CN106935384A

CN106935384A - Coupling inductor array and correlation technique

Info

Publication number: CN106935384A
Application number: CN201611170310.3A
Authority: CN
Inventors: 姚迪; A·伊克里亚尼科夫
Original assignee: Wal Tara Semiconductor Ltd
Current assignee: Wal Tara Semiconductor Ltd; Volterra Semiconductor LLC
Priority date: 2015-12-18
Filing date: 2016-12-16
Publication date: 2017-07-07
Anticipated expiration: 2036-12-16
Also published as: CN106935384B

Abstract

A kind of coupling inductor array includes the one chip magnetic core, the first and second windings and the low magnetic permeability magnetic texure that are formed by the magnetic material with Distributed gaps.First and second windings form corresponding first and second winding turns around the public winding axle for extending in the height direction.Low magnetic permeability magnetic texure is embedded in one chip magnetic core, and forms ring around the public winding axle.The low magnetic permeability magnetic texure in the height direction separates the first and second winding turns, and the low magnetic permeability magnetic texure is formed by the magnetic material for having lower magnetic conductivity than forming one or more magnetic material of the one chip magnetic core.A kind of possible application of the coupling inductor array is in multiphase switching power converter.

Description

Coupling inductor array and correlation technique

Related application

The application is that the part of the U.S. Patent application of the sequence number No.14/199833 that on March 6th, 2014 submits to continues, The U.S. Patent application is that the part of the U.S. Patent application of the sequence number No.13/303062 that on November 22nd, 2011 submits to is prolonged It is continuous.Each application in above mentioned application is incorporated herein by quoting.

Background technology

Multiple switching formula converter parallel connections are electrically coupled to improve switching power converter capacity and/or improve switching Formula power converter performance is known.Multiphase switching power converter generally has than in the similar design of other side Single-phase switching power converter better performance.Specifically, the out-phase in multiphase converter switches in converter output filter Ripple current is caused to be offset at ripple device, and it is more preferable than in the similar single phase converter of other side to allow multiphase converter to have Transient response.

As Schultz et al. is instructed in United States Patent (USP) No.6362986 (being incorporated into herein by quoting), can It is magnetically coupled by the energy stores inductor to two or more phases and improves the property of multiphase switching power converter Energy.Such magnetic coupling causes ripple current to be offset and improves ripple switching frequency in the inductor, thus relative to Other side is equivalent but the converter without magnetically coupled inductors improves converter transient response, reduces input and exports Filtering requirements, and/or improve converter efficiency.

Two or more magnetically coupled inductors are often referred to collectively as " coupling inductor ", and with related leakage inductance and magnetic Change inductance value.Magnetic coupling between magnetizing inductance and winding is related；Thus magnetizing inductance is bigger, and the magnetic coupling between winding is got over By force.On the other hand, leakage inductance is related to energy stores.Thus, leakage inductance is bigger, and the energy of inductance memory storage is more.Such as What Schultz etc. was instructed, it may be desirable to larger magnetizing inductance, make in switching power converter so as to be better achieved Replace the advantage of discrete inductor with coupling inductor.On the other hand, leakage inductance is generally had in the range of relatively small value. Specifically, leakage inductance must be sufficiently large, and to avoid excessive ripple current amplitude, but should not arrive greatly again makes converter transient state Response is deteriorated.

The content of the invention

In embodiment, a kind of coupling inductor array includes magnetic core and N number of winding, wherein, N is greater than one integer. Magnetic core has relative the first side and the second side, linear interval distance definition between the first side and the second side length of magnetic core Degree.N number of winding passes through the magnetic core in the longitudinal direction at least in part, and each of N number of winding around accordingly around Group axle forms ring in magnetic core.Each winding axle is approximately perpendicular to length direction, and each winding axle can with each other Winding axle is parallel but offsets.Each winding has relative first at least extending towards the first side of magnetic core and the second side respectively End and the second end.

In embodiment, multiphase switching power converter includes coupling inductor and N number of switching circuit, wherein, N is big In one integer.Coupling inductor includes the magnetic core with the first relative side and the second side, and the first side and the second side it Between the linear interval distance definition length of magnetic core.N number of winding passes through magnetic core, and N in the longitudinal direction at least in part Each of individual winding forms ring around corresponding winding axle in magnetic core.Each winding axle is approximately perpendicular to length direction, and And other winding axles of each winding axle and each are parallel but offset.Each winding have at least respectively towards the first side of magnetic core and The relative first end and the second end that second side extends.Each switching circuit be suitable to make in N number of winding it is corresponding around The first end of group switches between at least two different voltage levels.

In embodiment, a kind of electronic installation includes integrated circuit package body, be contained in integrated circuit package body half Conductor tube core and it is contained in integrated circuit package body and is electrically coupled to the coupling inductor of semiconductor element.Coupling inductor Including the magnetic core with the first relative side and the second side, linear interval distance definition between the first side and the second side magnetic core Length.Coupling inductor also includes passing through in the longitudinal direction at least in part N number of winding of magnetic core, wherein, N is greater than one Integer.Each of N number of winding forms ring around corresponding winding axle in magnetic core, and each winding axle is approximately perpendicular to Length direction, and other winding axles of each winding axle and each are parallel but offset.Each winding has at least respectively towards magnetic The relative first end and the second end that first side of core and the second side extend.

In embodiment, a kind of coupling inductor array has length, width and height.Coupling inductor array include by Multiple windings in the one chip magnetic core and embedded one chip magnetic core of the magnetic material formation with Distributed gaps.Each Winding forms the winding ring of a corresponding circle or multiturn around corresponding winding axle, and each winding axle prolongs in the height direction Stretch.The area surrounded by winding ring of one chip magnetic core can be more than the area of the one chip magnetic core outside winding ring, such as exist Pass through finding during cross-section coupling inductor array in short transverse.

In embodiment, include that the method for the coupling inductor array of magnetic core is comprised the following steps for being formed, wherein institute State magnetic core and be embedded in nonmagnetic structures therein with least one：(1) at least two conductor layers are set in the height direction On core portion, so that conductor layer is at least partially formed at least two winding rings, finding when such as observing in the height direction； (2) one or more nonmagnetic structures are arranged on core portion and outside winding ring, when such as observing in the height direction Finding；And be arranged on magnetic material in core portion, conductor layer and one or more nonmagnetic structures by (3).

In embodiment, a kind of coupling inductor array with length, width and height is included by between distribution One chip magnetic core, the first and second windings and low magnetic permeability magnetic texure that one or more magnetic material of gap is formed.The One and second winding form corresponding first and second winding turns, and around the public winding axle for extending in the height direction One and second in the embedded one chip magnetic core of each of winding turns.Low magnetic permeability magnetic texure insertion one chip magnetic core in and around Public winding axle forms ring.Low magnetic permeability magnetic texure in the height direction separates the first and second winding turns, and low magnetic Conductance magnetic texure is formed by the magnetic conductivity magnetic material lower than forming one or more magnetic material of one chip magnetic core.

In embodiment, a kind of coupling inductor array with length, width and height is included by between distribution One chip magnetic core, the first winding and the second winding that one or more magnetic material of gap is formed.First winding is embedded in one chip In magnetic core, and the first winding forms one or more first winding turns around the corresponding windings axle for extending in the height direction. Each winding axle in the direction of the width open with each by other winding axle offsets.In second winding insertion one chip magnetic core, and the Two windings form corresponding second winding turns for each of one or more first winding turns.Each second winding turns and its Corresponding first winding turns collective surrounds the corresponding common portion of one chip magnetic core, and cross-section is such as passed through in the height direction Finding during coupling inductor array.

Brief description of the drawings

Fig. 1 shows the perspective view of the coupling inductor array according to embodiment.

Fig. 2 shows the perspective view of Fig. 1 coupling inductor arrays, wherein, the magnetic core of coupling inductor array is illustrated as Transparent.

Fig. 3 shows the top plan view of Fig. 1 coupling inductor arrays for eliminating top board.

Fig. 4 shows and eliminates top board and the battle array of Fig. 1 coupling inductors with the winding ring longer than in Fig. 3 embodiment The top plan view of the alternate embodiment of row.

Fig. 5 shows and eliminates top board and the battle array of Fig. 1 coupling inductors with the winding ring smaller than in Fig. 3 embodiment The top plan view of the alternate embodiment of row.

Fig. 6 shows the alternate embodiment for eliminating top board and Fig. 1 coupling inductor arrays with circular winding ring Top plan view.

Fig. 7 shows the sectional view of Fig. 1 coupling inductor arrays.

Fig. 8 shows the sectional view of the alternate embodiment of Fig. 1 coupling inductor arrays including coupling tooth.

Fig. 9 shows the replacement of Fig. 1 coupling inductor arrays including leakage tooth (leakage teeth) and coupling both teeth The sectional view of embodiment.

Figure 10 shows another alternate embodiment of Fig. 1 coupling inductor arrays including leakage tooth and coupling both teeth Sectional view.

Figure 11 shows including leakage tooth, coupling tooth and couples the Fig. 1 for coupling the non-magnetic spacer body that tooth separates with top board The sectional view of the alternate embodiment of inductor array.

Figure 12 shows the signal of the three-phase step-down converter of the coupling inductor array including Fig. 1 according to embodiment Figure.

Figure 13 shows should for the coupling inductor array of Fig. 1 to be applied into multi-phase and step-down converter according to embodiment A kind of possible printed circuit board (PCB) area of coverage in.

Figure 14 show according to the similar with the coupling inductor array of Fig. 1 of embodiment but wherein winding the second end electricity Coupled to the perspective view of the coupling inductor array of public tongue piece.

Figure 15 is shown according to embodiment for the coupling inductor array of Figure 14 to be applied into multi-phase and step-down converter A kind of possible printed circuit board (PCB) area of coverage in.

It is have substantially that Figure 16 is shown according to the similar with the coupling inductor array of Fig. 1 of embodiment but wherein winding The perspective view of the coupling inductor array of the wire winding in the upper section for being arc.

Figure 17 is shown according to embodiment for the coupling inductor array of Figure 16 to be applied into multi-phase and step-down converter A kind of possible printed circuit board (PCB) area of coverage in.

Figure 18 shows that similar with the coupling inductor array of Figure 16 according to embodiment but wherein winding overhang is from relative The perspective view of coupling inductor array that extends out of core side.

Figure 19 is shown according to embodiment for the coupling inductor array of Figure 18 to be applied into multi-phase and step-down converter A kind of possible printed circuit board (PCB) area of coverage in.

Figure 20 shows the perspective view of the double winding coupling inductor array according to embodiment.

Figure 21 shows that the replacement for eliminating top board and Figure 20 coupling inductor arrays with circular winding ring is implemented The top plan view of example.

Figure 22 shows and eliminates top board and Figure 20 coupling inductor arrays with the winding formed by conducting film The top plan view of alternate embodiment.

But Figure 23 is shown according to the similar with the coupling inductor array of Fig. 1 in its top surface and bottom table of embodiment The perspective view of the upper coupling inductor array with weld tab in both faces.

Figure 24 shows the electronic installation according to embodiment.

Figure 25 shows another electronic installation according to embodiment.

Figure 26 is that the side of coupling inductor in the prior art for include the scalariform magnetic core formed by ferrite magnetic material is stood View.

Figure 27 shows the side cross-sectional, view of prior art magnetic device.

Figure 28 shows the cross-sectional top view of Figure 27 prior art magnetic devices.

Figure 29 is shown in which the cross-sectional top view of the magnetic device of winding close proximity.

Figure 30 is the coupling of the one chip magnetic core including being formed by the magnetic material with Distributed gaps according to embodiment Close the top plan view of inductor array.

Figure 31 is the side elevation view of Figure 30 coupling inductor arrays.

Figure 32 is the sectional view obtained along the line 30A-30A of Figure 30.

Figure 33 is the sectional view obtained along the line 31A-31A of Figure 31.

Figure 34 is the sectional view of magnetic device.

Figure 35 shows the magnetic device of Figure 34 of the electric model of equal value with projection thereon.

Figure 36 is the electric model of the magnetic flux for representing the section for flowing through Figure 34 magnetic devices.

Figure 37 is the chart for showing the relative magnetic flux density in the section of Figure 34 magnetic devices.

Figure 38 is the top plan view of the coupling inductor array including multilayer film magnetic core according to embodiment, multilayer film magnetic Core is included in the nonmagnetic structures in one chip magnetic core.

Figure 39 is the side elevation view of Figure 38 coupling inductor arrays.

Figure 40 is the sectional view of Figure 38 coupling inductor arrays obtained along the line 38A-38A of Figure 38.

Figure 41 is the sectional view of Figure 38 coupling inductor arrays obtained along the line 39A-39A of Figure 39.

Figure 42 is cutting including the coupling inductor array of nonmagnetic structures that is formed by conductive material according to embodiment Face figure.

Figure 43 to show and include thering is the magnetic core for being embedded in nonmagnetic structures therein for being formed according to embodiment The method of coupling inductor array.

But Figure 44 is according to the similar with than Figure 33 coupling inductor with the coupling inductor array of Figure 33 of embodiment The sectional view of the coupling inductor array of the bigger winding ring of the winding ring of array.

Figure 45 is the reproduction of the sectional view of Figure 33.

Figure 46 shows the sectional view of the staggeredly coupling inductor array of engagement in the absence of winding according to embodiment.

Figure 47 shows the top plan view of the staggeredly coupling inductor array of engagement including winding according to embodiment.

Figure 48 shows the side elevation view of Figure 47 coupling inductor arrays.

Figure 49 shows the sectional view of Figure 47 coupling inductor arrays obtained along the line 47A-47A of Figure 47.

Figure 50 shows the sectional view of Figure 48 coupling inductor arrays obtained along the line 48A-48A of Figure 48.

Figure 51 is to include two perspective views of the coupling inductor array of the winding of vertical stacking according to embodiment.

Figure 52 is the top plan view of Figure 51 coupling inductor arrays.

Figure 53 is the side elevation view of Figure 51 coupling inductor arrays.

Figure 54 is the vertical section figure of Figure 51 coupling inductor arrays.

Figure 55 is the horizontal sectional view of Figure 51 coupling inductor arrays.

Figure 56 shows Figure 51 coupling inductor arrays without magnetic core in an exploded view.

Figure 57 is the vertical section figure similar with Figure 54, simply this sectional view show the approximate magnetic in one chip magnetic core Road all.

Figure 58 is the perspective view of the coupling inductor array that multiple winding turns are formed according to wherein each winding of embodiment.

Figure 59 is the top plan view of Figure 58 coupling inductor arrays.

Figure 60 is the side elevation view of Figure 58 coupling inductor arrays.

Figure 61 is the vertical section figure of Figure 58 coupling inductor arrays.

Figure 62 is another vertical section figure of Figure 58 coupling inductor arrays.

Figure 63 is the horizontal sectional view of Figure 58 coupling inductor arrays.

Figure 64 is another horizontal sectional view of Figure 58 coupling inductor arrays.

Figure 65 shows the winding of Figure 58 coupling inductor arrays, and it is separated with the magnetic core of the coupling inductor array.

But Figure 66 is according to the similar with the coupling inductor array of Figure 58 with being electrically coupled including parallel connection of embodiment The perspective view of the coupling inductor array of the winding of multiple electric conductors.

Figure 67 shows the winding of Figure 66 coupling inductor arrays, and it is separated with the magnetic core of the coupling inductor array.

But Figure 68 is shown according to the similar with the coupling inductor array of Figure 67 with including electricity staggeredly of embodiment The perspective view of the coupling inductor array of the winding of conductor.

Figure 69 shows the winding of Figure 68 coupling inductor arrays, and it is separated with the magnetic core of the coupling inductor array.

But Figure 70 be according to each winding similar with the coupling inductor array of Figure 66 of embodiment only formed it is single around The perspective view of the coupling inductor array of group circle.

Figure 71 shows the winding of Figure 70 coupling inductor arrays, and it is separated with the magnetic core of the coupling inductor array.

Figure 72 is the vertical section figure of Figure 70 coupling inductor arrays.

But Figure 73 be according to each winding similar with the coupling inductor array of Figure 68 of embodiment only formed it is single around The perspective view of the coupling inductor array of group circle.

Figure 74 shows the winding of the coupling inductor array of Figure 73, and it is separated with the magnetic core of coupling inductor array.

Figure 75 is the vertical section figure of Figure 73 coupling inductor arrays.

Figure 76 is the sectional view similar with the sectional view of Figure 62 according to embodiment, simply this sectional view show coupling electricity The one chip magnetic core for being divided into some sections of sensor array.

Figure 77 is the sectional view similar with the sectional view of Figure 72 according to embodiment, but this sectional view show coupling electricity Sensor array is divided into six one chip magnetic cores of layer.

Figure 78-83 is respectively the top plan view of the layer 1-6 of Figure 77 coupling inductor arrays.

Figure 84 is the sectional view similar with the sectional view of Figure 75 according to embodiment, simply this sectional view show coupling electricity Sensor array is divided into six one chip magnetic cores of layer.

Figure 85-90 is respectively the top plan view of the layer 1-6 of Figure 84 coupling inductor arrays.

Specific embodiment

The coupling that can serve as the energy stores inductor in (such as) multiphase switching power converter is disclosed herein Inductor array.Such coupling inductor can realize one or more significant advantages, as discussed below.For example, Some embodiments of these inductors realize relatively strong magnetic coupling, relatively large electric leakage inductance value in small package size And/or relatively low core loss.As another example, in the design and/or manufacturing process of some embodiments, can be easy Ground adjustment leakage inductance and/or magnetizing inductance.In the middle of following disclosures, can by using in bracket numeral (for example, around Group 118 (1)) refer to project particular instance, without parenthesized numeral then refer to it is any as project (for example, winding 118)。

Fig. 1 shows the perspective view of coupling inductor array 100.Array 100 includes the magnetic core formed by magnetic material 102, if the magnetic film of the iron powder materials or dried layer in magnetic material such as Ferrite Material, adhesive.Magnetic core 102 includes setting Top board 104 on base plate 106 and with relative the first side 108 and the second side 110, the first side 108 and the second side 110 every Open linear interval distance, linear interval distance definition core length 112.Magnetic core 102 also has the width vertical with length 112 Degree 114 and the height 116 vertical with both length 112 and width 114.Fig. 2 shows that magnetic core 102 is illustrated as transparent array 100.Fig. 3 shows the top plan view of the array 100 for eliminating top board 104.

During coupling inductor array 100 also includes being arranged on magnetic core 102, two between top board 104 and base plate 106 or More Multiple coil 118.Although array 100 to be shown as the accompanying drawing of the disclosure have three windings 118 it should be appreciated that can be by this The array of sample is revised as any amount of winding for having more than 1.In other words, coupling inductor array disclosed herein can be fitted In with N number of winding, wherein, N is any integer for being more than.

Each winding 118 passes through magnetic core 102 on length direction 112, and ring 120 is formed in magnetic core 102.Typical real Apply in example, ring 120 is about plane.Although ring 120 is illustrated as forming single turn, ring 120 can be alternatively formed two Or more circle, with promote low magnetic flux density and correlation low core loss.The first and second relative ends 122 of winding 118, 124 extend towards first and second side 108,110 of core respectively.Each first end 122 forms corresponding first weld tab 123, and each the second end 124 forms corresponding second weld tab 125.Weld tab 123/125 is configurable for Attachment is installed to the surface of printed circuit board (PCB) (PCB).

Each ring 120 winds around corresponding winding axle 126, and each winding axle 126 on width 114 substantially Other winding axles 126 are parallel with each, but offset.Correspondingly, respective regions 128 of each ring in magnetic core 102, and And each ring region 128 along the width 114 and each of magnetic core, other ring regions 128 are not overlap.Such construction causes coupling electricity Sensor array 100 has " negative " or negation magnetic coupling.It is anti-magnetic-coupled to be characterised by array 100 (such as) by a first direction On flow through the increasing electric current of amplitude of one of winding 118 and flow through the width of remaining winding 118 in a first direction to generate The increasing electric current of degree.For example, will induct from the increasing electric current of the amplitude in the inflow of the first side of core 108 winding 118 (2) Go out the increasing electric current of the amplitude flowed into from the first side of core 108 in winding 118 (1), 118 (3).

The construction of array 100 promotes big magnetizing inductance value and electric leakage inductance value and low magnetic resistance flux paths.It is specific and Speech, winding 118 is longer than on width 114 typically on length direction 112 so that the big part of winding 118 is tight It is close adjacent, and provide path wide to couple the magnetic flux of adjacent winding.In figure 3 by solid arrow 130 represent coupling it is adjacent around The magnetic flux of group, is only marked to some of which for clarity of explanation.Such path wide is low for magnetic flux is provided Magnetic circuits, thereby promote the strong magnetic coupling and low core loss between winding.

Additionally, magnetic core 102 is typically extended to beyond ring 120, with cause with each ring region in ring identical plane 128 areas for being less than magnetic core 102.As a result, magnetic core 102 is major part or the leakage of whole circumference of the circumference around each ring 120 Magnetic flux provides path, wherein, leakage magnetic flux is to flow through an electric current for winding 118 for not coupling remaining winding 118 by change And the magnetic flux for generating.Arrow 132 represents leakage magnetic flux by a dotted line in figure 3, for clarity of explanation only to therein one It is marked.As a result, each winding 118 has relatively wide low magnetic resistance leakage magnetic flux path, thereby promotes low core loss And the big electric leakage inductance value related to winding 118.

In the design and/or manufacturing process of coupling inductor array 100 can by the size of controling winding 118 and/ Or shape, and/or magnetic core 102 extend to the degree outside winding ring 120 and magnetizing inductance and leakage inductance are individually controlled. Specifically, can be improved by increasing the tight adjacent part of winding 118 and/or reducing the spacing between winding 118 Magnetizing inductance.For example, Fig. 4 show including winding ring 420 replace winding ring 120 alternate embodiment it is similar with Fig. 3 Top plan view.Winding ring 120 of the winding ring 420 than Fig. 3 embodiment on length direction 112 is long.Correspondingly, it is assumed that other sides If face is equivalent, Fig. 4 embodiments will have the magnetizing inductance bigger than Fig. 3 embodiment.But, winding ring 420 it is relatively long Length reduce magnetic core 102 can be used for couple leakage magnetic flux part.Thus, it is supposed that if other side is equivalent, Fig. 4 is implemented Example will have the electric leakage inductance value smaller than Fig. 3 embodiment.

Used as another example, Fig. 5 shows including winding ring 520 to replace alternate embodiment and Fig. 3 of winding ring 120 Similar sectional view.Winding ring 520 is smaller than the winding ring 120 of Fig. 3 embodiment.Thus, compared with Fig. 3 embodiments, in Fig. 5 Magnetic core 102 has bigger being partially in outside winding ring in embodiment so that can be used to leak in the greater part of Fig. 5 embodiment SMIS Magnetic flux.Thus, it is assumed that if other side is equivalent, Fig. 5 embodiments will have the electric leakage inductance value bigger than Fig. 3 embodiment.But, Compared with Fig. 3 embodiments, the tight adjacent part of winding ring is smaller in Fig. 5 embodiments.Thus, it is assumed that other side If equivalent, Fig. 5 embodiments will have the magnetizing inductance smaller than Fig. 3 embodiment.

Embodiment discussed above has rectangle winding ring, and it helps to make the tight adjacent part of each ring to maximize, Thus big magnetizing inductance value is promoted.But, winding ring can have other shapes.For example, Fig. 6 is shown including circular winding Ring 620 replaces the sectional view similar with Fig. 3 of the alternate embodiment of rectangle winding ring 120.The round-shaped length for reducing ring Degree, thereby promotes low winding resistance.But, thus the round-shaped tight adjacent part for also reducing winding ring 620 drops Low magnetizing inductance.

The construction of magnetic core 102 can also be changed in the design of coupling inductor array 100 and/or manufacturing process, to control Magnetizing inductance processed and/or leakage inductance.Fig. 7 shows the sectional view of the coupling inductor array 100 obtained along the line segment A-A of Fig. 2. Part 134 in winding ring 120 is both leakage magnetic flux and the magnetic flux for coupling winding 118 offer path, and the portion outside winding ring 120 Divide 136 for leakage magnetic flux provides path.The cross-sectional area of magnetizing inductance and leakage inductance all substantially to part 134 is proportional, and Cross-sectional area of the leakage inductance also substantially to part 136 is proportional.Thus, it is possible to pass through the width 135 of (such as) adjustment member 134 To adjust magnetizing inductance and leakage inductance, and electric leakage individually can be adjusted by the width 137 of (such as) adjustment member 136 Sense.Each example of width 135 is not necessarily all identical, and each example of width 137 is also not necessarily all identical.Example Such as, in certain embodiments, a part 136 has the width 137 bigger than other parts 136, to set up asymmetric electric leakage Inductance value.

Magnetizing inductance and leakage inductance can also be made together by the spacing 139 changed between top board and base plate 104,106 Change.In general, spacing 139 is smaller, magnetizing inductance and leakage inductance are bigger.

Furthermore, it is possible to control magnetizing inductance and/or leakage inductance by the magnetic resistance of control section 134 and/or 136.For example, Magnetic material can be added to reduce the magnetic resistance of leakage magnetic flux path and the flux paths of coupling winding 118 by part 134, come Improve magnetizing inductance and leakage inductance.It is likewise possible to add magnetic material to reduce the magnetic of leakage magnetic flux path by part 136 Hinder to improve leakage inductance.

Fig. 8 shows the sectional view similar with Fig. 7 of the alternate embodiment including coupling tooth 838, and coupling tooth 838 is in top board It is arranged between 104 and base plate 106 in the part 134 in winding 120.The coupling tooth 838 formed by magnetic material reduces portion The magnetic resistance of the flux paths divided in 134, thereby increases magnetizing inductance and leakage inductance.As another example, Fig. 9 show including The sectional view similar with Fig. 7 of the alternate embodiment of coupling tooth 838 and leakage tooth 940 in part 134, leakage tooth 940 is in top board 104 It is arranged on and base plate 106 between in part 136.The magnetic flux that the same leakage tooth 940 formed by magnetic material is reduced in part 136 The magnetic resistance of path, thereby increases electric leakage inductance value.Leakage tooth 940 (2), each of 940 (3) is arranged between adjacent winding ring, And leak the opposed end that tooth 940 (1), 940 (4) is separately positioned on the row of winding ring.Form the magnetic of coupling tooth 838 and leakage tooth 940 Property material be not necessarily identical and can be individually selected, to realize expected magnetization and electric leakage inductance value.For example, in some realities Apply in example, coupling tooth 838 is formed by the material with the magnetic conductivity higher than leakage tooth 940.Alternatively, coupling tooth 838 and leakage tooth 940 Can be formed by same magnetic material, to simplify the construction of core 102, and two kinds of teeth even can by with top board and base plate 104, 106 identical materials are formed, and are constructed with further simplifying core.In certain embodiments, coupling tooth 838 and/or winding tooth are formed 940 magnetic material is non-homogeneous.

One or more can be coupled by tooth 838 and top board 104 and/or base plate by the gap filled with nonmagnetic substance 106 separate, to be controlled to magnetizing inductance and leakage inductance and/or help avoid magnetic saturation.For example, such gap can be with Filled with air, plastics, paper and/or adhesive.It is likewise possible to by filled with nonmagnetic substance (for example air, plastics, Paper and/or adhesive) gap by one or more leakage teeth 940 separate with top board 104 and/or base plate 106, with control leak electricity Sense.For example, Figure 10 shows the alternate embodiment including the coupling tooth 1038 separated by the air gap 1042 and top board 104 The sectional view similar with Fig. 7.The embodiment of Figure 10 also includes the leakage tooth 1040 separated by the air gap 1044 and top board 104. The thickness of the air gap 1042 and 1044 is optionally by single optimization and need not be identical.Used as another example, Figure 11 shows The sectional view similar with Fig. 7 of alternate embodiment, in the alternate embodiment, by the interval body formed by nonmagnetic substance 1146 separate each coupling tooth 1138 with top board 104, and will by corresponding the air gap 1144 and interval body 1146 Each leakage tooth 1140 separates with top board 104.In certain embodiments, interval body 1146 by with by the lap of winding 118 every The insulator (not shown) identical material opened is formed.

In certain embodiments, magnetic core 102 is by material (such as iron powder in adhesive with distributed the air gap End) formed.In such embodiments, can also be adjusted with changing distributed air intermittence matter by changing material composition Whole leakage inductance and/or magnetizing inductance.

A kind of possible application of coupling inductor array 100 is switching power converter application, including but not limited to Multi-phase and step-down converter, multiphase boost converter or multiphase type of voltage step-up/down converter.For example, Figure 12 shows coupling inductor battle array A kind of possible application of the row 100 in multi-phase and step-down converter.Specifically, Figure 12 is shown using coupling inductor array 100 as the three-phase step-down converter 1200 of coupling inductor schematic diagram.The first end 122 of each winding is electrically coupled to phase The switching node Vx for answering, and the second end 124 of each winding is electrically coupled to public output node Vo.Corresponding switching circuit 1248 are electrically coupled to each switching node Vx.Each switching circuit 1248 is electrically coupled to input port 1250, and input port 1250 are electrically coupled to power supply 1252 again.Output port 1254 is electrically coupled to output node Vo.Each switching circuit 1248 and corresponding Inductor be collectively referred to as " phase " 1255 of converter.Thus, multi-phase and step-down converter 1200 is three phase converer.

Controller 1256 causes each switching circuit 1248 to make its corresponding winding first end 122 repeatedly in power supply Switched between 1252 and ground, its first end is switched between two different voltage levels, with from electricity Source 1252 is to the load (not shown) transfer power for being electrically coupled to the two ends of output port 1254.Controller 1256 typically causes to be cut Change circuit 1248 to be switched over of a relatively high frequency (such as 100kHz or higher), to promote low ripple current amplitude and fast Fast transient response, and ensure to switch the frequency that the noise inducted is on the appreciable frequency of people.

Each switching circuit 1248 includes control switching device 1258, and it is under the order of controller 1256 alternately at it Switch between conduction state and non-conductive state.Each switching circuit 1248 also includes current following device 1260, and it is suitable in switching Circuit is the electric current for flowing through its corresponding windings 118 when controlling switching device 1258 by its conductive state to non-conductive state Path is provided.Current following device 1260 can be diode as depicted, be simplified with promotion system.But, it is real in some replacements Apply in example, current following device 1260 can be supplemented or substituted by the switching device worked under the order of controller 1256, to change Enter converter performance.For example, the diode in current following device 1260 can be supplemented by switching device, to reduce current following device 1260 forward drop.Under the background of the disclosure, switching device includes but is not limited to bipolar junction transistor, field-effect crystalline substance Body pipe is (for example, N-channel or P-channel metal-oxide-semiconductor field-effect transistor, junction field effect transistor, metal are partly led Body field-effect transistor), insulated gate bipolar junction transistor, thyristor or silicon controlled rectifier.

Controller 1256 is optionally configured to and switching circuit 1248 is controlled, to adjust multi-phase and step-down converter 1200 one or more parameters, such as input voltage, input current, input power, output voltage, output current or output work Rate.Step-down converter 1200 typically comprises one or more input capacitors for being electrically coupled to the two ends of input port 1250 1262, for providing the ripple component of the input current of switching circuit 1248.Additionally, one or more output capacitors 1264 are logical The two ends of output port 1254 often are electrically coupled to, so that the ripple current shunting of the generation of switching circuit 1248.

Step-down converter 1200 can be revised as the phase with varying number, and can correspondingly by coupling inductor Array 100 is revised as the winding 118 with respective amount.Furthermore, it is possible to step-down converter 1200 is revised as to be incorporated to coupling electricity Two or more examples of sensor array 100.For example, an alternate embodiment of converter 1200 include six phases 1255 and Two examples of coupling inductor array 100.First example of array 100 serves first to third phase, and array 100 Second example serves the 4th to the 6th phase.Step-down converter 1200 can also be revised as with different topological structures, example Such as, the topological structure with multiphase boost converter or multiphase type of voltage step-up/down converter, or the topological structure with isolation, for example Flyback converter or forward converter.

Figure 13 shows printed circuit board (PCB) (PCB) area of coverage 1300, and it is that coupling inductor array 100 is applied into multiphase A kind of possible area of coverage in step-down converter application (for example, step-down converter 1200 (Figure 12)).The area of coverage 1300 includes For by each first weld tab 123 coupled to the pad 1366 of corresponding switching node Vx and for by each the second weldering Connect pad 1368 of the tongue piece 125 coupled to public output node Vo.It is all of to cut due to the anti-magnetic-coupled reason of array 100 Node Vx is changed all on the first side 1308 of the area of coverage 1300, the topological simplicity of the PCB including the area of coverage 1300 is this facilitated.

In some alternative embodiments, the second end 124 of each winding is electrically coupled to common conductor, such as public tongue Piece, is connected with the Low ESR provided to external circuit.For example, Figure 14 shows the perspective view of coupling inductor array 1400, battle array Row 1400 are identical with array 100 (Fig. 1), simply the second end 124 of wherein winding be electrically coupled to public tongue piece 1470 rather than Form corresponding weld tab.Tongue piece 1470 is for example configurable for installing attachment to the surface of printed circuit board (PCB).Figure 15 shows The PCB areas of coverage 1500 are gone out, it is that coupling inductor array 1400 is applied into multi-phase and step-down converter application (such as step-down turn Parallel operation 1200 (Figure 12)) in a kind of possible area of coverage.The area of coverage 1500 includes being used for each coupling of the first weld tab 123 It is bonded to the pad 1566 of corresponding switching node Vx and the weldering for public tongue piece 1470 to be coupled to public output node Vo Disk 1568.It is able to recognize that public tongue piece 1470 provides the large surface region for being connected to PCB pads from Figure 15, thus promotees The Low ESR connection entered between tongue piece and PCB, and help to cool down inductor 1400 and neighbouring part.

Although magnetic core 102 is shown as including discrete top board and base plate 104,106, magnetic core 102 can have other Construction.For example, top board and base plate 104,106 can be alternatively the parts of single-piece magnetic cell, the magnetic cell optionally includes coupling Tooth 838 and/or leakage tooth 940.Used as another example, in some alternative embodiments, magnetic core 102 is that have the winding being embedded 118 single-piece one-piece construction, such as core by the way that the composition including the magnetic material in adhesive is moulded and formed. In such embodiments, between each core section do not exist gap or interval, and can by change magnetic material into Divide and/or change magnetizing inductance and leakage inductance around set constructor, as discussed above.As another example, in some replacements In embodiment, magnetic core 102 is formed by setting multiple magnetic material layers or magnetic material film.In such embodiments, Nonmagnetic substance is optionally located at least a portion of part 134 and/or 136, to set up similar to the gap in Figure 10 1042nd, 1044 gap.Additionally, in some alternative embodiments, magnetic core 102 is entirely around winding ring 120.Including coupling tooth 838 and/or leakage tooth 940 embodiment in, such tooth can be discrete magnetic cell and/or be another portion of magnetic core 102 Point.For example, in certain embodiments, at least one of coupling tooth 838 and/or leakage tooth 940 are top board 104 or base plate 106 Part.

For example, winding 118 is formed separately with core 102, and next for example before engagement top board 104 and base plate 106 It is arranged in core.In by the embodiment for being moulded and being formed core 102 to the composition including the magnetic material in adhesive, For example, winding 118 is formed separately, and it was placed in mould before to mould adding ingredient.Can also be by magnetic core 102 Part or the substrate that is arranged on magnetic core 102 apply conducting film, such as by applying such as silver-colored thick-film conductor material, come Form winding 118.Dielectric film can be arranged between adjacent conductive film layer, be shorted with the different piece for avoiding winding 118 To together.During one or more in winding 118 are the embodiment of multicircuit winding, magnetic material optionally makes two or more Winding turns are spaced from each other, and extra path is provided with for leakage magnetic flux, thus promote big electric leakage inductance value.

Array 100 and 1400 is shown to have the winding 118 for paper tinsel winding.The square-section of paper tinsel winding contributes to reduction to become The loss that skin effect is inducted, thus promote the low winding resistance of high frequency treatment.But, coupling inductor array disclosed herein is not limited In paper tinsel winding.For example, winding 118 can alternatively have arc or square-section, or can be led by a plurality of The cable that line is formed.Although additionally, array 100 and 1400 is shown as including to be configurable for install attachment to the surface of PCB Weld tab, but can be to be revised as being otherwise connected to external circuit by coupling inductor array disclosed herein, For example by using through hole connect or by coupled to socket come externally connected circuit.

For example, Figure 16 shows the perspective view of coupling inductor array 1600, array 1600 and the (figure of coupling inductor 100 1) it is similar, simply wherein substitute paper tinsel winding 118 with the wire winding 1618 with substantially arc section.In figure 16, magnetic core 102 Be illustrated as it is transparent, to show winding 1618.Relative first end and the second end 1622,1624 the difference shape of winding 1618 Into the first and second through-hole pins 1623,1625 of the basal surface 1672 for extending through magnetic core 102.Figure 17 shows that PCB is covered Area 1700, it is that coupling inductor array 1600 is applied into multi-phase and step-down converter application (for example, step-down converter 1200 (Figure 12)) in a kind of possible area of coverage.The area of coverage 1700 includes being used for each through-hole pins 1623 coupled to corresponding The through hole 1766 of switching node Vx and the through hole 1768 for through-hole pins 1625 to be coupled to public output node Vo.

Used as another example, Figure 18 shows the perspective view of coupling inductor array 1800, itself and coupling inductor array 1600 (Figure 16) are similar to, but including the wire winding 1818 with relative first end and the second end 1822,1824, first End and the second end 1822,1824 extended out from core side 108,110 respectively with formed the first and second through-hole pins 1823, 1825.Figure 19 shows the PCB areas of coverage 1900, and it is that coupling inductor array 1800 is applied into multi-phase and step-down converter application A kind of possible area of coverage in (such as step-down converter 1200 (Figure 12)).The area of coverage 1900 is included for each through hole to be drawn Pin 1823 is coupled to the through hole 1966 of corresponding switching node Vx and for through-hole pins 1825 to be coupled into public output section The through hole 1968 of point Vo.Because the winding of array 1800 extends out from the side of magnetic core 102, rather than from the bottom of magnetic core 102 Portion extends out, thus array 1800 is generally not so good as array 1600 (Figure 16) in mechanical robustness.But, through-hole pins The fact that the 1823rd, 1825 extend out from magnetic core side 108,110 can eliminate PCB conductive traces are carried out below magnetic core 102 The demand of wiring, thus shortens trace length.Shorten trace length and reduce trace impedance and dependent loss again.

In only two embodiments of winding, winding ring can be with least partially overlapped, and thereby assisting in covers inductor Cover region size is minimized.For example, Figure 20 shows the double winding coupling inductor array including least partially overlapped winding ring 2000 perspective view.Coupling inductor array 2000 includes magnetic core 2002, and magnetic core 2002 includes top board and base plate 2004,2006. Magnetic core 2002 has the first relative side and the second side 2008,2010, and the first side and the second side 2008,2010 separate and define core The linear interval distance of length 2012.Magnetic core 2002 also have the width 2014 vertical with length 2012 and with length 2012 and The vertical height 2016 of both width 2014.In fig. 20, magnetic core 2002 is illustrated as transparent.

Coupling inductor array 2000 is additionally included between top board and base plate 2004,2,006 two be arranged in magnetic core 2002 Individual winding 2018.Although showing winding 2018 (2) by a dotted line to help observer to distinguish winding 2018 (1) and 2018 (2), It is that two windings are generally constructed with identical in reality.Each winding 2018 passes through magnetic core on length direction 2012 2002, and ring 2020 is formed in magnetic core 2002.In an exemplary embodiment, ring 2020 is usually plane.Although the quilt of ring 2020 It is shown as forming single turn, but ring 2020 can be alternatively formed two or more circles, to promote low magnetic flux density low with correlation Core loss.The first relative side of winding 2018 and the second side 2022,2024 respectively towards the first side of core and the second side 2008, 2010 extend.Each first end 2022 forms corresponding first through hole pin 2023, and each the second end 2024 is formed Corresponding second through-hole pins 2025.In some alternative embodiments, winding overhang 2022,2024 is suitable to be otherwise attached to To external circuit.For example, in some alternative embodiments, winding overhang 2022,2024 forms corresponding weld tab, the weldering Tongue piece is connect to be configurable for that attachment is installed to the surface of PCB.

Each ring 2020 is around the winding of corresponding winding axle 2026.Ring 2020 winds in the opposite direction, anti-to obtain Magnetic coupling.It is such anti-magnetic-coupled to be characterised by that array 2000 (such as) flows into winding 2018 by from first side 2008 of core (1) the increasing electric current of amplitude is increasing to generate the amplitude that flows into winding 2018 (2) from first side 2008 of core Electric current.But other winding axles 2026 of each winding axle 2026 and each are almost parallel to be offseted on width 2014. Two rings 2020 partly overlap, so that the public domain 2028 that the two rings are surrounded in magnetic core 2002.Can be in coupling inductor By adjusting the overlapping degree of winding ring 2020 in the design and/or manufacturing process of array 2000, or in other words by adjustment The sizes in the region 2028 that two rings are surrounded and magnetizing inductance value and electric leakage inductance value are adjusted.Specifically, with winding Ring 2020 is separated from each other so that the reduction of the size of region 2028, leakage inductance will increase and magnetizing inductance will reduce.Conversely, with around To the size increase so that region 2028 is drawn close together, leakage inductance will reduce group ring 2020 and magnetizing inductance will increase.

Can also in the design of inductor and/or manufacturing process according to discussed above for Fig. 8-11 by way of Similar mode is added one or more coupling teeth and/or one or more leakage teeth and leakage inductance and/or magnetizing inductance is carried out Adjustment.For example, can by the region 2028 surrounded by two winding rings 2020 add connection top board and base plate 2004, 2006 leakage tooth and increase magnetizing inductance and leakage inductance.As another example, can be by adding connection outside region 2028 The coupling tooth of top board and base plate 2004,2006 and increase leakage inductance.Can also be in Array Design and/or manufacturing process by making With the technology similar with the technology discussed above for array 100, such as by changing size, the winding ring of winding ring 2020 2020 geometry, the spacing between the composition of magnetic core 2002 and/or top board and base plate 2004,2006 and change leakage inductance And/or magnetizing inductance.

For example, Figure 21 shows the top plan view of the coupling inductor array 2100 for eliminating top board.Array 2100 with The array 2000 of Figure 20 is similar to, simply array 2100 have be a substantially circular shape shape rather than it is generally rectangularly-shaped around Group ring 2120.The round-shaped length for helping to reduce winding 2118, thus reduces winding impedance.But, round-shaped reduction The lap of winding ring 2120, thus reduces magnetizing inductance and increases leakage inductance.Although winding shown in broken lines 2118 (2) to help observer to distinguish winding 2118 (1) and 2118 (2), but in practice, two windings are generally with identical Construction.Array 2100 also resides in relative winding overhang 2122,2124 and is electrically coupled to corresponding weldering with the difference of array 2000 Tongue piece 2123,2125 is connect, rather than formation through-hole pins.

Can be according to the structure with mode similar mode change magnetic core 2002 (Figure 20) discussed above for array 1000 Make.For example, top board and base plate 2004,2006 can be alternatively the parts of single-piece magnetic cell.As another example, replaced at some For in embodiment, magnetic core 2002 is that have the single-piece one-piece construction for being embedded in winding therein 2018, such as by including The core that the composition of the magnetic material in adhesive is moulded and formed.As another example, in some alternative embodiments, magnetic Core 2002 is formed by setting multiple magnetic material layers or magnetic material film.Additionally, in some alternative embodiments, magnetic Core 2002 is entirely around winding ring 2020.

Further, it is also possible to change the construction of winding 2018.For example, wire winding can be replaced with paper tinsel winding or conducting film 2018.For example, Figure 22 shows the top plan view of the coupling inductor array 2200 for eliminating top board.Array 2200 and Figure 20 Array 2000 it is similar, the simply winding 2218 including being formed by conducting film.The lap of at least winding 2218 is by example The dielectric film (not shown) that is such as arranged between the windings section of overlap and mutual insulating.Compared with array 2000, winding End 2222,2224 is electrically coupled to corresponding weld tab 2223,2225, rather than formation through-hole pins.

The construction of coupling inductor array disclosed herein promotes the low clearance of array, to allow to some embodiments Regard " chip-shaped " coupling inductor array as.For example, some embodiments have 0.8 millimeter or smaller of height 116 (Fig. 1).

The relatively low height of such array can allow it to be accommodated together with semiconductor element or semiconductor bar In integrated circuit package body, and optionally it is electrically coupled to semiconductor element or semiconductor bar.For example, some embodiments of array Can be contained in public integrated circuit package body with semiconductor element, but be physically separated from the tube core in packaging body.Additionally, Some other embodiments of coupling inductor array disclosed herein are for example by by some magnetic material layers and conductive material layer Setting is formed on a semiconductor die with forming magnetic core and winding respectively on a semiconductor die.Semiconductor element and coupling electricity Sensor array is optionally contained in public integrated circuit package body again, and coupling inductor is optionally electrically coupled to semiconductor Tube core.For example, Figure 24 is shown including integrated circuit package body 2402, the semiconductor being contained in integrated circuit package body 2402 The electronic installation 2400 of tube core 2404 and the coupling inductor 2406 being contained in integrated circuit package body 2402.Coupling inductance Device 2406 is electrically coupled to semiconductor element 2404, as shown in the symbol of dotted line 2408.As another example, for example, Figure 25 shows Go out including integrated circuit package body 2502, the semiconductor element being contained in integrated circuit package body 2,502 2504 and accommodated The electronic installation 2500 of the coupling inductor 2506 in integrated circuit package body 2502.Coupling inductor 2506 is arranged on partly leads On body tube core 2504, and coupling inductor 2506 is electrically coupled to semiconductor element 2504, as shown in the symbol of dotted line 2508.

Example discussed above shows and is arranged on coupling inductor array basal surface and the weldering on non-array top surface Connect tongue piece.In the application that array top surface is electrically isolated from each other is wished, such as in the optional heat sink feelings that set on the top Under condition, such construction can be favourable.

However, some alternate embodiments include weld tab on the top surface and basal surface of array.For example, Figure 23 shows The perspective view of coupling inductor array 2300 is gone out, array 2300 is similar with coupling inductor array 100 (Fig. 1), is into one Step includes the weld tab 2374,2376 being arranged on top surface 2378 and the weld tab being arranged on basal surface 2372 123 (invisible in the perspective view of Figure 23).

Applicant is also in addition, it is found that in magnetic core by the magnetic material with Distributed gaps (such as including in adhesive The material of Magnaglo) in the embodiment that is formed, it is necessary to great care winding geometry and relative winding position, with ensure around The notable magnetic coupling of group.Discuss as discussed above and in the document of Schultz, should in switching power converter Winding must be made in has strong magnetic coupling, to realize the advantage for using coupling inductor to replace multiple discrete inductors.

In order to help to recognize that must be made when using the magnetic core formed by Distributed gaps magnetic material special is examined Consider, coupling inductor 2600 in the prior art of Figure 26 is considered first, it includes the magnetic core 2602 formed by Ferrite Material, without It is the magnetic core formed by the magnetic material with distributed the air gap.Magnetic core 2602 is " scalariform " magnetic core, and it includes relative Terraced column (rail) 2604,2606 and three steps 2608.Corresponding winding 2610 winds around each step 2608.Such as magnetic neck Known to domain, ferrite magnetic material has relative permeability very high, and it is often in the range of 2000 to 3000, and And therefore ferrite magnetic material has low magnetic resistance.As a result, magnetic core 2602 have low magnetic resistance, and by flow through one or more around The magnetic flux of the electric current generation of group 2610 almost will completely be limited to magnetic core 2602.For example, the arrow 2612 in Figure 26 is symbolic How ground diagram almost will be flowed in magnetic core 2602 completely by the magnetic flux that the electric current for flowing through winding 2610 (2) is generated, to couple To winding 2610 (1) and 2610 (3).Therefore, even if between spacing 2614 between adjacent step or terraced column 2604 and 2606 Spacing 2616 is big, it is also possible to make winding 2610 that strong magnetic coupling to occur.

Magnetic device 2700 in the prior art shown in Figure 27 and Figure 28 is considered now, and it is included by the magnetic with Distributed gaps Property material formed one chip magnetic core 2702.Figure 27 shows the side cross-sectional, view of magnetic device 2700, and Figure 28 shows magnetic The cross-sectional top view of device 2700.Three windings 2704 are embedded into one chip magnetic core 2702, and each winding 2704 is formed Circular rings.Distributed gaps magnetic material has the magnetic conductivity bigger than air.But, Distributed gaps cause these magnetic materials With the much smaller magnetic conductivity of the magnetic conductivity than ferrite magnetic material.As a result, magnetic core 2702 has relatively large magnetic resistance, and And the magnetic flux generated by the electric current for flowing through winding 2704 therefore by from winding very close to place flowing, and will not show Write ground and be coupled to other windings 2704.For example, the symbol 2708 in arrow 2706 and Figure 28 in Figure 27 is symbolically illustrated Why not the magnetic flux generated by the electric current for flowing through winding 2704 (2) is such as significantly coupled to winding 2704 (1) and 2704 (3).Correspondingly, Magnetic device 2700 be three it is independent there is no the set of obvious magnetic-coupled inductor, and must not believe that magnetic device 2700 is coupling inductor array.

Even if additionally, magnetic device 2700 is revised as winding 2704 is brought to together, winding 2704 does not still show The magnetic coupling of work.For example, Figure 29 shows the cross-sectional top view of magnetic device 2900, its class of magnetic device 2700 with Figure 27 and Figure 28 Seemingly, simply the drawing close closely on width 2901 of winding 2704.Symbol 2908 symbolically illustrate by flow through around The path of the magnetic flux of the electric current generation of group 2704 (2).As indicated, from winding 2704 (2) magnetic flux seldom coupled to remaining around Group 2704 (1) and 2704 (3), although winding 2704 is close proximity.Therefore, magnetic device 2900 is still three independent There is no the set of obvious magnetic-coupled inductor, and therefore must not believe that magnetic device 2900 is coupling inductor array.

However, it has been discovered by the applicants that in the device including the one chip magnetic core with Distributed gaps, if (1) Winding on Fig. 1-4 in the longitudinal direction than (such as being discussed) long in the direction of the width so that winding forms encirclement generally It is the winding ring of the ring region of rectangle, and (2) multiply width section (lengthwise in the given length direction of magnetic core By widthwise cross-section) in the region that surrounds of winding ring be substantially greater than region outside winding ring, then can Enough realize both strong magnetic coupling and relatively large electric leakage inductance value.

Figure 30 to Figure 33 shows an example of the magnetic device for meeting these requirements.Specifically, Figure 30 is that have length The top plan view of the coupling inductor array 3000 of degree 3002, width 3004 and height 3006, Figure 31 is its side elevation view. Figure 32 is the sectional view obtained along the line 30A-30A of Figure 30, and Figure 33 is the sectional view obtained along the line 31A-31A of Figure 31.Coupling A kind of possible application of inductor array 3000 is in switching power converter application, such as in the three-phase step-down of Figure 12 In the middle of converter 1200.

Coupling inductor array 3000 includes the one chip magnetic core 3008 formed by the magnetic material with Distributed gaps. For example, in certain embodiments, one chip magnetic core 3008 is formed by single piece of the magnetic powder material in adhesive.As Another example, in some other embodiments, one chip magnetic core 3008 is by the multiple that is stacked to form one chip magnetic core Magnetic film layers are formed, wherein, each magnetic film layers is formed by the magnetic material powder in adhesive.The distribution of one chip magnetic core 3008 Gap causes that magnetic core 3008 has the magnetic conductivity more much lower than the magnetic conductivity of typical ferrite magnetic material.

Coupling inductor array 3000 includes the multiple windings 3010 in embedded one chip magnetic core 3008, wherein, each around Group forms the corresponding windings ring 3012 of one or more circles around corresponding winding axle 3016, wherein, each winding axle 3016 exists Extend in short transverse.Each winding ring 3012 includes multiple conductor layers 3014 spaced apart from each other in the height direction so that every Individual winding ring 3012 has thickness T in the height direction.Only some conductor layers 3014 are marked in Figure 32, to promote Bright is clear.The conductor layer 3014 of each winding ring 3012 passes through electric connector (not shown) coupled in series electrical, for example, the electricity Connector is the conductive through hole for extending between adjacent conductive layers 3014 in the height direction.Adjacent winding ring 3012 is spaced from each other Width spacing distance D.

Each winding ring 3012 surrounds the ring region Ain that corresponding length direction multiplies width, and the region has in length The shape (referring to Figure 33) that what degree side protruded upward be generally rectangular.The region of the magnetic core 3008 that winding ring 3012 is surrounded is substantially The upper region outside winding ring 3012 more than magnetic core 3008, such as in the height direction by cross-section coupling inductor battle array Finding during row 3000.In other words, in the sectional plane that the given length direction including winding ring 3012 multiplies width, around The overall dimension of the magnetic core area Ain that group ring 3012 is surrounded is noticeably greater than the totality of the magnetic core area Aout outside winding ring 3012 Size.Winding ring geometry, this relation between winding ring position and magnetic core 3008 allow magnetic core 3008 in adjacent winding Low magnetic circuits are provided between ring 3012, even if magnetic core 3008 has relatively low magnetic conductivity.As a result, winding ring 3012 occurs Strong magnetic coupling, so that they are the parts of coupling inductor array, the part of the set without being merely separate inductor.

Additionally, magnetic core 3008 the fact beyond length by width side extends up to winding ring 3012 so that magnetic core 3008 Path can be provided for the leakage magnetic flux of the whole corresponding circumference generally surround each winding ring 3012.Thus, coupling inductor Array 3000 has leakage magnetic flux path wide or heavy in section area.The heavy in section area of leakage magnetic flux path causes the path With low magnetic resistance, low core loss and the big electric leakage inductance value related to winding 3010 are thereby promoted.Correspondingly, coupling inductor battle array Row 3000 realize the strong magnetic coupling and the significant electric leakage inductance value related to winding 3010 of winding 3010, even if magnetic core 3008 With relatively low magnetic conductivity.

In the case of without departing substantially from this context modification can be made to coupling inductor array 3000.For example, can be with Change the quantity of winding 3010, as long as coupling inductor array 3000 includes at least two windings 3010.Show as another Example, thus it is possible to vary the quantity of the conductor layer 3014 in each winding ring 3012, as long as each winding ring 3012 includes at least one Conductor layer 3014.Additionally, although magnetic core 3008 is illustrated as homogeneity, magnetic core 3008 can have two Or more the composite cores of part that are made up of heterogeneity, as long as the major part in the volume of magnetic core 3008 is by with distribution What the magnetic material in formula gap was formed.Although additionally, it is anticipated that coupling inductor array 3000 be typically it is symmetrical, But in some alternative embodiments, coupling inductor array 3000 has non-symmetrical configuration, for example to realize asymmetric coupling Inductor array.

Applicant further determines, if width winding central spacer distance is closed with winding ring height with certain System, then promote the strong magnetic coupling and significant leakage inductance in Distributed gaps magnetic device.In order to help recognize this relation, Consider the magnetic device 3400 shown in the sectional view in Figure 34.Magnetic device 3400 is included by the magnetic material with Distributed gaps The rectangular monolithic formula magnetic core 3402 that (such as the magnetic powder material in adhesive) is formed.Magnetic device 3400 has length 3404 Include being embedded in multicircuit winding ring 3408 in one chip magnetic core 3402 with height 3406, and magnetic device 3400, wherein, winding Ring 3408 has height T.

Can by by length multiply height section be divided into it is imaginary square (such as length multiplies height section 3410 and includes Square 1-5) and magnetic core 3402 is modeled.The model of even now is approximate, and only considers one chip magnetic core 3402 A part, but make one to understand the speed that declines with the increase with the distance of winding ring 3408 of magnetic flux density have how soon In meaning, the model is illustrative.Ignore boundary condition and second-order effects, can be by electric model of equal value (as shown in figure 35) To the magnetic resistance modeling between each foursquare summit, wherein, each resistor represents the normalization magnetic resistance between two summits.Example Such as, the magnetic resistance of path from point A to point B is about the twice of the magnetic resistance of the path from point A to point C, such as by with twice Shown in the resistor 3502 of the resistance of resistor 3504.

Approximate modeling can be carried out to the magnetic flux by section 3410 as shown in figure 36, wherein, by the electricity with amplitude 1 Stream source 3602 represents the total magnetic flux for flowing through section 3410.The boundary definition by square 1-5 discrete path come pair cross-section 3410 when carrying out approximate, and the electric current for flowing through each the electric branch in Figure 36 represents the relative magnetic of the corresponding path for flowing through magnetic core 3402 It is logical.For example, about 55.7% flowing between point A and point B of the total magnetic flux in section 3410, and only have about in total magnetic flux 30.9% flows between point C and point D.Figure 37 is the chart 3700 of the relative magnetic flux density in section 3410, and is by scheming Derived from 36, wherein, the area under curve 3702 represents the total magnetic flux in section 3410.Transverse axis 3704 represents that magnetic flux flows through section Which square (for example, square 1) in 3410, and the longitudinal axis 3706 represents the relative magnetic for estimating in the square Flux density.

As shown in figure 37, most of magnetic flux flowing in square 1 in section 3410 is flowed through.As a result, it is any it is extra around Group ring (not shown) also has to be located in square 1, extra winding ring is consumingly magnetically coupled to winding ring 3408. If D is less than T, the constraint is met in the coupling inductor array 3000 of Figure 30-33.Correspondingly, in coupling inductor battle array In some embodiments of row 3000, each width spacing distance D is less than the thickness T of winding ring 3012, further to realize The strong magnetic coupling of each winding ring 3012.

Although needing strong magnetic coupling in coupling inductor array, for energy stores, some leakage inductances It is also required.Thus, in an exemplary embodiment, spacing distance D should be at least the 10% of winding ring thickness T, think leakage Magnetic flux provides enough length directions and multiplies width sectional area.Additionally, spacing distance D should be sufficiently large, to avoid and be spaced It is difficult apart from the related manufacture of the very small value of D.If for example, manufacturing process has the mechanical precision tolerance of +/- dD, then D should be at least the twice of dD, to promote the manufacture of robust.Correspondingly, in some embodiments of coupling inductor array 3000 In, D is less than T, and D more than the greater in 0.1*T or 2*dD, to realize strong magnetic coupling, significant electric leakage inductance value and robust Manufacture.

In some coupling inductor array applications, it may be desirable to the very strong magnetic coupling with winding.Correspondingly, Shen Ask someone to have developed extra technology by means of the balance between the leakage magnetic flux path magnetic resistance of increase, it promotes have distribution The strong magnetic coupling of the winding in the coupling inductor array of formula clearance magnetic core.

Specifically, it is found by the applicant that by the way that in nonmagnetic structures embedded magnetic core magnetic flux will be hindered around the stream of winding ring Kinetic energy enough further realizes the strong magnetic coupling of the winding ring in the coupling inductor array with Distributed gaps magnetic core.For example, Figure 38 is the top plan view of the coupling inductor array 3800 for including the nonmagnetic structures in embedded one chip magnetic core, Tu39Shi Its side plan view.Coupling inductor array 3800 has length 3802, width 3804 and height 3806.Figure 40 is along Figure 38 The sectional view that line 38A-38A is obtained, Figure 41 is the sectional view obtained along the line 39A-39A of Figure 39.Coupling inductor array 3800 A kind of possible application be in switching power converter application, for example, in the three-phase step-down converter 1200 of Figure 12.

Coupling inductor array 3800 is included by the one chip magnetic core 3808 with Distributed gaps.In the example for illustrating In, one chip magnetic core 3808 forms (see Figure 40) by the multiple magnetic film layers 3809 for stacking in the height direction, wherein, each magnetic film Layer is formed by the magnetic material (such as the magnetic powder material in adhesive) with Distributed gaps.But, replaced at some For in embodiment, one chip magnetic core 3808 is formed by Distributed gaps material (such as the magnetic powder material in adhesive) Block magnetic cores.

Coupling inductor array 3800 includes the multiple windings 3810 in embedded one chip magnetic core 3808, wherein, each around Group forms the corresponding windings ring 3812 of the circle or multiturn around the winding of corresponding axle 3816, wherein, each winding axle 3816 exists Extend in short transverse.Each winding ring 3812 includes multiple conductor layers 3814 spaced apart from each other in the height direction so that every Individual winding ring 3812 has thickness T in the height direction.Some conductor layers 3814 are only marked in Figure 40, to promote explanation Clearness.The conductor layer 3814 of each winding ring 3812 by electric connector coupled in series electrical, the electric connector be, for example, The conductive through hole 3813 extended between adjacent conductive layers 3814 in short transverse.Partially illustrated by a dotted line in Figure 41 around The profile of group ring 3812, wherein, the conductor layer 3814 of winding ring is invisible in the sectional view of Figure 41.The adjacent phase of winding ring 3812 Mutually it is spaced apart width spacing distance D.

Each winding ring 3812 surrounds corresponding length direction and multiplies width ring region Ain, and the region has in length The shape (see Figure 41) being generally rectangular of direction elongation.The region surrounded by winding ring 3812 of magnetic core 3808 is generally big In the region outside winding ring 3812 of magnetic core 3808, such as passing through cross-section coupling inductor array along short transverse See when 3800.In other words, in the given length including winding ring 3812 multiplies width section plane, ring region Ain's is total Body size is substantially greater than the overall dimension of the region Aout outside winding ring 3812 of magnetic core 3808.Therefore, winding ring 3812 according to the similar mode discussed above for Figure 30-33 by strong magnetic coupling so that winding 3810 is coupling inductor The part of array, the part of the set without being merely separate inductor.Additionally, in certain embodiments, D is less than T, and D More than the greater in 0.1*T or 2*dD, strong magnetic coupling, significant leakage inductance are realized with according to similar mode discussed above The manufacture of value and robust.

Nonmagnetic structures 3815 are embedded in one chip magnetic core and are arranged on outside winding ring 3812, such as logical along short transverse Cross what cross-section coupling inductor array 3800 was found out.Specifically, one or more nonmagnetic structures 3815 are set to It is adjacent with each winding ring 3812 in the length direction common with winding ring multiplies width plane so that magnetic core 3808 around Length direction outside group ring 3812 multiplies width region and is at least substantially covered by nonmagnetic structures 3815.Nonmagnetic structures 3815 hinder magnetic flux in winding ring flows outside in magnetic core 3808, thus further promote the strong magnetic coupling of winding 3810.To the greatest extent Pipe is it is anticipated that the whole length direction outside substantially covering winding ring 3812 is generally multiplied width side by nonmagnetic structures 3815 To region, see during as along short transverse by cross-section coupling inductor array 3800, but without departing substantially from the present invention In the case of scope, the less length direction that nonmagnetic structures 3815 can alternatively cover magnetic core 3808 multiplies width area Domain.

In the case of without departing substantially from this context modification can be made to coupling inductor array 3800.For example, can be with Change the quantity of magnetic film layers 3809.As another example, thus it is possible to vary the quantity of nonmagnetic structures 3815.For example, will can give Determine nonmagnetic structures 3815 and be divided into some smaller magnetic texures.As another example, thus it is possible to vary the quantity of winding 3810, as long as Coupling inductor array 3800 includes at least two windings 3810.It is furthermore possible to vary leading in each winding ring 3812 The quantity of body layer 3814, as long as each winding ring 3812 includes at least one conductor layer 3814.Although additionally, it is anticipated that Coupling inductor array 3800 is typically symmetrical, but in some alternative embodiments, coupling inductor array 3800 has Non-symmetrical configuration, for example to realize asymmetric coupling inductor array.

Nonmagnetic structures 3815 are formed by the magnetic conductivity material lower than forming the material of magnetic film layers 3809.In some embodiments In, nonmagnetic structures 3815 are formed by the material with one or so relative permeability, so that by the magnetic flux of winding ring 3812 Maximum flow.Ideally, nonmagnetic structures 3815 are formed by the material being electrically insulated, to avoid in nonmagnetic structures The flowing of the vortex flow in 3815.But, the material different from the material for conductor layer 3814 is used for nonmagnetic structures 3815 may complicate manufacture.For example, it may be desirable in some embodiments to two different print steps and correlation masking carry out shape Into conductor layer 3814 and nonmagnetic structures 3815 with different respective materials.Therefore, in some alternative embodiments, non-magnetic Property structure 3815 and the both of which of conductor layer 3814 are formed by common conductive material, wherein, nonmagnetic structures 3815 and winding 3810 electric isolution, and therefore also electrically insulated with winding ring 3812 and its composition conductor layer 3814.

For example, Figure 42 is the sectional view similar with the sectional view of Figure 41 of coupling inductor array 4200.Coupling inductor Array 4200 is the alternate embodiment of coupling inductor array 3800, in coupling inductor array 4200, with by conductive material The nonmagnetic structures 4215 that (for example, the conductive material with the conductive material same type for forming conductor layer 3814) is formed replace non- Magnetic texure 3815.One or more nonmagnetic structures 4215 are set to multiply width in the length direction common with winding ring It is adjacent with each winding ring 3812 in plane so that length direction of the magnetic core 3808 outside winding ring 3812 multiplies width area Domain is at least substantially covered by nonmagnetic structures 4215.Nonmagnetic structures 4215 and winding 3810 and the electricity of associated winding ring 3812 every From.It is contemplated that multiple individually nonmagnetic structures 4215 will be arranged on given width side instead of single nonmagnetic structures 4215 To multiplying in length direction plane, to reduce the flowing of vortex flow and promote manufacturability.

Figure 43 is shown for forming the coupling inductor battle array including having the magnetic core for being embedded in nonmagnetic structures therein The method 4300 of row.In step 4302, at least two conductor layers are arranged on core portion along short transverse, so that conductor Layer is at least partially formed at least two winding rings, finding when such as being observed along short transverse.In an example of step 4302, Conductor layer 3814 (1), 3814 (4) and 3814 (7) is printed onto in magnetic film layers 3809 (5), respectively partially to form winding ring 3812 (1), 3812 (2) and 3812 (3).(see Figure 40).In step 4304, one or more nonmagnetic structures are arranged on magnetic On core segment and outside winding ring, finding when such as being observed along short transverse.In an example of step 4304, by non-magnetic Property structure 3815 (1) is printed onto in magnetic film layers 3809 (5), outside winding ring 3812 (1), 3812 (2), 3812 (3).

In step 4306, magnetic material is arranged in core portion, conductor layer and nonmagnetic structures.In step 4306 An example in, magnetic film layers 3809 (6) are arranged on magnetic film layers 3809 (5), conductor layer 3814 (1), 3814 (4), 3814 (7) And in nonmagnetic structures 3815 (1).Decision steps 4308 judge whether to need extra conductor layer.If it is required, then weight Multiple step 4302 to 4306；Otherwise method 4300 terminates.

Winding ring size can also be increased, to hinder the flowing of leakage magnetic flux, thus by means of the leakage magnetic flux path with increase The balance of magnetic resistance increases the magnetic coupling of winding.For example, Figure 44 is the coupling inductor battle array with length 4402 and width 4404 The sectional view of row 4400.Winding ring 4412 is embedded into the one chip magnetic core 4408 formed by the magnetic material with Distributed gaps In.Coupling inductor array 4400 is similar with the coupling inductor array 3000 of Figure 30-33, simply with bigger winding ring. The sectional view of the coupling inductor array 3000 shown in Figure 33 is reproduced as Figure 45, in order to the He of coupling inductor array 3000 4400 comparing.The magnetic of winding ring cover from the comparing of Figure 44 and 45 it is observed that in coupling inductor array 4400 It is big in coupling inductor array 3000 that the length direction of core multiplies width part ratio.Thus, it is supposed that other side is equivalent, Compared with coupling inductor array 3000, coupling inductor array 4400 is by by means of the power between the leakage magnetic flux magnetic resistance of increase Weigh and there is the magnetic coupling of stronger winding.Moreover, it is assumed that other side is equivalent, then relative to coupling inductor array 3000, the size of the increase of the winding ring in coupling inductor array 4400 causes that the winding in coupling inductor array 4400 has The lower resistance of corresponding winding in having than coupling inductor array 3000.

Applicant further found that the staggeredly engagement of winding ring can promote the strong magnetic coupling of winding.In order to help recognize the hair It is existing, the coupling inductor array 4600 of the staggeredly engagement in the absence of winding ring is considered first, as shown in the sectional view in Figure 46.Coupling Closing inductor array 4600 has length 4602 and width 4604.Coupling inductor array 4600 is included and is embedded into by with distribution Two winding rings 4612 in the one chip magnetic core 4608 that the magnetic material in formula gap is formed.Pass through arrow 4601 and 4603 respectively Symbolically to illustrate couples magnetic flux and leakage magnetic flux.Only leakage magnetic flux flows through the region 4605 between winding ring 4612.Thus, area Domain 4605 reduces the magnetic coupling of winding ring 4612 by allowing magnetic flux to bypass winding ring 4612.But region can not possibly be eliminated 4605, because winding ring 4612 must be spaced from each other in the direction of the width, to avoid winding ring from being shorted to together by electricity.

Applicant have determined that the staggeredly engagement of winding ring can reduce or eliminate the leakage magnetic flux for being attributed to the separation of winding ring Path.For example, it is contemplated that the coupling inductor array 4700 shown in the side elevation view of the top view of Figure 47 and Figure 48.Figure 49 is Along the sectional view that the line 47A-47A of Figure 47 is obtained, Figure 50 is the sectional view obtained along the line 48A-48A of Figure 48.Coupling inductor Array 4700 has length 4702, width 4704 and height 4706.A kind of possible application of coupling inductor array 4700 is In switching power converter application, such as in the multi-phase and step-down converter similar to the three-phase step-down converter 1200 of Figure 12 In.

Coupling inductor array 4700 includes the one chip magnetic core 4708 formed by the magnetic material with Distributed gaps. For example, in certain embodiments, one chip magnetic core 4708 is formed monolithically by the magnetic powder material in adhesive.As another One example, in some other embodiments, one chip magnetic core 4708 is formed by multiple magnetic film layers, and multiple magnetic film layers are stacked with shape Into one chip magnetic core, wherein, each magnetic film layers is formed by the magnetic material powder in adhesive.The distribution of one chip magnetic core 4708 Formula gap causes that one chip magnetic core 4708 has the magnetic conductivity more much lower than the magnetic conductivity of typical fen iotate magnetic material.

Coupling inductor array 4700 includes the winding 4710 being embedded into one chip magnetic core 4708, wherein, each winding The corresponding windings ring 4712 of the circle or multiturn around the winding of corresponding winding axle 4716 is formed, wherein, each winding axle 4716 Extend in the height direction.Each winding ring 4712 includes multiple conductor layers 4714 spaced apart from each other in the height direction so that Each winding ring 4712 has thickness T in the height direction.Some conductor layers 4714 are only marked in Figure 49, to promote explanation Clearness.The conductor layer 4714 of each winding ring 4712 coupled in series electrical by electric connector, the electric connector is for example It is the conductive through hole 4713 for extending between adjacent conductive layers 4714 in the height direction.By a dotted line and partly show in Figure 50 Go out the profile of winding ring 4712, wherein, the conductor layer 4714 of winding ring is invisible in the sectional view of Figure 50.

Each winding ring 4712 surrounds corresponding length direction and multiplies width ring region Ain, and the region has along length The shape (see Figure 50) being generally rectangular of direction elongation.The region surrounded by winding ring 4712 of magnetic core 4708 is generally big In the region outside winding ring 4712 of magnetic core 4708, cross-section coupling inductor array is such as passed through in the height direction Finding when 4700.In other words, in the given length including winding ring 4712 multiplies width section plane, surrounded by winding ring 4712 The overall dimension of magnetic core area Ain be noticeably greater than the overall dimension of the magnetic core area outside winding ring 4712.With close above , the winding ring geometry, winding ring position and magnetic core 4708 between similar with what 3800 discussed in coupling inductor array 3000 This relation allow magnetic core 4708 to provide low magnetic circuits between adjacent winding ring 4712, even if magnetic core 4708 have it is relative Relatively low magnetic conductivity.

Additionally, making winding ring 4712 staggeredly engage in coupling inductor array 4700, or in other words, make winding ring 4712 are partly overlapped, and finding during cross-section coupling inductor array 4700 is such as passed through in the height direction.Winding ring 4712 This staggeredly engagement causes that the length direction between adjacent winding ring 4712 multiplies width region 4705 by the two winding rings Surround.As a result, region 4705 is the part of couples magnetic flux path, rather than the part of leakage magnetic flux path.Thus, it is supposed that other sides Face is equal to, then coupling inductor array 4700 has the magnetic coupling of the winding more stronger than coupling inductor array 4600.

The fact that winding ring 4712 is staggeredly engaged is set to require that winding ring 4712 intersects.Accordingly, it may be desirable at two Implement given winding turns on different layers, to allow winding ring 4712 to be intersected in the case of not electric being shorted to together.

In the case of without departing substantially from this context modification can be made to coupling inductor array 4700.For example, can be with Change the quantity of winding 4710, as long as coupling inductor array 4700 includes at least two windings 4710.Show as another Example, thus it is possible to vary the quantity of the conductor layer 4714 in each winding ring 4712, as long as each winding ring 4712 includes at least one Conductor layer 4714.Additionally, although magnetic core 4708 is illustrated as homogeneity, magnetic core 4708 can be had by not The composite cores of two or more parts of congruent composition, as long as the major part in the volume of magnetic core 4708 is by with distribution What the magnetic material in formula gap was formed.Although additionally, it is anticipated that coupling inductor array 4700 be typically it is symmetrical, It is that in some alternative embodiments, coupling inductor array 4700 has non-symmetrical configuration, for example to realize asymmetric coupling electricity Sensor array.

Applicant also additionally have developed the coupling inductor including the winding with strong magnetic-coupled two vertical stackings Array.The winding of vertical stacking promotes the small device area of coverage, in the limited application in the space for installing component this Point is especially beneficial.

Figure 51-56 shows an example of such coupling inductor array.Specifically, Figure 51 is to include having by force The perspective view of the coupling inductor array 5100 of the winding of magnetic-coupled two vertical stackings.Shown by line chart in Figure 51 The magnetic core of coupling inductor array 5100, i.e. illustrate only the profile of magnetic core, to show the inside of coupling inductor array.Figure 52 is the top plan view of coupling inductor array 5100, and Figure 53 is the side elevation view of coupling inductor array 5100, Figure 54 It is the vertical section figure of the coupling inductor array 5100 obtained along the line 52A-52A of Figure 52, Figure 55 is along the line 53A- of Figure 53 The horizontal sectional view of the coupling inductor array 5100 that 53A is obtained.Figure 56 shows the coupling electricity without magnetic core by exploded view Sensor array 5100.Coupling inductor array 5100 has length 5102, width 5104 and height 5106.Coupling inductor array 5100 a kind of possible application is in switching power converter application, such as in the phase of step-down converter 1200 with Figure 12 Seemingly but only with two step-down converters of phase 1255.

Coupling inductor array 5100 includes the one chip magnetic core 5108 formed by the magnetic material with Distributed gaps. For example, in certain embodiments, one chip magnetic core 5108 is formed monolithically by the magnetic powder material in adhesive.As another One example, in some other embodiments, one chip magnetic core 5108 stacks to form one chip magnetic by 5106 directions of height Multiple magnetic film layers of core are formed, wherein, each magnetic film layers is formed by the magnetic material powder in adhesive.One chip magnetic core 5108 Distributed gaps cause one chip magnetic core 5108 have the magnetic conductivity more much lower than the magnetic conductivity of typical fen iotate magnetic material. In certain embodiments, one chip magnetic core 5108 includes one or more layer of non-magnetic material (not shown), such as in coupling Close the feature of support coupling inductor array 5800 in the manufacturing process of inductor array and for providing coupling inductor battle array One or more substrates of dielectric insulation in row.

Coupling inductor array 5100 includes the first winding 5110 and the second winding 5112.First winding 5110 forms embedding Enter to the first winding turns 5114 in one chip magnetic core 5108, and the second winding 5112 and form and be embedded into one chip magnetic core The second winding turns 5116 (see Figure 51,54 and 56).The public winding axle 5118 that highly 5106 sides upwardly extend is centered around to wind Each of first and second winding turns 5114 and 5116.Although each of first and second winding turns 5114 and 5116 are shown To form single turn, but one or more of these winding turns can form multiturn.Optionally make the first and second windings 5110, 5112 are electrically isolated from each other in one chip magnetic core 5108.

The opposed end 5120 and 5122 of the first winding 5110 is terminated near the first side 5124 of one chip magnetic core 5108, And relative second side 5130 that the opposed end 5126 and 5128 of the second winding 5112 terminates at one chip magnetic core 5108 is attached Closely (see Figure 51 and Figure 56).Make the first side of one chip magnetic core 5108 and the second side 5124 and 5130 phase on the direction of length 5102 Mutually separate.Although winding overhang 5120,5122,5126 and 5128 is illustrated as being formed for the surface erecting and welding to circuit board Corresponding weld tab, but one or more of these winding overhangs can form another type of connector, for example, lead to Hole pin, without departing from this context.

Coupling inductor array 5100 also includes by magnetic conductivity than forming one or more magnetic of one chip magnetic core 5108 The low magnetic permeability magnetic texure 5132 that the low magnetic material of material is formed.Low magnetic permeability magnetic texure 5132 is embedded in one chip In magnetic core 5108, and the first winding turns 5114 are separated with the second winding turns 5116 on 5106 directions of height.Low magnetic permeability magnetic Property structure 5132 forms the ring around public winding axle 5118, so that low magnetic permeability magnetic texure 5132 is formed and public winding The aperture 5134 (see Figure 51 and Figure 54-56) of the alignment of axle 5118.Correspondingly, the first winding turns 5114, the second winding turns 5116 The Part I 5136 of one chip magnetic core 5108 is surrounded jointly with low magnetic permeability magnetic texure 5132, such as on 5106 directions of height Finding during by cross-section coupling inductor array 5100.In certain embodiments, the first winding turns 5114, the second winding turns 5116 and low magnetic permeability magnetic texure 5132 be rectangle, with cause one chip magnetic core 5108 Part I 5136 have rectangle Shape, the finding such as when 5106 sides of height are upwardly through cross-section coupling inductor array 5100, to promote first and second The strong magnetic coupling of winding 5110,5112.

Between the first and second winding turns 5114 and 5,116 is advantageously facilitated including low magnetic permeability magnetic texure 5132 One and second winding 5110 and 5112 strong magnetic coupling, while remain as leakage magnetic flux provide path, to obtain significant leakage inductance Value.In order to help recognize these features, it is considered to Figure 57, it is the vertical section figure similar with Figure 54, but is showed approximate The path of couples magnetic flux 5138 and the path of leakage magnetic flux 5140.Couples magnetic flux 5138 links the first and second winding turns 5114 and 5116 Both, and therefore couples magnetic flux 5138 flows through the Part I 5136 of one chip magnetic core 5108 and around the first and second windings Circle flows outside.On the other hand, leakage magnetic flux 5140 only links one of winding turns 5114 and 5116, and therefore leakage magnetic flux 5140 must Low magnetic permeability magnetic texure 5132 must be flowed through.

The magnetic material for forming the Part I 5136 of one chip magnetic core 5108 has than low magnetic permeability magnetic texure 5132 Magnetic conductivity magnetic conductivity higher.Therefore, be will be less than by low magnetic permeability by the magnetic resistance of the flux paths of Part I 5136 The magnetic resistance of the flux paths of magnetic texure 5132, with big in the magnetic flux for causing to flow through the first and second winding turns 5114 and 5116 Part is couples magnetic flux, and it promotes the strong magnetic coupling of the first and second windings 5110 and 5112.If there is no low magnetic permeability magnetic Property structure 5132, and the winding of material separates first and second of the of a relatively high magnetic conductivity of one chip magnetic core 5108 is taken on the contrary Circle 5114 and 5116, then the magnetic resistance of leakage magnetic flux path will be relatively low.As a result, the He of the first and second winding turns 5114 is flowed through Relatively little magnetic flux is couples magnetic flux in 5116 magnetic flux, causes the relatively weak of the first and second windings 5110 and 5112 Magnetic coupling.

It is important to note that, although the magnetic material for forming low magnetic permeability magnetic texure 5132 has than forming one chip magnetic The low magnetic conductivity of the magnetic material of the Part I 5136 of core 5108, but the material for forming low magnetic permeability magnetic texure 5132 must It must be the magnetic material for being obtained in that significant electric leakage inductance value.If low magnetic permeability magnetic texure 5132 is alternatively by non magnetic material Material is formed, then be difficult to or may even not obtain the significant leakage inductance needed in typical switching power converter application Value.

Can be in the design of coupling inductor array 5100 and/or manufacturing process by adjusting low magnetic permeability magnetic texure 5132 composition and/or change leakage inductance by adjusting thickness of the low magnetic permeability magnetic texure 5132 on 5106 directions of height Value.For example, can be by increasing the thickness of low magnetic permeability magnetic texure 5132 or by increasing low magnetic permeability magnetic texure 5132 magnetic conductivity increases electric leakage inductance value.

In the case of without departing substantially from this context modification can be made to coupling inductor array 5100.For example, can be with Modification is made to the first and second windings 5110 and 5112 so that their end 5120,5122,5126 and 5128 terminates at list The different piece of chip magnetic core 5108.For example, in an alternative embodiment, with winding in the opposite direction and with termination The first and second windings 5110 are replaced in the winding (for example, similar with the winding shown in Figure 22) of the end of relative magnetic core side With 5112.Additionally, although magnetic core 5108 is illustrated as homogeneity, one chip magnetic core 5108 can be had by difference The composite cores of two or more parts that composition is constituted, if in the volume of one chip magnetic core 5108 it is most of by with point The magnetic material in cloth gap is formed.

Applicant has further developed such coupling inductor array, wherein, each winding forms multiple winding turns, and Each winding turns of given winding are wound around different winding axles, to promote the strong magnetic coupling and coupling inductance of winding The low clearance of device array.For example, Figure 58 is each winding formed multiple winding turns coupling inductor array 5800 perspective view. The magnetic core of coupling inductor array 5800 is shown by line chart in Figure 58, i.e. illustrate only the profile of magnetic core, to show coupling Close the inside of inductor array.Figure 59 is the top plan view of coupling inductor array 5800, and Figure 60 is coupling inductor array 5800 side elevation view, Figure 61 is the vertical section figure of the coupling inductor array 5800 obtained along the line 59A-59A of Figure 59, Figure 62 is the vertical section figure of the coupling inductor array 5800 obtained along the line 59B-59B of Figure 59, and Figure 63 is along the line of Figure 60 The horizontal sectional view of the coupling inductor array 5800 that 60A-60A is obtained, Figure 64 is the coupling obtained along the line 60B-60B of Figure 60 The horizontal sectional view of inductor array 5800.Figure 65 is the winding separated with the magnetic core of the array of coupling inductor array 5800 Perspective view.Coupling inductor array 5800 has length 5802, width 5804 and height 5806.Coupling inductor array 5800 A kind of possible application be in switching power converter application, such as similar to the step-down converter 1200 of Figure 12 but In being only two step-down converters of phase 1255.

Coupling inductor array 5800 includes the one chip magnetic core 5808 formed by the magnetic material with Distributed gaps. For example, in certain embodiments, one chip magnetic core 5808 is formed monolithically by the magnetic powder material in adhesive.As another One example, in some other embodiments, one chip magnetic core 5808 stacks to form one chip magnetic by 5806 directions of height Multiple magnetic film layers of core are formed, wherein, each magnetic film layers is formed by the magnetic powder material in adhesive.One chip magnetic core 5808 Distributed gaps cause that one chip magnetic core 5808 has the magnetic more much lower than the magnetic conductivity of typical fen iotate magnetic material Conductance.In certain embodiments, one chip magnetic core 5808 include one or more layer of non-magnetic material (not shown), for example for The feature of coupling inductor array 5800 is supported in the manufacturing process of coupling inductor array and for providing coupling inductance One or more substrates of dielectric insulation in device array.

Coupling inductor array 5800 includes the first winding 5810 and the second winding 5812.First winding 5810 forms insertion Multiple first winding turns 5814 in one chip magnetic core 5808.Each first winding turns is centered around 5806 sides of height and upwardly extends Corresponding windings axle 5816 formed, and each winding axle 5816 other winding axles 5816 are inclined with each on the direction of width 5804 Remove (see Figure 58,61,64,65).As a result, the first winding turns 5814 offset from each other out on the direction of width 5804.Second winding 5812 form multiple second winding turns 5818 being embedded into one chip magnetic core 5808.Each second winding turns 5818 is around winding Corresponding winding axle in axle 5816 is formed so that each second winding turns 5818 is coaxial with corresponding first winding turns 5814 (see Figure 58,61,63,65).As a result, the corresponding winding turns in each second winding turns 5818 and the first winding turns 5814 are common The corresponding common portion 5819 of one chip magnetic core 5808 is surrounded, such as in 5806 sides of height upwardly through cross-section coupling inductance Finding during device array 5800 (see Figure 58).First and second windings 5810 and 5812 in the one chip magnetic core 5808 optionally by Such as insulating materials on winding or one or more dielectric substrates for being embedded into one chip magnetic core 5808 and mutual electricity Isolation.

First and second windings 5810,5812 are formed so that the first winding turns 5814 in a first direction around winding axle 5816 wind, and the second winding turns 5818 wind around winding axle 5816 in a second direction that is opposite the first direction, such as The finding when 5806 sides of height are upwardly through cross-section coupling inductor array 5800, to realize the first and second windings 5810 Anti- magnetic coupling with 5812.It is this anti-magnetic-coupled to be characterised by coupling inductor array 5800 (such as) by from coupling inductance The electric current that the amplitude of first winding 5810 of the inflow of the first side 5820 of device array is increasing flows to generate from the first side 5820 Enter the increasing electric current of the amplitude of the second winding 5812 (see Figure 58).

Multiple first winding turns 5814 are coaxial with corresponding second winding turns 5818, and this is coupling in one chip magnetic core 5808 Magnetic flow provides a plurality of path, thus promotes the strong magnetic coupling of the first and second windings 5810 and 5812.Additionally, the first winding Circle 5814 offsets from each other out on the direction of width 5804, and the second winding turns 5818 offset from each other out on the direction of width 5804 The fact, promote the low clearance 5806 of coupling inductor array 5800.Some embodiments of coupling inductor array 5800 are also wrapped Low magnetic permeability magnetic texure (not shown) is included, its low magnetic permeability magnetic texure with coupling inductor array 5100 discussed above It is similar, the first winding turns 5814 are separated with the second winding turns 5818 on 5806 directions of height, further to promote the first He The strong magnetic coupling of the second winding 5810 and 5812, while for leakage magnetic flux provides path.

In the case of without departing substantially from this context modification can be made to coupling inductor array 5800.For example, can be with By coupling inductor array 5800 be revised as length direction multiply in width have with the first and second windings 5810 and The 5812 extra windings for offseting.As another example, the first and second winding turns 5814 and 5818 can be revised as having Different shape, such as with round-shaped rather than rectangular shape.Additionally, in some replacements of coupling inductor array 5800 In embodiment, the first winding turns 5814 are on one or more directions in the direction of length 5802 or the direction of width 5804 with second Winding turns 5818 are offseted, and are come with the balance between the weaker magnetic coupling by means of the first and second windings 5810 and 5812 For leakage magnetic flux provides extra path, and thus promote big electric leakage inductance value.In these alternate embodiments, the second winding turns 5818 is coaxial with the first winding turns 5814.Conversely, the second winding turns 5818 are around the corresponding windings for extending in the height direction Axle winds, and the first winding axle 5814 is centered around the different corresponding windings axle winding that 5806 sides of height upwardly extend.

Coupling inductor array 5800 can also be changed to cause that the first winding 5810 and the second winding 5812 are included simultaneously Multiple electric conductors that connection is electrically coupled, to promote the Low ESR of winding.For example, Figure 66 is the perspective of coupling inductor array 6600 Figure, coupling inductor array 6600 is similar with the coupling inductor array 5800 of Figure 58, and simply wherein each winding includes parallel connection Two electric conductors being electrically coupled.

Coupling inductor array 6600 has length 6602, width 6604 and height 6606, and coupling inductor array 6600 include one chip magnetic core 6608, the first winding 6610 and the second winding 6612.Monolithic is shown by line chart in Figure 66 Formula magnetic core 6608, i.e. illustrate only the profile of magnetic core.Figure 67 is the first and second windings separated with one chip magnetic core 6608 6610th, 6612 perspective view.First winding 6610 forms multiple first winding turns being embedded into one chip magnetic core 6608 6614, and each first winding turns 6614 is centered around the height corresponding windings axle 6616 that upwardly extends of 6606 sides and formed.Second Winding 6612 forms multiple second winding turns 6618 being embedded into one chip magnetic core 6608.Each second winding turns 6618 is enclosed Corresponding windings axle in winding axle 6616 is formed so that each second winding turns 6618 is same with corresponding first winding turns 6614 Axle.The first winding turns 6614, some examples of the winding turns 6618 of axle 6616 and second are only marked in Figure 66, to promote explanation Clearness.First winding 6610 includes two the first electric conductors 6630 being electrically coupled in parallel, and the second winding 6612 includes Two the second electric conductors 6632 that parallel connection is electrically coupled.Second electric conductor 6632 is stacked on the first electric conductor on 6606 directions of height On 6630.Can be by one of the first winding 6610 and the second winding 6612 or many in the case of without departing substantially from this context Person is revised as including extra electric conductor.

Coupling inductor array 6600 can be modified, so that the first electric conductor 6630 and the second electric conductor 6632 exist On highly 6606 directions staggeredly, with the strong magnetic coupling of further the first and second windings 6610 and 6612 of promotion.For example, Figure 68 is The perspective view of the coupling inductor array 6800 with length 6802, width 6804 and height 6806.Coupling inductor array 6800 is similar with the coupling inductor array 6600 of Figure 66, simply replaces first including the first and second windings 6810 and 6812 With the second winding 6610 and 6612.Figure 69 is the saturating of the first and second windings 6810 and 6812 for separating with one chip magnetic core 6608 View.First winding 6810 includes two the first electric conductors 6830 being electrically coupled in parallel, and the second winding 6812 includes parallel connection Two the second electric conductors 6832 being electrically coupled.Second electric conductor 6832 is submitted with the first electric conductor 6830 in 6806 directions of height Mistake, to promote the strong magnetic coupling of the first and second windings 6810 and 6812.One chip magnetic core is shown by line chart in Figure 68 6608, i.e. illustrate only the profile of magnetic core.

Each of coupling inductor array 5800,6600 and 6800 can be modified, so that each winding only shape Into single winding turns, made with the balance between the magnetic coupling by means of the reduction of winding coupling inductor array sizes and into This minimum.For example, Figure 70 is the perspective of the coupling inductor array 7000 with length 7002, width 7004 and height 7006 Figure.Coupling inductor array 7000 is similar with the coupling inductor array 6600 of Figure 66, and simply wherein each winding only forms list Individual winding turns.Coupling inductor array 7000 includes one chip magnetic core 7008, the first winding 7010 and the second winding 7012.In figure One chip magnetic core 7008 is shown by line chart in 70, i.e. illustrate only the profile of magnetic core.Figure 71 is and one chip magnetic core 7008 The perspective view of the first and second windings 7010 and 7012 for separating, and Figure 72 is the coupling obtained along the line 70A-70A of Figure 70 The vertical section figure of inductor array 7000.

First winding 7010 forms the first winding turns 7014, and it is embedded into one chip magnetic core 7008 and is centered around height The winding axle 7016 that 7006 sides upwardly extend is spent to be formed.Second winding 7012 forms be embedded into one chip magnetic core 7008 Two winding turns 7018.Second winding turns 7018 are formed around winding axle 7016, so that the second winding turns 7018 and the first winding turns 7014 is coaxial.First winding 7010 includes two the first electric conductors 7030 being electrically coupled in parallel, and the second winding 7012 includes Two the second electric conductors 7032 that parallel connection is electrically coupled.Second electric conductor 7032 is stacked on the first electric conductor 7030 in the height direction On.One or more of the first winding 7010 and the second winding 7012 can be repaiied in the case of without departing substantially from this context It is changed to include extra electric conductor.

Figure 73 shows another coupling inductor array, wherein, each winding only forms single turn.Specifically, Tu73Shi The perspective view of the coupling inductor array 7300 with length 7302, width 7304 and height 7306.Coupling inductor array 7300 is similar with the coupling inductor array 6800 of Figure 68, and simply wherein each winding only forms single winding turns.Coupling inductance Device array 7300 includes one chip magnetic core 7308, the first winding 7310 and the second winding 7312.Shown by line chart in Figure 73 One chip magnetic core 7308, i.e. illustrate only the profile of magnetic core.Figure 74 is first and second separated with one chip magnetic core 7308 The perspective view of winding 7310 and 7312, and Figure 75 is the coupling inductor array 7300 obtained along the line 73A-73A of Figure 73 Vertical section figure.

First winding 7310 forms the first winding turns 7314, and it is embedded into one chip magnetic core 7308 and is centered around height The winding axle 7316 that 7306 sides upwardly extend is formed.Second winding 7312 forms second be embedded into one chip magnetic core 7308 Winding turns 7318.Second winding turns 7318 are formed around winding axle 7316 so that the second winding turns 7318 and the first winding turns 7314 is coaxial.First winding 7310 includes two the first electric conductors 7330 being electrically coupled in parallel, and the second winding 7312 includes Two the second electric conductors 7332 that parallel connection is electrically coupled.Second electric conductor 7332 and the first electric conductor 7330 are on 7306 directions of height Staggeredly.In the case of without departing substantially from this context, can be by one of the first winding 7310 and the second winding 7312 or many Person is revised as including extra electric conductor.

One chip magnetic core in each of coupling inductor array 5800,6600,6800,7000 and 7300 be optionally by The composite cores that at least two different types of magnetic materials are formed, to realize the desired property of coupling inductor array.Example Such as, in some embodiments of the coupling inductor array 5800 of Figure 58, each of first and second windings 5810 and 5812 Terminate on the public outer surface of one chip magnetic core 5808 so that the first and second windings 5810 and 5812 have length not etc. Degree.These winding lengths not waited cause the first and second winding 5810 and 5812 to give tacit consent to has asymmetrical electric leakage inductance value.But Be, if it is desired to be inductance value of symmetrically leaking electricity, then one chip magnetic core 5808 can be embodied as composite cores with compensative winding Difference in length.For example, the part of the leakage path of the encirclement winding more long of one chip magnetic core 5808 can be than one chip magnetic core The part of the 5808 shorter winding of encirclement has smaller relative permeability, so that the corresponding leakage inductance path of two windings has Equal magnetic resistance, thus makes winding have symmetrical electric leakage inductance value.

Used as another example, the relative permeability for forming the magnetic material of one chip magnetic core 5808 can be along one chip magnetic core 5808 size changes, between the magnetic coupling and the electric leakage inductance value of winding of realizing the first and second windings 5810 and 5812 Expectation balance.For example, Figure 76 is the sectional view similar with the sectional view of Figure 62, but show to be divided into some sections The one chip magnetic core 5808 of 7602-7628, wherein, there is change between each section in the magnetic conductivity of one chip magnetic core 5808.Under Face is the several of the possible construction of the section 7602-7628 of the various balances between the magnetic coupling for obtaining winding and electric leakage inductance value Individual example.It will be understood, however, that the construction of one chip magnetic core 5808 is not limited to these examples.

Example 1 --- the coupling inductor array 5800 with composite cores.

Section 7602-7628 has the relative permeability shown in following table 1.One chip magnetic core 5808 is first and Part in two winding turns 5814 and 5818 by magnetic conductivity than one chip magnetic core 5808 outside the first and second winding turns extremely The big magnetic material of few some parts of magnetic conductivity is formed, such as in 5806 sides of height upwardly through cross-section coupling inductor battle array Finding during row 5800.The construction promotes the He of the first and second winding 5810 by providing low magnetic circuits along winding axle 5816 5812 strong magnetic coupling.But, electric leakage inductance value is relatively small.

Section	Relative permeability
		7602	It is low
7604	It is high
		7606	It is low
7608	It is low
		7610	It is high
7612	It is low
		7614	It is low
7616	It is low
		7618	It is low
7620	It is high
		7622	It is low
7624	It is low
		7626	It is high
7628	It is low

Table 1

Example 2 --- the coupling inductor array 5800 with another composite cores.

Section 7602-7628 has the relative permeability shown in following table 2.Compared with the construction of example 1, the construction Pass through to reduce leakage inductance path by means of the balance between the magnetic coupling of the decrease of the first and second windings 5810 and 5812 Magnetic resistance promote bigger electric leakage inductance value.

Table 2

Example 3 --- the coupling inductor array 5800 with another composite cores.

Section 7602-7628 has the relative permeability shown in following table 3.Compared with the construction of example 2, the construction Passed through further drop by means of the balance between the magnetic-coupled further decrease of the first and second windings 5810 and 5812 The magnetic resistance of low drain inductance path promotes bigger electric leakage inductance value.The construction further promotes the first and second windings 5810 and 5812 Balanced electric leakage inductance value, it is assumed that winding is terminated on the bottom outer surface of one chip magnetic core 5808.

Table 3

Example 4 --- the coupling inductor array 7000 with composite cores.

Figure 77-83 shows the implementation of the coupling inductor array 7000 (Figure 70) that one chip magnetic core 7008 is composite cores Example.Specifically, Figure 77 is the sectional view similar with the sectional view of Figure 72, but shows the layer 1- for being divided into vertical stacking 6 one chip magnetic core 7008.Figure 78-83 is respectively the top plan view of layer 1-6.As shown in Figure 78-83, layer 1-6 is divided into Section 7702-7768.Following table 4 lists the relative permeability of these different sections in one exemplary embodiment. The configuration of table 4 advantageously promotes the strong magnetic coupling of the first and second windings 7010 and 7012, and in structure it is asymmetrical around The balanced electric leakage inductance value of group.

Table 4

Example 5 --- the coupling inductor array 7300 with composite cores.

Figure 84-90 shows the implementation of the coupling inductor array 7300 (Figure 73) that one chip magnetic core 7308 is composite cores Example.Specifically, Figure 84 is the sectional view similar with the sectional view of Figure 75, but shows the layer 1- for being divided into vertical stacking 6 one chip magnetic core 7308.Figure 85-90 is respectively the top plan view of layer 1-6.As shown in Figure 85-90, layer 1-6 is divided into Section 8402-8468.Following table 5 lists the relative permeability of these different sections in one exemplary embodiment. The configuration of table 5 advantageously promotes the strong magnetic coupling of the first and second windings 7310 and 7312, and in structure it is asymmetrical around The balanced electric leakage inductance value of group.

Table 5

The combination of feature

In the case of without departing substantially from this context can by various modes to above-described feature and below it is main The feature for opening protection is combined.The example below is exemplified with some possible combinations：

(A1) coupling inductor array can include magnetic core and N number of winding, wherein, N is greater than 1 integer.Magnetic core can be with With relative the first side and the second side, linear interval distance definition between the first side and the second side length of magnetic core.Institute Stating N number of winding can in the longitudinal direction pass through magnetic core at least in part.Each of N number of winding can be in magnetic core around phase The winding axle answered forms ring, and each winding axle can be approximately perpendicular to length direction, and each winding axle parallel to every Individual other winding axles are still offseted with them.Each winding can have the first side and the second side at least respectively towards magnetic core to prolong The relative first end and the second end stretched.

(A2) in the coupling inductor array for being denoted as (A1), each ring can surround in magnetic core corresponding first Region, wherein, each first area in magnetic core on the width of length direction at least in part with each its Its first area does not overlap.

(A3) in the coupling inductor array for being denoted as (A2), each first area can in the direction of the width with often Individual other first areas do not overlap completely.

(A4) in any one for being denoted as the coupling inductor array of (A2) or (A3), each ring can substantially put down Face, and each first area can be less than the magnetic core in the plane of corresponding first area between the first side and the second side Region.

(A5) in any coupling inductor array being denoted as in the coupling inductor array of (A2) to (A4), each Winding axle can other winding axle offsets be opened with each in the direction of the width in magnetic core.

(A6) in any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A5), magnetic core Top board and base plate can be included, and each ring can be arranged between top board and base plate.

(A7) in the coupling inductor array for being denoted as (A6), magnetic core can also include being arranged on top board and base plate it Between N number of coupling tooth, and the corresponding coupling tooth that each of N number of winding can be in N number of coupling tooth twines Around.

(A8) in any one for being denoted as the coupling inductor array of (A6) or (A7), the magnetic core can also include At least one leakage tooth between top board and base plate is arranged on, wherein, at least one leakage tooth is arranged on two in corresponding ring Between individual adjacent ring.

(A9) in the coupling inductor array for being denoted as (A8), it is N number of coupling tooth at least one can by with The magnetic material that at least one example of at least one leakage tooth is different is formed.

(A10) any coupling inductor array being denoted as in the coupling inductor array of (A7) to (A9) can also be wrapped Include at least one the non-magnetic spacer body between one of top board and base plate for being arranged on N number of coupling tooth.

(A11) in any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A5), magnetic Core can be single-piece magnetic core, wherein, each of described ring is embedded into the single-piece magnetic core.

(A12) in any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A11), N Individual winding can be disposed in magnetic core, to cause the amplitude in the first winding for flowing into N number of winding from the first side of magnetic core Increasing electric current can be generated from the amplitude in another winding in the N number of winding of the first side inflow of magnetic core increasingly Big electric current.

(A13) in any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A12), N May be greater than 2 integer.

(A14) in any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A13), often Individual ring can be generally disposed in the common plane in magnetic core.

(A15) in any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A14), institute It can be in the longitudinal direction than long in the direction of the width to state each of ring.

(A16) in any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A15), institute Stating each of ring can have the shape being generally rectangular.

(A17) in any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A14), often Individual ring can have the shape being a substantially circular shape.

(A18) any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A17) can be with Including common conductor, be electrically coupled at least two the second ends in the second end of N number of winding by the common conductor.

(A19) in the coupling inductor array for being denoted as (A18), the common conductor can form and be configured as using In the weld tab that attachment is installed to the surface of printed circuit board (PCB).

(A20) in any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A19), institute At least one for stating N number of winding can form multiturn.

(A21) any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A20) can be with Semiconductor element is packaged together jointly.

(A22) any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A20) can set Put on a semiconductor die.

(A23) any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A20) can set Put on a semiconductor die, and with the semiconductor die package to common integrated circuit package body in.

(A24) any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A20) can be with Semiconductor element is packaged together and is electrically coupled with the semiconductor element jointly.

(A25) any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A20) can set Put on a semiconductor die and be electrically coupled to the semiconductor element.

(A26) any coupling inductor array being denoted as in the coupling inductor array of (A1) to (A20) can set Put on a semiconductor die and be electrically coupled to the semiconductor element, and with the semiconductor die package to common integrated circuit In packaging body.

(B1) multiphase switching power converter can include coupling inductor and N number of switching circuit, wherein, N is greater than 1 Integer.The coupling inductor can include magnetic core and N number of winding.Magnetic core can have relative the first side and the second side, Linear interval distance definition between first side and the second side length of magnetic core.N number of winding can exist at least in part Magnetic core is passed through on length direction, and each of N number of winding can form ring in magnetic core around corresponding winding axle. Each winding axle can be approximately perpendicular to length direction, and each winding axle can be parallel to each other winding axle but skew Open.Each winding can have the first and second relative ends at least extending towards the first side of magnetic core and the second side respectively. Each switching circuit may be adapted to the first end of the corresponding winding in N number of winding can be made different at least two Switch between voltage level.

(B2) the multiphase switching power converter for being denoted as (B1) can also include controller, and the controller is suitable to control Make N number of switching circuit so that each of described N number of switching circuit can relative in N number of switching circuit at least One other switching circuit is switched to different phases.

(B3) in any one for being denoted as the multiphase switching power converter of (B1) or (B2), each ring can be wrapped The corresponding first area in magnetic core is enclosed, wherein, each first area in magnetic core is in the width perpendicular to length direction On other first areas are not overlap with each at least in part.

(B4) in the multiphase switching power converter for being denoted as (B3), each first area can be in width It is upper that other first areas are not completely overlap with each.

(B5) in any one for being denoted as the multiphase switching power converter of (B3) or (B4), each ring can be big It is plane to cause, and each first area can be less than in the plane of corresponding first area between the first side and the second side Magnetic core area.

(B6) any multiphase switching power in the multiphase switching power converter of (B1) to (B5) is denoted as In converter, each winding axle can other winding axle offsets be opened with each in the direction of the width in magnetic core.

(B7) any multiphase switching power in the multiphase switching power converter of (B1) to (B6) is denoted as In converter, magnetic core can include top board and base plate, and each ring can be arranged between top board and base plate.

(B8) in the multiphase switching power converter for being denoted as (B7), magnetic core can also include be arranged on top board and N number of coupling tooth between base plate, and each of N number of winding can be around the corresponding coupling in N number of coupling tooth Close tooth winding.

(B9) in any one for being denoted as the multiphase switching power converter of (B7) or (B8), magnetic core can also be wrapped At least one leakage tooth being arranged between top board and base plate is included, wherein, at least one leakage tooth is arranged on two in corresponding ring Between adjacent ring.

(B10) in the multiphase switching power converter for being denoted as (B9), it is described it is N number of coupling tooth at least within it One can be formed by the magnetic material of at least one example different from described at least one leakage tooth.

(B11) it is denoted as any multiphase switching power in the multiphase switching power converter of (B8) to (B10) Converter can also include being arranged at least one non-magnetic spacer between one of top board and base plate of N number of coupling tooth Body.

(B12) any multiphase switching power in the multiphase switching power converter of (B1) to (B6) is denoted as In converter, magnetic core can be single-piece magnetic core, wherein, each of described ring is embedded into the single-piece magnetic core.

(B13) any multiphase suitching type work(in the multiphase switching power converter of (B1) to (B12) is denoted as In rate converter, the multiphase switching power converter can include multi-phase and step-down converter, multiphase boost converter and many At least one of phase type of voltage step-up/down converter.

(B14) any multiphase suitching type work(in the multiphase switching power converter of (B1) to (B13) is denoted as In rate converter, N number of winding can be disposed in magnetic core, to cause to flow into first in N number of winding from the first side of magnetic core The increasing electric current of amplitude in winding can be generated in another winding for flowing into N number of winding from the first side of magnetic core The increasing electric current of amplitude.

(B15) any multiphase suitching type work(in the multiphase switching power converter of (B1) to (B14) is denoted as In rate converter, N may be greater than 2 integer.

(B16) any multiphase suitching type work(in the multiphase switching power converter of (B1) to (B15) is denoted as In rate converter, each ring can be arranged substantially in the common plane in magnetic core.

(B17) any multiphase suitching type work(in the multiphase switching power converter of (B1) to (B16) is denoted as In rate converter, each of described ring can in the longitudinal direction than long in the direction of the width.

(B18) any multiphase suitching type work(in the multiphase switching power converter of (B1) to (B17) is denoted as In rate converter, each of described ring can have the shape being generally rectangular.

(B19) any multiphase suitching type work(in the multiphase switching power converter of (B1) to (B16) is denoted as In rate converter, each ring can have the shape being a substantially circular shape.

(B20) it is denoted as any multiphase switching power in the multiphase switching power converter of (B1) to (B19) Converter can also include common conductor, and the common conductor is by least two end thermocouples in the second end of N number of winding Close.

(B21) in the multiphase switching power converter for being denoted as (B20), the common conductor can be formed is matched somebody with somebody It is set to the weld tab for installing attachment to the surface of printed circuit board (PCB).

(B22) any multiphase suitching type work(in the multiphase switching power converter of (B1) to (B21) is denoted as In rate converter, at least one of N number of winding can form multiturn.

(C1) a kind of coupling inductor array with length, width and height can include by with Distributed gaps The one chip magnetic core of magnetic material formation and the multiple windings being embedded into the one chip magnetic core.Each winding can be formed Around a circle or the corresponding windings ring of multiturn of corresponding winding axle, wherein, each winding axle extends in the height direction.Monolithic The region surrounded by winding ring of formula magnetic core can be more than the region of the one chip magnetic core outside winding ring, such as in short transverse It is upper to pass through finding during cross-section coupling inductor array.

(C2) in the coupling inductor array for being denoted as (C1)：Winding ring can be spaced from each other in the direction of the width, And each winding ring can surround the corresponding ring region for extending in the longitudinal direction.

(C3) in the coupling inductor array for being denoted as (C2), each ring region can have what is be generally rectangular Shape.

(C4) in any coupling inductor array being denoted as in the coupling inductor array of (C1) to (C3)：(1) Each winding ring can in the height direction have thickness T, and (2) adjacent winding ring can be spaced from each other width spacing distance D, and (3) D can be less than T.

(C5) in the coupling inductor array for being denoted as (C4), D can be more than 0.1*T.

(C6) any coupling inductor array being denoted as in the coupling inductor array of (C1) to (C5) can also be wrapped One or more nonmagnetic structures being embedded into one chip magnetic core are included, wherein, one or more of nonmagnetic structures are set Outside winding ring, finding during cross-section coupling inductor array is such as passed through in the height direction.

(C7) in the coupling inductor array for being denoted as (C6), one or more of nonmagnetic structures can include At least one nonmagnetic structures, it is arranged to adjacent with each winding ring and multiplies in common length direction with the winding ring In width plane.

(C8) it is one or more of non-in any one of the coupling inductor array of (C6) or (C7) is denoted as Magnetic texure can have the magnetic conductivity of the magnetic conductivity less than the magnetic material with Distributed gaps.

(C9) it is described in any coupling inductor array being denoted as in the coupling inductor array of (C6) to (C8) One or more nonmagnetic structures can be formed by conductive material, and one or more of nonmagnetic structures can with it is described Multiple winding electric isolution.

(C10) in the coupling inductor array for being denoted as (C9), one or more of nonmagnetic structures and described Multiple windings can be formed by common material.

(C11) in the coupling inductor array for being denoted as (C1), at least two winding rings in the winding ring can With overlapped, finding during cross-section coupling inductor array is such as passed through in the height direction.

(C12) in the coupling inductor array for being denoted as (C11), two winding rings in the winding ring can be wrapped The common length direction enclosed in one chip magnetic core multiplies width region.

(C13) in any one of the coupling inductor array of (C11) or (C12) is denoted as, each winding ring can To surround the corresponding ring region for extending in the longitudinal direction.

(C14) in the coupling inductor array for being denoted as (C13), each ring region can have be generally rectangular Shape.

(C15) in any coupling inductor array being denoted as in the coupling inductor array of (C1) to (C14), tool It is distributed the magnetic powder material that the magnetic material in formula gap can be included in adhesive.

(C16) in the coupling inductor array for being denoted as (C15), the one chip magnetic core can be block magnetic core.

(C17) in the coupling inductor array for being denoted as (C15), the one chip magnetic core can be included in height side The multiple magnetic film layers for stacking upwards.

(D1) it is a kind of for forming the coupling electricity for including that there is at least one magnetic core for being embedded in nonmagnetic structures therein The method of sensor array can comprise the steps：(1) at least two conductor layers are arranged on core portion in the height direction On, so that at least two conductor layer is at least partially formed at least two winding rings, as observed when institute in the height direction See, be arranged on one or more nonmagnetic structures on the core portion and outside at least two windings ring by (2), Magnetic material is arranged on the core portion, at least two conductor by finding during as observed in the height direction, and (3) On layer and one or more of nonmagnetic structures.

(D2) in the method for (D1) is denoted as, the nonmagnetic structures can be arranged on core portion with being less than Magnetic material magnetic conductivity magnetic conductivity.

(D3) in any one for being denoted as the method for (D1) or (D2), one or more of nonmagnetic structures can be with Formed by conductive material, and one or more of nonmagnetic structures can be electrically insulated with least two windings ring.

(D4) in the method for (D3) is denoted as, one or more of nonmagnetic structures and at least two conductor Layer can be formed by common material.

(E1) a kind of coupling inductor array with length, width and height can include by with Distributed gaps One or more the one chip magnetic core of magnetic material formation, the first and second windings and low magnetic permeability magnetic texure.First He Second winding can form corresponding first and second winding turns, and around the public winding axle for extending in the height direction One and second each of winding turns can be embedded into the one chip magnetic core.The low magnetic permeability magnetic texure can be embedded in To in the one chip magnetic core, and ring is formed around public winding axle.The low magnetic permeability magnetic texure can be in short transverse On the first and second winding turns are separated, and the low magnetic permeability magnetic texure can form the one chip by magnetic conductivity ratio The magnetic material that the magnetic conductivity of one or more magnetic material of magnetic core is lower is formed.

(E2) in the coupling inductor array for being denoted as (E1), the first and second winding turns and low magnetic permeability magnetic Structure can jointly surround the Part I of one chip magnetic core, and cross-section coupling inductor array is such as passed through in the height direction Shi Suojian.

(E3) in the coupling inductor array for being denoted as (E2), the Part I of one chip magnetic core can be by magnetic conductivity The magnetic material higher than the magnetic material for forming low magnetic permeability magnetic texure is formed.

(E4) in any one of the coupling inductor array of (E2) or (E3) is denoted as, the first of one chip magnetic core Part can have the shape being generally rectangular, as passed through cross-section coupling inductor array when institute in the height direction See.

(E5) in any coupling inductor array being denoted as in the coupling inductor array of (E1) to (E4), first Can be electrically isolated from each other in one chip magnetic core with each of the second winding.

(E6) in any coupling inductor array being denoted as in the coupling inductor array of (E1) to (E5), formed One or more magnetic material of one chip magnetic core can include the magnetic powder material in adhesive.

(E7) it is described in any coupling inductor array being denoted as in the coupling inductor array of (E1) to (E6) One chip magnetic core can be block magnetic core.

(E8) it is described in any coupling inductor array being denoted as in the coupling inductor array of (E1) to (E6) One chip magnetic core can include the multiple magnetic film layers for stacking in the height direction.

(F1) a kind of coupling inductor array with length, width and height can include by with Distributed gaps One or more the one chip magnetic core of magnetic material formation, the first winding and the second winding.First winding can be embedded into monolithic In formula magnetic core, and the first winding can around the corresponding windings axle for extending in the height direction formed one or more first around Group circle.Each winding axle can other winding axle offsets be opened with each in the direction of the width.Second winding can be embedded into monolithic In formula magnetic core, and the second winding can form corresponding second winding for each of one or more first winding turns Circle.Each second winding turns and its corresponding first winding turns can jointly surround the corresponding common portion of one chip magnetic core, As passed through finding during cross-section coupling inductor array in the height direction.

(F2) in the coupling inductor array for being denoted as (F1), each second winding turns can be in winding axle A corresponding winding axle is formed, so that each second winding turns is same with the corresponding winding turns in multiple first winding turns Axle.

(F3) in any one of the coupling inductor array of (F1) or (F2) is denoted as, the first winding can include Multiple first electric conductors that parallel connection is electrically coupled, the second winding can include multiple second electric conductors being electrically coupled in parallel, and institute Stating multiple second electric conductors can be stacked on the multiple first electric conductor in the height direction.

(F4) in any one of the coupling inductor array of (F1) or (F2) is denoted as, the first winding can include Multiple first electric conductors that parallel connection is electrically coupled, the second winding can include multiple second electric conductors being electrically coupled in parallel, and institute Stating multiple second electric conductors can interlock with the multiple first electric conductor in the height direction.

(F5) in any coupling inductor array being denoted as in the coupling inductor array of (F1) to (F4), each First winding turns can wind in a first direction, and each second winding turns can be in the second party opposite with first direction Winding upwards, such as passes through finding during cross-section coupling inductor array in the height direction.

(F6) in any coupling inductor array being denoted as in the coupling inductor array of (F1) to (F5), monolithic Formula magnetic core can be formed by least two different magnetic materials.

(F7) in the coupling inductor array for being denoted as (F5), the part in winding turns of one chip magnetic core can be with Formed by the magnetic material with the magnetic conductivity high of at least some parts than the magnetic core outside the first and second winding turns, such as Pass through finding during cross-section coupling inductor array in the height direction.

(F8) in any coupling inductor array being denoted as in the coupling inductor array of (F1) to (F7), first Can be electrically isolated from each other in one chip magnetic core with each of the second winding.

(F9) in any coupling inductor array being denoted as in the coupling inductor array of (F1) to (F8), formed One or more magnetic material of one chip magnetic core can include the magnetic powder material in adhesive.

(F10) in the coupling inductor array for being denoted as (F9), the one chip magnetic core can be block magnetic core.

(F11) in the coupling inductor array for being denoted as (F9), the one chip magnetic core can be included in height side The multiple magnetic film layers for stacking upwards.

Can be made a change without departing from this context in methodology above and system.For example, thus it is possible to vary each The quantity of winding in array.Therefore, content being included in described above and shown in the drawings should be construed to illustrative , without that should be explained from limiting meaning.Following claim is intended to general features described in text and specific All statements of the scope of feature and the method and system for being presented are (as language issues it may be said that it falls in the scope It is interior).

Claims

1. a kind of coupling inductor array with length, width and height, the coupling inductor array includes：

The one chip magnetic core formed by one or more magnetic material with Distributed gaps；

First winding and the second winding, first winding and second winding around extend in the height direction it is public around Group axle forms corresponding first winding turns and the second winding turns, and each of first winding turns and second winding turns are embedding Enter in the one chip magnetic core；And

Low magnetic permeability magnetic texure, the low magnetic permeability magnetic texure is embedded in the one chip magnetic core and around the public affairs Winding axle forms ring altogether, and the low magnetic permeability magnetic texure is in the short transverse by first winding turns and described second Winding turns separate, and the low magnetic permeability magnetic texure is by one or more magnetic material than forming the one chip magnetic core Magnetic material with lower magnetic conductivity is formed.

2. coupling inductor array according to claim 1, first winding turns and second winding turns and institute The Part I that low magnetic permeability magnetic texure surrounds the one chip magnetic core jointly is stated, is seen from section such as in the short transverse Finding when examining the coupling inductor array, the Part I of the one chip magnetic core is by than forming the low magnetic permeability magnetic Property structure magnetic material have magnetic conductivity higher magnetic material formed.

3. coupling inductor array according to claim 2, the Part I of the one chip magnetic core has substantially Upper is rectangular shape, finding during coupling inductor array as described in the short transverse from cross-section.

4. coupling inductor array according to claim 1, each of first winding and second winding exist It is electrically isolated from each other in the one chip magnetic core.

5. coupling inductor array according to claim 1, forms one or more magnetic of the one chip magnetic core Property material include adhesive in magnetic powder material.

6. coupling inductor array according to claim 5, the one chip magnetic core is block magnetic core.

7. coupling inductor array according to claim 5, the one chip magnetic core is included in heap in the short transverse Folded multiple magnetic film layers.

8. a kind of coupling inductor array with length, width and height, including：

The first winding in the one chip magnetic core is embedded in, first winding is corresponding around what is extended in the height direction Winding axle forms one or more first winding turns, and each winding axle in the direction of the width open with each by other winding axle offsets； And

The second winding in the one chip magnetic core is embedded in, second winding is directed to one or more of first winding turns Each of form corresponding second winding turns, each second winding turns and its corresponding first winding turns surround the list jointly The corresponding common portion of chip magnetic core, the coupling inductor array when institute as described in the short transverse from cross-section See.

9. coupling inductor array according to claim 8, each second winding turns are corresponding in the winding axle A winding axle and formed, with cause each second winding turns it is coaxial with corresponding first winding turns.

10. coupling inductor array according to claim 9, first winding include it is in parallel be electrically coupled multiple first Electric conductor, and second winding includes multiple second electric conductors being electrically coupled in parallel, and the multiple second electric conductor is in institute State and be stacked in short transverse on the multiple first electric conductor.

11. coupling inductor arrays according to claim 9, first winding includes the multiple first being electrically coupled in parallel Electric conductor, and second winding includes multiple second electric conductors being electrically coupled in parallel, and the multiple second electric conductor is in institute State and interlock with the multiple first electric conductor in short transverse.

12. coupling inductor arrays according to claim 8, each first winding turns wind along a first direction, and Each second winding turns winds along second direction opposite to the first direction, is seen from section such as in the short transverse Finding when examining the coupling inductor array.

13. coupling inductor arrays according to claim 8, the one chip magnetic core is by least two different magnetic materials Material is formed.

14. coupling inductor arrays according to claim 13, part of the one chip magnetic core in the winding turns There is magnetic conductance higher by least some parts than the magnetic core outside first winding turns and second winding turns The magnetic material of rate is formed, finding during coupling inductor array as described in the short transverse from cross-section.

15. coupling inductor arrays according to claim 8, each of first winding and second winding exist It is electrically isolated from each other in the one chip magnetic core.

16. coupling inductor arrays according to claim 8, form one or more magnetic of the one chip magnetic core Property material include adhesive in magnetic powder material.

17. coupling inductor arrays according to claim 16, the one chip magnetic core is block magnetic core.

18. coupling inductor arrays according to claim 16, the one chip magnetic core is included in the short transverse Multiple magnetic film layers of stacking.