CN106903424B - A kind of post-processing approach that optical element mechanical property is improved based on laser blast wave - Google Patents
A kind of post-processing approach that optical element mechanical property is improved based on laser blast wave Download PDFInfo
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- CN106903424B CN106903424B CN201710092401.8A CN201710092401A CN106903424B CN 106903424 B CN106903424 B CN 106903424B CN 201710092401 A CN201710092401 A CN 201710092401A CN 106903424 B CN106903424 B CN 106903424B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
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Abstract
The present invention provides a kind of post-processing approach that optical element mechanical property is improved based on laser blast wave, the mechanical characteristic R of thin-film component during not carrying out laser blast wave post processing0、A0、B0、H0On the basis of resisting laser damage ability F0, G0, E is obtained respectively0、EmSample mechanical property R after being handled with Δ E S laser blast waveS、AS、BS、HSWith resisting laser damage ability FS、GSAffecting laws；According to mechanical property and the promotion situation of resisting laser damage ability, to initial laser ENERGY E0, increased energy gradient delta E and maximum laser ENERGY EmIt optimizes, when thin-film component mechanical property and resisting laser damage ability are no longer promoted, and meet the requirement of laboratory sample, stops Xun Huan, complete the post processing of thin-film component mechanical property.The present invention realizes the improvement to high power optical thin-film component mechanical property, solves the problems, such as that the mechanical properties such as optical thin film element adhesive force, membranous layer binding force, residual stress lack effective means control at present.
Description
Technical field
The invention belongs to optical thin film element post-processing technology fields, and in particular to a kind of to be carried using laser shock wave technology
The post-processing approach of high optical thin film element mechanical property.
Background technology
The development of the development of Modern high power laser technology, particularly heavy caliber system, puies forward optical thin film element performance
Increasingly harsher requirement is gone out, it is desirable that it is with high photosensitiveness precision, strong mechanical performance, high damage threshold and high-precision surface shape control
The function of directly influencing heavy caliber precision optical system is realized the stability with system long-play by system.Influence optics
Film various aspects of performance it is many because being known as, including film self-characteristic, thin film preparation process and laser parameter etc..
Optical thin film element is due to its multilayer of the special high and low refractive index material alternating deposit on non-optical glass substrate
Structure, the optical thin film element that particularly most common electron beam evaporation is coated in high laser damage threshold thin film study field,
Compared to body material, there are between substrate and film layer adhesive force, between film layer and film layer combine the problem of power is weaker.And if thin
Membrane component is peeled off by the damage from laser that defect induction generates with film layer, and under post laser pulsed irradiation, damage can be rapid
Growth occurs catastrophic failure, seriously affects system run all right.Simultaneously as the strain of thin-film component storeroom is not
The influence of residual stress caused by matching somebody with somebody and surface figure accuracy equally has tremendous influence to the performance and system stability of element,
Therefore stringent control must be carried out to film residual stress.At this stage purely rely on improve preparation process, optimization Film Design,
The cost that the means such as Development of Novel Coating Materials improve the above-mentioned mechanical property of film is high, in order to further improve membrane element
The performance of part, researcher both domestic and external propose post-processing technology.
Various post-processing technologies, using different technological parameters, post processing mode, for different membrane system materials and knot
Structure, can obtain the film performance of different aspect improves.Currently used post processing means include：Ion post-treatment, heat treatment
And laser pre-treated.Ion post-treatment, be film after the completion of preparation, low energy ion is used to bombard with cleaning film it
Surface is original or the weaker surface microscopic defect of combination of adherency, improves thin film damage threshold value.Technique is most ripe at present, and effect is most
Good laser pre-treated is to irradiate the plethora defect of Low threshold in removal multilayer dielectric film by laser to improve the anti-of film to swash
Light injury ability.Heat treatment is namely annealed, although being mainly used in discharging film residual stress at present and improving the side such as face shape
Face, but repeatability is poor, the heat treatment process needed to different materials, different filming parameters, different types of thin-film component
Parameter is different, and improvement degree is equally different, therefore there is the problems such as being difficult to control in practical application.
The content of the invention
The present invention in view of the above shortcomings of the prior art, provides a kind of based on laser blast wave raising optical element mechanics
The post-processing approach of performance.
The present invention is achieved through the following technical solutions：
A kind of post-processing approach that optical element mechanical property is improved based on laser blast wave, is included the following steps：
(1) a collection of optical thin film element is coated with using electron beam evaporation；An optical thin film element is arbitrarily chosen as quilt
Sample measures the residual stress R of sample0, film layer and substrate critical adhesive force A0, film layer critical interfaces combination power B0
With hardness H0；
(2) 200 test points are selected on sample, every 20 test points are as a test group；And choose 10
Different laser energies, as the corresponding laser energy of 10 test groups, all test points in each test group correspond to
Laser energy it is identical；The irradiance pulse number for setting each test point is N1, pumping laser is used with selected laser energy
Amount irradiates the test point on sample successively, and the position of pumping laser irradiation sample is directed at by online monitoring system
It detects the generation of damage and growth, obtains under initial damage probability and the pulse number of the sample under different-energy
Damage growth probability；And sample is obtained by way of linear fit in irradiance pulse number N1Under initial damage threshold value
F01And damage growing threshold G01；
(3) sample is chosen again, and the irradiance pulse number of test point is changed to Nk, Nk≠N1, according to step
(2) method obtains sample in irradiance pulse number NkUnder initial damage threshold value F0kWith damage growing threshold G0k；
(4) step (3) is repeated, the initial damage threshold value F0 under m different pulsed irradiation numbers is obtained and damage is given birth to
Long threshold value G0；Wherein, F0={ F01, F02, F03……F0m, G0={ G01, G02, G03……G0m, it is desirable that pulsed irradiation number m
Not less than 200 times of laser repetition rate；
(5) a cluster film element is chosen again in a collection of optical thin film element made in step (1), in the cluster film
Element film surface pastes absorbed layer；Restraint layer is placed on the surface of absorbed layer, forms the experiment sample for laser blast wave post processing
Product；
(6) laboratory sample is placed on motorized precision translation stage, while ensures that the position that same sample is placed every time is all identical；
Online microscope is made to be directed at the position of pumping laser irradiation experiment sample always, sample is tested in last handling process to detect in real time
The state of product, absorbed layer and restraint layer；
(7) the original incident laser energy E for the pump laser that setting is handled for laser blast wave0, maximum incident laser
ENERGY EmWith laser energy incremental gradient Δ E, and fixed spot size, overlapping rate and scanning area；It is required that E0And EmLess than laser
Make the maximum laser energy that thin-film component does not destroy during shock wave；And it is less than or equal to (E to mark Sm-E0)/Δ E's
Maximum integer；Make i=1；
(8) actual incident laser energy E=E is made0+ΔE*i；
(9) a laser blast wave scan process is carried out to sample using grating scanning mode so that thin-film component surface is micro-
Structure changes；
(10) the absorbed layer and restraint layer of film sample remained on surface are removed, and film sample is sprayed and ultrasound is clear
It washes, obtains one group of laboratory sample by laser blast wave post processing；
(11) the residual stress R after shock wave post-processes is measured respectively using this group of laboratory samplei, film layer and substrate face
Boundary adhesive force Ai, film layer critical interfaces combination power BiWith hardness Hi, and repeat step (2)~(4), obtain laser blast wave after
Initial damage threshold value F0 after processing under m different pulsed irradiation numbersiWith damage growing threshold G0i；
(12) i=i+1 is made；Judge whether i is less than or equal to S, if so, step (5) is transferred to, if it is not, entering step (13)；
(13) the irradiation by sample same area under pump laser different-energy is completed to the laboratory sample
The laser blast wave post processing of multiple energy gradients, and obtain S laser blast wave post processing rear film element mechanical property
Variation characteristic, including residual stress R1~RS, critical adhesive force A1~AS, critical interfaces combination power B1~BS, hardness H1~HSAnd m
Initial damage threshold value F0 under a difference pulsed irradiation number1~F0SWith damage growing threshold G01~G0S；
(14) original incident laser energy E is changed0, maximum incident laser energy EmWith laser energy incremental gradient Δ E, repeat
Step (5)~(13)；The mechanical characteristic R of thin-film component during not carrying out laser blast wave post processing0、A0、B0、H0And resisting laser damage
On the basis of ability F0, G0, E is obtained respectively0、EmSample mechanical property R after being handled with Δ E S laser blast waveS、AS、BS、HS
With resisting laser damage ability FS、GSAffecting laws；According to mechanical property and the promotion situation of resisting laser damage ability, to initial
Laser energy E0, increased energy gradient delta E and maximum laser ENERGY EmIt optimizes, when thin-film component mechanical property and anti-laser
Lesion capability is no longer promoted, and when meeting the requirement of laboratory sample, stops cycle, completes the post processing of thin-film component mechanical property.
The present invention has the advantages that：
1st, post-processing approach of the present invention realizes the improvement to high power optical thin-film component mechanical property, with reference to
Real-time online adjusts aftertreatment technology parameter, solves the mechanics such as optical thin film element adhesive force, membranous layer binding force, residual stress
Performance lacks the problem of effective means control at present.The present invention can according to thin-film component mechanical property demand and judgment criteria,
The technological parameters such as scanning times and laser energy step are judged, until system requirements is met.
2nd, there is no limit to optical thin film element type, material, thin film deposition parameter for post-processing approach of the present invention,
Such as antireflective film, high-reflecting film and polarizing coating are compatible.
3rd, post-processing approach of the present invention limits from optical element dimension, similary to large-aperture optical thin-film component
It is applicable in, function of heavy caliber precision optical system is realized for this and the stability of system long-play provides guarantee, solves
One of " bottleneck " that optical system develops to high-energy, high-precision direction.
4th, compared to traditional heat treatment method in the presence of the residual stress that can only improve in optical thin film element mechanical property
Problem, and there are poor controllability, repeatability it is low, be not suitable for the problems such as optical elements of large caliber, post processing of the present invention
Method precision greatly improves, and controllability and the scope of application greatly promote.
5th, after the completion of post-processing approach of the present invention, on-line checking, the real-time thin-film component that obtains can adhere at once
The mechanical informations such as power, interface binding power, hardness, residual stress, it is whether up to standard for the mechanical property of check and evaluation thin-film component.
6th, post-processing approach of the present invention realizes simple, reliable that applicability is extensive.
Specific embodiment
The present invention will be further described in detail With reference to embodiment.
Embodiment 1：
A kind of post-processing approach that optical element mechanical property is improved based on laser blast wave, is included the following steps：
(1) electron beam evaporation is used to be coated with 1064nm high-reflecting film of the size for 50 × 5mm of φ, is obtained using wavefront interferometer
Sample residual stress R0, and utilize the critical adhesive force A of nano impress instrument measurement sample film layer and substrate0, film layer critical interfaces knot
B with joint efforts0With hardness H0；
(2) 10 laser energy step F are arbitrarily chosenj(j=1,2 ..., 10), each laser energy step correspond to 20
Test point sets the irradiance pulse number N of each test point1, pumping laser is directed at by online monitoring system and irradiates detected sample
The generation of damage and growth are detected in the position of product, count out and all number of test points purpose percentages so as to obtain damage, with
And obtain damage growth and count out and all number of test points purpose percentages, that is, it is initial under different-energy to obtain sample
Damage growth probability under damage probability and the pulse number；And sample is obtained by way of linear fit in irradiation arteries and veins
Rush number N1Under initial damage threshold value F01And damage growing threshold G01；
(3) sample is chosen again in a collection of optical thin film element made in step (1), by test point
Irradiance pulse number is changed to Nk(Nk≠N1), according to the method for step (2), sample is obtained in irradiance pulse number NkUnder
Initial damage threshold value F0kWith damage growing threshold G0k；
(4) step (3) is repeated, obtains the initial damage threshold value F0 (F0={ F under m different pulsed irradiation numbers01,
F02, F03……F0mAnd damage growing threshold G0 (G0={ G01, G02, G03……G0m}；It is required that pulsed irradiation number m is not less than sharp
200 times of light repetition rate, such as repetition rate is if 5Hz, the maximum number of pulses of test otherwise less than 1000；
(5) a cluster film element is chosen again in a collection of optical thin film element made in step (1), in thin-film component
Film surface pastes absorbed layer, absorbed layer select market purchase with the pitch-dark flexible lamina for material, the thickness of absorbed layer is 120 μ
M, absorber thickness are fluctuated as 8nm, the entire sample surfaces of area covering；Afterwards restraint layer, this reality are placed on the surface of absorbed layer
It is restraint layer to apply and deionized water is selected in example, and it is the uniform of 2.5mm that deionized water forms stable thickness on layer surface is absorbed
Moisture film forms the laboratory sample of laser blast wave post processing；
(6) sample is placed on motorized precision translation stage, while to ensure position all phases that same sample is placed every time
Together, so that the region all same post-processed every time, online microscope are directed at the position of pumping laser irradiation sample always
It puts, to detect sample in last handling process, absorbed layer and the state of restraint layer in real time；
(7) the original incident laser energy E for the pump laser that setting is handled for laser blast wave0, maximum incident laser
ENERGY EmWith laser energy incremental gradient Δ E, to select spot size be 2mm, overlapping rate 90%, Scanning size be 10 ×
10mm, it is desirable that E0And EmMake the maximum laser energy that thin-film component does not destroy when being acted on less than laser blast wave；And mark S
To be less than or equal to (Em-E0The maximum integer of)/Δ E；Make i=1；
(8) actual incident laser energy E=E is made0+ΔE*i；
(9) a laser blast wave scan process is carried out to sample using grating scanning mode so that thin-film component surface is micro-
Structure changes；
(10) the absorbed layer and restraint layer of film sample remained on surface are removed, and film sample is sprayed and ultrasound is clear
It washes；
(11), by the film sample of laser blast wave post processing, reuse wavefront interferometer and obtain sample residual stress
Ri, utilize the critical adhesive force A of nano impress instrument measurement sample film layer and substratei, film layer critical interfaces combination power BiAnd hardness
Hi, obtain the initial damage threshold value F0 under m different pulsed irradiation numbers after laser blast wave post-processesiWith damage growing threshold
G0i；
(12) i=i+1 is made；Judge whether i is less than or equal to S, if so, step (5) is transferred to, if it is not, entering step (13)；
(13) the irradiation by sample same area under pump laser different-energy is completed to the laboratory sample
The laser blast wave post processing of multiple energy gradients, and obtain S laser blast wave post processing rear film element mechanical property
Variation characteristic, including residual stress R1~RS, critical adhesive force A1~AS, critical interfaces combination power B1~BS, hardness H1~HSAnd m
Initial damage threshold value F0 under a difference pulsed irradiation number1~F0SWith damage growing threshold G01~G0S；
(14) original incident laser energy E is changed0, maximum incident laser energy EmWith laser energy incremental gradient Δ E, repeat
Step (5)~(13)；The mechanical characteristic R of thin-film component during not carrying out laser blast wave post processing0、A0、B0、H0And resisting laser damage
On the basis of ability F0, G0, E is obtained respectively0、EmSample mechanical property R after being handled with Δ E S laser blast waveS、AS、BS、HS
With resisting laser damage ability FS、GSAffecting laws；
According to mechanical property and the promotion situation of resisting laser damage ability, to initial laser ENERGY E0, increased energy gradient
Δ E and maximum laser ENERGY EmIt optimizes, when thin-film component mechanical property and resisting laser damage ability are no longer promoted, and meets
During the requirement of laboratory sample, stop Xun Huan, complete the post processing of thin-film component mechanical property；Think to reach optimal laser-impact at this time
Ripple post-processes effect, and corresponding is optimal laser blast wave aftertreatment technology parameter；The optimal laser blast wave post processing
Technique, including initial laser energy, increased energy gradient, maximum laser energy and hot spot overlapping rate etc..
Embodiment 2
A kind of post-processing approach that optical element mechanical property is improved based on laser blast wave, is included the following steps：
(1) electron beam evaporation is used to be coated with 532nm antireflective film of the size for 30 × 3mm of φ, sample is obtained using wavefront interferometer
Product residual stress R0, and utilize the critical adhesive force A of nano impress instrument measurement sample film layer and substrate0, the combination of film layer critical interfaces
Power B0With hardness H0；(2) 10 laser energy step F are arbitrarily chosenj(j=1,2 ..., 10), each laser energy step correspond to
20 test points set the irradiance pulse number N of each test point1, pumping laser is directed at by online monitoring system and irradiates quilt
The generation of damage and growth are detected in the position of sample, count out and all number of test points purpose percentages so as to obtain damage
Than and obtain damage growth count out and all number of test points purpose percentages, that is, obtain sample under different-energy
Initial damage probability and the pulse number under damage growth probability；And it obtains sample by way of linear fit and exists
Irradiance pulse number N1Under initial damage threshold value F01And damage growing threshold G01；
(3) sample is chosen again in a collection of optical thin film element made in step (1), by test point
Irradiance pulse number is changed to Nk(Nk≠N1), according to the method for step (2), sample is obtained in irradiance pulse number NkUnder
Initial damage threshold value F0kWith damage growing threshold G0k；
(4) step (3) is repeated, obtains the initial damage threshold value F0 (F0={ F under m different pulsed irradiation numbers01,
F02, F03……F0mAnd damage growing threshold G0 (G0={ G01, G02, G03……G0m}；It is required that pulsed irradiation number m is not less than
200 times of laser repetition rate, such as repetition rate is if 5Hz, the maximum number of pulses of test otherwise less than 1000；
(5) a cluster film element is chosen again in a collection of optical thin film element made in step (1), in thin-film component
Film surface pastes absorbed layer, absorbed layer select market purchase with the pitch-dark flexible lamina for material, the thickness of absorbed layer is 150 μ
M, absorber thickness are fluctuated as 8nm, the entire sample surfaces of area covering；Afterwards restraint layer, this reality are placed on the surface of absorbed layer
It is restraint layer to apply and deionized water is selected in example, and deionized water forms the uniform water that stable thickness is 3mm on layer surface is absorbed
Film forms the laboratory sample of laser blast wave post processing；
(6) sample is placed on motorized precision translation stage, while to ensure position all phases that same sample is placed every time
Together, so that the region all same post-processed every time, online microscope are directed at the position of pumping laser irradiation sample always
It puts, to detect sample in last handling process, absorbed layer and the state of restraint layer in real time；
(7) the original incident laser energy E for the pump laser that setting is handled for laser blast wave0, maximum incident laser
ENERGY EmWith laser energy incremental gradient Δ E, to select spot size be 1mm, overlapping rate 90%, Scanning size be 10 ×
10mm, it is desirable that E0And EmMake the maximum laser energy that thin-film component does not destroy when being acted on less than laser blast wave；And mark S
To be less than or equal to (Em-E0The maximum integer of)/Δ E；Make i=1；
(8) actual incident laser energy E=E is made0+ΔE*i；
(9) a laser blast wave scan process is carried out to sample using grating scanning mode so that thin-film component surface is micro-
Structure changes；
(10) the absorbed layer and restraint layer of film sample remained on surface are removed, and film sample is sprayed and ultrasound is clear
It washes；
(11), by the film sample of laser blast wave post processing, reuse wavefront interferometer and obtain sample residual stress
Ri, utilize the critical adhesive force A of nano impress instrument measurement sample film layer and substratei, film layer critical interfaces combination power BiAnd hardness
Hi, and repeat step (2)~(4), obtain the initial damage threshold value under m difference pulsed irradiation numbers after laser blast wave post processing
F0iWith damage growing threshold G0i；
(12) i=i+1 is made；Judge whether i is less than or equal to S, if so, step (5) is transferred to, if it is not, entering step (13)；
(13) the irradiation by sample same area under pump laser different-energy is completed to the laboratory sample
The laser blast wave post processing of multiple energy gradients, and obtain S laser blast wave post processing rear film element mechanical property
Variation characteristic, including residual stress R1~RS, critical adhesive force A1~AS, critical interfaces combination power B1~BS, hardness H1~HSAnd m
Initial damage threshold value F0 under a difference pulsed irradiation number1~F0SWith damage growing threshold G01~G0S；
(14) original incident laser energy E is changed0, maximum incident laser energy EmWith laser energy incremental gradient Δ E, repeat
Step (5)~(13)；The mechanical characteristic R of thin-film component during not carrying out laser blast wave post processing0、A0、B0、H0And resisting laser damage
On the basis of ability F0, G0, E is obtained respectively0、EmSample mechanical property R after being handled with Δ E S laser blast waveS、AS、BS、HS
With resisting laser damage ability FS、GSAffecting laws；
According to mechanical property and the promotion situation of resisting laser damage ability, to initial laser ENERGY E0, increased energy gradient
Δ E and maximum laser ENERGY EmIt optimizes, when thin-film component mechanical property and resisting laser damage ability are no longer promoted, and meets
During the requirement of laboratory sample, stop Xun Huan, complete the post processing of thin-film component mechanical property；Think to reach optimal laser-impact at this time
Ripple post-processes effect, and corresponding is optimal laser blast wave aftertreatment technology parameter；The optimal laser blast wave post processing
Technique, including initial laser energy, increased energy gradient, maximum laser energy and hot spot overlapping rate etc..
Change filming parameter (sedimentation rate, depositing temperature etc.), repeat step (1)~(14), can also obtain laser blast wave
Post-process the promotion rule to the optical thin film element mechanical property of same type difference micro-structure.
Claims (2)
1. a kind of post-processing approach that optical element mechanical property is improved based on laser blast wave, which is characterized in that including as follows
Step：
(1) a collection of optical thin film element is coated with using electron beam evaporation；An optical thin film element is arbitrarily chosen as detected sample
Product measure the residual stress R of sample0, film layer and substrate critical adhesive force A0, film layer critical interfaces combination power B0With it is hard
Spend H0；
(2) 200 test points are selected on sample, every 20 test points are as a test group；And choose 10 differences
Laser energy, as the corresponding laser energy of 10 test groups, all test points in each test group are corresponding to swash
Light energy is identical；The irradiance pulse number for setting each test point is N1, use pumping laser with selected laser energy according to
Test point on secondary irradiation sample, and the position of pumping laser irradiation sample is directed to examine by online monitoring system
The generation and growth of damage are surveyed, obtains the damage under initial damage probability and the pulse number of the sample under different-energy
Grow probability；And sample is obtained by way of linear fit in irradiance pulse number N1Under initial damage threshold value F01With
And damage growing threshold G01；
(3) sample is chosen again, and the irradiance pulse number of test point is changed to Nk, Nk≠N1, according to step (2)
Method obtains sample in irradiance pulse number NkUnder initial damage threshold value F0kWith damage growing threshold G0k；
(4) step (3) is repeated, obtains initial damage threshold value F0 and damage growth threshold under m different pulsed irradiation numbers
Value G0；Wherein, F0={ F01, F02, F03……F0m, G0={ G01, G02, G03……G0m, it is desirable that pulsed irradiation number m is not small
In 200 times of laser repetition rate；
(5) a cluster film element is chosen again in a collection of optical thin film element made in step (1), in the cluster film element
Film surface pastes absorbed layer；Restraint layer is placed on the surface of absorbed layer, forms the laboratory sample for laser blast wave post processing；
(6) laboratory sample is placed on motorized precision translation stage, while ensures that the position that same sample is placed every time is all identical；Make
Line microscope is directed at the position of pumping laser irradiation experiment sample always, to detect in real time laboratory sample in last handling process,
The state of absorbed layer and restraint layer；
(7) the original incident laser energy E for the pump laser that setting is handled for laser blast wave0, maximum incident laser energy
EmWith laser energy incremental gradient Δ E, and fixed spot size, overlapping rate and scanning area；It is required that E0And EmLess than laser-impact
Ripple makes the maximum laser energy that thin-film component does not destroy when acting on；And it is less than or equal to (E to mark Sm-E0The maximum of)/Δ E
Integer；Make i=1；
(8) actual incident laser energy E=E is made0+ΔE*i；
(9) a laser blast wave scan process is carried out to sample using grating scanning mode so that thin-film component surface micro-structure
It changes；
(10) the absorbed layer and restraint layer of film sample remained on surface are removed, and film sample is sprayed and is cleaned by ultrasonic, is obtained
One group of laboratory sample of laser blast wave post processing must be passed through；
(11) the residual stress R after shock wave post-processes is measured respectively using this group of laboratory samplei, film layer and substrate it is critical attached
Put forth effort Ai, film layer critical interfaces combination power BiWith hardness Hi, and repeat step (2)~(4), obtain laser blast wave post processing
Initial damage threshold value F0 under m different pulsed irradiation numbers afterwardsiWith damage growing threshold G0i；
(12) i=i+1 is made；Judge whether i is less than or equal to S, if so, step (5) is transferred to, if it is not, entering step (13)；
(13) the irradiation by sample same area under pump laser different-energy completes multiple to the laboratory sample
The laser blast wave post processing of energy gradient, and obtain S laser blast wave post processing rear film element mechanical property variation
Characteristic, including residual stress R1~RS, critical adhesive force A1~AS, critical interfaces combination power B1~BS, hardness H1~HSWith m not
With the initial damage threshold value F0 under pulsed irradiation number1~F0SWith damage growing threshold G01~G0S；
(14) original incident laser energy E is changed0, maximum incident laser energy EmWith laser energy incremental gradient Δ E, step is repeated
(5)~(13)；The mechanical characteristic R of thin-film component during not carrying out laser blast wave post processing0、A0、B0、H0With resisting laser damage ability
On the basis of F0, G0, E is obtained respectively0、EmSample mechanical property R after being handled with Δ E S laser blast waveS、AS、BS、HSWith it is anti-
Damage from laser ability FS、GSAffecting laws；According to mechanical property and the promotion situation of resisting laser damage ability, to initial laser
ENERGY E0, increased energy gradient delta E and maximum laser ENERGY EmIt optimizes, when thin-film component mechanical property and resisting laser damage
Ability is no longer promoted, and when meeting the requirement of laboratory sample, stops cycle, completes the post processing of thin-film component mechanical property.
2. the post-processing approach according to claim 1 that optical element mechanical property is improved based on laser blast wave, special
Sign is that step can also include after (14)：Change the step the filming parameter in (1), repeat step (1)~(14), obtain laser punching
Hit promotion rule of the ripple post processing to the optical thin film element mechanical property of same type difference micro-structure.
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