CN107031189B - Fluid ejection head, liquid discharge apparatus and manufacturing method - Google Patents

Abstract

Fluid ejection head, liquid discharge apparatus and the manufacturing method of a kind of pressure change being able to suppress pressure chamber are provided.Therefore, The lid component is formed on the device substrate of wafer-shaped, which is cut into chip to manufacture type element substrate.

Description

Fluid ejection head, liquid discharge apparatus and manufacturing method

Technical field

The present invention relates to fluid ejection head, liquid discharge apparatus and manufacturing methods that liquid is sprayed from ejiction opening.

Background technique

In recent years, since printing device is used for various uses, in the presence of what is operated to high-precision and letter quality It is more and more to require.In order to need to configure multiple sprays in fluid ejection head middle-high density with higher precision print image Outlet, the fluid ejection head can selectively spray the liquid from multiple ejiction openings.In addition, for high-quality printed drawings Picture needs to spray the drop with single-size.

In order to configure ejiction opening to high-density, it is also necessary to be decreased to the size of the liquid supply line of ejiction opening.The U.S. is special The specification of benefit the 7347534th discloses a kind of processing method for supplying ink to the component of device substrate.Here, lead to Integrated sealing film is crossed on the length direction of line head (line type head) a supporting member is laminated and passes through Laser machine supply opening.Then, type element substrate is mounted on the sealing film for being provided with supply opening.

However, disclosed in U.S. Patent No. 7347534 specifications in method, in the branch for being used as type element substrate Support supply opening is processed in the sealing film of component and make type element substrate with be formed by supply opening and accordingly position Mode be mounted on sealing film on.In such configuration, from the confession of flow path and sealing film near the back side of type element substrate From the perspective of the positioning accuracy of opening, it is difficult to realize the ruler of the flow path near the back side of supply opening or type element substrate It is very little to further decrease or density further increases.

Summary of the invention

The purpose of the present invention is to provide a kind of rulers of the flow passage structure near back side that can be realized type element substrate Very little fluid ejection head, liquid discharge apparatus and the manufacturing method further decreased or density further increases.

For this purpose, according to the present invention, providing a kind of manufacturing method of following fluid ejection head, which includes Device substrate, the device substrate include: the multiple ejiction openings for spraying liquid；Each of be configured to multiple ejiction openings Ejiction opening is corresponding and generates the element of the energy for spraying liquid from ejiction opening；And supply a liquid to the supply of ejiction opening Path is used to form in adjacent adjacent to each other multiple element substrate and setting this method comprises: The lid component forming step The face for having the face of ejiction opening opposite is formed with the The lid component for the opening being connected to feed path；And cutting step, in lid structure The device substrate of multiple adjoinings is cut into chip after part forming step.

A kind of manufacturing method of fluid ejection head, the fluid ejection head include device substrate, and the device substrate includes: The ejiction opening of liquid is sprayed, is arranged to corresponding with the ejiction opening and generates the energy for spraying liquid from the ejiction opening Element and the internal pressure chamber that the element is set, which comprises preparation is provided with the ejection in device substrate The device substrate for the feed path for supplying a liquid to the pressure chamber is provided at the back side in the face of mouth；It is being arranged Membranaceous The lid component is arranged to cover the feed path in the back side for stating the device substrate of feed path；And in the lid The multiple supply openings being connected to the feed path are formed at component.

A kind of fluid ejection head comprising: device substrate, the device substrate include the ejiction opening for spraying liquid, are set The element and internal setting for being set to energy of the and generation corresponding with the ejiction opening for spraying liquid from the ejiction opening should The pressure chamber of element；And resin film, the resin film include the supply opening to pressure chamber supply liquid, wherein liquid The a part in body path is formed by the resin film, and the supply road being connected to the pressure chamber and the supply opening is arranged Diameter is less than to the profile portion of the resin film shape of the device substrate, so as not to prominent from the shape of the device substrate Out.

A kind of fluid ejection head spraying liquid comprising: device substrate, the device substrate include the spray for spraying liquid It exports, be arranged to corresponding with the ejiction opening and generate the element for the energy from ejiction opening ejection liquid and inside The pressure chamber of the element is set；And resin film, what the resin film was set to the device substrate is provided with the ejiction opening Face the back side, and the resin film include to the pressure chamber supply liquid supply opening and from the pressure chamber recycle The recycling of liquid is open, wherein the back side of the device substrate, which is provided with, is supplied to the liquid supplied from the supply opening The feed path of the pressure chamber and the recycling path that will be open from the liquids recovery that the pressure chamber recycles to the recycling, and And a part of the feed path and a part in the recycling path are formed by the resin film.

A kind of liquid discharge apparatus, with fluid ejection head, the fluid ejection head includes device substrate and resin film, The device substrate includes: the ejiction opening for spraying liquid, is arranged to and generation corresponding with the ejiction opening for from the spray Outlet sprays the element of the energy of liquid and the internal pressure chamber that the element is arranged, the resin film are arranged in the element base The back side in the face for being provided with the ejiction opening of plate and the resin film include opening to the supply of pressure chamber supply liquid Mouthful and be open from the recycling of pressure chamber's withdrawal liquid, wherein the back side of the device substrate is provided with will be from the supply The liquid of opening supply be supplied to the pressure chamber feed path and will be from the liquids recovery that the pressure chamber recycles to described The recycling path of opening is recycled, and a part in the feed path and the recycling path is formed by the resin film.

According to the present invention it is possible to realize the fluid ejection head for being able to suppress the pressure change of pressure chamber, liquid discharge apparatus And manufacturing method.

By the way that the explanation of illustrative embodiments (referring to attached drawing), other feature of the invention be will be apparent below.

Detailed description of the invention

Fig. 1 is the figure for showing the schematic configuration for the liquid discharge apparatus for spraying liquid；

Fig. 2 is the schematic diagram for showing the first circulation mode suitable for the circulating path of printing device；

Fig. 3 is the schematic diagram for showing the second circulation mode suitable for the circulating path of printing device；

Fig. 4 is the schematic diagram of the difference shown to the black influx of fluid ejection head；

Fig. 5 A is the perspective view for showing fluid ejection head；

Fig. 5 B is the perspective view for showing fluid ejection head；

Fig. 6 is the exploded perspective view for showing the component or unit that constitute fluid ejection head；

Fig. 7 be show first flow path component to third channel member front and back figure；

Fig. 8 is perspective view when from spraying module mounting surface for showing the part α of Fig. 7 (a)；

Fig. 9 is the sectional view intercepted along the line IX-IX of Fig. 8；

Figure 10 A is the perspective view for showing an ejection module；

Figure 10 B is the exploded view for showing an ejection module；

Figure 11 A is the figure for showing type element substrate；

Figure 11 B is the figure for showing type element substrate；

Figure 11 C is the figure for showing type element substrate；

Figure 12 is the perspective view for showing the section of type element substrate and The lid component；

Figure 13 is the partly enlarged top view of the adjacency section of type element substrate；

Figure 14 A is the perspective view for showing fluid ejection head；

Figure 14 B is the perspective view for showing fluid ejection head；

Figure 15 is the strabismus decomposition figure for showing fluid ejection head；

Figure 16 is the figure for showing first flow path component；

Figure 17 is the perspective view for showing the liquid connection relationship between type element substrate and channel member；

Figure 18 is the sectional view intercepted along the line XVIII-XVIII of Figure 17；

Figure 19 A is the perspective view for showing an ejection module；

Figure 19 B is the exploded view for showing an ejection module；

Figure 20 is the schematic diagram for showing type element substrate；

Figure 21 is shown by spraying liquid come the figure of the ink jet printing device of print image；

Figure 22 is the figure for showing type element substrate and The lid component；

Figure 23 A is the perspective view for showing fluid ejection head；

Figure 23 B is the perspective view for showing fluid ejection head；

Figure 23 C is the perspective view for showing fluid ejection head；

Figure 23 D is the perspective view for showing fluid ejection head；

Figure 23 E is the perspective view for showing fluid ejection head；

Figure 24 A is the figure for showing the summary that liquid sprays printing device；

Figure 24 B is the figure for showing the summary that liquid sprays printing device；

Figure 24 C is the figure for showing the flow passage structure that liquid sprays printing device；

Figure 25 is the exploded perspective view for showing liquid spray unit；

Figure 26 is the exploded perspective view for showing liquid spray unit；

Figure 27 is the figure for showing the ejiction opening Chong Die with the partial enlarged view of first flow path layer；

Figure 28 is the liquid supply path for showing second flow path layer and the sectional view in liquids recovery path；

Figure 29 is the liquid supply path for showing second flow path layer and the perspective view in liquids recovery path；

Figure 30 is the exemplary flow chart for showing the manufacturing process of fluid ejection head；

Figure 31 A is the figure for showing type element substrate；

Figure 31 B is the figure for showing type element substrate；

Figure 32 A is the sectional view intercepted along the line XXXII-XXXII of Figure 31 A；

Figure 32 B is the sectional view intercepted along the line XXXII-XXXII of Figure 31 A；

Figure 32 C is the sectional view intercepted along the line XXXII-XXXII of Figure 31 A；

Figure 32 D is the sectional view intercepted along the line XXXII-XXXII of Figure 31 A；

Figure 32 E is the sectional view intercepted along the line XXXII-XXXII of Figure 31 A；

Figure 32 F is the sectional view intercepted along the line XXXII-XXXII of Figure 31 A；

Figure 33 A is the sectional view intercepted along the line XXXII-XXXII of Figure 31 A；

Figure 33 B is the sectional view intercepted along the line XXXII-XXXII of Figure 31 A；

Figure 33 C is the sectional view intercepted along the line XXXII-XXXII of Figure 31 A；

Figure 33 D is the sectional view intercepted along the line XXXII-XXXII of Figure 31 A；

Figure 33 E is the sectional view intercepted along the line XXXII-XXXII of Figure 31 A；

Figure 34 A is the figure for showing the configuration relation between liquid supply opening and liquid supply path；

Figure 34 B is the figure for showing the configuration relation between liquid supply opening and liquid supply path；

Figure 34 C is the figure for showing the configuration relation between liquid supply opening and liquid supply path；

Figure 35 A is the chart for showing the relationship between the pressure loss and the width of supply mouth；

Figure 35 B is the chart for showing the relationship between the variation of circular flow and the spouting velocity ratio of first drop；

Figure 36 A is the figure for showing the relationship of the shape between device substrate and The lid component；

Figure 36 B is the figure for showing the relationship of the shape between device substrate and The lid component；

Figure 36 C is the figure for showing the relationship of the shape between device substrate and The lid component；

Figure 37 A is the figure for showing the position that type element substrate, liquid supply opening and liquids recovery are open；

Figure 37 B is the figure for showing the position that type element substrate, liquid supply opening and liquids recovery are open；

Figure 37 C is the figure for showing the position that type element substrate, liquid supply opening and liquids recovery are open；

Figure 37 D is the figure for showing the position that type element substrate, liquid supply opening and liquids recovery are open；

Figure 38 is the figure for showing liquid spray unit；

Figure 39 is the figure for showing liquid spray unit；

Figure 40 is the figure for showing liquid spray unit；

Figure 41 is the figure for showing liquid spray unit；

Figure 42 A is the figure for showing liquid spray unit；

Figure 42 B is the figure for showing the position of liquid supply opening and liquids recovery opening；

Figure 43 A is the chart for showing the Temperature Distribution of type element substrate when spraying liquid from all ejiction openings；

Figure 43 B is the chart for showing the Temperature Distribution of type element substrate when spraying liquid from all ejiction openings；

Figure 44 A is the chart for showing the Temperature Distribution of type element substrate；

Figure 44 B is the chart for showing the Temperature Distribution of type element substrate；

Figure 45 A is the figure for showing the variation example of shape of liquid supply opening；

Figure 45 B is the figure for showing the variation example of shape of liquid supply opening；

Figure 45 C is the figure for showing the variation example of shape of liquid supply opening；

Figure 46 A is the exemplary figure for showing the construction of the clearance portion between adjacent type element substrate；

Figure 46 B is the exemplary figure for showing the clearance portion between adjacent type element substrate；

Figure 47 A is the exemplary figure for showing the construction of the clearance portion between adjacent type element substrate；

Figure 47 B is the exemplary figure for showing the construction of the clearance portion between adjacent type element substrate；

Figure 48 A is the exemplary figure for showing the construction of the clearance portion between adjacent plate；

Figure 48 B is the exemplary figure for showing the construction of the clearance portion between adjacent plate；

Figure 49 A is the exemplary figure for showing the construction of the clearance portion between adjacent plate；

Figure 49 B is the exemplary figure for showing the construction of the clearance portion between adjacent plate；

Figure 50 is the exploded perspective view for showing liquid spray unit；

Figure 51 is the decomposition plan view for showing liquid spray unit；

Figure 52 is the figure for showing liquid spray unit；

Figure 53 is the figure for showing liquid spray unit；And

Figure 54 is the figure for showing the configuration relation between the first black flow path and the second black flow path.

Specific embodiment

Hereinafter, illustrating preferred Application Example and embodiment of the invention with reference to the accompanying drawings.Ejection of the invention is such as black Deng liquid fluid ejection head and liquid discharge apparatus including the fluid ejection head can be suitable for printer, duplicator, Facsimile machine with communication system and the word processor with printer.In addition, fluid ejection head and liquid discharge apparatus with Various processing unit combinations can be suitable for Industrial Printing equipment.For example, fluid ejection head and liquid discharge apparatus can be used in Manufacture biochip (biochip) or printing electronic circuit.

Further, since the Application Example and embodiment that will be described below are specific examples of the invention, therefore it is able to carry out Various technology limitings are carried out to example of the invention.However, Application Example and embodiment are not limited to above-mentioned Application Example, embodiment With other specific methods and modification can be carried out in purport of the invention.

(the first Application Example)

(explanation of ink jet printing device)

Fig. 1 is that the figure for the schematic configuration of liquid discharge apparatus for showing ejection liquid of the invention is particularly to show By spraying ink come the figure of the schematic configuration of the ink jet printing device (hereinafter, also referred to printing device) 1000 printed.Printing Equipment 1000 includes: supply unit 1, conveys print media 2；With line (page width formula) fluid ejection head 3, be arranged to The conveying direction of print media 2 is substantially vertical.Then, printing device 1000 is line printing equipment, by it is continuous or Ink is ejected on the print media 2 relatively moved while conveying print media 2 disconnectedly and is continuously beaten in primary pass through Watermark image.Fluid ejection head 3 includes: vacuum cavitations unit 230, the pressure (negative pressure) in control loop path；Liquid supply Unit 220 is connected to vacuum cavitations unit 230 and allows fluid in fluid supply unit 220 and vacuum cavitations unit 230 Between flow；Fluid connection 111 is used as the black supply mouth and ink outlet of fluid supply unit 220；With shell 80.It beats Print medium 2 is not limited to cut paper, can also be continuous coiled medium (roll medium).

Fluid ejection head 3 can print color image, and liquid by the ink of cyan C, magenta M, yellow Y and black K Body ejecting head 3 is fluidly connected to be used as liquid supplying member, the main liquid storage device that the feed path of liquid is supplied to fluid ejection head 3 With buffer reservoir (referring to Fig. 2 described later on).In addition, being supplied electric power to fluid ejection head 3 and transmitting ejection control signal Control unit be electrically connected to fluid ejection head 3.By the liquid path and electrical signal path in fluid ejection head 3 described later on.

Printing device 1000 is to recycle the liquid of ink etc. between liquid storage device and fluid ejection head 3 described later on Ink jet printing device.Circulation pattern includes: first circulation mode, and in first circulation mode, liquid is sprayed by being located at liquid Lift one's head 3 downstream side two circulating pumps (for high pressure and low pressure) starting and recycle；With second circulation mode, followed second In ring mode, liquid passes through the starting of two circulating pumps (being used for high pressure and low pressure) positioned at the upstream side of fluid ejection head 3 Circulation.Hereinafter, the first circulation mode and second circulation mode that will illustrate circulation.

(explanation of first circulation mode)

Fig. 2 is the signal for showing the first circulation mode suitable for the circulating path of the printing device 1000 of this Application Example Figure.Fluid ejection head 3 is fluidly connected to first circulation pump (high-pressure side) 1001, first circulation pump (low-pressure side) 1002 and buffering storage Liquid device 1003.In addition, to simplify the explanation, being shown for one of cyan C, magenta M, yellow Y and black K in Fig. 2 The path that the ink of color flows through.However, in fact, following there are four types of color is arranged in fluid ejection head 3 and printing device main body Endless path.

In first circulation mode, the ink in main liquid storage device 1006 is supplied to by buffer reservoir by make-up pump 1005 In 1003, then ink is set to pass through fluid supply unit of the fluid connection 111 to fluid ejection head 3 by second circulation pump 1004 220 supplies.Then, two different negative pressure are adjusted in the vacuum cavitations unit 230 by being connected to fluid supply unit 220 While the ink of (high pressure and low pressure) is divided into two flow paths with high pressure and low pressure, recycle the ink.In fluid ejection head 3 Ink by be located at fluid ejection head 3 downstream side first circulation pump (high-pressure side) 1001 and first circulation pump (low-pressure side) 1002 act in fluid ejection head recycles, passes through fluid connection 111 from the discharge of fluid ejection head 3 and return to buffering storage Liquid device 1003.

Buffer reservoir 1003 as secondary liquid storage device is connected to main liquid storage device 1006 and (does not show including atmosphere connection port Out), so that the inside of liquid storage device is connected to outside, it is thus possible to which the bubble in ink to be discharged to the outside.Make-up pump 1005 is arranged Between buffer reservoir 1003 and main liquid storage device 1006.In ink due to being sprayed in printing operation and suction recycling movement from liquid 3 ejiction opening of lifting one's head sprays (discharge) after being consumed ink, and Mo Congzhu liquid storage device 1006 is transmitted to slow by make-up pump 1005 Rush liquid storage device 1003.

Two first circulations pump 1001 and 1,002 111 sucking liquids of fluid connection from fluid ejection head 3, so that liquid Flow to buffer reservoir 1003.It is pumped as first circulation, the positive displacement pump with quantitative liquid transfer capability is desired.Specifically Ground can exemplify tube pump, gear pump, diaphragm pump and syringe pump.However, for example, can arrange routine in the exit of pump The safety valve of permanent flow valve or routine, to ensure predetermined amount of flow (rate).When fluid ejection head 3 is driven, first circulation pump is (high Press side) 1001 and first circulation pump (low-pressure side) 1002 act so that ink with predetermined amount of flow flow through common feed flow path 211 and altogether With recycling flow path 212.Since ink flows in this way, so the temperature of fluid ejection head 3 is maintained at during printing operation Optimum temperature.Predetermined amount of flow when fluid ejection head 3 is driven is set equal to or is higher than such as down-off with being expected to: at this Under flow, the temperature difference between type element substrate 10 in fluid ejection head 3 does not influence print quality.

Especially, when setting excessively high flow, the Negative Pressure Difference between type element substrate 10 can be because of liquid spray unit The influence of the pressure loss of flow path in 300 and increase, thus lead to uneven concentration.For this reason, it may be desirable to consider type element Temperature difference and Negative Pressure Difference between substrate 10 and set flow.

Vacuum cavitations unit 230 is arranged in the path between second circulation pump 1004 and liquid spray unit 300.Negative pressure Control unit 230 be manipulated into even if when ink flow change in the circulatory system because of the difference of per unit area spray volume when, Also the pressure (that is, pressure near liquid spray unit 300) in the downstream side of vacuum cavitations unit 230 is maintained into pre- level pressure Power.As two negative pressure controls for constituting vacuum cavitations unit 230, any mechanism can be used, as long as can be by negative pressure The pressure control in the downstream side of control unit 230 is in the preset range for deviateing expectation setting pressure or smaller.

As an example, can be using the mechanism of so-called " pressure reducing regulator " etc..In the circulation stream of this Application Example In, the upstream side of vacuum cavitations unit 230 is by fluid supply unit 220 by 1004 pressurization of second circulation pump.Utilize the structure It makes, due to being able to suppress influence of the buffer reservoir 1003 relative to the head pressure of fluid ejection head 3, is beaten so can widen The freedom degree of the layout of the buffer reservoir 1003 of printing apparatus 1000.

As second circulation pump 1004, it is able to use turbine pump or positive displacement pump, as long as pre- when fluid ejection head 3 is driven Determining head pressure (head pressure) or bigger pressure can be presented in the range of used black circular flow.Tool Body, it is able to use diaphragm pump.In addition, for example, can also use be arranged to relative to vacuum cavitations unit 230 have it is certain Head difference head liquid storage device replace second circulation pump 1004.As shown in Fig. 2, vacuum cavitations unit 230 includes being respectively provided with Two negative pressure regulating mechanisms of difference control pressure.In two negative pressure regulating mechanisms, " H " table (is used in relatively high pressure side in Fig. 2 Show) and relatively low pressure side (in Fig. 2 with " L " indicate) liquid spray unit 300 is connected to by fluid supply unit 220 respectively Interior common feed flow path 211 and shared recycling flow path 212.

Liquid spray unit 300 be provided with common feed flow path 211, share recycling flow path 212 and with type element substrate The independent flow path 215 (being independently supplied flow path 213 and independent recycling flow path 214) of connection.Negative pressure control H is connected to shared confession To flow path 211, negative pressure control L, which is connected to, shares recycling flow path 212, and forms pressure difference between two common flow paths. Then, due to independent flow path 215 and shared supply line 211 and share recycling flow path 212 and be connected to, thus generate as it is dirty (by The stream that the arrow direction of Fig. 2 indicates): a part of liquid is passed through the flow path in type element substrate 10 from common feed Flow path 211 is flowed to shared recycling flow path 212.

In this way, liquid spray unit 300 has as flowed down: when liquid is flowed to pass through common feed flow path 211 When with shared recycling flow path 212, a part of liquid passes through type element substrate 10.For this purpose, can be by flowing through common feed The heat generated by type element substrate 10 is discharged to type element substrate 10 by flow path 211 and the ink for sharing recycling flow path 212 It is external.Using the construction, even if in the pressure chamber or the ejiction opening that do not spray liquid when passing through 3 print image of fluid ejection head In, it can also generate the stream of ink.Therefore, the change of ink can be inhibited in a manner of the viscosity of the ink of retrogradation in ejiction opening to reduce It is thick.Furthermore it is possible to the foreign matter in retrogradation is discharged towards shared recycling flow path 212 ink or ink.For this purpose, the liquid of this Application Example sprays Lift one's head 3 can with high speed print high quality image.

(explanation of second circulation mode)

Fig. 3 be show suitable for the circulating path of the printing device of this Application Example as different from first circulation mode Circulation pattern second circulation mode schematic diagram.It is with the main distinction of first circulation mode, constitutes vacuum cavitations list The pressure control of the upstream side of vacuum cavitations unit 230 is being deviateed expectation setting pressure by two negative pressure controls of member 230 In the preset range of power.In addition, with first circulation mode another difference is that, second circulation pump 1004 be used as reduce negative pressure control The negative pressure source of the pressure in the downstream side of unit 230 processed.In addition, also a difference is that first circulation pumps (high-pressure side) 1001 and the The upstream side of fluid ejection head 3 is arranged in one circulating pump (low-pressure side) 1002, and vacuum cavitations unit 230 is arranged in fluid ejection head 3 downstream side.

In second circulation mode, the ink in main liquid storage device 1006 is supplied to by buffer reservoir by make-up pump 1005 1003.Then, ink is divided by two flow paths by the effect for the vacuum cavitations unit 230 being arranged in fluid ejection head 3, and Recycle ink in two flow paths for being located at high-pressure side and low-pressure side.(high-pressure side) 1001 and first circulation are pumped by first circulation The effect for pumping (low-pressure side) 1002, the ink being divided into two flow paths of high-pressure side and low-pressure side pass through fluid connection 111 supply to fluid ejection head 3.Then, make to pump (high-pressure side) 1001 and the by first circulation by vacuum cavitations unit 230 The effect of one circulating pump (low-pressure side) 1002 and the ink that recycles in fluid ejection head passes through fluid connection 111 and sprays from liquid First 3 discharge.Make the ink of discharge back to buffer reservoir 1003 by second circulation pump 1004.

In second circulation mode, even if when flow changes because of the variation of per unit area spray volume, vacuum cavitations Unit 230 can also be such that the pressure change stabilization of the upstream side (that is, liquid spray unit 300) of vacuum cavitations unit 230 is deviateing In the preset range of predetermined pressure.In the circulation stream of this Application Example, the downstream side of vacuum cavitations unit 230 is supplied by liquid To unit 220 by 1004 pressurization of second circulation pump.Using the construction, due to being able to suppress buffer reservoir 1003 relative to liquid The influence of the head pressure of body ejecting head 3, so layout of the buffer reservoir 1003 in printing device 1000 can have perhaps More options.

For example, the head liquid storage for being arranged to and there is predetermined head difference relative to vacuum cavitations unit 230 can also be used Device replaces second circulation pump 1004.Same as first circulation mode, in second circulation mode, vacuum cavitations unit 230 includes It is respectively provided with two negative pressure controls of different control pressure.In two negative pressure regulating mechanisms, high-pressure side (is used in Fig. 3 " H " is indicated) and low-pressure side (in Fig. 3 with " L " expression) pass through fluid supply unit 220 respectively and be connected to liquid spray unit Common feed flow path 211 or shared recycling flow path 212 in 300.When by two negative pressure regulating mechanisms by common feed flow path When 211 pressure is set higher than the pressure for sharing recycling flow path 212, is formed from common feed flow path 211 and pass through independent flow path 215 and the flow path that is formed in type element substrate 10 to sharing the stream for recycling the liquid of flow path 212.

In the second circulation mode, liquid identical with first circulation mode can be obtained in liquid spray unit 300 Body stream, but have the advantages that two different from first circulation mode.As the first advantage, in second circulation mode, due to Vacuum cavitations unit 230 is arranged in the downstream side of fluid ejection head 3, so what seldom worry was generated by vacuum cavitations unit 230 Foreign matter or waste can influent ejecting heads 3.As the second advantage, in second circulation mode, liquid is from buffer reservoir 1003 are less than the maximum value of first circulation mode to the maximum value of flow necessary to fluid ejection head 3.The reason is as follows that.

In the case where the circulation in printing standby mode, by common feed flow path 211 and recycling flow path 212 is shared Flow and it is set as flow A.The value of flow A is defined as minimum discharge: being sprayed to liquid is adjusted in the case where printing standby mode 3 temperature of lifting one's head makes the temperature difference in liquid spray unit 300 fall in necessary minimum discharge in expected range.In addition, The ejection flow obtained when spraying black (spraying state entirely) from all ejiction openings of liquid spray unit 300 is defined as flow F (each ejiction opening spray volume × ejection frequency × ejiction opening quantity) per unit time.

Fig. 4 is the difference for showing the black influx to fluid ejection head 3 between first circulation mode and second circulation mode Different schematic diagram.The part (a) of Fig. 4 shows the standby mode in first circulation mode, and the part (b) of Fig. 4 shows first circulation Full ejection state in mode.The part (c) of Fig. 4 to part (f) shows second circulation flow path.Here, the part (c) of Fig. 4 and Partially (d) shows the case where flow F is lower than flow A, and the part (e) and part (f) of Fig. 4 shows the feelings that flow F is higher than flow A Condition.In this way, the flow under standby mode and full ejection state is shown.

Liquid spray is arranged in the first circulation pump 1001 and first circulation pump 1002 for all having quantitative liquid transfer capability Lift one's head 3 downstream sides first circulation mode the case where (part (a) of Fig. 4 and part (b)) under, first circulation pump 1001 and first The total flow of circulating pump 1002 is flow A.By flow A, can manage in liquid spray unit 300 in the standby state Temperature.Then, in the case where the full ejection state of fluid ejection head 3, first circulation pump 1001 and first circulation pump 1002 Total flow is flow A.However, the maximum stream flow for being supplied to the liquid of fluid ejection head 3 obtains as follows: by by The effect for the negative pressure that the ejection of fluid ejection head 3 generates, the full flow F for spraying consumption are added with the flow A of total flow.Thus, Since flow F is added (part (b) of Fig. 4) with flow A, so that the maximum value of supply amount of fluid ejection head 3 meets flow A The relationship of+flow F.

Meanwhile the second of the upstream side of fluid ejection head 3 is arranged in first circulation pump 1001 and first circulation pump 1002 It is same as first circulation mode under the case where circulation pattern (part (c) of Fig. 4 to part (f)), it must to printing standby mode The supply amount to fluid ejection head 3 needed is flow A.Thus, when in 1002 arrangement of first circulation pump 1001 and first circulation pump When flow A is higher than (part (c) and part (d) of Fig. 4) flow F in the second circulation mode of the upstream side of fluid ejection head 3, Even if being sufficient in full ejection state down toward the supply amount of fluid ejection head 3 for flow A.At this point, the discharge of fluid ejection head 3 Flow meets the relationship (part (d) of Fig. 4) of flow A- flow F.

However, when flow F is higher than (part (e) of Fig. 4 and the part (f)) flow A, when being supplied under full ejection state Flow can be insufficient when the flow of the liquid of fluid ejection head 3 is flow A.For this purpose, needing near liquid when flow F is higher than flow A The supply amount of body ejecting head 3 is set as flow F.At this point, due to the meeting of fluid ejection head 3 consumed flow F, institute under full ejection state The flow of liquid to be discharged from fluid ejection head 3 is almost nil (part (f) of Fig. 4).In addition, if when flow F is higher than stream Liquid is then discharged from fluid ejection head 3 not to spray state ejection entirely and subtracts the liquid measured consumed by ejection by flow F when measuring A Body.In addition, when flow A and flow F are equal to each other, to 3 supply flow rate A (or flow F) of fluid ejection head, fluid ejection head 3 Consumed flow F.For this purpose, the flow being discharged from fluid ejection head 3 is almost nil.

In this way, in the case where second circulation mode, first circulation pump 1001 and first circulation pump 1002 are set The aggregate value of fixed flow, the maximum value of i.e. necessary supply flow rate are the big value in flow A and flow F.As long as this purpose, using tool There is the liquid spray unit 300 of same structure, then to maximum value (flow A or the stream of supply amount necessary to second circulation mode Measure F) less than the maximum value (flow A+ flow F) to supply flow rate necessary to first circulation mode.

For this purpose, improving the freedom degree of circulating pump applicatory in the case where second circulation mode.For example, can make With the circulating pump with simple structure and low cost, or the cooler (not shown) being arranged in main body side path can be reduced Load.The advantages of accordingly, there exist the costs that can reduce printing device.In the row of flow A or flow F with relatively large value In formula head, which is significant.Therefore, in line head, it is beneficial for having the line head of long length direction length.

Meanwhile first circulation mode is more advantageous than second circulation mode.That is, in second circulation mode, due to printing to The maximum flow of the liquid of liquid spray unit 300 is flowed through under machine state, so as image is (hereinafter, also referred to low duty ratio Image (low-duty image)) per unit area spray volume it is smaller and smaller, to ejiction opening apply negative pressure it is higher and higher.For This applies ejiction opening in the low duty ratio image for being easy to appear inhomogeneities high negative when flow path width is narrow and negative pressure is high Pressure.Therefore, worry along with the quantity of so-called satellite droplet (satellite droplet) sprayed together with the main drop of ink Increase, print quality may deteriorate.

Meanwhile in the case where first circulation mode, due to having the image of big per unit area spray volume when formation High negative pressure is applied to ejiction opening when (hereinafter, also referred to high duty ratio image), so even if also depositing when generating many satellite droplets In the small advantage of influence of the satellite droplet to image.It can be in the specification (discharging jet for considering fluid ejection head and printing device main body Flow path resistance in amount F, minimal circulation flow A and head) in the case where desirably select two kinds of circulation patterns.

(explanation of the construction of fluid ejection head)

By explanation according to the construction of the fluid ejection head 3 of the first Application Example.Fig. 5 A and Fig. 5 B are to show according to this application example Fluid ejection head 3 perspective view.Fluid ejection head 3 is line fluid ejection head, wherein on a type element substrate 10 In series configuration (linear configurations) can spray cyan C, magenta M, four kinds of colors of yellow Y and black K ink 15 beat Printing elements substrate 10.As shown in Figure 5A, fluid ejection head 3 includes type element substrate 10, signal input terminal 91 and feeder ear Son 92, signal input terminal 91 and power supply terminal 92 pass through flexible circuit board 40 and electrical wiring substrate 90 and type element substrate 10 It is electrically connected to each other, electrical wiring substrate 90 can be to 10 supply of electrical energy of type element substrate.

Signal input terminal 91 and power supply terminal 92 are electrically connected to the control unit of printing device 1000, so as to first to printing The supply of part substrate 10 sprays driving signal and electric power necessary to spraying.Match when having by the circuit integration in electrical wiring substrate 90 When line, the quantity of signal input terminal 91 and power supply terminal 92 can be fewer than the quantity of type element substrate 10.Therefore, reduce The quantity of electric connecting part to be separated when fluid ejection head 3 to be assembled into printing device 1000 or replace fluid ejection head.

As shown in Figure 5 B, the fluid connection 111 that the both ends of fluid ejection head 3 are arranged in is connected to printing device 1000 Liquid-supplying system.Therefore, from the feed system of printing device 1000 to fluid ejection head 3 supply include cyan C, magenta M, The ink of four kinds of colors of yellow Y and black K, and recycled by the feed system of printing device 1000 across fluid ejection head 3 Ink.It is followed in this way it is possible to which the ink of different colours is made to pass through the path of printing device 1000 and the path of fluid ejection head 3 Ring.

Fig. 6 is the exploded perspective view for showing the component or unit that constitute fluid ejection head 3.Liquid spray unit 300, liquid Feed unit 220 and electrical wiring substrate 90 are attached to shell 80.Fluid connection 111 (referring to Fig. 3) setting supplies single in liquid In member 220.In addition, setting is for different colours in fluid supply unit 220 in order to remove the foreign matter in supplied ink Filter 221 (referring to figs. 2 and 3), while the open communication of filter 221 and interconnecting piece 111.Correspond respectively to two kinds of colors Two fluid supply units 220 be provided with filter 221.It is fed into across the liquid of filter 221 and is arranged in liquid The vacuum cavitations unit 230 of feed unit 220, fluid supply unit 220 are arranged to correspond to each color.

Vacuum cavitations unit 230 be include different colours negative pressure control valve unit.Pass through the spring being disposed therein The function of component or valve significantly reduces the feed system (position of the printing device 1000 as caused by the variation of the flow of liquid Feed system in the upstream side of fluid ejection head 3) in the pressure loss variation.Therefore, vacuum cavitations unit 230 can make Negative pressure variation positioned at the downstream side (300 side of liquid spray unit) of vacuum cavitations unit 230 is stablized within a predetermined range.Such as figure Shown in 2, vacuum cavitations unit 230 is built-in with two negative pressure control valves of different colours.Two negative pressure control valves are individually set For different control pressure.Here, the shared confession in high-pressure side and liquid spray unit 300 is made by fluid supply unit 220 It is connected to flow path 211 (referring to fig. 2) and is connected to low-pressure side with recycling flow path 212 (referring to fig. 2) is shared.

Shell 80 includes liquid spray unit support portion 81 and electrical wiring substrate support 82, and shell 80 is in support liquid Ensure the rigidity of fluid ejection head 3 while body spray unit 300 and electrical wiring substrate 90.Electrical wiring substrate support 82 is used for It supports electrical wiring substrate 90 and liquid spray unit support portion 81 is fixed to by screw.Liquid spray unit support portion 81 is used for The warpage or deformation of liquid spray unit 300 are corrected, to ensure the relative positional accuracy between type element substrate 10.Therefore, Inhibit the striped and inhomogeneities of print media.

For this reason, it may be desirable to which liquid spray unit support portion 81 has enough rigidity.As material, be contemplated to be such as SUS or The ceramics of the metal or aluminium oxide of aluminium etc. etc..Liquid spray unit support portion 81 is provided with to be inserted into for connector rubber 100 Opening 83 and 84.The liquid supplied from fluid supply unit 220 passes through connector rubber and is directed into composition liquid spray unit 300 third channel member 70.

Liquid spray unit 300 includes multiple ejection modules 200 and channel member 210, and cover component 130 is attached to liquid spray The face being located near print media in unit 300 out.Here, cover component 130 be it is as shown in FIG. 6 have phase frame-shaped surface and It is provided with the component of elongated opening 131, and including spraying type element substrate 10 and containment member 110 in module 200 (referring to Figure 10 A described later on) exposes from opening 131.The periphery frame portion of opening 131 is used as to be covered in the case where printing standby mode The contact surface of the cover component of fluid ejection head 3.For this reason, it may be desirable to pass through periphery coating adhesive, sealing material along opening 131 Bumps in ejection port face or gap with packing material to fill liquid spray unit 300, to be formed under the state of covering Enclosure space.

Next, including the construction of channel member 210 in liquid spray unit 300 by explanation.As shown in fig. 6, stream Road component 210 is obtained by stacking first flow path component 50, second flow path component 60 and third channel member 70, and flow path Component 210 distributes the liquid supplied from fluid supply unit 220 to module 200 is sprayed.In addition, channel member 210 is made from spray The liquid that module 200 recycles out returns to the channel member of fluid supply unit 220.Channel member 210 is fixed by screw To liquid spray unit support portion 81, thus inhibit the warpage or deformation of channel member 210.

The part (a) of Fig. 7 to part (f) is the front and back for showing first flow path component to third channel member Figure.The part (a) of Fig. 7 shows the face installed for spraying module 200 in first flow path component 50, and the part (f) of Fig. 7 is shown The face contacted for liquid spray unit support portion 81 in third channel member 70.First flow path component 50 and second flow path structure Part 60 is so that the part of the contact surface shown in the part (b) and part (c) of Fig. 7 and corresponding to channel member is facing with each other Mode is engaged with each other, and second flow path component and third channel member are so that shown in the part (d) and part (e) of Fig. 7 and right Mode that should be facing with each other in the part of the contact surface of channel member is engaged with each other.When second flow path component 60 and third flow path structure When part 70 is engaged with each other, eight of the length direction extension along channel member are formed by the common flow path slot 62 and 71 of channel member A common flow path (211a, 211b, 211c, 211d, 212a, 212b, 212c, 212d).

Therefore, the group of common feed flow path 211 and shared recycling flow path 212 is formed in flow path structure corresponding to each color In part 210.Ink is supplied from common feed flow path 211 to fluid ejection head 3, and by sharing the recycling recycling supply of flow path 212 To the ink of fluid ejection head 3.The hole of communication port 72 (referring to the part (f) of Fig. 7) and connector rubber 100 of third channel member 70 Connection, and the communication port 72 is fluidly connected to fluid supply unit 220 (referring to Fig. 6).The shared stream of second flow path component 60 The bottom surface of road slot 62 be provided with multiple communication ports 61 (the communication port 61-1 that is connected to shared supply line 211 and with shared recycling The communication port 61-2 that flow path 212 is connected to) and be connected to one end of the independent flow passage groove 52 of first flow path component 50.First flow path structure The other end of the independent flow passage groove 52 of part 50 is provided with communication port 51, and is fluidly connected to spray module by communication port 51 200.By independent flow passage groove 52, the center side of channel member can be densely arranged in flow path.

It is expected that first flow path component to third channel member by with the corrosion resistance relative to liquid and have low line it is swollen The material of swollen coefficient is formed.For example, can be suitably used by by the inorganic filler of fiber or silicon dioxide microparticle etc. It is added to aluminium oxide, LCP (liquid crystal polymer), PPS (polyphenylene sulfide), PSF (polysulfones) or MODIFIED PP E (polyphenylene oxide) etc. Substrate and the composite material (resin) that obtains are as material.Three channel members can be made to be stacked on one another bonding as forming flow path The method of component 210.When selecting resin composite materials as material, the joint method using welding can be used.

Fig. 8 is enlarged fragmentary perspective when from the face for spraying the installation of module 200 in first flow path component 50 Figure, which shows the part α of the part (a) of Fig. 7, and shows by making first flow path component to the Three channel members are engaged with each other and the flow path in the channel member 210 that is formed.So that common feed flow path 211 and shared recycling Flow path 212 forms common feed flow path 211 from the mode that the flow path at both ends is alternately arranged and shares recycling flow path 212.Here, It will illustrate the connection relationship between the flow path in channel member 210.

Channel member 210 be provided with along fluid ejection head 3 length direction extension common feed flow path 211 (211a, 211b, 211c, 211d) and share recycling flow path 212 (212a, 212b, 212c, 212d) and be arranged for each color.By What independent flow passage groove 52 was formed, which be independently supplied flow path 213 (213a, 213b, 213c, 213d), is connected to difference by communication port 61 The common feed flow path 211 of color.In addition, formed by independent flow passage groove 52 independent recycling flow path 214 (214a, 214b, 214c, 214d) the shared recycling flow path 212 of different colours is connected to by communication port 61.Using the flow path configuration, ink can be made The type element for being independently supplied 213 concentrated supply of flow path to the central portion for being located at channel member is passed through from common feed flow path 211 Substrate 10.It is recycled furthermore it is possible to pass through independent recycling flow path 214 from type element substrate 10 and reach shared recycling 212 ground of flow path Ink.

Fig. 9 is the sectional view intercepted along the line IX-IX of Fig. 8.Independent recycling flow path (214a, 214c) passes through communication port 51 It is connected to module 200 is sprayed.In Fig. 9, independent recycling flow path (214a, 214c) is illustrated only, but in different cross sections In, it communicates with each other as shown in figure 8, being independently supplied flow path 213 and spraying module 200.Including the support in each ejection module 200 Component 30 and type element substrate 10 are provided with following flow path: ink is supplied to setting from first flow path component 50 and beaten by the flow path Type element 15 in printing elements substrate 10.In addition, supporting member 30 and type element substrate 10 are provided with following flow path: the stream Road is fed into some or all of liquid of type element 15 recycling (recycling) to first flow path component 50.

Here, the common feed flow path 211 of each color is connected to the negative pressure control of corresponding color by fluid supply unit 220 Unit 230 (high-pressure side) processed, sharing recycling flow path 212, to be connected to vacuum cavitations unit 230 (low by fluid supply unit 220 Press side).By vacuum cavitations unit 230, in common feed flow path 211 and generation pressure difference (pressure between recycling flow path 212 is shared Difference).For this purpose, as shown in Figure 8 and Figure 9, in the fluid ejection head of this Application Example with the flow path being connected to each other, with each color Common feed flow path 211, be independently supplied flow path 213, type element substrate 10, independent recycling flow path 214 and share recycling stream The sequence on road 212 generates stream.

(explanation for spraying module)

Figure 10 A is the perspective view for showing an ejection module 200, and Figure 10 B is the exploded view of the ejection module 200.As The method that manufacture sprays module 200, firstly, type element substrate 10 and flexible circuit board 40 to be adhered to and be provided with fluid connection On the supporting member 30 of mouth 31.Then, by making wire bonding by the terminal 16 and flexible circuit board on type element substrate 10 Terminal 41 on 40 is electrically connected to each other, and passes through 110 sealing wire joint portion (electrical connection section) of containment member.

The terminal 42 opposite with type element substrate 10 of flexible circuit board 40 is electrically connected to the connection of electrical wiring substrate 90 Terminal 93 (referring to Fig. 6).Since supporting member 30 is used as the supporter of support type element substrate 10 and makes type element substrate 10 channel members being in fluid communication with each other with channel member 210, it is desirable to supporting members to be engaged to type element substrate When with high flatness and sufficiently high reliability.For example, it is desirable to which aluminium oxide or resin are as material.

(explanation of the structure of type element substrate)

Figure 11 A is the top view for showing the face for being provided with ejiction opening 13 in type element substrate 10, and Figure 11 B is figure The enlarged drawing of the part A of 11A, Figure 11 C are the top views for showing the back side of Figure 11 A.Here, it will illustrate the printing member of this Application Example The construction of part substrate 10.As shown in Figure 11 A, the ejiction opening of type element substrate 10 forms component 12 and is provided with corresponding to different face The four column ejiction openings column of the ink of color.In addition, the extending direction that the ejiction opening of ejiction opening 13 is arranged is referred to as " ejiction opening column direction ".Such as Shown in Figure 11 B, the setting of type element 15 as the ejection energy generating element for spraying liquid by thermal energy is corresponding to respectively At the position of ejiction opening 13.The pressure chamber 23 being arranged in type element 15 is divided by partition wall 22.

Type element 15 passes through the electric wire (not shown) being arranged in type element substrate 10 and is electrically connected to terminal 16.In Be, based on via electrical wiring substrate 90 (referring to Fig. 6) and flexible circuit board 40 (referring to Figure 10 B) from the control of printing device 1000 The pulse signal of circuit input, type element 15 make liquid boiling while being heated.Liquid passes through the hair by boiling generation Power is steeped to spray from ejiction opening 13.As shown in Figure 11 B, liquid supply path 18 is listed in side along each ejiction opening and extends, and liquid returns It receives path 19 and is listed in other side extension along the ejiction opening.Liquid supply path 18 and liquids recovery path 19 are being beaten along setting The flow path that ejiction opening column direction in printing elements substrate 10 extends, and pass through supply mouth 17a and recovery port 17b and ejiction opening 13 Connection.

As shown in Figure 11 C, the The lid component (resin film) 20 of sheet made of resin material is layered in type element substrate On the back side in the face for being provided with ejiction opening 13 in 10, and The lid component 20 is provided with and liquid supply path 18 and liquids recovery Multiple openings 21 that path 19 is connected to.In this application example, The lid component 20 is provided with for as along type element substrate 10 Three of each liquid supply path 18 openings 21 of common flow path that extend of length direction and for as along type element Two openings 21 in each liquids recovery path 19 in the shared recycling path that the length direction of substrate 10 extends.In the present invention, The quantity of opening 21 is without being limited thereto.For example, the two of the liquid supply path that can be configured in liquid supply path 18 A supply side opening 21 and a recycling side opening 21 for a liquids recovery path in liquids recovery path 19.Consider The pressure loss into flow path portion, it is preferred that be at least arranged in liquid supply path 18 or in liquids recovery path 19 Two or more openings.

As shown in Figure 11 B, the opening 21 of The lid component 20 is connected to communication port 51 shown in the part (a) of Fig. 7.

It is expected that The lid component 20 has enough corrosion resistances for liquid.From the viewpoint of preventing colour mixture, it is open 21 Opening shape and aperture position need to have high-precision.For this reason, it may be desirable to by using photoresist material or silicon plate as lid The material of component 20 simultaneously forms opening 21 using photoetching process.In this way, The lid component 20 changes flow path by opening 21 Pitch.Here, it is contemplated that the pressure loss is expected that by the photosensitive resin film with thin thickness and forms The lid component 20.

Figure 12 is the cutting when the line XII-XII interception along Figure 11 A for showing type element substrate 10 and The lid component 20 The perspective view in face.Here, it will illustrate flowing of the liquid in type element substrate 10.The lid component 20 is used as in type element substrate The lid of a part of the wall in liquid supply path 18 and liquids recovery path 19 is formed in 10 substrate 11.Type element substrate 10 It is formed by the way that the substrate 11 formed by Si is laminated and forms component 12 by the ejiction opening that photoresist is formed, The lid component 20 connects Close the back side of substrate 11.One face of substrate 11 is provided with type element 15 (referring to Figure 11 B), and the back side of substrate 11 is provided with Form the slot of the liquid supply path 18 and liquids recovery path 19 that extend along ejiction opening column.

The liquid supply path 18 and liquids recovery path 19 formed by substrate 11 and The lid component 20 is connected respectively to each stream Common feed flow path 211 and shared recycling flow path 212 in road component 210, and in liquid supply path 18 and liquids recovery Pressure difference is generated between path 19.When liquid is sprayed from ejiction opening 13 with print image, lead at the ejiction opening for not spraying liquid The liquid inside the liquid supply path 18 in substrate 11 is arranged in across supply mouth 17a, pressure chamber 23 and recycling in over-voltage official post Mouth 17b flows (referring to the arrow C of Figure 12) towards liquids recovery path 19.By the flowing, liquids recovery path can be passed through 19 recycling are not related to the retrogradation of printing operation generated and evaporating from ejiction opening 13 in ejiction opening 13 or pressure chamber 23 Ink, foreign matter and bubble.Furthermore it is possible to inhibit the retrogradation of the ink of ejiction opening 13 or pressure chamber 23.

The liquid for being recovered to liquids recovery path 19 passes through the opening 21 of The lid component 20 and the fluid connection of supporting member 30 31 (referring to Figure 10 B) of mouth are with the communication port 51 (referring to the part (a) of Fig. 7) in channel member 210, independent recycling 214 and of flow path The sequence for sharing recycling flow path 212 is recovered.Then, pass through the recycling path withdrawal liquid of printing device 1000.That is, from printing Equipment body is flowed in the following order to the liquid that fluid ejection head 3 supplies to be supplied to and recycle.

Firstly, fluid connection 111 influent ejecting head 3 of the liquid from fluid supply unit 220.Then, liquid according to It is secondary to pass through connector rubber 100, the communication port 72 being arranged in third channel member and common flow path slot 71, be arranged in second flow path Common flow path slot 62 and communication port 61 in component and independent flow passage groove 52 and the communication port being arranged in first flow path component 51 are supplied to.Then, liquid is sequentially passing through the fluid connection mouth 31 being arranged in supporting member 30, is being arranged in The lid component 20 Opening 21 and the liquid supply path 18 and supply mouth 17a that are arranged in substrate 11 in the case where be fed into pressure chamber 23。

In the liquid for being supplied to pressure chamber 23, does not flow successively through and be arranged in substrate 11 from the liquid that ejiction opening 13 sprays Recovery port 17b and liquids recovery path 19, the opening 21 being arranged in The lid component 20 and the liquid being arranged in supporting member 30 Body communication port 31.Then, liquid flows successively through the communication port 51 being arranged in first flow path component and independent flow passage groove 52, setting In the communication port 61 and common flow path slot 62, the common flow path slot 71 that is arranged in third channel member 70 in second flow path component With communication port 72 and connector rubber 100.Then, liquid from the fluid connection 111 being arranged in fluid supply unit 220 to The flows outside of fluid ejection head 3.

In first circulation mode shown in Fig. 2, the liquid flowed out from fluid connection 111 passes through vacuum cavitations unit 230 supply to connector rubber 100.In addition, the liquid recycled from pressure chamber 23 passes through in second circulation mode shown in Fig. 3 Connector rubber 100, and pass through flows outside of the vacuum cavitations unit 230 from fluid connection 111 to fluid ejection head.From liquid The common feed flow path 211 of body spray unit 300 one end outflow whole liquid be not passed through be independently supplied flow path 213a to Pressure chamber 23 supplies.

That is, liquid can be flowed from the other end of common feed flow path 211 to fluid supply unit 220, and from shared confession It is not flowed into the liquid that one end of flow path 211 is flowed out and is independently supplied flow path 213a.In this way, since path is configured to make Liquid flows through the path in the case where being not passed through type element substrate 10, so even if in such as this Application Example include have In the type element substrate 10 of the big flow path of small flow resistance, it is also able to suppress the adverse current of the recycle stream of liquid.In this way, due to The retrogradation of the liquid near ejiction opening or pressure chamber 23 is able to suppress in the fluid ejection head 3 of this Application Example, so can press down System sliding does not spray.As a result, it is possible to print the image of high-quality.

(explanation of the positional relationship between type element substrate)

Figure 13 is the partly enlarged top view for showing two adjacent adjacency sections for spraying the type element substrate in module.? In this Application Example, the type element substrate of substantially parallel quadrangle is used.Among each parallelogram, as shown in figure 13, by The angle that the side to adjoin each other is formed is that the parallelogram of non-90 degree is particularly applicable in.Row in each type element substrate 10 Show ejiction opening 13 ejiction opening column (14a to 14d) be configured to have relative to fluid ejection head 3 length direction it is pre- Determine to tilt while angle.Then, the ejiction opening column at the adjacency section between type element substrate 10 are formed so that at least one A ejiction opening is overlapped on print media conveying direction.As shown in figure 13, two ejiction openings on line D overlap each other.

Using the configuration, even if when the position of type element substrate 10 is offset slightly from predetermined position, by making ejiction opening The drive control of overlapping can not see the black streaking or missing of print image.Even if when type element substrate 10 is with rectilinear form It, also can be by construction shown in Figure 13 in the printing for inhibiting fluid ejection head 3 when (linearity configuration) rather than meander-shaped configure The black streaking or missing at interconnecting piece while length on medium conveying direction increases between reply type element substrate 10. In addition, in this application example, the principal plane of type element substrate has parallelogram shape, and but the invention is not restricted to this. For example, even if also can desirably make when using having rectangular shape, trapezoidal shape and other shapes of type element substrate With construction of the invention.

(the second Application Example)

Hereinafter, illustrating that the ink jet printing device 2000 of the second Application Example according to the present invention and liquid spray with reference to the accompanying drawings First 2003 construction.In the following description, it will only illustrate the difference with the first Application Example, and will omit and the first Application Example phase The explanation of same component.

(explanation of ink jet printing device)

Figure 21 is the figure for showing the ink jet printing device 2000 for spraying liquid according to this application example.This Application Example Printing device 2000 and the difference of the first Application Example are, print color image on the print medium by constructing as follows: at this In construction, it is parallel to correspond respectively to four monochrome fluid ejection heads 2003 of ink of cyan C, magenta M, yellow Y and black K Ground arrangement.In the first application example, the columns that can be used in a kind of ejiction opening column of color is a column.However, in this Application Example In, the columns that can be used in a kind of ejiction opening column of color is 20 column.For this purpose, when to multiple ejiction openings column, suitably distribution is beaten Printing accordingly print image when, can be with higher speed print image.

In addition, even if liquid also can be from being located in print media conveying direction when there is the ejiction opening for not spraying liquid On the position corresponding to non-ejiction opening at the ejiction openings of other column addedly spray.Improve reliability, it is thus possible to suitable Locality printing commercial graphic.It is same as the first Application Example, the feed system of printing device 2000, buffer reservoir 1003 (referring to Fig. 2 and Fig. 3) and main liquid storage device 1006 (referring to figs. 2 and 3) be fluidly connected to fluid ejection head 2003.In addition, being sprayed to liquid First 2003 transmitting electric power and the electric control unit for spraying control signal are electrically connected to fluid ejection head 2003.

(explanation of circulating path)

It is same as the first Application Example, it is able to use Fig. 2 or first circulation mode shown in Fig. 3 and second circulation mode conduct Liquid circulation mode between printing device 2000 and fluid ejection head 2003.

(explanation of the structure of fluid ejection head)

Figure 14 A and 14B are the perspective views for showing fluid ejection head 2003 according to this application example.Here, it will illustrate basis The structure of the fluid ejection head 2003 of this Application Example.Fluid ejection head 2003 is ink-jet line (page width formula) print head comprising The 16 type element substrates 2010 linearly arranged on the length direction of fluid ejection head 2003, and one can be passed through Kind liquid print image.Same as the first Application Example, fluid ejection head 2003 includes fluid connection 111, signal input terminal 91 and power supply terminal 92.However, since the fluid ejection head 2003 of this Application Example compared with the first Application Example includes many ejections Mouthful column, so inputting a signal into terminal 91 and power supply terminal 92 is arranged in the two sides of fluid ejection head 2003.This is because needing Reduce the reduction of the voltage as caused by the wiring part being arranged in type element substrate 2010 or signal transferring lag.

Figure 15 is the strabismus decomposition figure for showing fluid ejection head 2003, show constitute fluid ejection head 2003 according to function It can divided component or unit.The function or the liquid communication sequence in fluid ejection head of each unit and component are applicable in first Example is substantially likewise, but ensure that the function of the rigidity of fluid ejection head is different.In the first application example, mainly pass through liquid Body spray unit support portion 81 ensures the rigidity of fluid ejection head, but in the fluid ejection head of second Application Example 2003, By including rigidity that the second flow path component 2060 in liquid spray unit 2300 ensures fluid ejection head.

The liquid spray unit support portion 81 of this Application Example is connected to the both ends of second flow path component 2060, and liquid sprays Unit 2300 is mechanically connected to the balladeur train of printing device 2000 so that fluid ejection head 2003 positions out.90 He of electrical wiring substrate Fluid supply unit 2220 including vacuum cavitations unit 2230 is connected to liquid spray unit support portion 81.Two liquid supplies Each of unit 2220 fluid supply unit 2220 includes built-in filter (not shown).

Two vacuum cavitations units 2230 are configured to different and relatively high and low vacuum cavitations pressure.In addition, As shown in Figure 14 B and Figure 15, when fluid ejection head 2003 is arranged in the vacuum cavitations unit 2230 of high-pressure side and low-pressure side When both ends, the common feed flow path extended along the length direction of fluid ejection head 2003 and the stream for sharing the liquid in recycling flow path Toward each other.In this configuration, it promotes common feed flow path and shares the heat exchange between recycling flow path, thus reduce two Temperature difference in a common flow path.It therefore reduces the temperature difference of the type element substrate 2010 along common flow path setting.Knot Fruit exists and does not allow to be also easy to produce the non-uniform advantage of printing as caused by temperature difference.

Next, by the detailed configuration for the channel member 2210 for illustrating liquid spray unit 2300.As shown in figure 15, flow path Component 2210 is obtained by stacking first flow path component 2050 and second flow path component 2060, and channel member 2210 will be from The liquid that fluid supply unit 2220 supplies, which is assigned to, sprays module 2200.Channel member 2210, which is used as, to be made from ejection module 2200 The liquid of recycling returns to the channel member of fluid supply unit 2220.The second flow path component 2060 of channel member 2210 is Following channel member: it is formed with common feed flow path and shares recycling flow path and improve the rigidity of fluid ejection head 2003.For This, it is expected that the material of second flow path component 2060 with enough corrosion resistances and has high mechanical strength relative to liquid. Specifically, SUS, Ti or aluminium oxide are able to use.

The part (a) of Figure 16 is the figure for spraying the face that module 2200 is installed shown in first flow path component 2050, figure 16 part (b) is the figure at the back side for showing first flow path component 2050 and the face of contact second flow path component 2060.With first Application Example is different, and the first flow path component 2050 of this Application Example has following construction: in this configuration, multiple components are by adjacently It is arranged to correspond respectively to spray module 2200.By using the segmenting structure, multiple modules can be sprayed with corresponding to liquid The mode of first 2003 length configures.Therefore, the structure can particularly well use with for example with B2 or larger size The corresponding relatively long fluid ejection head of sheet material in.

As shown in the part (a) of Figure 16, the communication port 51 and ejection module 2200 of first flow path component 2050 are in fluid communication. As shown in the part (b) of Figure 16, the independent communication port 53 of first flow path component 2050 and the communication port of second flow path component 2060 61 are in fluid communication.The part (c) of Figure 16 shows the contact surface relative to first flow path component 2050 of second flow path component 60, The part (d) of Figure 16 shows the section of the central portion on the thickness direction of second flow path component 60, and the part (e) of Figure 16 is to show The figure of the contact surface relative to fluid supply unit 2220 of second flow path component 2060 out.The connection of second flow path component 2060 Each color of the function and the first Application Example of mouth or flow path is same.The common flow path slot 71 of second flow path component 2060 is by shape As so that the side of common flow path slot 71 is common feed flow path 2211 shown in Figure 17, the other side is to share recycling flow path 2212.These flow paths respectively along fluid ejection head 2003 length direction be arranged so that liquid from one end of these flow paths to Other end supply.The difference of this Application Example and the first Application Example is that common feed flow path 2211 recycles flow path 2212 with shared In liquid flow direction it is opposite each other.

Figure 17 is the perspective view for showing the liquid connection relationship between type element substrate 2010 and channel member 2210.Edge A pair of of the common feed flow path 2211 and shared recycling flow path 2212 setting that the length direction of fluid ejection head 2003 extends are flowing In road component 2210.The communication port 61 of second flow path component 2060 is connected to the independent communication port 53 of first flow path component 2050, So that the position of the two matches each other, pass through connection so as to form from the common feed flow path 2211 of second flow path component 2060 The liquid supply line that mouth 61 is connected to the communication port 51 of first flow path component 2050.Similarly, it yet forms from second flow path The liquid that the communication port 72 of component 2060 is connected to by sharing recycling flow path 2212 with the communication port 51 of first flow path component 2050 Feed path.

Figure 18 is the sectional view along the interception of the line XVIII-XVIII of Figure 17.Common feed flow path 2211 passes through connection Mouth 61, independent communication port 53 and communication port 51, which are connected to, sprays module 2200.Although being not shown in Figure 18, it should be apparent that , recycling flow path 2212, which is shared, by the same paths in the different cross section of Figure 17 is connected to ejection module 2200.With One Application Example is same, sprays module 2200 and type element substrate 2010 is provided with the flow path being connected to each ejiction opening, thus Some or all of liquid of supply can be made to be recycled in the state of passing through the ejiction opening for not executing spray action.This Outside, same as the first Application Example, by fluid supply unit 2220, common feed flow path 2211 is connected to vacuum cavitations unit 2230 (high-pressure sides) share recycling flow path 2212 and are connected to vacuum cavitations unit 2230 (low-pressure side).Thus, to be made by pressure difference The side that liquid is flowed from the pressure chamber that common feed flow path 2211 passes through type element substrate 2010 to shared recycling flow path 2212 Formula forms stream.

(explanation for spraying module)

Figure 19 A is the perspective view for showing an ejection module 2200, and Figure 19 B is the decomposition for showing the ejection module 2200 Figure.Difference with the first Application Example is that terminal 16 is arranged on the ejiction opening column direction of type element substrate 2010 Two sides (long leg of type element substrate 2010).Therefore, two flexible circuit boards of type element substrate 2010 are electrically connected to 40 are arranged to each type element substrate 2010.Since the columns for the ejiction opening column being arranged in type element substrate 2010 is 20 column, so ejiction opening column are arranged more than eight column ejiction openings of the first Application Example.Here, due to shortening from terminal 16 to printing The maximum distance of element, so reducing, the voltage generated in the wiring part in type element substrate 2010 is reduced or signal prolongs Late.In addition, the fluid connection mouth 31 of supporting member 2030 is arranged along the entire ejiction opening being arranged in type element substrate 2010 Opening.Other constructions are same as the first Application Example.

(explanation of the structure of type element substrate)

The part (a) of Figure 20 is the schematic diagram for showing the face for being disposed with ejiction opening 13 in type element substrate 2010, figure 20 part (c) is the schematic diagram for showing the back side in the face of part (a) of Figure 20.The part (b) of Figure 20 is shown when setting exists Type element substrate in the case that the The lid component 2020 at the back side of the type element substrate 2010 in the part (c) of Figure 20 is removed The schematic diagram in 2010 face.As shown in the part (b) of Figure 20, liquid supply path 18 and liquids recovery path 19 are in type element It is alternately arranged at the back side of substrate 2010 along ejiction opening column direction.

The columns of ejiction opening column is greater than the columns that the ejiction opening of the first Application Example arranges.However, the essence with the first Application Example Difference is that the two sides on the ejiction opening column direction of type element substrate are arranged in terminal 16 as described above.Basic structure with First Application Example is same, wherein each ejiction opening column are respectively provided with a pair of of liquid supply path 18 and liquids recovery path 19, and covers Component 2020 is provided with the opening 21 being connected to the fluid connection mouth 31 of supporting member 2030.

In addition, not limited the scope of the invention to the explanation of above-mentioned Application Example.As an example, in this application example, Illustrate to be generated bubble by heating element to spray the thermal type (thermal type) of liquid.However, the present invention can also fit For the fluid ejection head using piezo electrics and various other liquid spray modes.

In this application example, the spray that the liquid of ink etc. recycles between liquid storage device and fluid ejection head is had been described that Black printing device (printing device), it is also possible to use other Application Examples.In other Application Examples, for example, can be using ink It does not recycle and two liquid storage devices is so that fluid ejection head is arranged in from the mode that a liquid storage device flows to another liquid storage device in ink Upstream side and downstream side construction.In this way, the indoor ink of pressure can flow.

In this application example, it has been described that using the so-called line with length corresponding with the width of print media The example of head, but the present invention can also be suitable for the so-called of while scanning and printing medium print image on the print medium String type fluid ejection head.As string type fluid ejection head, for example, fluid ejection head can be equipped with ejection black ink Type element substrate and ejection have the type element substrate of color ink, and but the invention is not restricted to this.It is situated between i.e., it is possible to be arranged than printing The width of matter is short and is included such that multiple type elements that the mode that ejiction opening overlaps each other on ejiction opening column direction configures The fluid ejection head of substrate, and fluid ejection head scanning and printing medium can be passed through.

(first embodiment)

Hereinafter, illustrating first embodiment of the invention with reference to the accompanying drawings.Further, since the essence construction of present embodiment It is identical as the essence construction of above-mentioned Application Example, therefore will only illustrate latent structure below.

Hereinafter, with reference to the accompanying drawings to illustrating the fluid ejection head and liquid discharge apparatus of embodiment according to the present invention. In the following embodiments, the fluid ejection head, the liquid that spray liquid (hereinafter, being also known as ink) will be illustrated with detailed construction Body discharge apparatus and manufacturing method, but the invention is not restricted to this.It can be by the fluid ejection head, liquid discharge apparatus and manufacture Method be suitable for printer, duplicator, the facsimile machine with communication system, the word processor with printer and with it is various The Industrial Printing equipment of processing unit combination.For example, being able to use fluid ejection head of the invention, liquid discharge apparatus and manufacture Method come manufacture biochip or printing electronic circuit.

Further, since the embodiment that will be described below is specific example of the invention, therefore it is able to carry out to the present invention Embodiment various technology limitings.However, embodiment is not limited to the above embodiment of specification and other specific Method, as long as embodiment is based on purport of the invention.

(type element substrate and The lid component)

Figure 22 is the type element substrate 10 for showing present embodiment and the figure of The lid component 20.The lid component 20 is used as being used for The back side of the type element substrate 10 shown in the part (a) of Figure 22 is (opposite with the ejiction opening formation face of component 12 is provided with Face) component of the lid of flow path that is formed and be arranged will be in third stream described later on shown in part (b) just like Figure 22 Road floor.In the present invention, type element substrate 10 and The lid component 20 are formed as wafer in wafer step (wafer step) It shape and is divided.

(structure example of fluid ejection head)

Figure 23 A to Figure 23 E is the perspective view for showing fluid ejection head.The fluid ejection head of Figure 23 A includes a printing member Part substrate 10 and the construction on first flow path component 50 is configured with supporting member 30 and type element substrate 10.Liquid spray Lift one's head and sprays printing device for so-called serial scan type liquid.Liquid sprays printing device and is configured to pass through multiple scanning Operation and conveying operations and print image on the print medium, in a scanning operation in fluid ejection head along the side with arrow X Ink is sprayed from ejiction opening while mobile to corresponding main scanning direction, is corresponding to the direction of arrow Y simultaneously in conveying operations Print media is conveyed on the sub-scanning direction intersected with main scanning direction.Main scanning direction is first extended with ejiction opening column 14 Intersect the direction of (orthogonal in the case of this example) in direction.

The fluid ejection head of Figure 23 B and Figure 23 C are that the line for the length that multiple type element substrates 10 are configured with zigzag is beaten Print head.In the construction shown in Figure 23 B, as shown in fig. 23b, configuration first flow path structure is shared on multiple type element substrates 10 Part 50.Then, in the construction of Figure 23 C, first flow path component 50 is respectively configured on each type element substrate 10.This liquid Ejecting head sprays printing device for so-called full line liquid.Liquid sprays printing equipment and is configured to arrange along with ejiction opening While print media is continuously conveyed in the direction of the arrow Y of the 14 first direction intersections (orthogonal in the case of this example) extended The continuous print image on the print medium and spraying ink from fluid ejection head in fixed position.

The fluid ejection head of Figure 23 D and Figure 23 E are the line heads of strip, and wherein type element substrate 10 is configured to a column, And it is sprayed in printing device for so-called full line liquid.In the construction of Figure 23 D, on multiple type element substrates 10 Share configuration first flow path component 50.Then, it in the construction of Figure 23 E, is respectively configured on type element substrate 10 first-class Road component 50.It is expected that the type element substrate 10 of this fluid ejection head is formed as identical as the 4th embodiment described later on Shape.

(printing device)

Figure 24 A to Figure 24 C be show using fluid ejection head of the invention liquid spray printing device (liquid ejection sets It is standby) flow passage structure and summary figure.The printing device of Figure 24 A is identical as fluid ejection head 3 shown in Figure 23 A using having The serial scan type printing device of the fluid ejection head of construction.Rack 1010 is by multiple plate-shaped metal members with redetermined rigidity Form and formed the skeleton of printing device.Feed unit 4, supply unit 1 and equipped with fluid ejection head 3 and can be previous The balladeur train 5 that multiple mode moves on the main scanning direction of arrow X is assembled into rack 1010.Main scanning direction is sprayed with liquid The direction of the extending direction intersection (orthogonal in the present case) of first 3 ejiction opening column.

The print media (not shown) of sheet is fed into printing device by feeding unit 4 automatically, and 1 edge of supply unit Sub-scanning direction corresponding with the direction of arrow Y from feeding unit 4 convey print media one by one.Sub-scanning direction is Intersect the direction of (orthogonal in the present case) with main scanning direction.This printing device by multiple scanning operation and it is defeated Operation and on the print medium print image are sent, in a scanning operation in fluid ejection head 3 along main scanning direction and balladeur train 5 one Ink is sprayed from the ejiction opening of fluid ejection head 3 while playing mobile, conveys print media along sub-scanning direction in conveying operations. Mo Congmo liquid storage device (not shown) is supplied to fluid ejection head 3.

The printing device of Figure 24 B is that full line liquid jet spray goes out printing device, uses Figure 23 B, Figure 23 C, Figure 23 D and figure Elongated fluid ejection head 3 and the conveying including paper (print media) 2 is continuously conveyed along the direction of arrow Y shown in 23E Unit 1.As supply unit 1, conveying roller can be used instead of this exemplary conveyer belt.In this example, setting sprays yellow (Y), four fluid ejection heads 3Y, 3M, 3C and 3B of magenta (M), cyan (C) and black (Bk) are as fluid ejection head 3.It will Corresponding ink is supplied to fluid ejection head 3 (3Y, 3M, 3C and 3B).While paper 2 are continuously conveyed in the direction along arrow Y In the case that fixed position sprays ink from fluid ejection head 3, color image is continuously printed on paper 2.

Figure 24 C is the explanatory diagram for showing the black feed system for fluid ejection head 3.Black quilt in first liquid storage device 1011 It is supplied to the common feed flow path 211 (referring to figs. 2 and 3) of fluid ejection head 3, passes through pressure chamber 23, and by from sharing back Receipts flow path 212 (referring to figs. 2 and 3) are recovered to the second liquid storage device 1012.It is recycled as following ink are generated in fluid ejection head 3 The method of stream, for example, as it is known that using the method for the head difference between the first liquid storage device 1011 and the second liquid storage device 1012.

Optionally, it is also known that by the pressure in the first liquid storage device 1011 of control and the second liquid storage device 1012 in the first storage The method of pressure difference is generated between liquid device 1011 and the second liquid storage device 1012.Further, it is also possible to generate black recycle stream by pump etc.. The method that the construction and generation ink of black feed system circulate is not limited to this example, but can arbitrarily set.Namely It says, the differential pressure generator for generating and the indoor ink of pressure being made to recycle necessary pressure difference can be used.

In addition, method described here is only that example is not limit the scope of the invention.For example, the circulation path can be formed Diameter, wherein the ink for being recycled to the second liquid storage device 1012 is fed into fluid ejection head 3 by the first liquid storage device 1011 again.This Outside, fluid ejection head can only include liquid storage device 1011, black from liquid storage device in the circulating path to form circulating path 1011 are fed into back to liquid storage device 1011 and again fluid ejection head 3 by fluid ejection head.

(liquid spray unit)

Figure 25 and Figure 26 is the exploded perspective view for showing liquid spray unit 300.As illustrated in figs. 25 and 26, this embodiment party The liquid spray unit 300 of formula includes that ejiction opening forms component 12 and six layered laminated flow line structures, the six layered laminated flows line structure Including first flow path layer 221, second flow path layer 222, third fluid passage layer 223, the 4th fluid passage layer 224, the 5th fluid passage layer 225 and Six fluid passage layers 226.Type element substrate 10 includes type element 15, ejiction opening formation component 12 and flow passage structure (first flow path Layer 221 is to second flow path layer 222).Type element substrate 10 has the substrate including type element 15 and the spray including ejiction opening Outlet forms component 12.Here, the substrate including type element 15 is formed as Si substrate and is provided with to type element 15 to supply To the flow path of ink.Flow path includes liquid supply path 18 and liquids recovery path 19, liquid supply path 18 and liquids recovery road Diameter 19 extends along the orientation of ejiction opening 13.In addition, flow path includes being connected to liquid supply path 18 and supplying along liquid Multiple supply mouth 17a for being arranged to path 18 and be connected to liquids recovery path 19 and along the arrangement of liquids recovery path 19 Multiple recovery port 17b.

In the present invention, the substrate including type element 15 may include single-layer or multi-layer.The single layer shown in Figure 12 In the case of, a Si substrate 11 is provided with liquid supply path 18, liquids recovery path 19, multiple supply mouth 17a and multiple times Closing in 17b.The first Si substrate shown in Figure 28 and in the case where two layers of the 2nd Si substrate, the first Si substrate 11 is provided with multiple Supply mouth 17a and multiple recovery port 17b, the 2nd Si substrate 115 are provided with liquid supply path 18 and liquids recovery path 19.Nothing By being a Si substrate or multiple Si substrates, at the back side of Si substrate, setting includes the The lid component 20 of multiple openings 21.Opening 20 include supplying a liquid to the supply side opening 20 of liquid supply path 18 and returning from 19 withdrawal liquid of liquids recovery path Receive side opening 20.Multiple openings 20 are arranged along liquid supply path 18 and liquids recovery path 19.The present invention is not limited to this to show Example.For example, first flow path layer 221 can be formed at the first Si substrate and second flow path layer 222 can be formed in the 2nd Si At substrate.Furthermore, it is possible to which at least one opening 20 is arranged at liquid supply path 18 and liquids recovery path 19.

As type element 15, thermoelectric element (heater) or piezoelectric element can be used.The case where using heater Under, the ink in pressure chamber 23 becomes bubble due to heat, and can spray ink from ejiction opening 13 by using foaming.

Figure 27 is the ejiction opening 13 for showing the ejiction opening Chong Die with the partial enlarged view of first flow path layer 221 and forming component 12 Figure.As shown in figure 27, multiple ejiction openings 13 are densely configured to form ejiction opening column 14.In this example, a liquid spray There are four ejiction opening column 14 for the setting of unit 300 out.

Figure 28 is the liquid supply path 18 for showing second flow path layer 222 and the sectional view in liquids recovery path 19, Figure 29 It is its perspective view.As shown in figure 28, the liquid supply path 18 of second flow path layer 222 passes through the independence corresponding to each pressure chamber 23 Supply mouth 17a be connected to the side (left side of Figure 28) of each pressure chamber 23.Similarly, the liquids recovery of second flow path layer 222 Path 19 is connected to by the independent recovery port 17b of pressure chamber 23 with the other side (right side of Figure 28) of each pressure chamber 23.

Liquid supply path 18 connects with the liquid supply opening 2133 being formed at the third fluid passage layer 223 as The lid component Lead to and be formed so that from liquid supply opening 2133 to liquid supply path 18 and supplies ink.Similarly, liquids recovery road Diameter 19 is connected to the liquids recovery opening 2143 for being formed in third fluid passage layer 223.Multiple liquid supply openings 2143 are along ejiction opening The orientation (first direction) of the ejiction opening of column 14 arranges, to form the column of liquid supply opening 2133.Similarly, with liquid Similarly, multiple liquids recovery openings 2143 arrange the column of supply opening 2133 along first direction, to form liquids recovery opening 2143 column.The column of liquid supply opening 2133 and the column of liquids recovery opening 2143 are alternately configured in third fluid passage layer 223.

4th fluid passage layer 224 is provided with common feed path 2134 and shares recycling path 2144, and the 5th fluid passage layer 225 are provided with and are independently supplied mouth 2135 and independent recovery port 2145.6th fluid passage layer 226 is provided with 211 He of common feed flow path Share recycling flow path 212.

Liquid supply path 18 is formed so that the side (first flow path in a thickness direction of second flow path layer 222 The side of layer 221) it is connected to multiple supply mouth 17a, and the other side (side of third fluid passage layer 223) is opened with the supply of multiple liquid Mouth 2133 is connected to.Similarly, liquids recovery path 19 is formed so that the side in a thickness direction of second flow path layer 222 It is connected to multiple recovery port 17b, and the other side is connected to multiple liquids recoveries opening 2143.Common feed path 2134 is formed To be connected to the side in a thickness direction of the 4th fluid passage layer 224 with multiple liquid supply openings 2133, and the other side with Multiple second supply mouths 2135 are connected to.

Similarly, the side in a thickness direction that recycling path 2144 is formed so that the 4th fluid passage layer 224 is shared It is connected to liquids recovery opening 2143, and the other side is connected to independent recovery port 2145.In addition, the 6th fluid passage layer 226 shares Supply line 211 is connected to multiple mouths 2135 that are independently supplied, and shares recycling flow path 212 and multiple independent companies of recovery port 2145 It is logical.

Multiple arranging densities for being independently supplied mouth 2135 and the arranging density of multiple independent recovery ports 2145 are lower than multiple liquid The arranging density of the arranging density of body supply opening 2133 and multiple liquids recoveries opening 2143.In addition, multiple liquid supplies are opened Arranging density of the arranging density lower than multiple supply mouth 17a of mouthfuls 2133 arranging density and multiple liquids recoveries opening 2143 and The arranging density of multiple recovery port 17b.Liquid supply path 18 and liquids recovery path 19 are formed side by side along a first direction, and And common feed path 2134 and shared recycling path 2144 are formed side by side along second direction.Common feed flow path 211 and altogether It is arranged side-by-side along a first direction with recycling flow path 212.

This exemplary liquid spray unit 300 includes multiple fluid passage layers, and multiple flow path layer stackups.The flow path of fluid passage layer Density is formed according to the 6th fluid passage layer 226, the 5th fluid passage layer 225, the 5th fluid passage layer 225, the 4th fluid passage layer 224, third flow path The sequence of layer 223, second flow path layer 222 and first flow path layer 221 increases.Therefore, 10 He of type element substrate can inhibited The increased liquid spray unit 300 for being formed simultaneously multiple ejiction opening column 14 and densely configuring of the size of each channel member.This Outside, six fluid passage layers can be respectively formed as different components.

In addition, both first flow path layer 221 and second flow path layer 222 are formed in substrate 11 to form type element substrate 10, third fluid passage layer 223 is formed in The lid component 20, and a part of the 4th fluid passage layer 224 is formed in supporting member 30.So Afterwards, another part of the 4th fluid passage layer 224 is formed in first flow path component 50 (see Figure 23 B to Figure 23 E), the 5th fluid passage layer 225 A part and a part of the 6th fluid passage layer 226 be formed in second flow path component 60 (3B to Figure 23 E referring to fig. 2), and Another part of six fluid passage layers 226 is formed in third channel member.

In addition, both first flow path layer 221 and second flow path layer 222 are formed at substrate 11 to form type element base Plate 10, and third fluid passage layer 223 is formed in The lid component 20.Then, a part of the 4th fluid passage layer 224 is formed in supporting member 30, another part of the 4th fluid passage layer 224 and the 5th fluid passage layer 225 are formed in first flow path component 50,226 shape of the 6th fluid passage layer At in second flow path component 60.In this way, the relationship between fluid passage layer and component does not limit the present invention.In addition, independent Feed path 214a, independent recycling path 214b, it is independently supplied mouthful 215a and the construction of independent recovery port 215b does not limit the structure It makes.

The common feed flow path 211 for the Mo Congyu ink inflow entrance connection being externally supplied, which successively flows to, is independently supplied mouth 2135, common feed path 2134, liquid supply opening 2133, liquid supply path 18 and supply mouth 17a and be directed into pressure Power room 23.Ink in pressure chamber 23 flows successively through recovery port 17b, liquids recovery path 19, liquids recovery opening 2143, shares back Receive path 2144, independent recovery port 2145 and share recycling flow path 212 with from the shared outflux stream that is connected to of recycling flow path 212 To outside.In this way, when the ink in pressure chamber 23 is recycled to outside, the thick ink or gas that are readily retained in pressure chamber 23 Bubble flow direction is external.Therefore, the variation of the color concentration of ink and the reduction of the black spouting velocity from ejiction opening 13 can be inhibited.With Under, this compulsory ink stream will be referred to as " black recycle stream ".

In this example, as shown in Figure 27, Figure 28 and Figure 29, supply mouth 17a and recovery port 17b are configured to ejiction opening 13 mode between supply mouth 17a and recovery port 17b is facing with each other.In this way, when pressure chamber 23 is between supply When between mouth 17a and recovery port 17b, black recycle stream is generated with high efficiency inside pressure chamber 23.Therefore, can efficiently inhibit The variation of the color concentration of the reduction and ink of black spouting velocity.In addition, supply mouth 17a and recovery port 17b is to correspond to multiple pressures The mode of power room 23 is formed at multiple positions on the first direction of the extension of ejiction opening column 14.

It in this way, can be adjacent when being formed separately supply mouth 17a and recovery port 17b in multiple positions The electric wire of driving type element 15 is configured between supply mouth 17a and adjacent recovery port 17a.For this purpose, due to not needing The electric wire extended in a first direction is configured between supply mouth 17a and ejiction opening 13 and between recovery port 17b and ejiction opening 13, Therefore the size in the gap between them can be further decreased.Quantitative relation between supply mouth 17a and ejiction opening 13 can be with It is one to one, one to two or one to five.Here, the quantity for the pressure chamber 23 being connected to supply mouth 17a is not limited to this exemplary confession To the one-to-one relationship of the quantity of mouth 17a and ejiction opening 13.

In this example, it is formed as follows flow path, to generate the ink circulation by pressure chamber 23 and ejiction opening 13 Stream.Liquid supply path 18 extends in a first direction to be connected to multiple supply mouth 17a and by each supply mouth 17a and pressure Power room 23 is connected to.Similarly, liquids recovery path 19 is extended in a first direction to be connected to multiple recovery port 17b and by each Recovery port 17b is connected to pressure chamber 23.

It is desirable that, being provided with the second flow path layer 222 of liquid supply path 18 and liquids recovery path 19 and first-class Road floor 221 is the component being formed from the same material.In this example, first flow path layer 221 and second flow path layer 222 be formed in by Be formed as the substrate 11 of silicon (Si) substrate.In addition, being formed as silicon substrate and being provided with the substrate 11 of first flow path layer 221 and formed For identical silicon substrate and the second substrate 115 that is provided with second flow path layer 222 is stacked on one another and engages, second flow path layer 222 It is provided with liquid supply path 18 and liquids recovery path 19.

It is more desirable that substrate 11 and the second substrate 115 are engaged with each other without using bonding agent.For example, surfactant connects It closes or melting engagement can be used for engaging.This is because in the case where substrate 11 and the second substrate 115 are engaged with each other, bonding agent Influence outstanding reduce so that the ejiction opening of high concentration corresponds to highdensity black flow path.Therefore, the substrate 11 formed by silicon It engages or melts engagement by surfactant with the second substrate 115 to be integrated with each other, and supply mouth 17a, recovery port 17b, liquid supply path 18 and liquids recovery path 19 are formed in the inside of integrated component.

In this way, first flow path layer 221 and second flow path layer 222 are provided with a series of black flow paths, this series of Black flow path corresponds respectively to ejiction opening column 14 and by supply mouth 17a, recovery port 17b, liquid supply path 18 and liquids recovery Path 19 is formed.Therefore, it is possible to form component 12 in the pressure chamber of first flow path layer 221 23 and ejiction opening by these black flow paths Ejiction opening 13 in generate black recycle stream.

In addition, as shown in Figure 28 and Figure 29, forming supply mouth 17a, recovery port 17b, liquid supply path 18 and liquid and returning The front and back (upper and lower surfaces in the figure) for receiving the side wall and first flow path layer 221 in path 19 is substantially orthogonal.This In, substantially orthogonal state includes inclining for the conical by its shape formed by processing first flow path layer 221 and second flow path layer 222 Tiltedly.Supply mouth 17a, recovery port 17b, liquid supply path 18 and liquids recovery path 19 are formed for example, by dry ecthing.

In addition, these components can be formed by the combination of laser processing or dry ecthing and laser processing.Supply mouth 17a, The depth direction (vertical direction of Figure 28) and first flow path of recovery port 17b, liquid supply path 18 and liquids recovery path 19 The front of layer 221 is substantially vertical.Therefore, because black flow path is efficient and is densely populated, therefore can be at first flow path layer 221 The ejiction opening 13 intensively formed and black recycle stream is efficiently produced in pressure chamber 23.

(manufacturing method of The lid component and the shape of The lid component)

Figure 30 is the exemplary flow chart for showing the manufacturing process of the fluid ejection head of present embodiment.It is formed in ejiction opening In step 2000, ejiction opening is formed on the type element substrate 10 for being provided with type element 15 or necessary circuit.Overleaf In feed path forming step 2001, liquid supply path 18 and liquids recovery path are set at the back side of type element substrate 10 19.In addition, in The lid component forming step 2002, in the lid of the back side of type element substrate 10 setting covering back side feed path Component (third fluid passage layer 223).In the present invention, liquid supply path 18 and liquids recovery path 19 are formed in wafer shape The back side of the Si substrate of formation, and the back side of the Si substrate with wafer shape is arranged in The lid component 20 (223).In the shape Under state, the multiple openings 21 (2133,2143) smaller than liquid supply path 18 and liquids recovery path 19 are formed by patterning. Then, in cutting step 2003, by the shape of type element substrate 10 from wafer shape processing at chip form.

In addition, type element substrate 10 is joined to supporting member 30 or first flow path component 50 in engagement step 2004. In configuration step 2005, the component after engagement is configured in predetermined position to manufacture fluid ejection head.In the above description, Through the manufacturing method for illustrating to include to supply the fluid ejection head of the feed path of liquid to pressure chamber.However, the present invention may be used also To be applied to include the fluid ejection head for recycling the liquids recovery path 19 of the liquid from pressure chamber shown in Figure 29.Including liquid The back side of type element substrate is arranged in body feed path 18 and the type element substrate in liquids recovery path 19, and membranaceous The back side of type element substrate is arranged in cover the liquid supply path 18 at the back side for being formed in type element substrate in The lid component With liquids recovery path 19.Then, The lid component is provided with multiple liquid supply openings 2133 and multiple liquids recoveries opening 2143, Multiple liquid supply opening 2133 is connected to liquid supply path 18 and, multiple liquids recovery smaller than liquid supply path Opening 2143 is connected to and smaller than liquids recovery path with liquids recovery path 19.Next, including The lid component from wafer cutting Multiple type element substrates, and by the engagement of type element substrate to supporting member, so that manufacture is first configured with multiple printings The fluid ejection head of part substrate.

In this way, in the present invention, liquid supply path 18 and liquids recovery are formed first under wafer state Path 19, and The lid component 20 is configured to Covering Liguid feed path 18 and liquids recovery path 19.Then, setting and liquid The liquid supply opening 2133 that feed path 18 is connected to and the liquids recovery opening 2143 being connected to liquids recovery path 19.Cause This, can form liquid supply path 18 or liquids recovery path 19 with higher density, and can form tool with high precision There is the opening (liquid supply opening 2133, liquids recovery opening 2143) of small opening size.Hereinafter, will be explained in type element The manufacturing method of substrate.

Figure 31 A and Figure 31 B are the figure for being shown provided with the type element substrate of The lid component 517, Figure 32 A to Figure 32 F and figure 33A to Figure 33 E is the sectional view intercepted along the line XXXII-XXXII of Figure 31 A.In addition, will be described below type element substrate Manufacturing method.However, will illustrate the attached drawing of the component of finished product respectively to distinguish the component in the component and manufacturing process of finished product The appended drawing reference of component in label and manufacturing process.Figure 32 A to Figure 32 F shows a part of type element substrate.However, Multiple type element substrates are formed simultaneously the type element substrate on wafer and being cut into fritter.In this way, Manufacture independent type element substrate.Firstly, being provided with type element or necessary circuitry by using normal Photosensitive resin The front of silicon substrate 511 formed and be used to form the pattern 521 of flow path.Firstly, being pressed in substrate by spin coating, spraying or film layer Photosensitive resin is set on 511, and patterns photosensitive resin to form black flow path by photoetching process.It in this way, can be with Form channel member.

As normal Photosensitive resin, for example, using mainly including poly- methyl isopropenyl ketone or methacrylate High polymer main chain degradation photoresist.Positive-working photosensitive resin layer can be to be suitable for the exposure wavelength (exposure of material Wavelength it is formed while) exposure with desired pattern.Then, by using negative photosensitive resin layer in substrate 511 Front formed ejiction opening formed component 522 (Figure 32 A).As negative photosensitive resin, can enumerate using free radical polymerization The negative photosensitive resin of reaction or the negative photosensitive resin for using cationic polymerization.

Furthermore, it is possible to which independent use a kind of negative photosensitive resin, or two or more can be used with admixture Kind negative photosensitive resin.In addition, if needing that additive etc. can be properly added.In addition, as negative photosensitive resin, it can To use by " the SU-8 series " and " KMPR-1000 " (ProductName) of Nippon Kayaku K. K's manufacture and by Tokyo applied chemistry " the TMMR S2000 " and " TMMF S2000 " (ProductName) of Industrial Co., Ltd's manufacture.

In addition, being not particularly limited the method being applied to negative light-sensitive resin combination on the pattern of flow path.For example, can To properly select spin coating, lamination, spraying etc., and ejiction opening is formed by photoetching process.

Furthermore it is possible to form multiple negative photosensitive resin layers by negative photosensitive resin, and in addition to spraying the degree of lip-rounding Other than step, ejiction opening forming member 522 can be formed by photoetching process.

Next, overleaf forming common liquid room 513 by using photoetching process and Si deep etching method (corresponds to liquid Feed path 18 and liquids recovery path 19) and for supplying black black supply mouth 516 (Figure 32 B).Then, in substrate 511 It is provided with the resin film that The lid component is arranged as on the face of common liquid room 513.In the feelings for engaging The lid component 517 by bonding agent Under condition, bonding agent is projected into common liquid room 513 to which the flow path shape to essence generates adverse effect.Therefore, it is desirable to not Bonding operation is carried out in the case where using bonding agent.

In the case where The lid component 517 is formed by non-photosensitivity thermosetting resin, non-photosensitivity resin is applied to as substrate Basement membrane 518 on (Figure 32 C), and remove basement membrane 518 (Figure 32 D).Then, (the figure of pattern 521 of flow path is removed after solidification 32E), and by laser processing opening (corresponding to supply opening 2133 and recycling opening 2143) (Figure 32 F) is formed.

Next, the method that will illustrate to form The lid component by photoetching process referring to Figure 33 A to Figure 33 E.

The lid component 517 can be formed by photoetching process etc..It can thus be avoided the base as caused by the ablation in laser processing Dash-board injury obtains higher position precision.Overleaf form the method and Figure 32 B of common liquid room 513 and ink supply port 516 Method it is same.Then, the stepped construction of basement membrane 518 and photo-sensitive resin is transferred to by using laminater and is provided with On the face of the substrate 511 of common liquid room 513 (Figure 33 A).As the material of photo-sensitive resin, illustrates and use free radical The negative photosensitive resin of polymerization reaction or the negative photosensitive resin for using cationic polymerization.By using by being included in The free radical that Photoepolymerizationinitiater initiater in photosensitive polymer combination generates makes to include the freedom in photosensitive polymer combination Base polymerization monomer or prepolymer molecule aggregation or crosslinking and make the negative photosensitive resin using Raolical polymerizable Solidification.

As Photoepolymerizationinitiater initiater, benzoin, benzophenone, thioxanthones, anthraquinone, acylphosphine oxide, two are illustrated Luxuriant titanium, acridine etc..As the monomer of free radical polymerization, it is desired to have acryloyl group, methylacryloyl, acrylamido, horse Come the monomer or prepolymer of acid diester and allyl, however, the present invention is not limited thereto.By using by being included in photoresist The cation that generates of light cationic initiator make include cationic polymerization in photoresist monomer or prepolymer Molecule aggregation or crosslinking and make using cationic polymerization negative photosensitive resin solidify.

As light cationic initiator, for example, illustrating aromatic iodonium salts or aromatic series sulfonium salt.It is poly- as cation The monomer or prepolymer of conjunction, it may be desirable to monomer or prepolymer with epoxy group, vinyl ether group or oxetanyl, but The invention is not limited thereto.Furthermore, it is possible to which independent use a kind of negative photosensitive resin, or two kinds can be used with admixture Or more negative photosensitive resin.In addition, if needing that additive etc. can be properly added.

In addition, as negative photosensitive resin, can be used by Nippon Kayaku K. K's manufacture " SU-8 series " and " KMPR-1000 " (ProductName) and " the TMMR S2000 " and " TMMF manufactured by Tokyo applied chemistry Industrial Co., Ltd S2000 " (ProductName).In addition, being not particularly limited in the method for forming negative photosensitive resin on basement membrane 518, can suitably select Select spin coating, slot die coating or spraying.In addition, the film thickness as The lid component 517, the ink of the size and supply that no matter are open Flow or viscosity how, expectation thickness be 2 μm to 50 μm.In the case where the film thickness of The lid component 517 is less than 2 μm, share Liquid chamber 513 cannot be fully coated with, and ink is easy leakage during supplying ink.In addition, The lid component 517 is easy to be supplied by ink To pressure damage.

As basement membrane 518, for example, using PET, polyimides, fluorine film or hydrocarbon film.Then, basement membrane 518 (Figure 33 B) is removed, And pass through the light of 532 irradiation exposure of mask (Figure 33 C).Then, The lid component (Figure 33 B) is formed by rear baking or development.For The bumps for keeping The lid component 517, resin is exposed in the state that negative photosensitive resin is supported by basement membrane 518 and after Baking, and basement membrane 518 is removed and developed.Then, curing schedule is executed after the pattern 521 of removal flow path.Therefore, it makes Make the type element substrate (Figure 33 E) of wafer-shaped.Furthermore, it is possible to execute the pattern of removal flow path before forming The lid component 517 521 the step of.

Further, since liquid supply opening 2133 can be processed in The lid component 517 by photoetching process and liquids recovery is opened Mouth 2143, therefore the form accuracy and configuration essence of each of liquid supply path 18 and liquids recovery path 19 can be improved Degree.When the use of film thickness being 50 μm or smaller resin film, can obtain ± 5 μm or smaller form accuracy and ± 5 μm or Smaller configuration precision.In addition, satisfactory form accuracy can be obtained in the case where film thickness is less than 25 μm.

Although being not shown in Figure 32 A to Figure 32 F and Figure 33 A to Figure 33 E, it is formed in The lid component as shown in Figure 11 C Opening on 517 is arranged at multiple positions in liquid supply path 18 and liquids recovery path 19.

Due to improving form accuracy by machining or molding when processing The lid component 517 in wafer step, So another micro hole can be formed more precisely, thus The lid component 517 can be formed as thinner.In addition, liquid supplies Path 18 and liquids recovery path 19 are formed in the face of substrate, and The lid component is arranged on the face of substrate, and then The lid component is provided with 21 (2133,2143) of multiple openings.Therefore, it can be formed at liquid supply path 18 and liquids recovery path 19 with high precision Minute opening 21 (2133,2143).When be used as The lid component photosensitive film be coated on wafer-shaped Si substrate on and pass through When photoetching process forms opening at The lid component, precision can be further improved.

In this way, when The lid component 517 is formed at wafer shape device substrate and 2133 He of liquid supply opening When the form accuracy of each of liquids recovery opening 2143 obtains improving, liquid supply opening 2133 and liquid can reduce Flow path resistance between recycling opening 2143.Further, since improve form accuracy and configuration precision, it is possible to further with Small size accurately configures liquid supply opening 2133 and liquids recovery opening 2143.Therefore, can by flow arrangement with compared with At the liquid supply path 18 of arranged in high density or liquids recovery path 19.

That is, flow path can be formed at the ejiction opening column 14 configured with higher density.Particularly, such as in this implementation In mode like that, due to needing the configuration liquid supply at each ejiction opening column 14 in the fluid ejection head 3 for generating black recycle stream Path 18 and liquids recovery path 19, therefore with higher configuration precision configuration path, thus effect of the invention is big.About edge Ejiction opening arrange the liquid supply path 18 to be formed and liquids recovery path 19, liquid supply path 18 or liquids recovery path 19 Can be with higher Density and distribution, and the multiple openings for all having small opening size can be formed with high precision.

Figure 34 A to 34C is the liquid for showing the The lid component 20 when from The lid component 20 and being applied to type element substrate 10 Ejecting head and the liquid for showing the liquid supply opening 2133 being formed at The lid component 20 and being formed at type element substrate 10 The schematic diagram of configuration relation between feed path 18.The width that Figure 34 A shows liquid supply opening 2133 is supplied greater than liquid To the example of the width in path 18.In the case where form accuracy is ± 5 μm or smaller and configuration precision is ± 5 μm or smaller situation, The width of liquid supply opening 2133 is set as 10 μm bigger than the width of liquid supply path 18 in two sides.Therefore, show in Figure 34 A Positional relationship out does not change in precision variation.When the factor in view of causing precision to change, liquid supply is opened The width of mouth 2133 can be set to 15 μm bigger than the width of liquid supply path 18 in two sides.

Due to changing positional relationship not, can reduce from liquid supply opening 2133 to liquid The variation of the flow path resistance of body feed path 18.Similarly, as illustrated in figure 34b, the width of liquid supply opening 2133 can be set It is set to 15 μm smaller than the width of liquid supply path 18 in two sides.In addition, as shown in figure 34 c, the width of side can increase by 15 μ M, and the width of opposite side can reduce 15 μm.In this way, even if liquid supply path 18 and liquid supply are opened The width of mouth 213 is set within 30 μm, can also reduce the variation of flow path resistance.

For example, in the case where the relationship of Figure 34 A, even if the joint surface between The lid component 20 and type element substrate 10 In the case where needing to be at least 50 μm, the beam width between liquid supply line 18 and liquids recovery flow path 19 is reduced to 65 μ M, configuration relation also do not change.In addition, in the case where the relationship of Figure 34 B, even if the width needs in liquid supply opening are In the case where 150 μm, the width of liquid supply line 18 is reduced to 180 μm, and configuration relation will not change.

Figure 35 A is the chart for showing the relationship between the width of liquid supply opening and the pressure loss of supply line 18. Hereinafter, by being illustrated to effect of the invention.As shown in Figure 35 A, when the width of liquid supply opening reduces, change in width Influence in the case where change to the pressure loss increases.Especially when width is 200 μm or smaller, the pressure loss increases.Also It is to say, when ejiction opening is arranged with the reduction of the size of arranged in high density and liquid supply opening, the shape essence of liquid supply opening The influence for spending the variation of flow path resistance increases.In this way, the present invention is sprayed in the liquid that ejiction opening densely configures In head especially effectively.Therefore, because can reduce the variation of flow path resistance, being generated in supply line during spraying operation The pressure loss variation, therefore can reduce the pressure change of ejiction opening meniscus (meniscus interface).As a result, Since the drop with single-size can be sprayed, the image of high-quality can be formed with higher precision.

In addition, in the fluid ejection head 3 for generating black recycle stream as in the present embodiment, due to the change of flow path resistance Change and reduce, therefore can stablize and generate the pressure difference that ink circulates, and reduce the variation of black internal circulating load.

Figure 35 B is the exemplary chart of the influence for the variation for showing black internal circulating load, and it illustrates the lower part of each ejiction opening (pressures Power room) black circular flow with temporarily ceased at each black circular flow first drop after the predetermined time spouting velocity it Between relationship example.When circular flow is equal to or greater than about 7000pl/s, first drop can be with normal spouting velocity 90% spouting velocity spray, and in the case where flow is equal to or less than 7000pl/s, the ejection speed of first drop Degree becomes smaller than 90%.In this way, when spouting velocity reduces, there is the deviation of landing positions, thus image quality Deterioration.

In addition, in order to increase circular flow, need to increase Figure 24 C the first liquid storage device 1011 and the second liquid storage device 1012 it Between pressure difference, or by pump etc. ensure big flow.Therefore, because big black feed system is needed, so being not easily controlled spray The pressure of exit portion.Thus, circular flow, which can reduce spouting velocity, will not reduce excessive degree, and circular flow It can be easily decreased to the degree that spouting velocity does not reduce in the small fluid ejection head 3 of the variation of circular flow.

In this way, in the present invention, due to even if in ejiction opening in the fluid ejection head of arranged in high density It can reduce the variation of flow path resistance, therefore the variation for causing the pressure difference of black recycle stream to reduce circular flow can be stablized. As a result, since no matter each ejiction opening is whether there is or not temporarily ceasing and stop how length can obtain uniform ejection characteristic, The image of high-quality can be formed with higher precision.

(configurational relationships between device substrate and The lid component)

Figure 36 A to Figure 36 C is the figure for showing the configurational relationships between device substrate 2010 and The lid component 517 (20), Figure 36 A Show the state that The lid component 517 is formed on wafer-shaped device substrate 2010.Liquid supply opening 2133 is being not shown in the figure With liquids recovery opening 2143.Finally, The lid component 517 is divided by the unit of a type element substrate 10.Figure 36 B is Figure 36 A Partial enlarged view.

When dividing wafer-shaped device substrate 2010, device substrate can be divided in the region of no The lid component 517. Since device substrate is divided in the region of no The lid component 517, deterioration can be inhibited when type element substrate 2010 The shape deterioration and removing of The lid component 517 when being divided.That is, due to the outer dimension of The lid component be set to be less than by The outer dimension of type element substrate cut and divided, it is possible to The lid component is manufactured on wafer-shaped device substrate, with Inhibit the shape deterioration and removing of the The lid component 517 when cutting crystal wafer shape device substrate.

For example, carrying out cutting element substrate 2010 using various etchings or cutting.When through etching cutting element substrate, need Divide the region of no The lid component 517.In addition, when cutting (blade-dicing) by cutter come cutting element substrate When situation undercover member 517 is present in cut zone, it may occur that the shape of The lid component 517 deteriorate or removing and cutter it is bad Change.In addition, needing to divide as when etching the area of no The lid component 517 when by cutter cutting come cutting element substrate Domain.

Figure 36 C shows a divided type element substrate 10 and The lid component 20.As shown in Figure 36 A and 36B, when not having When having the region punishment of The lid component 20 to cut type element substrate 2010, the shape and The lid component of type element substrate 10 can be set Relationship between 20 shape, so that the The lid component 20 as shown in Figure 36 C closes at the inside of the shape of type element substrate 10.

In this way, in the present embodiment, since the shape of The lid component closes at the shape of type element substrate Inside, thus can after The lid component is formed in the type element substrate of wafer-shaped cutting crystal wafer shape type element substrate from And the shape of The lid component is inhibited to deteriorate or remove.That is, being formed in the feelings of the type element substrate of wafer-shaped in The lid component Under condition, the shape of The lid component needs the shape of substantially less than type element substrate.Furthermore, it is possible to inhibit the shape office of The lid component Portion closes at the inside of the shape of type element substrate, prominent from another shape without will lead to a shape.

(structure (1) for inhibiting the variation of black circular flow and pressure)

In addition, in the present embodiment, providing the variation for inhibiting the black circular flow of each pressure chamber 23 with flowering structure And pressure change.As illustrated in figs. 25 and 26, multiple liquid supply openings 2133 are connected to a liquid supply path 18.Equally Ground, multiple liquids recovery openings 2143 are connected to a liquids recovery path 19.Liquid supply opening 2133 and liquids recovery are opened Mouth 2143 is configured to the variation of the black circular flow of each pressure chamber 23 and pressure change falls in ink and sprays characteristic not by big In the range of influence.

Specifically, liquid supply opening 2133 and liquids recovery opening 2143 arrange in ejiction opening column 14 in ejiction opening 13 First direction on be alternately arranged.Therefore, can further decrease liquid supply opening 2133 and liquids recovery opening 2143 it Between gap in a first direction.Therefore, even if in each of liquid supply path 18 and liquids recovery path 19 In the case that flow path width is relatively small, the variation and pressure change of the black circular flow of each pressure chamber 23 can also be inhibited.

(structure (2) for inhibiting the variation of black circular flow and pressure)

In addition, in the present embodiment, providing the variation for inhibiting the black circular flow of each pressure chamber 23 with flowering structure And pressure change.It is, as illustrated in figs. 25 and 26, common feed path 2134 is intersected with the orientation of ejiction opening 13 Second party upwardly extend and be connected to the multiple liquid supply openings 2133 arranged in a second direction.

Similarly, share recycling path 2144 extend in a second direction and with multiple liquid for arranging in a second direction 2143 connection of recycling opening.In addition, multiple common feed paths 2134 are by being independently supplied mouth 2135 and a common feed stream The whole connection in road 211.Similarly, multiple shared recycling paths 2144 share recycling flow path by independent recovery port 2145 and one 212 whole connections.

In this way, formed due to black flow path by six layer structure, with narrow pitch formed with dense arrangement Multiple liquid supply paths 18 that multiple ejiction opening column 14 match finally are integrated into one by multiple liquid supply openings 2133 A common feed flow path 211.Similarly, matched with narrow pitch formation with multiple ejiction opening column 14 with dense arrangement multiple Liquids recovery path 19 shares recycling flow path 212 by one that multiple liquids recoveries opening 2143 is finally integrated.Therefore, more A ejiction opening column 14 can arrange to high-density, and the flow path without widening liquid supply path 18 and liquids recovery path 19 is wide Degree.

Furthermore, it is possible to inhibit the ejiction opening 13 with the multiple ejiction opening column 14 being arranged at a high density respectively in this way The variation of the black circular flow of corresponding each pressure chamber 23 and the variation of pressure.Furthermore, it is possible to (not show from black liquid storage device simply Ink is provided out), and ink is simply recovered to black liquid storage device, while inhibiting corresponding with the ejiction opening 13 configured to high-density The variation of the black circular flow of each pressure chamber 23 and the variation of pressure.Therefore, the present invention is not limited to aforesaid liquid ejecting head and packets Include the printing device of the fluid ejection head.Therefore, present invention can also apply to various fluid ejection heads and including various liquid The liquid discharge apparatus of ejecting head, to realize the compact size of whole system.

(structure (3) for inhibiting the variation of black circular flow and pressure)

In addition, it is expected that have following structure, so as to inhibit each pressure chamber 23 black circular flow variation and pressure change Change.That is, the liquid supply opening 2133 and/or liquids recovery opening 2143 that are located at the both ends of ejiction opening column 14 are by shape As liquid supply opening 2133 and/or the liquids recovery opening 2143 being less than at the position being located in addition to both ends.Also To say, positioned at the both ends of ejiction opening column 14 liquid supply opening 2133 and/or liquids recovery opening 2143 opening by shape It is opened as the liquid supply opening 2133 and/or liquids recovery being less than at the position being located in addition to the both ends of ejiction opening column 14 The opening of mouth 2143.The ejiction opening 13 of ejiction opening column 14 is only located at the liquid supply opening positioned at the both ends of ejiction opening column 14 2133 side.

Therefore, the black flow at the liquid supply opening 2133 at the both ends of ejiction opening column 14 becomes smaller than other liquid The black flow of body supply opening 2133.Similarly, the ejiction opening 13 of ejiction opening column 14 is only located at positioned at the both ends of ejiction opening column 14 The side of the liquids recovery opening 2143 in portion.Therefore, positioned at the both ends of ejiction opening column 14 liquids recovery opening 2143 ink Flow becomes smaller than the black flow of other liquids recovery openings 2143.

In this way, the liquid supply opening 2133 and/or liquids recovery positioned at the both ends of ejiction opening column 14 are opened Mouth 2143 has small shape, so that its flow path resistance increases.Therefore, it is open in liquid supply opening 2133 and/or liquids recovery The pressure loss generated at 2143 can be approximately equal to be open in other liquid supply openings 2133 and/or other liquids recoveries The pressure loss generated at 2143.It is thereby possible to reduce the liquid supply opening 2133 and/or liquids recovery by both ends are opened Mouthfuls 2143 the ink of 23 internal flow of pressure chamber black flow with pass through other liquid supply openings 2133 and/or other liquid time Receive difference of the opening 2143 between the black flow of the ink of 23 internal flow of pressure chamber.As a result, each pressure can be further suppressed The variation of the black circular flow of room 23.

(structure (4) for inhibiting the variation of black circular flow and pressure)

Figure 37 A to Figure 37 D is the position for showing type element substrate 10 and the liquid supply opening of type element substrate 10 With the figure of the position of liquids recovery opening.It is expected that type element substrate 10 has following structure, to inhibit each pressure chamber 23 Black circular flow variation and pressure variation.That is, as shown in Figure 37 A, the end of ejiction opening column 14 and printing member Region a between the end of part substrate 10 is set big.

Region a may be used as example to the driving circuit of type element substrate 10 and type element 15 send electric signal and from The driving circuit of type element substrate 10 and type element 15 receives matching for the pad terminal (pad terminal) 16 of electric signal Between emptying.In addition, it is expected that being opened as shown in the perspective view of Figure 37 B and Figure 37 C by using this region a to configure liquids recovery Mouth 2133.That is, liquids recovery opening 2133 be configured to be located at ejiction opening column 14 ejiction opening column 14 extend The ejiction opening 13 of end on first direction is overlapped.In Figure 37 B and Figure 37 C, the left part in liquids recovery path 19 and liquid The left part of body recycling opening 2143 is at same location.In addition, as shown in figure 37 c, liquids recovery path 19 and liquid return The left part for receiving opening 2143 significantly expands to the left relative to the recovery port 17b for being located at left part.

In Figure 37 B and Figure 37 C, the ink of the pressure chamber 23 of the end by being located at ejiction opening column 14 is first such as arrow A1 institute Show from 2133 influent feed path 18 of liquid supply opening and supply mouth 17a.Then, ink passes through position as indicated by arrow a 2 It is flowed in the pressure chamber 23 of the end of ejiction opening column 14, recovery port 17b and liquids recovery path 19 and from liquids recovery opening 2143 Out.

Figure 37 D be show liquids recovery opening 2143 be configured as not be located at ejiction opening column 14 in a first direction The comparative example for the case where ejiction opening 13 of end is overlapped.In Figure 37 D, the pressure chamber of the end by being located at ejiction opening column 14 23 ink is as indicated by arrow a 1 first from 2133 influent feed path 18 of liquid supply opening and supply mouth 17a.Then, Ink as indicated by arrow a 2 by be located at ejiction opening column 14 end pressure chamber 23 and recovery port 17b.Then, ink such as arrow A3 It is shown to be flowed out by liquids recovery path 19 and from liquids recovery opening 2143.

In Figure 37 B and Figure 37 C, compared with the construction of Figure 37 D, the liquid from the end for being located at first direction can be shortened The length that body supply opening 2133 passes through the black flow path of pressure chamber 23 to liquids recovery opening 2143.That is, due in place The Max pressure loss generated inside liquid supply path 18 and liquids recovery path 19 near the end of ejiction opening column 14 Reduce, therefore the variation of the black circular flow of the inside of each pressure chamber 23 can be inhibited.In addition, in 2133 generation of liquid supply opening In the case where the end being located on first direction for liquids recovery opening 2143, liquid supply opening 2133 is configurable to and position Ejiction opening 13 in the end in a first direction of ejiction opening column 14 is overlapped.

(Temperature Distribution inhibition structure)

In the present embodiment, it provides with flowering structure to inhibit the Temperature Distribution in fluid ejection head 3.It is, such as Shown in Figure 25 and Figure 26,2143 configuration of liquids recovery opening is at the both ends of ejiction opening column 14.As in this example, pass through in ink In the case where each 23 forced circulation of pressure chamber, usually recycled from the heat of the sendings such as type element 15 by ink.Therefore, ink outflow effluent The temperature of ink in road becomes to be above the temperature of the ink of each pressure chamber 23.

In addition, even if when ensuring to be enough to inhibit to be followed by the ink of the caused influence of the moisture evaporation in the ink in ejiction opening 13 When circulation, there is a situation where as follows: wherein becoming larger than black circular flow from the ink of multiple ejiction openings 13 while ejection.At this In the case of kind, ink is also supplied in pressure chamber 23 from shared recycling flow path 212.That is, ink is supplied from shared recycling flow path 212 It gives, by independent recovery port 2145, shares recycling path 2144, liquids recovery opening 2143, liquids recovery path 19 and recycling Mouth 17b, and be fed into pressure chamber 23.Accordingly, there exist when simultaneously spray ink from multiple ejiction openings 13 when liquids recovery open The case where pressure chamber 23 that high temperature ink inside mouth 2143 is fed into.

In this case, it is attached to become to be above liquid supply opening 2133 for the temperature of the ink near liquids recovery opening 2143 Close temperature.Therefore, worry the ejiction opening 13 near liquid supply opening 2133 and the spray near liquids recovery opening 2143 The difference of black spouting velocity may occur between outlet 13.In addition, being located at the two of ejiction opening column 14 in liquid supply opening 2133 It is whole in the case that one end and liquids recovery opening 2143 in end are located at the other end in the both ends of ejiction opening column 14 Heat distribution in the orientation of a ejiction opening column 14 is inclined, therefore the heat distribution width in entire fluid ejection head becomes Greatly.As a result, worrying that ink sprays characteristic in each ejiction opening 13 may change.

It in the present embodiment, can be with since 2143 configuration of liquids recovery opening is at the both ends of ejiction opening column 14 Ink is inhibited to spray the variation of characteristic by inhibiting the inclination of heat distribution.In addition, even if existing in the configuration of liquid supply opening 2133 In the case where the both ends of ejiction opening column 14, it is also possible to obtain identical effect.However, as in the present embodiment, it is expected that The both ends configuration liquids recovery opening 2143 of ejiction opening column 14.

That is, as described above, being arranged in type element substrate 10 in the end of type element substrate 10 and ejiction opening Between every one end in 14 both ends, the region a for being not used for configuration ejiction opening 13 is arranged to greatly, therefore in ink ejection operation The heat that period generates is radiated from region a.Therefore, in the case where spraying ink from multiple ejiction openings 13, there are the two of ejiction opening column 14 The temperature of end gets lower than the trend of the temperature of other parts.Since 2143 configuration of liquids recovery opening is in ejiction opening column 14 Both ends can supply high temperature ink to the both ends of ejiction opening column 14 in this case.

Therefore, because the temperature at the both ends of ejiction opening column 14 is set high to, therefore can reduce relative to other portions The temperature difference divided.As a result, ink can be inhibited to spray characteristic since the heat distribution width in entire fluid ejection head reduces Variation.

In this way, The lid component is formed on the device substrate of wafer-shaped, and device substrate is cut into printing The chip of device substrate.Therefore, it can be realized the fluid ejection head for the variation of pressure for being able to suppress pressure chamber, liquid ejection is set Standby and manufacturing method.

(second embodiment)

Hereinafter, illustrating second embodiment of the present invention with reference to the accompanying drawings.In addition, due to the essential structure of present embodiment It is identical with first embodiment, therefore will only illustrate latent structure below.

Figure 38 and Figure 39 is the figure for showing the liquid spray unit 300 of present embodiment.Here, identical appended drawing reference will Component identical with above embodiment is given, and its description will be omitted.Figure 38 is the decomposition of liquid spray unit 300 Perspective view, Figure 39 are the decomposition plan views of liquid spray unit 300.In the present embodiment, at an end of ejiction opening column 14 At portion position, liquid supply path 18 and liquid supply opening 2133 communicate with each other and liquids recovery path 19 and liquids recovery Opening 2143 communicates with each other.Similarly, at the other end position of ejiction opening column 14, liquid supply path 18 and liquid are supplied Opening 2133 communicates with each other and liquids recovery path 19 communicates with each other with liquids recovery opening 2143.

Since liquid supply opening 2133 and 2143 configuration of liquids recovery opening are at the both ends of ejiction opening column 14, with First Application Example is compared, and variation and each pressure chamber in the first direction inking circular flow of the extension of ejiction opening column 14 can be inhibited The variation of pressure in 23.In addition, each of common feed path 2134 and shared recycling path 2144 can be only fitted to Two positions.

In this way, in the present embodiment, it can be open by reduction liquid supply opening and liquids recovery Quantity simplifies black flow passage structure.

(third embodiment)

Hereinafter, illustrating third embodiment of the present invention with reference to the accompanying drawings.In addition, due to the essential structure of present embodiment It is identical with first embodiment, therefore will only illustrate latent structure below.

Figure 40 to Figure 42 A and Figure 42 B is the figure for showing the liquid spray unit 600 of present embodiment.Here, identical attached Icon note will give component identical with above embodiment, and will omit its description.Figure 40 is liquid spray unit 600 exploded perspective view, Figure 41 are the decomposition plan views of liquid spray unit 600.Figure 42 A is the type element of present embodiment The top view of substrate 610, Figure 42 B are the perspective views for showing the structure of end of ejiction opening column 14.

The type element substrate 610 of present embodiment is formed so that its shape is formed as parallelogram shape.So Afterwards, compared with the type element substrate 10 of Figure 37 A of the first Application Example, the end of the ends of ejiction opening column 14 and device substrate it Between region a small (referring to Figure 42 A).In the present embodiment, as shown in Figure 42 A, between type element substrate 610 and outside Send and receive electric signal connection pad 16 and type element 15 drive circuitry arrangement type element substrate 610 length Side.

In addition, shape is not limited to parallelogram shape, but it can be rectangular shape.Passing through type element substrate In the case that 610 combination forms the fluid ejection head (line head) of strip, type element substrate 10 be configured as such as Figure 23 D and The shape of substantially substantially one column shown in Figure 23 E or Figure 42 A, rather than zigzag fashion.

That is, adjacent device substrate is configured so that fluid ejection head in length and width directions All ends partially overlap each other.Using this configuration, the end of the ejiction opening column 14 of adjacent type element substrate 10 It can easily overlap each other in second direction corresponding with the up and down direction of Figure 42 A.

Here, " configuration of the shape of substantially one column " indicates that adjacent type element substrate 610 is configured as such as Figure 42 A institute Show on the first direction that ejiction opening 13 extends in ejiction opening column 14 and intersect with first direction and overlaps each other in second direction State.

In this way, in the present embodiment, ejiction opening 13 be configured in type element substrate 610 end it is attached Closely.In this configuration, it is difficult to by liquid supply opening 2133 or 2143 configuration of liquids recovery opening such as the first Application Example The position Chong Die with the end of ejiction opening column 14 of type element substrate 610 shown in Figure 37 B and Figure 37 C.Therefore, in this implementation In mode, liquid supply opening 2133 or liquids recovery opening 2143 be configured in as shown in Figure 42 B relative to ejiction opening arrange The position at 14 end deviation center.

In the present embodiment, liquid supply opening 2133 configures as shown in Figure 40 and Figure 41 the two of ejiction opening column 14 Near end, to inhibit the variation of black circular flow of each pressure chamber 23 and the variation of pressure and to inhibit type element substrate Temperature Distribution inside 610.

As in the present embodiment, the situation near the end of ejiction opening column 14 is configured in liquid supply opening 2133 Under, pressure difference and black circulate operation between the liquid supply path 18 and liquids recovery path 19 of the end of ejiction opening column 14 The initial differential pressure of period is compared big during ink sprays operation.Meanwhile as the first Application Example, in liquids recovery opening 2133 Configure the liquid supply path 18 and liquids recovery road in the case where the end of ejiction opening column 14, in the end of ejiction opening column 14 Pressure difference between diameter 19 is small during ink sprays operation compared with the initial differential pressure during black circulate operation.

When the pressure difference between liquid supply path 18 and liquids recovery path 19 reduces, black circular flow is reduced.Therefore, Inhibit the effect that caused influence is evaporated by the moisture in the ink of ejiction opening 13, that is, the reduction for inhibiting black spouting velocity and ink The effect of the variation of color concentration reduces.Therefore, pressure difference may be big.When as in the present embodiment by liquid supply opening 2133 Configuration is at the both ends of ejiction opening column 14, it is possible to reduce the influence of the variation of black circular flow.

Pressure in liquid supply opening 2133 is set to the pressure being higher than in liquids recovery opening 2143, to generate Black recycle stream.Therefore, it during ink sprays operation, can be readily supplied in pressure chamber 23 by liquid supply opening 2133 Ink.In this way, since the liquid supply opening 2133 for readily supplying ink is configured in the end of ejiction opening column 14 Near, therefore can reduce when spraying ink from multiple ejiction openings 13 simultaneously in liquid supply path 18 and liquids recovery path 19 Locate the pressure loss generated.

In addition, in the present embodiment, as noted previously, as between the end of ejiction opening column 14 and the end of device substrate Region a it is small, therefore the degree that is radiated from region a of heat generated during ink sprays operation is small.Since region a is small, such as Figure 42 B Shown, the length of the liquid supply path 18 from liquid supply opening 2133 to the end of ejiction opening column 14 increases.Similarly, from The length that liquids recovery opening 2143 arrives the liquids recovery path 19 of the end of ejiction opening column 14 increases.Therefore, it is supplied by liquid It is easy to receive heat from type element substrate 610 to the ink in path 18 and liquids recovery path 19.

Therefore, when spraying ink simultaneously from multiple ejiction openings 13, there are the temperature of the end of ejiction opening column 14 to become to be above The trend of the temperature of other parts.In addition, the pressure loss generated in each black flow path increases during ink sprays operation, because The pressure of this 14 end of ejiction opening column becomes uneven.

In addition, in the present embodiment, as described above, the configuration of liquid supply opening 2133 is at the both ends of ejiction opening column 14 Portion.Therefore, a large amount of ink is supplied to the ejiction opening near the end of ejiction opening column 14 from adjacent liquid supply opening 2133 13.As a result, the amount of the high temperature ink supplied from liquid supply opening 2133 reduces when spraying ink simultaneously from multiple ejiction openings 13, Therefore the temperature that can reduce the end of ejiction opening column 14 increases.

Specifically, the ink supplied from liquid supply opening 2133 is supplied from liquid first as shown in the arrow B1 of Figure 42 B Path 18 flows into supply mouth 17a.Then, ink passes through 23 He of pressure chamber positioned at the end of ejiction opening column 14 as shown in arrow B2 Recovery port 17b.Then, ink is flowed out by liquids recovery path 19 and from liquids recovery opening 2143 as shown with arrow a 3.

In this way, in the present embodiment, since liquid supply opening 2133 is configured the two of ejiction opening column 14 End, therefore the variation of the variation of circular flow and the pressure of ink can be inhibited, and reduce the temperature in fluid ejection head point Cloth.Therefore, because the reduction of ink spouting velocity and ink as caused by the evaporation of the moisture in the ink in ejiction opening 13 can be inhibited Color concentration variation, and ink can be inhibited to spray the variation of characteristic, therefore the figure of high-quality can be printed with high precision Picture.

(arrangement of liquid supply opening and liquids recovery opening)

Figure 43 A and Figure 43 B are the figures for showing the Temperature Distribution of type element substrate 610 when ink is sprayed from all ejiction openings Table.Next, by the Temperature Distribution for the entire type element substrate 610 for illustrating present embodiment.Type element substrate 610 is controlled Make the temperature at 50 DEG C.Since the flow when spraying operation is greater than the flow of black recycle stream, so being open in liquids recovery It is directed toward ejiction opening in black flow direction in 2143.Additionally, there are liquid supply opening 2133 and liquids recovery opening 2143 it The biggish trend of flow of middle liquid supply opening 2133.Figure 43 A shows 2133 He of liquid supply opening as comparative example Temperature Distribution of each of liquids recovery opening 2143 configuration in an ejiction opening column 14.

The ink for flowing through liquid supply path 18 or liquids recovery path 19 receives heat from type element substrate 610, so that in The temperature in centre portion increases.In addition, when the temperature of comparative liquid supply opening 2133 and liquids recovery opening 2143, liquid supply The temperature of opening 2133 is low, because the flow of liquid supply opening 2133 is big.In addition, even if not being open in liquids recovery in ink In 2143 in the case where reverse flow, flow through type element substrate 610 and receive heat ink flow to liquids recovery opening 2143.Cause This, there are the trend that the temperature of liquid supply opening 2133 reduces.

Figure 43 B shows liquid supply opening 2133 and liquids recovery opening in the ejiction opening column of present embodiment 2143 alternately configure Temperature Distribution in the case where multiple positions.Due to being returned relative to liquid supply opening 2133 and liquid The distance for receiving opening 2143 is short, so the length in liquid supply path 18 and liquids recovery path 19 shortens.Therefore, temperature will not Increase too many.In particular, temperature becomes equal to the temperature of liquids recovery opening 2143.Further, since liquid supply opening 2133 It being alternately arranged with liquids recovery opening 2143, the maximum length of liquid supply line 18 and liquids recovery flow path 19 becomes to shorten, Therefore temperature not will increase too much.

In this way, in the present embodiment, due to liquid supply opening 2133 and liquid in an ejiction opening column Body recycling opening 2143 alternately configures at multiple positions, therefore can reduce and beat compared with Figure 43 A for corresponding to comparative example Temperature difference inside printing elements substrate 610.Therefore, because the variation of ejection characteristic can be inhibited, it is possible to higher essence Degree forms the image of high-quality.As long as in addition, the setting of any of liquid supply opening 2133 and liquids recovery opening 2143 In at least two positions, so that it may obtain the effect of present embodiment.

Figure 44 A is shown according to the type element substrate 610 with parallelogram shape in multiple ejiction opening column 14 The chart of the Temperature Distribution of each ejiction opening column 14 in the case that liquid supply opening 2133 and liquids recovery opening 2143 deviate.Though So had differences between the kelvin rating in each ejiction opening column according to the position of ejiction opening column, but high temperature location and low temperature Position is different according to the difference between liquid supply opening 21a and liquids recovery opening 21b.Figure 44 B is shown in ejiction opening The chart of the average temperature distribution of the column direction figure 4 above 4A of column 14.

Since the high temperature location in each ejiction opening column is with low position difference, the type element substrate under average state Temperature difference inside 610 becomes smaller than the temperature difference in all ejiction openings column of Figure 44 A.Therefore, when printed material scanning direction (the relative scanning direction between fluid ejection head and printed material) perpendicular to ejiction opening column 14 column direction when, can obtain by The equalization of the influence of the variation of characteristic is sprayed caused by the temperature difference of printed material.

In this way, since liquid supply opening 2133 and liquids recovery opening 2143 are configured as offsetting with one another, Therefore the equalization of the temperature difference as caused by the configuration of liquid supply opening 2133 and liquid supply opening 2143 can be obtained.Cause And since the variation of ejection characteristic can be inhibited, the image of high-quality can be formed with higher precision.

(variation example of the shape of liquid supply opening and liquids recovery opening)

Figure 45 A to Figure 45 C is the variation example for showing the shape of liquid supply opening 2133 or liquid supply opening 2143 Figure.Figure 45 A is the figure for showing The lid component 620 and type element substrate 610 when from the unilateral observation opposite with ejiction opening.Figure 45B is the figure for showing the details of liquid supply opening 2133 of liquid supply path 18 and Figure 45 A on type element substrate 10. Figure 45 C is to show first flow path component 50 or the supporting member 30 including the 4th fluid passage layer 224 is joined to the state of The lid component 620 Figure.As shown in Figure 45 B, liquid supply opening 2133 is formed parallelogram shape, to match type element substrate 610 Shape.

In this parallelogram shape, it can increase between the The lid component 620 of Figure 45 C and the 4th fluid passage layer 224 The sectional area of the width W5 on joint surface or the liquid flow direction perpendicular to liquid supply opening 21a.That is, it is contemplated that Protrusion for the bonding agent for making The lid component 620 and the 4th fluid passage layer 224 be engaged with each other, it is expected that increasing liquid supply opening 2133 With the minimum clearance W6 of the shape in common feed path 2134.Since liquid supply opening 2133 is formed as parallelogram shape Shape, therefore the sectional area of liquid supply opening 2133, width W5 and gap W6 can be further increased.Since photoetching can be passed through Method is processed such as the microcosmic or complicated shape in present embodiment, it is possible to increase liquid supply opening 2133 or liquids recovery Joint surface between the sectional area and The lid component 620 and supporting member 30 or first flow path component 50 of opening 2143.

(linear expansion coefficient of The lid component)

In the fluid ejection head for being arranged with multiple type element substrates, due to independently being set at each type element substrate The lid component 620 is set, therefore the deterioration of the configuration precision of type element substrate can be inhibited.That is, in Figure 23 D or Figure 23 E Shown in fluid ejection head, when as disclosed in the specification of United States Patent (USP) No.7347534 in multiple type element bases When in plate using integrated The lid component in the longitudinal direction, the linear expansion coefficient of The lid component is acted upon by temperature changes, therefore beats The configuration precision of printing elements substrate deteriorates.On the contrary, as in the present embodiment, since The lid component 620 is set independently At each type element substrate, therefore by supporting the linear expansion coefficient of the component of type element substrate rather than the line of The lid component The coefficient of expansion significantly leads to matching for the type element substrate as caused by the temperature change in the longitudinal direction of fluid ejection head Set the deterioration of precision.

In the case where using resin film in The lid component 620, linear expansion coefficient normally becomes about 30ppm.On the contrary, for example, When using aluminium oxide in the component for supporting multiple type element substrates 610, linear expansion coefficient becomes about 7ppm.Then, when When using being filled with the resin material for reducing the filler of linear expansion coefficient, linear expansion coefficient can be set as to about 20ppm.Also It is to say, since The lid component 620 is provided independently at each type element substrate, and integrally supports multiple type element bases The linear expansion coefficient of the component of plate 610 reduces, therefore the configuration precision of type element substrate can be improved.

(clearance portion between adjacent plate)

In the present embodiment, since independent The lid component 620 being arranged at each type element substrate, it is possible to reduce The deviation width of the ejiction opening column of the joint of type element substrate 610.That is, in The lid component across adjacent printing member When the formation of part substrate, there is the case where needing bonding agent when type element substrate is joined to The lid component.In this case, it examines The expansion or creep for considering bonding agent need to widen the gap between adjacent type element substrate.On the contrary, in present embodiment In, when the construction (1) of the clearance portion between the adjacent panels using the 4th embodiment described later on and (2), can reduce Gap between adjacent print device substrate, and do not have to the expansion or creep that consider bonding agent.As a result, can reduce in printing member The deviation width on printed material scanning direction between the type element substrate of the joint of part substrate, and reduce ejiction opening The deviation width of column.Therefore, because reducing the problem of inhomogeneities in the image at joint portion etc., therefore it is capable of forming The image of high-quality.

(the 4th embodiment)

Hereinafter, illustrating the 4th embodiment of the invention with reference to the accompanying drawings.In addition, due to the essential structure of present embodiment It is identical with first embodiment, therefore will only illustrate latent structure below.

(construction (1) of the clearance portion between adjacent plate)

Figure 46 A, Figure 46 B, Figure 47 A and 47B are the gaps shown between the adjacent type element substrate of present embodiment The exemplary figure of the construction in portion.Figure 46 A and Figure 46 B are the schematic diagrames of the fluid ejection head of present embodiment, and Figure 46 A is three-dimensional Figure, Figure 46 B is exploded perspective view.Figure 47 A and Figure 47 B are the gaps shown between the adjacent device substrate of present embodiment Schematic diagram, Figure 47 A are top views, and Figure 47 B is the sectional view intercepted along the line XLVIIb-XLVIIb of Figure 47 A.

In the present embodiment, the configuration of The lid component 20 is at the back surface of type element substrate 10, in type element substrate 10 back surface setting supplies a liquid to the liquid supply path 18 of ejiction opening 13, and The lid component 20 is supplied for Covering Liguid To path 18.In addition, to liquid supply path 18 supply liquid liquid supply opening 2133 setting The lid component 20 and with set Set the feed path connection inside supporting member.

In the present embodiment, since ejiction opening 13 is also disposed in first towards supporting member of type element substrate 50 At the upside region outstanding of the slot 55 of channel member 50, therefore the deviation width of ejiction opening column is in the engagement of type element substrate It is reduced at portion.As shown in Figure 47 B, liquid supply path 18 is also disposed at the clearance portion between adjacent type element substrate 10 Towards at the type element substrate 10 outstanding of the upside of the slot of first flow path component 50, and The lid component 20 is for covering right liquid Feed path 18.Then the joint portion between The lid component 20 and supporting member 50 is at adjacent clearance portion from type element substrate Outer edge enter inside.

In this way, due to towards the liquid supply path 18 at the position outstanding of the upside of slot 55 by The lid component 20 coverings, therefore liquid can also beaten at the outwardly projecting position in end relative to first flow path component 50 by setting Liquid supply path 18 at the back surface of printing elements substrate 50 is fed into outlet 13.That is, due to being formed in The width (length on the length direction of first flow path component 50) of slot 55 on one channel member is set to be greater than printing The width in the gap between device substrate, it is possible to reduce the gap between adjacent type element substrate.Further, since It is covered towards the liquid supply path 18 at the upside position outstanding of the slot 55 of first flow path component 50 by The lid component 20, therefore Ejiction opening 13 can be only fitted to the end of type element substrate 10.Therefore, connecing in type element substrate can be further decreased The deviation width of ejiction opening column at conjunction portion.

The gap between type element substrate is reduced to from 0.2mm by using present embodiment for example, will compare The case where 0.03mm.Ejiction opening in the end of ejiction opening column can be only fitted to the position of the end 0.05mm apart from type element And in the case that the angle of bevel edge is 45 °, the deviation width of ejiction opening column becomes about 0.18mm from about 0.42mm.Therefore, may be used Significantly to reduce the deviation width of ejiction opening column through the invention.

In this way, even if making type element substrate 10 and first flow path component 50 be engaged with each other using bonding agent In the case where, the printed material scanning direction between type element substrate can also be reduced at the joint portion of type element substrate On deviation width and reduce ejiction opening column deviation width.As a result, due to reduce joint portion image in such as not The problem of uniformity etc., therefore it is capable of forming the image of high-quality.

In addition, in the present embodiment, the shape of The lid component 20 can be less than the shape of type element substrate 10.Namely It says, since adjacent type element substrate can be closer proximity to each other, and it is unrelated with machining accuracy of the The lid component 20 at joint portion, Therefore can reduce at the joint portion of type element substrate between type element substrate on printed material scanning direction Deviate width and reduces the deviation width of ejiction opening column.As a result, due to reduce joint portion image in such as inhomogeneities Deng problem, therefore be capable of forming the image of high-quality.

(construction (2) of the clearance portion between adjacent plate)

Figure 48 A, Figure 48 B, Figure 49 A and Figure 49 B are the constructions for showing the clearance portion between the adjacent plate of present embodiment Exemplary figure.Figure 48 A and Figure 48 B are the schematic diagrames for showing the fluid ejection head of structure example, and Figure 48 A is perspective view, and Figure 48 B is Exploded perspective view.Figure 49 A and Figure 49 B are the schematic diagrames for showing the gap between the adjacent device substrate of present embodiment, figure 49A is top view, and Figure 49 B is the sectional view intercepted along the line XLIXb-XLIXb of Figure 49 A.

Here, the case where gap between more adjacent type element substrate being reduced to 0.02mm from 0.2mm.It is spraying The ejiction opening for exporting the end of column can be only fitted to position and the bevel edge of chip of end 0.05mm apart from type element In the case that angle is 45 °, the deviation width of ejiction opening column becomes about 0.17mm from about 0.42mm.It therefore, can be by this hair The bright deviation width for substantially reducing ejiction opening column.

In this way, according to the present invention it is possible to reduce between the element of the joint of type element substrate 10 Deviation width on printed material scanning direction and the deviation width for reducing ejiction opening column.As a result, due to reducing engagement The problem of inhomogeneities in the image in portion etc., therefore it is capable of forming the image of high-quality.

In addition, with above-mentioned structure example likewise it is possible to inhibit the bonding agent of ejection port face in the adjacent of type element substrate Creep at part.When making The lid component 20 and first flow path component 50 be engaged with each other using bonding agent, due to such as in this implementation The jag of The lid component 20 and type element substrate 10 protrudes outward and bonding agent outstanding from first flow path component 50 in mode Assemble at the back side of The lid component 20.Thus, compared with the construction that end does not protrude outward, be able to suppress adjacent part The creep of bonding agent at ejection port face.

In addition, being illustrated by using the type element substrate 10 with parallelogram shape of present embodiment The construction of clearance portion between adjacent plate, but the present invention is not limited to parallelogram shapes.For example, present invention may also apply to Fluid ejection head configured with multiple rectangular print device substrates 10.

(the 5th embodiment)

Hereinafter, illustrating the 5th embodiment of the invention with reference to the accompanying drawings.In addition, due to the essential structure of present embodiment It is identical with first embodiment, therefore will only illustrate latent structure below.Even if in the present embodiment, with above embodiment Similarly, third fluid passage layer 223 is set as The lid component.

Figure 50 and Figure 51 is the figure for showing the liquid spray unit 700 of present embodiment.Here, identical appended drawing reference will Component identical with above embodiment is given, and its description will be omitted.Figure 50 is the decomposition of liquid spray unit 700 Perspective view, Figure 51 are the decomposition plan views of liquid spray unit 700.

In the present embodiment, as shown in figure 50, for four ejiction opening column 14 (14A, 14B, 14C and 14D) configurations three A liquid supply path 18 (18A, 18B and 18C) and two liquids recovery paths 19 (19A and 19B).As shown in figure 51, it shares Recovery port 17b is configured between ejiction opening column 14A and 14B, and recovery port 17b is connected to liquids recovery path 19A.

In addition, common feed mouth 17a configures supply mouth 17a and liquid supply path between ejiction opening column 14B and 14C 18B connection.In addition, sharing recovery port 17b configuration between ejiction opening column 14C and 14D, and recovery port 17b and liquids recovery Path 19B connection.The supply mouth 17a of ejiction opening column 14A is connected to liquid supply path 18A, the supply mouth of ejiction opening column 14D 17a is connected to liquid supply path 18C.

In this way, a liquid supply path 18B passes through the common feed mouth of two ejiction opening column 14B and 14C 17a is connected at ejiction opening column 14B and 14C with pressure chamber 23.In addition, a liquids recovery path 19A passes through two ejiction openings The shared recovery port 17b of column 14A and 14B is connected to the pressure chamber 23 of ejiction opening column 14A and 14B.Similarly, a liquids recovery Path 19B is connected by the pressure chamber 23 of the shared recovery port 17b and ejiction opening column 14C and 14D of two ejiction opening column 14C and 14D It is logical.

According to the present embodiment, other than the effect of above embodiment, following effect can also be obtained.Namely It says, since two adjacent ejiction openings arrange shared liquid supply path 18 and liquids recovery path 19, it is possible to reduce ink stream The quantity of the quantity of partition wall between road and black flow path.Therefore, the gap turn narrow and increase between ejiction opening column 14 can be made The width of black flow path.

As a result, the variation of the black circular flow of each pressure chamber 23 and the variation of pressure can be further suppressed.In addition, with upper It states embodiment to compare, the size of liquid spray unit 700 can be reduced by further densely configuring ejiction opening column 14 With the size of fluid ejection head.In addition, can further press down in the case where ejiction opening column 14 are with the arrangement of identical arranging density The pressure change of the variation sum of the black circular flow of the pressure chamber Zhi Ge 23, and reduce the quantity and liquid of liquid supply opening 2133 Body recycling opening 2143.Therefore, it can simplify the black flow passage structure of liquid spray unit 700.

(sixth embodiment)

Hereinafter, illustrating sixth embodiment of the invention with reference to the accompanying drawings.In addition, due to the essential structure of present embodiment It is identical with first embodiment, therefore will only illustrate latent structure below.Even if in the present embodiment, with above embodiment Similarly, third fluid passage layer 223 is set as The lid component.

Figure 52 and Figure 53 is the figure for showing the liquid spray unit 800 of present embodiment.Here, identical appended drawing reference will Component identical with above embodiment is given, and its description will be omitted.Figure 52 is the decomposition of liquid spray unit 800 Perspective view, Figure 53 are the decomposition plan views of liquid spray unit 800.

In the present embodiment, the ejiction opening column with the ejiction opening 13M for the first ink are formed and are had and are used for second The ejiction opening column of the ejiction opening 13Y of ink, so that different colours or different types of ink are ejected into a liquid spray unit 800 In.Second flow path layer 222 is provided with the liquid supply path 18M for the first ink, for the liquid supply path of the second ink 18Y, the liquids recovery path 19M for the first ink and the liquids recovery path 19Y for the second ink.Third fluid passage layer 223 is set It is equipped with the liquid supply opening 2133M for the first ink, the liquid supply opening 2133Y black for second, for the first ink The liquids recovery opening 2143M and liquids recovery black for second opening 2143Y.

4th fluid passage layer 224 is provided with the common feed path 2134M for the first ink, for the common feed of the second ink Path 2134Y, the shared recycling path 2144M for the first ink and the shared recycling path 2144Y for the second ink.5th stream Road floor 225 is provided with being independently supplied a mouthful 2135M, be independently supplied a mouthful 2135Y, for first for the second ink for the first ink The independent recovery port 2145M of the ink and independent recovery port 2145Y black for second.6th fluid passage layer 226 is provided with for first The common feed flow path 211M of ink, the common feed flow path 211Y for the second ink, the shared recycling flow path black for first The 212M and shared recycling flow path 212Y black for second.

As in the first application example, the first ink and the second ink be supplied respectively to from common feed flow path 211M and 211Y, It is flowed out by corresponding pressure chamber 23 and from shared recycling flow path 212M and 212Y.

In addition, a liquid supply path can be with the pressure of two ejiction openings column as in the 5th embodiment Room is connected to jointly.Similarly, the pressure chamber that a liquids recovery path can be arranged with two ejiction openings is connected to jointly.In addition, the The width in a second direction of six fluid passage layers 226 can be set as the width in a second direction greater than type element substrate 10 Degree.

It in this way, can also even if in the fluid ejection head of black or a plurality of types of ink for spraying multiple color With inhibit the black circular flow of each pressure chamber variation and pressure variation without expanding liquid supply path and liquids recovery road The width of diameter.Thus, the drop since the ink spouting velocity due to caused by the moisture evaporation in the ink in ejiction opening can be inhibited The variation of low and black color concentration, it is possible to print high quality image with high precision.

(configuration relation of flow path 18M and 19M and the configuration relation of flow path 18Y and 19Y)

Furthermore, it is possible to which setting is used for the liquid supply path 18M and liquids recovery path 19M of the first ink as follows The configuration relation of configuration relation and liquid supply path 18Y and liquids recovery path 19Y for the second ink.That is, As shown in figure 54, the shared outflow flow path 19M and common feed stream between the first black ejiction opening column and the second black ejiction opening column Beam width between the 18Y of road is set to beam width W4, and beam width W4 is set to be greater than beam width W1.

Since beam width W4 is set big, it is possible to inhibit due to sharing outflow flow path 19M and common feed flow path Ink leakage between 18Y and the problem of cause black color to be mixed with each other.Here, the relationship between beam width W3 and beam width W4 can With identical or different.Particularly, when beam width W3 is big, it can reduce the pressure loss of the flow path relative to ink flowing.Thus, spray Characteristic becomes satisfactory out.It in this way, can be while the pressure in liquid supply path be remained negative pressure Inhibit black color to be mixed with each other, and inhibits the adverse current of black recycle stream.

(the 7th embodiment)

Hereinafter, illustrating the 7th embodiment of the invention with reference to the accompanying drawings.In addition, due to the essential structure of present embodiment It is identical with first embodiment, therefore will only illustrate latent structure below.

In the present embodiment, fluid ejection head does not generate black recycle stream different from the embodiment described above.In each ejection In mouthful column, supply mouth, liquid supply opening, is independently supplied flow path, communication port and common feed mouth and connects each other liquid supply path It is logical.

Even if matching in the fluid ejection head for not generating black recycle stream since the form accuracy of liquid supply opening improves Precision is set, therefore can reduce the variation of flow path resistance, that is to say, that even if being sprayed in the liquid that ejiction opening is densely configured In head, also reduce the pressure loss in supply line.Thus, the variation of the pressure of the meniscus due to can reduce ejiction opening is simultaneously The drop with single-size is sprayed, therefore the image of high-quality can be formed with higher precision.

Although illustrating the present invention referring to illustrative embodiments, but it is to be understood that it is public that the present invention is not limited to institutes The illustrative embodiments opened.The range of claims should meet broadest explanation, with comprising all these modifications, etc. Same structure and function.

Claims (26)

1. a kind of manufacturing method of fluid ejection head, the fluid ejection head include device substrate, the device substrate includes: spray Out the ejiction opening of liquid, be arranged to corresponding with the ejiction opening and generate the energy for spraying liquid from the ejiction opening Element and the internal pressure chamber that the element is set, which is characterized in that the described method includes:

Preparation is provided at the back side in the face for being provided with the ejiction opening of device substrate supplies a liquid to the pressure chamber Feed path the device substrate；

Membranaceous The lid component is set at the back side for the device substrate for being provided with the feed path to cover the supply road Diameter；And

The multiple supply openings being connected to the feed path are formed at the The lid component.

2. according to the method described in claim 1, wherein,

The The lid component is photosensitive resin film, and

The lid component forming step include at least by the The lid component be transferred to the device substrate the back side transfer step, make institute It states the step of exposure of The lid component exposure and makes the development step of the The lid component development.

3. according to the method described in claim 2, wherein,

In device substrate preparation step, multiple device substrates are formed as into wafer, and

Cutting step is executed after supply opening forming step the wafer is cut into multiple device substrates.

4. according to the method described in claim 2, wherein,

In device substrate preparation step, the back side of the device substrate is provided with the recycling road for recycling the liquid of the pressure chamber Diameter,

In The lid component forming step, the back side of the device substrate is provided with the The lid component for covering the recycling path, And

In supply opening forming step, the The lid component, which is provided with, to be connected to and than the recycling path with the recycling path Small multiple recycling opening.

5. a kind of fluid ejection head comprising:

Device substrate, the device substrate include the ejiction opening for spraying liquid, are arranged to corresponding with the ejiction opening and generate For spraying the element of the energy of liquid and the pressure chamber of the internal setting element from the ejiction opening；And

Resin film, the resin film are set to the back side in the face for being provided with the ejiction opening of the device substrate, and described Resin film includes the supply opening that liquid is supplied to the pressure chamber,

It is characterized in that,

A part of liquid path is formed by the resin film, and is arranged and is connected to the pressure chamber and the supply opening Feed path,

It is less than the shape of the device substrate, the profile portion of the resin film so as not to prominent from the shape of the device substrate Out.

6. fluid ejection head according to claim 5, wherein

The back side of the device substrate is provided with a part of the liquid path formed by the resin film and recycles the pressure The recycling path of the liquid of room,

The resin film is provided with the recycling being connected to the recycling path and is open.

7. a kind of fluid ejection head for spraying liquid comprising:

Device substrate, the device substrate include the ejiction opening for spraying liquid, are arranged to corresponding with the ejiction opening and generate For spraying the element of the energy of liquid and the pressure chamber of the internal setting element from the ejiction opening；And

Resin film, the resin film are set to the back side in the face for being provided with the ejiction opening of the device substrate, and described Resin film includes being open to the supply opening of pressure chamber supply liquid and from the recycling of pressure chamber's withdrawal liquid,

It is characterized in that,

The back side of the device substrate is provided with the supply that the liquid supplied from the supply opening is supplied to the pressure chamber Path and the recycling path that will be open from the liquids recovery that the pressure chamber recycles to the recycling, and

A part of the feed path and a part in the recycling path are formed by the resin film.

8. fluid ejection head according to claim 7, wherein

The feed path and it is described recycling path be configured to and be arranged with multiple ejiction openings ejiction opening column with The length made on the first direction of the extending direction of the ejiction opening column is corresponding.

9. fluid ejection head according to claim 8, wherein

The feed path and the recycling path are alternately arranged in the second direction intersected with the first direction.

10. fluid ejection head according to claim 7, wherein

The device substrate is provided with multiple supply mouths and multiple recovery ports, and the multiple supply mouth is by the liquid of the feed path Body is supplied to the pressure chamber, and the multiple recovery port is by the liquids recovery of the pressure chamber to the recycling path.

11. fluid ejection head according to claim 10, wherein

The supply mouth and the recovery port are liquid path of the length direction along the thickness direction of the device substrate.

12. fluid ejection head according to claim 7, wherein

The thickness of the resin film is less than 25 μm.

13. fluid ejection head according to claim 7, wherein

Bonding agent is not involved between the device substrate and the resin film.

14. fluid ejection head according to claim 7, wherein

The shape of the device substrate is formed parallelogram shape.

15. fluid ejection head according to claim 7, wherein

The shape of the device substrate is parallelogram shape, and in the supply opening and recycling opening at least One has parallelogram shape.

16. fluid ejection head according to claim 7, wherein

The supporting member that the device substrate is supported across the resin film is set, and in the supporting member and the resin Bonding agent is set between film.

17. fluid ejection head according to claim 7, wherein

Multiple supply openings are configured to be connected to a feed path.

18. fluid ejection head according to claim 7, wherein

The supply opening and the recycling opening are in the extending direction for being used as the ejiction opening column for being arranged with multiple ejiction openings First direction on be alternately arranged.

19. fluid ejection head according to claim 7, wherein

The fluid ejection head is the fluid ejection head for including multiple device substrates, and the resin film is configured at each element base Plate, and the adjacent device substrate is configured as being partially overlapped by each other on the length direction of the fluid ejection head.

20. fluid ejection head according to claim 16, wherein

The multiple device substrates of support member support,

Slot is set at the adjacent part adjacent to each other in the device substrate of the supporting member, and the width of the slot is greater than The width in the gap between the device substrate, and at the adjacent part between the resin film and the supporting member Joint portion from the outer edge of the device substrate enter inside.

21. fluid ejection head according to claim 16, wherein

The linear expansion coefficient of the supporting member is less than the linear expansion coefficient of the resin film.

22. fluid ejection head according to claim 16, wherein

The multiple supporting members for supporting the device substrate respectively are set, and

Joint portion between the supporting member and the resin film at device substrate adjacent part adjacent to each other from The outer edge of the device substrate enters inside.

23. fluid ejection head according to claim 7, wherein

The shape of the resin film is less than the shape of the device substrate, so as not to prominent from the shape of the device substrate.

24. fluid ejection head according to claim 7, wherein

The fluid ejection head is the page width type fluid ejection head that multiple device substrates linearly arrange.

25. fluid ejection head according to claim 7, wherein

Outer loop of the indoor liquid of pressure to the pressure chamber.

26. a kind of liquid discharge apparatus, with fluid ejection head, the fluid ejection head includes device substrate and resin film, The device substrate includes: the ejiction opening for spraying liquid, is arranged to and generation corresponding with the ejiction opening for from the spray Outlet sprays the element of the energy of liquid and the internal pressure chamber that the element is arranged, the resin film are arranged in the element base The back side in the face for being provided with the ejiction opening of plate and the resin film include opening to the supply of pressure chamber supply liquid Mouthful and from the recycling of pressure chamber's withdrawal liquid be open,

It is characterized in that,

The back side of the device substrate is provided with the supply that the liquid supplied from the supply opening is supplied to the pressure chamber Path and the recycling path that will be open from the liquids recovery that the pressure chamber recycles to the recycling, and

The a part in the feed path and the recycling path is formed by the resin film.