CN106944874A - The new heat dissipating method of metal that a kind of utilization low-temperature current takes away heat - Google Patents
The new heat dissipating method of metal that a kind of utilization low-temperature current takes away heat Download PDFInfo
- Publication number
- CN106944874A CN106944874A CN201710249388.2A CN201710249388A CN106944874A CN 106944874 A CN106944874 A CN 106944874A CN 201710249388 A CN201710249388 A CN 201710249388A CN 106944874 A CN106944874 A CN 106944874A
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- China
- Prior art keywords
- metal derby
- temperature
- metal
- cutter
- power supply
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/10—Arrangements for cooling or lubricating tools or work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides the new heat dissipating method of metal that a kind of utilization low-temperature current takes away heat, comprise the following steps：Step 1, cooling circuit is set up, cooling circuit includes power supply, metal derby and cutter, and the negative pole of power supply is connected with metal derby, and the positive pole of power supply is connected with cutter, and the loop of connection is formed between power supply, metal derby and cutter；Step 2, refrigeration unit is connected with metal derby, and refrigeration unit makes it maintain the low temperature needed for the metal derby as required to cooling as the metal derby of electronic library, so that the metal derby builds a low temperature electric word bank；Step 3, cutter is cooled to after uniform temperature, and cutter is started working.The present invention is changed into high-temperature electric subflow by the electron stream draw heat and then increase electronics mean kinetic energy of low temperature, the randomness for the simply electronics warm-up movement that whole process changes, for pure physical action, any adverse effect will not be produced to environment, there will not be any escaping gas and noise.
Description
Technical field
The present invention relates to a kind of heat dissipation metal technical field, and in particular to a kind of utilization low-temperature current takes away the metal of heat
New heat dissipating method.
Background technology
In existing routine work and life, the convection current side of jetting liquid or ventilation is used generally for heat dissipation metal
Method, the method is set about from outside, crosses high temperature metal surface using the fluid stream of low temperature, but use the radiating of injection liquid (gas) body
Method easily forms pollution, produces noise and forms the healthy of escaping gas harm people.
The content of the invention
The present invention is carried out to solve the above problems, it is therefore intended that is provided one kind and is taken away heat using low-temperature current
The new heat dissipating method of metal, for solve injection liquid (gas) body heat dissipating method environment is produced adverse effect, volatility gas
Body and noise.
The invention provides the new heat dissipating method of metal that a kind of utilization low-temperature current takes away heat, inhaled by low temperature electric subflow
Take heat and then increase mean kinetic energy to become high-temperature electronic and take away heat, give heat dissipation metal cooling, it is characterised in that including following
Step：
Step 1, cooling circuit is set up, cooling circuit includes power supply, metal derby, switch, cutter, workpiece, the negative pole of power supply
It is connected with metal derby, the positive pole of power supply is connected with workpiece, cutter is contacted with workpiece after connection, by the workpiece of connection, is opened
The loop of connection is formed between pass, power supply, metal derby and cutter.
Step 2, refrigeration unit is connected with metal derby, refrigeration unit to cooling as the metal derby of electronic library, according to
Need to make it maintain the low temperature needed for metal derby, so that metal derby builds a low temperature electric word bank.And
Step 3, closure switch, the cryotronics in metal derby under electric field action flows into cutter against direction of an electric field, passes through
Control electrical potential difference that the cryotronics of low-temperature region is imported into high-temperature metal, high-temperature region is taken away in the electronics outflow high-temperature region of high-temperature region
Heat, cutter cooled down.
In the new heat dissipating method of metal that a kind of utilization low-temperature current that the present invention is provided takes away heat, there can also be this
The feature of sample：Wherein, refrigeration unit is the working medium liquid nitrogen of low temperature.
The effect of invention and effect
The new heat dissipating method of metal that a kind of utilization low-temperature current involved in the present invention takes away heat, passes through low temperature electric subflow
Draw heat and then increase mean kinetic energy become high-temperature electronic and take away heat, and the new method that the present invention is provided is purely with the electricity of low temperature
Subflow draw heat and then increase electronics mean kinetic energy are changed into high-temperature electric subflow, the simply electronics warm-up movement that whole process changes
Randomness.For pure physical action, any adverse effect will not be produced to environment, there will not be any escaping gas and noise.
Brief description of the drawings
Fig. 1 is the new heat dissipating method structural representation of metal for taking away heat using low-temperature current in embodiments of the invention.
Embodiment
In order that technological means, creation characteristic, reached purpose and effect that the present invention is realized are easy to understand, it is real below
The new heat dissipating method of metal that example combination accompanying drawing takes away heat to a kind of utilization low-temperature current involved in the present invention is applied to make specifically to explain
State.
Material is the carrier of energy, electronics can also as heat carrier.Lattice is shown as on the heat energy of metal is microcosmic
Vibrations and electronics random motion, referred above to the warm-up movement of metallic atom；Microcosmic go up of kinetic energy macroscopically is substantially
The mean kinetic energy of molecule.Electronics random motion can aggravate after heat absorbing metal, refer to be by the converting heat of absorption
The mean kinetic energy increment of particle.Low-temperature metal internal electron group random motion is not comparatively violent, more stable.In electric field
Under effect, electronics can be formed electric current by electric field force effect.Control electrical potential difference that the cryotronics of low-temperature region is imported into high temperature gold
Category, the unordered electronics outflow high-temperature region of high-temperature region, cryotronics constantly substitutes the position of the original electronics in high-temperature region, simultaneously because dynamic
Amount exchanges electron stream can constantly obtain bigger kinetic energy from high-temperature region, and external manifestation is draw heat, electron stream outflow high-temperature region
The heat of high-temperature region can be taken away, you can reach the mesh cooled to high-temperature region.
Fig. 1 is the new heat dissipating method structural representation of metal for taking away heat using low-temperature current in embodiments of the invention.
As shown in figure 1, the new heat dissipating method of metal that a kind of utilization low-temperature current takes away heat, is drawn by low temperature electric subflow
Heat and then increase mean kinetic energy become high-temperature electronic and take away heat, give heat dissipation metal cooling, it is characterised in that including following step
Suddenly：
Step 1, cooling circuit is set up, cooling circuit includes power supply 1, metal derby 2, workpiece, cutter 3 and switch 4, power supply 1
Negative pole be connected with metal derby 2, the positive pole of power supply 1 is connected with workpiece, and cutter 3 contacts connection with workpiece, workpiece, switch 4, power supply
1st, between metal derby 2 and cutter 3 by connection, after cutter 3 contacts connection with workpiece, workpiece, switch 4, power supply 1,
The loop of connection is formed between metal derby 2 and cutter 3.
Step 2,5 pairs of refrigeration unit cools as the metal derby 2 of electronic library, it is maintained metal derby 2 as required
Required low temperature, so that metal derby 2 builds a low temperature electric word bank, now electronic population mean kinetic energy is reduced in metal derby 2.
Wherein, refrigeration unit 5 can for refrigeration machine or low temperature working medium liquid nitrogen, in the present embodiment, what refrigeration unit 5 was used
It is the working medium liquid nitrogen of low temperature.
Step 3, closure switch 4, the power supply of power supply 1 provides voltage, and the cryotronics of metal derby 2 is against electric field under electric field action
Direction flows into cutter 3, and high-temperature metal, the electronics outflow of high-temperature region are imported by controlling electrical potential difference by the cryotronics of low-temperature region
High-temperature region, cryotronics constantly substitutes the position of the original electronics in high-temperature region, simultaneously because action of thermal difference electron stream can be constantly from height
Warm area draw heat, the heat that electron stream outflow high-temperature region can produce the heat of high-temperature region and Joule effect is taken away, i.e.,
It can reach the mesh cooled to high-temperature region.
Step 4, cutter 3 is cooled to after uniform temperature, and cutter 3 is started working, electron stream absorb due to cutter 3 and workpiece it
Between mechanical friction and Joule effect produce heat, heat is changed into the mean kinetic energy increment of electron stream, i.e. molecule meeting
Become more unordered.When electron stream outflow cutter will just take away the heat absorbed within the workpiece.Then electron stream flows through power supply and entered
Enter the metal derby 2 of low temperature electric word bank, taking away heat by refrigeration unit 5 is discharged into external environment.
The effect of embodiment and effect
The new heat dissipating method of metal that a kind of utilization low-temperature current involved in the present invention takes away heat, passes through low temperature electric subflow
Draw heat and then increase mean kinetic energy become high-temperature electronic and take away heat, give heat dissipation metal cooling, and the inventive method uses letter
Folk prescription just, imports high-temperature metal, the electronics of high-temperature region flows out high-temperature region by controlling electrical potential difference by the cryotronics of low-temperature region,
Cryotronics constantly substitutes the position of the original electronics in high-temperature region, simultaneously because action of thermal difference electron stream constantly can be drawn from high-temperature region
Heat, the heat that electron stream outflow high-temperature region can produce the heat of high-temperature region and Joule effect be taken away, you can reach to
The mesh of high-temperature region cooling.
The present invention can also be then applied to association area as One function module, because being a kind of basic side
Method, application field is also to have very much Development volue.
Above-mentioned embodiment is the preferred case of the present invention, is not intended to limit protection scope of the present invention.
Claims (2)
1. the new heat dissipating method of metal that a kind of utilization low-temperature current takes away heat, it is characterised in that comprise the following steps：
Step 1, cooling circuit is set up, the cooling circuit includes power supply, metal derby, switch, cutter, workpiece, the power supply
Negative pole is connected with the metal derby, and the positive pole of the power supply is connected with the workpiece, and the cutter contacts connection with the workpiece
Afterwards, the company of being formed between the workpiece of connection, the switch, the power supply, the metal derby and the cutter is passed through
Logical loop；
Step 2, refrigeration unit is connected with the metal derby, and the refrigeration unit as the metal derby of electronic library to dropping
Temperature, and the metal derby is maintained for building the low temperature that cryotronics place is needed；And
Step 3, the switch is closed, the cryotronics under electric field action in the metal derby flows into the knife against direction of an electric field
Tool, imports high-temperature metal, the electronics outflow high-temperature region of high-temperature region is taken away by controlling electrical potential difference by the cryotronics of low-temperature region
The heat of high-temperature region, the cutter is cooled down.
2. the new heat dissipating method of metal that a kind of utilization low-temperature current according to claim 1 takes away heat, it is characterised in that：
Wherein, the refrigeration unit is the working medium liquid nitrogen of low temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710249388.2A CN106944874A (en) | 2017-04-17 | 2017-04-17 | The new heat dissipating method of metal that a kind of utilization low-temperature current takes away heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710249388.2A CN106944874A (en) | 2017-04-17 | 2017-04-17 | The new heat dissipating method of metal that a kind of utilization low-temperature current takes away heat |
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| CN106944874A true CN106944874A (en) | 2017-07-14 |
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| CN201710249388.2A Pending CN106944874A (en) | 2017-04-17 | 2017-04-17 | The new heat dissipating method of metal that a kind of utilization low-temperature current takes away heat |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111819297A (en) * | 2018-03-16 | 2020-10-23 | 株式会社 Ihi | Object processing method and device |
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|---|---|---|---|---|
| US5551324A (en) * | 1992-10-07 | 1996-09-03 | Akhmetzyanov; Izyaslav D. | Method and device for cooling the machine zone using an ionized gaseous cutting fluid |
| CN1597216A (en) * | 2004-08-06 | 2005-03-23 | 苏州中特机电科技有限公司 | Method of high efficiency cooling and removing etched matter of efficient discharge milling processing |
| CN201168842Y (en) * | 2008-02-18 | 2008-12-24 | 苏州新火花机床有限公司 | Shock absorption sprayer for numerical control linear cutter |
| CN201220324Y (en) * | 2008-06-06 | 2009-04-15 | 奇瑞汽车股份有限公司 | Projection welder |
| CN101966661A (en) * | 2010-07-08 | 2011-02-09 | 苏州科技学院 | Ultrasonic focused vapor fog cooler |
| CN102601677A (en) * | 2012-03-30 | 2012-07-25 | 大连理工大学 | Atmospheric cold plasma jet auxiliary cutting method |
| CN103084919A (en) * | 2013-02-07 | 2013-05-08 | 浙江工业大学 | Cutting fluid aerial fog micro-scale lubricating method and device |
| CN103691969A (en) * | 2013-12-06 | 2014-04-02 | 大连理工大学 | Method for cutting black metal by diamond tool |
| CN203578791U (en) * | 2013-12-06 | 2014-05-07 | 大连理工大学 | Device for cutting black metal through diamond cutter |
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2017
- 2017-04-17 CN CN201710249388.2A patent/CN106944874A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5551324A (en) * | 1992-10-07 | 1996-09-03 | Akhmetzyanov; Izyaslav D. | Method and device for cooling the machine zone using an ionized gaseous cutting fluid |
| CN1597216A (en) * | 2004-08-06 | 2005-03-23 | 苏州中特机电科技有限公司 | Method of high efficiency cooling and removing etched matter of efficient discharge milling processing |
| CN201168842Y (en) * | 2008-02-18 | 2008-12-24 | 苏州新火花机床有限公司 | Shock absorption sprayer for numerical control linear cutter |
| CN201220324Y (en) * | 2008-06-06 | 2009-04-15 | 奇瑞汽车股份有限公司 | Projection welder |
| CN101966661A (en) * | 2010-07-08 | 2011-02-09 | 苏州科技学院 | Ultrasonic focused vapor fog cooler |
| CN102601677A (en) * | 2012-03-30 | 2012-07-25 | 大连理工大学 | Atmospheric cold plasma jet auxiliary cutting method |
| CN103084919A (en) * | 2013-02-07 | 2013-05-08 | 浙江工业大学 | Cutting fluid aerial fog micro-scale lubricating method and device |
| CN103691969A (en) * | 2013-12-06 | 2014-04-02 | 大连理工大学 | Method for cutting black metal by diamond tool |
| CN203578791U (en) * | 2013-12-06 | 2014-05-07 | 大连理工大学 | Device for cutting black metal through diamond cutter |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111819297A (en) * | 2018-03-16 | 2020-10-23 | 株式会社 Ihi | Object processing method and device |
| EP3766993A4 (en) * | 2018-03-16 | 2021-12-08 | Ihi Corporation | Object processing method and device |
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Application publication date: 20170714 |
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