CN106931313A - LED light device and its manufacture method - Google Patents

Abstract

The present invention provides a kind of LED light device and its manufacture method, it is main be metallic plate punching and shape tool 3d space a conductive plate, and the conductive plate is provided with a lighting circuit, then the conductive plate is supported with a support frame, to constitute polytype lighting device of the invention；The present invention fixes the conductive plate with support frame support, is beneficial to the conductive plate and is formed space multistory curved surface, and the present invention is additionally provided with a protection LED chip pad mechanism, each LED chip pad is protected according to this.Apparatus of the present invention may be adapted to largely produce and lift its fine ratio of product, the demand for radiating efficiency high, on a large scale illumination can be met again, saving materials, lightweight or/and environmental protection.

Description

LED light device and its manufacture method

Technical field

The present invention relates to light emitting diode illuminating apparatus, more particularly to main utilization shapes lighting circuit knot with stamp forming technology A kind of LED light device and its manufacture method of structure.

Background technology

Frequently with packaged LED chip as luminescence component, common packing forms have LED light device：DIP is encapsulated LED, SMD encapsulation LED, COB encapsulation LED, CSP encapsulation LED etc., below the encapsulation LED of any of the above form is referred to as LED chip；LED chip also has a heat and passes contact sometimes in addition to conductive electrode contact, for accelerating to be thermally conducted to outside, It is that plurality of LEDs bare crystalline is encapsulated on large-scale aluminium base in order to increase lighting power to have many situations, and its overall dimensions majority is long-range In LED bare crystalline sizes, also referred to as Large size Aluminium substrate package.

The common functional requirement of LED light device and known scheme are described as follows：Radiating requirements：Taiwan new patent TWM337844, great power LED, new patent case is arranged on electrode pin on sheet metal, increases the effect of area of dissipation, But the program does not pass the structure of contact using heat, does not disclose integral heat sink conception during lighting device yet；

Chinese patent CN102494257A, the large-angle LED ball bulb of the naturally inside and outside heat loss through convection of air, case LED chip patch Having on the polygon bodily form thermal column of multiple heat dissipation channels, radiating of being circulated naturally by heat dissipation channel air, due to the spy of the program The thermal column of fixed column shape can only provide the illumination in annular circumferential direction, and the scheme of other illumination zones is not proposed；

Taiwan Patent TWM477544, disclose a ring-like LED bulb radiator, the case bulb be a plane annular LED module simultaneously Have ring-like light shield, cold air is directly entered at radiator high temperature from central through part, take away after used heat from radiator upper half Portion opening is discharged, and program illumination zone must can just be reached by ring-type diffuser；

United States Patent (USP) US2014/029362A1, discloses a kind of LED radiator structure, and the Patent Case LED aluminum base plate is installed outside On shell, insulation inner sleeve and shell collocated form airflow clearance and are installed along with lamp holder, and cover surface air vent is extremely The air-flow through hole that formation is connected with airflow clearance on aluminium base, can in time take away the heat that drive circuit and LED aluminum base plate are produced；

Taiwan Patent TW201330307, the LED 3D curved-surface wire framves of light-emitting device, the program has the light-emitting device of curved surface, The radiating fin of its aluminium alloy body needs to expend the aluminium of volume.

Illumination zone demand：Taiwan Patent TWM405524 discloses a kind of LED stereo bulbs, has several LED chips to fill respectively Located at several inclination loading surfaces, and the range of exposures of augmentation LED light source body；

Japan Patent JP2014003032A, discloses LED core sheet on the aluminium base by cutting, then aluminium base is bent Enable LED chip luminous in circumferencial direction；

Japan Patent JP2014093235A, discloses a kind of oval column type bulb lamp of small-sized small-power, may be mounted in light fixture, Improved by the uniformity of irradiation light by mirror surface；

United States Patent (USP) US2012062151A1, a kind of photosphere is constituted using the flexible electric circuit board equipped with LED chip, makes hair Photosphere physical efficiency meets the lighting demand of 3D spheres；

Taiwan Patent TW201330307, discloses a kind of LED 3D curved-surface wire framves of light-emitting device, the LED 3D of the program Curved-surface wire frame can meet various illumination zone demands；

United States Patent (USP) US2014/0254145A1, discloses and double inclined plane is made in the structure of fluorescent tube for being provided with LED chip envelope The aluminium base of dress, can meet the demand of illumination zone, and radiated using the structure of large area.Materials demand：One As traditional LEDbulb lamp cost structure in, sheet radiating fins that majority is made using the metal aluminium flake of volume or aluminium die casting or Structural member, future uses environmental protection less material.

Ecological requirements：Taiwan Patent TW201330307, the LED 3D curved-surface wire framves of light-emitting device, the processing procedure of curved-surface wire frame Meet ecological requirements, but the light-emitting device aluminium alloy body of the program needs to use the aluminium of volume；

United States Patent (USP) US2014/0254145A1, discloses LED chip and is arranged on the circuit of aluminium base, it is necessary to many PCB Chemical process；

United States Patent (USP) US2012/006215A1, disclose needs many PCB chemical process using flexible electric circuit board, it is impossible to meet high Power radiating requirements and ecological requirements；

United States Patent (USP) US2014/0293624A1, the aluminium base that announcement is used needs many PCB chemical process.

There is stamping drawdown into 3D structures in known sheet metal processing procedure and then cut and to form circuit and constitute similar conduction of the invention Plate, but such processing procedure is more quick in formingspace structure, but cutting circuit and then manually on solid surface Do that LED chip is glutinous brilliant and welding processing procedure but lack advantage, and such scheme to be limited to volume production high cost low with processing procedure reliability.

The content of the invention

Based on the problem points of above-mentioned existing LED light device, the present invention provides a kind of LED light device and its manufacture method, this hair Bright conductive plate is made with conductive metal sheet, and in advance with surface insulation treatment, for example, to spray or print insulated paint etc., symbol The insulating requirements of electrical safety regulation are closed, and each isolation channel also complies with the requirement of electrical safety regulation with the width of slot electrode, and make The metal of electrode contact exposes.

It is a primary object of the present invention to provide:Unified using thermoelectricity and with stereo luminous curved surface concept, make what LED chip was produced Heat can carry a large amount of heat loss through convection of acceleration by the metal conductive plate of large area；Secondary objective of the invention is to provide:In ring It is free from environmental pollution using machining processing procedure on the premise of protecting preferentially；Another object of the present invention is to provide:On the conductive plate LED chip pad protection mechanism, the fraction defective on processing procedure can be reduced；It is still another object of the present invention to provide:Use Less material, can lightweight light fixture weight person.

It is that the present invention is main to be combined with each other with the conductive plate made by metal with a support frame of tool insulating effect up to above-mentioned purpose Into a lighting device, and fixed support conductive plate is used in each processing procedure of the invention with the support frame, is shone with the sharp present invention The shaping of bright circuit.

The support frame, the main body of support frame is constituted by several strip ribs, and the conductive plate being installed in inner space； And its each ribs must coordinate to should be set by conductive plate list structure；Each ribs are provided with several fixed bit posts, every A supporting surface is provided between group fixed column, each supporting surface is used for fitting and supports the fixed pan structure of the conductive plate, and each fixed column The fixing hole set by the conductive plate must be passed through to be combined, to protect the electrode welding point of each LED chip；Filled between the ribs It is provided with more than one air vent separately；Each assisted parts that cut the conductive plate is all contained by the area of an air vent Lid, under stamping mold pressing, the fixed pan structure is fixed with ribs by pressing, uses each assisted parts of incision.

The conductive plate, the flitch as made by conductive metal sheet via punching press and cutting, the conductive plate removed by the flitch simultaneously has There is list structure, under the demand for meeting connection in series-parallel lighting circuit, the various 3D curved surfaces of shaping can be bent.

And in being formed with a series-parallel lighting circuit on the conductive plate, and the lighting circuit divides several parallel connections by several isolation channel Circuit region, then each parallel circuit area is divided by a slot electrode, then be arranged in the parallel circuit area with several LED chips；Change speech It, is constituted the parallel circuit area, and then constitute several parallel circuit areas with several list structures, link portions；By each group The high-potential electrode contact of the LED chip in parallel circuit area does parallel connection by the linking part in its area, its low-potential electrode contact Another linking part in Ze Youqi areas does parallel connection, and these linking parts must bridge isolation channel, the linking part bridging outside Ling You areas Isolation channel does each parallel circuit area of series connection；Special one carries, if each slot electrode is located at when on isolation channel, by each assisted parts simultaneously Cross-over electrode groove and isolation channel.

Further, comprised at least on the conductive plate：One power supply contact, a location division, several isolation channels, several linking parts, number Individual list structure and the fixed pan structure are formed with the protection mechanism of LED chip pad；

The location division, positioning action when referring to that the conductive plate will bend shaping, it is 3D curved surfaces that can be stamped into shape with the sharp conductive plate；

The isolation channel, the conductive plate isolation channel is divided into the structure of several strips, or a list structure is divided into more again The list structure of subsection；Each isolation channel just for done between the high potential circuit and low potential circuit between each group of parallel circuit every From, and several slot electrodes are provided with the isolation channel if necessary depending on circuit requirements；

Several linking parts, are located at the side of the electrode of the slot electrode, the high-potential electrode in each parallel circuit area can be serially connected in Together, and low-potential electrode is serially connected outer, can also connect each parallel circuit area, in turn, ensure that the conductive plate stamping After can maintain integral shape；Can also be made on the position in partial link portion and locally bend deformation, 3D curved surface conductive plates are met according to this Demand；

The fixed pan structure, refers between each fixing hole of the conductive plate, around LED chip and its institute's structure such as non-open area Into plane；When the conductive plate will carry out bending shaping, punching press stamping mold avoids LED chip and its pad, and at this Fixed pan structure is pressed, with the stamping of the sharp conductive plate, to ensure that its slot electrode will not deform and protect each LED Chip electrode pad；Special one carries, the fixed pan structure according to the configuration of each LED chip can be an endless belt-shaped structure, One annular concentric banded structure, a U-shaped strip arrangement architecture, a rectangular arranged structure etc..

Further, the protection mechanism of the LED chip pad, refer to each fixing hole by the conductive plate, fixed pan structure with The ribs of the support frame, supporting surface, fixed column are constituted, wherein must be arranged in slot electrode with several assisted parts and be constituted list The conductive plate of one component, then between each fixing hole of the conductive plate, around LED chip and its non-open area etc. is constituted Fixed pan structure is used as punching press positioning region, then coordinates each fixing hole of the conductive plate to be combined with each fixed column of the support frame, And each supporting surface of the support frame sticks to the fixed pan structure for supporting the conductive plate.

The manufacture method of lighting device of the present invention, includes：One gets the raw materials ready processing procedure and a molding process；Wherein the processing procedure of getting the raw materials ready also is wrapped Contain：One blanking processing procedure, a glutinous crystalline substance processing procedure, a feeding processing procedure, and the molding process includes：One shaping prepares processing procedure, one Bending processing procedure, a combination processing procedure, assisted parts excision processing procedure etc.；And several fixed pan structures of conductive plate in above-mentioned processing procedure, Several ribs of fixing hole, assisted parts and support frame, supporting surface, support column constitute foregoing LED chip welding point protection machine System, to reduce the fraction defective in processing procedure.Each processing procedure implements its content and is not limited to only implement once depending on demand, every processing procedure Description of contents is as follows：

The blanking processing procedure, shearing is first passed through as a flitch by a metallic plate, makes to include several list structures on the flitch, Each list structure is separated by several isolation channels, and each to link with the linking part of bridging isolation channel by that can cause each assisted parts of short circuit List structure, makes the integral platy structure of the flitch；

The glutinous brilliant processing procedure, each LED chip is welded on several slot electrodes of the flitch；

The feeding processing procedure, a pressed sheet is removed by cutting off several connecting piece on the flitch；

The shaping prepares processing procedure, the location division of the pressed sheet is pressed positioning with stamping mold, according to the 3D shapes of the conductive plate plate Shape, carries out the deformation needed for precompressed is produced with stamping mold, wherein the deformation comprising each kink with each linking part in predetermined position；

The bending processing procedure, presses each fixed pan structure of the pressed sheet of advance deformation using stamping mold, and to its each bending Portion is bent, to complete the forming operation of the conductive plate；The bending processing procedure can be in the forward and backward operation of the combination processing procedure；

The combination processing procedure, the conductive plate is combined and is fixed on the support frame, and each fixed column of the support frame is passed through into the conductive plate Set each fixing hole, and its each ribs supporting surface laminating support the conductive plate fixed pan structure, to provide the conduction The necessary structural strength of plate, and be conducive to the conductive plate to carry out unfinished bending processing procedure, and the support frame each ribs it Between vent area obtain and must cover the conductive plate assisted parts to be cut open；The assisted parts cuts off processing procedure, in stamping mold pressing The fixed pan structure of the conductive plate, each ribs of support frame, then cut each assisted parts, the string complete to constitute the present invention Lighting circuit in parallel.

The manufacture method of above-mentioned lighting device in the bending processing procedure, combination processing procedure between, also comprising a shaping processing procedure, to formed Conductive plate further do more accurate forming dimension.

The present invention can reach following effect with above-mentioned technological means:

1. conductive plate of the present invention uses list structure, and it is most environmentally friendly and few using material that punching press cuts processing procedure, makes it in welding LED chip When, the heat that the low-potential electrode on each slot electrode can cover each LED chip passes contact；Because using its thermoelectricity unification list structure Conductive plate, and coordinate the support frame, to provide dual large area radiating (can also be radiated comprising support frame), the present invention is lifted according to this and is dissipated The thermal efficiency.

2. the present invention with mechanical punching without polluting the environment；Flitch before conductive plate shaping is well suited for a large amount of glutinous brilliant welding systems Journey, is capable of achieving the scheme of a large amount of productions；The present invention makes each list structure easily be bent into 3D curved surfaces using bending processing procedure, makes this The illumination zone of invention is easily designed and adjusts.

3. the present invention provides the protection mechanism of a LED chip pad, can make the electrode welding point of each LED chip of the invention in each Protection is acquired in processing procedure, it is possible to decrease the deflection of each LED chip electrode welding point, fine ratio of product is lifted according to this.

4. conductive plate of the invention is lamellar, and metal material consumption is few, can be while the weight person of lightweight lighting device of the present invention.

Brief description of the drawings

Fig. 1 is the outside drawing of plane bulb lamp of the present invention；

Fig. 1 a are the exploded views of plane bulb lamp of the present invention；

Fig. 1 b are the combination sections of plane bulb lamp of the present invention；

Fig. 1 c are the circuit diagrams of plane bulb lamp of the present invention；

Fig. 1 d are the schematic diagrames of the flitch of plane bulb lamp of the present invention；

Fig. 1 e are the schematic diagrames of the pressed sheet of plane bulb lamp of the present invention；

Fig. 1 f are the outside drawings of the support frame of plane bulb lamp of the present invention；

Fig. 1 g are the three-dimensional half-sectional combination diagrams of plane bulb lamp lighting device of the present invention；

Fig. 1 h are the schematic diagrames of the assisted parts excision of plane bulb lamp conductive plate of the present invention；

Fig. 1 i are the manufacture method process step figures of plane bulb lamp lighting device of the present invention；

Fig. 2 is the outside drawing of convex surface bulb lamp of the present invention；

Fig. 2 a are the exploded views of convex surface bulb lamp of the present invention；

Fig. 2 b are the combination sections of convex surface bulb lamp of the present invention；

Fig. 2 c are the schematic diagrames of the flitch of convex surface bulb lamp of the present invention；

Fig. 2 d are the schematic diagrames of the pressed sheet of convex surface bulb lamp of the present invention；

Fig. 2 e are the outside drawings of the support frame of convex surface bulb lamp of the present invention；

Fig. 2 f are the three-dimensional half-sectional views of convex surface bulb lamp lighting device of the present invention；

Fig. 2 g are the ball curved surface bending shaping schematic diagrames of convex surface bulb lamp conductive plate of the present invention；

Fig. 2 h are the assisted parts excision schematic diagrames of convex surface bulb lamp conductive plate of the present invention；

Fig. 2 i are the manufacture method process step figures of convex surface bulb lamp lighting device of the present invention；

Fig. 3 is the sectional axonometric drawing of concave curved surface bulb lamp of the present invention；

Fig. 3 a are the exploded views of concave curved surface bulb lamp of the present invention；

Fig. 3 b are the combination sections of concave curved surface bulb lamp of the present invention；

Fig. 3 c are the stereo appearance figures of the support frame of concave curved surface bulb lamp of the present invention；

Fig. 3 d are the recessed ball curved surface bending shaping schematic diagrames of concave curved surface bulb lamp conductive plate of the present invention；

Fig. 3 e are the scrobicular ring curved surface bending shaping schematic diagrames of concave curved surface bulb lamp conductive plate of the present invention；

Fig. 3 f are the assisted parts excision schematic diagrames of concave curved surface bulb lamp lighting device of the present invention；

Fig. 4 is the three-dimensional half-sectional view of hemisphere face lamp of the present invention；

Fig. 4 a are the exploded views of hemisphere face lamp of the present invention；

Fig. 4 b are the combination sections of hemisphere face lamp of the present invention；

Fig. 4 c are the circuit diagrams of hemisphere face lamp of the present invention；

Fig. 4 d are the schematic diagrames of the flitch of hemisphere face lamp of the present invention；

Fig. 4 e are the schematic diagrames of the pressed sheet of hemisphere face lamp of the present invention；

Fig. 4 f are the outside drawings of the support frame of hemisphere face lamp of the present invention；

Fig. 4 g are the combination diagrams of hemisphere face lamp lighting apparatus of the present invention；

Fig. 5 is the three-dimensional half-sectional view of globe lamp of the present invention；

Fig. 5 a are the exploded views of globe lamp of the present invention；

Fig. 5 b are the combination sections of globe lamp of the present invention；

Fig. 6 is the outside drawing of long strip type lamp of the present invention；

Fig. 6 a are the three-dimensional half-section diagrams of long strip type lamp of the present invention；

Fig. 6 b are long strip type lamp of the present invention, the circuit diagram of rectangular plane lamp；

Fig. 6 c are the outside drawings of the support frame of long strip type lamp of the present invention；

Fig. 6 d are the schematic diagrames of long strip type lamp lighting apparatus of the present invention；

Fig. 6 e are the three-dimensional part sectioned views of long strip type lamp lighting apparatus of the present invention；

Fig. 7 is the outside drawing of rectangular plane lamp of the present invention；

Fig. 7 a are the exploded views of rectangular plane lamp of the present invention；

Fig. 7 b are the combination sections of rectangular plane lamp of the present invention；

Fig. 7 c are the schematic diagrames of the flitch of rectangular plane lamp of the present invention；

Fig. 7 d are the schematic diagrames of the pressed sheet of rectangular plane lamp of the present invention；

Fig. 7 e are the outside drawings of the support frame of rectangular plane lamp of the present invention；

Fig. 7 f are the three-dimensional combination sections of rectangular plane lamp of the present invention；

Fig. 7 g are longitudinal joint portion shaping schematic diagrames of the conductive plate of rectangular plane lamp of the present invention；

Fig. 7 h are longitudinal kink shaping schematic diagrames of the conductive plate of rectangular plane lamp of the present invention；

Fig. 7 i are the horizontal integration portion shaping schematic diagrames of the conductive plate of rectangular plane lamp of the present invention；

Fig. 7 j are the complete shaping schematic diagrames of the conductive plate of rectangular plane lamp of the present invention；

Fig. 7 k are the manufacture method process step figures of rectangular plane lamp lighting apparatus of the present invention.

Reference：

A:Plane bulb lamp, a:Lighting device

B:Convex surface bulb lamp, b:Lighting device

C:Concave curved surface bulb lamp, c:Lighting device

D:Hemisphere face lamp, d:Lighting device

E:Globe lamp, e:Lighting device

F:Elongated fluorescent tube, f:Lighting device

G:Rectangle plane lamp, g:Lighting device

1、10、100:Lighting circuit

101、102、103、104、105、106:Circuit

11:LED chip, 12:Parallel circuit area

13:Positive electricity source contact, 14:Negative electricity source contact

2:Conductive plate

20、20a、20b、20c:List structure

21、21a、21b:Isolation channel

22:Slot electrode, 221:Assisted parts, 23:Connecting portion

24、24a、24b、24c、24d、24e、24f:Kink

241:Ball curved surface, 241a:Recessed ball curved surface, 242:Ring curved surface, 242a:Scrobicular ring curved surface

243:Cone curved surface, 244:Barrel surface, 245:Inclined-plane

25:Location division, 26:Heat transfer face, 261:Bending hole, 262:Flanging joint portion

27、27a、27b:Fixing hole

28:Fixed pan structure

3、3a:Support frame

30:Ribs, 301 supporting surfaces, 31:Retainer ring

32:Outer ring surface, 320:Outer side edges, 321:Hole for hoist

33:Fixed column, 34:Air vent

35:Clamping slot, 35a:Interior clamping slot

36、36a:Joint portion

37:It is lifting rope and power line

4:Radiating seat, 40:Outer ring surface, 41:Fin

42:Air vent, 43:Opening, 44:Heat transfer face,

5:Joint, 51:Power module

6:Lampshade, 61:Air vent 62:Bail wire 63:Flanging

7:Protective cover, 71:Fixing groove, 72:Bail wire, 73:Air vent

8:Flitch, 80:Pressed sheet, 81:Location hole, 82 connecting piece, 83:Excision hole

9a、9b、9g:Manufacture method

Specific embodiment

The present invention coordinates seven embodiments and seven groups of System Figures on a kind of LED light device and its manufacture method, says according to this Where the core technology that the bright present invention is used.In other words, wherein Fig. 1~Fig. 1 i, are the plane bulb lamp of first embodiment of the invention Lighting device and its manufacture method；Fig. 2~Fig. 2 h, the lighting device of the curved surface bulb lamp on second embodiment of the invention, By that analogy.Special one carries, the main member of various embodiments of the present invention structure, and function identical component is general with an element numbers Include, to simplify present invention explanation.

Fig. 1 e are referred to, the lighting device of various embodiments of the present invention is main to be constituted with reference to a support frame 3 with a conductive plate 2； Wherein the conductive plate 2 cuts into several list structures 20 by a pressed sheet 80 with several isolation channels 21, and by several linking parts 23 across Connect each isolation channel 21 and be connected and form a plane tabular structure (if each slot electrode 22 is located at when on isolation channel 21, by each assisted parts 221 While cross-over electrode groove 22 and isolation channel 21), and each assisted parts 221 causes short circuit, and in the accompanying drawings with diagonal line mode mark Show, recognized with profit.

Fig. 1 g are referred to, the lighting device of various embodiments of the present invention is respectively equipped with the electrode welding point protection mechanism of a LED chip 11： By between each group fixing hole 27 of the conductive plate 2, around LED chip 11 and its non-open area etc. constitutes a fixed pan structure 28, then coordinate each group fixing hole 27 of the conductive plate 2 to be combined with each group fixed column 33 of support frame 3, and positioned at fixed column 33 Between each supporting surface 301 laminating support the fixed pan structure 28；Special one carries, and the fixed pan structure 28 is according to each LED chip 11 configuration can be an endless belt-shaped structure, an annular concentric banded structure, a U-shaped strip arrangement architecture, a rectangular arranged knot Structure etc..

And the sidedness of slot electrode 22 is low-potential electrode 222 and high-potential electrode 223.Wherein several fixing holes 27 must be configured The both sides of slot electrode 22；And each group fixing hole 27 is combined with one group of fixed column 33 of ribs 30, to provide the electricity of LED chip 11 The protection of pole pad.Each fixed column 33 is extended through the mode that each fixing hole 27 is combined, and each fixed column 33 can be made to deform or make The fixed column 33 is set to be fixed on corresponding fixing hole 27 with glue.

Fig. 1 g, Fig. 1 h are referred to, the supporting surface 301 of the ribs 30 of the support frame 3 of various embodiments of the present invention must fit and be supported in this The fixed pan structure 28 of conductive plate 2, to provide the pressing of stamping mold；And an air vent 34 is provided between each ribs 30, and respectively The area of air vent 34 covers the assisted parts 221 to be cut, and each assisted parts 221 is cut open under stamping mold pressing.

Please coordinate with reference to Fig. 1 c, various embodiments of the present invention lighting circuit 1；10；100 include circuit 101, circuit 102, circuit 103rd, circuit 104, circuit 105, circuit 106.The conductive plate 2 corresponds to three three series-parallel circuits 1 simultaneously of string, and it is mainly with three Individual LED chip 11 is a circuit region 12 (being connected to constitute the parallel circuit area 12 with three list structures 20) in parallel, there is three altogether Individual parallel circuit area 12；By the series connection between at least two link portions Zuo Ge parallel circuits areas 12 between each parallel circuit area 12, with Constitute three strings, three lighting circuit 1 simultaneously；

Coordinate again refering to Fig. 1 d, the power supply contact set by the lighting circuit 1 is divided into a positive electricity source contact 13 and a negative electricity source contact again 14；The link portions 23 can be subdivided into parallel circuit：One parallel connection portion 23a1, a parallel connection portion 23a2, a parallel connection portion 23b1, in the lump Connection portion 23b2, a parallel connection portion 23c1, a parallel connection portion 23c2；Then subdivision has a series connection portion 23s1 to be connected with one portion in serial circuit 23s2。

Coordinate again refering to Fig. 1 e, the portion 23a1 in parallel to should the 1st figure (d) circuit 101 link a positive electricity source contact 13, and link The 1st group of high potential contact of LED chip 11, the portion 23a2 in parallel (to should circuit 102) the 1st group of low electricity of LED chip 11 in parallel Position contact, then the portion 23a2 in parallel and portion 23b1 in parallel (to should circuit 103) be connected with series connection portion 23s1；The portion 23b1 in parallel The 2nd group of high potential contact of LED chip in parallel, and the portion 23b2 in parallel (to should circuit 104) the 2nd group of LED chip in parallel is low Electric potential contact, and series connection portion 23s2 connections parallel connection portion 23b2 portion 23c1s in parallel with this (to should circuit 105)；The portion 23c1 in parallel The 3rd group of high potential contact of LED chip 11 in parallel, and the portion 23c2 in parallel (to should circuit 106) the 3rd group of LED chip 11c of parallel connection Low potential contact, and simultaneously link a positive electricity source contact 14.By seven embodiments of the invention, details are as follows respectively:

Refer to Fig. 1~Fig. 1 b, the plane bulb lamp A with flat luminous function of first embodiment of the invention, with a support frame 3 And a conductive plate 2 constitutes a lighting device a；Wherein plane bulb lamp A includes a lampshade 6, an aluminium alloy radiating seat 4, and connects First 5, one conductive plate 2, several LED chips 11, a support frame 3, a power module 51.

Fig. 1~Fig. 1 b are referred to, when plane bulb lamp A is arranged on ceiling, the joint 5 is located at the top；Wherein,

The lampshade 6 is then located at bottom, and the lampshade 6 installation is incorporated into the one end open 43 of the radiating seat 4 and has several air vents 61, to constitute the outward appearance of plane bulb lamp A；

The power module 51 is installed in inside radiating seat 4, and be provided with power line be arranged in respectively the conductive plate 2 power supply contact, Joint 5, to provide the power supply needed for LED chip of the present invention 11；

4 one-tenth tapered tube shape structures of the radiating seat, and periphery is provided with several fin 41, there is several ventilations between each fin 41 Hole 42, heat transfer face 44, outer ring surface 40 are then provided with the side of opening 43.What each LED chip 11 was produced again is thermally conducted to this and leads During electroplax 2, in addition to being cooled down using cross-ventilation, the heat transfer face 26 of conductive plate 2 and radiating of its large area can also be utilized The heat transfer face 44 of seat 4 connects, and on the fin 41 remaining heat transfer to the radiating seat 4, is beneficial to radiating.

Fig. 1 e and Fig. 1 g are referred to, the conductive plate 2 of the shallow cup-like structure with circumferentia must be installed on inside the lampshade 6, and by counting Individual each isolation channel 21 is divided into nine radial direction list structures 20, then bridges isolation channel 21 by each linking part 23 and be connected, to constitute this The lighting circuit of embodiment.Each list structure 20 includes：Several fixing holes 27 are distributed configuration bit in two sides of a slot electrode 22, One kink 24 is located at outside diameter, and the conductive plate 2 has a heat transfer face 26, and the heat transfer face 26 after ring-type is formed after being bent Obtain and connect with the heat transfer face 44 set by the radiating seat 4, as shown in Figure 1 b, and and be affixed with an outer ring surface 32 set by the support frame 3 Close.

Coordinate again with reference to Fig. 1 f, the support frame 3 coordinates 2 one-tenth disc structures with the outer ring surface 32 of the conductive plate, the support frame 3 to obtain The strip ribs 30 for coordinating the conductive plate 2 and being provided with nine arranged radiallys are constituted, and have one group to fix in each ribs 30 A supporting surface 301 is provided between post 33, and two fixed column 30, and then is fitted with each supporting surface 301 and to be supported the conductive plate 2 to consolidate Determine planar structure 28；An air vent 34 is provided between each ribs 30 and circumferential arrangement is formed；Its each group fixed column 33 must be passed through The fixing hole 27 of the conductive plate 2 and be combined with each other, the outer ring surface 32 of the support frame 3 fits with the kink 24 of the conductive plate 2, and The support frame 3 must be combined and is fixed at the opening 43 of the radiating seat.Special one carries, each fixing hole 27 of the conductive plate 2, annular The fixed pan structure 28 of banded structure and the ribs 30 of the support frame 3, supporting surface 301, each fixed column 33 etc. must form this reality Apply the electrode welding point protection mechanism of a LED chip of lighting device a, and the manufacture method 9a of following the present embodiment lighting device a Also there are the means of the LED chip electrode welding point protection mechanism.

Refer to Fig. 1 c~Fig. 1 e, the schematic diagram of plane bulb lamp A series-parallel circuits of the present invention and its be not yet bent over the punching press of shaping Plate 80 (i.e. unfashioned conductive plate 2), a circuit region 12 in parallel is constituted with three list structures 20, then with series connection portion 23s1, string Be serially connected for several circuit regions 12 by connection portion 23s2 bridging isolation channels 21, just forms three lighting circuit simultaneously of string of the present embodiment three 1。

Fig. 1 i, the manufacture method 9a of lighting device a of the present invention are referred to, comprising:One blanking processing procedure, a glutinous crystalline substance processing procedure, a feeding system Journey, a shaping prepare processing procedure, a bending processing procedure, a combination processing procedure and assisted parts excision processing procedure；Wherein,

The blanking processing procedure, such as Fig. 1 d and Fig. 1 e, by a flitch 8 by punching press processing procedure, make the flitch 8 be formed with a pressed sheet 80, The external appearance characteristic of several connecting piece 82, several location holes 81 and several excision holes 83.

The glutinous brilliant processing procedure, each LED chip 11 is welded on several slot electrodes 22 of the pressed sheet 80；

The feeding processing procedure, a pressed sheet 80 is removed by cutting off several connecting piece 82 on the flitch 8；

The shaping prepares processing procedure, when location division 25, the fixed pan structure 28 of pressing the pressed sheet 80 with stamping mold.

80 pairs of kinks 24 of the pressed sheet be bent into the conductive plate 2 of 3D shapes, as shown in Figure 1a by the bending processing procedure.

The combination processing procedure, refers to Fig. 1 g, and then the support frame 3, conductive plate 2 are combined, its outer ring surface 32 and kink 24, Heat transfer face 26 is fitted, and each fixed column 33 is combined through each fixing hole 27, and the supporting surface 301 of each ribs 30 is supported Fix the endless belt-shaped fixed pan structure 28, and the support frame 3 retainer ring 31 through the location division 25 centre bore, to carry For the support of the subsequent job of conductive plate 2, and the protection mechanism of the LED chip electrode welding point is completed, with sharp successive process.

The assisted parts cuts off processing procedure, refers to Fig. 1 h, and the support frame 3 and conductive plate 2 are pressed each assisted parts of incision with stamping mold 221, making the position of the assisted parts 221 of short circuit has turned into slot electrode 22, to constitute the present embodiment three lighting circuit 1 simultaneously of complete three string, As illustrated in figure 1 c.

Fig. 2~Fig. 2 b are referred to, second embodiment of the invention has the convex surface bulb lamp B of convex surface lighting function, with a support frame The 3 and lighting device b of the composition the present embodiment of a conductive plate 2, and continue to use the lighting circuit 1 of above-mentioned first embodiment.The wherein evagination Face bulb lamp B include a lampshade 6, a protective cover 7, a joint 5, a conductive plate 2, several LED chips 11, a support frame 3, One power module 51；

When the lighting device B of the present embodiment is arranged on ceiling, its joint 5 is located at the top, and its lampshade 6 is then located at bottom.And The lampshade 6 connects the support frame 3 being set at the one end open of protective cover 7, and the other end of protective cover 7 then links the joint 5, with Constitute the outward appearance of the present embodiment convex surface bulb lamp B；

The lampshade 6 is hemispherical hatch frame, and installed in the outside of lighting device b, and for transparent or semitransparent material is constituted, Which is provided with several air vents 61, the lampshade 6 and the clamping slot 35 of the embedded support frame 3 and other perforation and combine and fix, such as scheme Shown in 2b；

The protective cover 7 is curved cone tubular construction long, installed in the outside of lighting device b, which is provided with a fixing groove 71, number The barrel surface 244 of individual air vent 73, the wherein conductive plate 2 must be fixed on the fixing groove 71, as shown in Figure 2 b；

The power module 51, is installed in the inside of the conductive plate 2 and is fixed in the protective cover 7, and be provided with power line respectively with this Conductive plate 2 and joint 5 connect, to provide the power supply needed for LED chip of the present invention 11, as shown in Figure 2 b.

Fig. 2 a, Fig. 2 b and Fig. 2 f are referred to, the conductive plate 2 has 3D curved surfaces, and is supported with the support frame 3, fixes the conductive plate 2, The conductive plate 2 is divided into the list structure 20 of circumferential arrangement by each isolation channel 21, and the conductive plate 2 one end by a ball curved surface 241st, a ring curved surface 242 constitutes semi-round ball curved surface, and the other end of the conductive plate 2 is then by the structure of 243 and one barrel surface of cone curved surface 244 Into circular cone tubular.

Further, refer to shown in Fig. 2 d, the structure of conductive plate 2 is comprised at least：It is one power supply contact, several slot electrodes 22, certain Position portion 25, several linking parts 23, several isolation channels 21, several list structures 20.Each isolation channel 21 to extend radially outwardly, The conductive plate 2 is divided into nine list structures 20 being angularly distributed, and is distributed centre bore periphery of the configuration in the location division 25. Bridge the side of isolation channel 21 linking part 23 be stamped mould bending forming V-shape, the 3D of the conductive plate 2 is constituted to reduce circumferential size Curved-surface structure, and meet the connection in series-parallel demand of lighting circuit 1；

Further, Fig. 2 g are referred to, each list structure 20 is respectively equipped with from the barrel surface 244 toward the direction of ball curved surface 241：One is curved Folding part 24a is located between the barrel surface 244 and cone curved surface 243, and a kink 24b is located between the ring curved surface 242 and cone curved surface 243, One kink 24c on the ball curved surface 241；If several fixing hole 27b are located on the ball curved surface 241, if another several fixing hole 27a On the ring curved surface 242, by two fixing holes 27a, the 27b into one group；The slot electrode 22 be then arranged at the ball curved surface 241 with Between ring curved surface 242, and position is in the middle of each group fixing hole 27.

Fig. 2 e are referred to, the support frame 3 is perforate hemispherical dome structure, is made up of nine ribs of arranged radially 30, Mei Yizhi Stake rib 30 is provided with one group of fixed column 33a, fixed column 33b, and is provided with a supporting surface between this group of fixed column 33a, fixed column 33b 301, then each supporting surface 301 is come the fixed pan structure 28 of the support conductive plate 2 of fitting；Two are provided between each ribs 30 to lead to Air holes 34；The center of the support frame 3 is provided with retainer ring 31, is provided with the excircle of support frame 3 and is formed with several outer ring surfaces 32；Should Retainer ring 31 can be through the centre bore of the location division 25 of the conductive plate 2；The several clamping slots 35 set thereon of each outer ring surface 32 must be used for With reference to the lampshade 6, protective cover 7.Special one carries, each fixing hole 27a of the conductive plate 2, fixing hole 27b, fixed pan structure 28 Ribs 30, supporting surface 301, each fixed column 33a, fixed column 33b with the support frame 3 etc. must form the present embodiment lighting device b An endless belt-shaped structure LED chip electrode welding point protection mechanism, and the manufacture method of following the present embodiment lighting device b 9b has the means of the LED chip electrode welding point protection mechanism.

The related description of the lighting circuit 1 of lighting device b, refers to Fig. 1 c and Fig. 2 c, illustrates the lighting circuit 1 of three three parallel connections of string With the structural relation of the present embodiment conductive plate 2.In being equiped with a LED chip 11 on each list structure 20, and with three bars Shape structure 20, LED chip 11 constitute a circuit region 12 in parallel, a total of three groups of parallel circuit areas 12, and with two connecting portion 23s1, 23s2 is connected each parallel circuit area 12, and the lighting circuit 1 is formed according to this.

Fig. 2 i are referred to, is the manufacture method 9b of the present embodiment lighting device b, it is included:One blanking processing procedure, a glutinous crystalline substance processing procedure, one Feeding processing procedure, a shaping preparation processing procedure, one combine antecurvature journey, a combination processing procedure, the assisted parts of folding and cut off processing procedure and a combination Palintrope folds journey to complete to make.Special one carries, blanking processing procedure of the present embodiment with the pressed sheet 80 of following each embodiments, glutinous crystalline substance Processing procedure, feeding processing procedure etc. are identical with aforementioned first embodiment, are just repeated no more in this.

Fig. 2 i, Fig. 2 f~Fig. 2 h are referred to, illustrates that the conductive plate 2 is bent the processing procedure of shaping by the pressed sheet 80；Wherein, the shaping is accurate Journey, such as Fig. 2 g are prepared, when being positioned with the centre bore of the location division 25 with stamping mold and tightly suppress endless belt-shaped fixed pan knot Structure 28, and on the pressed sheet 80 bridge isolation channel 21 each linking part 23 carry out V-arrangement bending, to weaken each linking part 23 in circumference The intensity in direction.Then circumferencial direction is carried out to the list structure near kink 24c and shrinks operation, make the width of each isolation channel 21 Degree further reduces, and bends the V-arrangement of the linking part 23 to be further bent into deep V-arrangement, and makes the pressed sheet 80 of planar structure be in It is now conical structure, such as Fig. 2 g.Each of which list structure 20 is not bent into curved surface in the circumferencial direction of outermost, Endless belt-shaped fixed pan structure 28 in this during one remains to maintain plane, and can protect LED chip electrode welding point, Minimize its deflection.

The combination is antecurvature to fold journey, also includes ball curved surface bending processing procedure and ring curved surface bending processing procedure；Fig. 2 g are referred to, its In ball curved surface bending processing procedure system endless belt-shaped fixed pan structure 28 is pressed with stamping mold the cone angle for being fixed on setting Afterwards, kink 24c is bent to form ball curved surface 241, and by the ring curved surface 242, cone curved surface 243, barrel surface 244 then Circular conical surface is constituted, the width positioned at each isolation channel 21 of outside diameter is obviously reduced.The ring curved surface bends processing procedure, refers to Fig. 2 h, Next just carry out excision location division 25 and become center hole, and each fixed pan structure 28 is pressed with stamping mold consolidate again After fixed, then each kink 24b is bent to form the ring curved surface 242, ball curved surface 241 collectively forms hemisphere with ring curved surface 242 Shape, is now placed in the reduced width of isolation channel 21 of external diameter.

The combination processing procedure, refers to Fig. 2 h, and then the support frame 3 and conductive plate 2 (i.e. pressed sheet 80) are combined, its outer ring surface 32 with The kink 24b of the conductive plate 3 fits, to provide the support of subsequent job, and the guarantor for completing the LED chip electrode welding point Protection mechanism.

The assisted parts cuts off processing procedure, support frame 3 and the conductive plate 2 are pressed with stamping mold after and cuts each assisted parts 221, makes original First the position of the assisted parts 221 of short circuit has turned into slot electrode 22.

The combination palintrope folds journey, also comprising a cone curved surface bending processing procedure and barrel surface bending processing procedure.Fig. 2 f are referred to, is finally used Stamping mold fixes the support frame 3, and kink 24a and kink 24b to the conductive plate 2 bends, curved due to being provided with Folding hole 261 be able to can complete to bore the forming operation of the curved surface 243 and barrel surface 244, to constitute the present embodiment with weakening structure intensity Three complete three lighting circuits 1 simultaneously of string.

Fig. 3~Fig. 3 b are referred to, third embodiment of the invention has the concave curved surface bulb lamp C of concave curved surface lighting function, by a support frame The 3 and lighting device c of the composition the present embodiment of a conductive plate 2；Wherein concave curved surface bulb lamp C systems include:One lampshade 6, a protective cover 7, One joint 5, a conductive plate 2, several LED chips 11, a support frame 3, a power module 51.Special one carries, the present embodiment Continue to use the lampshade of above-mentioned lighting circuit 1, first embodiment, and second embodiment protective cover, power module 51 etc..

Refer to shown in Fig. 3 a, Fig. 3 b, when concave curved surface bulb lamp C is arranged on ceiling, its joint 5 is located at the top, lampshade 6 Then it is located at bottom.The lampshade 6, the one end open of protective cover 7 are obtained and are arranged in together on the clamping slot 35 of the support frame 3 again, and The another end of protective cover 7 then links the joint 5, to constitute the outward appearance of concave curved surface bulb lamp C.

Refer to Fig. 3 f, the pressed sheet 80 of the conductive plate 2 of the present embodiment similar in appearance to aforementioned second embodiment, upper in molding process The convex surface that the ball curved surface 241 and ring curved surface 242 for stating second embodiment are constituted, it is recessed with one that bending is configured to a recessed ball curved surface 241a The recessed hemisphere curved surface of ring curved surface 242a, in the forming operation of scrobicular ring curved surface 242a, the reverse U-bend foldings of kink 24b.

By the conductive plate 2 of the present embodiment located at the inside of the lampshade 6 and protective cover 7, and the conductive plate 2 with the support frame 3 in it Portion supports and fixes；The conductive plate 2 is divided into the list structure 20 of circumferential arrangement by each isolation channel 21, and distribution configures the location division 25 surrounding；One end of the conductive plate 2 constitutes recessed semi-round ball curved surface, the conduction by the recessed ball curved surface 241a and scrobicular ring curved surface 242a The other end of plate 2 then constitutes circular cone tubular by the cone curved surface 243 and barrel surface 244, and its kink 24b rolls over for U-bend, then this is led The barrel surface 244 of electroplax 3 is fixed in the fixing groove 71 of the protective cover 7.

Fig. 3 a are referred to, the structure of the conductive plate 2 is comprised at least：One power supply contact, a location division 25, several linking parts 23, number Individual isolation channel 21, several list structures 20.Bridging isolation channel 21 each linking part 23 must be stamped mould bending forming V-shape, with contract Subtract circumferential size to achieve 3D structures.Refer to shown in Fig. 3 d, Fig. 3 e, each list structure 20 is from barrel surface 244 toward recessed ball curved surface 241a directions are respectively equipped with：One kink 24a is located between barrel surface 244 and cone curved surface 243, and a kink 24b is located at scrobicular ring curved surface 242a and cone curved surface 243 between, one kink 24c on recessed ball curved surface 241a；If several fixing hole 27b are located at recessed ball curved surface 241a On, there is another fixing hole 27a to be located on scrobicular ring curved surface 242a, two fixing holes 27a, the 27b are into one group；The then position of each slot electrode 22 Between the recessed ball curved surface 241a and scrobicular ring curved surface 242a and position is between each group fixing hole 27.

Fig. 3 and Fig. 3 c are referred to, the support frame 3 is the recessed hemispherical dome structure of perforate, be installed in the conductive plate 2 of tool 3D curved spaces Inside, and being made up of several ribs 30 of arranged radially, each ribs 30 be provided with the fixed column 33a that two is a group, Fixed column 33b, and more than one air vent 34 is provided between each ribs 30；The center of the support frame 3 is provided with a retainer ring 31, separately it is provided with an outer ring surface 32 in its excircle；Each group of fixed column 33a, fixed column 33b must be through each groups of the conductive plate 2 Fixing hole 27a, fixing hole 27b be combined with each other, and the retainer ring 31 must pass through the centre bore of the location division 25 of the conductive plate 2；Should The outer ring surface 32 of support frame 3 can fit positioned at openend with the kink 24b of the conductive plate 2, the clamping slot 35 is additionally provided with thereon and is used Come fastening lampshades 6 and protective cover 7.And the power module 51 is installed in the protective cover 7, and be provided with power line respectively with the conduction Plate 2, joint 5 connect.Special one carries, each fixing hole 27a of the conductive plate 2, fixing hole 27b, endless belt-shaped fixed pan knot Ribs 30, supporting surface 301, each fixed column 33a, fixed column 33b of structure 28 and the support frame 3 etc. must form the present embodiment illumination The protection mechanism of the LED chip electrode welding point of device c, and the manufacture method 9 of following the present embodiment lighting device c has the LED core Plate electrode pad protection mechanism.

The manufacture method of the present embodiment lighting device c, such as Fig. 2 i, comprising:One blanking processing procedure, a glutinous crystalline substance processing procedure, a feeding processing procedure, One shaping preparation processing procedure, one combine antecurvature journey, a combination processing procedure, assisted parts excision processing procedure and the combination palintrope of folding and fold journey To complete to make；

The shaping prepares processing procedure, and such as Fig. 2 d are tightly suppressed endless belt-shaped when with stamping mold so that the centre bore of location division 25 is positioned Fixed pan structure 28, and to bridge the serial circuit of isolation channel 21 linking part 23 carry out V-arrangement bending, to weaken linking part 23 in circle The intensity of circumferential direction.Fig. 3 d are referred to, circumferencial direction is then carried out to the list structure 20 near kink 24b and is shunk operation, made The width of each isolation channel 21 further reduces, and the V-arrangement bending of each linking part 23 is further bent into deep V-arrangement, that is, allows flat The pressed sheet 80 (i.e. conductive plate 2) of face structure is rendered as conical structure, and now each LED chip 11 is in inner side, each of which bar Shape structure 20 is not yet bent into curved surface in circumferencial direction.Fixed pan structure 28 endless belt-shaped during one remains to maintain herein Plane, and the electrode welding point of LED chip 11 can be protected, its deflection is preferably minimized, and most deformations occurs in linking part 23, the reduced width of isolation channel 21.

Fig. 3 c, Fig. 3 d and Fig. 3 e are referred to, the combination is antecurvature to fold journey, also comprising the recessed bending of ball curved surface processing procedure and a scrobicular ring curved surface Bending processing procedure；Wherein the recessed ball curved surface 2 bends processing procedure, with stamping mold the location division 25, endless belt-shaped fixed pan structure 28 Pressing is fixed on the cone angle of setting, then carries out the operation that kink 24c is bent into the recessed ball curved surface 241a, and the scrobicular ring Curved surface 242a, cone curved surface 243, barrel surface 244 then constitute circular conical surface, and the width for being now placed in the isolation channel 21 of outside diameter substantially contracts It is small.

Fig. 3 e are referred to, the scrobicular ring curved surface bends the continuous stamping mold of processing procedure the location division 25, endless belt-shaped fixed pan structure 28 pressings are fixed, and kink 24b is bent, and make the cone curved surface 243 radially plane with barrel surface 244, each LED The still position of chip 11 in inner side, positioned at the reduced width of the isolation channel 21 of scrobicular ring curved surface 242a, positioned at each isolation channel 21 of outside diameter Width because flat shape and than larger.Next just carry out the excision location division 25 and become center hole, and use punching press again Endless belt-shaped fixed pan structure 28 is pressed fixation by mould, and kink 24b is bent, make the scrobicular ring curved surface 242a into Shape, the i.e. recessed ball curved surface 241a collectively form recessed hemispherical curved surface with scrobicular ring curved surface 242a.

Fig. 3 e are referred to, continue to bend kink 24b, and made into U-shaped reflexed song between the scrobicular ring curved surface 242a and cone curved surface 243, And the cone curved surface 243, barrel surface 244 then constitute the cylindrical shape turned up, the V-arrangement bending for bridging the linking part 23 of isolation channel 21 is entered one Step bending, and also reduced with the width of the isolation channel 21 of barrel surface 244 in the cone curved surface 243.

The combination processing procedure, refers to Fig. 3 e, and then the support frame 3 is combined with conductive plate 2, its outer ring surface 32 and U-bend folding part 24b Negative camber fit, to provide the support of the subsequent job of conductive plate 2, and complete the electrode welding point protection machine of LED chip 11 System, with sharp successive process.

The assisted parts cuts off processing procedure, refers to Fig. 3 e, and the support frame 3 and conductive plate 2 are pressed and cut each auxiliary with stamping mold Portion 221, the position of the assisted parts 221 of original short circuit has turned into slot electrode 22.

The combination palintrope folds journey, also bores curved surface bending processing procedure and barrel surface bending processing procedure comprising one；Fig. 3 f are referred to, with punching Compression mould fixes support frame 3, and cone curved surface 243 and barrel surface 244 to the conductive plate 2 forms operation, due to the kink 24b, kink 24a are provided with bending hole (drawing does not show), can easily be bent with stamping mold with weakening structure intensity, and the support The outer ring surface 32 of frame 3 fits with U-bend folding part 24b, there is provided the support needed for follow-up bending operation, and make cone curved surface 243 with Barrel surface 244 shapes, to constitute the present embodiment three lighting circuit 1 simultaneously of complete three string.

The hemisphere face lamp D of fourth embodiment of the invention, such as Fig. 4~Fig. 4 c, it is that a support frame 3 and a conductive plate 2 constitute the present embodiment The core application of lighting device d, and it is three group of three string three and circuit to use a lighting circuit 10, and amount to using 27 LED chip 11.The lighting device d of the hemisphere face lamp includes a lampshade 6, a protective cover 7, a conductive plate 2, several LED cores Piece 11, a support frame 3, a power module 51；

When installing, the protective cover 7 is located at and most goes up the hemisphere face lamp D, and the lampshade 6 is located at bottom.And the lampshade 6 and protection Cover 7 is arranged on the clamping slot 35 set by the support frame 3 simultaneously, such as Fig. 4 b, to constitute the hemisphere face lamp D structures.

The lampshade 6 is set to hemispherical hatch frame, is set to transparent or semitransparent material and constitutes, and is provided with the bail wire 62, Shuo Getong Air holes 61.The protective cover 7 is tray circular open structure, and it is provided with the bail wire 72, several air vents 73, by above-mentioned two clamping Ring 62,72 is buckled on the clamping slot 35 of the support frame 3.

The power module 51 is arranged on inside the protective cover 7, and its set power line is electrically connected with the conductive plate 2, to provide this Power supply needed for inventing each LED chip 11.

Refer to shown in Fig. 4 g, the inner space that the conductive plate 2 is formed located at the lampshade 6 and protective cover 7, and the conductive plate 2 Make support by the support frame 3 to fix, the shape of the conductive plate 2 constitutes one by a ball curved surface 241 and a ring curved surface 242 of its one end Semi-round ball curved surface.

Refer to shown in Fig. 4 f, the support frame 3 is the hemispherical dome structure of half hole shape of tool, installed in the inside of the conductive plate 2, phase For nine ribs 30 that the surface of ball curved surface 241 is provided with arranged radially, the surface relative to ring curved surface 242 is provided with arranged radially 18 ribs 30, each ribs 30 are provided with one group of fixed column 33；It is provided with least between two adjacent ribs 30 One air vent 34；And the center of the support frame 3 is provided with a retainer ring 31, the outside of the support frame 3 is provided with an outer ring surface 32, and The clamping slot 35 is provided with the outer ring surface 32；Another each group of fixed column 33 must be each passed through every group of fixing hole corresponding to the conductive plate 2 27 be combined with each other, and the retainer ring 31 must be inserted in the centre bore of the location division 25 of the conductive plate 2.

Such as the lighting circuit 10 that Fig. 4 c are hemisphere face lamp D, and the pressed sheet 80 of compares figure 4d circuit diagram, the ball is bent in figure There are one group of three string three and series-parallel lighting circuit on face 241, there is two group of three string three and series-parallel power for illumination on the ring curved surface 242 Road.

Fig. 4 d and Fig. 4 e are referred to, the pressed sheet 80 is to be divided into nine list structures of arranged radially by nine radial direction isolation channels 21 20, and annular isolation groove 21a is provided between the ball curved surface 241 and ring curved surface 242 separates to split each list structure 20, Each list structure 20 is divided into two parts by isolation channel 21a:List structure 20a, list structure 20b, and the annular every Several assisted parts 221 are provided with from groove 21a to ensure that list structure 20a and list structure 20b can be linked into a complete structure, also set There is a linking part 23 to bridge isolation channel 21a, and using high potential circuit in parallel as a positive electricity source contact 13.

Fig. 4 e are referred to, a ring electrode groove 22 is respectively equipped with again on the ball curved surface 241 and ring curved surface 242, make each strip knot Several LED chips 11 are equiped with structure 20a；Every three list structure 20a are a circuit region 12 in parallel, have three parallel circuit areas 12, these parallel circuit areas 12 are connected into three and three strings again has nine lighting circuits of LED chip in the ball curved surface 241 altogether.

Fig. 4 e are referred to, on the ring curved surface 242, list structure 20b of every three circumferential arrangements sets up thereon in intermediate There is a radial direction isolation channel 21b to be divided into two list structure 20c；A LED chip 11 is installed on list structure 20c, is not divided Two LED chips 11 are installed on the list structure 20b for cutting, with a list structure 20c and list structure 20b totally three LED Chip 11 is a circuit region 12 in parallel, makes to be connected again between three parallel circuit areas 12, and constituting three strings three and amounting to has nine LED The circuit of chip 11, has two group of three string three on the ring curved surface 242 and circuit amounts to 18 LED chips 11.

Special one carries, the branch of each fixing hole 27, annular concentric banding fixed pan structure 28 and the support frame 3 of the conductive plate 2 Stake rib 30, supporting surface 301, each fixed column 33 etc. form the LED chip electrode welding point protection of the present embodiment lighting device d Mechanism, and the manufacture method 9b of following the present embodiment lighting device d has the protection mechanism of the LED chip electrode welding point.

Such as Fig. 4, Fig. 4 d, Fig. 4 e, the manufacture method of the present embodiment lighting device d please coordinate ginseng similar to above-mentioned second embodiment Fig. 2 i are read, therefore the manufacture method of the present embodiment lighting device d is included:One blanking processing procedure, a glutinous crystalline substance processing procedure, a feeding processing procedure, one one-tenth Shape preparation processing procedure, one combine antecurvature journey, a combination processing procedure, assisted parts excision processing procedure and the combination palintrope of folding and fold journey and come Into making.

The bending processing procedure, is fixed on the pressing of fixed pan structure 28 of the annular concentric banding of the ball curved surface 241 with stamping mold and sets After after fixed cone angle, kink 24c, kink 24b at the two of list structure 20a are bent to form ball curved surface 241, It is obviously reduced 242 one-tenth circular conical surfaces of ring curved surface, and the width of the isolation channel 21 positioned at outside diameter；Then carry out cutting off the location division 25 turn into a center hole, and reuse stamping mold the annular concentric banding fixed pan structure 28 of ring curved surface 242 is pressed it is solid After fixed, kink 24b and kink 24a to list structure 20b and list structure 20c are bent to form the ring curved surface 242, The pressed sheet 80 now has been presented the structure of the conductive plate 2.The ball curved surface 241 collectively forms hemispherical with ring curved surface 242, bridges Each linking part 23 of the isolation channel 21 is bent over forming V-shape and width is minimum, and the isolation channel 21 is arrived with the reduced width of isolation channel 21a Default width.

Fig. 4 g are referred to, the combination processing procedure, when the support frame 3 is combined with conductive plate 2, each ribs 30 of the support frame 3 connect and set In the inside of the conductive plate 2, and the retainer ring 31 of the support frame 3 is inserted in the location division 25 of the conductive plate 2, and the conduction is provided according to this The support of the subsequent job of plate 2, and complete the protection mechanism of the LED chip electrode welding point.

The assisted parts cuts off processing procedure, and the support frame 3 and conductive plate 2 are pressed each assisted parts 221 of incision with stamping mold, makes these auxiliary Helping portion 221 turns into slot electrode 22, three group three and three lighting circuits 10 gone here and there complete to constitute the present embodiment.

The globe lamp E of fifth embodiment of the invention, continues the invention of above-mentioned fourth embodiment, i.e. globe lamp E continues to use the 4th implementation The conductive plate of example amounts to two groups and continues to use the series-parallel lighting circuit 10 of identical with lampshade, and changes the support frame of the example IV Structure, with the support frame 3 as the present embodiment, support frame 3a.

Such as Fig. 5~Fig. 5 b, globe lamp E by left and right two lampshades 6, two conductive plates 2, several LED chips 11, two support frames 3； Support frame 3a, a power module 51 are constituted, and two support frame 3, support frame 3a and the mutual panelling of lampshade 6 is integrally non-disconnectable The globe lamp E for unloading.

Globe lamp E is located at the top and is passed through on the outer ring surface 32 of the support frame 3 when installing by being lifting rope with power line 37 Hole for hoist 321, makes 32 one-tenth plumbness of the outer ring surface, and two lampshade 6 is located at both sides respectively.As shown in figure 5, two lamps again Cover 6 is installed along with the joint portion 36a set by two support frames 3, support frame 3a, and the support frame 3 is mutual by another joint portion 36 Panelling is integral, to constitute the outward appearance of the present embodiment globe lamp E.

Each conductive plate 2 is located at the inside of each lampshade 6, and each conductive plate 2 is located at the inside of support frame 3 offer and supports and fixed, and Its shape constitutes semi-round ball curved surface by ball curved surface 241 and ring curved surface 242.

Refer to shown in Fig. 5 a, the support frame difference of two support frame 3, support frame 3a and fourth embodiment, in its outer ring surface 32 openend is additionally provided with a joint portion 36, joint portion 36a, there is provided the mutual panelling of two support frames 3, support frame 3a is combined, and The openend of the outer ring surface 32 is additionally provided with an at least hole for hoist 321, and it is lifting rope and power line 37 that the hole for hoist 321 can be used to install. Special one carries, the electrode of the present embodiment lighting device e equally LED chips of the annular concentric banded structure with previous embodiment Pad protection mechanism.

Fig. 6~Fig. 6 b are referred to, is the elongated fluorescent tube F of sixth embodiment of the invention, using the lighting circuit 10, it is set to elongated point The circuit of cloth is made up of the lighting device f of the present embodiment a support frame 3 and a conductive plate 2 to coordinate the demand of elongated fluorescent tube F.Its In, the elongated fluorescent tube F is included:One lampshade 6, a protective cover 7, two joints 5, several conductive plates 2, several LED chips 11, number Individual support frame 3, a power module 51.

When the elongated fluorescent tube F of the present embodiment is arranged on the lamp socket of ceiling, the protective cover 7 is located at the top, and the lampshade 6 is then located at most Lower section, and the joint 5 is then respectively arranged on two sides of fluorescent tube.The lampshade 6 is separately mounted to the clamping slot 35 of support frame 3 with protective cover 7 With interior clamping slot 35a, such as Fig. 6 a, and protective cover 7 are also secured to the ambilateral joint 5 of lamp with support frame 3, and the joint 5 has There is the power plug 52 of protrusion, to constitute the outward appearance of the elongated fluorescent tube F.

Please join shown in Fig. 6 a, the lampshade 6 is set to the strip hatch frame in U-shaped section, its two side is provided with the structure of flanging 63, and is Transparent or semitransparent material is constituted, and which is provided with several air vents 61, and the structure of flanging 63 can be embedded in clamping slot 35.The protection Cover 7 is set to elongated tabular structure, and is installed in the interior clamping slot 35a of the support frame 3, which is provided with air vent 73；

The power module is mounted, is fixed on inside the protective cover 7, and be provided with power line respectively with the conductive plate 2, the phase of two joint 5 Connect.Each joint 5 is used for reference to the support frame 3, the link power supply module of power plug 52 thereon and the power supply of lamp socket, each to provide Power supply needed for LED chip 11；

And the conductive plate 2 is located at the inside of the lampshade 6, and the conductive plate 2 is supported and fixed with support frame 3 inside it；This is led Electroplax 2 is isolated groove 21 and is divided into four list structures 20 arranged in parallel, and the knot of the U-shaped section with two flanging joint portions 262 Structure；The flanging 63 of the lampshade 6 must be embedded in the clamping slot 35 of the support frame 3；

Fig. 6 d are refer to, the conductive plate 2 is comprised at least：One power supply contact, location division (as fixing hole 27a, fixing hole 27b), Several linking parts 23, several isolation channels 21, several list structures 20., each list structure 20 is being respectively equipped with each other： Four kink 24a~24d, two kink 24e, kink 24f, three fixing hole 27a, fixing hole 27b, three slot electrodes 22 have assisted parts 221；Each slot electrode 22 is between two kinks of different spacing, and high-potential electrode and low-potential electrode Position three fixing hole 27a or 27b and is located at the side of slot electrode 22 in the dual side-edge of isolation channel 21 respectively；Its U-shaped section is by four Bending is formed individual kink 24a~24d respectively under relative distance, and flanging joint portion 262 is then by two kink 24e, kink 24f Bending respectively is formed；

Further, three slot electrodes 22 are equiped with the isolation channel 21 between every two adjacent list structures 20, and are formed with and have three Individual parallel circuit area 12；Respectively there are a fixing hole 27a, fixing hole 27b respectively in the dual side-edge of each slot electrode 22, wherein one fixes Hole 27a is set on a list structure 20, another fixing hole 27b then on another list structure 20, by two fixing hole 27a, Fixing hole 27b is into one group；Replace the series connection portion 23s1 of the lighting circuit 10 and string in two bodies of list structure 20 of intermediate arrangement Connection portion 23s2, has nine LED chips to constitute the series connection between LED chip parallel circuit area 12, and then form three and three strings to amount to Lighting circuit 10；

Fig. 6 c are referred to, the support frame 3 is set to the elongate structure of U-shaped cross section structure, and is made up of array ribs 30, the branch Stake rib 30 is in the horizontally-parallel arranged support frame 3, and every three ribs 30 must coordinate a list structure 20 of the conductive plate 3, And each of which ribs 30 are respectively equipped with one group of fixed column 33a, fixed column 33b and a therebetween supporting surface 301, each support Face 301 arranges the fixed pan structure 28 of shape for the U-shaped strip of the conductive plate 2 corresponding to laminating；Between each ribs 30 It is provided with several air vents 34；Each group of fixing hole 27a, the fixing hole of each group of fixed column 33a, fixed column 33b through the conductive plate 2 27b be combined with each other；Two outer side edges 320 positioned at the support frame 3 are respectively equipped with clamping slot 35a in a clamping slot 35 and, for dividing The other secure bond lampshade 6 and protective cover 7；The air vent 34 of the support frame 3 can be used to allow cooling air to flow and favorably cut off each auxiliary Help portion 221.Special one carries, and each fixing hole 27a of the conductive plate 2, fixing hole 27b, U-shaped strip arrange the fixed pan structure of shape 28 must form the present embodiment illumination dress with ribs 30, supporting surface 301, each fixed column 33a, the fixed column 33b of the support frame 3 etc. The electrode welding point protection mechanism of the LED chip of f is put, and the manufacture method 9a of following the present embodiment lighting device f also has the LED core Plate electrode pad protection mechanism.

Fig. 6 b and Fig. 6 d are referred to, illustrates that the conductive plate 2 forms the structure of lighting circuit 100 of three and three string, the conduction Its pressed sheet 80 is divided into four be parallel to each other distribution and sequentially list structures 20 of longitudinal arrangement by plate 2 by three isolation channels 21.And Three slot electrodes 22 are equiped with isolation channel 21 between every two flat shape list structures 20, are installed in for three LED chips 11 Face is formed with three parallel circuit areas 12, in the body generation of two list structures 20 of intermediate arrangement altogether into a circuit region 12 in parallel The series connection between each parallel circuit area 12 is constituted for series connection portion 23s1, the series connection portion 23s2 of the lighting circuit 100, to form three And three string amount to have nine lighting circuits of LED chip 100；Fig. 6 and Fig. 6 a are referred to, the elongated fluorescent tube of instruction sheet one is by above-mentioned number Individual lighting device f three string three and circuit unit a fluorescent lamp in series lighting device.

The manufacture method of the present embodiment lighting device f similar to first embodiment, as shown in figure 1i, comprising:One blanking processing procedure, one stick Brilliant processing procedure, a feeding processing procedure, a shaping preparation processing procedure, a bending processing procedure, a combination processing procedure, assisted parts excision processing procedure are complete Into making.

In the bending processing procedure, such as Fig. 6 c~Fig. 6 e are determined when with stamping mold with fixing hole 27a, the fixing hole 27b of most side longitudinal row Position, and tightly suppress the fixed pan structure 28 and the kink 24e to the side of pressed sheet two, kink 24f carry out angle folding, Make the flanging at a right angle of two flangings joint portion 262；Then following processing procedure is repeated, it is first curved in the longitudinal row to be bent with stamping mold Each fixing hole 27a, fixing hole the 27b positioning of folding part 24a, then tightly suppress the adjacent fixed pan structure 28, to the longitudinal row Kink 24b, kink 24c, kink 24d etc. carry out straight line track for several times to bending, the conductive plate 2 is formed tool eighty percent discount The U-shaped cross section structure of side joint portion 262；The periphery of this each LED chip 11 during one can maintain flattened region, and can protect The shield electrode welding point of LED chip 11.

The combination processing procedure, then combines the support frame 3 with conductive plate 2, and two outer side edges 320 of the support frame 3 must fit in this Two flanging joint portions 262 of conductive plate 3, to provide the support of the subsequent job of conductive plate 2, and complete the electrode of LED chip 11 weldering Contact protection mechanism.

The assisted parts cuts off processing procedure, and support frame 3 and conductive plate 2 are pressed each assisted parts 221 of incision with stamping mold, original short circuit The position of assisted parts 221 has turned into slot electrode 22, three string three lighting circuits 100 simultaneously complete to constitute the present embodiment.

Fig. 7~Fig. 7 b are referred to, the square row flat lamp G of seventh embodiment of the invention, is the extension of above-mentioned sixth embodiment, is similarly The lighting circuit 100 of three and three strings, and the lighting device g of the present embodiment is made up of a support frame 3 and a conductive plate 2.The present embodiment Flitch 8 and its pressed sheet 80, such as Fig. 7 c, Fig. 7 d, its structure has the network structures of two mutually perpendicular directions, there is two phases The bending of mutual vertical direction.Wherein, square row flat lamp G, includes an a lampshade 6, protective cover 7, a conductive plate 2, several LED chip 11, a support frame 3, a power module 51；When the square row flat lamp G of the present embodiment is arranged on ceiling, the protection Cover 7 is located at the top and is installed on ceiling, and lampshade 6 is located at bottom, and its internal power supply contact can connect external power source. The lampshade 6 distinguishes clamping slot 35 of the secure bond in the support frame 3 with protective cover 7, to constitute the outer of the present embodiment square row flat lamp G See；

The lampshade 6 is rectangular aperture structure, is set to transparent or semitransparent material and constitutes, and which is provided with several air vents 61, the lampshade 6 insertions are incorporated into the clamping slot 35 of support frame 3, the flanging joint portion 262 of the conductive plate 2 is therefore positioned.The conductive plate 2 The opening bevel 245 of rectangular recess, the light for each LED chip 11 is reflected towards external exposure；

The power module 51 is installed in the inside of protective cover 7 and is fixed on protective cover 6, and is provided with power line and connects the conductive plate 2 The contact of power supply, to provide the power supply needed for each LED chip 11.

Refer to Fig. 7 j, the conductive plate 2 by the support frame 3 support with fixation, and the conductive plate 2 is recessed by nine rectangles that three rows three are arranged Groove is constituted, and adjacent rectangular recess is connected with each other with its inclined-plane 245, and the fixation of rectangular arranged shape set by each rectangular recess bottom is put down Face structure 28 is respectively equipped with a slot electrode 22 and a LED chip 11, therefore each slot electrode 22, LED chip 11 with rectangular arranged, and should Fixed pan structure 28 is surrounded by four inclined-planes 245 of array respectively.The surrounding outer ring surface of the conductive plate 2 has flanging joint portion 262, The rectangular recess of its row, column is bent and formed respectively by four kinks 24 in its row, column direction.

Further, the conductive plate 2, such as Fig. 7 d and Fig. 7 j, four list structures are cut into by three isolation channels 21 in row, column direction 20, and split each plane of the fixed pan structure 28 into two parts by three list structures 20 of the row, column；Namely Each plane distinguishes position on two adjacent list structures 20, and several slot electrodes 22 are provided with each isolation channel 21, has three Individual LED chip 11 is simultaneously unified into connection circuit region 12 in the lump, in the present embodiment Zhong Gongsange parallel circuits area 12；And in each slot electrode 22 dual side-edge is respectively provided with a fixing hole 27；Replace the string of the lighting circuit 100 in two bodies of list structure 20 of intermediate arrangement The connection portion 23s1 and portion 23s2 that connects, such as Fig. 6 b constitute the series connection between each parallel circuit area 12.

The support frame 3, such as Fig. 7 e, are list structure that is rectangular-shaped and can coordinating the conductive plate 2 installed in the inside of the conductive plate 2 20, and with nine rectangular recess of the row of three row three；A strip ribs 30 are provided with each rectangular recess bottom, in the branch The both sides of stake rib 30 are respectively provided with an air vent 34；Each strip ribs 30 have a supporting surface 301 above, and in the supporting surface 301 One group of fixed column 33 is provided with, this group of fixed column 33 must be passed through and be incorporated into one group of fixing hole 27 of the conductive plate 2, separately in the support frame 3 surrounding outer ring surface 32 is provided with the clamping slot 35 for fixing the lampshade 6 and protective cover 7.

Special one carries, the support of each fixing hole 27 of the conductive plate 2, the fixed pan structure 28 of rectangular arranged shape and the support frame 3 Rib 30, supporting surface 301, each fixed column 33 etc. must form the protection machine of the LED chip electrode welding point of the present embodiment lighting device g System, and the manufacture method 9g of following the present embodiment lighting device f also has the LED chip electrode welding point protection mechanism.

The manufacture method 9g of the present embodiment lighting device g, such as Fig. 7 k, comprising:One blanking processing procedure, a glutinous crystalline substance processing procedure, a feeding processing procedure, One shaping prepares processing procedure, a bending processing procedure, a shaping processing procedure, a combination processing procedure, assisted parts excision processing procedure to complete to make.

The bending processing procedure, refers to Fig. 7 d and Fig. 7 g, when the direction that a skidding or side arrange first is selected with stamping mold, with the party To the fixing hole 27 of fixed pan structure 28 be positioning, tightly suppress the skidding or side row fixed pan structure 28 and to the punching press 80 liang of kinks of side 24 of plate carry out wide-angle bending, make 262 one-tenth of flanging joint portion obtuse angle flanging, then to the fixed pan The kink 24 of structure 28 is bent.Such as Fig. 7 h, identical bending processing procedure is repeated until row or column in the same direction completes curved in the direction Untill being converted into shape.Such as Fig. 7 i, different overbending directions are then changed, are positioning with the fixing hole 27 of the fixed pan structure 28 of the direction, Identical bending processing procedure is repeated untill column or row in the same direction complete bending, such as Fig. 7 j's, that is, fixed pan structure 28 is each flat Untill the kink 24 on four inclined-planes 245 of the side of face four and rectangular recess all completes bending.

The shaping processing procedure, such as Fig. 7 j, carry out the shaping processing procedure of rectangular recess after processing procedure is bent, and are combined with stamping mold all of solid Determine hole 27 and position, tightly suppress the fixed pan structure 28 of the rectangular arranged shape, final size and its opening to each rectangular recess Inclined-plane 245 carry out shaping, the light of each LED chip 11 is reflected towards external exposure.

The combination processing procedure, refers to Fig. 7 f, and then the support frame 3 is combined with conductive plate 2, and outer ring surface 32 and this of the support frame are led The flanging joint portion 262 of electroplax fits, and to provide the support of the subsequent job of conductive plate 2, and completes the electrode of LED chip 11 The protection mechanism of pad, with sharp successive process.

The assisted parts cuts off processing procedure, and support frame 3 and conductive plate 2 are pressed each assisted parts 221 of incision with stamping mold, original short circuit The position of assisted parts 221 has turned into slot electrode 22, to constitute the lighting circuit of the present embodiment.

Each embodiment of summary, the present invention is main in metallic plate punching on a kind of LED light device and its manufacture method And the conductive plate for having 3d space is shaped, and the conductive plate is provided with a lighting circuit, then the assembled inside one of the conductive plate is supported Frame, and the support frame must provide the conductive plate supports and fix, and be beneficial to the shaping of the conductive plate and protect each LED chip pad, Again by components such as the core component collocation of a LED light device of the invention exclusive a lampshade, a protective cover, a power modules Afterwards, it is possible to constitute radiating light fixture preferably miscellaneous, and used indoors in the air vent on the lampshade and protective cover Protection class (IP grades), such as IP40 grades, the slit width of air vent<1mm, allows extraneous air directly contact is of the invention to be led The double surfaces of electroplax and contacted, convection current, to provide excellent radiating efficiency.

Claims (25)

1. a kind of LED light device, it is characterised in that include:

One conductive plate, by stamping tool solid space structure, an at least slot electrode and several isolation is provided with the conductive plate Groove；And each isolation channel is divided into several list structures, and each list structure to form be available for mould to press one and consolidate the conductive plate Determine planar structure and several fixing holes, wherein the fixed pan structure is across the slot electrode, each fixing hole is located at close to described The side of fixed pan structure；

Several LED chips, are arranged in the fixed pan structure of the conductive plate and cross-over electrode groove respectively, and by each strip knot Structure divides into several LED chip parallel circuit areas, and each parallel circuit area of being connected by several link portions or list structure, with structure Into series-parallel circuit；And

One support frame, is made up of several strip ribs, ribs, and is mounted on the inner space below the conductive plate, Each fixed column is stretched through respectively and be incorporated into the fixing hole of the conductive plate, an air vent, and each are respectively equipped between each ribs The list structure of the stake rib correspondence conductive plate；

A supporting surface is provided with for each plane lower section of the conductive plate of fitting by being each extended between the ribs and each fixed column Place, as the place of mould pressing, and each fixed column is extended through the both sides of each LED chip respectively, and LED core is formed according to this Piece pad protection mechanism, makes that the electrode welding point of each LED chip can be protected in its manufacturing process.

2. LED light device according to claim 1, it is characterised in that the serial circuit of the lighting circuit by respectively every Make to isolate from groove, each parallel circuit area is isolated with the slot electrode, and bridges isolation in the link portions in the parallel circuit area Groove and the high-potential electrode of the several LED chips in the area, low-potential electrode are connected in parallel respectively.

3. LED light device according to claim 1, it is characterised in that the conductive plate can dual large area radiating, Can increase extra area of dissipation with reference to support frame.

4. LED light device according to claim 1, it is characterised in that be arranged in the slot electrode by several assisted parts Conductive plate that is interior and constituting solid memder, and between each fixing hole of the conductive plate, around LED chip and its non-aperture area Domain constitutes a fixed pan structure, then coordinates each group fixing hole of the conductive plate to be combined with each group fixed column of each ribs, And the supporting surface between each group fixed column sticks to the bottom of the fixed pan structure, make the electrode welding point of each LED chip in Protected in each processing procedure, and the deflection of each LED chip electrode welding point can be reduced, to lift fine ratio of product, finally gone again Except several assisted parts, in case electric pole short circuit and forming complete series-parallel circuit.

5. LED light device according to claim 1, it is characterised in that the electrode contact of each LED chip in welding, The heat that the low-potential electrode of the slot electrode can cover each LED chip passes contact, to accelerate each LED chip to radiate.

6. LED light device according to claim 1, it is characterised in that each fixed column is extended through each fixing hole and is combined Mode, each fixed column is deformed or can be fixed on using glue fixing hole.

7. LED light device according to claim 1, it is characterised in that when each list structure is radially arranged, respectively connect Knot can maintain the platy structure of one to ensure the conductive plate across isolation channel after stamping.

8. LED light device according to claim 7, it is characterised in that set several radial direction isolation channels each list structure Outermost portion be cut into smaller list structure, and several slot electrodes are provided with, to meet circuit requirements.

9. LED light device according to claim 1, it is characterised in that each list structure into it is arranged in parallel when, each electricity Pole groove is installed on isolation channel, and when each slot electrode is arranged on the dual side-edge of list structure, slot electrode is arranged on isolation channel, and will The connecting portion, and the strips of conductive plate for having connected longer by the shorter conductive plate of array are substituted positioned at two middle list structures.

10. LED light device according to claim 1, it is characterised in that each list structure into it is arranged in parallel when, and institute Fixed pan structure is stated to be split by each isolation channel, it is necessary to the plane pressed by the complete confession moulds of two adjacent strip structure compositions with Slot electrode, and set several slot electrodes are installed in isolation channel；Each list structure has several slot electrodes, and by two adjacent strips The fixing hole difference position of structure is constituting the both sides of the plane；Replace each linking part in the body of the list structure of intermediate arrangement, With the series connection that the parallel circuit for constituting LED chip is interval.

11. LED light devices, purposes during as plane bulb lamp according to claim 7；Characterized in that,

The conductive plate includes：One power supply contact, a slot electrode, a location division, several linking parts, several isolation channels, number Individual list structure；Wherein described several isolation channels must split the list structure that the conductive plate is radially distributed；

The conductive plate also has the rounded shallow cup-like structure in several heat transfer faces, and the heat transfer face must fit in support frame as described above Outer ring surface；

Each list structure also includes having structure：One group of fixing hole, a slot electrode, a kink, fixed pan structure A plane；Wherein described group fixed hole position is in the side of slot electrode two；In its outside diameter, it is formed the bending part after being bent Fitted with the outer ring surface set by support frame as described above afterwards；And

Support frame as described above also coordinates the conductive plate in disc structure, and is made up of several strip ribs of several arranged radiallys, There is one group of fixed column in each ribs, there is the supporting surface between described group of fixed column, and each supporting surface must coordinate respectively Group fixed column is incorporated into the fixing hole of the conductive plate, uses the endless belt-shaped fixed pan structure of the support fixation conductive plate； The center of support frame as described above is provided with a retainer ring, and the retainer ring must pass through the location division of the conductive plate；Support frame as described above institute If an outer ring surface be located at openend and be formed around a clamping slot；

When being combined in support frame as described above by the conductive plate, according to the arrangement of each LED chip, to constitute endless belt-shaped structure LED chip pad protection mechanism, fine ratio of product is lifted according to this.

12. LED light devices according to claim 7, as the purposes of convex surface bulb lamp；Characterized in that,

The conductive plate includes：One power supply contact, a slot electrode, a location division, several linking parts, several isolation channels, number Individual list structure；Several isolation channels must split the conductive plate into several in radially-arranged list structure；

The shape of the conductive plate, its one end is made up of semi-round ball curve form one ball curved surface and a ring curved surface, the other end then by One cone curved surface and a barrel surface constitute conical cylindrical shape；And the linking part of its bridging isolation channel must be bent forming V-shape；

Each list structure includes having structure：Several kinks, one group of fixing hole, a slot electrode, fixed pan knot One plane of structure；Wherein foregoing several kinks are respectively arranged on from barrel surface toward ball curved surface direction：One bending part is in the cylinder Between face and cone curved surface, between the ring curved surface and cone curved surface, a bending part is on the ball curved surface for a bending part；Its Described in a fixed hole position set by group fixing hole on ball curved surface, being additionally provided with a fixed hole position on ring curved surface；The fixation is put down Face structure and slot electrode are located between ball curved surface and ring curved surface and position in the middle of described group of fixing hole；And

Support frame as described above is also set to hemispherical dome structure, and its each ribs is respectively equipped with one group of fixed column, and between each group fixed column The supporting surface is respectively equipped with, and each supporting surface coordinates each group fixed column to be incorporated into the fixing hole of the conductive plate, uses support solid The endless belt-shaped fixed pan structure of the fixed conductive plate；The center of support frame as described above is provided with retainer ring, wherein the retainer ring Through the location division of the conductive plate；An outer ring surface set by excircle in support frame as described above is provided with a clamping slot, and the outer shroud Face is adjacent to the ring curved surface of the conductive plate；

When being combined in support frame as described above by the conductive plate, according to the arrangement of each LED chip, to constitute endless belt-shaped structure LED chip pad protection mechanism, the fine ratio of product of the lighting device is lifted according to this.

13. LED light devices according to claim 7, as the purposes of concave curved surface bulb lamp；Characterized in that,

The conductive plate includes：One power supply contact, a slot electrode, a location division, several linking parts, several isolation channels, number Individual list structure；Several isolation channels must split the conductive plate into several radially-arranged list structures；

The conductive plate, recessed semi-round ball curved surface is made up of a recessed ball curved surface and a scrobicular ring curved surface in its one end, and the other end is then by a cone Curved surface and a barrel surface constitute circular cone tubular；The linking part of its bridging isolation channel must be bent forming V-shape；

Each list structure includes：Several kinks, one group of fixing hole, a slot electrode, the fixed pan structure it is one flat Face；Foregoing several kinks are respectively arranged on from barrel surface toward recessed ball curved surface direction：One bending part is in the barrel surface and cone curved surface Between, between the scrobicular ring curved surface and cone curved surface, a bending part is on the recessed ball curved surface for a bending part；It is wherein described A fixed hole position set by group fixing hole on recessed ball curved surface, being additionally provided with a fixed hole position on scrobicular ring curved surface, two fixations Kong Chengyi groups；The fixed pan structure and slot electrode are then located between recessed ball curved surface and scrobicular ring curved surface and position in described group of fixing hole It is middle；And

Support frame as described above is also set to recessed hemispherical dome structure, is made up of the ribs of several arranged radiallys, and each ribs are provided with one Group is provided with the supporting surface between fixed column, and described group of fixed column, each supporting surface coordinates each group fixed column to be fixed through each group Hole and be combined, the endless belt-shaped fixed pan structure of the fixation conductive plate is supported according to this；The center of support frame as described above is provided with solid Determine ring, and the retainer ring passes through the centre bore of the location division of conductive plate；An outer ring surface set by support frame as described above is located at openend A clamping slot is provided with, the outer ring surface must be adjacent to the ring curved surface of the conductive plate, set by the excircle in support frame as described above one Outer ring surface must be adjacent to the U-bend folding part of the conductive plate；

When being combined in support frame as described above by the conductive plate, according to the arrangement of each LED chip, to constitute endless belt-shaped structure LED chip pad protection mechanism, the fine ratio of product of the lighting device is lifted according to this.

14. LED light devices according to claim 8, as the purposes of hemisphere face lamp；Characterized in that,

The conductive plate includes：One power supply contact, several slot electrodes, a location division, several linking parts, several isolation channels, Several list structures；Wherein described conductive plate is cut into the list structure of several arranged radiallys by several isolation channels；

The conductive plate shape, one end is made up of semi-round ball curved surface the ball curved surface and ring curved surface, and the ball curved surface is provided with an electricity Pole groove, another slot electrode is provided between the ring curved surface and ball curved surface；And each list structure is according to circuit requirements, described Two radially-arranged list structures can be divided on ring curved surface by several isolation channels；The size of each list structure is provided with several LED chip；In connecting for the ball curved surface and the parallel circuit area that varying number is provided with ring curved surface, and several linking parts Bridging isolation channel simultaneously must be bent forming V-shape, and the space structure of the conductive plate is constituted to reduce the conductive plate circumferential size；

Each list structure is respectively equipped with radial direction spacing respectively from outer toward internal diameter direction：One kink, a fixing hole, an electricity Pole groove, a fixing hole, a kink, a plane of the fixed pan structure；Each fixing hole is two one group, the fixation Hole group, plane and slot electrode position are between above-mentioned two kink；

Support frame as described above is also set to hemispherical dome structure, and the main body of support frame as described above is made up of several ribs, bent relative to the ball Face is respectively equipped with several ribs of the different arranged radially of quantity from ring curved surface thereon；Each ribs must coordinate the conductive plate List structure；Each ribs are provided with one group of fixed column, there is a supporting surface between described group of fixed column, and each supporting surface coordinates Each group fixed column is combined through each group of fixing hole, uses the annular concentric banding fixed pan of the support fixation conductive plate Structure；An air vent is respectively equipped between each ribs；An outer ring surface set by support frame as described above is provided with a clamping slot, and institute Outer ring surface is stated to be fitted with the ring curved surface of the conductive plate；

When being combined in support frame as described above by the conductive plate, according to the arrangement of each LED chip, to constitute annular concentric banding The protection mechanism of the LED chip pad of structure, lifts the fine ratio of product of the lighting device according to this.

15. according to claim 14 LED light device, as the purposes of globe lamp；Characterized in that, described spherical Lamp is constituted using two identical conductive plates and two support frames, and each conductive plate is supported and consolidated inside it with a support frame respectively It is fixed；Each support frame is additionally provided with a clamping slot and a joint portion in the openend of outer ring surface, enables two support frames mutually panelling, And the openend of the outer ring surface of each support frame is additionally provided with hole for hoist, it is lifting rope and power line that the hole for hoist is used for installing.

16. LED light devices according to claim 9, as the purposes of elongated fluorescent tube；Characterized in that,

The structure of the conductive plate is included：One power supply contact, several slot electrodes, several linking parts, several isolation channels, several Shape structure；The conductive plate is cut into several list structures arranged in parallel by several isolation channels；

The conductive plate also U-shaped cross section structure with two flanging joint portions, the U-shaped section by several kinks it is relative away from Formed from lower bending respectively, each flanging joint portion is bent and formed respectively by two kinks in two sides；When the flanging quilt of lampshade During the clamping slot being embedded in set by support frame as described above, the joint portion can be fixed by fit；

Each list structure is respectively equipped with：Several kinks, several fixing holes, several slot electrodes, the fixed pan structure number Several planes；Wherein each plane is divided into from slot electrode position between two kinks of different spacing and by a wherein isolation channel Two parts, i.e., must be by the complete each plane of two adjacent strip structure compositions and slot electrode, and each slot electrode is installed in isolation channel On；There is a fixing hole side that each list structure is provided with several slot electrodes；By two the two of adjacent list structure fixing holes point Other position is in one group of the both sides of each plane and composition；Replace link portions in the body of the list structure of intermediate arrangement, to constitute the LED The interval series connection of chip parallel circuit；And

Support frame as described above is also set to the elongate structure of U-shaped cross section structure, from the ribs of several horizontally-parallel arrangements constitute and with One list structure；Each ribs which is provided with one group of fixed column, and the supporting surface is provided between described group of fixed column, each support Face cooperation each group fixed column must be combined through each group of fixing hole, and the U-shaped strip of the fixation conductive plate is supported according to this Fixed pan structure；More than one air vent is provided between each ribs；Support frame as described above is provided with two outer side edges；It is each Group fixed column be combined with each other through each group of fixing hole；The outer side edges of support frame as described above set, and have clamping slot with interior clamping slot；

Support frame as described above is combined in by the conductive plate, according to the arrangement of each LED chip, to constitute U-shaped strip arrangement knot The protection mechanism of the LED chip pad of structure, lifts the fine ratio of product of the lighting device according to this.

17. LED light devices according to claim 10, as the purposes of square row flat lamp；Characterized in that,

The conductive plate includes：One power supply contact, several slot electrodes, several linking parts, several isolation channels, several strip knots Structure；Several list structures arranged in parallel are cut into by several isolation channels in row or column direction；

Several rectangular recess that the conductive plate is arranged by several line numbers are constituted, and adjacent rectangular recess is connected with each other with its hypotenuse, The plane of bottom is provided with slot electrode and installs each LED chip, and its circumferential periphery has the joint portion of flanging；The groove of its row or column Section is expert at by several kinks and the kink in the side of the inclined-plane two or column direction bends form respectively；

Each list structure is being respectively equipped with：Several kinks, several fixing holes, several slot electrodes, the fixed pan structure Several planes；Position is between two kinks of row and column of different spacing respectively and is isolated groove and splits for each plane and slot electrode Into two parts, i.e., complete plane and slot electrode must be constituted by two adjacent list structures, and each slot electrode is installed in the isolation On groove；Each list structure is provided with several slot electrodes, and the side of each linking part is provided with a fixing hole；By two adjacent list structures Fixing hole difference position the both sides of the plane and composition one group；Replace link portions in the body of the list structure of intermediate arrangement, The series connection interval to constitute LED chip parallel circuit；

Support frame as described above, is set to rectangle and arranges several rectangular recess with ranks, and a bar is provided with each rectangular recess Shape ribs, the ribs can coordinate in the plane of the rectangular recess of the conductive plate, and each strip ribs several Support face and two fixed columns, two fixed column must pass through the fixing hole of the conductive plate and be combined with each other, and use support fixed described The fixed pan structure of rectangular arranged shape；Two air vents are respectively provided on two sides with each ribs；In set by support frame as described above One outer ring surface is provided with a clamping slot, and the outer ring surface of support frame as described above fits with the joint portion of the conductive plate；

Support frame as described above is combined in by the conductive plate, according to the arrangement of each LED chip, to constitute rectangular arranged structure The protection mechanism of LED chip pad, lifts the fine ratio of product of the lighting device according to this.

18. a kind of manufacture methods of LED light device, it is characterised in that taken comprising a blanking processing procedure, a glutinous crystalline substance processing procedure, one Material processing procedure, a shaping prepare processing procedure, a bending processing procedure, a combination processing procedure, assisted parts excision processing procedure；And in above-mentioned processing procedure also Include LED chip protection mechanism means, make to protect the electrode welding point of each LED chip in each processing procedure and reduce foregoing The deflection of processing procedure, wherein,

The blanking processing procedure a, metallic plate first passes through a stamping flitch, makes to include several list structures on the flitch, Each list structure is separated by several isolation channels, and is linked by that can cause several assisted parts of short circuit with the linking part of bridging isolation channel List structure, makes the flitch an into platy structure；

The glutinous brilliant processing procedure, LED chip is welded on the several slot electrodes set by the flitch；

The feeding processing procedure, a smooth pressed sheet is removed by cutting off several connecting piece on the flitch；

The shaping prepares processing procedure, and the location division of the pressed sheet is pressed positioning with stamping mold, and conductive plate is three-dimensional needed for Space requirement, the bending carried out with stamping mold needed for precompressed produces the pressed sheet in predetermined position deforms, wherein comprising curved Folding part and the deformation of linking part；

The bending processing procedure, presses the fixed pan structure of the pressed sheet of advance deformation with stamping mold, and its kink is entered Row bending, to complete solid space structure formation operation of the pressed sheet as the conductive plate；

The combination processing procedure, is combined in support frame as described above the inside of the conductive plate and combines and fix, and by support frame as described above institute If each fixed column makes the fixed pan structure of its each supporting surface laminating support conductive plate through each fixing hole of the conductive plate, To provide the conductive plate in the necessary structural support of successive process, and ventilation hole area between the ribs of support frame as described above will The conductive plate each assisted parts to be cut open can be covered；And

The assisted parts cuts off processing procedure, and the fixed pan structure of the conductive plate and the support of support frame as described above are pressed in stamping mold Under rib, and then each assisted parts of the conductive plate is cut, in case electric pole short circuit and constituting completely series-parallel circuit.

19. according to claim 18 LED light device manufacture method, it is characterised in that LED chip protection Mechanism means are also arranged in the slot electrode by several assisted parts and constitute the conductive plate of solid memder, and by the conductive plate Between each fixing hole, around LED chip and its fixed pan structure that is constituted such as non-open area, then with the conduction The each group fixing hole of plate is combined with each group fixed column of each ribs, and supporting surface between each group fixed column is sticking to support The fixed pan structure of the conductive plate, makes the electrode welding point of each LED chip be protected in each processing procedure.

20. according to claim 19 LED light device manufacture method, apply to the purposes of a plane bulb lamp；Its It is characterised by,

The bending processing procedure, the also kink to outer radius bend, into the conductive plate for having the tazza shape with circumferentia, and The location division is cut off as centre bore；

The combination processing procedure, each fixed column on support frame as described above is also passed through the fixing hole of the conductive plate, its each ribs Supporting surface coordinates each fixed column to pass through each fixing hole, the endless belt-shaped fixed pan structure of the conductive plate of laminating support according to this, And the outer ring surface of support frame as described above fits with the kink 24 of the conductive plate, the retainer ring set by support frame as described above passes through institute State the centre bore of location division；

When being combined in support frame as described above by the conductive plate, according to the arrangement of each LED chip, to constitute endless belt-shaped structure LED chip pad protection mechanism, the fine ratio of product of lighting device of the present invention is lifted according to this.

21. according to claim 19 LED light device manufacture method, apply to the purposes of a convex surface bulb lamp, Also journey is folded in the bending processing procedure comprising the antecurvature journey, a combination palintrope of folding of a combination；Characterized in that,

The shaping prepares processing procedure, is also positioned with the centre bore of the location division with stamping mold, and tightly suppress described endless belt-shaped Fixed pan structure, and on the conductive plate bridge isolation channel each linking part carry out V-arrangement bending, will each list structure Lateral bending of supporting or opposing is rolled over, and each list structure near the kink carries out circumferencial direction and shrinks operation, enters the width of each isolation channel One step reduces, and each linking part is further bent into deep V-arrangement, and now pressed sheet is rendered as conical structure and makes each LED core On the outside of it, the periphery of each LED chip now remains to remain smooth piece；

The combination is antecurvature to fold journey, also comprising ball curved surface bending processing procedure, ring curved surface bending processing procedure；Wherein

The ball curved surface bends processing procedure, also using stamping mold the location division, the endless belt-shaped fixed pan structure pressure After closing the cone angle set by fixing, ball curve generating operation is then carried out, the width positioned at the isolation channel of outside diameter is further It is reduced；The ring curved surface bends processing procedure, also carries out cutting off the location division becoming center hole, and use stamping mold again Ring curve generating operation is carried out after the pressing of each fixed pan structure is fixed, the pressed sheet after shaping has been presented the conduction of solid space Plate, and the ball curved surface collectively forms hemispherical with ring curved surface, bridges each linking part of isolation channel by further bending forming V-shape, And also reduced with the width of the isolation channel of barrel surface in the cone curved surface；

The combination processing procedure, also combines support frame as described above with conductive plate, and its outer ring surface fits with the negative camber of kink, respectively The supporting surface of ribs coordinates each fixed column to pass through each fixing hole, and the endless belt-shaped fixation of the conductive plate of laminating support according to this is put down Face structure, the retainer ring is then through the centre bore of location division；

The combination is antecurvature to fold journey, and as one cone curved surface bends processing procedure with barrel surface, after each assisted parts processing procedure of incision, Continuous stamping mold fixes support frame as described above, and cone curved surface and barrel surface to the conductive plate forms operation, by institute Setting several bending holes on the kink of two junctions for stating cone curved surface can be easily bent with weakening structure intensity, make support frame as described above Outer ring surface fitted with the kink, shape cone curved surface and the barrel surface；

When being combined in support frame as described above by the conductive plate, according to the arrangement of each LED chip, to constitute endless belt-shaped structure LED chip pad protection mechanism, the fine ratio of product of lighting device of the present invention is lifted according to this.

22. according to claim 19 LED light device manufacture method, apply to the purposes of a concave curved surface bulb lamp, In it is described bending processing procedure in also comprising one combination it is antecurvature fold journey and one combination palintrope fold journey；Characterized in that,

The shaping prepares processing procedure, is also positioned with the centre bore of the location division with stamping mold, and tightly suppress described endless belt-shaped Fixed pan structure, and on the conductive plate bridge isolation channel each linking part carry out V-arrangement bending, will each list structure Lateral bending of supporting or opposing is rolled over, and each list structure near the kink carries out circumferencial direction and shrinks operation, enters the width of each isolation channel One step reduces, and each linking part is further bent into deep V-arrangement, and now pressed sheet is rendered as conical structure and makes each LED core On the outside of it, the periphery of each LED chip now can remain smooth to piece；

The combination is antecurvature to fold journey, also comprising a recessed ball curved surface bending processing procedure, scrobicular ring curved surface bending processing procedure；It is wherein described recessed Ball curved surface bends processing procedure, the location division, the endless belt-shaped fixed pan structure is pressed with stamping mold also fixed set Fixed cone angle, then carries out the forming operation of recessed ball curved surface, and the recessed ball curved surface in the structure after shaping still maintains circular conical surface, And each list structure is bent in the kink of fixing hole outside diameter simultaneously, the bending angle of the kink is more than 90 degree, makes Cone curved surface is radially plane with barrel surface, and each LED chip still position is in inner side, positioned at the isolation channel of scrobicular ring curved surface internal side diameter Width be reduced, positioned at outside diameter isolation channel width because flat shape and than larger；The scrobicular ring curved surface bends processing procedure, Excision location division becomes center hole, and again with stamping mold after the endless belt-shaped fixed pan structure pressing fixation Scrobicular ring curve generating operation is carried out, is bent in the kink of the fixing hole outside diameter of each list structure, make the scrobicular ring curved surface It is bent into U-shaped reflexed with kink between cone curved surface, the bending angle of the U-bend folding part close to 180 degree, after shaping Pressed sheet has been presented the conductive plate of solid space, the recessed ball curved surface is then constituted recessed hemispherical curved surface with scrobicular ring curved surface, and described Cone curved surface, barrel surface then constitute the cylindrical shape turned up, and the V-arrangement for bridging the linking part of isolation channel is bent by further bending, and Cone curved surface also reduces with the width of the isolation channel of barrel surface；

The combination processing procedure, then combines support frame with conductive plate, by the outer ring surface of support frame as described above and U-bend folding part Curved surface fits, and the supporting surface of each ribs coordinates each fixed column to pass through each fixing hole, the ring of the conductive plate of laminating support according to this The fixed pan structure of shape banding, and the clamping slot of support frame as described above is passed through into isolation channel, the retainer ring passes through centre bore；

The combination palintrope folds journey, and as one cone curved surface bends processing procedure, after each assisted parts processing procedure is cut, also makes with barrel surface Support frame as described above is fixed with stamping mold, and cone curved surface and barrel surface to the conductive plate forms operation, because cone is bent Several bending holes are set on the kink of two junctions in face can be easily bent with weakening structure intensity, and support frame as described above outer shroud Face fits with the U-bend folding part of the conductive plate, the cone curved surface is shaped with barrel surface；

When being combined in support frame as described above by the conductive plate, according to the arrangement of each LED chip, to constitute endless belt-shaped structure LED chip pad protection mechanism, the fine ratio of product of lighting device of the present invention is lifted according to this.

23. according to claim 18 LED light device manufacture method, transport in the purposes of hemisphere face lamp；Its feature exists In,

The shaping prepares processing procedure, is also positioned with the centre bore of the location division with stamping mold, tightly suppresses the concentric annular lands The fixed pan structure of shape and on the pressed sheet bridge isolation channel linking part carry out V-arrangement bending, to weaken linking part in circle The intensity of circumferential direction；

The shaping prepares processing procedure, and the also centre bore with stamping mold in the location division is positioned, and the kink to a ring curved surface is attached Near list structure carries out circumferencial direction and shrinks operation, the width of each isolation channel is further reduced, and make the V-arrangement of each linking part Bending is further bent into deep V-arrangement, the pressed sheet of planar structure is rendered as conical structure, and each of which list structure exists Circumferencial direction is not bent into curved surface；This during one the peripheral of each LED chip remain to maintain plane；

The bending processing procedure, also presses the endless belt-shaped fixed pan structure of the ball curved surface with stamping mold and is fixed on setting After cone angle, contraposition kink at the two of the list structure of the ball curved surface is bent, by its ring curved surface into circular conical surface； Next excision location division is just carried out, becomes center hole, and again with stamping mold the endless belt-shaped solid of the ring curved surface Determine planar structure pressing it is fixed after, kink at the two of list structure is bent and is collectively formed with forming ring curved surface, ball curved surface The conductive plate of hemispherical space structure, and the linking part of each isolation channel will be connected across be bent over forming V-shape；

The combination processing procedure, during then support frame as described above with conductive plate combination, makes the outer ring surface of support frame as described above and the conduction The ring curved surface of plate fits, and the supporting surface of each ribs coordinates each fixed column to be combined through each fixing hole, laminating support according to this The fixed pan structure of the annular concentric banding of the conductive plate；

When being combined in support frame as described above by the conductive plate, according to the arrangement of each LED chip, to constitute annular concentric banding The protection mechanism of the LED chip pad of structure, lifts the fine ratio of product of lighting device of the present invention according to this.

24. according to claim 18 LED light device manufacture method, transport in the purposes with elongated fluorescent tube；Its feature It is,

The bending processing procedure, also using stamping mold using the fixing hole of a line on the outside of a pressed sheet as location division, tightly suppresses described The capable fixed pan structure and kink to two sides of the pressed sheet carries out angle folding, makes joint portion be at an angle of flanging, It is most close to an angle of 90 degrees；Then the processing procedure of the above is repeated, the fixing hole with the stamping mold with bending angle in another row is positioned, The fixed pan structure of the row is tightly suppressed, bending for several times is carried out to kink, the pressed sheet is formed two flangings of tool and combine The conductive plate structure in the U-shaped section in portion；

The combination processing procedure, then be combined with each other support frame as described above with conductive plate, and its outer side edges fits with joint portion, respectively The supporting surface of ribs coordinates each fixed column to be combined through each fixing hole, the U-shaped strip row of the conductive plate of laminating support according to this Column-shaped fixed pan structure；

Support frame as described above is combined in by the conductive plate, according to the arrangement of each LED chip, to constitute U-shaped strip arrangement knot The protection mechanism of the LED chip pad of structure, lifts the fine ratio of product of lighting device of the present invention according to this.

25. according to claim 18 LED light device manufacture method, apply to the purposes of square row flat lamp, and also Comprising a shaping processing procedure；Characterized in that,

The bending processing procedure, also first selectes the direction that a skidding or side arrange, with the fixed pan knot in the direction with stamping mold The fixing hole of structure is location division, tightly suppresses the skidding or the side row fixed pan structure and to the curved of the side of the pressed sheet two Folding part carries out wide-angle bending, joint portion is at an angle of flanging, most close to 150 degree of angles, then to the fixed pan structure Kink bent；Identical bending processing procedure is repeated in the direction, and changes other direction to be bent, until all fixations The kink on planar structure and the side of rectangular recess four all completes bending；The pressed sheet is set to turn into the several rectangles with ranks arrangement The conductive plate of recess space structure；

The shaping processing procedure, carries out the shaping of rectangular recess, also combines each fixing hole with stamping mold and positions, and tightly suppresses described The plane of rectangular arranged shape fixed pan structure, the inclined-plane of final size and its opening to rectangular recess carries out shaping；

The combination processing procedure, also combines support frame as described above with conductive plate, the knot of the outer ring surface of support frame as described above and the conductive plate Conjunction portion fits, and the supporting surface of each ribs coordinates each fixed column through each fixing hole to be combined with each other, and laminating support according to this is described The fixed pan structure of the rectangular arranged shape of conductive plate；

Support frame as described above is combined in by the conductive plate, according to the arrangement of each LED chip, to constitute rectangular arranged structure The protection mechanism of LED chip pad, lifts the fine ratio of product of lighting device of the present invention according to this.