CN106966578B - Supporting layer and machine table for cutting substrate and method for cutting substrate by adopting machine table - Google Patents
Supporting layer and machine table for cutting substrate and method for cutting substrate by adopting machine table Download PDFInfo
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- CN106966578B CN106966578B CN201710286047.2A CN201710286047A CN106966578B CN 106966578 B CN106966578 B CN 106966578B CN 201710286047 A CN201710286047 A CN 201710286047A CN 106966578 B CN106966578 B CN 106966578B
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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Abstract
The invention provides a supporting layer for cutting a substrate, a machine and a method for cutting the substrate by adopting the machine. The support layer includes: the supporting layer body comprises a placing surface for placing a substrate to be cut and an opposite end surface opposite to the placing surface, and the placing surface comprises an airflow passage area and an airflow closed area; the placing surface can realize air flow communication with the opposite end surface in the air flow passage area, and cannot realize air flow communication with the opposite end surface in the air flow closed area; wherein, the projection of the pre-cutting line of the substrate to be cut on the placing surface is positioned in the air flow closed area. The supporting layer for cutting the substrate is arranged on a machine table for cutting the substrate, and the airflow channel area and the airflow closed area are formed on the placing surface for supporting the substrate to be cut, so that the substrate to be cut can be adsorbed and fixed, the cutting line of the substrate to be cut can be prevented from passing through the adsorption hole area, and the edge of the substrate to be cut can be prevented from generating stress cracks.
Description
Technical Field
The invention relates to the technical field of display manufacturing, in particular to a supporting layer and a machine table for cutting a substrate and a method for cutting the substrate by adopting the machine table.
Background
In the manufacture of a display, a general process is to cut a large-area substrate into a plurality of small-area cells. For the above cutting process, a laser cutting method is usually adopted at present, and before laser cutting, as shown in fig. 1, the substrate 1 to be cut is fixed on the machine table 2, and the substrate 1 to be cut is adsorbed and fixed on the machine table 2 by using the negative pressure generated by vacuumizing the adsorption hole 3 through the adsorption hole 3 arranged on the machine table 2, so as to avoid deviation generated in the cutting process.
However, when the substrate 1 to be cut is a flexible substrate and the substrate 1 to be cut is fixed on the machine table 2 for laser cutting by adopting the above method, if the laser scanning path passes through the adsorption hole 3, that is, the cut division line is located on the adsorption hole 3, stress cracks are generated at the edge of the substrate to be cut due to the negative pressure acting force of the adsorption hole 3, when the flexible substrate is used for manufacturing a flexible display panel, a weak point when the flexible substrate is bent is formed, so that the module display fails, and the display effect is influenced.
Disclosure of Invention
The technical scheme of the invention aims to provide a supporting layer for cutting a substrate, a machine table and a method for cutting the substrate by adopting the machine table, and solves the problem that stress cracks are generated at the edge of the cut substrate when a cutting scanning path passes through an adsorption hole on the machine table in the prior art.
The embodiment of the invention provides a supporting layer for cutting a substrate, which comprises:
the supporting layer body comprises a placing surface for placing a substrate to be cut and an opposite end surface opposite to the placing surface, and the placing surface comprises an airflow passage area and an airflow closed area; the placing surface can realize air flow communication with the opposite end surface in the air flow passage area, and cannot realize air flow communication with the opposite end surface in the air flow closed area;
wherein, the projection of the pre-cutting line of the substrate to be cut on the placing surface is positioned in the air flow closed area.
Preferably, the supporting layer for cutting the substrate is formed by a porous flexible material, a groove is formed in the placing surface, and a rigid substance is filled in the groove;
the arrangement area of the groove is formed into the airflow closed area, and the through holes in the porous flexible material for manufacturing the supporting layer body are formed into airflow channels which enable the airflow communication between the airflow channel area and the opposite end faces.
Preferably, the support layer for substrate cutting is formed of glass, metal, or ceramic.
Preferably, the supporting layer for cutting the substrate is formed by a porous flexible material.
Preferably, the supporting layer for cutting the substrate has a thickness of 0.3mm to 2mm in a direction perpendicular to the mounting surface, and the depth of the groove is 0.3mm or more.
Preferably, the support layer for substrate cutting, wherein a depth of the groove is equal to a thickness of the support layer body in a direction perpendicular to the placement surface.
Preferably, the support layer for substrate cutting, wherein the airflow closing region is formed in a stripe shape on the placement surface, corresponding to a shape of a pre-cut line of the substrate to be cut.
Preferably, the supporting layer for cutting the substrate is provided with a plurality of airflow sealing areas, each pre-cutting line of the substrate to be cut corresponds to one of the airflow sealing areas, and a projection of each pre-cutting line on the placing surface is located in the corresponding airflow sealing area.
In another aspect, an embodiment of the present invention further provides a machine including a machine body, where the machine body includes an installation surface provided with a plurality of vent holes, and the machine further includes the supporting layer for substrate cutting as described above, where the opposite end surfaces are attached to the installation surface, the placement surface is communicated with the vent holes in the airflow passage area, and the airflow closed area is not communicated with the vent holes.
In another aspect, an embodiment of the present invention further provides a method for cutting a substrate by using the above machine, where the method includes:
placing a substrate to be cut on the placing surface of the supporting layer body, and enabling the projection of a pre-cutting line of the substrate to be cut on the placing surface to be positioned in the airflow closed area;
vacuumizing the vent hole on the machine table body to enable the substrate to be cut to be adsorbed and fixed on the supporting layer body through the airflow channel area on the supporting layer body;
and outputting a laser beam to scan the laser beam along the pre-cutting line of the substrate to be cut to form a cutting line, wherein the substrate to be cut is cut.
Preferably, the method wherein the substrate to be cut is a flexible substrate.
One or more embodiments of the invention have at least the following beneficial effects:
the supporting layer for cutting the substrate is arranged on a machine table for cutting the substrate, and the airflow channel area and the airflow closed area are formed on the placing surface for supporting the substrate to be cut, so that the substrate to be cut can be adsorbed and fixed, the cutting line of the substrate to be cut can be prevented from passing through the adsorption hole area, and the edge of the substrate to be cut can be prevented from generating stress cracks.
Drawings
FIG. 1 is a schematic diagram of a prior art flexible substrate cutting;
fig. 2 is a schematic plan view illustrating a supporting layer for cutting a substrate according to an embodiment of the invention;
fig. 3 is a schematic cross-sectional view of a supporting layer for cutting a substrate according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of a supporting layer for substrate cutting disposed on a machine according to an embodiment of the present invention;
fig. 5 is a schematic cross-sectional view of a supporting layer for cutting a substrate according to a second embodiment of the present invention;
fig. 6 is a schematic plan view illustrating a supporting layer for cutting a substrate according to a second embodiment of the present invention;
fig. 7 is a schematic structural view illustrating a supporting layer for cutting a substrate according to a second embodiment of the present invention disposed on a machine;
fig. 8 is a flowchart illustrating a method for cutting a substrate by using the supporting layer for cutting a substrate according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a supporting layer for cutting a substrate, which is arranged on a machine table for cutting the substrate, and can adsorb and fix the substrate to be cut, prevent a cutting line of the substrate to be cut from passing through an adsorption hole area and prevent the edge of the substrate to be cut from generating stress cracks.
Specifically, as shown in fig. 2 and 3, the supporting layer for cutting a substrate according to the first embodiment of the present invention includes:
a support layer body 10 including a placing face 11 for placing a substrate to be cut and an opposite end face 13 opposite to the placing face, the placing face 11 including a gas flow passage area 111 and a gas flow closing area 112; wherein the placing surface 11 can realize air flow communication with the opposite end surface in the air flow passage area 111, and cannot realize air flow communication with the opposite end surface in the air flow closed area 112;
wherein the projection of the pre-cut lines of the substrate to be cut on the placement surface 11 is located within the gas flow enclosed area 112.
In the supporting layer for cutting the substrate according to the embodiment of the present invention, an airflow passage area 111 and an airflow sealing area 112 are formed on a placing surface 11 for supporting the substrate to be cut, and the airflow passage area is used for generating a vacuum adsorption effect to realize adsorption and fixation of the substrate to be cut; the airflow sealing area is used for corresponding to a pre-cutting line of a substrate to be cut, namely when the substrate to be cut is cut, the projection of the cutting path on the placing surface 11 is located in the airflow sealing area 112 and is not located in the airflow channel area 111, so that stress cracks are prevented from being generated on the cut substrate due to the negative pressure of the airflow channel when the substrate passes through the airflow channel during cutting.
In the first embodiment of the present invention, through holes 12 are provided in the supporting layer for cutting a substrate, which penetrate through the mounting surface 11 and the opposite end surface 13, an arrangement region of the plurality of through holes 12 in the mounting surface 11 is formed as an airflow passage region 111, which ensures airflow from the opposite end surface 13 to the mounting surface 11, and a region where no through hole 12 is provided is formed as an airflow sealing region 112, which corresponds to a precut line of a substrate to be cut provided on the mounting surface 11.
Fig. 4 is a schematic structural view illustrating the supporting layer for cutting a substrate assembled with a machine when the substrate 100 to be cut is cut. Referring to fig. 4, a plurality of vent holes 210 are formed in a machine body 200 of the machine, and are communicated with a vacuum pump through a pipeline for vacuum adsorption during substrate cutting. The supporting layer body 10 is disposed on the machine body 200, and the opposite end surface 13 of the placing surface 11 is attached to the mounting surface of the machine body 200.
According to fig. 4 and 2, since the through-hole 12 is provided in the air flow passage region 111, air flow from the mounting surface 11 to the machine base body 200 can be realized, and when a negative pressure is generated in the air vent 210, the air flow can be communicated to the mounting surface 11, thereby vacuum-sucking the substrate 100 to be cut above the mounting surface 11. The through hole 12 is not formed in the air flow closed region 112, so that air flow circulation cannot be formed with the air vent on the machine table body 200, when the laser beam 300 for cutting is used for cutting on the substrate 100 to be cut, and the projection of the cutting line on the placing surface 11 is located in the air flow closed region 112, because negative pressure adsorption force does not exist in the air flow closed region 112, stress cracks cannot be formed on the cut edge, and therefore the problem that stress cracks can be generated on the cut edge of the substrate when the cutting scanning path passes through the adsorption hole in the prior art is solved.
Preferably, the gas flow closing region 112 is formed in a stripe shape on the placing surface 11 corresponding to the shape of the pre-cut line of the substrate to be cut. Specifically, a plurality of airflow sealing areas 112 are formed on the placing surface 11, each pre-cutting line of the substrate to be cut corresponds to one of the airflow sealing areas 112, and the projection of each pre-cutting line on the placing surface is located in the corresponding airflow sealing area 112.
It is understood that the cutting lines of the substrate are formed in a linear shape, and therefore, in the support layer for substrate cutting according to the embodiment of the present invention, it is sufficient that the gas flow blocking region 112 is formed in a linear shape and has a width slightly larger than the width of the cutting lines formed by cutting the substrate in the cutting direction.
In the supporting layer for cutting the substrate according to the first embodiment of the present invention, the supporting layer body may be made of a rigid material, such as metal, and an airflow channel region is formed by forming a plurality of through holes, when the supporting layer is disposed between the machine table and the substrate to be cut, the substrate to be cut is fixed by using the airflow channel region, and a projection of a pre-cutting line of the substrate to be cut on a placement surface of the supporting layer body is located in a region where no through hole is disposed, that is, in an airflow closed region, so that a problem that stress cracks are generated at an edge when a scanning path passes through an adsorption hole when the substrate is cut is solved.
Therefore, the invention only needs to arrange a supporting layer below the substrate to be cut, not only can realize the adsorption effect of the substrate to be cut and ensure the smooth proceeding of the cutting process, but also can solve the problem that the edge generates stress cracks during the laser cutting in the prior art.
The present invention also provides another embodiment of a support layer for substrate cutting, as shown in fig. 5 and 6, the support layer of this embodiment includes:
the supporting layer body 10 is made of a porous flexible material, the supporting layer body 10 comprises a placing surface 11, a groove 110 is formed in the placing surface 11, and a rigid substance is filled in the groove 110;
wherein, the through holes on the porous flexible material for making the supporting layer body 10 are formed into airflow channels for realizing airflow communication between the placing surface 11 and the opposite end surface 13, on the placing surface 11, the arrangement area of the groove 110 is formed into an airflow closed area 112, and the area without the groove 110 is formed into an airflow channel area 111;
furthermore, the projection of the pre-cut lines of the substrate to be cut onto the placement surface 11 is located within the air flow containment area.
Specifically, the porous flexible material of the supporting layer body 10 may be a foamed polymer material, and the material has a characteristic of fine pores, so as to realize airflow communication between the placing surface 11 and the opposite end surface 13, and when the material is disposed on a machine, the material is communicated with a vacuum adsorption hole on the machine, so as to vacuum adsorb a substrate to be cut disposed on the supporting layer body 10.
In addition, the rigid substance filled in the recess 110 may be glass, metal or ceramic for closing the air flow passage between the placing surface 11 and the opposite end surface 13 at the setting area.
Referring to fig. 7 in combination with fig. 5 and 6, when the supporting layer body 10 is disposed on the machine table body 200, the opposite end surface 13 of the placing surface 11 is attached to the mounting surface of the machine table body 200, and the substrate 100 to be cut is flatly placed on the placing surface 11 of the supporting layer body 10, since the plurality of micro holes are disposed in the airflow channel region 111 of the placing surface 11, airflow communication from the placing surface 11 to the machine table body 200 can be achieved, and when a negative pressure is generated in the vent holes 210 of the machine table body 200, the substrate 100 to be cut above the placing surface 11 can be communicated to the placing surface 11, so as to perform vacuum adsorption on the substrate 100 to be cut; because on the airflow closed area 112 of the placing surface 11, the rigid substance is closed, airflow circulation cannot be formed with the vent hole 210 on the machine table body 200, when the laser beam 300 for cutting is used for cutting on the substrate 100 to be cut, and when the projection of the cutting line on the placing surface 11 is positioned in the airflow closed area 112, because negative pressure adsorption force does not exist in the airflow closed area 112, stress cracks cannot be formed on the cut edge, so that the problem that stress cracks can be generated on the cut edge of the substrate when a cutting scanning path passes through the adsorption hole in the prior art is solved.
With reference to fig. 5, in the embodiment of the present invention, the thickness of the supporting layer body 10 in the direction perpendicular to the placing surface 11 is 0.3mm to 2mm, and the depth of the groove 110 provided on the supporting layer body 10 has no maximum requirement, and may be less than or equal to the thickness of the supporting layer body 10, but the minimum depth should satisfy the functional requirement of blocking the air flow, and preferably, the depth of the groove 110 is greater than or equal to 0.3 mm.
Further, referring to fig. 6, the groove 110 provided on the placing surface 11 is formed in a stripe shape corresponding to the shape of the preliminary cutting line of the substrate to be cut. Specifically, a plurality of grooves 110 are formed on the placing surface 11, each pre-cut line of the substrate to be cut corresponds to one of the grooves 110, and a projection of each pre-cut line on the placing surface is located in the corresponding groove 110.
It is understood that the cutting lines of the substrate are formed in a linear shape, and therefore, in the support layer for substrate cutting according to the embodiment of the present invention, the grooves 110 may be formed in a linear shape, and have a width slightly larger than the width of the cutting lines formed by cutting the substrate in the cutting direction.
In the second embodiment of the invention, the supporting layer made of the porous flexible material is arranged between the machine table body and the substrate to be cut, the airflow channel area is formed by utilizing a plurality of through holes of the porous flexible material, the substrate to be cut is adsorbed and fixed, the groove formed in the porous flexible material is utilized to be filled with the rigid substance, the airflow channel is sealed to form the airflow sealing area, and when the projection of the pre-cutting line of the substrate to be cut on the placing surface of the supporting layer body is positioned in the airflow sealing area, namely, when the substrate to be cut is cut right above the airflow sealing area, the negative pressure adsorption force does not exist in the airflow sealing area, so that the stress crack can not be formed at the cut edge. This structure forms the supporting layer that just gentle combined together, not only can realize treating the adsorption of cutting base plate, guarantees going on smoothly of cutting process, and the edge produces stress crack's problem when can also solving prior art laser cutting to guarantee the homogeneity of cutting line width.
The invention also provides a machine table, which comprises the supporting layer for cutting the base plate with the structure, wherein the machine table comprises a machine table body, the machine table body comprises an installation surface provided with a plurality of vent holes, when the supporting layer is used, the opposite end surfaces of a placing surface are attached and connected with the installation surface of the machine table body, and the placing surface is provided with the tiled base plate to be cut. The placing surface is communicated with the vent hole on the machine table body in the airflow channel area, and the vent hole on the airflow closed area and the machine table body cannot be communicated.
The specific mounting structure between the supporting layer and the machine body can be seen in fig. 4 and 7, and is not described herein again.
In addition, the machine station further comprises a vacuum pump and a connecting pipeline connecting the vacuum pump and the vent hole, and a person skilled in the art can understand the specific mode and structure when the vacuum pump and the connecting pipeline are arranged on the machine station body, which is not described in detail herein.
In another aspect, the present invention further provides a method for cutting a substrate by using the above machine, referring to fig. 8 in combination with fig. 2 to 7, the method including:
s810, placing the substrate 100 to be cut on the placing surface 11 of the supporting layer body 10, and enabling the projection of the pre-cutting line of the substrate 100 to be cut on the placing surface 11 to be positioned in the air flow closed area 112;
s820, vacuuming the air holes on the machine body 200 to make the substrate 100 to be cut adsorbed and fixed on the supporting layer body 10 through the airflow channel region 111 on the supporting layer body;
s830, outputting a laser beam, and scanning the laser beam along a pre-cutting line of the substrate to be cut to form a cutting line, so that the substrate to be cut 100 is cut.
In the method according to the embodiment of the present invention, preferably, the substrate to be cut is a flexible substrate, such as a substrate made of a polyimide PI material, a polyethylene terephthalate PET material, or a polyethylene naphthalate PEN material.
In addition, preferably, the laser used for completing the cutting process of the substrate to be cut is CO2A laser.
By adopting the method provided by the embodiment of the invention, the projection of the pre-cutting line of the substrate to be cut on the placing surface of the supporting layer body is positioned in the airflow closed area, namely, the substrate is cut right above the airflow closed area, and because negative pressure adsorption force does not exist in the airflow closed area, stress cracks can not be formed on the cut edge, so that the problem that the edge of the cut substrate is affected by negative pressure to generate stress cracks when a cutting scanning path passes through the adsorption hole on the machine table in the prior art is solved.
While the preferred embodiments of the present invention have been described, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims.
Claims (10)
1. A supporting layer for cutting a substrate, comprising:
the supporting layer body comprises a placing surface for placing a substrate to be cut and an opposite end surface opposite to the placing surface, and the placing surface comprises an airflow passage area and an airflow closed area; the placing surface can realize air flow communication with the opposite end surface in the air flow passage area, and cannot realize air flow communication with the opposite end surface in the air flow closed area; wherein, the projection of the pre-cutting line of the substrate to be cut on the placing surface is positioned in the air flow closed area;
the supporting layer body is made of a porous flexible material, a groove is formed in the placing surface, and a rigid substance is filled in the groove;
the arrangement area of the groove is formed into the airflow closed area, and the through holes in the porous flexible material for manufacturing the supporting layer body are formed into airflow channels which enable the airflow communication between the airflow channel area and the opposite end faces.
2. The support layer for cutting a substrate according to claim 1, wherein the rigid material is glass, metal, or ceramic.
3. The support layer for cutting a substrate according to claim 1, wherein the porous flexible material is a foamed polymer material.
4. The support layer for cutting a substrate according to claim 1, wherein the thickness of the support layer body in a direction perpendicular to the placement surface is 0.3mm to 2mm, and the depth of the groove is 0.3mm or more.
5. The support layer for cutting of substrates according to claim 4, wherein the depth of the groove in the direction perpendicular to the placement surface is equal to the thickness of the support layer body.
6. The supporting layer for substrate cutting according to any one of claims 1 to 5, wherein the airflow sealing area is formed in a stripe shape on the placement surface corresponding to a shape of a pre-cut line of the substrate to be cut.
7. The supporting layer for cutting the substrate according to claim 6, wherein a plurality of the airflow sealing areas are formed on the placing surface, each pre-cutting line of the substrate to be cut corresponds to one of the airflow sealing areas, and a projection of each pre-cutting line on the placing surface is positioned in the corresponding airflow sealing area.
8. A machine table comprising a machine table body, wherein the machine table body comprises a mounting surface provided with a plurality of vent holes, and the machine table is characterized by further comprising the supporting layer for cutting the substrate according to any one of claims 1 to 7, wherein the opposite end surfaces are attached to the mounting surface, the placing surface is communicated with the vent holes in the airflow passage area, and is not communicated with the vent holes in the airflow closed area.
9. A method for cutting a substrate using the apparatus of claim 8, the method comprising:
placing a substrate to be cut on the placing surface of the supporting layer body, and enabling the projection of a pre-cutting line of the substrate to be cut on the placing surface to be positioned in the airflow closed area;
vacuumizing the vent hole on the machine table body to enable the substrate to be cut to be adsorbed and fixed on the supporting layer body through the airflow channel area on the supporting layer body;
and outputting a laser beam to scan the laser beam along the pre-cutting line of the substrate to be cut to form a cutting line, wherein the substrate to be cut is cut.
10. The method of claim 9, wherein the substrate to be cut is a flexible substrate.
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| CN201710286047.2A CN106966578B (en) | 2017-04-25 | 2017-04-25 | Supporting layer and machine table for cutting substrate and method for cutting substrate by adopting machine table |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108188590B (en) * | 2017-12-28 | 2020-02-18 | 武汉华星光电半导体显示技术有限公司 | Cutting method of flexible medium |
| CN108500478A (en) * | 2018-03-29 | 2018-09-07 | 武汉华星光电半导体显示技术有限公司 | The cutting auxiliary device of display panel cutting equipment and display panel |
| CN108453399B (en) * | 2018-04-08 | 2024-03-26 | 天津泰格瑞祥仪器设备有限公司 | Cutting platform |
| CN108682305B (en) | 2018-05-21 | 2021-04-27 | 京东方科技集团股份有限公司 | Flexible substrate, preparation method thereof and flexible display device |
| CN113787722A (en) * | 2021-07-21 | 2021-12-14 | 武汉锐科光纤激光技术股份有限公司 | Packaging device and packaging method |
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|---|---|---|---|---|
| CN103214178A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Adjustment method of multifunctional glass support platform |
| CN103833206A (en) * | 2014-02-22 | 2014-06-04 | 蚌埠中建材信息显示材料有限公司 | Inclined roller table for transversely cutting ultrathin plate glass |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103214178A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Adjustment method of multifunctional glass support platform |
| CN103833206A (en) * | 2014-02-22 | 2014-06-04 | 蚌埠中建材信息显示材料有限公司 | Inclined roller table for transversely cutting ultrathin plate glass |
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