CN106957970A - A kind of low bulk, copper-based heat-barrier material of low-density and preparation method thereof - Google Patents
A kind of low bulk, copper-based heat-barrier material of low-density and preparation method thereof Download PDFInfo
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- CN106957970A CN106957970A CN201710075578.7A CN201710075578A CN106957970A CN 106957970 A CN106957970 A CN 106957970A CN 201710075578 A CN201710075578 A CN 201710075578A CN 106957970 A CN106957970 A CN 106957970A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
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- Manufacturing & Machinery (AREA)
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Abstract
The invention discloses a kind of low bulk, the copper-based heat-barrier material of low-density and preparation method thereof, on the basis of Cu matrixes, the Sc of nanometer particle size is introduced2W3O12Powder, significantly reduce Cu thermal coefficient of expansion, ensure that it has high intensity simultaneously, and the high purity graphite alkene powder added makes composite produce a large amount of relatively independent enclosed type stomatas, Cu thermal conductivity factor is set to be down to reduced levels, excellent heat-proof quality is provided with, therefore copper-based heat-barrier material of the present invention has both the multiple characteristics such as rigidity, heat-proof quality, shock resistance, low bulk, lightweight, easy processing, has good application prospect in multiple fields.
Description
Technical field
The present invention relates to a kind of Metal Substrate heat-barrier material, and in particular to a kind of low bulk, the copper-based heat-barrier material of low-density
And preparation method thereof.
Background technology
Currently, non-metal heat-insulating material (such as fiber) is widely used in the field such as Aero-Space, civilian, but nonmetallic
Heat-barrier material rigidity is not high, and machinability is poor, can not often meet some needs have both rigidity, it is heat-proof quality, shock resistance, low swollen
The application demand of the multiple characteristics such as swollen, lightweight, easy processing, metal material possesses high intensity and rigidity, and machinability is good, but also has
Its shortcoming, i.e. density are big, heat-proof quality is poor, thermal coefficient of expansion is big, and above-mentioned application requirement can be reached without homogenous material.
Therefore, it is current urgent problem to develop a kind of low bulk, the Metal Substrate heat-barrier material of low-density.
The content of the invention
It is an object of the invention to provide a kind of low-expansion coefficient, low-density, machinability be good, well-insulated Metal Substrate
Composite.
To achieve the above object, the technical solution adopted by the present invention is as follows：
A kind of preparation method of low bulk, the copper-based heat-barrier material of low-density.Including following preparation process：
(1) the negative thermal expansion material Sc for preparing hydro-thermal method or solid phase method2W3O12Powder is put into ball grinder, addition go from
Sub- water or ethanol, by centrifuging, being dried to obtain nano level Sc after ball milling in ball mill2W3O12Powder.
(2) the nano level Sc obtained by weighing respectively in the Cu powder, graphene powder, step (1) of different proportion2W3O12
Powder is put into dry ball grinder, and ball milling mixing is uniform.
(3) take well mixed powder to be put into graphite jig, pass through hot pressing furnace hot pressed sintering.
Ball mill described in step (1) is high energy ball mill, and rotating speed control is 360~400 revs/min, Ball-milling Time
Control is in 48~72h；The Sc being dried to obtain2W3O12The particle diameter of powder is 100~200 nanometers.
The particle diameter of Cu powder described in step (2) is 100nm, and shared mass percent is 60%, described Graphene powder
End is technical grade high purity graphite alkene powder, and shared mass percent is 5%~15%, described nano level Sc2W3O12Powder institute
It is 25%~35% to account for mass percent.
The condition of hot pressed sintering described in step (3) is to be sintered under vacuum or reducing atmosphere, and sintering temperature control is
700~800 DEG C, sintered heat insulating time control is 2~3h, applies Stress control in sintering process in 20~30MPa.
The density domination of prepared material is in 4.1~4.8g/cm3, much smaller than the density 8.9g/cm of fine copper3, the heat of material
The coefficient of expansion is controlled 8~10 × 10-6/K。
Prepared material internal forms the airtight air vent of substantial amounts of Hu Bu UNICOMs, and the porosity is controlled in 30~40%, material
Minimum thermal conductivity be 2.4W/mK, specific process parameter is shown in embodiment.
Beneficial effects of the present invention：
(1) copper-based heat-barrier material of the present invention belongs to metal_based material, and its rigidity and shock resistance are good, in addition, its
Thermal conductivity factor and density all very littles, thermal coefficient of expansion are low, possess low bulk, lightweight, easy processing characteristic, in Aero-Space, civilian
There is good application prospect Deng field.
(2) copper-based heat-barrier material of the present invention uses disposable thermal isostatic pressing, and preparation method is simple, easy to operate,
The copper-based heat-barrier material intensity prepared is high.
Brief description of the drawings
Fig. 1 is 60%Cu35%Sc described in embodiment2W3O12The thermal dilatometry and Linear Quasi of 5% graphene composite material
Close.
Embodiment
Embodiment
Raw material：Cu powder, mass percent 60%；High purity graphite alkene powder, mass percent 5%, nano level Sc2W3O12
Powder, mass percent 35%.
Take said ratio and well mixed powder 20g, put after loading the graphite jig into a diameter of 30mm, vibrating compacting
Enter in hot-pressed sintering furnace, 700 DEG C of design temperature is heated to 10 DEG C/min, in vacuum state heat-insulation pressure keeping 2h, pressure is kept
30Mpa, furnace cooling.
After testing, density is only 4.3g/cm to gained sample3, the half of only pure Cu density, it is 2.4W/ that thermal conductivity, which is only,
MK, thermal dilatometry are as shown in figure 1, the evenly heat for obtaining composite in 25~300 DEG C of intervals by linear fit calculating is swollen
Swollen coefficient is 8.6 × 10-6K-1。
Claims (8)
1. the preparation method of the copper-based heat-barrier material of a kind of low bulk, low-density, it is characterised in that preparation process is as follows：
(1) the negative thermal expansion material Sc for preparing hydro-thermal method or solid phase method2W3O12Powder is put into ball grinder, adds deionized water
Or ethanol, by centrifuging, being dried to obtain nano level Sc after ball milling in ball mill2W3O12Powder；
(2) the nano level Sc obtained by weighing respectively in the Cu powder, graphene powder, step (1) of different proportion2W3O12Powder
It is put into dry ball grinder, ball milling mixing is uniform；
(3) take well mixed powder to be put into graphite jig, pass through hot pressing furnace hot pressed sintering.
2. a kind of low bulk, the preparation method of the copper-based heat-barrier material of low-density as described in claim 1, its feature exist
In the ball mill described in step (1) is high energy ball mill, and rotating speed control is 360~400 revs/min, and Ball-milling Time control exists
48~72h；The Sc being dried to obtain2W3O12The particle diameter of powder is 100~200 nanometers.
3. a kind of low bulk, the preparation method of the copper-based heat-barrier material of low-density as described in claim 1, its feature exist
In the particle diameter of the Cu powder described in step (2) is 100nm, and shared mass percent is 60%, and described graphene powder is work
Industry level high purity graphite alkene powder, shared mass percent is 5%~15%, described nano level Sc2W3O12Quality shared by powder
Percentage is 25%~35%.
4. a kind of low bulk, the preparation method of the copper-based heat-barrier material of low-density as described in claim 1, its feature exist
Be to be sintered under vacuum or reducing atmosphere in the condition of, the hot pressed sintering described in step (3), sintering temperature control for 700~
800 DEG C, sintered heat insulating time control is 2~3h, applies Stress control in sintering process in 20~30MPa.
5. a kind of low bulk, the preparation method of the copper-based heat-barrier material of low-density as described in claim 1, its feature exist
In the density domination of copper-based heat-barrier material prepared by the preparation method is in 4.1~4.8g/cm3, much smaller than the density of fine copper
8.9g/cm3, the thermal coefficient of expansion control of material is 8~10 × 10-6/K。
6. a kind of low bulk, the preparation method of the copper-based heat-barrier material of low-density as described in claim 1, its feature exist
In the airtight air vent for being internally formed substantial amounts of Hu Bu UNICOMs of copper-based heat-barrier material prepared by the preparation method, porosity control
System is 30~40%, and the minimum thermal conductivity of material is 2.4W/mK.
7. a kind of low bulk, the preparation method of the copper-based heat-barrier material of low-density as described in claim 3, its feature exist
In mass percent shared by the Cu powder described in step (2) is 60%, and mass percent shared by described graphene is 5%, institute
The nano level Sc stated2W3O12Mass percent shared by powder is 35%.
8. a kind of low bulk, the preparation method of the copper-based heat-barrier material of low-density as described in claim 4, its feature exist
In the control of sintering temperature described in step (3) is 700 DEG C, and sintered heat insulating time control is to apply pressure in 2h, sintering process
Control is in 30MPa.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710075578.7A CN106957970A (en) | 2017-02-13 | 2017-02-13 | A kind of low bulk, copper-based heat-barrier material of low-density and preparation method thereof |
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| CN201710075578.7A CN106957970A (en) | 2017-02-13 | 2017-02-13 | A kind of low bulk, copper-based heat-barrier material of low-density and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108821343A (en) * | 2018-07-02 | 2018-11-16 | 合肥萃励新材料科技有限公司 | A kind of sheet Y2W3O12Synthetic method |
| CN112063881A (en) * | 2020-08-18 | 2020-12-11 | 北京科技大学 | High-thermal-conductivity adjustable-thermal-expansion copper-based composite material and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012138439A2 (en) * | 2011-04-04 | 2012-10-11 | Lockheed Martin Corporation | Articles containing copper nanoparticles and methods for production and use thereof |
| CN103103403A (en) * | 2013-01-24 | 2013-05-15 | 西安交通大学 | Electronic packaging material |
| CN104775045A (en) * | 2015-03-27 | 2015-07-15 | 江苏大学 | Preparation method for Cu-based composite material based on negative thermal expansion particles |
-
2017
- 2017-02-13 CN CN201710075578.7A patent/CN106957970A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012138439A2 (en) * | 2011-04-04 | 2012-10-11 | Lockheed Martin Corporation | Articles containing copper nanoparticles and methods for production and use thereof |
| CN103103403A (en) * | 2013-01-24 | 2013-05-15 | 西安交通大学 | Electronic packaging material |
| CN104775045A (en) * | 2015-03-27 | 2015-07-15 | 江苏大学 | Preparation method for Cu-based composite material based on negative thermal expansion particles |
Non-Patent Citations (1)
| Title |
|---|
| 张琰琰: "电子封装用Al2W3O12/SiCp/Al复合材料的制备及其性能研究", 《中国优秀硕士论文学位论文全文数据库 工程科技I辑》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108821343A (en) * | 2018-07-02 | 2018-11-16 | 合肥萃励新材料科技有限公司 | A kind of sheet Y2W3O12Synthetic method |
| CN112063881A (en) * | 2020-08-18 | 2020-12-11 | 北京科技大学 | High-thermal-conductivity adjustable-thermal-expansion copper-based composite material and preparation method thereof |
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