CN107004622A - A kind of defective products marker recognition device for matrix arrangement chip - Google Patents
A kind of defective products marker recognition device for matrix arrangement chip Download PDFInfo
- Publication number
- CN107004622A CN107004622A CN201780000010.7A CN201780000010A CN107004622A CN 107004622 A CN107004622 A CN 107004622A CN 201780000010 A CN201780000010 A CN 201780000010A CN 107004622 A CN107004622 A CN 107004622A
- Authority
- CN
- China
- Prior art keywords
- chip
- matrix arrangement
- image
- substrate
- defective products
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The embodiment of the present application provides a kind of defective products marker recognition device for matrix arrangement chip, and described device includes：The mobile device for driving the substrate of the matrix arrangement chip to move, and the camera of IMAQ is carried out to each chip on the substrate, the mobile device makes each chip on the substrate be moved to illumination condition ideal zone, the camera gathers each chip image of the illumination condition ideal zone, and each chip image of collection is spliced into the complete image of the substrate, identify the matrix arrangement chip marked with defective products for the complete image.The embodiment of the present application is used to the defective products marker recognition for efficiently realizing matrix arrangement chip, reduces testing cost, and operating process is simple.
Description
Technical field
The application is related to chip testing technology field, more particularly to a kind of defective products for matrix arrangement chip is marked and known
Other device.
Background technology
With the arrival of fingerprint recognition and mobile payment tide, fingerprint chip has welcome explosive growth, and is to meet different
Mobile phone business men arises at the historic moment to fingerprint chip different shape and various sizes of requirement, matrix arrangement chip (Strip chips).Square
Battle array arrangement chip (Strip chips) is that have many chips into matrix arrangement on a strip substrate, is had between chip and chip
Certain space length, so facilitates client to cut into the shape and size of oneself needs.
Often there is the defective products chips such as outward appearance, electric property failure on strip substrate, enter to the defective products chip
During row detection, generally by recognizing that defective products mark differentiates whether chip is defective products chip.Recognized not in traditional die test
Non-defective unit chip carries out IMAQ and identification only for single chip, by the one-to-many core into matrix arrangement on strip substrate
Piece carries out IMAQ and identification causes recognition efficiency low.Also, by one-to-many into matrix arrangement on strip substrate
Chip carries out IMAQ, it is necessary to mobile device moves the substrate so that camera is directed at the chip that need to be recognized one by one, causes
Testing cost is high, and flow is complicated.
Therefore, the defective products marker recognition of matrix arrangement chip how is efficiently realized, as needing solution badly in the prior art
Technical problem certainly.
The content of the invention
In view of this, one of technical problem that the embodiment of the present application is solved is to provide a kind of for matrix arrangement chip
Defective products marker recognition device, the defective products marker recognition efficiently to realize matrix arrangement chip, reduce testing cost, and
Operating process is simple.
The embodiment of the present application provides a kind of defective products marker recognition device for matrix arrangement chip, including：Drive institute
The mobile device that the substrate of matrix arrangement chip is moved is stated, and IMAQ is carried out to each chip on the substrate
Camera, the mobile device makes each chip on the substrate be moved to illumination condition ideal zone, the camera collection
Each chip image of the illumination condition ideal zone, and each chip image of collection is spliced into the complete graph of the substrate
Picture, the matrix arrangement chip marked with defective products is identified for the complete image.
Correspondence said apparatus, the application also provides a kind of defective products mark recognition method for matrix arrangement chip, wraps
Include：
Make mobile device that each chip on substrate is moved into illumination condition ideal zone；
Each chip image of the illumination condition ideal zone is gathered by the camera；
Each chip image of collection is spliced into the complete image of the substrate；
The matrix arrangement chip marked with defective products is identified for the complete image.
From above technical scheme, herein described mobile device makes each chip on the substrate be moved to illumination bar
Part ideal zone is so that the camera gathers each chip image, and each chip image of collection is spliced into the complete of the substrate
Whole image, the matrix arrangement chip marked with defective products is identified for the complete image.Therefore, the mobile device is only
Need to drive the substrate to illumination condition ideal zone so that the camera gathers each chip image, without the mobile base
Plate is so that camera is directed at the chip that need to be recognized one by one.The application can efficiently realize the defective products mark of matrix arrangement chip
Identification, and testing cost is reduced, operating process is simple.
Brief description of the drawings
, below will be to embodiment or existing in order to illustrate more clearly of the embodiment of the present application or technical scheme of the prior art
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments described in application, for those of ordinary skill in the art, can also obtain other according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the structural representation for the defective products marker recognition device that the application is used for matrix arrangement chip；
Fig. 2 is that the application is used for the reflection signal of substrate surface in the defective products marker recognition device of matrix arrangement chip
Figure；
Fig. 3 is that the application is used for illumination condition ideal zone signal in the defective products marker recognition device of matrix arrangement chip
Figure；
Fig. 4 is the flow chart for the defective products mark recognition method that the application is used for matrix arrangement chip；
Fig. 5 is that the application is used for the flow chart of step S4 in the defective products mark recognition method of matrix arrangement chip；
Fig. 6 is the schematic diagram that the application is used for that template to be chosen in the defective products mark recognition method of matrix arrangement chip；
Fig. 7 is that the application is used for the flow chart of step S42 in the defective products mark recognition method of matrix arrangement chip；
Fig. 8 is that the application is used for the defective products mark recognition method chips outline drawing of matrix arrangement chip.
Embodiment
Herein described mobile device makes each chip on the substrate be moved to illumination condition ideal zone so that described
Camera gathers each chip image, and each chip image of collection is spliced into the complete image of the substrate, for described complete
Whole image recognition goes out the matrix arrangement chip marked with defective products.Therefore, the mobile device only needs to drive the substrate
To illumination condition ideal zone so that the camera gathers each chip image, without the mobile substrate so that camera one by one
It is directed at the chip that need to be recognized.The application can efficiently realize the defective products marker recognition of matrix arrangement chip, and reduce inspection
Cost is surveyed, operating process is simple.
Certainly, implementing any technical scheme of the embodiment of the present application must be not necessarily required to while reaching all excellent of the above
Point.
In order that those skilled in the art more fully understand the technical scheme in the embodiment of the present application, below in conjunction with the application
Accompanying drawing in embodiment, the technical scheme in the embodiment of the present application is clearly and completely described, it is clear that described reality
It is only a part of embodiment of the embodiment of the present application to apply example, rather than whole embodiments.Based on the implementation in the embodiment of the present application
Example, all other embodiment that those of ordinary skill in the art are obtained should all belong to the scope of the embodiment of the present application protection.
Further illustrate that the embodiment of the present application is implemented with reference to the embodiment of the present application accompanying drawing.
In the following description of exemplary embodiment, with reference to as the accompanying drawing appended by it, wherein passing through the spy shown in graphic mode
Determine embodiment to be put into practice.It is understood that other embodiments can use the change with structure can be various by not departing from
The scope of embodiment.
Referring to Fig. 1, the application provides a kind of defective products marker recognition device for matrix arrangement chip, including：Drive
The mobile device 11 that the substrate of the matrix arrangement chip is moved, and each chip progress image on the substrate is adopted
The camera 12 of collection.
The mobile device 11 makes each chip on the substrate 2 be moved to illumination condition ideal zone, the camera
Each chip image of the 12 collection illumination condition ideal zones, and each chip image of collection is spliced into the complete of the substrate
Whole image, the matrix arrangement chip marked with defective products is identified for the complete image.
Therefore, the mobile device 11 only needs to drive the substrate 2 to illumination condition ideal zone so that the shooting
Each chip image of first 12 collection, without the mobile substrate 2 so that camera 12 is directed at the chip that need to be recognized one by one.The application can
Efficiently to realize the defective products marker recognition of matrix arrangement chip, and testing cost is reduced, operating process is simple.
In the application one in the specific implementation, because the stock size of strip substrate is the core on 7.6*24cm, strip substrate
Piece area is only the 1/100 or smaller of substrate area, therefore in order to which each chip in the complete image of the substrate can be clear
It can be seen that, the camera 12 uses the video camera of 5,000,000 pixel resolutions.
Specifically, to reduce the barrel distortion that the camera 12 gathers image, the camera 12 is demarcated, institute
The distance of camera lens for stating substrate and the camera is 20cm~25cm, and the camera lens of the camera is using 6mm~12mm focal lengths
Wide-angle lens.
It is another in the specific implementation, referring to Fig. 2, because the substrate surface is smooth, being also easy to produce mirror-reflection in the application.For
Camera 12 described in specular reflections effect is avoided to carry out IMAQ, the embodiment of the present application arranges light source in substrate both sides, it is ensured that
Left and right brightness uniformity.Light source arrangement is arranged using oblique sidelight mode described in the embodiment of the present application.So as to only be produced in substrate surface
Diffusing reflection light, diffusing reflection light is weaker, and the influence for carrying out IMAQ to the camera 12 is smaller.
Specifically, because the embodiment of the present application substrate length of side is longer, the light source uses 250*20mm strip source.
Another in the specific implementation, the strip zig is generally 24cm in the application, substrate two ends light is weaker, is
Ensure that, referring to Fig. 3, the illumination condition ideal zone is per chips uniform illumination：The gray scale of the matrix arrangement chip is put down
The maximum of average and the difference of minimum value are not more than 20 region.
Specifically, the illumination condition ideal zone is：Apart from the interval region of the light source 60mm~200mm.
Correspondence said apparatus, the application also provides a kind of defective products mark recognition method for matrix arrangement chip, joins
See Fig. 4, methods described includes：
S1, make mobile device that each chip on substrate is moved into illumination condition ideal zone.
The strip zig is generally 24cm, and substrate two ends light is weaker, to ensure per chips uniform illumination, ginseng
See Fig. 3, the illumination condition ideal zone is：The maximum and the difference of minimum value of the average gray of the matrix arrangement chip
No more than 20 region.
Specifically, the illumination condition ideal zone is：Apart from the interval region of the light source 60mm~200mm.
S2, each chip image by the camera collection illumination condition ideal zone.
In the application one in the specific implementation, because the stock size of strip substrate is the core on 7.6*24cm, strip substrate
Piece area is only the 1/100 or smaller of substrate area, therefore in order to which each chip in the complete image of the substrate can be clear
It can be seen that, the camera 12 uses the video camera of 5,000,000 pixel resolutions.
Specifically, to reduce the barrel distortion that the camera 12 gathers image, the camera 12 is demarcated, institute
The distance of camera lens for stating substrate and the camera is 20cm~25cm, and the camera lens of the camera is using 6mm~12mm focal lengths
Wide-angle lens.
It is another in the specific implementation, referring to Fig. 2, because the substrate surface is smooth, being also easy to produce mirror-reflection in the application.For
Camera 12 described in specular reflections effect is avoided to carry out IMAQ, the embodiment of the present application arranges light source in substrate both sides, it is ensured that
Left and right brightness uniformity.Light source arrangement is arranged using oblique sidelight mode described in the embodiment of the present application.So as to only be produced in substrate surface
Diffusing reflection light, diffusing reflection light is weaker, and the influence for carrying out IMAQ to the camera 12 is smaller.
Specifically, because the embodiment of the present application substrate length of side is longer, the light source uses 250*20mm strip source.
S3, the complete image that each chip image of collection is spliced into the substrate.
In order to more accurately splice the complete image of the substrate, the embodiment of the present application can make the camera multiple
The step S2 is performed, i.e., each chip image of illumination condition ideal zone described in multi collect, by the figure of multi collect
Complete image as synthesizing the substrate.
Specifically, it is described the step S2 is performed a plurality of times to be generally twice.
S4, for the complete image identify with defective products mark matrix arrangement chip.
In the application one in the specific implementation, referring to Fig. 5, the step S4 includes：
S41, the image for extracting in the complete image each matrix arrangement chip.
The step S41 is specially：Using the chip periphery image and periphery mark as template, pass through template matches
Algorithm identifies the position of each chip on the substrate to extract the image of each matrix arrangement chip.
Specifically, referring to Fig. 6, the chip center is avoided as template with lower section 62 using chip top 61
Defective products mark 63.The embodiment of the present application locks the position of each chip on the substrate, so as to carry by template matches
Take the image of each matrix arrangement chip.
S42, the image by each matrix arrangement chip, identify the matrix arrangement chip marked with defective products.
Referring to Fig. 7, the step S42 includes：
S421, the profile for extracting each matrix arrangement chip, and calculate the area that the profile is included.
After the image for extracting each matrix arrangement chip, the profile of each matrix arrangement chip is extracted, then calculates in image and takes turns
The area that exterior feature is included.Referring to Fig. 8, the profile of the matrix arrangement chip 81 of no defective products mark includes chip pin, there is bad
The profile that the profile of the matrix arrangement chip 82 of product mark is marked comprising chip pin and defective products.Therefore, there is defective products mark
The area that includes of profile of matrix arrangement chip 82 be more than what the profile of the matrix arrangement chip 81 marked without defective products was included
Area.
If S422, the area are more than predetermined threshold value, for the matrix arrangement chip marked with defective products.
Because area of each pin on the image of matrix arrangement chip of matrix arrangement chip is 15mm*10mm=
150mm2, 22 pins are generally comprised per chips, the pin gross area is 3300mm2, the embodiment of the present application set threshold value be
3500mm2, the matrix arrangement chip marked with defective products can be gone out with Effective selection.
Therefore, the mobile device only needs to drive the substrate to illumination condition ideal zone so that the camera is adopted
Collect each chip image, without the mobile substrate so that camera is directed at the chip that need to be recognized one by one.The application can be efficient
The defective products marker recognition of matrix arrangement chip is realized, and reduces testing cost, operating process is simple.
It will be understood by those skilled in the art that the embodiment of the embodiment of the present application can be provided as method, device (equipment) or
Computer program product.Therefore, the embodiment of the present application can be soft using complete hardware embodiment, complete software embodiment or combination
The form of the embodiment of part and hardware aspect.Moreover, the embodiment of the present application can be used wherein includes calculating one or more
The computer-usable storage medium of machine usable program code (includes but is not limited to magnetic disk storage, CD-ROM, optical memory
Deng) on the form of computer program product implemented.
The embodiment of the present application is with reference to according to the method for the embodiment of the present application, device (equipment) and computer program product
Flow chart and/or block diagram are described.It should be understood that can be by every in computer program instructions implementation process figure and/or block diagram
One flow and/or the flow in square frame and flow chart and/or block diagram and/or the combination of square frame.These computers can be provided
Processor of the programmed instruction to all-purpose computer, special-purpose computer, Embedded Processor or other programmable data processing devices
To produce a machine so that produce use by the instruction of computer or the computing device of other programmable data processing devices
In the dress for realizing the function of being specified in one flow of flow chart or multiple flows and/or one square frame of block diagram or multiple square frames
Put.
These computer program instructions, which may be alternatively stored in, can guide computer or other programmable data processing devices with spy
Determine in the computer-readable memory that mode works so that the instruction being stored in the computer-readable memory, which is produced, to be included referring to
Make the manufacture of device, the command device realize in one flow of flow chart or multiple flows and/or one square frame of block diagram or
The function of being specified in multiple square frames.
These computer program instructions can be also loaded into computer or other programmable data processing devices so that in meter
Series of operation steps is performed on calculation machine or other programmable devices to produce computer implemented processing, thus in computer or
The instruction performed on other programmable devices is provided for realizing in one flow of flow chart or multiple flows and/or block diagram one
The step of function of being specified in individual square frame or multiple square frames.
Although having been described for the preferred embodiment of the embodiment of the present application, those skilled in the art once know base
This creative concept, then can make other change and modification to these embodiments.So, appended claims are intended to be construed to
Including preferred embodiment and fall into having altered and changing for the embodiment of the present application scope.Obviously, those skilled in the art
The spirit and scope of various changes and modification without departing from the embodiment of the present application can be carried out to the embodiment of the present application.So, if
If these modifications and variations of the embodiment of the present application belong within the scope of the embodiment of the present application claim and its equivalent technologies,
Then the embodiment of the present application is also intended to comprising including these changes and modification.
Claims (14)
1. a kind of defective products marker recognition device for matrix arrangement chip, including：Drive the base of the matrix arrangement chip
The mobile device that plate is moved, and the camera of IMAQ is carried out to each chip on the substrate, it is characterised in that
The mobile device makes each chip on the substrate be moved to illumination condition ideal zone, and the camera gathers the illumination
Each chip image of condition ideal zone, and each chip image of collection is spliced into the complete image of the substrate, for institute
State complete image and identify the matrix arrangement chip marked with defective products.
2. identifying device according to claim 1, it is characterised in that the camera is using 5,000,000 pixel resolutions
Video camera.
3. identifying device according to claim 2, it is characterised in that the distance of camera lens of the substrate and the camera is
20cm~25cm.
4. identifying device according to claim 3, it is characterised in that the camera lens of the camera is burnt using 6mm~12mm
Away from wide-angle lens.
5. identifying device according to claim 1, it is characterised in that light source is arranged in the both sides of the substrate.
6. identifying device according to claim 5, it is characterised in that the light source arrangement is arranged using oblique sidelight mode.
7. identifying device according to claim 6, it is characterised in that the light source uses 250mm*20mm strip light
Source.
8. identifying device according to claim 1, it is characterised in that the illumination condition ideal zone is：The matrix
The maximum of average gray and the difference of minimum value for arranging chip are not more than 20 region.
9. identifying device according to claim 8, it is characterised in that the illumination condition ideal zone is：Distance is described
Light source 60mm~200mm interval region.
10. a kind of defective products mark recognition method for matrix arrangement chip, it is characterised in that including：
Make mobile device that each chip on substrate is moved into illumination condition ideal zone；
Each chip image of the illumination condition ideal zone is gathered by the camera；
Each chip image of collection is spliced into the complete image of the substrate；
The matrix arrangement chip marked with defective products is identified for the complete image.
11. recognition methods according to claim 10, it is characterised in that described to identify have for the complete image
The matrix arrangement chip of defective products mark includes：
The image of each matrix arrangement chip is extracted in the complete image；
By the image of each matrix arrangement chip, the matrix arrangement chip marked with defective products is identified.
12. recognition methods according to claim 11, it is characterised in that described that each matrix is extracted in the complete image
Arrangement chip image be specially：Using the chip periphery image and periphery mark as template, pass through template matching algorithm
The position of each chip on the substrate is identified to extract the image of each matrix arrangement chip.
13. recognition methods according to claim 12, it is characterised in that the figure by each matrix arrangement chip
Picture, identifies that the matrix arrangement chip marked with defective products includes：
The profile of each matrix arrangement chip is extracted, and calculates the area that the profile is included；
If the area is more than predetermined threshold value, for the matrix arrangement chip marked with defective products.
14. recognition methods according to claim 13, it is characterised in that the predetermined threshold value is 3500mm2。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/071571 WO2018132981A1 (en) | 2017-01-18 | 2017-01-18 | Defective mark recognition device for matrix array chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107004622A true CN107004622A (en) | 2017-08-01 |
| CN107004622B CN107004622B (en) | 2019-12-17 |
Family
ID=59435950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780000010.7A Active CN107004622B (en) | 2017-01-18 | 2017-01-18 | Defective product mark recognition device for matrix arrangement chip |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107004622B (en) |
| WO (1) | WO2018132981A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107665344A (en) * | 2017-11-01 | 2018-02-06 | 江苏凯尔生物识别科技有限公司 | A kind of fingerprint module striking mechanism |
| CN112053401A (en) * | 2020-09-11 | 2020-12-08 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chip splicing method, device, equipment and storage medium |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1942059A (en) * | 2005-09-28 | 2007-04-04 | 雅马哈发动机株式会社 | Mark recognition method and printing apparatus |
| US7851517B2 (en) * | 2007-05-08 | 2010-12-14 | Lisa Marie Holmes | Antimicrobial credit cards, identification cards, membership cards and identification badges and badge holders |
| CN103722869A (en) * | 2012-10-15 | 2014-04-16 | 松下电器产业株式会社 | Silk screen printing device, analyzing device and analyzing method for analyzing silk screen poor printing |
| US20140154808A1 (en) * | 2012-12-03 | 2014-06-05 | Gordhanbhai N. Patel | Monitoring system based on etching of metals |
| CN105825219A (en) * | 2016-05-10 | 2016-08-03 | 梁伟棠 | Machine vision detection system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011003956A (en) * | 2009-06-16 | 2011-01-06 | Konica Minolta Business Technologies Inc | Image reading apparatus and image sensor chip |
| KR101438157B1 (en) * | 2012-11-12 | 2014-09-05 | 주식회사 고영테크놀러지 | Board inspection method |
| CN103700678B (en) * | 2013-09-13 | 2016-04-27 | 华中科技大学 | A kind of liquid crystal base electricity adjusts spatial resolution full color imaging detection chip |
-
2017
- 2017-01-18 WO PCT/CN2017/071571 patent/WO2018132981A1/en active Application Filing
- 2017-01-18 CN CN201780000010.7A patent/CN107004622B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1942059A (en) * | 2005-09-28 | 2007-04-04 | 雅马哈发动机株式会社 | Mark recognition method and printing apparatus |
| US7851517B2 (en) * | 2007-05-08 | 2010-12-14 | Lisa Marie Holmes | Antimicrobial credit cards, identification cards, membership cards and identification badges and badge holders |
| CN103722869A (en) * | 2012-10-15 | 2014-04-16 | 松下电器产业株式会社 | Silk screen printing device, analyzing device and analyzing method for analyzing silk screen poor printing |
| US20140154808A1 (en) * | 2012-12-03 | 2014-06-05 | Gordhanbhai N. Patel | Monitoring system based on etching of metals |
| CN105825219A (en) * | 2016-05-10 | 2016-08-03 | 梁伟棠 | Machine vision detection system |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107665344A (en) * | 2017-11-01 | 2018-02-06 | 江苏凯尔生物识别科技有限公司 | A kind of fingerprint module striking mechanism |
| CN112053401A (en) * | 2020-09-11 | 2020-12-08 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chip splicing method, device, equipment and storage medium |
| CN112053401B (en) * | 2020-09-11 | 2024-04-16 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chip splicing method, device, equipment and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107004622B (en) | 2019-12-17 |
| WO2018132981A1 (en) | 2018-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Park et al. | Ambiguous surface defect image classification of AMOLED displays in smartphones | |
| US20130128026A1 (en) | Image processing device for defect inspection and image processing method for defect inspection | |
| JP2020536324A (en) | Systems and methods for machine learning driven object detection | |
| CN107843599A (en) | The methods of a kind of panel detection based on AOI is sentenced and device | |
| TWI797262B (en) | System and method for line defect detection with preprocessing | |
| CN103366176B (en) | Optical element defect batch automatic identification equipment and method | |
| CN110910314B (en) | Splicing method and device for shelf scene images | |
| CN105304002A (en) | LED display screen splicing error detection method and device | |
| TWI477790B (en) | Patterned wafer defect inspection system and method | |
| CN107238605A (en) | A kind of cylindric outer surface of workpiece defect inspection method and device | |
| CN107004622A (en) | A kind of defective products marker recognition device for matrix arrangement chip | |
| CN104749801B (en) | High Precision Automatic optical detecting method and system | |
| CN102879404A (en) | System for automatically detecting medical capsule defects in industrial structure scene | |
| CN108107611B (en) | Self-adaptive defect detection method and device and electronic equipment | |
| CN102788679A (en) | Film sheet defect monitoring device and method | |
| CN108229281A (en) | The generation method and method for detecting human face of neural network, device and electronic equipment | |
| CN104103224A (en) | Panel inspection method and apparatus | |
| CN104422694A (en) | Processing device and processing method of measured data as well as optical measurement system | |
| CN108122199A (en) | The original image color method of adjustment and device of a kind of panorama camera | |
| CN110896469B (en) | Resolution testing method for three-shot photography and application thereof | |
| CN104349125A (en) | Area monitoring method and device | |
| US10791661B2 (en) | Board inspecting apparatus and method of compensating board distortion using the same | |
| CN115690077A (en) | Bubble plate back defect detection method and system | |
| WO2020158630A1 (en) | Detecting device, learner, computer program, detecting method, and method for generating learner | |
| CN110838107B (en) | Method and device for intelligently detecting defects of 3C transparent component by variable-angle optical video |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |