CN106976282A - A kind of thermal insulation thermal insulation board - Google Patents
A kind of thermal insulation thermal insulation board Download PDFInfo
- Publication number
- CN106976282A CN106976282A CN201610026047.4A CN201610026047A CN106976282A CN 106976282 A CN106976282 A CN 106976282A CN 201610026047 A CN201610026047 A CN 201610026047A CN 106976282 A CN106976282 A CN 106976282A
- Authority
- CN
- China
- Prior art keywords
- thermal insulation
- layer
- insulation board
- shaped groove
- aluminum membranous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/02—Layered products comprising a layer of paper or cardboard next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
Abstract
The invention discloses a kind of thermal insulation thermal insulation board, it is characterised in that including aluminum membranous layer, foaming layer and separation layer, and the aluminum membranous layer is located at heat-insulated inner cord, and the separation layer is located at thermal insulation board outer layer, and the foaming layer is located between aluminum membranous layer and separation layer;The thermal insulation thermal insulation board good heat-insulation effect of the present invention.
Description
Technical field
The present invention relates to heat-insulating technique field, more particularly to a kind of thermal insulation thermal insulation board.
Background technology
The heat-barrier material of existing packaging applicationss is mainly the gentle foam composite aluminium film of pearl cotton composite aluminium film, its heat-insulated valid interval very little, the length of constant temperature time under extreme temperature can not be met, trace it to its cause and be that existing heat-barrier material is composited for sandwich construction by glue bonding, limited by distance, realized per layer material by self performance heat-insulated, the effect of heat insulation after being combined is the superposition of every layer of effect, it is impossible to really realize composite performance.
The content of the invention
In order to solve the problems of the prior art, it is an object of the invention to provide a kind of thermal insulation thermal insulation board, thermal insulation thermal insulation board good heat-insulation effect of the invention.
To achieve these goals, the technical solution adopted by the present invention:A kind of thermal insulation thermal insulation board, it is characterised in that including aluminum membranous layer, foaming layer and separation layer, the aluminum membranous layer is located at heat-insulated inner cord, and the separation layer is located at thermal insulation board outer layer, and the foaming layer is located between aluminum membranous layer and separation layer.
Preferably, it is provided with the outside of described foaming layer on the outside of the first U-shaped groove, described aluminum membranous layer and is provided with the second U-shaped groove, the first U-shaped groove and the second U-shaped groove is arranged in a crossed manner in thermal insulation board.
Preferably, the first external part is provided with the inside of the separation layer, first external part is connected together with the first U-shaped groove.
Wherein, the first described U-shaped groove is four, and upper and lower, left and right are symmetricly set on the outside of foaming layer.
Preferably, the second external part is provided with the inside of the foaming layer, second external part is connected together with the second U-shaped groove.
Wherein, the second described U-shaped groove is four, and upper and lower, left and right are symmetricly set on the outside of aluminum membranous layer.
Preferably, the separation layer is filled with the first slow heat-conducting layer with foaming interlayer, and the aluminum membranous layer is filled with the second slow heat-conducting layer with foaming interlayer, and the first slow heat-conducting layer is made up with the second slow heat-conducting layer of slow Heat Conduction Material.
Wherein, described slow Heat Conduction Material is selected from alumina fibre.
Wherein, described aluminum membranous layer is the aluminium film of 0.01-0.5mm thickness.
Wherein, described foaming layer is the crosslinked polyethylene foaming layer of 0.01-0.2mm thickness.
Wherein, described separation layer is high density brown paper separation layer.
Compared with prior art, the beneficial effect that the present invention is realized:The thermal insulation thermal insulation board of the present invention is provided with aluminum membranous layer, foaming layer and separation layer, separation layer is used as first thermal insulation layer, isolate thermal insulation board and external environment, foaming layer utilizes the relatively low thermal conductivity of foaming layer as second layer thermal insulation layer, the transmission of less heat, aluminum membranous layer utilizes the reflection fuel factor of aluminium film so that heat transfer further falls sharply as third layer thermal insulation layer, aluminum membranous layer, foaming layer and separation layer are heat-insulated layer by layer, it is ensured that the temperature constant state of packaging;The thermal insulation thermal insulation board of the present invention is in aluminum membranous layer and foaming layer, and foaming layer is connected together with isolating interlayer by groove with external part, and aluminum membranous layer sets slow heat-conducting layer with foaming layer and foaming layer with isolating interlayer, further reduces the transmission of heat;The thermal insulation thermal insulation board good heat-insulation effect of the present invention, is used to pack, constant temperature time is long with the thermal insulation thermal insulation board of the present invention;The thermal insulation thermal insulation board of the present invention really realizes compound effect of heat insulation.
Brief description of the drawings
The present invention is further described below in conjunction with the drawings and specific embodiments:
Fig. 1 is the structural representation of the thermal insulation thermal insulation board of the present invention.
Wherein:Aluminum membranous layer 1, foaming layer 2, separation layer 3, the first U-shaped groove 4, the second U-shaped groove 5, the first external part 6 and the second external part 7.
Embodiment
As shown in Figure 1, a kind of thermal insulation thermal insulation board, including aluminum membranous layer 1, foaming layer 2 and separation layer 3, aluminum membranous layer 1 is located at heat-insulated inner cord, separation layer 3 is located at thermal insulation board outer layer, foaming layer 2 is located between aluminum membranous layer 1 and separation layer 3, the outside of foaming layer 2 is provided with the first U-shaped groove 4, the inner side of separation layer 3 is provided with the first external part 6, first external part 6 is connected together in the first U-shaped groove 4, the outside of aluminum membranous layer 1 is provided with the second U-shaped groove 5, and the inner side of foaming layer 2 is provided with the second external part 7, and the second external part 7 is connected together with the second U-shaped groove 5.
In order to ensure the intensity of engaging, the first U-shaped groove 5 of U-shaped groove 4 and second is respectively four, and four the first U-shaped upper and lower, left and right of groove 4 are symmetricly set on the outside of foaming layer 2, and four the second U-shaped upper and lower, left and right of groove 5 are symmetricly set on the outside of aluminum membranous layer 1.
In order to further improve effect of heat insulation, the first U-shaped groove 5 of U-shaped groove 4 and second is arranged in a crossed manner in thermal insulation board, the first slow heat-conducting layer is filled between separation layer 3 and foaming layer 2 simultaneously, the second slow heat-conducting layer is filled between aluminum membranous layer 1 and foaming layer 2, first slow heat-conducting layer and the second slow heat-conducting layer are slow Heat Conduction Material, and such as alumina fibre is made.
Above-mentioned embodiment is exemplary, is to preferably make skilled artisans appreciate that this patent, it is impossible to be not understood as including this patent the limitation of scope;As long as any equivalent change or modification made of spirit, each fall within the scope that this patent includes according to disclosed in this patent.
Claims (10)
1. a kind of thermal insulation thermal insulation board, it is characterised in that including aluminum membranous layer(1), foaming layer(2)And separation layer(3), the aluminum membranous layer(1)Positioned at heat-insulated inner cord, the separation layer(3)Positioned at thermal insulation board outer layer, the foaming layer(2)Positioned at aluminum membranous layer(1)And separation layer(3)Between.
2. thermal insulation thermal insulation board as claimed in claim 1, it is characterised in that described foaming layer(2)Outside is provided with the first U-shaped groove(4), described aluminum membranous layer(1)Outside is provided with the second U-shaped groove(5), the first U-shaped groove(4)With the second U-shaped groove(5)It is arranged in a crossed manner in thermal insulation board.
3. thermal insulation thermal insulation board as claimed in claim 2, it is characterised in that the separation layer(3)Inner side is provided with the first external part(6), first external part(6)With the first U-shaped groove(4)It is connected together.
4. thermal insulation thermal insulation board as claimed in claim 2, it is characterised in that the first described U-shaped groove(4)For four, upper and lower, left and right are symmetricly set on foaming layer(2)Outside.
5. thermal insulation thermal insulation board as claimed in claim 2, it is characterised in that the foaming layer(2)Inner side is provided with the second external part(7), second external part(7)With the second U-shaped groove(5)It is connected together.
6. thermal insulation thermal insulation board as claimed in claim 2, it is characterised in that the second described U-shaped groove(5)For four, upper and lower, left and right are symmetricly set on aluminum membranous layer(1)Outside.
7. thermal insulation thermal insulation board as claimed in claim 1, it is characterised in that the separation layer(3)With foaming layer(2)Between be filled with the first slow heat-conducting layer, the aluminum membranous layer(1)With foaming layer(2)Between be filled with the second slow heat-conducting layer, the first slow heat-conducting layer and the second slow heat-conducting layer are made up of slow Heat Conduction Material.
8. thermal insulation thermal insulation board as claimed in claim 1, it is characterised in that described aluminum membranous layer(1)For the aluminium film of 0.01-0.5 mm thickness.
9. thermal insulation thermal insulation board as claimed in claim 1, it is characterised in that described foaming layer(2)For the crosslinked polyethylene foaming layer of 0.01-0.2 mm thickness.
10. thermal insulation thermal insulation board as claimed in claim 1, it is characterised in that described separation layer(3)For high density brown paper separation layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610026047.4A CN106976282A (en) | 2016-01-15 | 2016-01-15 | A kind of thermal insulation thermal insulation board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610026047.4A CN106976282A (en) | 2016-01-15 | 2016-01-15 | A kind of thermal insulation thermal insulation board |
Publications (1)
Publication Number | Publication Date |
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CN106976282A true CN106976282A (en) | 2017-07-25 |
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Family Applications (1)
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CN201610026047.4A Pending CN106976282A (en) | 2016-01-15 | 2016-01-15 | A kind of thermal insulation thermal insulation board |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2235373Y (en) * | 1995-11-09 | 1996-09-18 | 宝珑 | PF foamed plastic composite board |
CN2493414Y (en) * | 2001-08-13 | 2002-05-29 | 刘为成 | Folding type color printed advertisement paper box |
CN2547797Y (en) * | 2002-04-24 | 2003-04-30 | 石能高 | Heat-insulating slab |
CN2581573Y (en) * | 2002-12-10 | 2003-10-22 | 东旭 | Heat insulation composite board |
CN201970522U (en) * | 2010-12-10 | 2011-09-14 | 周新怀 | Foam heat insulation material |
-
2016
- 2016-01-15 CN CN201610026047.4A patent/CN106976282A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2235373Y (en) * | 1995-11-09 | 1996-09-18 | 宝珑 | PF foamed plastic composite board |
CN2493414Y (en) * | 2001-08-13 | 2002-05-29 | 刘为成 | Folding type color printed advertisement paper box |
CN2547797Y (en) * | 2002-04-24 | 2003-04-30 | 石能高 | Heat-insulating slab |
CN2581573Y (en) * | 2002-12-10 | 2003-10-22 | 东旭 | Heat insulation composite board |
CN201970522U (en) * | 2010-12-10 | 2011-09-14 | 周新怀 | Foam heat insulation material |
Non-Patent Citations (1)
Title |
---|
方汉中: "《世界建筑材料 发展水平和趋势》", 30 April 1989, 科学普及出版社 * |
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Application publication date: 20170725 |
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