CN107039316A - Make the control method and controller of LED chip - Google Patents
Make the control method and controller of LED chip Download PDFInfo
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- CN107039316A CN107039316A CN201710257883.8A CN201710257883A CN107039316A CN 107039316 A CN107039316 A CN 107039316A CN 201710257883 A CN201710257883 A CN 201710257883A CN 107039316 A CN107039316 A CN 107039316A
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000013078 crystal Substances 0.000 claims abstract description 120
- 238000000206 photolithography Methods 0.000 claims abstract description 101
- 230000015572 biosynthetic process Effects 0.000 claims description 18
- 238000004364 calculation method Methods 0.000 claims description 10
- 238000001259 photo etching Methods 0.000 claims description 2
- 241000894007 species Species 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000012827 research and development Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67242—Apparatus for monitoring, sorting or marking
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Abstract
The present invention proposes a kind of control method and controller for making LED chip, including:The parameter of at least two crystal grain templates is received, the species number of crystal grain template is the first quantity;The structural parameters of block are set according to the structural parameters of the parameter of crystal grain template and photolithography plate;The position of multiple blocks is preset for each quadrant of photolithography plate according to the structural parameters of block;According to the arrangement data of the crystal grain template in the arrangement data and block of the block on photolithography plate Bin values are preset for all positions on photolithography plate;The arrangement data of block in the arrangement data and photolithography plate of crystal grain template in the parameter of crystal grain template, block are transferred to mechanical machine, to make photolithography plate;Default Bin values are transferred to separator, so that separator is sorted according to Bin values to crystal grain, the LED chip with identical parameters are obtained.The present invention improves the degree of accuracy and the operating efficiency of sorting, and fast and easy draws experimental result exactly.
Description
Technical field
The present invention relates to LED chip preparation field, more particularly, to a kind of control method for making LED chip and control
Device processed.
Background technology
The LED chip of different size and figure has different photoelectric characteristics.In design different size and different graphic
In the experimentation of LED chip, it is essential step to change different photolithography plates.In R&D process, take a piece of
The method of a variety of different sizes and figure is designed on photolithography plate, facilitates the contrast of the crystal grain of different photoelectric characteristics, contrast is improved accurate
True property, while the usage quantity of photolithography plate can be reduced, reduces R&D costs.
But this can bring great operation difficulty to the operation of follow-up process.It is divided into example to illustrate with point, most of feelings
Under condition, the identification capability of provisioned CCD camera all has some limitations in the test of point minute and screening installation, it is impossible to
Extremely accurate distinguish size and the small product of finger line differences.So during research and development product stream access point point, running into
Such product, it is often necessary to which personnel are pressed from both sides out crystal grain with tweezers and are placed in together, row testing, sorting again after rearrangement.Such method without
Method ensure to choose for same figure and the chip of specification, it is and cumbersome, crystal grain may be caused during gripping to damage
Wound, and human cost is higher, and efficiency is low, is unfavorable for quick and precisely drawing experimental result.
Therefore it provides a kind of have the control method and controller for making LED chip, the accuracy and work for improving sorting are imitated
Rate, to avoid damage to crystal grain and reduce human cost be this area urgent problem to be solved.
The content of the invention
In view of this, the invention provides a kind of control method and controller for making LED chip, prior art is solved
Middle sorting accuracy and inefficiency, easy damage crystal grain and the high technical problem of human cost.
In order to solve the above-mentioned technical problem, the present invention proposes a kind of control method for making LED chip, including:
The parameter of at least two crystal grain templates is received, the species number of crystal grain template is the first quantity;Parameter includes crystal grain mould
The specification and figure of plate;
The structural parameters of block are set according to the structural parameters of the parameter of crystal grain template and photolithography plate, specifically included:
Two cut-off rules perpendicular to one another are preset on photolithography plate, photolithography plate is divided into four quadrants, and by two points
Secant forms the first coordinate system respectively as abscissa line and vertical coordinate line;Wherein, each quadrant of the first coordinate system is square
Region;
Multiple factors pair of the first quantity are calculated according to the first preset formula, each factor is to including the first factor and second
The product of factor, the first factor and the second factor is the first quantity;
For each factor pair, the quantity of factor pair, shape can be accommodated by being calculated according to default arragement direction in each quadrant
Into the 4th quantity;Wherein, abscissa line extension of the crystal grain template of arragement direction including the first factor along the first coordinate system and the
Vertical coordinate line extension of the crystal grain template of one factor along the first coordinate system;
Choose the maximum of the 4th quantity, and the factor pair and its arragement direction according to corresponding to maximum form square
Block;The structural parameters of block include the factor pair and its arragement direction corresponding to maximum;
The position of multiple blocks is preset for each quadrant of photolithography plate according to the structural parameters of block;
It is institute on photolithography plate according to the arrangement data of the crystal grain template in the arrangement data and block of the block on photolithography plate
There is position to preset Bin values;
By the arrangement number of the block in the arrangement data and photolithography plate of the crystal grain template in the parameter of crystal grain template, block
According to mechanical machine is transferred to, to make photolithography plate;
Default Bin values are transferred to separator, so that separator is sorted according to Bin values to crystal grain, had
The LED chip of identical parameters.
Further, the position of multiple blocks is preset, is comprised the following steps:
In each quadrant, the first block is set by basic point of the origin of coordinates of the first coordinate system, makes the of the first block
The position of a line and the crystal grain template of first row is corresponding with the first row of the first coordinate system and the template position of first row respectively;
Along the abscissa direction and ordinate direction of the first coordinate system the second block is set gradually against the first block
Position.
Further, it is that Bin values are preset in all positions on photolithography plate, comprises the following steps:
It is each corresponding second coordinate of crystal grain template-setup in block using block as the second coordinate system;Wherein, second
The abscissa of coordinate is the row number of crystal grain template, and the ordinate of the second coordinate is the line number of crystal grain template;Wherein, the second coordinate system
Origin position be block the lower left corner;
First corresponding to the crystal grain template on photolithography plate with identical second coordinate is calculated according to the second preset formula to sit
Mark, wherein integral multiple and the abscissa sum of second coordinate of the absolute value of the abscissa of the first coordinate for the columns of block, the
The absolute value of the ordinate of one coordinate is the integral multiple and the ordinate sum of the second coordinate of the line number of block;
Identical Bin is preset for the template position corresponding to the first coordinate with identical second coordinate value.
Further, it is that Bin values are preset in all positions on photolithography plate, comprises the following steps:
It is each first coordinate value calculating remainder coordinate under the first coordinate system according to the 3rd preset formula, wherein, remainder
The remainder that the abscissa of coordinate obtains for the abscissa of the first coordinate divided by the columns of block;The ordinate of remainder coordinate is first
The remainder that the ordinate of coordinate divided by the line number of block are obtained;
Identical Bin is preset for the template position corresponding to the first coordinate with same remainder coordinate value.
The invention also provides a kind of controller for making LED chip, including:Parameter receiving module, block setup module,
Photolithography plate setup module, Bin values setup module, mechanical machine control data sending module and separator control data send mould
Block;Wherein:
Parameter receiving module, the parameter for receiving at least two crystal grain templates, the species number of crystal grain template is the first number
Amount;
Block setup module is connected with parameter receiving module, is joined for the parameter according to crystal grain template and the structure of photolithography plate
Number sets the structural parameters of block;
Photolithography plate setup module is connected with block setup module, is each of photolithography plate for the structural parameters according to block
Quadrant presets the position of multiple blocks;
Bin values setup module is connected with block setup module and photolithography plate setup module, for according to the area on photolithography plate
The arrangement data of crystal grain template in the arrangement data and block of block are that Bin values are preset in all positions on photolithography plate;
Mechanical machine control data sending module connects with parameter receiving module, block setup module and photolithography plate setup module
Connect, the arrangement number of the block in the arrangement data and photolithography plate by the crystal grain template in the parameter of crystal grain template, block
According to mechanical machine is transferred to, to make photolithography plate;
Separator control data sending module is connected with Bin value setup modules, for default Bin values to be transferred into sorting
Machine, so that separator is sorted according to Bin values to crystal grain, obtains the LED chip with identical parameters;
Wherein, block setup module include the first coordinate system setup module, factor to computing module, capacity calculation module and
Block formation module;Wherein:
First coordinate system setup module, it is for presetting two cut-off rules perpendicular to one another on photolithography plate, photolithography plate is equal
It is divided into four quadrants, and using two cut-off rules as abscissa line and vertical coordinate line, forms the first coordinate system;Wherein,
Each quadrant of one coordinate system is square region;
Factor is connected to computing module with parameter receiving module, for calculating many of the first quantity according to the first preset formula
Individual factor pair, each factor is to including the first factor and the second factor, the product of the first factor and the second factor is the first quantity;
Capacity calculation module is connected with the first coordinate system setup module and factor to computing module, for for each factor
Right, the quantity of factor pair can be accommodated by being calculated according to default arragement direction in each quadrant, form the 4th quantity;Wherein, arrange
The crystal grain template of abscissa line extension and first factor of the crystal grain template in direction including the first factor along the first coordinate system is along the
The vertical coordinate line extension of one coordinate system;
Block formation module is connected with capacity calculation module, the maximum for choosing the 4th quantity, and according to maximum
Corresponding factor pair and its arragement direction forms square block;The structural parameters of block include the factor corresponding to maximum
Pair and its arragement direction.
Further, photolithography plate setup module includes the first block locating module and the second block locating module;Wherein:
First block locating module is connected with the first coordinate system setup module and block formation module, in each quadrant
In, the first block is set by basic point of the origin of coordinates of the first coordinate system, makes the first row of the first block and the crystal grain of first row
The position of template is corresponding with the first row of the first coordinate system and the template position of first row respectively;
Second block locating module is connected with the first block locating module, for along the abscissa direction of the first coordinate system
The position of the second block is set gradually against the first block with ordinate direction.
Further, Bin values setup module include the second coordinate system setup module, the first coordinate value computing module and
Bin assignment modules;Wherein:
Second coordinate system setup module and block formation module are connected, for using block as the second coordinate system, be block
Interior corresponding second coordinate of each crystal grain template-setup;Wherein, the abscissa of the second coordinate is the row number of crystal grain template, and second sits
Target ordinate is the line number of crystal grain template;Wherein, the origin position of the second coordinate system is the lower left corner of block;
First coordinate value computing module is connected with block formation module and the second coordinate system setup module, for according to second
Preset formula calculates the first coordinate corresponding to the crystal grain template on photolithography plate with identical second coordinate, wherein the first coordinate
The absolute value of abscissa for block columns integral multiple and the abscissa sum of the second coordinate, the ordinate of the first coordinate it is exhausted
Integral multiple and the ordinate sum of the second coordinate to being worth the line number for block;
Bin assignment module is connected with the second coordinate system setup module and the first coordinate value computing module, for for
Template position corresponding to first coordinate of identical second coordinate value presets identical Bin.
Further, Bin values setup module includes remainder coordinate value computing module and Bin assignment modules;Wherein:
Remainder coordinate value computing module is connected with the first coordinate system setup module and block formation module, for according to the 3rd
Preset formula is that each first coordinate value under the first coordinate system calculates remainder coordinate, wherein, the abscissa of remainder coordinate is the
The remainder that the abscissa of one coordinate divided by the columns of block are obtained;The ordinate of remainder coordinate for the first coordinate ordinate divided by
The remainder that the line number of block is obtained;
Bin assignment module is connected with remainder coordinate value computing module and the first coordinate system setup module, for for
Template position corresponding to first coordinate of same remainder coordinate value presets identical Bin.
Compared with prior art, a kind of control method and controller for making LED chip of the invention, is realized following
Beneficial effect:
(1) area in the parameter, block structure parameter and photolithography plate of crystal grain template is provided automatically for mechanical machine by controller
The arrangement mode of block, makes polytype crystal grain template on photolithography plate exactly;And controller is automatic to be sat by first
Mark system and the second coordinate system are that all positions distribute No. Bin exactly on photolithography plate, and No. Bin distribution is provided for separator, are improved
The degree of accuracy of sorting and operating efficiency, fast and easy draw experimental result exactly.
(2) there is no artificial participation in assorting room, it is to avoid damage crystal grain.
(3) without artificial participation, human cost is reduced.
Brief description of the drawings
The accompanying drawing for being combined in the description and constituting a part for specification shows embodiments of the invention, and even
It is used for the principle for explaining the present invention together with its explanation.
Fig. 1 is the flow chart of the control method of the making LED chip of embodiments of the invention 1.
Fig. 2 for embodiments of the invention 1 makings LED chip control method in setting block structure flow chart.
The flow of the position of default multiple blocks in control methods of the Fig. 3 for the makings LED chip of embodiments of the invention 1
Figure.
Fig. 4 is one embodiment of default Bin values in the control method of the making LED chip of embodiments of the invention 1
Flow chart.
Another embodiment of Fig. 5 default Bin values in the control method for the makings LED chip of embodiments of the invention 1
Flow chart.
Fig. 6 is the structure chart of the controller of the making LED chip of embodiments of the invention 2.
Fig. 7 for embodiments of the invention 2 making LED chip controller in block setup module structure chart.
Fig. 8 for embodiments of the invention 2 making LED chip controller in photolithography plate setup module structural parameters
Figure.
Fig. 9 is implemented for one of Bin value setup modules in the controller of the makings LED chip of embodiments of the invention 2
The structure chart of example.
Figure 10 for embodiments of the invention 2 making LED chip controller in Bin value setup modules another reality
Apply the structure chart of example.
Figure 11 is the block layout viewing of the photolithography plate of one embodiment of the present of invention.
The structure chart for the second coordinate system that Figure 12 is formed for block in the embodiment shown in Figure 11.
Embodiment
The various exemplary embodiments of the present invention are described in detail now with reference to accompanying drawing.It should be noted that:Unless had in addition
Body illustrates that the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments does not limit this
The scope of invention.
The description only actually at least one exemplary embodiment is illustrative below, never as to the present invention
And its any limitation applied or used.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as a part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that:Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
The present invention makes different types of LED chip simultaneously on photolithography plate, and is that mechanical machine and separator are transmitted automatically
Related data.
Embodiment 1
Fig. 1 is the flow chart of the control method of the making LED chip of embodiments of the invention 1.As shown in figure 1, controlling party
Method comprises the following steps:
S101:The parameter of at least two crystal grain templates is received, the species number of crystal grain template is the first quantity.
As one embodiment, the parameter includes the specification and figure, specification and the distinguishing crystal grain of figure of crystal grain template
Template is considered as different types of crystal grain template.
S102:The structural parameters of block are set according to the structural parameters of the parameter of crystal grain template and photolithography plate.Photolithography plate
Structural parameters include the quantity of the horizontal and vertical template position that can be accommodated of photolithography plate.
S103:The position of multiple blocks is preset for each quadrant of photolithography plate according to the structural parameters of block.
S104:Arrangement data according to the crystal grain template in the arrangement data and block of the block on photolithography plate are photolithography plate
Preset Bin values in upper all positions.
Bin values are set for all positions on photolithography plate, facilitate separator to sort out the crystal grain of same type exactly.
S105:By the block in the arrangement data and photolithography plate of the crystal grain template in the parameter of crystal grain template, block
Arrangement data are transferred to mechanical machine, to make photolithography plate.
The parameter of crystal grain template and the arrangement of photolithography plate are provided for mechanical machine automatically, facilitate mechanical machine rapidly and accurately
Make photolithography plate.
, it is necessary to which chip is processed as into crystal grain using the photolithography plate as photomask blank after photolithography plate is made.
S106:Default Bin values are transferred to separator, so that separator is sorted according to Bin values to crystal grain, obtained
LED chip with identical parameters.
Automatically accurate Bin values and its correspondence position are provided for separator, facilitates separator to be sorted exactly.
Specifically, as shown in Fig. 2 setting the structural parameters of block to comprise the following steps:
S1021:Two cut-off rules perpendicular to one another are preset on photolithography plate, photolithography plate is divided into four quadrants, and will
Two cut-off rules form the first coordinate system respectively as abscissa line and vertical coordinate line.Wherein, each quadrant of the first coordinate system
For square region, as shown in figure 11.
Photolithography plate is divided into the quadrant of four formed objects, facilitates the division of follow-up block, improves the degree of accuracy and work
Make efficiency.
S1022:Multiple factors pair of the first quantity are calculated according to the first preset formula, each factor is to including the first factor
With the second factor, the product of the first factor and the second factor is the first quantity.
Factorization is carried out according to the number of species of crystal grain template, is easy to find suitable block structure parameter.To input
Exemplified by the crystal grain template of six types, the first quantity is 6, then factor is to that can be 1 and 6 or 2 and 3.
S1023:For each factor pair, the number of factor pair can be accommodated by being calculated according to default arragement direction in each quadrant
Amount, forms the 4th quantity;Wherein, arragement direction includes abscissa line extension of the crystal grain template of the first factor along the first coordinate system
Vertical coordinate line extension with the crystal grain template of the first factor along the first coordinate system.
For the block of same structure parameter, two kinds of arragement directions on quadrant can produce different block capacity.
By taking 2 × 3 block as an example.In the quadrant shown in Figure 11, arrange, be can be set in the quadrant if block is two rows three
9 blocks, the 4th quantity is 9.Arranged if block is three rows two, 8 blocks can be set in the quadrant, the 4th quantity is 8.
S1024:Choose the maximum of the 4th quantity, and the factor pair and its arragement direction according to corresponding to maximum are formed
Square block.The structural parameters of block include the factor pair and its arragement direction corresponding to maximum.In the above embodiments
In, the block structure that the 4th quantity of selection is 9, i.e. block are that two rows three are arranged.
The block dividing mode of maximum capacity is chosen, is conducive to improving the output and production efficiency of crystal grain on photolithography plate,
Reduce production cost.
As shown in figure 3, specifically, the position for presetting multiple blocks comprises the following steps:
S1031:In each quadrant, the first block 1101 is set by basic point of the origin of coordinates of the first coordinate system, makes the
The first row and the template of first row of the position of the first row of one block and the crystal grain template of first row respectively with the first coordinate system
Position correspondence, as shown in figure 11.
Using the origin of coordinate system as unified reference point, facilitate the positioning of block.
S1032:Along the abscissa direction and ordinate direction of the first coordinate system second is set gradually against the first block
The position of block 1102, as shown in figure 11.
As shown in figure 4, specifically, as one embodiment, default Bin values comprise the following steps:
S1041:It is each corresponding second coordinate of crystal grain template-setup in block using block as the second coordinate system;Its
In, the abscissa of the second coordinate is the row number of crystal grain template, and the ordinate of the second coordinate is the line number of crystal grain template;Wherein,
The origin position of two coordinate systems is the lower left corner of block.
The structural parameters figure for the second coordinate system that Figure 12 is formed for block in the embodiment shown in Figure 11.Block 1201 is two
The square region that row three is arranged, the second coordinate of each crystal grain template is as shown in figure 12.
S1042:Calculated according to the second preset formula corresponding to the crystal grain template on photolithography plate with identical second coordinate
First coordinate, wherein the absolute value of the abscissa of the first coordinate for block columns integral multiple and the second coordinate abscissa it
With the absolute value of, the ordinate of the first coordinate integral multiple and the ordinate sum of the second coordinate for the line number of block.
By taking the second coordinate (2,1) in Figure 12 as an example, relevant position in second block 1102 on the right side of the first block 1101
The first coordinate (X, Y) of crystal grain template is:
X=3 × 1+2=5
Y=2 × 0+1=1
Obtain the first coordinate (5,1).
By that analogy, in the second block 1102 of the upside of the first block 1101 the crystal grain template of relevant position the first coordinate
(X, Y) is (2,3).Therefore, the crystal grain template that the first coordinate is (2,3) and the first coordinate is (5,1) is endowed identical Bin
Number.
S1043:Identical Bin is preset for the template position corresponding to the first coordinate with identical second coordinate value.
Coordinate according to each crystal grain template on block under the second coordinate system carrys out calculation block, and to be placed on photolithography plate institute right
Coordinate value under the first coordinate system answered, fast and easy carries out the mark of No. Bin.
As shown in figure 5, specifically, as another embodiment, default Bin values comprise the following steps:
S1044:It is each first coordinate value calculating remainder coordinate under the first coordinate system according to the second preset formula, its
In, the abscissa of remainder coordinate is the remainder that the abscissa of the first coordinate divided by the columns of block are obtained;The vertical seat of remainder coordinate
The remainder that the line number of the ordinate divided by block that are designated as the first coordinate is obtained.
In Figure 11 quadrant, the first coordinate is that the remainder coordinate of (5,2) is (2,0);First coordinate is sat for the remainder of (5,4)
It is designated as (2,0).Therefore, the crystal grain template that the first coordinate is (5,2) and the first coordinate is (5,4) is endowed identical Bin.
S1045:Identical Bin is preset for the template position corresponding to the first coordinate with same remainder coordinate value.
It is the template position setting Bin on photolithography plate according to remainder coordinate value, the short and small refining of remainder coordinate value facilitates mould
Board position and the Rapid matching of No. Bin.
Embodiment 2
Fig. 6 is the structure chart of the controller of the making LED chip of embodiments of the invention 2.As shown in fig. 6, controller bag
Include parameter receiving module 601, block setup module 602, photolithography plate setup module 603, Bin values setup module 604, mechanical machine control
Data transmission blocks 605 and separator control data sending module 606 processed.
Wherein, parameter receiving module 601 is used for the parameter for receiving at least two crystal grain templates, and the species number of crystal grain template is
First quantity.
Block setup module 602 is connected with parameter receiving module 601, for the parameter according to crystal grain template and photolithography plate
Structural parameters set the structural parameters of block.
Photolithography plate setup module 603 is connected with block setup module 602, is photolithography plate for the structural parameters according to block
Each quadrant preset the positions of multiple blocks.
Bin values setup module 604 is connected with block setup module 602 and photolithography plate setup module 603, for according to photoetching
The arrangement data of crystal grain template in the arrangement data and block of block on plate are that Bin values are preset in all positions on photolithography plate.
Mechanical machine control data sending module 605 is set with parameter receiving module 601, block setup module 602 and photolithography plate
Put module 603 to connect, for the area in the arrangement data and photolithography plate by the crystal grain template in the parameter of crystal grain template, block
The arrangement data of block are transferred to mechanical machine, to make photolithography plate.
, it is necessary to which chip is processed as into crystal grain using the photolithography plate as photomask blank after photolithography plate is made.
Separator control data sending module 606 is connected with Bin values setup module 604, for default Bin values to be transmitted
To separator, so that separator is sorted according to Bin values to crystal grain, the LED chip with identical parameters is obtained.
Specifically, as shown in fig. 7, block setup module 602 includes the first coordinate system setup module 6021, factor to calculating
Module 6022, capacity calculation module 6023 and block formation module 6024.
Wherein, the first coordinate system setup module 6021, will for presetting two cut-off rules perpendicular to one another on photolithography plate
Photolithography plate is divided into four quadrants, and using two cut-off rules as abscissa line and vertical coordinate line, forms the first coordinate system;
Wherein, each quadrant of the first coordinate system is square region.
Factor is connected to computing module 6022 with parameter receiving module 601, for calculating first according to the first preset formula
Multiple factors pair of quantity, each factor is to including the first factor and the second factor, and the product of the first factor and the second factor is
First quantity.
Capacity calculation module 6023 is connected with the first coordinate system setup module 6021 and factor to computing module 6022, is used for
For each factor pair, the quantity of factor pair can be accommodated by being calculated according to default arragement direction in each quadrant, formed the 4th and counted
Amount;Wherein, arragement direction includes abscissa line extension and first factor of the crystal grain template of the first factor along the first coordinate system
Vertical coordinate line extension of the crystal grain template along the first coordinate system.
Block formation module 6024 is connected with capacity calculation module 6023, the maximum for choosing the 4th quantity, and root
Square block is formed according to the factor pair and its arragement direction corresponding to maximum;It is right that the structural parameters of block include maximum institute
The factor pair and its arragement direction answered.
Specifically, as shown in figure 8, photolithography plate setup module 603 includes the first block locating module 6031 and the second block
Locating module 6032.
Wherein, the first block locating module 6031 connects with the first coordinate system setup module 6021 and block formation module 6024
Connect, in each quadrant, the first block being set by basic point of the origin of coordinates of the first coordinate system, makes the first of the first block
The position of the crystal grain template of row and first row is corresponding with the first row of the first coordinate system and the template position of first row respectively.
Second block locating module 6032 is connected with the first block locating module 6031, for the horizontal stroke along the first coordinate system
Coordinate direction and ordinate direction set gradually the position of the second block against the first block.
Specifically, as shown in figure 9, as one embodiment, Bin values setup module 604 includes the second coordinate system and sets mould
Block 6041, the first coordinate value computing module 6042 and Bin assignment module 6043.
Wherein, the second coordinate system setup module 6041 is connected with block formation module 6024, for regarding block as second
Coordinate system, is each corresponding second coordinate of crystal grain template-setup in block;Wherein, the abscissa of the second coordinate is crystal grain template
Row number, the ordinate of the second coordinate is the line number of crystal grain template;Wherein, the origin position of the second coordinate system is the lower-left of block
Angle.
First coordinate value computing module 6042 is connected with the block formation coordinate system setup module 6041 of module 6024 and second,
For according to the second preset formula calculate photolithography plate on have identical second coordinate crystal grain template corresponding to the first coordinate, its
In the first coordinate abscissa absolute value for block columns integral multiple and the abscissa sum of the second coordinate, the first coordinate
Ordinate absolute value for block line number integral multiple and the ordinate sum of the second coordinate.
Bin assignment module 6043 connects with the second coordinate system setup module 6041 and the first coordinate value computing module 6042
Connect, for presetting identical Bin for the template position corresponding to the first coordinate with identical second coordinate value.
Specifically, as shown in Figure 10, as another embodiment, Bin values setup module 604 is calculated including remainder coordinate value
Module 6044 and Bin assignment module 6045.
Wherein, the coordinate system setup module 6021 of remainder coordinate value computing module 6044 and first and block formation module 6024
Connection, for being that each first coordinate value under the first coordinate system calculates remainder coordinate according to the second preset formula, wherein, remainder
The remainder that the abscissa of coordinate obtains for the abscissa of the first coordinate divided by the columns of block;The ordinate of remainder coordinate is first
The remainder that the ordinate of coordinate divided by the line number of block are obtained.
Bin assignment module 6045 connects with remainder coordinate value computing module 6044 and the first coordinate system setup module 6021
Connect, identical Bin is preset for the template position corresponding to the first coordinate with same remainder coordinate value.
By above-described embodiment, the control method and controller of making LED chip of the invention have reached following
Beneficial effect:
(1) area in the parameter, block structure parameter and photolithography plate of crystal grain template is provided automatically for mechanical machine by controller
The arrangement mode of block, makes polytype crystal grain template on photolithography plate exactly;And controller is automatic to be sat by first
Mark system and the second coordinate system are that all positions distribute No. Bin exactly on photolithography plate, and No. Bin distribution is provided for separator, are improved
The degree of accuracy of sorting and operating efficiency, fast and easy draw experimental result exactly.
(2) there is no artificial participation in assorting room, it is to avoid damage crystal grain.
(3) without artificial participation, human cost is reduced.
Although some specific embodiments of the present invention are described in detail by example, the skill of this area
Art personnel are it should be understood that example above is merely to illustrate, the scope being not intended to be limiting of the invention.The skill of this area
Art personnel to above example it should be understood that can modify without departing from the scope and spirit of the present invention.This hair
Bright scope is defined by the following claims.
Claims (8)
1. a kind of control method for making LED chip, it is characterised in that including:
The parameter of at least two crystal grain templates is received, the species number of the crystal grain template is the first quantity;The parameter includes institute
State the specification and figure of crystal grain template;
The structural parameters of block are set according to the structural parameters of the parameter of the crystal grain template and photolithography plate, specifically included:
Two cut-off rules perpendicular to one another are preset on the photolithography plate, the photolithography plate is divided into four quadrants, and by institute
Two cut-off rules are stated respectively as abscissa line and vertical coordinate line, the first coordinate system is formed;Wherein, first coordinate system is every
Individual quadrant is square region;
Calculate multiple factors pair of first quantity according to the first preset formula, each factor to including the first factor and
The product of second factor, first factor and second factor is first quantity;
For each factor pair, the factor pair can be accommodated by being calculated according to default arragement direction in each quadrant
Quantity, forms the 4th quantity;Wherein, the crystal grain template of the arragement direction including first factor is along first coordinate system
Abscissa line extension and first factor crystal grain template along first coordinate system vertical coordinate line extension;
Choose the maximum of the 4th quantity, and the factor pair according to corresponding to the maximum and its arragement direction side of being formed
The block of shape;The structural parameters of the block include the factor pair and its arragement direction corresponding to the maximum;
The position of multiple blocks is preset for each quadrant of the photolithography plate according to the structural parameters of the block;
Arrangement data according to the crystal grain template in the arrangement data and the block of the block on the photolithography plate are the light
Preset Bin values in mechanical all positions;
By the block in the arrangement data and the photolithography plate of the crystal grain template in the parameter of the crystal grain template, the block
Arrangement data be transferred to mechanical machine, to make photolithography plate;
The default Bin values are transferred to separator, so that the separator is sorted according to the Bin values to crystal grain,
Obtain the LED chip with identical parameters.
2. the control method according to claim 1 for making LED chip, it is characterised in that default multiple blocks
Position, comprises the following steps:
In each quadrant, the first block is set by basic point of the origin of coordinates of first coordinate system, makes described first
The first row and the mould of first row of the position of the first row of block and the crystal grain template of first row respectively with first coordinate system
Board position correspondence;
Along the abscissa direction and ordinate direction of first coordinate system the secondth area is set gradually against first block
The position of block.
3. the control method according to claim 1 for making LED chip, it is characterised in that to own on the photolithography plate
Bin values are preset in position, comprise the following steps:
It is each corresponding second coordinate of crystal grain template-setup in the block using the block as the second coordinate system;Wherein,
The abscissa of second coordinate is the row number of the crystal grain template, and the ordinate of second coordinate is the crystal grain template
Line number;Wherein, the origin position of second coordinate system is the lower left corner of the block;
First corresponding to the crystal grain template on the photolithography plate with identical second coordinate is calculated according to the second preset formula to sit
Mark, wherein the absolute value of the abscissa of first coordinate is the integral multiple of the columns of the block and the horizontal stroke of second coordinate
Coordinate sum, the absolute value of the ordinate of first coordinate is the integral multiple and second coordinate of the line number of the block
Ordinate sum;
Identical Bin is preset for the template position corresponding to first coordinate with identical second coordinate value.
4. the control method according to claim 1 for making LED chip, it is characterised in that to own on the photolithography plate
Bin values are preset in position, comprise the following steps:
It is each first coordinate value calculating remainder coordinate under first coordinate system according to the 3rd preset formula, wherein, it is described
The remainder that the abscissa of remainder coordinate obtains for the abscissa of first coordinate divided by the columns of the block;The remainder is sat
The remainder that target ordinate obtains for the ordinate of first coordinate divided by the line number of the block;
Identical Bin is preset for the template position corresponding to the first coordinate with same remainder coordinate value.
5. a kind of controller for making LED chip, it is characterised in that including:Parameter receiving module, block setup module, photoetching
Plate setup module, Bin values setup module, mechanical machine control data sending module and separator control data sending module;Its
In:
The parameter receiving module, the parameter for receiving at least two crystal grain templates, the species number of the crystal grain template is the
One quantity;
The block setup module is connected with the parameter receiving module, for the parameter and photolithography plate according to the crystal grain template
Structural parameters set block structural parameters;
The photolithography plate setup module is connected with the block setup module, is described for the structural parameters according to the block
Each quadrant of photolithography plate presets the position of multiple blocks;
The Bin values setup module is connected with the block setup module and the photolithography plate setup module, for according to described
The arrangement data of crystal grain template in the arrangement data and the block of block on photolithography plate are all positions on the photolithography plate
Put default Bin values;
The mechanical machine control data sending module and the parameter receiving module, the block setup module and the photolithography plate
Setup module is connected, for by arrangement data of the crystal grain template in the parameter of the crystal grain template, the block and described
The arrangement data of block on photolithography plate are transferred to mechanical machine, to make photolithography plate;
The separator control data sending module is connected with the Bin values setup module, for the default Bin values to be passed
Separator is defeated by, so that the separator is sorted according to the Bin values to crystal grain, the LED core with identical parameters is obtained
Piece;
Wherein, the block setup module include the first coordinate system setup module, factor to computing module, capacity calculation module and
Block formation module;Wherein:
The first coordinate system setup module, will be described for presetting two cut-off rules perpendicular to one another on the photolithography plate
Photolithography plate is divided into four quadrants, and using two cut-off rules as abscissa line and vertical coordinate line, forms first and sit
Mark system;Wherein, each quadrant of first coordinate system is square region;
The factor is connected to computing module with the parameter receiving module, for calculating described first according to the first preset formula
Multiple factors pair of quantity, each factor is to including the first factor and the second factor, first factor and described second
The product of factor is first quantity;
The capacity calculation module is connected with the first coordinate system setup module and the factor to computing module, for for
Each factor pair, the quantity of the factor pair, shape can be accommodated by being calculated according to default arragement direction in each quadrant
Into the 4th quantity;Wherein, the arragement direction includes horizontal seat of the crystal grain template of first factor along first coordinate system
Vertical coordinate line extension of the crystal grain template of graticule extension and first factor along first coordinate system;
The block formation module is connected with the capacity calculation module, the maximum for choosing the 4th quantity, and root
Square block is formed according to the factor pair and its arragement direction corresponding to the maximum;The structural parameters of the block include institute
State the factor pair and its arragement direction corresponding to maximum.
6. the controller according to claim 5 for making LED chip, it is characterised in that the photolithography plate setup module bag
Include the first block locating module and the second block locating module;Wherein:
The first block locating module and the first coordinate system setup module and block formation module are connected, for
In each quadrant, the first block is set by basic point of the origin of coordinates of first coordinate system, makes first block
The first row and the template position of first row of the position of the first row and the crystal grain template of first row respectively with first coordinate system
Correspondence;
The second block locating module is connected with the first block locating module, for the horizontal stroke along first coordinate system
Coordinate direction and ordinate direction set gradually the position of the second block against first block.
7. the controller according to claim 5 for making LED chip, it is characterised in that the Bin values setup module includes
Second coordinate system setup module, the first coordinate value computing module and Bin assignment modules;Wherein:
The second coordinate system setup module is connected with block formation module, for regarding the block as the second coordinate
System, is each corresponding second coordinate of crystal grain template-setup in the block;Wherein, the abscissa of second coordinate is described
The row number of crystal grain template, the ordinate of second coordinate is the line number of the crystal grain template;Wherein, second coordinate system
Origin position is the lower left corner of the block;
The first coordinate value computing module is connected with block formation module and the second coordinate system setup module, is used for
The first coordinate according to corresponding to the second preset formula calculates the crystal grain template on the photolithography plate with identical second coordinate, its
Described in the first coordinate abscissa absolute value for integral multiple and second coordinate of the columns of the block abscissa
Sum, the absolute value of the ordinate of first coordinate is the integral multiple of the line number of the block and the vertical seat of second coordinate
Mark sum;
The Bin assignment module is connected with the second coordinate system setup module and the first coordinate value computing module, is used
In for corresponding to the first coordinate with identical second coordinate value template position preset identical Bin.
8. the controller according to claim 5 for making LED chip, it is characterised in that the Bin values setup module includes
Remainder coordinate value computing module and Bin assignment modules;Wherein:
The remainder coordinate value computing module is connected with the first coordinate system setup module and block formation module, is used for
It is each first coordinate value calculating remainder coordinate under first coordinate system according to the 3rd preset formula, wherein, the remainder
The remainder that the abscissa of coordinate obtains for the abscissa of first coordinate divided by the columns of the block;The remainder coordinate
The remainder that ordinate obtains for the ordinate of first coordinate divided by the line number of the block;
The Bin assignment module is connected with the remainder coordinate value computing module and the first coordinate system setup module, is used
In for corresponding to the first coordinate with same remainder coordinate value template position preset identical Bin.
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CN111864039A (en) * | 2020-08-04 | 2020-10-30 | 深圳市隆利科技股份有限公司 | Mini-LED die bonding method and mini-LED lamp panel thereof |
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