 and the middle layer, or arranged on the side surfaces of the upper cover 03, the lower cover 04 and the middle layer and extends to the upper surface of the upper cover 03 and the lower surface of the lower cover 04, or arranged at the bottom of the lower cover 04, and one end of the bypass capacitor inner electrode 05 extends out of the dielectric layer and is connected with the grounding electrode 16. The number of the input electrodes 01 may be one, and the input electrodes are disposed at one side of the upper cover 03, the lower cover 04, and the intermediate layer, and connected to the common terminal 061 of the power distribution coil 06, and the number of the output electrodes 02 is the same as the number of the power distribution coils 06, and preferably disposed at opposite sides of the input electrodes 01, and connected to the non-common terminals 062 of the power distribution coils 06 one-to-one. One or more connection terminals 053 may be led out of the bypass capacitor lower electrode 052 to be connected to the ground electrode 16.
In this embodiment, the base material of the upper cover 03, the lower cover 04, and the dielectric layer for carrying each internal electrode and the coil is preferably a dielectric ceramic, and specifically, a microwave dielectric ceramic that can be used in a microwave frequency band, such as NPO, C0G, and the like, may be used. When the material is adopted, the power distribution module is a microwave power distribution module. Of course, materials suitable for other frequency bands may also be adopted, so that the power distribution module is suitable for power distribution of other frequency bands.
In this embodiment, the bypass capacitor inner electrode 05, the power distribution coil 06, and the coupling capacitor inner electrode 07 are made of pure silver, silver-palladium alloy, or gold. Silver of silver palladium alloy: the ratio of palladium is 100-0: 0-100.
In use, the power distribution module may be externally connected to an isolation resistor 17 between the output electrodes 02.
As shown in fig. 4, the whole power distribution module may be in a cubic shape, and the coupling capacitor inner electrode 07, the power distribution coil 06, the bypass capacitor inner electrode 05, the upper cover 03 and the lower cover 04 are integrated into a whole, so that the conventional structure of assembling the coupling capacitor device, the bypass capacitor device and the power distribution device into a module whole is eliminated, and the whole product has high integration, small volume, convenient assembly, good weldability, high reliability, suitability for high-density surface mounting, high installation efficiency, small insertion loss, high isolation, and excellent phase balance and amplitude balance; each part achieves organic matching, realizes signal energy distribution serialization, ensures that products meet power distribution requirements of different frequency bands, and is a power distribution module which not only meets assembly requirements but also improves electrical performance.
The present invention further provides a method for manufacturing the above laminated chip power distribution module, as shown in fig. 5, the method includes the following steps:
in step S101, the base material is sufficiently ball-milled and mixed with a binder, a solvent, a dispersant, and a plasticizer to form a slurry.
In this step, the base material may be a microwave dielectric ceramic such as NPO and C0G, which can be used in the microwave band, or a dielectric material suitable for other bands may be used. The viscosity of the mixed slurry is preferably 10 to 500Pa S.
In step S102, the slurry is made into the lower cover 04 and the upper cover 03. Specifically, the slurry can be cast into a film belt, and the film belt is laminated to form the lower cover 04 and the upper cover 03.
In step S103, the following are laminated between the upper cover 03 and the lower cover 04:
a first dielectric layer 08, and manufacturing a bypass capacitor inner electrode 05 on the first dielectric layer 08;
a second dielectric layer 09, at least two parallel power distribution coils 06 are manufactured on the second dielectric layer 09, and a common end 061 of the power distribution coils 06 is connected with one end of the bypass capacitor inner electrode 05;
and a third dielectric layer 10, wherein a coupling capacitor inner electrode 07 is formed on the third dielectric layer 10, and the non-common ends 062 of two power distribution coils 06 which are connected in parallel are respectively connected with two ends of the coupling capacitor inner electrode 07 to form a semi-finished product.
Steps S102 and S103 may be performed in chronological order, that is, the upper cover 03 and the lower cover 04 are first fabricated, then the middle layer is fabricated on the lower cover 04, and then the upper cover 03 is covered on the middle layer. Or alternatively, the manufacturing process may be performed in a cross manner, for example, the lower cover 04 is manufactured first, the middle layer is manufactured on the lower cover 04, and then the upper cover 03 is manufactured and covered on the middle layer, and of course, the manufacturing process of the upper cover 03 and the lower cover 04 in the same process is more beneficial to resource utilization and efficiency improvement.
In step S103, a first dielectric layer 08, a bypass capacitor inner electrode 05, a second dielectric layer 09, a power distribution coil 06, a third dielectric layer 10, and a coupling capacitor inner electrode 07 may be fabricated in order from bottom to top with the lower cover 04 as a substrate, and optionally, the lower cover 04 may be directly used as the first dielectric layer 08. When the first, second and third dielectric layers are manufactured, conductive through holes can be formed in the corresponding dielectric layers as required, so that the upper and lower circuits of the dielectric layers can be conducted conveniently, for example, the power distribution coil 06 and the inner electrode 05 of the bypass capacitor, the power distribution coil 06 and the inner electrode 07 of the coupling capacitor, and the like. In addition, when each internal electrode and the power distribution coil 06 are manufactured, it is necessary to lead out a part of the electrodes to the side surface of each dielectric layer according to design so as to be connected with the terminal electrodes (the input electrode 01, the output electrode 02, and the ground electrode 16) manufactured later.
The specific implementation process may be as follows, a first sub-dielectric layer 081 is fabricated on the lower cover 04, a bypass capacitor lower electrode 052 is fabricated on the first sub-dielectric layer 081, and a plurality of leads 053 are led out of the bypass capacitor lower electrode 052 to the side of the first sub-dielectric layer 081 for connecting with a grounding electrode 16 fabricated subsequently. Another first sub-dielectric layer 081 is formed on the bypass capacitor lower electrode 052, and a bypass capacitor upper electrode 051 is formed thereon. Then, a first intermediate dielectric layer 11 is manufactured and provided with conductive through holes, then a plurality of second sub-dielectric layers 091 are continuously manufactured and provided with conductive through holes, a lead 063 is manufactured on each layer, the leads 063 are communicated through the conductive through holes of the second sub-dielectric layers 091 to form a power distribution coil 06, more than two power distribution coils 06 can be manufactured at different positions of the second dielectric layer 09, the plurality of power distribution coils 06 have a common end 061 on the second sub-dielectric layer 091 at the lowest layer and serve as an input end, and the bypass capacitor upper electrode 051 also penetrates through the first intermediate dielectric layer 11 and the second sub-dielectric layers 091 upwards to be connected with the common end 061. At the terminal of the power distribution coil, the non-common terminals 062 of different power distribution coils 06 are respectively led out for connecting terminal electrodes manufactured subsequently. After the power distribution coil 06 is manufactured, the second intermediate medium layer 12 is manufactured and provided with conductive through holes, then at least two third sub medium layers 101 are manufactured, coupling capacitor lower electrodes 072 and coupling capacitor upper electrodes 071 are manufactured on the third sub medium layers, the number of the coupling capacitor lower electrodes 072 and the number of the coupling capacitor upper electrodes 071 are preferably reduced by 1, and the coupling capacitor upper electrodes 071 and the coupling capacitor lower electrodes 072 are respectively connected with two non-common ends 062 of the power distribution coil 06 which are connected in parallel through the conductive through holes on the second intermediate medium layer 12 and the third sub medium layers 101. After the intermediate layer is manufactured, the upper cover 03 is covered on the upper surface of the intermediate layer.
In step S104, the semi-finished product is cut, chamfered, de-glued, sintered and separated to obtain a semi-finished product single body.
In step S105, an input electrode 01, an output electrode 02, and a ground electrode 16 are disposed on the outer surface of the single semi-finished product, the input electrode 01 is connected to the common terminal 061 of the power distribution coil 06, the output electrode 02 is connected to the non-common terminal 062, and the other end of the bypass capacitor inner electrode 05 is connected to the ground electrode 16, thereby obtaining the multilayer chip power distribution module.
In this step, the monomer semi-finished product is placed on a special-purpose special-shaped silver coating machine, a proper silver coating roller is selected according to the shapes of the input electrode 01 and the output electrode 02, the shapes of the input electrode 01 and the output electrode 02 are pad-printed on the monomer semi-finished product, and then the grounding electrode 16 is manufactured by silver burning.
Further, the products on which the input electrode 01, the output electrode 02 and the grounding electrode 16 are arranged are subjected to end processing and sorting to obtain a finished product of the laminated microwave power distribution module.
The embodiment of the invention adopts the LTCC technology (low temperature co-fired ceramic technology) to manufacture the power distribution module, replaces the traditional structure that the coupling capacitor device, the bypass capacitor device and the power distribution device are assembled into a module whole, and manufactures the bypass capacitor inner electrode 05, the power distribution coil 06 and the coupling capacitor inner electrode 07 in a laminated way between the upper cover 03 and the lower cover 04.
The present invention is not limited to the above preferred embodiments, and any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The laminated chip type power distribution module is characterized by comprising an input electrode, an output electrode, an upper cover, a lower cover and an intermediate layer positioned between the upper cover and the lower cover, wherein the intermediate layer comprises a bypass capacitor inner electrode, power distribution coils and a coupling capacitor inner electrode which are laminated, and the number of the power distribution coils is at least two and the power distribution coils are mutually connected in parallel; one end of the bypass capacitor inner electrode is electrically connected with the common end of the power distribution coil, and the other end of the bypass capacitor inner electrode is grounded; the public end of the power distribution coil is electrically connected with the input electrode, and the non-public end of each power distribution coil is connected with one output electrode; the non-common end of each two parallel power distribution coils is connected with one coupling capacitor inner electrode;
the bypass capacitor inner electrode, the power distribution coil and the coupling capacitor inner electrode are all carried by a dielectric layer, and part of the dielectric layer is provided with a conductive through hole for conducting circuits above and below the dielectric layer;
the bypass capacitor inner electrode is carried by a first dielectric layer, and the first dielectric layer comprises two first sub-dielectric layers which respectively carry a bypass capacitor upper electrode and a bypass capacitor lower electrode of the bypass capacitor inner electrode; the power distribution coil is carried by a second medium layer, the second medium layer comprises a plurality of second sub-medium layers which respectively carry each circle of conducting wires of the power distribution coil, and conducting wires on different second sub-medium layers are electrically connected through conducting through holes of the second sub-medium layers to form the power distribution coil; the coupling capacitor inner electrode is carried by a third medium layer, the third medium layer comprises two third sub-medium layers respectively carrying a coupling capacitor upper electrode and a coupling capacitor lower electrode of the coupling capacitor inner electrode, a first intermediate medium layer is arranged between the first medium layer and the second medium layer, a second intermediate medium layer is arranged between the second medium layer and the third medium layer, a first conductive through hole is respectively arranged on the two third sub-medium layers and the second intermediate medium layer and used for communicating the non-common end of one power distribution coil with the coupling capacitor upper electrode, a second conductive through hole is respectively arranged on the third sub-medium layer carrying the coupling capacitor lower electrode and the second intermediate medium layer and used for communicating the non-common end of the other power distribution coil with the coupling capacitor lower electrode, and a third conductive through hole is respectively arranged on the first intermediate medium layer and the first sub-medium layer carrying the bypass capacitor upper electrode, the third conductive via connects the bypass capacitor upper electrode and the common terminal of the power distribution coil.
2. The stacked chip power distribution module as claimed in claim 1, wherein the input and output electrodes are disposed at sides of the upper cover, the lower cover, and the intermediate layer, or disposed at sides of the upper cover, the lower cover, and the intermediate layer and extended toward upper surfaces of the upper cover and lower surfaces of the lower cover.
3. The stacked slice power distribution module of claim 1 wherein the dielectric layer is a microwave ceramic dielectric layer.
4. The laminated chip type power distribution module as claimed in claim 1, further comprising a ground electrode disposed at a side surface of the upper cover, the lower cover and the intermediate layer, or disposed at a side surface of the upper cover, the lower cover and the intermediate layer and extending toward an upper surface of the upper cover and a lower surface of the lower cover, or disposed at a bottom portion of the lower cover, wherein one end of the bypass capacitor inner electrode is connected to the ground electrode.
5. A method of manufacturing a stacked chip power distribution module, comprising the steps of:
fully ball-milling and mixing the matrix material, an adhesive, a solvent, a dispersant and a plasticizer to form slurry;
manufacturing the slurry into a lower cover and an upper cover;
and (3) laminating and manufacturing between the upper cover and the lower cover:
a first dielectric layer, wherein a bypass capacitor inner electrode is manufactured on the first dielectric layer, the first dielectric layer comprises two first sub-dielectric layers, a bypass capacitor lower electrode is manufactured on the first sub-dielectric layer, another first sub-dielectric layer is manufactured on the bypass capacitor lower electrode, and a bypass capacitor upper electrode is manufactured on the other first sub-dielectric layer;
the conductive through hole is formed in the first middle medium layer;
the second dielectric layer is provided with at least two power distribution coils which are connected in parallel, the second dielectric layers are provided with a plurality of second sub-dielectric layers, wires on different second sub-dielectric layers are electrically connected through conductive through holes of the second sub-dielectric layers to form a power distribution coil, and the common end of the power distribution coil is connected with the upper electrode of the bypass capacitor through the conductive through hole on the first middle dielectric layer;
a second intermediate dielectric layer, wherein a conductive through hole is formed in the second intermediate dielectric layer;
a third dielectric layer, wherein a coupling capacitor inner electrode is manufactured on the third dielectric layer, the third dielectric layer comprises two third sub-dielectric layers which respectively bear a coupling capacitor upper electrode and a coupling capacitor lower electrode of the coupling capacitor inner electrode, and non-common ends of two power distribution coils which are mutually connected in parallel are respectively connected with the coupling capacitor upper electrode and the coupling capacitor lower electrode through conductive through holes formed in a second middle dielectric layer to form a semi-finished product;
cutting, chamfering, glue discharging, sintering and separating the semi-finished product to obtain a semi-finished product monomer;
and arranging an input electrode, an output electrode and a grounding electrode on the outer surface of the semi-finished product monomer, connecting the input electrode with the common end of the power distribution coil, connecting the output electrode with the non-common end of the power distribution coil, and connecting the other end of the inner electrode of the bypass capacitor with the grounding electrode to obtain the laminated chip type power distribution module.
6. The method of claim 5, wherein the substrates of the upper cover, the lower cover, the first dielectric layer, the second dielectric layer, and the third dielectric layer are all microwave dielectric ceramics.
7. The manufacturing method according to claim 5, wherein the step of providing the input electrode, the output electrode, and the ground electrode on the outer surface of the semi-finished single body comprises: and placing the semi-finished product monomer on a special-shaped silver coating machine, selecting a proper silver coating roller according to the shapes of the input electrode and the output electrode, pad-printing the shapes of the input electrode and the output electrode on the semi-finished product monomer, and then burning silver to finish the manufacturing of the grounding electrode.
8. The production method according to any one of claims 5 to 7, wherein the viscosity of the slurry is 10 to 500 Pa-S.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610404705.9A CN107039734B (en) | 2016-06-08 | 2016-06-08 | Laminated sheet type power distribution module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610404705.9A CN107039734B (en) | 2016-06-08 | 2016-06-08 | Laminated sheet type power distribution module and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107039734A CN107039734A (en) | 2017-08-11 |
| CN107039734B true CN107039734B (en) | 2022-04-29 |
Family
ID=59532256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610404705.9A Active CN107039734B (en) | 2016-06-08 | 2016-06-08 | Laminated sheet type power distribution module and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107039734B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103560312A (en) * | 2013-11-15 | 2014-02-05 | 苏州博海创业微系统有限公司 | Multi-path unequal-power LTCC power divider |
| CN104332687A (en) * | 2014-09-29 | 2015-02-04 | 中国电子科技集团公司第五十五研究所 | Improved 2.4GHz LTCC power divider |
| CN104966879A (en) * | 2015-06-29 | 2015-10-07 | 南京理工大学 | Subminiature power divider with built-in absorption resistor |
| CN105187026A (en) * | 2015-10-12 | 2015-12-23 | 深圳振华富电子有限公司 | Laminated filter network and manufacturing method thereof |
| CN205828623U (en) * | 2016-06-08 | 2016-12-21 | 深圳振华富电子有限公司 | A kind of lamination sheet type power distribution module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003124771A (en) * | 1996-02-27 | 2003-04-25 | Hitachi Metals Ltd | Demultiplexer for dual-band mobile phone terminal |
| FI20020522A0 (en) * | 2002-03-19 | 2002-03-19 | Nokia Corp | Arrangements for administering the effect |
| CN105048027A (en) * | 2015-07-14 | 2015-11-11 | 南京理工大学 | L-band miniature double-microwave balance power dividing filter |
-
2016
- 2016-06-08 CN CN201610404705.9A patent/CN107039734B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103560312A (en) * | 2013-11-15 | 2014-02-05 | 苏州博海创业微系统有限公司 | Multi-path unequal-power LTCC power divider |
| CN104332687A (en) * | 2014-09-29 | 2015-02-04 | 中国电子科技集团公司第五十五研究所 | Improved 2.4GHz LTCC power divider |
| CN104966879A (en) * | 2015-06-29 | 2015-10-07 | 南京理工大学 | Subminiature power divider with built-in absorption resistor |
| CN105187026A (en) * | 2015-10-12 | 2015-12-23 | 深圳振华富电子有限公司 | Laminated filter network and manufacturing method thereof |
| CN205828623U (en) * | 2016-06-08 | 2016-12-21 | 深圳振华富电子有限公司 | A kind of lamination sheet type power distribution module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107039734A (en) | 2017-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107039732B (en) | Laminated sheet type power distribution module and manufacturing method thereof | |
| US6778058B1 (en) | Embedded 3D coil inductors in a low temperature, co-fired ceramic substrate | |
| TWI323052B (en) | Multilayer filter | |
| KR101462769B1 (en) | Multi layered ceramic capacitor, fabricating method thereof and circuit board for mounting the same | |
| US8111524B2 (en) | Electronic passive device | |
| US20120313743A1 (en) | Laminated electronic component equipped with inductor | |
| US20120081870A1 (en) | Electronic passive device | |
| CN107210268B (en) | High-frequency model | |
| CN103078158A (en) | L-band miniature low-pass filter | |
| CN110022133B (en) | Small inductance coupling type adjustable band-pass filter and preparation method thereof | |
| US6534842B2 (en) | Composite components and the method of manufacturing the same | |
| CN205545171U (en) | Stromatolite formula high pass filter | |
| CN107039735B (en) | Laminated sheet type power distribution module and manufacturing method thereof | |
| CN107039736B (en) | Laminated sheet type power distribution module and manufacturing method thereof | |
| US6922129B2 (en) | High-work-efficiency multilayered circuit board | |
| CN107039734B (en) | Laminated sheet type power distribution module and manufacturing method thereof | |
| CN109194299B (en) | Ultra-miniature LTCC low-pass filter | |
| CN107039733B (en) | Laminated sheet type power distribution module and manufacturing method thereof | |
| CN114974895B (en) | Multilayer ceramic binary capacitor based on MLCC and SLC and capacitor adjusting method | |
| CN101202274A (en) | Multi-chip electronic circuit module and a method of manufacturing | |
| CN205828621U (en) | A kind of lamination sheet type power distribution module | |
| CN107332531A (en) | A kind of preparation method of lamination tunable filter and adjustable core inductance | |
| CN205828623U (en) | A kind of lamination sheet type power distribution module | |
| CN205828624U (en) | Lamination sheet type power distribution module | |
| CN205828622U (en) | Lamination sheet type power distribution module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |