CN106903037A - Ultrasonic transducer, ultrasonic array probe and ultrasonic image-forming system - Google Patents
Ultrasonic transducer, ultrasonic array probe and ultrasonic image-forming system Download PDFInfo
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- CN106903037A CN106903037A CN201710050668.0A CN201710050668A CN106903037A CN 106903037 A CN106903037 A CN 106903037A CN 201710050668 A CN201710050668 A CN 201710050668A CN 106903037 A CN106903037 A CN 106903037A
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- 239000000523 sample Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000002604 ultrasonography Methods 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 12
- 238000003491 array Methods 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000026683 transduction Effects 0.000 claims description 2
- 238000010361 transduction Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000003384 imaging method Methods 0.000 abstract description 22
- 230000015572 biosynthetic process Effects 0.000 abstract description 17
- 238000003786 synthesis reaction Methods 0.000 abstract description 16
- 238000012285 ultrasound imaging Methods 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4477—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device using several separate ultrasound transducers or probes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/52—Devices using data or image processing specially adapted for diagnosis using ultrasonic, sonic or infrasonic waves
Abstract
The invention provides a kind of ultrasonic transducer, ultrasonic array probe and ultrasonic image-forming system, belong to ultrasonic technique field, the ultrasonic transducer includes：The polarised direction of piezoelectric patches group, piezoelectric patches of the piezoelectric patches group including the superposition of at least two through-thickness and two neighboring piezoelectric patches is opposite.The present invention is superimposed by by the different two panels of polarised direction or multi-disc piezoelectric patches, so that the ultrasonic transducer also has multiple synthesis resonant frequencies in addition to the reference frequency with each piezoelectric patches for constituting its working lining, such that it is able to realize high frequency ultrasound imaging and multiple frequency ultrasonic imaging, the bandwidth and imaging resolution of transducer are improve.
Description
Technical field
The present invention relates to ultrasonic technique field, and in particular to a kind of ultrasonic transducer, ultrasonic array probe and ultrasonic imaging
System.
Background technology
Ultrasonic transducer is to convert electrical signals to ultrasonic signal and by ultrasonic time by piezo-electric effect and inverse piezoelectric effect
Ripple is converted into the device of electric signal, is the core devices of ultrasonic image-forming system.As clinical B ultrasonic detects used probe, it is exactly
It is made up of ultrasound transducer array.
With becoming increasingly popular for the development of clinical technology, especially amnio-infusion, the resolution ratio to ultrasonic imaging will
Seek more and more higher.And the resolution ratio of ultrasonoscopy is mainly determined by the centre frequency of ultrasonic transducer, frequency is higher, then wavelength is got over
Short, resolution ratio is higher.And the high-frequency ultrasonic transducer of traditional handicraft requirement must use very thin piezoelectric ceramic piece as it
Working lining, general thickness is 1/2nd of operating frequency wavelength, the PZT (piezoelectric transducer) of such as 50MHz, its piezoelectric working layer
Thickness is generally 35~40 microns, and this processing development technology to transducer proposes very big challenge.Meanwhile, with new many
Frequency ultrasonic imaging technique is emerged in large numbers, such as harmonic imaging, double frequency imaging technique, and centre frequency working range to transducer has
It is more to require.Multiple frequency ultrasonic transducer technology main at present mainly includes Multi-layers distributing and inverted distribution etc., specific as follows：
Inverted distribution transducer mainly uses the heat treatment of piezoelectric ceramics such as lithium niobate or lithium tantalate in sintering
Technique so that same potsherd levels polarised direction is different, so as to produce harmonic vibration when exciting, and then forms broadband
Ultrasonic transducer.If levels thickness is identical, its resonant frequency is 2 times of its reference frequency.But the method is needed to ceramics
Material is modified in itself, very high to process technology condition and device requirement, is difficult to popularize.
And multi-layered transducer is then, using the identical or different potsherd of bonding superposition multi-disc, to be excited and received by control
Piece number realize detection or the harmonic imaging of multi-frequency.But different layers potsherd its polarised direction is all identical.Such as phase
The two panels potsherd of stack pile stacks up according to multi-layered transducer, frequency (layered ceramic piece center on the basis of its resonant frequency
Frequency) 2 times.But the method needs to carry out every layer of potsherd line and control respectively, makes and control technique more complicated.
The content of the invention
Therefore, the technical problem to be solved in the present invention is that existing utilization low frequency piezoelectric obtains high-frequency ultrasonic signal
Or the technology of multiple frequency ultrasonic signal it is either high to the processing request of piezoelectric, or manufacture craft and control method it is complicated.
Therefore, the embodiment of the invention provides following technical scheme：
A kind of ultrasonic transducer is the embodiment of the invention provides, including：Piezoelectric patches group, the piezoelectric patches group includes at least two
The piezoelectric patches of the individual through-thickness superposition and polarised direction of the two neighboring piezoelectric patches is opposite.
Alternatively, also including electrode, the electrode is connected to the outer surface of the piezoelectric patches of the piezoelectric patches group both sides.
Alternatively, also including at least one of which back sheet and/or at least one of which matching layer, and electrode, the back sheet sets
In the side of the piezoelectric patches group, the matching layer located at the piezoelectric patches group opposite side, one of them described electrode with most
The conductive back sheet connection of outer layer, another described electrode is connected with outermost conductive matching layer.
Alternatively, can be by glue or epoxy resin or elargol or two-sided glue sticking between the two neighboring piezoelectric patches.
Alternatively, the piezoelectric patches is that rectangular bar thin slice or square sheets or thin rounded flakes or annular wafer or prismatic are thin
Piece or bowl-shape concave spherical surface thin slice or convex spherical thin slice or arcuation thin slice.
Alternatively, the piezoelectric patches group include one located at outermost first piezoelectric patches in side, at least two respectively with
Second piezoelectric patches of the first piezoelectric patches side connection.
Alternatively, the first piezoelectric patches ground connection, located at the outermost second piezoelectric patches difference receiving electrode.
Alternatively, the thickness of each piezoelectric patches is identical in the piezoelectric patches group or difference.
Alternatively, the piezoelectric patches is using the one kind in piezoelectric ceramics, piezoelectric monocrystal, piezoelectric membrane and composite piezoelectric ceramic
Or it is various.
The embodiment of the present invention additionally provides a kind of ultrasonic array probe, it is characterised in that including：Ultrasound described in multiple is changed
Many array element arrays that energy device is rearranged.
Alternatively, many array element arrays are with linear array, convex battle array, the recessed battle array of bowl face or matrix distribution.
Alternatively, the ultrasonic transducer shares the piezoelectric patches at a bottom or top, and corresponding top or bottom are pressed
Electric piece is provided separately, wherein, shared piezoelectric patches can be used as holding altogether, the individual piezoelectric patches difference connection electrode being respectively provided separately.
The embodiment of the present invention additionally provides a kind of ultrasonic image-forming system, it is characterised in that including：Described ultrasonic transduction
Device, ultrasound emission circuit, ultrasonic echo receiving circuit and for being processed ultrasonic echo and be converted to image treatment electricity
Road, and for switched conductive ultrasound emission circuit and the transmit-receive switch of ultrasonic echo receiving circuit.
Technical solution of the present invention, has the following advantages that：
1. ultrasonic transducer provided in an embodiment of the present invention, folds by by the different two panels of polarised direction or multi-disc piezoelectric patches
Plus so that the ultrasonic transducer also has multiple synthesis resonance in addition to the reference frequency with each piezoelectric patches for constituting its working lining
Frequency, and from unlike conventional multilayer superposition ultrasonic transducer and tradition inversion layer transducer：When the thickness of each layer piezoelectric patches
The frequency that its resonance occurs when spending identical is no longer 2 overtones bands but 3 overtones bands.Therefore, it can be obtained using low frequency piezoelectric
High-frequency ultrasonic signal is taken, while multiple frequency ultrasonic signal can also be obtained.If in addition, using different-thickness piezoelectric patches combine,
The working frequency combination of more different Changing Patterns can be obtained.Such that it is able to realize high frequency ultrasound imaging and multiple frequency ultrasonic imaging,
And improve the bandwidth and imaging resolution of transducer.
2. ultrasonic image-forming system provided in an embodiment of the present invention, the piezoelectric working layer of its ultrasonic transducer is by least two
Through-thickness superposition piezoelectric patches and two neighboring piezoelectric patches 1 polarised direction conversely, therefore it can once launch and receive
Ultrasonic signal comprising different frequency (reference frequency, the different resonant frequencies of synthesis), so as to once obtain different frequencies simultaneously
The ultrasonoscopy of rate, including reference frequency ultrasonic echo image and each synthesis resonant frequency ultrasonic echo image, variant frequency
The ultrasonoscopy of rate can also be merged accordingly.
3. ultrasonic image-forming system provided in an embodiment of the present invention, due to that can be operated under different centre frequencies, therefore
The probe of different frequency need not be changed, it is possible to switching working mode.Wherein, lower frequency reference frequency mode of operation can obtain compared with
The ultrasonic imaging detection of deep scope, can obtain the ultrasonoscopy of Shallow High Resolution under frequency multiplication mode of operation high.Namely utilize
One ultrasonic probe can just realize the ultrasonic imaging of different scale different resolution.Furthermore it is also possible to using ultrasonic transducer
Frequency multiplication rule, realize harmonic imaging with reference to microvesicle etc., be effectively simplified conventional harmonic imaging need low-frequency probe encourage, high frequency
The method that probe is received.
Brief description of the drawings
In order to illustrate more clearly of the specific embodiment of the invention or technical scheme of the prior art, below will be to specific
The accompanying drawing to be used needed for implementation method or description of the prior art is briefly described, it should be apparent that, in describing below
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before creative work is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation of ultrasonic transducer in the embodiment of the present invention 1；
Fig. 2 is second structural representation of ultrasonic transducer in the embodiment of the present invention 1；
Fig. 3 is the structural representation of ultrasonic array probe in the embodiment of the present invention 2；
Fig. 4 is the structural representation of ultrasonic array probe in the embodiment of the present invention 2；
Fig. 5 is a kind of structured flowchart of ultrasonic image-forming system in the embodiment of the present invention 3；
Fig. 6 is a kind of echo-signal frequency spectrum of inversion layer distributed ultrasound transducer provided in an embodiment of the present invention.
Reference：1- piezoelectric patches, 11- piezoelectric workings layer, 2- electrodes, 3- matching layers, 4- back sheets, the piezoelectricity of 01- first
Piece, the piezoelectric patches of 02- second, 21- ultrasonic probes, 22- transmit-receive switches, 23- impulse senders, 24- echo receivers, 25-
IL time gain compensation units, 26- AD conversion units, 27-IL Beam synthesis units, 28-IL signal processing units, 29-IL
Graphics processing unit, 30- display screens, 31- user's control input blocks.
Specific embodiment
Technical scheme is clearly and completely described below in conjunction with accompanying drawing, it is clear that described implementation
Example is a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
In the description of the invention, it is necessary to explanation, term " " center ", " on ", D score, "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " interior ", " outward " be based on orientation shown in the drawings or position relationship, merely to
Be easy to the description present invention and simplify describe, rather than indicate imply signified device or element must have specific orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.Additionally, term " first ", " second ",
" the 3rd " is only used for describing purpose, and it is not intended that indicating or implying relative importance.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Company ", " connection " should be interpreted broadly, for example, it may be being fixedly connected, or being detachably connected, or be integrally connected；Can
Being to mechanically connect, or electrically connect；Can be joined directly together, it is also possible to be indirectly connected to by intermediary, can be with
It is two connections of element internal, can is wireless connection, or wired connection.For one of ordinary skill in the art
For, above-mentioned term concrete meaning in the present invention can be understood with concrete condition.
As long as additionally, technical characteristic involved in invention described below different embodiments non-structure each other
Can just be combined with each other into conflict.
Embodiment 1
As illustrated in fig. 1 and 2, a kind of ultrasonic transducer is present embodiments provided, including：Piezoelectric patches group, piezoelectric patches group includes
At least two through-thickness superposition piezoelectric patches 1 and two neighboring piezoelectric patches 1 polarised direction it is opposite.
The ultrasonic transducer that the present embodiment is provided, is superimposed by by the different two panels of polarised direction or multi-disc piezoelectric patches 1, makes
Obtain the ultrasonic transducer and also have multiple synthesis resonance in addition to the reference frequency with each piezoelectric patches 1 for constituting its working lining frequently
Rate, and from unlike conventional multilayer superposition ultrasonic transducer and tradition inversion layer transducer：When the thickness of each layer piezoelectric patches 1
The frequency that its resonance occurs when identical is no longer 2 overtones bands but 3 overtones bands.Fig. 6 is shown based on same thickness, centre frequency
Be the echo-signal frequency spectrum of the inversion layer ultrasonic transducer of the piezoelectric patches composition of 20MHz, reference frequency that it includes 20.8MHz and
Two peak values of synthesis resonant frequency of 67MHz.Therefore, it can obtain high-frequency ultrasonic signal using low frequency piezoelectric, while
Multiple frequency ultrasonic signal can be obtained.If in addition, being combined using the piezoelectric patches 1 of different-thickness, more different change rule can be obtained
The working frequency combination of rule.Such that it is able to realize high frequency ultrasound imaging and multiple frequency ultrasonic imaging, improve transducer bandwidth and
Imaging resolution.
Used as specific embodiment, the ultrasonic transducer also includes electrode 2, and electrode 2 is connected to piezoelectric patches group two
The outer surface of the piezoelectric patches 1 of side.In the present embodiment, by the different piezoelectric patches 1 of two or more polarised directions along thickness side
Piezoelectric working layer 11 is formed to being bonded together, electrode 2 is connected to the upper and lower surface of piezoelectric working layer 11 (namely most
The upper surface of top piezoelectric piece 1, the lower surface of bottommost piezoelectric patches 1) just can be with, it is not necessary to as traditional lamination ultrasonic transducer
Line equally is carried out to every layer of piezoelectric patches 1.As illustrated in fig. 1 and 2, to be fabricated to ultrasound imaging probe, in the pressure of ultrasonic transducer
The upper and lower surface of electric working lining 11 also needs to be respectively provided with matching layer 3 and back sheet 4, namely back sheet 4 located at the one of piezoelectric patches group
Side, matching layer 3 are located at the opposite side of piezoelectric patches group.If back sheet 4 is conductive material, such as elargol and metal etc., then pressure
The electrode 2 of the lower surface of electric working lining 11 can also be connected on the lower surface of back sheet 4；If matching layer 3 is conductive, then
The electrode 2 of 11 upper surface of piezoelectric working layer can also be connected on the upper surface of matching layer 3.In addition, back sheet 4 can be many
Layer, then one of electrode 2 can be connected with outermost conductive back sheet 4；Matching layer 3 can also be multilayer, then another
One electrode 2 can be connected with outermost conductive matching layer 3.
Specifically, can be tight by glue or epoxy resin or elargol or double faced adhesive tape between above-mentioned two neighboring piezoelectric patches 1
Bonding.Each piezoelectric patches 1 of above-mentioned composition piezoelectric patches group can be same piezoelectric, or piezoresistive material not of the same race
Material, can be using one or more in piezoelectric ceramics, piezoelectric monocrystal, piezoelectric membrane and composite piezoelectric ceramic, and piezoelectric ceramics is such as
PZT, piezoelectric monocrystal such as PMN-PT, piezoelectric membrane such as PVDF and composite piezoelectric ceramic such as 1-3 Piezoelectric anisotropies/2-2 Piezoelectric anisotropies, also
Can be that other have the piezoelectric of polarised direction.The thickness of each piezoelectric patches 1 can be identical, it is different to be,
The piezoelectric patches 1 of such as bottom is 200 microns, the piezoelectric patches 1 at top is 100 microns.The centre frequency of each piezoelectric patches 1 can be phase
With, can also be different, the centre frequency of piezoelectric patches 1 of such as bottom is that 15Mhz, the piezoelectric patches 1 at top are 20MHz.Respectively
The work area size and shape of piezoelectric patches 1 can be identical, it is different to be, the piezoelectric patches 1 of such as bottom can be with
Be the rectangular bar thin slice of 10 × 5 × 0.2mm, the piezoelectric patches 1 at top can be 5 × 5 × 0.2mm square sheets.
As optional implementation method, the shape of above-mentioned each piezoelectric patches 1 can for rectangular bar thin slice or square sheets or
Thin rounded flakes or annular wafer or prismatic thin slice or bowl-shape concave spherical surface thin slice or convex spherical thin slice or arcuation thin slice.
Embodiment 2
A kind of ultrasonic array probe is the embodiment of the invention provides, the probe includes：Multiple ultrasonic transducers are rearranged
Many array element arrays.
As shown in figure 3, the ultrasonic transducer includes at least two piezoelectric patches groups, the wherein side of at least two piezoelectric patches groups
Surface is connected jointly by electric-conductor.Ultrasonic transducer can include multiple piezoelectric patches groups, and the plurality of piezoelectric patches group can be as
Ultrasound element constitutes array.
Used as a kind of optional embodiment, the ultrasonic transducer of the present embodiment shares the piezoelectricity at a bottom or top
Piece, corresponding top or bottom piezoelectric patches are provided separately, wherein, shared piezoelectric patches can respectively be provided separately as holding altogether
Individual piezoelectric patches distinguishes connection electrode, so as to realize the control to single ultrasonic transducer.
As shown in figure 3, after supersonic array is constituted, each piezoelectric patches group can have common back sheet 4 and common
With layer 3.But, in order to realize that each array element (i.e. piezoelectric patches group) is respectively controlled, it is necessary to the one of each piezoelectric patches group
Individual side is respectively provided between electrode, and these electrodes and is mutually not turned on.For example, it may be back sheet 4 or matching layer 3 are insulation material
Material, the electrode in each piezoelectric patches group near back sheet 4 or matching layer 3 is arranged on the outer surface of piezoelectric patches group.For letter
Change structure, reduce line, can by the another side of each piezoelectric patches group by the matching layer of plain conductor or conduction or
Conductive back sheet connection, realizes common ground.Many array element arrays can be linear array or convex battle array or the recessed battle array of bowl face or matrix.Each
Slit between piezoelectric patches group can be air, it is also possible to fill the insulation fillers such as epoxy resin or rubber.
In addition, ultrasound element can also be made up of above-mentioned multiple piezoelectric patches groups, then constitute super by the ultrasound element again
Acoustic array.
As one of which variant embodiment, as shown in figure 4, piezoelectric patches group includes one located at side outermost the
The second piezoelectric patches 02 that one piezoelectric patches 01, at least two is connected with the side of the first piezoelectric patches 01 respectively.Specifically, the second piezoelectricity
Piece 02 can specifically have multi-disc, and a portion is connected with the side superposition of the first piezoelectric patches 01 respectively, and another part sets respectively
Put on the second piezoelectric patches 02 being connected with the first piezoelectric patches 01.Each piezoelectric patches is that through-thickness is superimposed, and adjacent
The polarised direction of two keeps opposite., used as shared bottom or top piezoelectric piece, connection is on one side thereof for first piezoelectric patches 01
The second piezoelectric patches 02 be then by organize it is separate, the gap between the second piezoelectric patches of each group 02 can be air, it is also possible to fill
The insulation filler such as epoxy resin or rubber.First piezoelectric patches 01 can connect an electrode as holding altogether, and each group second is pressed
The electrode of electric piece 02 is then independently connected, i.e., distinguish receiving electrode located at outermost second piezoelectric patches 02, so as to realize individually
Control.Each group of the second piezoelectric patches 02 of through-thickness superposition can be as an array element together with the first piezoelectric patches 01, should
Second piezoelectric patches 02 of multigroup through-thickness superposition can constitute ultrasound transducer array together with the first piezoelectric patches 01.This change
In shape implementation method, each piezoelectric patches can be that same piezoelectric can also be piezoelectric not of the same race, the thickness of each piezoelectric patches
Degree be able to can also be differed with identical.
Embodiment 3
As shown in figure 5, example is originally applied there is provided a kind of ultrasonic image-forming system, including：Any one of the offer of above-described embodiment 1 is inverse
Put ultrasonic transducer, ultrasound emission circuit, the ultrasonic echo receiving circuit and for being processed simultaneously ultrasonic echo of layer distribution
The process circuit of image is converted to, and for the transmitting-receiving conversion of switched conductive ultrasound emission circuit and ultrasonic echo receiving circuit
Switch (T/R Switch).
Specifically, above-mentioned ultrasonic transducer composition ultrasonic probe 21；Transmit-receive switch 22 is used to control ultrasound emission electricity
Road and ultrasonic echo receiving circuit switched conductive；Ultrasound emission circuit includes impulse sender 23；Ultrasonic echo receiving circuit bag
Include echo receiver 24；Process circuit include IL (inversion layer, inversion layer) time gain compensation (TGC) unit 25,
Modulus (A/D) converting unit 26, IL Beam synthesis unit 27, IL signal processing units 28 and IL graphics processing units 29.
During work, transmit-receive switch 22 controls ultrasound emission circuit turn-on first, the pulse hair in ultrasound emission circuit
Emitter 23 produces wideband narrow pulse sequence excitation ultrasound transducer to produce ultrasonic wave；Transmit-receive switch 22 controls ultrasonic echo again
Receiving circuit is turned on, and the ultrasonic echo of detection target is received after being converted to electric signal through ultrasonic transducer by echo receiver 24；
Pass through modulus after time gain compensation is carried out to the electric signal that echo receiver is exported by IL time gain compensations (TGC) unit 25
(A/D) converting unit 26 is converted into data signal, then carries out Beam synthesis treatment to it by IL Beam synthesis unit 27, finally
It is filtered through IL signal processing units 28, visual image is converted into by IL graphics processing units 29 after the treatment such as denoising
Information, the visual image information can be shown by display 30.In addition, the ultrasonic image-forming system also includes that user's control is defeated
Enter unit 31, can be used for the essential information of input detection target (such as patient), can be also used for selecting ultrasonic probe
The mould of working frequency (reference frequency or synthesis resonant frequency), time gain compensation parameter, the depth of focus and image procossing/display
Formula etc..
When processing ultrasound echo signal, the ultrasonic image-forming system from traditional single centre frequency is different：
When time gain is calculated, it is necessary to reference frequency and different resonant frequencies according to ultrasonic transducer calculate phase respectively
The gain answered；Time gain compensation curve can be calculated by the parameter of the corresponding imaging pattern for prestoring and with minor function：TGC
(i)=Depth (i) * Att (i, f) * IL (f) * 2+Base, wherein, i represents that target acquisition point, Depth (i) represent target acquisition
The depth of point, Att (i, f) represent the attenuation coefficient of target acquisition point correspondence working frequency, and IL (f) represents working frequency (benchmark
Frequency or a certain synthesis resonant frequency), Base represents initial gain.
Carrying out when Beam synthesis are processed, it is necessary to reference frequency and different resonant frequencies according to ultrasonic transducer are entered respectively
The corresponding Beam synthesis of row；
When signal transacting is carried out, it is necessary to reference frequency and different resonant frequencies according to ultrasonic transducer, i.e., in difference
Frequency of heart carries out corresponding signal transacting respectively；
When image procossing is carried out, it is necessary to reference frequency and different resonant frequencies according to ultrasonic transducer, i.e., in difference
Frequency of heart carries out corresponding image procossing respectively, is imaged respectively so as to the signal to different center frequency, can also be right
The image formation of different center frequency is merged.And then ultrasonoscopy and the fusion of display display different frequency can be utilized
Ultrasonoscopy afterwards.
The ultrasonic image-forming system that the present embodiment is provided, the piezoelectric working layer of its ultrasonic transducer is along thickness by least two
Piezoelectric patches 1 and the polarised direction of two neighboring piezoelectric patches 1 that direction is superimposed are conversely, therefore it can once launch and receive comprising not
The ultrasonic signal of same frequency (reference frequency, the different resonant frequencies of synthesis), so as to once obtain the super of different frequency simultaneously
Acoustic image, including reference frequency ultrasonic echo image and each synthesis resonant frequency ultrasonic echo image, variant frequency it is super
Acoustic image can also be merged accordingly.
Because the ultrasonic image-forming system that the present embodiment is provided can be operated under different centre frequencies, therefore without changing
The probe of different frequency, it is possible to switching working mode.Wherein, lower frequency reference frequency mode of operation can obtain deeper scope
Ultrasonic imaging is detected, and the ultrasonoscopy of Shallow High Resolution can be obtained under frequency multiplication mode of operation high.Visited using a ultrasound
Head can just realize the ultrasonic imaging of different scale different resolution.Furthermore it is also possible to using the frequency multiplication rule of ultrasonic transducer,
Harmonic imaging is realized with reference to microvesicle etc., being effectively simplified conventional harmonic imaging needs low-frequency probe excitation, high frequency probe to receive
Method.Specifically, when the ultrasonic imaging of different scale different resolution is realized using the ultrasonic image-forming system, can once send out
Penetrate comprising different reference frequency ultrasonic waves (and constituting different resonant frequencies), receive ultrasound echo signal after by filter come
The signal of different frequency is distinguished, the ultrasonoscopy of respective frequencies is then converted into using filtered signal, be not only imaged speed
Degree is fast and simple to operate.
Obviously, above-described embodiment is only intended to clearly illustrate example, and not to the restriction of implementation method.It is right
For those of ordinary skill in the art, can also make on the basis of the above description other multi-forms change or
Change.There is no need and unable to be exhaustive to all of implementation method.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (13)
1. a kind of ultrasonic transducer, it is characterised in that including：Piezoelectric patches group, the piezoelectric patches group includes at least two along thickness
Direction superposition piezoelectric patches and the two neighboring piezoelectric patches polarised direction it is opposite.
2. ultrasonic transducer according to claim 1, it is characterised in that also including electrode, the electrode is connected to
The outer surface of the piezoelectric patches of the piezoelectric patches group both sides.
3. ultrasonic transducer according to claim 1, it is characterised in that also including at least one of which back sheet and/or at least
One layer of matching layer, and electrode, the back sheet are located at the piezoelectric patches located at the side of the piezoelectric patches group, the matching layer
The opposite side of group, one of them described electrode is connected with outermost conductive back sheet, another described electrode with it is outermost
Conductive matching layer connection.
4. ultrasonic transducer according to claim 1, it is characterised in that can be by glue between the two neighboring piezoelectric patches
Water or epoxy resin or elargol or two-sided glue sticking.
5. ultrasonic transducer according to claim 1, it is characterised in that the piezoelectric patches is rectangular bar thin slice or square
Thin slice or thin rounded flakes or annular wafer or prismatic thin slice or bowl-shape concave spherical surface thin slice or convex spherical thin slice or arcuation thin slice.
6. ultrasonic transducer according to claim 1, it is characterised in that the piezoelectric patches group include one located at side most
The second piezoelectric patches that first piezoelectric patches, at least two of outer layer are connected with the first piezoelectric patches side respectively.
7. ultrasonic transducer according to claim 6, it is characterised in that the first piezoelectric patches ground connection, located at outermost layer
Second piezoelectric patches difference receiving electrode.
8. ultrasonic transducer according to claim 1, it is characterised in that the thickness phase of each piezoelectric patches in the piezoelectric patches group
It is same or different.
9. ultrasonic transducer according to claim 1, it is characterised in that the piezoelectric patches uses piezoelectric ceramics, piezoelectricity list
One or more in brilliant, piezoelectric membrane and composite piezoelectric ceramic.
10. a kind of ultrasonic array probe, it is characterised in that including：Ultrasonic transduction any one of multiple claim 1-9
Many array element arrays that device is rearranged.
11. ultrasonic array probes according to claim 10, it is characterised in that many array element arrays with linear array, convex battle array,
The recessed battle array of bowl face or matrix distribution.
12. ultrasonic array probes according to claim 10, it is characterised in that the ultrasonic transducer shares a bottom
Or the piezoelectric patches at top, corresponding top or bottom piezoelectric patches be provided separately, wherein, shared piezoelectric patches can be used as common
End, the individual piezoelectric patches difference connection electrode being respectively provided separately.
A kind of 13. ultrasonic image-forming systems, it is characterised in that including：Ultrasonic transducer any one of claim 1-9,
Ultrasound emission circuit, ultrasonic echo receiving circuit and for being processed ultrasonic echo and be converted to the process circuit of image,
And for switched conductive ultrasound emission circuit and the transmit-receive switch of ultrasonic echo receiving circuit.
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