CN106922089A - 植入式电子装置的壳体结构 - Google Patents

植入式电子装置的壳体结构 Download PDF

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CN106922089A
CN106922089A CN201510993708.6A CN201510993708A CN106922089A CN 106922089 A CN106922089 A CN 106922089A CN 201510993708 A CN201510993708 A CN 201510993708A CN 106922089 A CN106922089 A CN 106922089A
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wall portion
shell structure
housing
lamellar body
electronic device
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吴承暾
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JINGNENG MEDICAL SCIENCE Co Ltd
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JINGNENG MEDICAL SCIENCE Co Ltd
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Priority to US15/392,871 priority patent/US20170182325A1/en
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
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    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
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    • B29C66/3022—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • B29C66/30223—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being rib-like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8141—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined
    • B29C66/81411—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined characterised by its cross-section, e.g. transversal or longitudinal, being non-flat
    • B29C66/81421—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined characterised by its cross-section, e.g. transversal or longitudinal, being non-flat being convex or concave
    • B29C66/81423—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined characterised by its cross-section, e.g. transversal or longitudinal, being non-flat being convex or concave being concave
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
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    • H05K5/0217—Mechanical details of casings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
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Abstract

本申请公开一种植入式电子装置的壳体结构，用于容置植入式电子装置的电路板。壳体结构包括壳体及片体。壳体具有板材、壁部以及开口，壁部由板材的周缘沿与板材不共面的方向向外延伸，壁部的外缘侧具有缺口部且定义出开口。片体的外缘可与壁部的外缘相密封接合，片体与壳体形成密闭容置空间，用以容置电路板。

Description

植入式电子装置的壳体结构
技术领域
本发明涉及一种植入式电子装置的壳体结构，特别涉及一种可优化超音波熔接技术效果的壳体结构。
背景技术
现今，精密微工艺的技术已发展成熟至可将医疗仪器微小化至可植入到生物体内部，即植入式的电子装置，以进一步应用于治疗的用途。所谓的植入式电子装置例如为植入式神经电刺激器、血糖传感器或心律调节器等。然而，考虑到需要植入人体的因素，研究人员必须找出能有效密封植入式的电子装置壳体的手段，以避免体液渗入植入式电子装置造成电子装置短路或是毁损。
传统惯用的黏胶接着方式容易因为温度的变化，而造成脱胶的现象，同时脱胶后的黏胶亦有可能对身体产生毒性，此外黏胶接着的方式速度慢、产能低，相对会使得成本提高。因此，速度快、没有毒性、密合性佳的超音波焊接(ultrasonic welding)的技术成为封装植入式电子装置最好的选择。
广为公众所知的超音波焊接技术的原理是利用发声器产生高频信号，通常介于20KHz～15KHz之间，再通过超音波机器上的焊头(HORN)直接接触塑料制品的工件来将高频信号传递至塑料工件上，使得工件内的分子发生剧烈摩擦而进而产生高温，最后熔融化塑料工件来达到焊接的效果。
请参考图1A至图1C，图1A为传统植入式电子装置壳体结构的外观图，图1B为图1A传统植入式电子装置壳体结构的爆炸图。图1C为图1A于A-A切线进行超音波熔接操作时的局部示意图。传统植入式电子装置1包含电路板P与壳体结构10。电路板P容置于壳体结构10中。由图1B可知，传统的植入式电子装置的壳体结构10具有互相对称的一对上盖12与下盖14，由于超音波机器的高频信号强度会随着距离的平方衰减，因此若上盖的厚度较厚，焊接面D与焊头H的距离d也会较长，相对地超音波机器的高频信号能量也会衰减的较严重，因此熔接所需要花的时间会较长，也会比较耗电。
因此，有需要提供一种新的壳体结构，使得植入式电子装置在使用超音波熔接技术进行封装时，能更有效地控制能量的传递，进而提升熔接的速度跟质量。
发明内容
鉴于上述课题，本发明的目的为提供一种植入式电子装置的壳体结构，使植入式电子装置在使用超音波熔接技术进行封装时，能更有效地控制能量的传递，进而提升熔接的速度跟质量。
为实现上述目的，依据本发明的一种植入式电子装置的壳体结构，用于容置电子装置的电路板，壳体结构包括壳体及片体。壳体具有板材、壁部以及开口，壁部由板材的周缘沿与板材不共面的方向向外延伸，壁部的外缘侧具有缺口部且定义出开口。片体的外缘可与壁部的外缘相密封接合，片体与壳体形成密闭容置空间，用以容置电路板。
在一个实施例中，壁部的高度介于5～10mm之间。
在一个实施例中，片体的厚度与延伸壁部的高度的比值介于0.04～0.4之间。
在一个实施例中，壳体与片体以超音波熔接技术密封接合。
在一个实施例中，壳体及片体的材质为聚醚醚酮(polyetheretherketone，PEEK)。
在一个实施例中，壳体于板材与壁部连接处设有至少一个定位件，用来固定电子装置本体。
在一个实施例中，壁部具有至少两个贯通馈孔。
本发明的功效在于，通过减少超音波熔接的焊头到焊接面之间的距离，来大幅提升超音波熔接所使用的高频信号传递的效率，进而提升超音波熔接的速度跟质量。
附图说明
图1A为传统植入式电子装置壳体结构的外观图。
图1B为图1A传统植入式电子装置壳体结构的爆炸图。
图1C为图1A于A-A切线进行超音波熔接操作时的局部示意图。
图2为本发明植入式电子装置壳体结构的实施例的分解图。
图3A为本发明植入式电子装置壳体结构的实施例的外观立体图。
图3B为图3A于B-B切线的剖面图。
图3C为图3B在C区域使用超音波熔接的技术进行密封接合前的局部放大图。
图3D为图3C使用超音波熔接的技术进行密封接合后的示意图。
具体实施方式
以下将参照相关附图，说明依据本发明优选实施例的一种植入式电子装置的壳体结构，其中相同的元件将以相同的参照符号加以说明。文中所用术语“大致”是指在可接受的误差范围内，所属领域的公知技艺者能够在一定误差范围内解决所述技术问题，基本达到所述技术效果。举例而言，“大致垂直”是指在不影响结果正确性时，技术人员能够接受的与“完全垂直”有一定差异的操作方式。
需先说明的是，所称的植入电子装置实际为植入生物体的医疗用电子装置，其是例如但不限于植入于脑或脊椎的神经电刺激器(implantable nervestimulator)、血糖传感器(blood glucose sensor)或心律调节器(artificialpacemaker)等等。其中，虽然本发明所揭露的植入式电子装置壳体结构并不限定于特定的医疗领域，仅为清楚说明起见，以下内容中以医疗植入装置为用于脊椎的神经电刺激器为例，以应用于治疗或缓解生物体的患部疼痛为例说明。另外，本发明所称的生物体主要包括哺乳类动物，如老鼠、人类、兔、牛、羊、猪、猴、狗、猫等，优选为人类。
请参考图2，图2为本发明植入式电子装置壳体结构的实施例的分解图。植入式电子装置2包含有壳体结构20与电路版P，本发明植入式电子装置的壳体结构20用来容置电路板P。由图2可知，壳体结构20包括壳体21及片体22。在本实施例中，壳体结构20的材质为聚醚醚酮(polyetheretherketone，PEEK)，聚醚醚酮具有耐腐蚀与耐水解等特性，由于壳体结构20会直接接触人体，所以使用聚醚醚酮作为壳体的材料可避免对人体造成危害，同时聚醚醚酮也是一种热熔性的塑料，因此很适合应用超音波熔接的技术来对壳体21与片体22进行密封接合。
壳体21具有板材212、壁部214、开口216以及多个定位件218。壁部214沿着板材212的周缘设置，且沿着与板材212不共面的同一方向向外延伸，壁部214的外缘同时也定义出开口216，在本实施例中，壁部214与板材212大致垂直，然而此仅作为范例说明之用，并非作为本发明的限制条件。请注意，在本实施例中，壁部214与板材212一体成型，然而在其它实施例中，壁部214与板材212也可通过胶合或熔接等方式接合，本发明并不以此为限。壁部214沿着其外缘侧具有缺口部222，缺口部222具有两实质垂直的接触面222a与222b，恰可与片体22的外缘匹配结合。
请参考图2及图3A至图3B，图3A为本发明植入式电子装置壳体结构接合后的外观示意图，图3B为图3A在B-B切线的剖面图。壳体结构20内容置了电路板P。如图3A及图3B所示，壳体21与片体22接合后，则形成可容置电路板P的空间S。电路板P可经由开口216进入壳体21中。壁部214上具有多个贯通孔220，电路板P可透过穿过贯通孔220的导电片/棒(图中未显示)来与连接器结合，以便与外部的医疗装置电性连接，如此外部的医疗装置方可对电路板P的刺激参数进行调校或设置。多个定位件218分别分散位于板材212与壁部214的接合处，当电路板P容置于空间S中时，多个定位件218恰可与电路板P卡合(如图3B所示)，使得电路板P固定于空间S中，进而能避免电路板P因碰撞产生毁损。要特别注意的是，电路板P可包含印刷电路板、软性电路板以及具有IC的控制板。而且容置空间S中，除了电路板P之外，当然还可以容置其它必要的电子元件。
请参考图3C至图3D，图3C为图3B在C区域使用超音波熔接的技术进行密封接合前的示意图，图3D则为图3B在C区域使用超音波熔接的技术进行密封接合后的示意图。在进行超音波熔接前，片体22与接触面222b接触的部分设置有凸起的微结构T，在本发明植入式电子装置的壳体结构在使用超音波熔接技术进行封装时，微结构T会热融而可塑形，当微结构T经降温从熔融态恢复成固态时，便会与接触面222b接合在一起。由图3C可知，焊接面D与焊头H的距离d，即是超音波所需传递能量的距离，而距离d大致取决于片体22的厚度。故经由不对称厚度的壳体结构设计，让超音波可由较少厚度侧来进行接合工艺，因此能大幅地减少高频信号的衰减，提升超音波熔接的速度。
以下，进一步说明不对称厚度的壳体结构设计方式，值得注意的是，本发明的特征在于通过缩短超音波熔接的焊头H中心点到焊接面D之间的距离d，来减少超音波的能量散失，以大幅提升超音波熔接的效率与质量，因此在优选的实施例中，如图3B所示，由于片体22实质上不具有壁部，因此片体22的平均肉厚t1与壳体壁部214的高度之间的比值小于1，优选控制在介于0.04～0.4之间，壁部114的高度控制介于5～10mm之间，如此可使超音波熔接技术应用在本发明上达到最佳的效果。
以上所述仅为举例性，而非为限制性。任何未脱离本发明的精神与范畴，而对其进行的等效修改或变更，均应包含于随附的申请专利范围中。

Claims (8)

1.一种植入式电子装置的壳体结构，用于容置植入式电子装置的电路板，所述壳体结构包括：
壳体，具有板材、壁部以及开口，所述壁部由所述板材的周缘沿与所述板材不共面的方向向外延伸，所述壁部的外缘侧具有缺口部且定义出所述开口；以及
片体，其外缘与所述壁部的外缘相密封接合，所述片体与所述壳体形成密闭容置空间，用以容置所述电路板。
2.根据权利要求1所述的壳体结构，其中所述壁部的高度介于5～10mm之间。
3.根据权利要求1所述的壳体结构，其中所述片体的厚度与所述延伸壁部的高度的比值介于0.04～0.4之间。
4.根据权利要求1所述的壳体结构，其中所述壳体与所述片体以超音波熔接技术密封接合。
5.根据权利要求1所述的壳体结构，其中所述壳体与所述片体的材质为聚醚醚酮。
6.根据权利要求1所述的壳体结构，其中所述壳体在所述板材与所述壁部连接处设有至少一个定位件，用来固定所述电路板。
7.根据权利要求1所述的壳体结构，其中所述壁部具有至少两个贯通馈孔。
8.一种植入式电子装置包括：
壳体，具有板材、壁部以及开口，所述壁部由所述板材的周缘沿与所述板材不共面的方向向外延伸，所述壁部的外缘侧具有缺口部且定义出所述开口；
片体，其外缘与所述壁部的外缘相密封接合，所述片体与所述壳体形成密闭容置空间；以及
电路板，容置于所述密闭容置空间中。
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