CN106951883A - A kind of fingerprint module preparation method and fingerprint module - Google Patents
A kind of fingerprint module preparation method and fingerprint module Download PDFInfo
- Publication number
- CN106951883A CN106951883A CN201710210066.7A CN201710210066A CN106951883A CN 106951883 A CN106951883 A CN 106951883A CN 201710210066 A CN201710210066 A CN 201710210066A CN 106951883 A CN106951883 A CN 106951883A
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- China
- Prior art keywords
- fingerprint
- top surface
- temperature control
- identification
- heating film
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/94—Hardware or software architectures specially adapted for image or video understanding
Abstract
The embodiments of the invention provide a kind of fingerprint module preparation method and fingerprint module, wherein methods described includes：Metal electrode lead is laid on identification of fingerprint chip, wherein, one end of the metal electrode lead is arranged on the top surface of identification of fingerprint chip, and the other end of the metal electrode lead is connected with the welding pin in the fingerprint die bottom surface；Temperature control heating film is prepared on the top surface of the identification of fingerprint chip, to cover the top surface of the identification of fingerprint chip；Heat discoloration ink layer is prepared on the top surface of the temperature control heating film, to cover the top surface of the temperature control heating film.The fingerprint module prepared by fingerprint module preparation method provided by the present invention, can show different colors with the difference of temperature.
Description
Technical field
The present invention relates to fingerprint module manufacture technology field, more particularly to a kind of fingerprint module preparation method and fingerprint mould
Group.
Background technology
Due to the convenience and security of fingerprint recognition, consumption electronic product uses the field of fingerprint recognition module increasingly
It is many, including mobile phone, automobile, bank card, smart home door lock etc., fingerprint recognition module needs one interface of offer to give user's typing
Fingerprint and identification fingerprint, fingerprint recognition module is typically an appearance part.Currently in order to making fingerprint module be supplied to user's
Interface is more attractive in appearance, and general mode is the ink that certain color is sprayed on identification of fingerprint chip, or in identification of fingerprint core
Certain color ink and cover plate are covered on piece, so as to be supplied to the user interface of consumer's pleasurable sensation.
And the structure of existing fingerprint module has following deficiency：
Identification of fingerprint chip is presented to the color of user and determined completely by the ink colors of covering above identification of fingerprint chip.
And color is just fixed up after the completion of the manufacture of identification of fingerprint chip production, it is only capable of that single color is presented, consumer can not basis
The hobby of oneself freely sets the color at identification of fingerprint chip user interface, represents personalization and the identification of oneself.
The content of the invention
The present invention provides a kind of fingerprint module preparation method and fingerprint module, to solve fingerprint present in prior art
The color for recognizing chip user interface fixes immutable problem.
In order to solve the above problems, the invention discloses a kind of fingerprint module preparation method, methods described includes：In fingerprint
Recognize and metal electrode lead is laid on chip, wherein, one end of the metal electrode lead is arranged on the top of identification of fingerprint chip
On face, the other end of the metal electrode lead is connected with the welding pin in the fingerprint die bottom surface；Distinguished in the fingerprint
Temperature control heating film is prepared on the top surface for knowing chip, to cover the top surface of the identification of fingerprint chip；In the temperature control heating film
Heat discoloration ink layer is prepared on top surface, to cover the top surface of the temperature control heating film.
In order to solve the above problems, the invention also discloses a kind of fingerprint module, the fingerprint module includes：Identification of fingerprint
Chip, temperature control heating film and heat discoloration ink layer；Metal electrode lead, the gold are laid with the identification of fingerprint chip
One end of category contact conductor is arranged on the top surface of identification of fingerprint chip, the other end and the fingerprint of the metal electrode lead
Welding pin connection in die bottom surface；The bottom surface of the temperature control heating film is combined with the top surface of the identification of fingerprint chip, and
Cover the top surface of the identification of fingerprint chip；The heat discoloration ink layer is combined with the top surface of the temperature control heating film, and is covered
Cover the top surface of the temperature control heating film.
Compared with prior art, the present invention includes advantages below：
Fingerprint module preparation method provided in an embodiment of the present invention and fingerprint module, lay gold on identification of fingerprint chip
Belong to contact conductor and be sequentially overlapped on identification of fingerprint chip and prepare temperature control heating film and heat discoloration ink layer, metal
Contact conductor provides electric current for temperature control heating film, and own temperature control can be design temperature, heat discoloration by temperature control heating film
Ink layer senses the temperature of temperature control heating film, and as the difference of temperature shows different colors, so that identification of fingerprint core
Piece user interface color changeable.By fingerprint module provided in an embodiment of the present invention, user sets temperature control to add according to self-demand
The temperature of hotting mask, the color of setting temperature sensing ink layer in a disguised form, finally makes identification of fingerprint chip user interface according to self-demand
Different colors are shown, the personalization of oneself are embodied while identification can also be lifted.
Brief description of the drawings
A kind of step flow chart of Fig. 1 according to embodiments of the present invention one fingerprint module preparation method；
Fig. 2 lays the fingerprint modular structure schematic diagram after metal electrode lead；
Fingerprint modular structure schematic diagram after Fig. 3 covering temperature control heating films；
Fingerprint modular structure schematic diagram after Fig. 4 covering heat discoloration ink layers；
Fig. 5 is the structure chart for the fingerprint module for using the fingerprint module preparation method in embodiment one to prepare；
Fig. 6 is a kind of step flow chart of according to embodiments of the present invention two fingerprint module preparation method；
Fig. 7 is to cover the fingerprint modular structure schematic diagram after transparent cover plate；
Fig. 8 is the structure chart for the fingerprint module for using the fingerprint module preparation method in embodiment two to prepare.
Embodiment
It is below in conjunction with the accompanying drawings and specific real to enable the above objects, features and advantages of the present invention more obvious understandable
Applying mode, the present invention is further detailed explanation.
Embodiment one
Reference picture 1, shows a kind of step flow chart of fingerprint module preparation method of the embodiment of the present invention one.
The fingerprint module preparation method of the embodiment of the present invention comprises the following steps：
Step 101：Metal electrode lead is laid on identification of fingerprint chip.
One end of metal electrode lead is arranged on the top surface of identification of fingerprint chip, the other end and finger of metal electrode lead
Welding pin connection in line die bottom surface.Metal electrode primarily serves electric signal conducting function, provides and adds for temperature control heating film
Thermocurrent.
Wherein, shown in the front schematic view such as Fig. 2 (a) for laying the fingerprint recognition chip after metal electrode lead, show sideways
It is intended to as shown in Fig. 2 (b).As shown in Fig. 2 (a), when laying metal electrode lead, it is necessary to control the chi of metal electrode lead 20
Very little and position, it is to avoid metal electrode lead enters the induction zone 101 of identification of fingerprint chip.As shown in Fig. 2 (b), metal electricity
Pole lead 20 is arranged on the surface and side of identification of fingerprint chip 10.
Step 102：Temperature control heating film is prepared on the top surface of identification of fingerprint chip, to cover the top of identification of fingerprint chip
Face.
The temperature control heating film of preparation is completely covered on identification of fingerprint chip surface, provides and adds by metal electrode lead conduction
Heat and temperature control function, temperature control heating film can accurately be controlled according to design temperature by heating and stopping the operation of heating
Own temperature processed maintains design temperature.Temperature control heating film typically has PTC (Positive Temperature
Coefficient, positive temperature coefficient) effect semiconductor heating ceramic material, dielectric constant is high, does not influence fingerprint sensing
Energy.PTC effects refer to this material resistance can with the rise of temperature increased effect.
Temperature control heating film can be made by thermal chemical reaction method or vacuum sputtering method, and thickness is generally less than 5 microns.
Wherein, shown in front schematic view such as Fig. 3 (a) of the fingerprint module after covering temperature control heating film, side schematic view is such as
Shown in Fig. 3 (b).As shown in figure 3, the top surface of identification of fingerprint chip 10 is completely covered in temperature control heating film 30.
Step 103：Heat discoloration ink layer is prepared on the top surface of temperature control heating film, to cover the top of temperature control heating film
Face.
Make heat discoloration ink layer to be completely covered on the top surface of temperature control heating film, because heat discoloration ink is temperature
Sensitive material, therefore, it can that different colors are presented according to the temperature difference of lower section temperature control heating film.Heat discoloration ink layer
Working range at the comfortable temperature of body-sensing (such as 36-38 DEG C), heat discoloration ink temperature discoloration sensitivity and temperature control heating
Film temperature control accuracy is all below 0.1 DEG C, in the comfortable temperature range of above body-sensing (such as 36-38 DEG C), heat discoloration
Ink layer at least 20 kinds of colors of alterable.Therefore, user can in the temperature according to the fancy setting temperature control heating film of oneself, from
And the color of heat discoloration ink layer is set, fingerprint module is represented the user interface of different colours, embody of oneself
The identification of fingerprint recognition module can also be lifted while property.
Making heat discoloration ink can be made by the technique for spraying or printing, and thickness can be adjusted as needed, excellent
Selection of land, temperature sensing ink thickness degree is less than 50um.The dielectric constant of heat discoloration ink, which is tried one's best, selects larger, in order to avoid influence fingerprint
Sense performance.
Wherein, covered shown in fingerprint module front schematic view such as Fig. 4 (a) after temperature sensing ink layer, side schematic view is such as
Shown in Fig. 4 (b).As shown in figure 4, the top surface of temperature control heating film 30 is completely covered in heat discoloration ink layer 40.
So far the fingerprint module of the embodiment of the present invention completes.
The structure for the fingerprint module produced by above-mentioned fingerprint module preparation method is as shown in Figure 5.
Fingerprint module includes：Identification of fingerprint chip 10, temperature control heating film 30 and heat discoloration ink layer 40.
Metal electrode lead 20 is laid with identification of fingerprint chip 10, one end of metal electrode lead is arranged on identification of fingerprint
On the top surface of chip, the other end of metal electrode lead is connected with the welding pin in fingerprint die bottom surface；Temperature control heating film 30
Bottom surface combined with the top surface of identification of fingerprint chip 10, and the top surface of covering identification of fingerprint chip 10；Heat discoloration ink layer 40
Combined with the top surface of temperature control heating film 30, and the top surface of covering temperature control heating film 30.
By fingerprint recognition module preparation method provided in an embodiment of the present invention, metal electricity is laid on identification of fingerprint chip
Pole lead and it is sequentially overlapped on identification of fingerprint chip and prepares temperature control heating film and heat discoloration ink layer, metal electrode
Lead provides electric current for temperature control heating film, and own temperature control can be design temperature, heat discoloration ink by temperature control heating film
The temperature of layer sensing temperature control heating film, and as the difference of temperature shows different colors, so that identification of fingerprint chip is used
Family interface color is variable.By fingerprint module provided in an embodiment of the present invention, user sets temperature control heating film according to self-demand
Temperature, the color of covert setting temperature sensing ink layer finally makes identification of fingerprint chip user interface according to self-demand displaying
Go out different colors, embody the personalization of oneself while identification can also be lifted.
Embodiment two
Reference picture 6, shows a kind of step flow chart of fingerprint module preparation method of the embodiment of the present invention two.
The fingerprint module preparation method of the embodiment of the present invention specifically includes following steps：
Step 201：Metal electrode lead is laid on identification of fingerprint chip.
Wherein, one end of metal electrode lead is arranged on the top surface of identification of fingerprint chip, metal electrode lead it is another
End is connected with the welding pin in fingerprint die bottom surface.
Specifically, can by way of any one in plating, type metal and vacuum sputtering prepares film,
Metal electrode lead is laid on fingerprint recognition chip.
Step 202：Temperature control heating film is prepared on the top surface of identification of fingerprint chip, to cover the top of identification of fingerprint chip
Face.
Step 203：Heat discoloration ink layer is prepared on the top surface of temperature control heating film, to cover the top of temperature control heating film
Face.
Step 201 to step 203 is that metal electrode lead is laid on identification of fingerprint chip, and covering temperature control adds successively
The idiographic flow of hotting mask, heat discoloration ink layer, for the idiographic flow with reference in step 101 to step 103 in embodiment one
Related description, this is repeated no more in the embodiment of the present invention.
Step 204：Transparent cover plate, and transparent cover plate covering heat discoloration oil are covered on the top surface of heat discoloration ink layer
The top surface of layer of ink.
Wherein, transparent cover plate is clear glass cover plate or sapphire cover plate.Cover transparent on heat discoloration ink layer
Glass or sapphire cover plate, can make fingerprint module that there is smooth touch texture.
Wherein, covered shown in fingerprint module front schematic view such as Fig. 7 (a) after transparent cover plate, side schematic view such as Fig. 7
(b) shown in.As shown in fig. 7, the top surface of temperature control heating film 40 is completely covered in transparent cover plate 50.
So far the fingerprint module of the embodiment of the present invention completes.
The structure for the fingerprint module produced by above-mentioned fingerprint module preparation method is as shown in Figure 8.
Fingerprint module includes：Identification of fingerprint chip 10, temperature control heating film 30, heat discoloration ink layer 40 and transparent cover plate
50。
Metal electrode lead 20 is laid with identification of fingerprint chip 10, one end of metal electrode lead is arranged on identification of fingerprint
On the top surface of chip, the other end of metal electrode lead is connected with the welding pin in fingerprint die bottom surface；Temperature control heating film 30
Bottom surface combined with the top surface of identification of fingerprint chip 10, and the top surface of covering identification of fingerprint chip 10；Heat discoloration ink layer 40
Combined with the top surface of temperature control heating film 30, and the top surface of covering temperature control heating film 30；Transparent cover plate 50 and heat discoloration ink layer
40 top surface is combined, and the top surface of covering heat discoloration ink layer 40.Preferably, in order to not influence the sensing of fingerprint module
Can, set metal electrode lead thicknesses to be less than 5 microns, temperature control heating film thickness is less than 5 microns, the thickness of heat discoloration ink layer
Less than 50 microns.
By fingerprint recognition module preparation method provided in an embodiment of the present invention, metal electricity is laid on identification of fingerprint chip
Pole lead and it is sequentially overlapped on identification of fingerprint chip and prepares temperature control heating film and heat discoloration ink layer, metal electrode
Lead provides electric current for temperature control heating film, and own temperature control can be design temperature, heat discoloration ink by temperature control heating film
The temperature of layer sensing temperature control heating film, and as the difference of temperature shows different colors, so that identification of fingerprint chip is used
Family interface color is variable.By fingerprint module provided in an embodiment of the present invention, user sets temperature control heating film according to self-demand
Temperature, the color of covert setting temperature sensing ink layer finally makes identification of fingerprint chip user interface according to self-demand displaying
Go out different colors, embody the personalization of oneself while identification can also be lifted.
For foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as to a series of combination of actions, but
It is that those skilled in the art should know, the present invention is not limited by described sequence of movement, because according to the present invention, certain
A little steps can be carried out sequentially or simultaneously using other.Secondly, those skilled in the art should also know, be retouched in specification
The embodiment stated belongs to preferred embodiment, and involved action and the module not necessarily present invention are necessary.
Each embodiment in this specification is described by the way of progressive, what each embodiment was stressed be with
Between the difference of other embodiment, each embodiment identical similar part mutually referring to.
Finally, in addition it is also necessary to explanation, herein, such as first and second or the like relational terms be used merely to by
One entity or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or operation
Between there is any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant meaning
Covering including for nonexcludability, so that process, method, commodity or equipment including a series of key elements not only include that
A little key elements, but also other key elements including being not expressly set out, or also include be this process, method, commodity or
The intrinsic key element of equipment.In the absence of more restrictions, the key element limited by sentence "including a ...", is not arranged
Except also there is other identical element in the process including the key element, method, commodity or equipment.
Above to a kind of fingerprint module preparation method provided by the present invention and fingerprint module, it is described in detail, this
Apply specific case in text to be set forth the principle and embodiment of the present invention, the explanation of above example is only intended to
Help understands the method for the present invention and its core concept；Simultaneously for those of ordinary skill in the art, the think of according to the present invention
Think, will change in specific embodiments and applications, in summary, this specification content should not be construed as pair
The limitation of the present invention.
Claims (10)
1. a kind of fingerprint module preparation method, it is characterised in that including：
Metal electrode lead is laid on identification of fingerprint chip, wherein, one end of the metal electrode lead is arranged on fingerprint and distinguished
On the top surface for knowing chip, the other end of the metal electrode lead is connected with the welding pin in the fingerprint die bottom surface；
Temperature control heating film is prepared on the top surface of the identification of fingerprint chip, to cover the top surface of the identification of fingerprint chip；
Heat discoloration ink layer is prepared on the top surface of the temperature control heating film, to cover the top surface of the temperature control heating film.
2. antenna manufacturing method according to claim 1, it is characterised in that prepared on the top surface of the temperature control heating film
After the step of heat discoloration ink layer, top surface so that the temperature control heating film is completely covered, methods described also includes：
Transparent cover plate is covered on the top surface of the heat discoloration ink layer, and the transparent cover plate covers the heat discoloration oil
The top surface of layer of ink.
3. according to the method described in claim 1, it is characterised in that described that metal electrode lead is laid on identification of fingerprint chip
The step of, including：
By way of any one in plating, type metal and vacuum sputtering prepares film, in the fingerprint recognition core
Metal electrode lead is laid on piece.
4. method according to claim 2, it is characterised in that the transparent cover plate is clear glass cover plate or sapphire lid
Plate.
5. according to the method described in claim 1, it is characterised in that the metal electrode lead thicknesses are less than 5 microns, the control
Temperature heating film thickness is less than 5 microns, and the thickness of the heat discoloration ink layer is less than 50 microns.
6. according to the method described in claim 1, it is characterised in that the temperature control heating film is semiconductor heating ceramic material.
7. a kind of fingerprint module, it is characterised in that including：Identification of fingerprint chip, temperature control heating film and heat discoloration ink layer；
Metal electrode lead is laid with the identification of fingerprint chip, one end of the metal electrode lead is arranged on identification of fingerprint
On the top surface of chip, the other end of the metal electrode lead is connected with the welding pin in the fingerprint die bottom surface；
The bottom surface of the temperature control heating film is combined with the top surface of the identification of fingerprint chip, and the covering identification of fingerprint chip
Top surface；
The heat discoloration ink layer is combined with the top surface of the temperature control heating film, and the top surface of the covering temperature control heating film.
8. fingerprint module according to claim 7, it is characterised in that the fingerprint module also includes transparent cover plate；
The transparent cover plate is combined with the top surface of the heat discoloration ink layer, and the top of the covering heat discoloration ink layer
Face.
9. fingerprint module according to claim 8, it is characterised in that the transparent cover plate is clear glass cover plate or blue precious
Stone cover plate.
10. fingerprint module according to claim 7, it is characterised in that the metal electrode lead thicknesses are less than 5 microns,
The temperature control heating film thickness is less than 5 microns, and the thickness of the heat discoloration ink layer is less than 50 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710210066.7A CN106951883A (en) | 2017-03-31 | 2017-03-31 | A kind of fingerprint module preparation method and fingerprint module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710210066.7A CN106951883A (en) | 2017-03-31 | 2017-03-31 | A kind of fingerprint module preparation method and fingerprint module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106951883A true CN106951883A (en) | 2017-07-14 |
Family
ID=59474531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710210066.7A Pending CN106951883A (en) | 2017-03-31 | 2017-03-31 | A kind of fingerprint module preparation method and fingerprint module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106951883A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150078635A1 (en) * | 2013-09-18 | 2015-03-19 | Blackberry Limited | Structure for multicolor biometric scanning user interface |
| EP3048562A1 (en) * | 2015-01-23 | 2016-07-27 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Device for acquiring a characteristic image of a body |
-
2017
- 2017-03-31 CN CN201710210066.7A patent/CN106951883A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150078635A1 (en) * | 2013-09-18 | 2015-03-19 | Blackberry Limited | Structure for multicolor biometric scanning user interface |
| EP3048562A1 (en) * | 2015-01-23 | 2016-07-27 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Device for acquiring a characteristic image of a body |
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Application publication date: 20170714 |