CN106903334A - Chemical vapour deposition diamond cutter and its processing method - Google Patents
Chemical vapour deposition diamond cutter and its processing method Download PDFInfo
- Publication number
- CN106903334A CN106903334A CN201710197936.1A CN201710197936A CN106903334A CN 106903334 A CN106903334 A CN 106903334A CN 201710197936 A CN201710197936 A CN 201710197936A CN 106903334 A CN106903334 A CN 106903334A
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- face
- blade
- cutting
- vapour deposition
- matrix
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
- B23P15/30—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools lathes or like tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2200/00—Details of cutting inserts
- B23B2200/04—Overall shape
- B23B2200/0471—Square
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2200/00—Details of cutting inserts
- B23B2200/28—Angles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2226/00—Materials of tools or workpieces not comprising a metal
- B23B2226/31—Diamond
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2228/00—Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner
- B23B2228/04—Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner applied by chemical vapour deposition [CVD]
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to a kind of chemical vapour deposition diamond cutter and its processing method.The processing method includes providing the matrix being made up of hard alloy and the blade being made up of chemical vapour deposition diamond；Welding blade is to the end of matrix；Grinding blade removal blade is soldered to excessive surplus behind the end of matrix；And laser cutting blade exposes in the cutting face in empty avoiding face, make the complementary angle of angle between the major first flank and rake face in cutting face for 10 12 °, and make in cutting face second after angle between knife face and rake face complementary angle be angle between the major first flank and rake face complementary angle twice.Above-mentioned chemical vapour deposition diamond cutter and its processing method, the chipping of cutting edge is within 2 μm, and processing efficiency is higher, can meet the requirement of the crudy and speed for cutter.
Description
Technical field
The present invention relates to superhard material manufacture field, more particularly to a kind of chemical vapour deposition diamond cutter and its add
Work method.
Background technology
Diamond also known as diamond, are the isomers of carbon, belong to cubic system, with face-centred cubic structure, typically
Atomic crystal.Diamond has many impayable excellent properties, such as mechanical property, thermal characteristic, translucency, semiconductor
Characteristic and chemical inertness etc., are premier in all of material of nature.It is wide because of the excellent properties of diamond
It is general to apply in machinery manufacturing industry, it is fabricated to high performance cutting tool and dressing tool.Due to diamond reserves in nature
Seldom, and exploit it is also extremely difficult, people mostly use diamond synthesis.
The Single-crystal Diamond Cutters of HTHP (HTHP) method synthesis that the 1950's introduces, with extremely sharp
Cutting edge and low-friction surface, it is processed good surface smoothness.But the structure of single-crystal diamond is also determined
Its break resistance is poor.
Metal sintering polycrystalline diamond (PCD) cutter of 20 century 70s exploitation, with more excellent toughness, this characteristic
It is the result that there is cobalt phase in the bond strength and PCD material formed in crystallite dimension, the sintering process by diamond.But
Also just because of the presence of cobalt bonding agent, make it more sensitive to corroding, and easily make at high temperature diamond oxidation transformation into
Graphite.Additionally, the less PCD cutters wearability of crystallite dimension is inadequate.
Chemical vapor deposition (CVD) diamond cutter developed in recent years, remains the peculiar property of natural diamond, with
PCD cutters are compared, and cvd diamond cutter has hardness higher, preferably rigidity, smaller coefficient of friction, and preferably
Thermal conductivity and chemical stability, and wearability is 2-10 times of PCD cutters.Based on above-mentioned advantage, cvd diamond cutter can
To substitute PCD cutters in many processing, and apply also for some PCD and the limited processing space of Single-crystal Diamond Cutters
Close.Because cvd diamond cutter is non-conductive, it is impossible to be processed using wire cutting mode, processing mode main at present is sand
Wheel grinding.But wheel grinding efficiency is low, and small chipping is easily produced at blade, it is impossible to meet actual requirement.
The content of the invention
Based on this, it is necessary to for the problem that chemical vapor deposition (CVD) diamond cutter is present, there is provided a kind of chemical gas
Mutually deposit (CVD) diamond cutter and its processing method.
A kind of chemical vapour deposition diamond cutter, including matrix and be welded on matrix by chemical vapor deposition Buddha's warrior attendant
It is made of stones into blade, the one end of described matrix is provided with mutually perpendicular two empty avoiding faces, and abutted with two empty avoiding faces
Mounting plane, the blade is square sheet, including is arranged at the bottom surface of mounting plane, away from the rake face of mounting plane, with
And side and cutting face between rake face and bottom surface, the side overlaps with one of empty avoiding face of matrix, described
Cutting face exposes to another empty avoiding face, and the cutting face includes the major first flank being connected with rake face and is connected with bottom surface
Knife face after second, forms cutting edge, the folder between the major first flank and rake face between the rake face and major first flank
The complementary angle at angle is 10-12 °, and the complementary angle of the angle after described second between knife face and rake face is the major first flank and preceding knife
The twice of the complementary angle of the angle between face.
Wherein in one embodiment, the length of the cutting edge is 3-3.5mm.
Wherein in one embodiment, the cutting edge to the length that the distance in described another empty avoiding face is the cutting edge
1/3rd.
Wherein in one embodiment, the width of the major first flank is 0.1-0.15mm.
Wherein in one embodiment, described matrix includes connecting portion annular in shape and is extended by connecting portion one end
Installation portion, connecting hole is set on the connecting portion, the mounting plane and empty avoiding face are arranged at the end of installation portion.
A kind of processing method of above-mentioned chemical vapour deposition diamond cutter, including：
The matrix being made up of hard alloy and the blade being made up of chemical vapour deposition diamond are provided；
Welding blade is to the end of matrix；
Grinding blade removal blade is soldered to excessive surplus behind the end of matrix；And
Laser cutting blade exposes in the cutting face in empty avoiding face, makes between the major first flank and rake face in cutting face
The complementary angle of angle is 10-12 °, and make in cutting face second after the complementary angle of angle between knife face and rake face be described first
The twice of the complementary angle of the angle between knife face and rake face afterwards.
It is described to be welded as vacuum welding, soldering, HFI welding, gas shielded welding wherein in one embodiment
In one kind.
Wherein in one embodiment, during vacuum welding, cream solder is applied to the end of matrix and blade is placed, entered
After 200 DEG C of heat preservation solidifications of row, it is put into vacuum drying oven and vacuumizes, and be warming up to 700 DEG C, weld 30 minutes, is then cooled to 25 DEG C.
Wherein in one embodiment, the blade is square sheet, during grinding blade, using each depth of cut of emery wheel
Below 0.02mm, so that the side overlaps with one of empty avoiding face of matrix, the cutting face exposes to another empty avoiding
The distance in face is 1/3rd of the length of the blade length of side.
Wherein in one embodiment, during laser cutting, laser power 8W-18W, 10-18 μm of laser width, laser work
5-10 ° of taper, laser frequency 1500-16667HZ, linear velocity 15-30mm/min, 60-80 μm of laser spacing is cut by laser depth
0.03-0.1mm。
Above-mentioned chemical vapour deposition diamond cutter and its processing method, the chipping of cutting edge is within 2 μm, and processing efficiency
It is higher, the requirement of the crudy and speed for cutter can be met.
Brief description of the drawings
The structural representation of chemical vapor deposition (CVD) diamond cutter that Fig. 1 is provided for one embodiment of the invention.
Fig. 2 is the schematic front view of Fig. 1 part-structures.
Fig. 3 is the schematic top plan view of Fig. 1 part-structures.
Fig. 4 is the schematic side view of Fig. 1.
Fig. 5 is the schematic cross-section of the knife edge part of chemical vapour deposition diamond cutter shown in Fig. 1.
Specific embodiment
As shown in figure 1, the chemical vapour deposition diamond cutter that one embodiment of the invention is provided includes matrix and is welded on
Blade 20 on matrix 10.The blade is chemical vapour deposition diamond blade.In one embodiment, described matrix is closed by hard
Gold is made.
Described matrix 10 includes connecting portion 11 annular in shape and the installation portion 12 extended by the one end of connecting portion 11.Change
When vapor diamond deposition cutter is used, the connecting portion 11 is used to connect the actuator of cutter.Processing the chemical gas
During phase depositing diamond cutter, the connecting portion 11 can also be used for fixing, such as when the blade 20 is processed, can be clamped and connected
Portion 11 positions with to chemical vapour deposition diamond cutter.Connecting hole 110, connecting hole 110 are set on the connecting portion 11
For setting fastener.
The installation portion 12 is extended by one end of the connecting portion 11 of ring-type.The installation portion 12 includes that two hang down mutually
Straight empty avoiding face, individually below referred to as the first empty avoiding face 121 and the second empty avoiding face 122, and adjacent first empty avoiding face 121 and the
The mounting plane 123 in two empty avoiding faces 122.The axial direction of the connecting hole 110 in the connecting portion 11 of the mounting plane 123 and matrix 11
Direction is parallel, and horizontally extending.With reference to Fig. 2, the first empty avoiding face 121 and the second empty avoiding face 122 and mounting plane
123 angle is less than 90 °, and the first empty avoiding face 121 and the second empty avoiding face 122 are installed away from one end direction of mounting plane 123
The inner inclination of portion 12 so that the end of the installation portion 12 forms empty avoiding region away from the region of mounting plane 123, so as to blade
Walking during 20 installation, processing and use.
With reference to Fig. 3 and Fig. 4, the blade 20 is square sheet, including is arranged at the bottom surface 21 of mounting plane 123,
Away from the rake face 22 of mounting plane 123, and four sides between rake face 22 and bottom surface 21.Bottom surface 21 and preceding knife
Face 22 is parallel to each other, and and plane-parallel.The empty avoiding face 122 of one of side 23 and second overlaps.Outside another side
The first empty avoiding face 121 is exposed to, and as cutting face 24.The cutting face 24 includes the major first flank being connected with rake face 22
241 and be connected with bottom surface 21 second after knife face 242.Wherein, cutting edge is formed between the rake face 22 and major first flank 241
25.The cutting face 24 exposes to the first empty avoiding face 121, refers to after cutting edge 25, major first flank 241 and second in knife face 242
Any point be vacantly arranged on outside the first empty avoiding face 121, after cutting edge 25, major first flank 241 and second in knife face 242
Any position do not fall within the side that the first empty avoiding face 121 is located at mounting plane 123.
In use, workpiece to be processed is contacted the chemical vapour deposition diamond cutter with cutting edge 25, cutting edge 25
For cutting workpiece to be processed, the chip flow of generation is through rake face 22.After major first flank 241 and second knife face 242 not with
Workpiece to be processed is contacted, and plays empty avoiding effect.
With reference to Fig. 5, the complementary angle A1 of the angle between the major first flank 241 and rake face 22 is 10-12 °, institute
The complementary angle A2 for stating the angle after second between knife face 242 and rake face 22 is between the major first flank 241 and rake face 22
Angle complementary angle A1 twice.In one specific embodiment, A1 is 10 °.
Further, the length of the cutting edge 25 is 3-3.5mm.That is, the square block length of side of described blade 20 is 3-
3.5mm.In one specific embodiment, the length of the cutting edge 25 is 3mm.As shown in Figure 3, the cutting edge 25 is kept away to described first
Empty face 121 apart from 1/3rd of the length that d is the cutting edge 25.In one embodiment, it is described apart from d be 1mm.More precisely
Say, the distance between apart from d be the empty avoiding face of cutting edge 25 to the first 121 with intersection of mounting plane 123.When the first empty avoiding face
121 with mounting plane 123 it is nonopiate when, the distance of the cutting edge 25 to the first empty avoiding face 121 with it is above-mentioned apart from d can slightly
It is variant.
As shown in Figure 5, the width W of the major first flank 241 is 0.1-0.15mm.The major first flank 241
Width refer to cutting edge 25 with major first flank 241 and second after the distance between knife face 242 both intersections.
The processing method that the present invention also provides the chemical vapour deposition diamond cutter described in a kind of above-mentioned any embodiment.
The processing method generally comprises following steps：
The matrix being made up of hard alloy and the blade being made up of chemical vapour deposition diamond are provided；
Welding blade is to the end of matrix；
Grinding blade removal blade is soldered to excessive surplus behind the end of matrix；And
Laser cutting blade exposes in the cutting face in empty avoiding face, makes between the major first flank and rake face in cutting face
The complementary angle of angle is 10-12 °, and make in cutting face second after the complementary angle of angle between knife face and rake face be described first
The twice of the complementary angle of the angle between knife face and rake face afterwards.
First, matrix needs to be machined to the convenient surface structure with blade welding.For example, processed on matrix forming described
Connecting portion and installation portion, connecting hole is set on connecting portion, installation portion processing has mounting surface, the first empty avoiding face, the second empty avoiding
Face etc..To ensure the quality of welding, surface clean can be carried out to matrix, goes oxide film dissolving etc. to manage.
The blade is formed by chemical vapour deposition diamond, the structure with general square shape sheet.Wherein the two of blade
Individual relatively large plane respectively as welding bottom surface 21, and the rake face 22 that chip is flowed through.The blade and matrix
Welding can be using the form such as vacuum welding, soldering, HFI welding, gas shielded welding.After welding, wherein the one of blade
Side 23 overlaps with the second empty avoiding face of matrix, and another side exposes outside the first empty avoiding face as cutting face 24.Cutting face 24 with
The intersection of rake face 22 is the cutting edge 25 that blade will be contacted with workpiece to be processed.The length of cutting edge 25 is the length of side of blade.
In one embodiment, vacuum welding can be used.Specifically, cream solder can be applied into the end of matrix and place knife
Piece, after carrying out 200 DEG C of heat preservation solidifications, is put into vacuum drying oven and vacuumizes, and is warming up to 700 DEG C, welds 30 minutes, is then cooled to
25℃。
After welding blade, blade is possible to dislocation and does not reach finished product requirement with the relative position of matrix, for example, blade
Side 23 is misaligned with the second empty avoiding face 122, or cutting face 24 is excessive with the distance between the first empty avoiding face 121, therefore can
The step of by grinding, removes surplus excessive on blade.During grinding blade, using each below the depth of cut 0.02mm of emery wheel,
So that the side 23 of blade overlaps with the second empty avoiding face 122 of matrix 10, the cutting face 24 exposes to the first empty avoiding face
121 distance is 1/3rd of the length of the length of side of the blade.
Grinding can use W20 or W40 emery wheels.
Then, the cutting face 24 to blade is cut by laser.During laser cutting, laser power 8W-18W, laser width
10-18 μm, 5-10 ° of laser work taper, laser frequency 1500-16667HZ, linear velocity 15-30mm/min, laser spacing 60-
80 μm, laser cutting depth 0.03-0.1mm.First, cutting face 24 is cut by laser adjacent to the part of rake face 24, into
Type major first flank 241 is after the angle between major first flank 241 and rake face 22 meets requirement then neighbouring to cutting face 24
The part of bottom surface 21 is cut by laser, with knife face after being molded second 242.
The blade that the above method is processed, the small chipping of its cutting edge 25 is within 2 μm, and the time being cut by laser is only
Need 5 minutes, come more than 10 μm compared to traditional simple dozens of minutes using needed for grinding, and the blade chipping for producing
Say, be greatly improved crudy and efficiency.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed, but simultaneously
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of chemical vapour deposition diamond cutter, it is characterised in that including matrix and be welded on matrix by chemical gaseous phase
The blade that depositing diamond is made, the one end of described matrix is provided with mutually perpendicular two empty avoiding faces, and with two empty avoidings
The mounting plane of face adjoining, the blade is square sheet, including is arranged at the bottom surface of mounting plane, before mounting plane
Knife face, and side and cutting face between rake face and bottom surface, the side are heavy with one of empty avoiding face of matrix
Close, the cutting face exposes to another empty avoiding face, the cutting face include the major first flank being connected with rake face and with bottom
Knife face after the second of face connection, forms cutting edge, the major first flank and rake face between the rake face and major first flank
Between the complementary angle of angle be 10-12 °, the complementary angle of the angle after described second between knife face and rake face is knife after described first
The twice of the complementary angle of the angle between face and rake face.
2. chemical vapour deposition diamond cutter according to claim 1, it is characterised in that the length of the cutting edge is 3-
3.5mm。
3. chemical vapour deposition diamond cutter according to claim 1, it is characterised in that the cutting edge is to described another
The distance in individual empty avoiding face is 1/3rd of the length of the cutting edge.
4. chemical vapour deposition diamond cutter according to claim 1, it is characterised in that the width of the major first flank
It is 0.1-0.15mm to spend.
5. chemical vapour deposition diamond cutter according to claim 1, it is characterised in that described matrix includes annular in shape
Connecting portion and the installation portion that is extended by connecting portion one end, connecting hole, the mounting plane are set on the connecting portion
With the end that empty avoiding face is arranged at installation portion.
6. a kind of processing method of the chemical vapour deposition diamond cutter described in claim 1-5 any one, its feature exists
In including：
The matrix being made up of hard alloy and the blade being made up of chemical vapour deposition diamond are provided；
Welding blade is to the end of matrix；
Grinding blade removal blade is soldered to excessive surplus behind the end of matrix；And
Laser cutting blade exposes in the cutting face in empty avoiding face, makes the angle between the major first flank and rake face in cutting face
Complementary angle be 10-12 °, and make in cutting face second after the complementary angle of angle between knife face and rake face be knife after described first
The twice of the complementary angle of the angle between face and rake face.
7. the processing method of chemical vapour deposition diamond cutter according to claim 6, it is characterised in that the welding
It is the one kind in vacuum welding, soldering, HFI welding, gas shielded welding.
8. the processing method of chemical vapour deposition diamond cutter according to claim 7, it is characterised in that vacuum welding
When, cream solder is applied to the end of matrix and blade is placed, after carrying out 200 DEG C of heat preservation solidifications, it is put into vacuum drying oven and takes out true
Sky, and it is warming up to 700 DEG C, weld 30 minutes, then it is cooled to 25 DEG C.
9. the processing method of chemical vapour deposition diamond cutter according to claim 7, it is characterised in that the blade
It is square sheet, during grinding blade, using each below the depth of cut 0.02mm of emery wheel, so that the side and wherein the one of matrix
Individual empty avoiding face overlaps, the distance that the cutting face exposes to another empty avoiding face be the length of the blade length of side three/
One.
10. the processing method of chemical vapour deposition diamond cutter according to claim 7, it is characterised in that laser is cut
When cutting, laser power 8W-18W, 10-18 μm of laser width, 5-10 ° of laser work taper, laser frequency 1500-16667HZ, line
Speed 15-30mm/min, 60-80 μm of laser spacing, laser cutting depth 0.03-0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710197936.1A CN106903334A (en) | 2017-03-29 | 2017-03-29 | Chemical vapour deposition diamond cutter and its processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710197936.1A CN106903334A (en) | 2017-03-29 | 2017-03-29 | Chemical vapour deposition diamond cutter and its processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106903334A true CN106903334A (en) | 2017-06-30 |
Family
ID=59194256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710197936.1A Pending CN106903334A (en) | 2017-03-29 | 2017-03-29 | Chemical vapour deposition diamond cutter and its processing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN106903334A (en) |
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| CN108941715A (en) * | 2018-06-29 | 2018-12-07 | 南京航空航天大学 | A kind of preparation method of the micro- milling cutter of cvd diamond |
| CN110369960A (en) * | 2019-07-31 | 2019-10-25 | 山西锐倍特超硬刀具有限公司 | A kind of production method of diamond forming tool |
| CN113146167A (en) * | 2021-04-14 | 2021-07-23 | 惠州市鑫金泉精密技术有限公司 | Tool grain finish machining method |
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| CN108941715A (en) * | 2018-06-29 | 2018-12-07 | 南京航空航天大学 | A kind of preparation method of the micro- milling cutter of cvd diamond |
| CN110369960A (en) * | 2019-07-31 | 2019-10-25 | 山西锐倍特超硬刀具有限公司 | A kind of production method of diamond forming tool |
| CN113146167A (en) * | 2021-04-14 | 2021-07-23 | 惠州市鑫金泉精密技术有限公司 | Tool grain finish machining method |
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