CN106934391A - A kind of fingerprint recognition home key and its manufacture method - Google Patents
A kind of fingerprint recognition home key and its manufacture method Download PDFInfo
- Publication number
- CN106934391A CN106934391A CN201710313786.6A CN201710313786A CN106934391A CN 106934391 A CN106934391 A CN 106934391A CN 201710313786 A CN201710313786 A CN 201710313786A CN 106934391 A CN106934391 A CN 106934391A
- Authority
- CN
- China
- Prior art keywords
- film
- outward appearance
- identification sensor
- fingerprint identification
- bonding film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 5
- 238000004080 punching Methods 0.000 claims abstract description 4
- 239000010408 film Substances 0.000 claims description 129
- 239000010409 thin film Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 abstract description 2
- 239000011521 glass Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Abstract
The invention discloses a kind of fingerprint recognition home key and its manufacture method, the fingerprint recognition home key includes fingerprint Identification sensor, fingerprint Identification sensor upper end side installs outward appearance film, outward appearance film lower surface is printed with back up layer, back up layer lower surface is Nian Jie with fingerprint Identification sensor upper surface by bonding film, and the centre position of bonding film is hollow structure and bonding film is overleaf formed with air-gap between printing layer and fingerprint Identification sensor.The manufacture method is comprised the following steps that：A, FPCB printed circuit substrates upper surface carry fingerprint Identification sensor；B, carry out back up at the outward appearance film back side；C, overleaf printing layer lower surface adhesive bonding film；D, punching interception is carried out with home key shape to outward appearance film；The center section of e, interception bonding film；F, bonding film is attached to fingerprint Identification sensor upper surface；The preparation method can also improve bonding flat board and workability while raising home key is attractive in appearance.
Description
Technical field
The present invention relates to fingerprint identification technology field, more particularly to a kind of fingerprint recognition home key and its manufacture method.
Background technology
Fingerprint identification technology is the technology that can prevent various security accidents by user's registration and authentication procedure；It is more detailed
Carefully, fingerprint identification technology is applied to personal and tissue network protection, the protection of various contents and data, the access control of safety
System etc..
As the user using various portable units such as smart mobile phone and panel computers increases sharply, continually there is user and do not wish
The accident for occurring is hoped, i.e., the personal information for storing on a portable device and content are to external leakage.Fig. 1 is common portable unit generation
The schematic diagram of table, as shown in figure 1,
Smart mobile phone 10 or panel computer be by main body, the display device of the large area for being formed at before each main body center,
The home key 11 for being formed at the side of each display device is constituted；It should further be noted that home key 11 is to be embodied in smart mobile phone
10 or panel computer in setting action composition, there is provided press when using portable unit or touch home key 11, you can extensive
The facilitating functions such as the multiple initial stage picture to device.Need to be explained further, the fingerprint identification technology of electrostatic means is using skin
Conductive characteristic reads the mode of the electrical signals of the different intrinsic fingerprint shape of each user.
In addition, Fig. 2 is the sectional view of existing fingerprint recognition home key, as shown in Fig. 2 existing fingerprint recognition home key 11
It is the solution of coated with resins adhesive 113 and to bond glass 112 and constitute on fingerprint Identification sensor 111, but is set in coating
During the solution adhering glass 112 of fat adhesive 113, it is impossible to which applying strength to glass 112 bonds it；Therefore, it is existing
There is the phenomenon that fingerprint Identification sensor 111 can not be bonded correctly with glass 112 in fingerprint recognition home key 11, or cause glass
112 cause fingerprint recognition rate bad because the flatness of glass 112 is uneven below.In addition, molten in coated with resins adhesive 113
Glass 112 is placed after liquid in the above, workability is bad.
The content of the invention
It is an object of the invention to provide a kind of fingerprint recognition home key, the fingerprint recognition home key can improve attractive in appearance
While can also improve bonding flat board and workability.
Another object of the present invention is to provide a kind of manufacture method of fingerprint recognition home key, the fingerprint recognition home key
Manufacture method can improve home key it is attractive in appearance while can also improve bonding flat board and workability.
To reach above-mentioned purpose, the present invention is achieved through the following technical solutions.
A kind of fingerprint recognition home key, includes carrying and is installed in FPCB printed circuit substrates top and shape and fingerprint knowledge
The fingerprint Identification sensor that another edition of a book position key-shaped shape is adapted, the upper end side of fingerprint Identification sensor is equiped with the outer of flexible deformable
Film is seen, the lower surface of outward appearance film is printed with back up layer, and the lower surface bonds of back up layer have along back side print
The edge of brush layer extends and in the bonding film for enclosing shape entirely, and bonding film is located at the identification position periphery of fingerprint Identification sensor, glues
The centre position of film is closed for hollow structure and bonding film is overleaf formed with air-gap between printing layer and fingerprint Identification sensor,
The lower surface of bonding film is Nian Jie with fingerprint Identification sensor；
Outward appearance film, back up layer, the thin film component that is constituted of bonding film as fingerprint Identification sensor protection structure, hand
Refer to that when outward appearance film upper surface applies touch pressure, fingerprint Identification sensor recognizes the fingerprint shape of finger, and fingerprint recognition
The analog signal of detection is converted to data signal and transmits to FPCB printed circuit substrates numerical signal by sensor.
Wherein, the outward appearance film is plastic sheeting or film injection article with capacitivity.
Wherein, the thickness of the outward appearance film is 10-200.
Wherein, the bonding film is by OCA films, OCR films, DAF films or the membrane structure formed by adhesive.
Wherein, the thickness of the bonding film is 10-200.
A kind of manufacture method of fingerprint recognition home key, includes following processing step, specifically：
A, carry the fingerprint recognition that is adapted with fingerprint recognition home key shape in the upper surface of FPCB printed circuit substrates and sense
Device；
B, back up is carried out at the back side of outward appearance film, back up layer is formed with the outward appearance film back side；
The lower surface adhesive bonding film of c, overleaf printing layer；
D, the outward appearance film to being attached with bonding film carry out punching interception with home key shape, caused the shape of outward appearance film with
The shape of fingerprint Identification sensor is adapted；
E, the outward appearance film to being attached with bonding film carry out punch press process, and intercept the center section of bonding film, to cause bonding
The centre position of film forms hollow structure；
F, the upper surface that the bonding film for being only left marginal portion is attached to fingerprint Identification sensor.
Wherein, the centre position of the bonding film is for hollow structure and bonding film is in back up layer and the fingerprint
Air-gap, the thin film component that the outward appearance film, back up layer, bonding film are constituted are formed between identification sensor
Used as the protection structure of fingerprint Identification sensor, when outward appearance film upper surface applies touch pressure, fingerprint recognition is sensed finger
Device recognizes the fingerprint shape of finger, and the analog signal of detection is converted to data signal and believes numerical value by fingerprint Identification sensor
Number transmit to FPCB printed circuit substrates.
Beneficial effects of the present invention are：A kind of fingerprint recognition home key of the present invention, includes carrying and is installed in
The fingerprint Identification sensor that FPCB printed circuit substrates top and shape are adapted with fingerprint recognition home key shape, fingerprint recognition
The upper end side of sensor is equiped with the outward appearance film of flexible deformable, and the lower surface of outward appearance film is printed with back up layer,
The lower surface bonds of back up layer to be had extend along the edge of back up layer and in the bonding film for enclosing shape entirely, bonding film position
In the identification position periphery of fingerprint Identification sensor, the centre position of bonding film is hollow structure and bonding film overleaf printing layer
Air-gap is formed between fingerprint Identification sensor, the lower surface of bonding film is Nian Jie with fingerprint Identification sensor；By above-mentioned
Structure design, the fingerprint recognition home key can also improve bonding flat board and workability while improving attractive in appearance.
The present invention is another to be had the beneficial effect that：A kind of manufacture method of fingerprint recognition home key of the present invention, it includes
There is following processing step：A, carry the finger that is adapted with fingerprint recognition home key shape in the upper surface of FPCB printed circuit substrates
Line identification sensor；B, back up is carried out at the back side of outward appearance film, back up layer is formed with the outward appearance film back side；c、
The overleaf lower surface adhesive bonding film of printing layer；D, the outward appearance film to being attached with bonding film are punched with home key shape
Interception, such that the shape of outward appearance film is adapted with the shape of fingerprint Identification sensor；E, the outward appearance to being attached with bonding film
Film carries out punch press process, and intercepts the center section of bonding film, to cause that the centre position of bonding film forms hollow structure；f、
The bonding film for being only left marginal portion is attached to the upper surface of fingerprint Identification sensor.Designed by above-mentioned processing step, should
Preparation method can also improve bonding flat board and workability while raising home key is attractive in appearance.
Brief description of the drawings
The present invention is further detailed below with accompanying drawing, but the embodiment in accompanying drawing is not constituted to this hair
Bright any limitation.
Fig. 1 is the structural representation of smart mobile phone.
Fig. 2 is the generalized section of fingerprint recognition home key of the prior art.
Fig. 3 is structural representation of the invention.
Fig. 4 is the structural representation of OCA films of the invention.
Fig. 5 is manufacture flow process chart of the invention.
Included in Fig. 1 to Fig. 4：
10 --- smart mobile phone 11 --- home keys
111 --- fingerprint Identification sensor 112 --- glass
113 --- resin binder 210 --- fingerprint Identification sensors
220 --- bonding film 230 --- outward appearance films
240 --- back up layer 250 --- air-gaps.
Specific embodiment
With reference to specific embodiment, the present invention will be described.
As shown in Figure 3 and Figure 4, a kind of fingerprint recognition home key, includes carrying and is installed on FPCB printed circuit substrates
The fingerprint Identification sensor 210 that portion and shape are adapted with fingerprint recognition home key shape, the upper end of fingerprint Identification sensor 210
Side is equiped with the outward appearance film 230 of flexible deformable, and the lower surface of outward appearance film 230 is printed with back up layer 240, the back side
The lower surface bonds of printing layer 240 have the edge extension along back up layer 240 and in the bonding film 220 for enclosing shape entirely, glue
The identification position periphery that film 220 is located at fingerprint Identification sensor 210 is closed, the centre position of bonding film 220 is hollow structure and glues
Close film 220 and air-gap 250, the following table of bonding film 220 are overleaf formed between printing layer 240 and fingerprint Identification sensor 210
Face is be bonded with fingerprint Identification sensor 210.
Wherein, the thin film component that outward appearance film 230, back up layer 240, bonding film 220 is constituted is used as fingerprint recognition
The protection structure of sensor 210, finger when the upper surface of outward appearance film 230 applies touch pressure, know by fingerprint Identification sensor 210
The fingerprint shape of other finger, and the analog signal of detection is converted to data signal and believes numerical value by fingerprint Identification sensor 210
Number transmit to FPCB printed circuit substrates.
Need to be explained further, outward appearance film 230 is plastic sheeting or film injection article with capacitivity, and outward appearance is thin
The thickness of film 230 is 10-200.
In addition, bonding film 220 is by OCA films, OCR films, DAF films or the membrane structure formed by adhesive, and bonding film
220 thickness is 10-200.
The present invention is thin by the outward appearance of printed back printing layer 240 by the dielectric bonding film 220 in two sides optics adherence
Together with film 230 is bonded in fingerprint Identification sensor 210, the structure design can effectively improve aesthetic feeling, and it is flat to improve bonding
Plate.
For the fingerprint recognition home key of said structure, it can be prepared from using the production of following manufacture,
Specifically, a kind of manufacture method of fingerprint recognition home key, it includes following processing step：
A, carry the fingerprint recognition that is adapted with fingerprint recognition home key shape in the upper surface of FPCB printed circuit substrates and sense
Device 210；
B, back up is carried out at the back side of outward appearance film 230, back up layer 240 is formed with the back side of outward appearance film 230；
The lower surface adhesive bonding film 220 of c, overleaf printing layer 240；
D, the outward appearance film 230 to being attached with bonding film 220 carry out punching interception with home key shape, have caused outward appearance film
230 shape is adapted with the shape of fingerprint Identification sensor 210；
E, the outward appearance film 230 to being attached with bonding film 220 carry out punch press process, and intercept the center section of bonding film 220, with
So that the centre position of bonding film 220 forms hollow structure；
F, the upper surface that the bonding film 220 for being only left marginal portion is attached to fingerprint Identification sensor 210.
It should further be noted that the centre position of bonding film 220 is hollow structure and bonding film 220 overleaf printing layer 240
Air-gap 250, outward appearance film 230, the back up layer 240, institute of bonding film 220 are formed between fingerprint Identification sensor 210
The thin film component of composition as fingerprint Identification sensor 210 protection structure, finger in the upper surface of outward appearance film 230 apply touch
During pressure, fingerprint Identification sensor 210 recognizes the fingerprint shape of finger, and the simulation letter that fingerprint Identification sensor 210 will be detected
Number be converted to data signal and transmit to FPCB printed circuit substrates numerical signal.
Wherein, bonding film 220 can first be attached to back up layer 240 lower surface, then again with fingerprint Identification sensor
210 are bonded to realize that outward appearance film 230 is be bonded with fingerprint Identification sensor 210；First bonding film 220 can certainly be attached to
The upper surface of fingerprint Identification sensor 210, it is then Nian Jie with the back up of outward appearance film 230 layer 240 realizing that outward appearance is thin again
Film 230 is be bonded with fingerprint Identification sensor 210.
By said structure design, the manufacture method can effectively be produced and prepare above-mentioned fingerprint recognition home key, and energy
It is enough that bonding flat board and workability can be also improved while raising home key is attractive in appearance.
Above content is only presently preferred embodiments of the present invention, for one of ordinary skill in the art, according to of the invention
Thought, will change in specific embodiments and applications, and this specification content should not be construed as to the present invention
Limitation.
Claims (7)
1. a kind of fingerprint recognition home key, it is characterised in that：Include carrying and be installed in FPCB printed circuit substrates top and shape
The fingerprint Identification sensor that shape is adapted with fingerprint recognition home key shape（210）, fingerprint Identification sensor（210）Upper end side
It is equiped with the outward appearance film of flexible deformable（230）, outward appearance film（230）Lower surface be printed with back up layer（240）,
Back up layer（240）Lower surface bonds have along back up layer（240）Edge extend and in the bonding for enclosing shape entirely
Film（220）, bonding film（220）Positioned at fingerprint Identification sensor（210）Identification position periphery, bonding film（220）Interposition
It is set to hollow structure and bonding film（220）Overleaf printing layer（240）With fingerprint Identification sensor（210）Between be formed with air
Gap（250）, bonding film（220）Lower surface and fingerprint Identification sensor（210）Bonding；
Outward appearance film（230）, back up layer（240）, bonding film（220）The thin film component for being constituted is sensed as fingerprint recognition
Device（210）Protection structure, finger is in outward appearance film（230）When upper surface applies touch pressure, fingerprint Identification sensor（210）
Recognize the fingerprint shape of finger, and fingerprint Identification sensor（210）The analog signal of detection is converted into data signal and by number
Value signal is transmitted to FPCB printed circuit substrates.
2. a kind of fingerprint recognition home key according to claim 1, it is characterised in that：The outward appearance film（230）It is tool
There are the plastic sheeting or film injection article of capacitivity.
3. a kind of fingerprint recognition home key according to claim 2, it is characterised in that：The outward appearance film（230）Thickness
It is 10-200 to spend.
4. a kind of fingerprint recognition home key according to claim 1, it is characterised in that：The bonding film（220）It is OCA
Film, OCR films, DAF films or the membrane structure formed by adhesive.
5. a kind of fingerprint recognition home key according to claim 4, it is characterised in that：The bonding film（220）Thickness
It is 10-200.
6. a kind of manufacture method of fingerprint recognition home key, it is characterised in that include following processing step, specifically：
A, carry the fingerprint recognition that is adapted with fingerprint recognition home key shape in the upper surface of FPCB printed circuit substrates and sense
Device（210）；
B, in outward appearance film（230）The back side carry out back up, with outward appearance film（230）The back side forms back up layer
（240）；
C, overleaf printing layer（240）Lower surface adhesive bonding film（220）；
D, to being attached with bonding film（220）Outward appearance film（230）Punching interception is carried out with home key shape, such that outward appearance is thin
Film（230）Shape and fingerprint Identification sensor（210）Shape be adapted；
E, to being attached with bonding film（220）Outward appearance film（230）Punch press process is carried out, and intercepts bonding film（220）Centre
Part, to cause bonding film（220）Centre position formed hollow structure；
F, will only be left marginal portion bonding film（220）It is attached to fingerprint Identification sensor（210）Upper surface.
7. the manufacture method of a kind of fingerprint recognition home key according to claim 6, it is characterised in that：The bonding film
（220）Centre position be hollow structure and bonding film（220）In back up layer（240）Sensed with the fingerprint recognition
Device（210）Between be formed with air-gap（250）, the outward appearance film（230）, back up layer（240）, bonding film
（220）The thin film component for being constituted is used as fingerprint Identification sensor（210）Protection structure, finger is in outward appearance film（230）On
When surface applies touch pressure, fingerprint Identification sensor（210）Recognize the fingerprint shape of finger, and fingerprint Identification sensor
（210）The analog signal of detection is converted into data signal and numerical signal is transmitted to FPCB printed circuit substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710313786.6A CN106934391A (en) | 2017-05-05 | 2017-05-05 | A kind of fingerprint recognition home key and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710313786.6A CN106934391A (en) | 2017-05-05 | 2017-05-05 | A kind of fingerprint recognition home key and its manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106934391A true CN106934391A (en) | 2017-07-07 |
Family
ID=59430269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710313786.6A Pending CN106934391A (en) | 2017-05-05 | 2017-05-05 | A kind of fingerprint recognition home key and its manufacture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106934391A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11891213B2 (en) | 2019-02-11 | 2024-02-06 | The Glad Products Company | Thermoplastic bags with duplicative seals |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104239848A (en) * | 2013-06-10 | 2014-12-24 | 得英特株式会社 | Method of manufacturing fingerprint recognition home key |
| CN104252619A (en) * | 2013-06-26 | 2014-12-31 | 得英特株式会社 | Method of manufacturing fingerprint recognition home key and structure of fingerprint recognition home key |
-
2017
- 2017-05-05 CN CN201710313786.6A patent/CN106934391A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104239848A (en) * | 2013-06-10 | 2014-12-24 | 得英特株式会社 | Method of manufacturing fingerprint recognition home key |
| CN104252619A (en) * | 2013-06-26 | 2014-12-31 | 得英特株式会社 | Method of manufacturing fingerprint recognition home key and structure of fingerprint recognition home key |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11891213B2 (en) | 2019-02-11 | 2024-02-06 | The Glad Products Company | Thermoplastic bags with duplicative seals |
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| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20231229 |