CN106961538A - The focus adjustment method and focus control of array camera module - Google Patents
The focus adjustment method and focus control of array camera module Download PDFInfo
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- CN106961538A CN106961538A CN201610008681.5A CN201610008681A CN106961538A CN 106961538 A CN106961538 A CN 106961538A CN 201610008681 A CN201610008681 A CN 201610008681A CN 106961538 A CN106961538 A CN 106961538A
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- array camera
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- array
- test board
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000012360 testing method Methods 0.000 claims abstract description 135
- 230000003287 optical effect Effects 0.000 claims abstract description 66
- 230000007246 mechanism Effects 0.000 claims abstract description 34
- 238000012545 processing Methods 0.000 claims abstract description 23
- 238000003491 array Methods 0.000 claims abstract description 21
- 230000008859 change Effects 0.000 claims abstract description 17
- 230000008569 process Effects 0.000 claims abstract description 9
- 238000007711 solidification Methods 0.000 claims abstract description 9
- 230000008023 solidification Effects 0.000 claims abstract description 9
- 230000000694 effects Effects 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 45
- 230000033001 locomotion Effects 0.000 claims description 43
- 239000003292 glue Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract 1
- 238000001514 detection method Methods 0.000 abstract 1
- 210000004907 gland Anatomy 0.000 description 15
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000004807 localization Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a kind of focus adjustment method and focus control of array camera module, for carrying out optical focusing to the array camera module assembled, the array camera module assembled is positioned by detent mechanism, and the array camera module setting position assembled is exerted a force based on multiple spiral micrometer bars or six axles regulation platform, adjust the deformation of elastic washer, to change distance and the pitching of optical mirror slip facing arrays image sensor chip, focused for array camera module, and by resoliving power test target, test board and data processing terminal detection focus effect, obtain good image quality, to complete focusing encapsulating solidification, fixed array camera module.The invention focussing process facilitates controllable, and focus control is simple in construction, low cost of manufacture.
Description
Technical field
The present invention relates to array camera module technical field, more particularly to a kind of battle array
The focus adjustment method and focus control of row camera module.
Background technology
Under the promotion of current consumer electronics, the image quality and yield of camera module
Improve constantly.Current array camera lens module can ensure relatively low height, and not
Focusing is needed, can realize that high-definition image is rebuild, 3D rendering shows, first clapped in addition
Take many New functions such as rear focusing, panorama depth, high-speed camera, high dynamic picture.Mesh
Preceding manufacture array camera module technology is immature, high cost, limits array shooting mould
The further development of group.
Publication No. is a kind of CN 104272143A's patent document 2 discloses that shooting dress
Put and lens array laminated body and its manufacture method.Wherein, structural member is one in invention
Body, in structural member, it is necessary to fixed camera lens part, aperture, filter glass, core
Piece is assembled successively according to the method for screens.Its maximum drawback is structural member one
Change, the space not adjusted, therefore the alignment of lens light axis and chip photosensitive area, image distance
Regulation the problems such as can not solve, image finished product yield and image quality.
Therefore, the applicant proposes a kind of array camera module in other patent,
Including array image sensor chip, package substrate, array lens and elastic washer,
Array lens include structural member, gland, optical filter, some optical mirror slips and some screenings
Mating plate, by the assembling of structural member and gland, has locked optical mirror slip and anti-dazzling screen,
And by the assembling of gland, elastic washer and package substrate, secure optical mirror slip with
The position of array image sensor chip, then by forming communicating structure part, pressure successively
Lid, some through holes of elastic washer, and by the way of encapsulating solidification, can be achieved
Fixation after module group assembling and focusing, assembling process is simple.Wherein, structural member,
, it is necessary to optical mirror slip and array after the assembling of gland, elastic washer and package substrate
The distance between image sensor chip is adjusted, i.e., carry out optical focusing to module
Then encapsulating is carried out again to fix.Therefore, the present invention proposes a kind of array camera module
Focus adjustment method and focus control.
The content of the invention
In order to solve the above-mentioned technical problem, the present invention proposes a kind of a burst of row shooting mould
The focus adjustment method and focus control of group, can focus to array camera module, it is ensured that
Image quality, focussing process is simple and easy to apply.
The technical proposal of the invention is realized in this way：
A kind of focus adjustment method of array camera module, for being imaged to the array assembled
Module carries out optical focusing, and the array camera module assembled is passed including array image
Sensor chip, package substrate, array lens and elastic washer, comprise the following steps：
A, the positioning of the package substrate of the array camera module assembled is positioned over a survey
On test plate (panel), and test board positioning is fixedly arranged on an optic test platform, made described
The signal input part of test board is electrically connected with the package substrate, the letter of the test board
Number output end is electrically connected with a data processing terminal；
B, a resoliving power test target is set above array camera module, and adjust should
The distance between resoliving power test target and the array lens；
C, positioned by a detent mechanism and push down the array lens of array camera module,
Detent mechanism is driven to exert a force array lens setting position by a governor motion, adjustment
The deformation of elastic washer, changes the position of optical mirror slip facing arrays image sensor chip
Put, focused；
D, focussing process are：The view data that test board shoots array camera module
Data processing terminal is transferred to, shows that the resolution ratio shot is surveyed by data processing terminal
Attempt, to detect the shooting effect of array camera module, obtain satisfactory focusing
As a result after, solidification glue progress module is injected into the through hole of array camera module and is consolidated
It is fixed.
Or, test board positioning is fixedly arranged on a governor motion in step, will
Governor motion positioning is fixedly arranged on an optic test platform；In step C, by this
Governor motion drives test board to exert a force package substrate setting position, adjusts elastic washer
Deformation, change optical mirror slip facing arrays image sensor chip position, carry out
Focusing.
Further, the test board positioning is fixedly arranged in the middle part of the optic test platform
When, the governor motion includes several spiral micrometer bars, and the spiral micrometer bar is
Micrometer caliper removes the part after U-shaped chi frame and fixing anvil thereon, including fixation
Swivel nut, the micrometric screw coordinated in the fixed swivel nut with its screw thread, located at solid
Determine the microdrum outside swivel nut and the vernier knob located at microdrum tail end；The localization machine
Structure include fixed support and with the one-to-one some supports of some micrometric screws
Bar；Provided with a bracket institution, the bracket institution includes some columns, some columns
Lower end is fixed in the surrounding of the optic test platform, and the fixed support is fixed in
The middle part of some columns, the fixation swivel nut of some spiral micrometer bars is fixed in
On the fixed support, and it is suspended at the array lens surrounding of the array camera module
Top；The each support bar of correspondence, the structural member upper surface of the array lens is provided with one
Individual locating slot, described support bar one end is fixedly connected with the micrometric screw, the other end
It is positioned in the locating slot；Corresponding branch is controlled by some spiral micrometer bars
Strut is finely adjusted, change between optical mirror slip and array image sensor chip away from
From or/and optical mirror slip pitching.
Further, when the test board positioning is fixedly arranged on the governor motion, institute
State governor motion and adjust platform for six axles, the test board positioning is fixedly arranged on six axle
Adjust on platform, six axle regulation platform is fixedly arranged on the optic test platform；Institute
Stating detent mechanism includes fixed support and some support bars；The each support bar of correspondence, institute
The structural member upper surface for stating array lens is provided with a locating slot, and several locating slots
It is arranged in the surrounding of the structural member；Provided with a bracket institution, the bracket institution bag
Some columns are included, the lower end of some columns is fixed in the surrounding of the optic test platform
Side, the fixed support is fixed in the middle part of some columns, some supports
Bar one end is fixed on the fixed support, and the other end is positioned in the locating slot；
Adjusting platform by multiaxis drives test board to be finely adjusted, and changes optical mirror slip and array
The pitching of the distance between image sensor chip or/and optical mirror slip.
Further, provided with four locating slots, four locating slots are arranged in
At the corner of the structural member.
A kind of focus control of array camera module, including bracket institution, governor motion,
Detent mechanism, resoliving power test target, test board, optic test platform and data processing
Terminal, the bracket institution includes some columns, and the lower end of some columns is fixed in institute
State the surrounding of optic test platform, the package substrate positioning of the array camera module
It is positioned on the test board, the test board positioning is fixedly arranged on the optic test and put down
In the middle part of platform, the signal input part of the test board is electrically connected with the package substrate, institute
The signal output part for stating test board is electrically connected with the data processing terminal；It is described to differentiate
It is can adjust above and below rate test chart on some columns, and be suspended from the array shooting mould
The top of group；The array lens of array camera module are pushed down in the detent mechanism positioning,
The governor motion can drive the detent mechanism to apply array lens setting position
Power, adjusts the deformation of elastic washer, changes optical mirror slip facing arrays imaging sensor
The position of chip；
Or, the test board positioning is fixedly arranged on the governor motion, the regulation machine
Structure positioning is fixedly arranged on the optic test platform；The governor motion can drive institute
State test board to exert a force to package substrate setting position, adjust the deformation of elastic washer, change
Become the position of optical mirror slip facing arrays image sensor chip.
Further, the test board positioning is fixedly arranged in the middle part of the optic test platform
When, the governor motion includes several spiral micrometer bars, and the spiral micrometer bar is
Micrometer caliper removes the part after U-shaped chi frame and fixing anvil thereon, including fixation
Swivel nut, the micrometric screw coordinated in the fixed swivel nut with its screw thread, located at solid
Determine the microdrum outside swivel nut and the vernier knob located at microdrum tail end；The localization machine
Structure include fixed support and with the one-to-one some supports of some micrometric screws
Bar；The fixed support is fixed in the middle part of some columns, some spirals
The fixation swivel nut of micrometer bar is fixed on the fixed support, and is suspended at the array
Above the array lens surrounding of camera module；The each support bar of correspondence, the array mirror
The structural member upper surface of head is surveyed provided with a locating slot, described support bar one end with described
Micro- screw rod is fixedly connected, and the other end is positioned in the locating slot.
Further, when the test board positioning is fixedly arranged on the governor motion, institute
State governor motion and adjust platform for six axles, the test board positioning is fixedly arranged on six axle
Adjust on platform, six axle regulation platform positioning is fixedly arranged on the optic test platform
On；The detent mechanism includes fixed support and some support bars；The each support of correspondence
Bar, the structural member upper surface of the array lens is provided with a locating slot, and several
Locating slot is arranged in the surrounding of the structural member, and the fixed support is fixed in some
The middle part of the column, some described support bar one end are fixed in the fixed support
On, the other end is positioned in the locating slot；Platform is adjusted by six axle to drive
The test board exerts a force to package substrate setting position, adjusts the deformation of elastic washer,
Change the position of optical mirror slip facing arrays image sensor chip；
Further, one end that the support bar connects the locating slot is in orbicule.
Further, the fixed support is a rectangle support, is fixed in some described
On the middle part of column.
Further, provided with four locating slots, four locating slots are arranged in
At the corner of the structural member.
Beneficial effects of the present invention are as follows：The present invention proposes a kind of array camera module
Focus adjustment method and focus control, using multiple spiral micrometer bars coordinate detent mechanism or
Six axles regulation platform coordinates detent mechanism, is sensed to adjust optical mirror slip to array image
The image distance of device chip and pitching, can focus to the array camera module assembled,
Ensure image quality.The low cost of manufacture of the invention, focussing process is simple and easy to apply.
Brief description of the drawings
Fig. 1 is the sectional view of the array camera module assembled in the present invention；
Fig. 2 is the top view of the array camera module assembled in the present invention；
Making and assembling schematic diagram of the Fig. 3 for array camera module in the present invention；
Fig. 4 is optical mirror slip in the present invention and anti-dazzling screen assembling schematic diagram；
Fig. 5 is focus control side view in the embodiment of the present invention 1；
Fig. 6 is mplifying structure schematic diagram at A in Fig. 1；
Fig. 7 is spiral micrometer bar structural representation in the embodiment of the present invention 1；
Fig. 8 is focus control top view in the embodiment of the present invention 1；
Fig. 9 is focus control side view in the embodiment of the present invention 2；
With reference to accompanying drawing, make the following instructions：
1- array camera modules, 11- array image sensor chips, 111- images are passed
Sense chip, 112- soldered balls, 12- package substrates, 121- rigid substrates, 1211- encapsulatings
Groove, 122- flexible base boards, 13- array lens, 131- structural members, 1311- cylindrical portions,
1312- cover plates, 13121- light admission ports, 132- glands, 1321- light admission ports, 1322-
Locating slot, 133- optical filters, 134- optical mirror slips, 1341- optics support plates, 13411-
Neck, 13412- is raised, 13413- taper salient points, 13414- taper concave points, 1342-
Function lens, 135- anti-dazzling screens, 1351- light admission ports, 14- elastic washers, 15- is passed through
Through hole, 16- glue, 2- test boards, 3- optic test platforms, 4- data processings are whole
End, 5- resoliving power test targets, 6- detent mechanisms, 61- fixed supports, 62- support bars,
601- fixed supports, 602- support bars, 7- governor motions, 71- spiral micrometer bars,
711- fixation swivel nuts, 712- micrometric screws, 713- microdrums, 714- vernier knobs,
The axles of 701- six adjust platform, 8- bracket institutions, 81- columns.
Embodiment
To enable technical scheme more understandable, below in conjunction with the accompanying drawings to this
The embodiment of invention is described in detail.For convenience of description, embodiment accompanying drawing
Structure in each part do not scaled by normal rates, therefore do not represent in embodiment each
The actual relative size of structure.The above or over of wherein described structure, comprising in
Between also have miscellaneous part situation.
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, the array shooting mould to assemble
Group 1, including array image sensor chip 11, package substrate 12, array lens
13 and elastic washer 14, the array image sensor chip includes being arranged into array
Some image sensor chips 111, the array lens include structural member 131, pressure
Lid 132, the optical mirror slip 134 of optical filter 133 and at least two, the structural member bag
Include hollow cylindrical portion 1311 and close the cover plate 1312 of the cylindrical portion upper end, often
The individual optical mirror slip includes optics support plate 1341 and is formed on the optics support plate
Some functions of being arranged into array with some described image sensing chips one-to-one corresponding are saturating
Mirror 1342；The two neighboring optics support plate is bonded to each other together, and mutually patch
The interface edge position of conjunction by least one pair of mutually identical neck 13411 with it is convex
Play 13412 and carry out engaging positioning, make the optical axis coarse alignment of function lens thereon.
The neck, the raised section along optical axis direction be trapezoidal or rectangle, institute
State between neck and the projection by taper salient point 13413 and taper concave point 13414
Engaging positioning is carried out, makes function lens fine alignment thereon.Wherein, taper salient point
And taper concave point, can reach machining accuracy<1 μm of rank, and using neck with it is convex
Rise, between method that taper salient point engage with taper concave point progress optical mirror slip from right
Standard, meets the optical axis alignment requirement of optical mirror slip.
The gland closing is incorporated into the lower end of the cylindrical portion, light described at least two
Lens light axis alignment is learned to be stacked and placed in the cylindrical portion, and backstop is positioned at the cover plate
Downside and the gland upside between, it is fixed between the two neighboring optical mirror slip
Position is provided with anti-dazzling screen 135, and the two neighboring optical mirror slip is bonded to each other together,
And interface medium position bonded to each other is formed with rectangular channel, the anti-dazzling screen is accommodating fixed
In the rectangular channel.So, by mutually being pasted in two adjacent optical mirror slips
Rectangular channel is formed on the interface of conjunction can realize the positioning of anti-dazzling screen, and anti-dazzling screen is usually band
The black anti-dazzling screen of light admission port 1351, the light admission port can be slide, Ke Yishi
Opening, the light for isolating crosstalk between each optical mirror slip；By the knot being machined
Multi-disc optical mirror slip and black anti-dazzling screen are assembled integrally by component and gland.
The gland, the anti-dazzling screen, it is equipped with and some work(on the cover plate
Energy lens are arranged into the light admission port 1321,1351,13121 of array correspondingly；
The downside of the gland has groove, and the optical filter positioning is located at the bottom of the groove
Portion；The array image sensor chip underside is assembled on the upside of the package substrate,
Some described image sensing chips tie point corresponding with the package substrate is electrical
Connection, the elastic washer is sheathed on outside the array image sensor chip, and group
Between gland and the package substrate loaded on the array lens, make the array of figure
As sensor chip is placed in the groove；It is also formed with structure described in insertion successively
Part, the gland, some through holes 15 of the elastic washer, the through hole are used
Curable glue 16 is marked with Yu Qi, is realized after module group assembling and optical focusing
Fixation.
The package substrate includes rigid substrates 121 and is connected to the flexibility of its side
Substrate 122, the array image sensor chip underside is assembled in the rigid substrates
Upside, described image sensing chip tie point corresponding with the rigid substrates is electrical
Connection, the elastic washer is sheathed on outside the array image sensor chip, and group
Set between the gland and the rigid substrates of the array lens.
Flexible base board is connected with rigid substrates, for by the signal of array image sensor chip
Line is fanned out to, and keeps certain bending free degree.
The position of the correspondence through hole is formed with glue-filling slot on the rigid substrates
1211, the glue-filling slot connects the through hole and structural member exterior space.Pass through insertion
Hole respectively sets one for surrounding, in order to increase the adhesion of solidification glue, is rigidly encapsulating base
Also the glue-filling slot of four bar shapeds is devised on plate, for injecting solidification glue in through hole
When, strike-through amount in glue-filling slot adjusts injecting glue amount；When can be used for injecting glue
Beneficial to the discharge of air in through hole, increase solidification intensity.
The array image sensor chip is N × M array, and wherein N, M is just
Integer；Such as 2 × 2 arrays, 3 × 3 arrays, 2 × 3 arrays, 4 × 4 arrays etc..
The array camera module assembled, passes through the assembling of structural member and gland, lock
Determine optical mirror slip and anti-dazzling screen, and by the assembling of gland, elastic washer and substrate,
The position of optical mirror slip and array image sensor chip is determined, so, it is only necessary to
Change the compression degree of elastic washer, you can realize that optical mirror slip is sensed with array image
Between device chip during the regulation, i.e. module focusing of distance, mould is realized in the regulation of image distance
The function of group optical focusing.
The present invention proposes the focus adjustment method and focusing dress of a kind of a burst of row camera module
Put, can be focused for array camera module, it is ensured that image quality, focussing process letter
It is single easy.
Embodiment 1
Referring to Fig. 5 and Fig. 8, a kind of focus adjustment method of array camera module, for pair
The above-mentioned array camera module assembled carries out optical focusing, comprises the following steps：
A, the positioning of the package substrate of the array camera module assembled is positioned over a survey
On test plate (panel) 2, and test board positioning is fixedly arranged on an optic test platform 3, made
The signal input part of the test board is electrically connected with the package substrate, the test board
Signal output part be electrically connected with a data processing terminal 4；
B, a resolution test Fig. 5 is set above array camera module, and adjusted
The distance between the resoliving power test target and the array lens；
C, positioned by a detent mechanism 6 and push down the array lens of array camera module,
Drive detent mechanism to exert a force array lens setting position by a governor motion 7, adjust
The deformation of whole elastic washer, changes optical mirror slip facing arrays image sensor chip
Position, is focused；
The governor motion includes several spiral micrometer bars 71, the spiral micrometer
Part after fixing anvil of the bar for micrometer caliper removal U-shaped chi frame and thereon, referring to
Fig. 7, including fix swivel nut 711, coordinate in the fixed swivel nut with its screw thread
Micrometric screw 712, the microdrum 713 outside fixed swivel nut and located at microdrum
The vernier knob 714 of tail end；If the detent mechanism include fixed support 61 and with
Do the one-to-one some support bars 62 of the micrometric screw；Provided with a bracket institution
8, the bracket institution includes some columns 81, and the lower ends of some columns is fixed in described
The surrounding of optic test platform, the fixed support is fixed in some columns
Middle part, the fixation swivel nut of some spiral micrometer bars is fixed in the fixed support
On, and be suspended above the array lens surrounding of the array camera module；Correspondence is every
Individual support bar, the structural member upper surface of the array lens is provided with a locating slot
1311, described support bar one end is fixedly connected with the micrometric screw, other end positioning
In in the locating slot；Corresponding support bar is controlled by some spiral micrometer bars
Be finely adjusted, change the distance between optical mirror slip and array image sensor chip or
/ the pitching with optical mirror slip.
D, focussing process are：The view data that test board shoots array camera module
Data processing terminal is transferred to, shows that the resolution ratio shot is surveyed by data processing terminal
Attempt, to detect the shooting effect of array camera module, obtain satisfactory focusing
As a result after, solidification glue progress module is injected into the through hole of array camera module and is consolidated
It is fixed.
It is preferred that, provided with four locating slots, four locating slots are arranged in institute
State at the corner of structural member.
Referring to Fig. 5 and Fig. 8, a kind of focus control of array camera module, including branch
Frame mechanism 8, governor motion 7, detent mechanism 6, resolution test Fig. 5, test board
2nd, optic test platform 3 and data processing terminal 4, if the bracket institution includes
Dry column 81, the lower end of some columns is fixed in the surrounding of the optic test platform
Side, the package substrate positioning of the array camera module is positioned on the test board,
The test board positioning is fixedly arranged in the middle part of the optic test platform, the test board
Signal input part is electrically connected with the package substrate, the signal output part of the test board
It is electrically connected with the data processing terminal；It can adjust and set above and below the resoliving power test target
In on some columns, and it is suspended from the top of the array camera module；The localization machine
Structure positions the array lens for pushing down array camera module, and the governor motion can drive
The detent mechanism exerts a force to array lens setting position, adjusts the shape of elastic washer
Become, change the position of optical mirror slip facing arrays image sensor chip；
The governor motion includes several spiral micrometer bars 71, the spiral micrometer
Part after fixing anvil of the bar for micrometer caliper removal U-shaped chi frame and thereon, referring to
Fig. 7, including fix swivel nut 711, coordinate in the fixed swivel nut with its screw thread
Micrometric screw 712, the microdrum 713 outside fixed swivel nut and located at microdrum
The vernier knob 714 of tail end；If the detent mechanism include fixed support 61 and with
Do the one-to-one some support bars 62 of the micrometric screw；The fixed support is consolidated
The middle part of some columns is connected to, the fixation swivel nut of some spiral micrometer bars is consolidated
It is connected on the fixed support, and is suspended at the array lens of the array camera module
Above surrounding；The each support bar of correspondence, the structural member upper surface of the array lens is set
There is a locating slot 1311, described support bar one end is fixed with the micrometric screw to be connected
Connect, the other end is positioned in the locating slot.
It is preferred that, referring to Fig. 6, one end that the support bar connects the locating slot is in
Orbicule, the smooth transition exerted a force beneficial to all directions, the regulation for increasing module is accurate
Degree..
It is preferred that, the fixed support is a rectangle support, is fixed in some described vertical
On the middle part of post.
It is preferred that, provided with four locating slots, four locating slots are arranged in institute
State at the corner of structural member.
In the present embodiment, spiral micrometer bar is reequiped for micrometer caliper of the prior art
Form, the fine setting for realizing structural member, ranging degree of regulation up to 1 micron dimension,
The affixed support bar of micrometric screw of spiral micrometer bar, is pushed away when being adjusted for spiral micrometer bar
Locating slot carrys out pushing structure part and vertically moved on dynamic structural member.Surveyed by being fixed on optics
View data is transferred to data processing terminal by the test board on examination platform, is such as calculated
Machine, the resoliving power test target shot by Computer display, to detect module shooting effect
Really, so as to carry out the regulation of spiral micrometer bar accordingly.Resoliving power test target can go up downward
Section is fixed on column, to be vertically moved.Surveyed by four spirals of regulation simultaneously
Microbot adjusts optical mirror slip to the image distance of array image sensor chip, passes through regulation
Single or several spiral micrometer bars adjust the angle of pitch of optical mirror slip part in module,
The array camera module assembled can be focused, it is ensured that image quality, focused
Journey is simple and easy to apply.
Embodiment 2
Referring to Fig. 9, a kind of focus adjustment method of array camera module, for above-mentioned group
The array camera module installed carries out optical focusing, comprises the following steps：
A, the positioning of the package substrate of the array camera module assembled is positioned over a survey
On test plate (panel) 2, test board positioning is fixedly arranged on a governor motion 7, by the regulation machine
Structure positioning is fixedly arranged on an optic test platform 3, inputs the signal of the test board
End is electrically connected with the package substrate, and the signal output part of the test board is electrically connected with
One data processing terminal 4；
B, a resolution test Fig. 5 is set above array camera module, and adjusted
The distance between the resoliving power test target and the array lens；
C, positioned by a detent mechanism 6 and push down the array lens of array camera module,
Drive test board to exert a force package substrate setting position by the governor motion, adjust bullet
Property packing ring deformation, change optical mirror slip facing arrays image sensor chip position
Put, focused；
D, focussing process are：The view data that test board shoots array camera module
Data processing terminal is transferred to, shows that the resolution ratio shot is surveyed by data processing terminal
Attempt, to detect the shooting effect of array camera module, obtain satisfactory focusing
As a result after, solidification glue progress module is injected into the through hole of array camera module and is consolidated
It is fixed.
Referring to Fig. 9, the governor motion is that six axles adjust platform 701, the test
Plate positioning is fixedly arranged on the six axles regulation platform, and six axle regulation platform is fixedly arranged on institute
State on optic test platform；If the detent mechanism includes fixed support 601 and the Heavenly Stems and Earthly Branches
Strut 602；The each support bar of correspondence, the structural member upper surface of the array lens is set
There is a locating slot 1322, and several locating slots are arranged in the four of the structural member
Periphery；Provided with a bracket institution 8, the bracket institution includes some columns 81, some
The lower end of column is fixed in the surrounding of the optic test platform, the fixed support
The middle part of some columns is fixed in, some described support bar one end are fixed in described
On fixed support, the other end is positioned in the locating slot；Platform is adjusted by multiaxis
Drive test board to be finely adjusted, change optical mirror slip and array image sensor chip it
Between distance or/and optical mirror slip pitching.
It is preferred that, provided with four locating slots, four locating slots are arranged in institute
State at the corner of structural member.
Referring to Fig. 9, a kind of focus control of array camera module, including bracket institution
8th, governor motion 7, detent mechanism 6, resolution test Fig. 5, test board 2, light
Test platform 3 and data processing terminal 4 are learned, the bracket institution includes some columns
81, the lower end of some columns is fixed in the surrounding of the optic test platform, described
The package substrate positioning of array camera module is positioned on the test board, the test
Plate positioning is fixedly arranged on the governor motion, and governor motion positioning is fixedly arranged on the light
Learn on test platform；The signal input part of the test board is electrically connected with the encapsulation base
Plate, the signal output part of the test board is electrically connected with the data processing terminal；Institute
State and be can adjust above and below resoliving power test target on some columns, and be suspended from the array
The top of camera module；The array of array camera module is pushed down in the detent mechanism positioning
Camera lens, the governor motion can drive the test board to package substrate setting position
Force, adjusts the deformation of elastic washer, changes optical mirror slip facing arrays image sensing
The position of device chip.
The governor motion is that six axles adjust platform 701, and the test board positioning is fixed
In on six axle regulation platform, six axle regulation platform positioning is fixedly arranged on the optics
On test platform；The detent mechanism includes fixed support 601 and some support bars
602；The each support bar of correspondence, the structural member upper surface of the array lens is provided with one
Individual locating slot 1311, and several locating slots are arranged in the surrounding of the structural member,
The fixed support is fixed in the middle part of some columns, some support bars one
End is fixed on the fixed support, and the other end is positioned in the locating slot；Pass through
The six axles regulation platform drives the test board to exert a force package substrate setting position,
The deformation of elastic washer is adjusted, changes optical mirror slip facing arrays image sensor chip
Position；
It is preferred that, one end that the support bar connects the locating slot is in orbicule, profit
The smooth transition exerted a force in all directions, increases the accommodation accuracy of module.
It is preferred that, the fixed support is a rectangle support, is fixed in some described vertical
On the middle part of post.
It is preferred that, provided with four locating slots, four locating slots are arranged in institute
State at the corner of structural member.
In the present embodiment, using the structural member above detent mechanism fixed module, it will seal
Dress substrate is fixed on test board, is driven using the six axles regulation platform below test board
Test board carries out pitch regulation and changes optical mirror slip facing arrays imaging sensor core
The position (distance) of piece, reaches the effect of focusing, and by test board by focus effect
Computer display is sent, after the completion of focusing, the through hole encapsulating fixed module of module is utilized.
Six axles regulation platform is also known as sextuple platform, six shaft platforms, is prior art, herein
Repeat no more, innovative point of the invention is to coordinate detent mechanism using six axles regulation platform
Realize that the positioning to array camera module and regulation optical mirror slip are sensed to array image
The image distance of device chip and pitching, and then realize the array camera module progress to assembling
The function of focusing, it is ensured that image quality.
Above example is referring to the drawings, the preferred embodiments of the present invention to be carried out detailed
Explanation.Those skilled in the art to above-described embodiment by carrying out on various forms
Modification or change, but without departing substantially from the present invention essence in the case of, all fall in the present invention
Protection domain within.
Claims (10)
1. a kind of focus adjustment method of array camera module, for carrying out optical focusing to the array camera module assembled, the array camera module (1) assembled includes array image sensor chip (11), package substrate (12), array lens (13) and elastic washer (14), it is characterised in that：Comprise the following steps：
A, the positioning of the package substrate of the array camera module assembled is positioned on a test board (2), and test board positioning is fixedly arranged on an optic test platform (3), the signal input part of the test board is set to be electrically connected with the package substrate, the signal output part of the test board is electrically connected with a data processing terminal (4)；
B, a resoliving power test target (5) is set above array camera module, and adjusts the distance between the resoliving power test target and described array lens；
C, positioned by a detent mechanism (6) and push down the array lens of array camera module, detent mechanism is driven to exert a force array lens setting position by a governor motion (7), adjust the deformation of elastic washer, change the position of optical mirror slip facing arrays image sensor chip, focused；
D, focussing process are：The view data that array camera module is shot is transferred to data processing terminal by test board, the resoliving power test target shot is shown by data processing terminal, to detect the shooting effect of array camera module, obtain after satisfactory focusing result, solidification glue progress module is injected into the through hole of array camera module and is fixed.
Or, test board positioning is fixedly arranged on a governor motion in step, governor motion positioning is fixedly arranged on an optic test platform；In step C, drive test board to exert a force package substrate setting position by the governor motion, adjust the deformation of elastic washer, change the position of optical mirror slip facing arrays image sensor chip, focused.
2. the focus adjustment method of array camera module according to claim 1, it is characterised in that：When the test board positioning is fixedly arranged in the middle part of the optic test platform, the governor motion includes several spiral micrometer bars (71), part after fixing anvil of the spiral micrometer bar for micrometer caliper removal U-shaped chi frame and thereon, including fixed swivel nut (711), the micrometric screw (712) coordinated in the fixed swivel nut with its screw thread, the microdrum (713) outside fixed swivel nut and the vernier knob (714) located at microdrum tail end；The detent mechanism include fixed support (61) and with the one-to-one some support bars (62) of some micrometric screws；Provided with a bracket institution (8), the bracket institution includes some columns (81), the lower end of some columns is fixed in the surrounding of the optic test platform, the fixed support is fixed in the middle part of some columns, the fixation swivel nut of some spiral micrometer bars is fixed on the fixed support, and is suspended above the array lens surrounding of the array camera module；The each support bar of correspondence, the structural member upper surface of the array lens is provided with a locating slot (1311), and described support bar one end is fixedly connected with the micrometric screw, and the other end is positioned in the locating slot；Control corresponding support bar to be finely adjusted by some spiral micrometer bars, change the pitching of the distance between optical mirror slip and array image sensor chip or/and optical mirror slip.
3. the focus adjustment method of array camera module according to claim 1, it is characterised in that：When the test board positioning is fixedly arranged on the governor motion, the governor motion is six axles regulation platform (701), and the test board positioning is fixedly arranged on the six axles regulation platform, and six axle regulation platform is fixedly arranged on the optic test platform；The detent mechanism includes fixed support (601) and some support bars (602)；The each support bar of correspondence, the structural member upper surface of the array lens is provided with a locating slot (1311), and several locating slots are arranged in the surrounding of the structural member；Provided with a bracket institution (8), the bracket institution includes some columns (81), the lower end of some columns is fixed in the surrounding of the optic test platform, the fixed support is fixed in the middle part of some columns, some described support bar one end are fixed on the fixed support, and the other end is positioned in the locating slot；Adjusting platform by multiaxis drives test board to be finely adjusted, and changes the pitching of the distance between optical mirror slip and array image sensor chip or/and optical mirror slip.
4. the focus adjustment method of array camera module according to Claims 2 or 3, it is characterised in that：Provided with four locating slots, four locating slots are arranged at the corner of the structural member.
5. a kind of focus control of array camera module, it is characterised in that：Including bracket institution (8), governor motion (7), detent mechanism (6), resoliving power test target (5), test board (2), optic test platform (3) and data processing terminal (4), the bracket institution includes some columns (81), the lower end of some columns is fixed in the surrounding of the optic test platform, the package substrate positioning of the array camera module is positioned on the test board, the test board positioning is fixedly arranged in the middle part of the optic test platform, the signal input part of the test board is electrically connected with the package substrate, the signal output part of the test board is electrically connected with the data processing terminal；It is can adjust above and below the resoliving power test target on some columns, and be suspended from the top of the array camera module；The array lens of array camera module are pushed down in the detent mechanism positioning, and the governor motion can drive the detent mechanism to exert a force array lens setting position, adjust the deformation of elastic washer, change the position of optical mirror slip facing arrays image sensor chip；
Or, the test board positioning is fixedly arranged on the governor motion, and governor motion positioning is fixedly arranged on the optic test platform；The governor motion can drive the test board to exert a force package substrate setting position, adjust the deformation of elastic washer, change the position of optical mirror slip facing arrays image sensor chip.
6. the focus control of array camera module according to claim 5, it is characterised in that：When the test board positioning is fixedly arranged in the middle part of the optic test platform, the governor motion includes several spiral micrometer bars (71), part after fixing anvil of the spiral micrometer bar for micrometer caliper removal U-shaped chi frame and thereon, including fixed swivel nut (711), the micrometric screw (712) coordinated in the fixed swivel nut with its screw thread, the microdrum (713) outside fixed swivel nut and the vernier knob (714) located at microdrum tail end；The detent mechanism include fixed support (61) and with the one-to-one some support bars (62) of some micrometric screws；The fixed support is fixed in the middle part of some columns, and the fixation swivel nut of some spiral micrometer bars is fixed on the fixed support, and is suspended above the array lens surrounding of the array camera module；The each support bar of correspondence, the structural member upper surface of the array lens is provided with a locating slot (1322), and described support bar one end is fixedly connected with the micrometric screw, and the other end is positioned in the locating slot.
7. the focus control of array camera module according to claim 5, it is characterised in that：When the test board positioning is fixedly arranged on the governor motion, the governor motion is six axles regulation platform (701), the test board positioning is fixedly arranged on the six axles regulation platform, and six axle regulation platform positioning is fixedly arranged on the optic test platform；The detent mechanism includes fixed support (601) and some support bars (602)；The each support bar of correspondence, the structural member upper surface of the array lens is provided with a locating slot (1322), and several locating slots are arranged in the surrounding of the structural member, the fixed support is fixed in the middle part of some columns, some described support bar one end are fixed on the fixed support, and the other end is positioned in the locating slot；Adjusting platform by six axle drives the test board to exert a force package substrate setting position, adjusts the deformation of elastic washer, changes the position of optical mirror slip facing arrays image sensor chip.
8. the focus control of the array camera module according to claim 6 or 7, it is characterised in that：One end that the support bar connects the locating slot is in orbicule.
9. the focus adjustment method of array camera module according to claim 6 or 7, it is characterised in that：The fixed support is on a rectangle support, the middle part for being fixed in some columns.
10. the focus adjustment method of array camera module according to claim 6 or 7, it is characterised in that：Provided with four locating slots, four locating slots are arranged at the corner of the structural member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610008681.5A CN106961538B (en) | 2016-01-08 | 2016-01-08 | Focusing method and focusing device of array camera module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610008681.5A CN106961538B (en) | 2016-01-08 | 2016-01-08 | Focusing method and focusing device of array camera module |
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| Publication Number | Publication Date |
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| CN106961538A true CN106961538A (en) | 2017-07-18 |
| CN106961538B CN106961538B (en) | 2019-12-13 |
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| CN201610008681.5A Active CN106961538B (en) | 2016-01-08 | 2016-01-08 | Focusing method and focusing device of array camera module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109186959A (en) * | 2018-09-28 | 2019-01-11 | 歌尔股份有限公司 | Detection method, device and the equipment of the curvature of field of VR optics module |
| CN110801876A (en) * | 2019-11-25 | 2020-02-18 | 长春大学 | Integrated quantum optical test platform based on Internet of things |
| CN112866571A (en) * | 2021-01-08 | 2021-05-28 | 深圳睿晟自动化技术有限公司 | Lens focusing method and device, terminal and computer readable storage medium |
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| US20050141106A1 (en) * | 2003-12-31 | 2005-06-30 | Hyun-Ju Lee | Lens holder apparatus of camera lens module |
| US20070070511A1 (en) * | 2005-09-29 | 2007-03-29 | Visera Technologies, Company Ltd. | Wafer level image module |
| WO2010074743A1 (en) * | 2008-12-22 | 2010-07-01 | Tessera North America, Inc. | Focus compensation for thin cameras |
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| CN1320325A (en) * | 1999-08-19 | 2001-10-31 | 三菱电机株式会社 | Image pickup device and camera |
| US20050141106A1 (en) * | 2003-12-31 | 2005-06-30 | Hyun-Ju Lee | Lens holder apparatus of camera lens module |
| US20070070511A1 (en) * | 2005-09-29 | 2007-03-29 | Visera Technologies, Company Ltd. | Wafer level image module |
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| CN109186959A (en) * | 2018-09-28 | 2019-01-11 | 歌尔股份有限公司 | Detection method, device and the equipment of the curvature of field of VR optics module |
| CN110801876A (en) * | 2019-11-25 | 2020-02-18 | 长春大学 | Integrated quantum optical test platform based on Internet of things |
| CN112866571A (en) * | 2021-01-08 | 2021-05-28 | 深圳睿晟自动化技术有限公司 | Lens focusing method and device, terminal and computer readable storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106961538B (en) | 2019-12-13 |
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