CN106944704A - A kind of inert gas heater for wave soldering device - Google Patents

A kind of inert gas heater for wave soldering device Download PDF

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Publication number
CN106944704A
CN106944704A CN201611234429.2A CN201611234429A CN106944704A CN 106944704 A CN106944704 A CN 106944704A CN 201611234429 A CN201611234429 A CN 201611234429A CN 106944704 A CN106944704 A CN 106944704A
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CN
China
Prior art keywords
inert gas
temperature
heater according
spirality
heat carrier
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CN201611234429.2A
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Chinese (zh)
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CN106944704B (en
Inventor
郭俊松
范国良
余允红
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LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
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LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
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Priority to CN201611234429.2A priority Critical patent/CN106944704B/en
Publication of CN106944704A publication Critical patent/CN106944704A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • B23K1/085Wave soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Furnace Details (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The inert gas of wave soldering simply can accurately be heated to required temperature by a kind of inert gas heater for wave soldering device, heating and gas temperature control problem available for the inert gas for solving wave soldering, device.Gas temperature at the inert gas heating means exit reaches as high as 600 DEG C, and the adjustable scope of temperature is larger, from 100 DEG C to 600 DEG C, and the gas temperature measured in heater gas vent is fluctuated in positive and negative 2 DEG C of setting heating-up temperature.

Description

A kind of inert gas heater for wave soldering device
Technical field
The present invention relates to a kind of inert gas heater for wave soldering device.
Background technology
Wave soldering is a kind of important Electronic Assembly Foundation, by the solder under molten condition, in solder bath liquid level The solder wave of given shape is formed, the printed circuit board (PCB) for having inserted electronic component passes through solder wave through certain angle and depth Peak so that the pin that electronic component is exposed by through hole immerses solder wave, and solder is realized because capillary effect climbs into through hole The welding of electronic component.
During wave soldering, the workpiece of processing to be welded, such as printed circuit board (PCB) are at least one produced by solder bath Pass through on individual solder wave, as the ripple in wave soldering processes is stirred, the oxidation of solder can aggravate, and the oxidation of solder is not only produced A large amount of molten slages, and more weld defects can be produced and the reliability of solder joint is reduced.Typically set above solder bath lazy Property atmosphere, be covered in solder surface, completely cut off air, so as to reduce or prevent the oxidation of solder.United States Patent (USP) US5044542 (1989)A kind of gas shield wave-soldering is described, wave-soldering is carried out in the environment of inert gas, inert gas can be with It is simple inert gas or is mixed with the inert gas of a small amount of reducing gas for removing oxygen.But during welding equipment works Solder sputter and scaling powder volatilization always occurs, they can stick on nanoporous pipe and cause inert gas gas outlet to block up Plug.
Because the temperature in gas shield wave soldering region is typically 250-270 DEG C, and need substantial amounts of inert gas Completely cut off air;If inert gas can influence the temperature stability of welding region without preheating, and then cause welding effect not It is good.United States Patent (USP) US4606493(1984)Disclose a kind of method and dress that printed circuit board (PCB) is welded in atmosphere of inert gases Put, if touching the inert gas that the high speed splashed is sprayed into provided with carried interest and printed circuit board (PCB) bottom surface by gap, inert gas jet flow Temperature is set to 2 times of fusion welding temperature in solder bath(More than 600 DEG C), due to produced heat when can prevent from welding And make terminal(Typically copper)Aoxidize and reduce the defect that thermal stress occurs in circuit board.United States Patent (USP) US5520320 (1994)A kind of wave soldering processes for having inert gas atmosphere to inject wave-soldering unit are disclosed, pass through control input gas Temperature improves from ambiance to the thermal efficiency of printed circuit board (PCB) heat transfer to improve the quality of pad.Wave-soldering unit enters Atmosphere around the especially printed circuit board (PCB) of the region of solder bath should keep laminar condition and its temperature should be controlled at 20 DEG C to 250 ℃(Preferably 80 DEG C to 200 DEG C)Between to improve the quality of pad.United States Patent (USP) US5769305(1996)Disclose one kind Wave soldering apparatus, wherein inert gas is fed into wave soldering region via the inert gas supply pipeline through solder bath. Inert gas supply pipeline is arranged to from above through cover lid and comes gas distribution member through solder bath.Inert gas is supplied Pipeline is connected to the gas distribution member particularly below cover lid.However, the inert gas supply pipe being immersed in solder bath The curtailment of line with inert gas by be immersed in solder with inert gas supply pipeline when significantly raise indifferent gas The temperature of body.Chinese invention patent Authorization Notice No. CN201020583Y(2007)Disclose a kind of nitrogen-protective soldering furnace intermittently Stove preheating purification device, will be placed in the wall of preheating purification device for the nitrogen pipeline to brazing area supplying nitrogen, Between zone of heating and heat-insulation layer, the gap of nitrogen-protective soldering furnace door and preheating purification device cavity is utilized so that overflow brazing area The nitrogen gone out enters preheating purifying area.The B2 of United States Patent (USP) US 8,403,200(2010)Disclose a kind of for supplied for inert gas Body is to protect the surface of the solder bath in wave soldering device to exempt from the method for oxidation, and wherein inert gas is from above through cover Lid is supplied to the heat exchanger in the solder bath being immersed in below cover lid, is heated by heat exchanger, and be supplied back through cover lid Top and reach wave soldering device.Prevent at a temperature of inert gas is practically at solder bath and thus solder in crest Solidification and part to be welded are cooled down between two crests on distributor in welding equipment.The solder of splashing is prevented to exist Solidify on the component of inert gas distribution system.Carry out heat exchange to heat using the solder in solder bath and inert gas piping Inert gas, can make the temperature of solder reduces, particularly when solder bath volume is little, and solder cooling may be more than 15 DEG C, it can so have a strong impact on the effect of follow-up wave soldering.In addition, being influenceed by solder bath temperature, inert gas after heat exchange Temperature be difficult more than 220 DEG C.In addition the heat exchanging pipe of inert gas is immersed in solder and can be corroded throughout the year, once heat is handed over Change pipe damaged, inert gas leakage will cause solder sputter.
The content of the invention
It is an object of the invention to the heating problems for the inert gas that solves wave soldering, especially it is to provide one Inert gas heater is planted, the protection gas of wave soldering simply can accurately be heated to required temperature by the device Degree.
The technical solution adopted by the present invention is to use a kind of inert gas heater for wave soldering device, comprising Shell, insulation material, heat carrier, spirality inert gas piping, heating element heater, wherein temperature control system, heating element heater bag Containing heating rod and heating wire, the air inlet of spirality inert gas piping and gas outlet are located on shell respectively, air inlet and go out Gas port is connected by pipeline with outside gas circuit, spirality inert gas piping outer wrapping heat carrier, is thermal insulating material outside heat carrier It is shell outside material, insulation material, temperature control system is connected with heating element heater, temperature control system includes two temperature sensings Device and heating control apparatus, heating control apparatus are connected with hygrosensor and heating element heater, control the switch of heating element heater.
Preferably, the heating rod is located at the axis line position of spirality inert gas piping wound interior, the electric heating Silk is wrapped in outside heat carrier.
Preferably, the groove of external screw thread shape, groove of the heating wire winding outside heat carrier are provided with outside the heat carrier Interior, groove spacing is 5-100mm.
Preferably, the pitch of the spirality inert gas piping is the 0.01-10 of spirality inert gas piping caliber Times.
Preferably, the insulation material selected from titanium silicate, silica, aluminum oxide, titanium oxide in composite porous one Plant or several compounds.
Preferably, the insulation material is titanium silicate(Ti2Si2O5).
Preferably, the aperture of the titanium silicate insulation material is less than 70nm.
Preferably, inert gas gas outlet pipeline connects entering for the inert gas protection device of wave soldering device Mouthful, inert gas air inlet connection noble gas source.
Preferably, the hygrosensor be arranged on the pipeline of inert gas gas outlet and heat carrier in.
Preferably, the hygrosensor can be that thermocouple, thermal resistance or liquid rise the temperature probe of formula temperature switch.
Preferably, the heat carrier can also be Cu, Al and the good material of other heat conductivilitys, and the material includes copper Alloy or other alloys.
Preferably, the heat carrier is cast on together with spirality inert gas piping.
Preferably, the inert gas is nitrogen or the protection gas of other wave solderings.
The present invention has advantages below compared with prior art:
1st, simple installation of the present invention, can protect direct improvement and installation, the wave-soldering of all size on wave-soldering furnace in existing nitrogen Stove can be applicable.
2nd, the present invention is easy to operate, and heated perimeter is larger, and the inert gas temperature at heating means exit reaches as high as 600 DEG C, and the adjustable scope of temperature is larger, from 100 DEG C to 600 DEG C.And the gas measured in the inert gas gas outlet of heater Temperature is fluctuated in positive and negative 2 DEG C of setting heating-up temperature.
3rd, the present invention can conveniently and accurately adjust the inert gas temperature at heating means exit, preferably to adjust This parameter of inert gas temperature during wave-soldering.
4th, the present invention is not required to inert gas piping being immersed in solder bath, and maintenance is convenient.
Brief description of the drawings
Fig. 1 is the front section view of inert gas heater.
Fig. 2 is the winding schematic diagram of the outer heating wire of heat carrier in Fig. 1.
Wherein:1- shells;2- insulation materials;3- heat carriers;4- spirality inert gas pipings;5- heating rods;6- electric heating Silk;7- inert gas piping air inlets;8- inert gas pipings gas outlet;9- hygrosensors;10- hygrosensors;11- is recessed Groove.
Embodiment
The present invention is described in further detail with reference to the accompanying drawings and detailed description.
As shown in figure 1, a kind of inert gas heater for wave-soldering of the present invention, includes shell 1, insulation Material 2, heat carrier 3, spirality inert gas piping 4, heating rod 5 and heating wire 6, temperature control system.Wherein spirality is lazy Property gas piping air inlet 7 and gas outlet 8 respectively be located at shell on, air inlet by soon insert be connected with Nitrogen source gases, outlet Mouth is connected by cutting ferrule with wave-soldering nitrogen charging equipment.The caliber of spirality inert gas piping is 8mm, and pitch is about 0.1 times of pipe Footpath, the diameter of spirality inert gas piping wound interior is about 3cm.The power of heating rod 5 is 5000w, and length is about 30cm, position In the axis line position of helix tube wound interior, the diameter of heating rod and the diameter base of spirality inert gas piping wound interior This is consistent.Spirality inert gas piping outer wrapping cast copper heat carrier 3, spirality inert gas piping is cast with cast copper heat carrier Together.The power of heating wire 6 is 2000w, is wrapped in the pre-processed external screw thread shape groove outside heat carrier, between groove Away from for 30mm.The outside of heat carrier 3 is insulation material 2, because heating wire 6 is fixed in the groove 11 outside heat carrier 3(Such as Fig. 2 It is shown), it is possible to reduce heating wire moves and cast copper heat conduction external surface is preferably fitted with insulation material, while can be with Increase the heat exchange area of heat carrier and heating wire.It is shell 1 outside insulation material 2, insulation material is titanium silicate Ti2Si2O5It is micro- Hole heat-barrier material, aperture in 40nm or so, with normal temperature than still air also low thermal conductivity factor, even if heat conduction temperature is super 600 DEG C are crossed, shell is still unlikely to overheat.Temperature control system includes two hygrosensors 9,10, and heating control apparatus, two Hygrosensor measures the temperature of heat carrier and the temperature of gas at inert gas piping gas outlet, heating control apparatus respectively For control relay, it is connected with hygrosensor and be connected with heating rod 5 and heating wire 6, controls the switch of heating element heater.Temperature control System processed can set heating-up temperature, by heating element heats heat carrier, and spirality nitrogen pipeline is wound positioned at helix tube Cast copper heat carrier outside internal heating rod and its winding is fully heated, the spirality inert gas of inert gas heater Nitrogen temperature at pipeline gas outlet is monitored by hygrosensor, and the temperature of cast copper heat carrier is also monitored, and can be gone out according to nitrogen The nitrogen temperature of gas port, switch control is carried out by heating control apparatus to heating element heater.
A kind of occupation mode of the present invention during wave soldering:
First by the gas in nitrogen displacement heater gas circuit, operation is started after closing source of the gas.
Temperature control system sets heating-up temperature as 400 DEG C, opens heating control apparatus, opens heating element heater, is passed through nitrogen The temperature of gas, wherein nitrogen is that nitrogen pressure is 4atm at room temperature, source outlet, and the flow velocity of nitrogen in normal conditions is 6Nm3/h.The nitrogen temperature detector on the pipeline of nitrogen gas outlet is read after about 10min, 398 DEG C -402 DEG C are shown as.Simultaneously The temperature in the nitrogen atmosphere in solder for wave crest welding groove nitrogen protection device is measured, maximum temperature takes up to 280 DEG C -350 DEG C Certainly in the nitrogen pipeline length of heater to Wave-soldering device, and whether it is surrounded by the factors such as insulation material.The temperature and weldering 220 DEG C of the maximum temperature of the hot inert gas of hopper heat exchange production is compared to much higher.
Temperature control system sets heating-up temperature as 600 DEG C, opens heating control apparatus, opens heating element heater, about 15- The nitrogen temperature detector on the pipeline of nitrogen gas outlet is read after 20min, 598 DEG C -602 DEG C are shown as.Nitrogen is measured simultaneously Temperature in inert gas atmosphere, maximum temperature is up to 330 DEG C -500 DEG C.Inert gas heating dress in the present invention for wave-soldering Putting accurately can adjust and control the temperature of inert gas, to find and confirm for the optimal indifferent gas body temperature of wave-soldering Spend parameter.Compared with nitrogen inert gas mode of heating traditional and that solder bath heat exchange is produced, the present invention need not be by nitrogen Pipeline incident wave weld groove, can prevent the corrosion of nitrogen pipeline, and the influence to solder temperature.
If heat carrier is Al materials, about 400 DEG C of maximum heating temperature uses other heat carriers, maximum heating temperature root It is different according to heat carrier composition difference.The nitrogen that wave soldering needs protects temperature degree about at 300 DEG C or so, than the temperature of solder bath Degree is slightly higher, and the gas temperature to be heated can be protected to select suitable heat carrier according to nitrogen.
The nitrogen flow rate general control of spirality inert gas piping is flowed through in 4-8Nm3In/h, inert gas heater Spiral air pipeline total length can be calculated by heat transfer basic equation, Q=KA △ tm, major parameter Q is thermic load, and K is heat transfer Coefficient (entire thermal resistance is reciprocal), A is heat exchange area, △ tmFor logarithmic mean temperature difference (LMTD) (logarithmic mean motive force), pipeline total length takes Certainly in gaseous species and flow velocity, tubing internal diameter, pipe thickness, heat carrier material, the parameter such as heating-up temperature.
It should be understood that, although the present specification is described in terms of embodiments, but not each embodiment only includes one Individual independent technical scheme, this narrating mode of specification is just for the sake of for the sake of clear, and those skilled in the art should be by Specification is as an entirety, and technical scheme in embodiment can also be through appropriately combined, and forming those skilled in the art can The other embodiment of understanding.Above is of the invention obtain preferred embodiment, but the invention is not limited to the embodiment, this A variety of equivalent modifications or replacement that the technical staff in field is substantially made according to the technology of the present invention, being all contained in the application right will Ask in limited range, such as spirality inert gas piping can be round screw thread or square spiral or other The spiral of shape, the shape of heat carrier can be cylinder, cuboid or other shapes.

Claims (13)

1. a kind of inert gas heater for wave soldering device, it is characterised in that comprising shell, insulation material is led Hot body, spirality inert gas piping, heating element heater, wherein temperature control system, heating element heater include heating rod and heating wire, The air inlet of spirality inert gas piping and gas outlet are located on shell respectively, and air inlet and gas outlet pass through pipeline and outside Gas circuit is connected, spirality inert gas piping outer wrapping heat carrier, is outside being outside heat carrier outside insulation material, insulation material Shell, temperature control system is connected with heating element heater, and temperature control system includes two hygrosensors and heating control apparatus, plus Heat control device is connected with hygrosensor and heating element heater, controls the switch of heating element heater.
2. inert gas heater according to claim 1, it is characterised in that the heating rod is located at spirality inertia The axis line position of gas piping wound interior, the heating wire winding is outside heat carrier.
3. inert gas heater according to claim 2, it is characterised in that external screw thread is provided with outside the heat carrier The groove of shape, heating wire winding is in the groove outside heat carrier, and groove spacing is 5-100mm.
4. inert gas heater according to claim 1 or 2, it is characterised in that the spirality inert gas tube The pitch on road is 0.01-10 times of spirality inert gas piping caliber.
5. inert gas heater according to claim 1 or 2, it is characterised in that the insulation material is selected from silicic acid One or more of compounds during titanium, silica, aluminum oxide, titanium oxide are composite porous.
6. inert gas heater according to claim 5, it is characterised in that the insulation material is titanium silicate.
7. inert gas heater according to claim 6, it is characterised in that the aperture of the titanium silicate insulation material Less than 70nm.
8. inert gas heater according to claim 1 or 2, it is characterised in that the inert gas outlet tube The import of the inert gas protection device of road connection wave soldering device, inert gas air inlet connection noble gas source.
9. inert gas heater according to claim 1 or 2, it is characterised in that the hygrosensor is arranged on On the pipeline of inert gas gas outlet and in heat carrier.
10. inert gas heater according to claim 9, it is characterised in that the hygrosensor can be heat Galvanic couple, thermal resistance or liquid rise the temperature probe of formula temperature switch.
11. inert gas heater according to claim 1 or 2, it is characterised in that the heat carrier can also be Cu, Al and the good material of other heat conductivilitys, the material include copper alloy or other alloys.
12. inert gas heater according to claim 11, it is characterised in that the heat carrier and spirality inertia Gas piping is cast on together.
13. inert gas heater according to claim 1 or 2, it is characterised in that the inert gas be nitrogen or The protection gas of other wave solderings.
CN201611234429.2A 2016-12-28 2016-12-28 A kind of inert gas heating device for wave soldering device Active CN106944704B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112556199A (en) * 2020-06-25 2021-03-26 明宝能源株式会社 Control system for electrode type boiler

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2505461A1 (en) * 1981-05-05 1982-11-12 Guilhaumon Aime Heat recuperator for hot water boiler - has water coil around exhaust gas duct with insulation packing
CN101655472A (en) * 2009-10-09 2010-02-24 丁五行 Constant temperature insulation system for thermal conductivity gas detection
JP2011214537A (en) * 2010-04-01 2011-10-27 Sakamoto Industry Co Ltd Exhaust gas heat recovery device
CN203140915U (en) * 2013-02-04 2013-08-21 日东电子科技(深圳)有限公司 Nitrogen protection device
KR101420348B1 (en) * 2013-03-18 2014-07-16 우성이엔디주식회사 Nitrogen gas injection apparatus using heat of dry pump
CN203849084U (en) * 2014-04-15 2014-09-24 南京国电环保科技有限公司 Gas-heating constant temperature preheater
CN206677349U (en) * 2016-12-28 2017-11-28 乔治洛德方法研究和开发液化空气有限公司 A kind of inert gas heater for wave soldering device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2505461A1 (en) * 1981-05-05 1982-11-12 Guilhaumon Aime Heat recuperator for hot water boiler - has water coil around exhaust gas duct with insulation packing
CN101655472A (en) * 2009-10-09 2010-02-24 丁五行 Constant temperature insulation system for thermal conductivity gas detection
JP2011214537A (en) * 2010-04-01 2011-10-27 Sakamoto Industry Co Ltd Exhaust gas heat recovery device
CN203140915U (en) * 2013-02-04 2013-08-21 日东电子科技(深圳)有限公司 Nitrogen protection device
KR101420348B1 (en) * 2013-03-18 2014-07-16 우성이엔디주식회사 Nitrogen gas injection apparatus using heat of dry pump
CN203849084U (en) * 2014-04-15 2014-09-24 南京国电环保科技有限公司 Gas-heating constant temperature preheater
CN206677349U (en) * 2016-12-28 2017-11-28 乔治洛德方法研究和开发液化空气有限公司 A kind of inert gas heater for wave soldering device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112556199A (en) * 2020-06-25 2021-03-26 明宝能源株式会社 Control system for electrode type boiler

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