CN106985012B - A kind of processing of surface polishing method - Google Patents
A kind of processing of surface polishing method Download PDFInfo
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- CN106985012B CN106985012B CN201710355176.2A CN201710355176A CN106985012B CN 106985012 B CN106985012 B CN 106985012B CN 201710355176 A CN201710355176 A CN 201710355176A CN 106985012 B CN106985012 B CN 106985012B
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- Prior art keywords
- grinding wheel
- processing
- refine
- slightly
- polishing method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
Abstract
The invention discloses a kind of processing of surface polishing methods comprising following steps: 1) roughing: it is required that within flatness 0.01;2) semifinishing: it is required that within flatness 0.005, finish reaches within 0.4;3) finish: selecting granularity is 1500 alloy grinding wheels;By selected grinding wheel on surface grinding machine, red copper block is selected, selected grinding wheel is carried out once slightly to repair processing, it is desirable that within finish 0.6;On the same red copper block, progress is secondary to repair grinding wheel, it is desirable that finish is within 0.4;Select molybdenum block, to it is secondary slightly repair after grinding wheel carry out refine processing, the refine grinding wheel amount of cutting is carried out at most 0.001, it is required that the face rugosity of molybdenum block is finally polished the polishing workpiece after the semifinishing within 0.1 on the grinding wheel after refine, remove the surplus of 0.001~0.003mm, that is, can reach requirement.Within the flatness for the workpiece surface that the present invention polishes out reachable 0.002, finish is reached within 0.02, high production efficiency, and qualification rate is high.
Description
[technical field]
The invention belongs to technical field of surface, more particularly to a kind of processing of surface polishing method.
[background technique]
A kind of dieparts used on the mold of die casting powder compacting, it is desirable that the end face of two accessories contacted with product
Finish be 0.02um, and planarity requirements 0.002mm, and the material that accessory uses is wolfram steel, usually we pass through biography
System technique is realized by the technique of polishing, i.e., is directly polished by hand by diamond cream and wool head, and directly polish
The disadvantage is that the surrounding of plane is easy to step on side beyond tolerance, qualification rate is very low, and process is troublesome, and the manpower and material resources of investment are also very
It is more, and scrappage is very high.
Therefore, it is necessary to provide the new processing of surface polishing method of one kind to solve the above problems.
[summary of the invention]
The main purpose of the present invention is to provide a kind of processing of surface polishing method, the planes for the workpiece surface for polishing out
It spends within reachable 0.002mm, finish reaches within 0.02um, and product qualification rate is high, high production efficiency.
The present invention is achieved through the following technical solutions above-mentioned purpose: a kind of processing of surface polishing method comprising following step
Suddenly,
1) roughing: roughing is carried out to polishing workpiece end face, it is desirable that within flatness 0.01mm;
2) semifinishing: semifinishing is carried out to polishing workpiece end face, it is desirable that within flatness 0.005mm, finish reaches
To within 0.4um;
3) it finishes:
A. it selects grinding wheel: selecting granularity for 1500 alloy grinding wheels;
B. it once slightly repairs grinding wheel: by selected grinding wheel on surface grinding machine, red copper block is selected, to selected grinding wheel
It carries out once slightly repairing processing, it is desirable that within finish 0.6um;
C. it slightly repairs grinding wheel two times: on the same red copper block, carrying out secondary repairing grinding wheel, it is desirable that finish exists
Within 0.4um;
D. refine grinding wheel: selecting molybdenum block, to it is secondary slightly repair after grinding wheel carry out refine processing, carry out the refine grinding wheel amount of cutting
At most in 0.001mm, it is desirable that the surface roughness of molybdenum block is within 0.1um;
E. final polishing: the polishing workpiece after the semifinishing is finally thrown on the grinding wheel after refine
Light, removes the surplus of 0.001~0.003mm, that is, can reach requirement.
Further, the grinding wheel selected in the roughing process is alloy grinding wheel, and granularity is 150.
Further, the grinding wheel selected in the semifinishing process is alloy grinding wheel, and granularity is 600.
Further, the revolving speed for once slightly repairing surface grinding machine described in grinding wheel process is 2000 rpms.
Further, described once slightly repair requires that grinding wheel equating cannot be had shake in grinding wheel process, and slightly repairing the time is 20
Minute.
Further, the secondary revolving speed for slightly repairing surface grinding machine described in grinding wheel process is 2200 rpms.
Further, it is described it is secondary slightly repair requirement in grinding wheel process and cannot tremble trace phenomenon, slightly repair the time in 1 hour.
Further, the revolving speed of surface grinding machine described in the refine grinding wheel process is 2500 rpms.
Further, it is required there can be no any jutter, more than refine is for 1 hours in the refine grinding wheel process.
Further, it is described it is secondary slightly repair grinding wheel and it is described repair in grinding wheel process, need constantly to spray alcohol carry out
It is cooling.
Compared with prior art, a kind of beneficial effect of processing of surface polishing method of the present invention is: using progressive
Mode, first will polishing workpiece end face carry out roughing, then carry out semifinishing make polish workpiece end face plane degree reach
Within 0.005mm, finish reaches within 0.4um, provides good plane base for subsequent finishing, final to reach
Surface requirements provide safeguard;In finishing stage, first choice once slightly repair to grinding wheel and slightly be repaired with secondary using red copper block, then is selected
It selects molybdenum block and refine is carried out to grinding wheel, so that the wheel face of polishing meets polishing and requires, can will finally polish the end face of workpiece
Processing reaches requirement, reaches its surface planarity within 0.002mm, and finish reaches within 0.02um.
[specific embodiment]
Embodiment:
The present embodiment is processing of surface polishing method comprising following steps:
1) roughing: selecting a kind of 150 alloy grinding wheels of granularity, carries out roughing to polishing workpiece end face, it is desirable that plane
It spends within 0.01mm;
2) semifinishing: the alloy grinding wheel that granularity is 600 is selected to carry out semifinishing to polishing workpiece end face, it is desirable that flat
Within the degree 0.005mm of face, finish reaches within 0.4um, and the requirement in the step has to reach, because to subsequent key
It is extremely important whether process can be realized;
3) it finishes:
A. it selects grinding wheel: selecting granularity for 1500 alloy grinding wheels;
B. once slightly repair grinding wheel: by the grinding wheel of selection on surface grinding machine, lathe revolving speed is 2000 rpms, is selected
Material is red copper, repairs grinding wheel block, carries out once slightly repairing grinding wheel, it is desirable that be that grinding wheel equating cannot be had shake, finish 0.6um
Within, the time is 20 minutes;
C. it slightly repairs grinding wheel two times: on same red copper block, the revolving speed of surface grinding machine being transferred to 2200 rpms, into
Row is secondary to repair grinding wheel, but specifically repairs and will generate heat, so to add industrial alcohol during slightly repairing, keeps cooling, it is desirable that
Finish cannot tremble trace phenomenon, the time is in 1 hour within 0.4um;
D. refine grinding wheel: the selection of material is molybdenum, repairs grinding wheel block, and the revolving speed of surface grinding machine is transferred to 2500 rpms, is repaired
By it is secondary slightly repair grinding wheel after grinding wheel block, carry out the refine grinding wheel amount of cutting at most in 0.001mm, and all around shake be to want
Slowly uniformly, it is more than hour to be continued for 1, sprays alcohol cooling in the process, the surface roughness of molybdenum block is finally required to exist
Within 0.1um, there can be no any jutter, the product otherwise processed can not be up to requirement;
E. final polishing: the polishing workpiece after semifinishing is finally polished on the grinding wheel after refine, only
The surplus of 0.001~0.003mm need to be removed, that is, can reach requirement.
In step described in the present embodiment processing of surface polishing method, the burnishing surface of whole strict control polishing workpiece cannot
It is directly contacted using hand, otherwise will affect effect.
The beneficial effect of the present embodiment processing of surface polishing method is: by the way of progressive, first by buffer
Part end face carries out roughing, then carries out semifinishing and polishing workpiece end face plane degree is reached within 0.005mm, and finish reaches
To within 0.4um, good plane base is provided for subsequent finishing, the surface requirements to reach final provide safeguard;?
Finishing stage, first choice once slightly repair to grinding wheel and slightly be repaired with secondary using red copper block, and reselection molybdenum block carries out essence to grinding wheel
It repairs, so that the wheel face of polishing meets polishing and requires, the end face for polishing workpiece can finally be processed and reach requirement, make its table
Facial plane degree reaches within 0.002mm, and finish reaches within 0.02um.
Above-described is only some embodiments of the present invention.For those of ordinary skill in the art, not
Under the premise of being detached from the invention design, various modifications and improvements can be made, these belong to protection model of the invention
It encloses.
Claims (10)
1. a kind of processing of surface polishing method, it is characterised in that: it includes the following steps,
1) roughing: roughing is carried out to polishing workpiece end face, it is desirable that within flatness 0.01mm;
2) semifinishing: semifinishing is carried out to polishing workpiece end face, it is desirable that within flatness 0.005mm, finish reaches
Within 0.4um;
3) it finishes:
A. it selects grinding wheel: selecting granularity for 1500 alloy grinding wheels;
B. it once slightly repairs grinding wheel: by selected grinding wheel on surface grinding machine, selecting red copper block, selected grinding wheel is carried out
Once slightly repair processing, it is desirable that within finish 0.6um;
C. slightly repair grinding wheel two times: on the same red copper block, carrying out secondary repairing grinding wheel, it is desirable that finish 0.4um with
It is interior;
D. refine grinding wheel: selecting molybdenum block, to it is secondary slightly repair after grinding wheel carry out refine processing, it is most to carry out the refine grinding wheel amount of cutting
In 0.001mm, it is desirable that the surface roughness of molybdenum block is within 0.1um;
E. final polishing: the polishing workpiece after the semifinishing is finally polished on the grinding wheel after refine, is gone
Fall the surplus of 0.001 ~ 0.003mm, that is, can reach requirement.
2. processing of surface polishing method as described in claim 1, it is characterised in that: the grinding wheel selected in the roughing process
For alloy grinding wheel, granularity is 150.
3. processing of surface polishing method as claimed in claim 2, it is characterised in that: the sand selected in the semifinishing process
Wheel is alloy grinding wheel, and granularity is 600.
4. processing of surface polishing method as described in claim 1, it is characterised in that: described once slightly to repair described in grinding wheel process
The revolving speed of surface grinding machine is 2000 rpms.
5. processing of surface polishing method as claimed in claim 4, it is characterised in that: described once slightly repair requires in grinding wheel process
Grinding wheel equating, there cannot be shake, slightly repairing the time is 20 minutes.
6. processing of surface polishing method as claimed in claim 5, it is characterised in that: described secondary slightly to repair described in grinding wheel process
The revolving speed of surface grinding machine is 2200 rpms.
7. processing of surface polishing method as claimed in claim 6, it is characterised in that: secondary slightly repair requires in grinding wheel process
Trace phenomenon cannot be trembled, slightly repairs the time in 1 hour.
8. processing of surface polishing method as claimed in claim 7, it is characterised in that: plane described in the refine grinding wheel process
The revolving speed of grinding machine is 2500 rpms.
9. processing of surface polishing method as claimed in claim 8, it is characterised in that: required not in the refine grinding wheel process
Any jutter can occur, more than refine is for 1 hours.
10. processing of surface polishing method as described in claim 1, it is characterised in that: secondary slightly repair grinding wheel and described described
In refine grinding wheel process, needs constantly to spray alcohol and cooled down.
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CN107350903A (en) * | 2017-09-12 | 2017-11-17 | 苏州沃思诺自动化科技有限公司 | A kind of grinding machine processing technology for improving mold surface finish |
CN108801829B (en) * | 2018-06-06 | 2020-08-04 | 上海大学 | Method for selecting optimal grinding tool granularity in grinding process |
CN109129036A (en) * | 2018-10-30 | 2019-01-04 | 南充隆固机械工业有限公司 | A kind of grinding machine processing technology of piece surface high-precision grinding |
CN114211209A (en) * | 2021-12-27 | 2022-03-22 | 众至达精密机械科技(昆山)有限公司 | Surface processing technology for high-finish electronic metal structural part |
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CN2592301Y (en) * | 2001-07-06 | 2003-12-17 | 赵强 | Equipment for manufacturing quench metal thin strap at a scale production |
CN101091989A (en) * | 2006-12-15 | 2007-12-26 | 北京理工大学 | Technique for fabricating micro Nano powder of granular metal rapidly |
CN102029765A (en) * | 2010-09-27 | 2011-04-27 | 周晓宏 | Method for manufacturing multicolor wear-resistant metal decorative film layer |
CN103922707A (en) * | 2014-03-17 | 2014-07-16 | 淄博畅安陶瓷科技有限公司 | Eccentric ceramic ring and preparation method thereof |
CN205415966U (en) * | 2015-11-21 | 2016-08-03 | 张耀辰 | Automatic blank remedying machine |
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JP2009016484A (en) * | 2007-07-03 | 2009-01-22 | Renesas Technology Corp | Dresser for cmp and manufacturing method of semiconductor device |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2592301Y (en) * | 2001-07-06 | 2003-12-17 | 赵强 | Equipment for manufacturing quench metal thin strap at a scale production |
CN101091989A (en) * | 2006-12-15 | 2007-12-26 | 北京理工大学 | Technique for fabricating micro Nano powder of granular metal rapidly |
CN102029765A (en) * | 2010-09-27 | 2011-04-27 | 周晓宏 | Method for manufacturing multicolor wear-resistant metal decorative film layer |
CN103922707A (en) * | 2014-03-17 | 2014-07-16 | 淄博畅安陶瓷科技有限公司 | Eccentric ceramic ring and preparation method thereof |
CN205415966U (en) * | 2015-11-21 | 2016-08-03 | 张耀辰 | Automatic blank remedying machine |
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