CN107022776B - A kind of pcb board board falling monitoring device and electroplanting device - Google Patents
A kind of pcb board board falling monitoring device and electroplanting device Download PDFInfo
- Publication number
- CN107022776B CN107022776B CN201710444968.7A CN201710444968A CN107022776B CN 107022776 B CN107022776 B CN 107022776B CN 201710444968 A CN201710444968 A CN 201710444968A CN 107022776 B CN107022776 B CN 107022776B
- Authority
- CN
- China
- Prior art keywords
- pcb board
- sensor
- board
- support frame
- falling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention belongs to pcb boards, and related fields is electroplated, disclose a kind of pcb board board falling monitoring device and electroplanting device, above-mentioned pcb board board falling monitoring device includes ultrasonic sensor and controller, wherein: ultrasonic sensor issues the placement location of the direction face pcb board of monitoring signals, monitoring result signals are sent to controller for being monitored to pcb board by ultrasonic sensor.Electroplanting device of the invention includes above-mentioned pcb board board falling monitoring device.The present invention monitors whether corresponding pcb board occurs board falling by the ultrasonic sensor in pcb board board falling monitoring device, and monitoring signals are not influenced by the factor of production and production environment factor, and monitoring result is more acurrate.
Description
Technical field
The present invention relates to pcb board electroplating technology more particularly to a kind of pcb board board falling monitoring devices and pcb board to be electroplated
Device.
Background technique
Pcb board is in plating production process, and board falling frequent occurrence, i.e. pcb board are detached from electroplating clamp, in case of board falling
Fail to find in time, adverse effect can be generated to plating plate quality and electro-coppering cylinder by crossing plating for a long time.
Photoelectric sensor monitoring board falling is generallyd use in the prior art, and surface smoothness holds pcb board in the plating process
Easily changing, the color and surface gloss of pcb board can also change, and pcb board surface droplet easy to attach, and this
A little situations can all have an impact the monitoring result of photoelectric sensor, be easy to cause even if board falling does not occur, photoelectric sensor is but
Issue the monitoring result for monitoring board falling；Also there is the method monitoring board falling using artificial line walking, this method usually can not be timely
It was found that board falling, and labor intensive.
Therefore, it is necessary to provide a kind of improved board falling monitoring device and its control method to overcome drawbacks described above.
Summary of the invention
The purpose of the present invention is to provide a kind of pcb board board falling monitoring devices, are produced with solving existing photoelectric sensor
The influence of factor, the problem of monitoring result inaccuracy.
Another object of the present invention is to provide a kind of pcb board electroplanting device, including above-mentioned pcb board board falling monitoring device,
To improve the accuracy that board falling monitors in pcb board electroplating process.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of pcb board board falling monitoring device, including ultrasonic sensor and controller, in which: the supersonic sensing
Device issues the placement location of the direction face pcb board of monitoring signals, and the ultrasonic sensor is for supervising the pcb board
It surveys, and monitoring result signals is sent to the controller.
Monitor whether corresponding pcb board occurs board falling in the plating process by using ultrasonic sensor, not by
The influence of the factor of production and production environment factor, monitoring result are more acurrate.
Preferably, further including sensor mounting box, the ultrasonic sensor is installed on the sensor mounting box.
By be arranged sensor mounting box can make ultrasonic sensor avoid being electroplated in plating production process in object
Body and other foreign objects touch, and on the one hand protect ultrasonic sensor against damages, on the other hand, ensure that in use
The position of ultrasonic sensor and ultrasonic wave issue direction and will not change, to ensure that the accuracy of monitoring result.
Preferably, further including sensor support frame, the sensor mounting box is mounted on the sensor support frame,
And it is adjustable along the sensor support frame lengthwise location.
It is adjustable by position of the sensor mounting box on sensor support frame, thus when clamping different size model numbers
Pcb board when, equally can satisfy pcb board and the mutual corresponding needs of ultrasonic sensor, make same set of pcb board electroplanting device
It can be used for various sizes of pcb board.
Preferably, further including connecting device for sensor, the connecting device for sensor includes link block and locking plate, institute
It states link block to be fixedly connected with the ultrasonic sensor mounting box, the link block and the locking plate are along the sensor support
Frame length direction slidably, and is connected and fixed on sensor support frame by connecting component between the two.
By the release of connecting component, position of the adjustable sensor mounting box on sensor support frame passes through company
The locking of relay part the position of sensor mounting box can be fixed.
Preferably, the side of the sensor support frame is provided with through slot along its length, the link block is placed in
The outside of the through slot, the locking plate are set to the inside of the through slot, and the link block passes through described in the locking plate
Through slot slidably, and is connected and fixed on sensor support frame by connecting component between the two.
By the way that through slot is arranged on sensor support frame, for connecting component successively by link block, through slot and locking plate are solid
Fixed to arrive together, when unclamping connecting component, link block and locking plate can be along the direction slidable adjustments of slot.
A kind of pcb board electroplanting device, including above-mentioned pcb board board falling monitoring device.
Corresponding pcb board is monitored by the ultrasonic sensor in pcb board board falling monitoring device, to improve
The accuracy that board falling monitors in pcb board electroplating process.
Preferably, further including pcb board clamping device, the pcb board clamping device includes electroplating clamp, the plating folder
Tool is for clamping at least one pcb board.
At least one pcb board can be clamped simultaneously by pcb board clamping device and carries out electroplating activity, to realize extensive
Production.
Preferably, further include vertical movement device, the vertical movement device include at least one vertical drive,
Moved cross beam and bracket, in which: the vertical drive is fixed on the bracket, and each vertical drive is equal
It has been correspondingly connected with the moved cross beam and the moved cross beam can be driven mobile, the moved cross beam and the pcb board press from both sides
It holds device to be flexibly connected and the pcb board clamping device can be driven mobile, the moved cross beam both ends are sliding with the bracket respectively
Dynamic connection, the bracket are fixedly connected with the sensor support frame.
It is flexibly connected with pcb board clamping device by vertical movement device, drives entire pcb board clamping device and thereon
Pcb board rises or declines in vertical direction；Board falling monitoring device is fixed on bracket by sensor support frame, in pcb board
In process of rising or falling, when ultrasonic sensor face pcb board, monitoring of the ultrasonic sensor to pcb board is realized.
Preferably, the vertical drive includes vertical driving motor, vertical movement drive shaft and suspender belt,
In: the vertical driving motor is fixed on the either side of the fixed cross beam of the cradle top, the vertical driving motor and water
The vertical movement of flat setting drives axis connection, and described suspender belt one end is fixedly connected with the vertical movement drive shaft, another
End is fixedly connected with the moved cross beam.
Drive vertical movement drive shaft turns to drive suspender belt to roll and decontrol especially by setting vertical driving motor,
It realizes the rise and fall of moved cross beam, and then realizes the rise and fall of pcb board clamping device and pcb board thereon.
Preferably, further include moving forward and backward device, the device that moves forward and backward includes that front and back driving motor, vehicle body are total
At, trapped orbit and connecting plate, in which: the body assembly is slidably connected with the trapped orbit, the front and back driving electricity
Machine is fixed on the body assembly, and the body assembly is driven by the front and back driving motor, is moved along the trapped orbit,
Length of wagon direction both ends are respectively fixed with connecting plate, and the connecting plate is connected to bracket structure supported on both sides
Outside.
Vertical movement device can be driven to move in front-rear direction by moving forward and backward device, so as to drive pcb board
It is moved in front-rear direction, and then multiple working procedure can be arranged according to the range moved forward and backward during electroplating activity, realized big
Scale, automated production.
Beneficial effects of the present invention: pcb board is monitored by using ultrasonic sensor, monitoring signals are not electroplated
The influence of pcb board surface smoothness, color and surface gloss variation in the process, equally not by pcb board table in electroplating process
Face speckles with the influence of droplet, to improve the accuracy of monitoring result.
Detailed description of the invention
Fig. 1 is the schematic diagram of one pcb board board falling monitoring device of the embodiment of the present invention；
Fig. 2 be Fig. 1 along the sectional view of A-A；
Fig. 3 is the schematic diagram of two pcb board electroplanting device of the embodiment of the present invention；
Fig. 4 is the schematic diagram of three pcb board electroplanting device of the embodiment of the present invention；
Fig. 5 is another multi-angled view of pcb board electroplanting device shown in Fig. 4；
Fig. 6 is cross-sectional view of pcb board electroplanting device shown in Fig. 4 along B-B.
In figure:
10, vertical movement device；101, vertical driving motor；102, bracket；103, move vertically drive shaft；104, it hangs
Band；105, moved cross beam；106, idler wheel；107, lifting portion；108, idler wheel sliding rail；1021, support frame；1022, top cross-bar 20,
Move forward and backward device；201, front and back driving motor；202, connecting plate；203, driving wheel；204, trapped orbit；205, it moves forward and backward
Drive shaft；206, vehicle body；30, board falling monitoring device；301, sensor support frame；3011, through slot；302, link block；303,
Locking plate；304, sensor mounting box；305, ultrasonic sensor；306, connecting component；307, sensor mounting seat；40,PCB
Plate clamping device；401, winged bar；402, pcb board；403, electroplating clamp；404, hanging part is played；405, collet.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
Embodiment one:
The present embodiment provides a kind of pcb board board falling monitoring devices, as shown in Figs. 1-2, the pcb board board falling monitoring device 30 packet
Include ultrasonic sensor 305, sensor mounting box 304, connecting device for sensor, sensor support frame 301, controller, alarm
Device and/or control panel, in which:
Above-mentioned ultrasonic sensor 305 can be directly anchored on the box body of sensor mounting box 304, can also by
Sensor mounting seat 307 is set inside mounting box 304, ultrasonic sensor 305 is mounted on sensor mounting seat 307
On, protect ultrasonic sensor 305 in the plating process not by being electroplated and other foreign objects are touched by sensor mounting box 304
Touching, avoid ultrasonic sensor 305 be damaged and/or measurement result inaccuracy, the sensor mounting box 304 is in ultrasound
The direction that wave sensor 305 issues monitoring signals is unclosed, and the direction that ultrasonic sensor 305 issues monitoring signals can be with face
402 plate surface of pcb board, can also be with the back side of 402 plate surface of face pcb board, and it is super that every piece of pcb board 402 corresponds at least one
Sonic sensor 305, so as to be monitored to whether each piece of pcb board 402 occurs board falling.
In the present embodiment, ultrasonic sensor 305 has signal emission part and signal receiving part (attached to be not shown in the figure), and
And signal emission part and signal receiving part are all located at the same end of the ultrasonic sensor, by signal emission part to before emission part
Side issues monitoring signals (monitoring signals are ultrasonic wave), and there are when pcb board 402 in front of emission part, monitoring signals reach pcb board
It is reflected behind surface, the portion of being received receives, and generates the monitoring result signals for representing non-board falling at this time；It is not deposited in front of emission part
In pcb board 402, receiving unit can not receive the monitoring signals of emission part sending, form the monitoring result for representing board falling at this time
Signal, above two monitoring result signals can be passed at controller.
Sensor mounting box 304 is connected by connecting device for sensor with sensor support frame 301, is connected by sensor
Device makes sensor mounting box 304 and the ultrasonic sensor 305 in it on sensor support frame 301 along sensor support
Position on 301 length direction of frame is adjustable, can be by adjusting connecting device for sensor tune when pcb board size changes
Position of the sensor mounting box 304 on sensor support frame 301 is saved, thereby may be ensured that every piece of pcb board 402 corresponding at least one
A ultrasonic sensor 305.Ultrasonic sensor 305 connects (attached to be not shown in the figure), controller and warning device with controller
And/or control panel is (attached to be not shown in the figure) connected, monitoring result signals are sent controller by ultrasonic sensor 305, warp
After controller processing, monitoring result signals are sent warning device and/or control panel by controller, when monitoring result signals are
When board falling, warning device is sounded an alarm and/or control panel issues board falling prompt；When monitoring result signals are non-board falling, report
Alarm device does not issue alarm and/or control panel and does not issue board falling prompt.It is sounded an alarm by warning device and/or control panel
Board falling prompt is issued, knows that operator in time and handles board falling.
As shown in Figures 1 and 2, connecting device for sensor is attached by helicitic texture, specifically, the sensor connects
Device includes locking plate 303 and link block 302, in which: one end of link block 302 is connect with locking plate 303, the other end and sensor
Mounting box 304 is fixed, and link block 302 can be used with sensor mounting box 304 to be welded and/or be threadedly coupled and other can be with
The fixed form expected is fixed.Through-hole (not shown) is provided on link block 302, which is at least 2, locking plate
303 corresponding positions are provided with threaded hole, and the side of corresponding sensor support frame 301 is provided with through slot 3011, and locking plate 303 is set
It is placed in the side of through slot 3011 in square tube, link block 302 is correspondingly arranged at the other side of the outer through slot 3011 of square tube, link block
302 with the locking plate 303 along the through slot 3011 slidably, and be connected and fixed between the two by connecting component 306
On sensor support frame 301.It is locked, sensor mounting box 304 and the ultrasonic wave in it can be passed by connecting component 306
The position of sensor 305 is fixed.In the present embodiment, the sensor support frame 301 can be square tube, be also possible to other and set
It is equipped with the structure of through slot 3011, it is bolt or screw that above-mentioned connecting component 306, which is selected,.
In the present embodiment, in addition to the structure of above-mentioned locking plate 303 and link block 302, the sensor attachment device may be used also
To be the calutron (attached to be not shown in the figure) with control switch, which is fixed on sensor mounting box 304, phase
The sensor support frame 301 answered can be metallic rod or pipe containing iron, cobalt and/or nickel ingredient, such as rectangular steel tube, by beating
Calutron switch is opened, calutron generates magnetism, can be adsorbed on steel pipe, passes through and closes calutron switch, electromagnetic installing
Magnetic disappearance is set, steel pipe can be detached from, to realize the ultrasonic sensor 305 to sensor mounting box 304 and in it
Position on steel pipe.
The present embodiment monitors whether corresponding pcb board 402 occurs board falling using ultrasonic sensor 305, compared to adopting
With photoelectric sensor, monitoring signals are not by the shadow that pcb board surface smoothness, color and surface gloss change in electroplating process
It rings, equally not speckled with droplet by 402 surface of pcb board in electroplating process is influenced, and monitoring result is more acurrate.
Embodiment two:
The present embodiment provides a kind of pcb board electroplanting devices, specifically, as shown in figure 3, the pcb board electroplanting device includes real
Pcb board board falling monitoring device 30 described in example one is applied, further includes pcb board clamping device 40.
Above-mentioned pcb board clamping device 40 includes winged bar 401 and electroplating clamp 403, in which:
One end of electroplating clamp 403 is evenly arranged with multiple collets 405 along a winged bar 401 length direction intervals, and collet 405 can
Think a kind of spring clip, for clamping pcb board 402, is also possible to other fixtures that can clamp pcb board 402, electroplating clamp
403 other end is fixed on winged bar 401, is flown to be symmetrical arranged on bar 401 top length directions there are two a hanging part 404 is played, be lifted by crane
Portion 404 can be fixture block, or hanging ring can use boom hoisting, such as overhead traveling crane, has been flexibly connected hanging part 404, has carried out band
Dynamic pcb board clamping device 40 moves integrally, and then realizes the automated job of pcb board plating.
The ultrasonic sensor of 402 face pcb board board falling monitoring device 30 of pcb board clamped by above-mentioned electroplating clamp 403
305 settings, and board falling detection can be carried out to pcb board 402 clamped by electroplating clamp 403 by ultrasonic sensor 305.
The extensive of pcb board 402 may be implemented by using the pcb board clamping device 40 with winged bar 401 in the present embodiment
Electroplating activity improves the efficiency of 402 electroplating activity of pcb board, while in the plating process, using ultrasonic sensor 305 to PCB
Whether plate 402, which occurs board falling, is monitored, and improves the accuracy of monitoring result.
Embodiment three:
As Figure 4-Figure 6, the present embodiment provides a kind of pcb board electroplanting devices, specifically, the pcb board electroplanting device also exists
Vertical movement device 10 is added on the basis of embodiment two and moves forward and backward device 20, in which:
Vertical movement device 10, the vertical movement device include: at least one vertical drive, moved cross beam 105 and
Bracket 102, as shown in fig. 6, vertical drive 10 includes two vertical drives, in which:
Vertical drive is fixed on bracket 102, and vertical drive is fixedly connected with moved cross beam 105 and one is a pair of
It answers, 105 elongatedness direction interval of moved cross beam is symmetrical arranged there are two lifting portion 107, lifting portion 107 and flies rising on bars 401
Hanging part 404 is correspondingly arranged, and lifting portion 107 is flexibly connected with hanging part 404 is played, thus corresponding thereto by vertical drive driving
The moved cross beam 105 answered is gone up and down, and is connect by lifting portion 107 with hanging part 404 is played, and then drive pcb board clamping device 40
And pcb board 402 thereon is gone up and down.
In the present embodiment, above-mentioned lifting portion 107 can be U-type groove, and playing hanging part 404 accordingly is fixture block；Above-mentioned lifting portion
107 can also be suspension hook, and playing hanging part 404 accordingly is the hanging ring that can be flexibly connected with suspension hook.
Bracket 102 includes two support frames 1021 and fixed cross beam 1022, and 1022 both ends of fixed cross beam are respectively and support frame
1021 are fixedly connected, and the length direction of support frame 1021 is vertical with 1022 length direction of fixed cross beam, and support frame 1021 plays support
Effect.105 both ends of moved cross beam are slidably connected with the bracket of 102 two sides of bracket support 1021 respectively, specifically, moved cross beam 105
Both ends are respectively arranged with idler wheel 106, and the inner surface of the support frame 1021 of 102 two sides of bracket is correspondingly arranged on idler wheel sliding rail 108, rolling
Wheel 106 can drive moved cross beam 105 to roll along idler wheel sliding rail 108.During moved cross beam 105 is in vertical motion,
Be slidably connected by idler wheel 106 and idler wheel sliding rail 108, make it is more stable in 105 motion process of moved cross beam, avoid generate shaking,
And then it avoids that electroplating clamp 403 is caused to loosen generation board falling due to movement mechanism is unstable during vertical movement.
The support frame 1021 of 102 two sides of bracket is fixed with the inductor support frame 301 in board falling monitoring device 30 respectively to be connected
It connects, specifically, 301 length direction both ends of inductor support frame are separately fixed on the support frame 1021 of 102 two sides of bracket, institute
Place's height is pcb board 402 between maximum height attainable in ascending and descending process and minimum altitude, it may be assumed that pcb board 402
It, can be by height locating for inductor support frame 301 during rising to highest point from minimum point under vertical drive drive
Degree, to realize ultrasonic sensor 305 during vertical drive drives pcb board 402 to be risen and/or declined
When ultrasonic sensor 305 can be with face pcb board 402, board falling monitoring is carried out to pcb board.
Vertical drive includes vertical driving motor 101, vertical movement drive shaft 103 and suspender belt 104, in which: is hung down
Straight driving motor 101 is fixed on the either side of 1202 length direction of fixed cross beam of bracket 102, specifically, vertical driving motor
101 are fixed on any side of the support frame 1021 of 102 two sides of bracket, and are in identical with the fixed cross beam of bracket 102 1022
Highly.Vertical driving motor 101 is connect with vertical movement drive shaft 103, and vertical movement 103 length direction of drive shaft keeps water
Flat, 104 one end of suspender belt is fixedly connected with vertical movement drive shaft 103, and the other end is fixedly connected with moved cross beam 105, along vertical
Movement 103 length direction of drive shaft is arranged at intervals at least one suspender belt 104.Vertical driving motor 101 is by driving vertical fortune
The dynamic rotation of drive shaft 103 realizes the rise and fall of moved cross beam 105 to drive suspender belt 104 to roll and decontrol, and then realizes
The rise and fall of pcb board clamping device 40 and pcb board 402 thereon.
Device 20 is moved forward and backward, moves forward and backward and refers to, view directions as shown in Figure 4, specifically, moving forward and backward device packet
It includes: front and back driving motor 201, body assembly, trapped orbit 204 and connecting plate 202, in which: trapped orbit 204 and body assembly
It is slidably connected, front and back driving motor 201 is connected on body assembly, and the length direction of body assembly hangs down with direction is moved forward and backward
Directly, it and is parallel to the horizontal plane, under the drive of front and back driving motor 201, body assembly can be moved in front-rear direction, and vehicle body is total
It is respectively fixed with connecting plate 202 at length direction both ends, the length direction of connecting plate 202 is vertical with body assembly length direction,
It is parallel to the horizontal plane, connecting plate 202 is connected with the outside of the frame 1021 supported on both sides of bracket 102 respectively, preceding by connecting plate 202
Telecontrol equipment can drive vertical movement device to move in front-rear direction afterwards.
Body assembly includes: vehicle body 206, driving wheel 203 and moves forward and backward drive shaft 205, in which: front and back drive shaft
205 are arranged in 206 internal cavities of vehicle body, move forward and backward motor 201 and connect with drive shaft 205 is moved forward and backward, front and back driving motor
201 are arranged in 202 top center of vehicle body, move forward and backward uniform intervals on 205 length direction of drive shaft and are fixed at least two drives
Driving wheel 203, driving wheel 203 are slidably connected with trapped orbit 204.Under the drive of front and back driving motor 201, drive shaft is moved forward and backward
205 rotations realize that body assembly is moved along 204 front-rear direction of trapped orbit so that driving wheel 203 be driven to rotate.
The present embodiment drives vertical movement device 10 to move in front-rear direction by moving forward and backward device 20, so as to band
Dynamic pcb board clamping device 40 and pcb board 402 thereon are moved in front-rear direction, and then can basis during electroplating activity
The range arrangement multiple tracks station moved forward and backward, realizes extensive, automated production.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating examples made by the present invention, and being not is pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
Made any modifications, equivalent replacements, and improvements etc., should be included in the claims in the present invention within the spirit and principle of invention
Protection scope within.
Claims (10)
1. a kind of pcb board board falling monitoring device, which is characterized in that including ultrasonic sensor (305) and controller, in which:
The ultrasonic sensor (305) issues the placement location of the direction face pcb board (402) of monitoring signals, and the ultrasonic wave passes
Monitoring result signals are sent to the controller for being monitored to the pcb board (402) by sensor (305).
2. a kind of pcb board board falling monitoring device according to claim 1, which is characterized in that further include sensor mounting box
(304), the ultrasonic sensor (305) is installed in the sensor mounting box (304).
3. a kind of pcb board board falling monitoring device according to claim 2, which is characterized in that further include sensor support frame
(301), the sensor mounting box (304) is mounted on the sensor support frame (301), and along the sensor support frame
(301) lengthwise location is adjustable.
4. a kind of pcb board board falling monitoring device according to claim 3, which is characterized in that further include sensor connection dress
It sets, the connecting device for sensor includes link block (302) and locking plate (303), the link block (302) and the ultrasonic wave
Sensor mounting box (304) is fixedly connected, and the link block (302) and the locking plate (303) are along the sensor support frame
(301) length direction slidably, and is connected and fixed to sensor support frame (301) by connecting component (306) between the two
On.
5. a kind of pcb board board falling monitoring device according to claim 4, which is characterized in that the sensor support frame
(301) side is provided with through slot (3011) along its length, and the link block (302) is placed in the through slot (3011)
Outside, the locking plate (303) are set to the inside of the through slot (3011), the link block (302) and the locking plate (303)
Slidably along the through slot (3011), and between the two sensor support frame is connected and fixed to by connecting component (306)
(301) on.
6. a kind of pcb board electroplanting device, which is characterized in that monitored including pcb board board falling as described in any one in claim 1-5
Device.
7. a kind of pcb board electroplanting device according to claim 6, which is characterized in that further include pcb board clamping device
(40), the pcb board clamping device (40) includes electroplating clamp (403), and the electroplating clamp (403) is for clamping at least one
Pcb board (402).
8. a kind of pcb board electroplanting device according to claim 7, which is characterized in that it further include vertical movement device (10),
The vertical movement device (10) includes at least one vertical drive, moved cross beam (105) and bracket (102), in which:
The vertical drive is fixed on the bracket (102), and each vertical drive has been correspondingly connected with an institute
It states moved cross beam (105) and the moved cross beam (105) can be driven mobile, the moved cross beam (105) and the pcb board clamp
Device (40) is flexibly connected and the pcb board clamping device (40) can be driven to move, moved cross beam (105) both ends respectively with
The bracket (102) is slidably connected, and the bracket (102) is fixedly connected with the sensor support frame (301).
9. a kind of pcb board electroplanting device according to claim 8, which is characterized in that the vertical drive includes hanging down
Straight driving motor (101), vertical movement drive shaft (103) and suspender belt (104), in which: the vertical driving motor (101) is solid
It is scheduled on the bracket (102) top either side, the vertical driving motor (101) and the horizontally disposed vertical movement drive
Axis (103) connection, described suspender belt (104) one end are fixedly connected with the vertical movement drive shaft (103), the other end and the work
Dynamic crossbeam (105) are fixedly connected.
10. a kind of pcb board electroplanting device according to claim 8, which is characterized in that further include moving forward and backward device
(20), the device (20) that moves forward and backward includes front and back driving motor (201), body assembly, trapped orbit (204) and connection
Plate (202), in which: the body assembly is slidably connected with the trapped orbit (204), and the front and back driving motor (201) is solid
It is scheduled on the body assembly, the body assembly is driven by the front and back driving motor (201), along the trapped orbit
(204) it moves, body assembly length direction both ends are respectively fixed with connecting plate (202), and the connecting plate (202) connects respectively
It is connected to the outside of the bracket (102) structure supported on both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710444968.7A CN107022776B (en) | 2017-06-12 | 2017-06-12 | A kind of pcb board board falling monitoring device and electroplanting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710444968.7A CN107022776B (en) | 2017-06-12 | 2017-06-12 | A kind of pcb board board falling monitoring device and electroplanting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107022776A CN107022776A (en) | 2017-08-08 |
| CN107022776B true CN107022776B (en) | 2019-02-05 |
Family
ID=59531671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710444968.7A Active CN107022776B (en) | 2017-06-12 | 2017-06-12 | A kind of pcb board board falling monitoring device and electroplanting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107022776B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108531973A (en) * | 2018-06-29 | 2018-09-14 | 东莞宇宙电路板设备有限公司 | Circuit board plating rack and electroplanting device |
| JP7474673B2 (en) * | 2020-10-01 | 2024-04-25 | 株式会社荏原製作所 | Plating apparatus, bubble removing method, and storage medium storing a program for causing a computer of the plating apparatus to execute the bubble removing method |
| CN113280768A (en) * | 2021-05-28 | 2021-08-20 | 广德东威科技有限公司 | Plating line cardboard monitoring devices |
| CN113635813B (en) * | 2021-07-30 | 2023-03-21 | 天长市荣达电子有限公司 | Circuit board assembly for electric vehicle charger |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100250593B1 (en) * | 1995-11-30 | 2000-04-01 | 이구택 | The trouble sensing device and thereof controlling method of the electroplating line |
| CN1658741A (en) * | 2004-02-16 | 2005-08-24 | 华硕电脑股份有限公司 | Production device |
| CN101845659A (en) * | 2010-02-03 | 2010-09-29 | 深南电路有限公司 | PCB (Printed Circuit Board) plating auxiliary clamp and combination of PCB plating auxiliary clamp and PCB |
| CN201746603U (en) * | 2010-06-12 | 2011-02-16 | 东莞森玛仕格里菲电路有限公司 | Improved structure for preventing plate falling on full-automatic upper plate and lower plate vertical plating production line |
| CN203559145U (en) * | 2013-08-29 | 2014-04-23 | 东莞市若美电子科技有限公司 | Improved electroplating fixing element device |
| CN203714751U (en) * | 2014-02-28 | 2014-07-16 | 金川集团股份有限公司 | Device for preventing plate dropping during overturning |
| CN207079288U (en) * | 2017-06-12 | 2018-03-09 | 俊杰机械(深圳)有限公司 | A kind of pcb board board falling monitoring device and electroplanting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63190194A (en) * | 1987-02-02 | 1988-08-05 | Mitsubishi Metal Corp | Centering device for tubular body |
-
2017
- 2017-06-12 CN CN201710444968.7A patent/CN107022776B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100250593B1 (en) * | 1995-11-30 | 2000-04-01 | 이구택 | The trouble sensing device and thereof controlling method of the electroplating line |
| CN1658741A (en) * | 2004-02-16 | 2005-08-24 | 华硕电脑股份有限公司 | Production device |
| CN101845659A (en) * | 2010-02-03 | 2010-09-29 | 深南电路有限公司 | PCB (Printed Circuit Board) plating auxiliary clamp and combination of PCB plating auxiliary clamp and PCB |
| CN201746603U (en) * | 2010-06-12 | 2011-02-16 | 东莞森玛仕格里菲电路有限公司 | Improved structure for preventing plate falling on full-automatic upper plate and lower plate vertical plating production line |
| CN203559145U (en) * | 2013-08-29 | 2014-04-23 | 东莞市若美电子科技有限公司 | Improved electroplating fixing element device |
| CN203714751U (en) * | 2014-02-28 | 2014-07-16 | 金川集团股份有限公司 | Device for preventing plate dropping during overturning |
| CN207079288U (en) * | 2017-06-12 | 2018-03-09 | 俊杰机械(深圳)有限公司 | A kind of pcb board board falling monitoring device and electroplanting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107022776A (en) | 2017-08-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107022776B (en) | A kind of pcb board board falling monitoring device and electroplanting device | |
| CN208529104U (en) | It is a kind of for spraying the spray robot of large-size workpiece | |
| CN108332703B (en) | Disc workpiece precision detection device | |
| CN208729825U (en) | A kind of automobile engine industry robot cylinder cap gripping apparatus | |
| CN207079288U (en) | A kind of pcb board board falling monitoring device and electroplanting device | |
| CN203245066U (en) | Door spraying production line hook device | |
| CN207738330U (en) | A kind of slipping tail hanging apparatus | |
| CN103543197A (en) | Method and device for magnetic powder inspection on annular workpiece | |
| CN219075099U (en) | Perpendicularity detection device of gantry machine tool | |
| CN202220058U (en) | Lifting tool for mechanical equipment | |
| CN209601404U (en) | A kind of vibrating disk with cylinder dislocation device | |
| CN110757361A (en) | Inner circle clamping adjusting device and cylinder fixing equipment | |
| CN102372231A (en) | Tool for hoisting mechanical equipment | |
| CN215569208U (en) | Mounting rack for vibrating table | |
| CN106694938B (en) | Movable workbench type steel structure puncher | |
| CN209656497U (en) | A kind of detection of metal filtration film surface tension is with determining assembling structure | |
| CN105819327B (en) | A kind of suspender replaced for the remote control of CSNS target bodys plug-in unit | |
| CN201739406U (en) | Rubber spring of sieve plate | |
| CN209278805U (en) | Forced action type simplified elevator steel rope flow detector mounting bracket | |
| CN209456561U (en) | A kind of adjustable substrate clamping mechanism | |
| CN211491141U (en) | Inner circle clamping adjusting device and cylinder fixing equipment | |
| CN210937985U (en) | Belt scale mounting equipment | |
| CN208342050U (en) | General welding rack | |
| CN213289947U (en) | Shot blasting machine with casting posture convenient to adjust | |
| CN211346741U (en) | Crossbeam installation tool of three-coordinate measuring instrument |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |