CN106873318A - A kind of developing apparatus and developing method - Google Patents
A kind of developing apparatus and developing method Download PDFInfo
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- CN106873318A CN106873318A CN201710205380.6A CN201710205380A CN106873318A CN 106873318 A CN106873318 A CN 106873318A CN 201710205380 A CN201710205380 A CN 201710205380A CN 106873318 A CN106873318 A CN 106873318A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
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Abstract
This application discloses a kind of developing apparatus and developing method, the developing apparatus includes：Developing nozzle, connecting line and developing box, wherein：The developing box is used to hold developer solution；The connecting line is used to connect the developing nozzle and the developing box, and the developer solution is delivered into the developing nozzle；The developing nozzle is used to for the developer solution to be sprayed to target area to be developed, and the position of the developing nozzle is adjustable.So, development treatment is carried out in the target area that development is treated using the developing apparatus, to realize during the compensation to TFT dimension of picture, because the position of the developing nozzle for being used to spray developer solution in developing apparatus is adjustable, the target area that therefore, it can more neatly treat development carries out development treatment, and then effectively the size to TFT figures is compensated, reduce the size difference of TFT figures, improve product yield.
Description
Technical field
The application is related to photoresist developing technical field, more particularly to a kind of developing apparatus and developing method.
Background technology
In the making of semiconductor, photoetching process is a kind of very important processing step.Using photoetching process half-and-half
After conductor carries out photoetching treatment, it can be made to be lithographically derived with TFT (the English full name being sized：Thin Film
Transistor, Chinese：Thin film transistor (TFT)) figure.
Specifically, when photoetching treatment is carried out to semiconductor, photoresist is applied to the first step glass for being coated with film
On substrate, photoresist is set to cover whole film；Second step, at a set temperature, the glass substrate to scribbling photoresist carries out soft
Baking is processed, and photoresist is adhered on the glass substrate；3rd step, need to remove on the glass substrate is carried out at the position of photoresist
Alignment exposure-processed；4th step, is cleaned using developer solution to the photoresist for having exposed, and removes the photoresist for having exposed；The
Five steps, hard baking treatment is carried out to the glass substrate after development treatment；6th step, performs etching to the glass substrate after hard baking, and
Obtain that there is the TFT figures being sized.
However, in actual applications, during TFT figures are lithographically derived using photoetching process, due to each technique
The inevitable existing defects of step, cause the size of the TFT figures for finally giving to there is larger error, for example, to applying
When the glass substrate for having photoresist is exposed treatment, if the time for exposure is long, the size phase of the TFT figures for obtaining will be caused
It is smaller than in being sized.So, in the case where TFT dimension of picture has larger error, the yield of product will be caused relatively low.
The content of the invention
The embodiment of the present application provides a kind of developing apparatus and developing method, for solving in existing photoetching process
In, due to inevitable existing defects of each processing step in actual applications, cause the size of the TFT figures for obtaining to exist
Larger difference, the relatively low problem of product yield.
The embodiment of the present application provides a kind of developing apparatus, and the developing apparatus includes：Developing nozzle, connecting line and aobvious
Shadow case, wherein：
The developing box is used to hold developer solution；
The connecting line is used to connect the developing nozzle and the developing box, the developer solution is delivered to described aobvious
Shadow nozzle；
The developing nozzle is used to for the developer solution to be sprayed to target area to be developed, and the developing nozzle position
Put adjustable.
Preferably, the developing apparatus also includes：Fixing device, wherein：
The fixing device is used to fix the developing nozzle, fixed bit of the developing nozzle in the fixing device
Put adjustable.
Preferably, the fixing device includes：Support and locking mechanism, wherein：
Under the non-locking state of the locking mechanism, the developing nozzle is adjusted to setting position, the setting position
It is set to the position corresponding with the target area to be developed；
After developing nozzle regulation to the setting position, the locking mechanism locks to institute the developing nozzle
State setting position.
Preferably, the connecting line includes at least one connecting interface, and the developing nozzle is by described in one of them
Connecting interface is connected with the connecting line.
Preferably, the developing nozzle is connected by one of them described connecting interface with the connecting line, including：
The developing nozzle is adjusted to setting position, by the corresponding connecting interface in the setting position with it is described
Connecting line is connected, and the setting position is the position corresponding with the target area to be developed.
Preferably, the number of the developing nozzle is more than 1, and the fixed position of at least two developing nozzle is treated with described
The position of the target area of development is corresponding.
Preferably, the fixed position of at least two developing nozzle is adjacent；
Or, the fixed position of at least two developing nozzle is mutually non-conterminous；
Or, the fixed position even of developing nozzle described at least two is adjacent at least two developing nozzle.
Preferably, the spray scope of developing nozzle target area to be developed according to determines.
The embodiment of the present application also provides a kind of developing method, including：
It is determined that target area to be developed；
The developing nozzle is adjusted to the position corresponding with the target area to be developed；
Developer solution is sprayed into the target area to be developed using the developing nozzle carries out development treatment.
Preferably, it is described to determine target area to be developed, including：
Determine the actual size of destination object in setting regions；
By the actual size of the destination object and the destination object be sized contrasted；
Determine the destination object of the actual size with the difference being sized more than setting value, and will be described
Region where destination object is used as the target area to be developed.
Above-mentioned at least one technical scheme that the embodiment of the present application is used can reach following beneficial effect：
The developing apparatus that the embodiment of the present application is provided, comprising developing nozzle, connecting line and developing box, the developing box
For holding developer solution；The connecting line is used to connect the developing nozzle and the developing box, by developer solution conveying
To the developing nozzle；The developing nozzle is used to for the developer solution to be sprayed to target area to be developed, and the development
The position of nozzle is adjustable.So, development treatment is carried out in the target area that development is treated using the developing apparatus, it is right to realize
During the compensation of TFT dimension of picture, because the position of the developing nozzle for being used to spray developer solution in developing apparatus is adjustable, therefore, can
Development treatment is carried out with the target area for more neatly treating development, and then effectively the size to TFT figures is compensated,
Reduce the size difference of TFT figures, improve product yield.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding of the present application, constitutes the part of the application, this Shen
Schematic description and description please does not constitute the improper restriction to the application for explaining the application.In the accompanying drawings：
A kind of structural representation of developing apparatus that Fig. 1 is provided for the embodiment of the present application；
A kind of side view of fixing device that Fig. 2 (a) is provided for the embodiment of the present application；
A kind of top view of fixing device that Fig. 2 (b) is provided for the embodiment of the present application；
A kind of structural representation of connecting line that Fig. 3 is provided for the embodiment of the present application；
The structural representation of another developing apparatus that Fig. 4 is provided for the embodiment of the present application；
A kind of schematic flow sheet of developing method that Fig. 5 is provided for the embodiment of the present application.
Specific embodiment
In the prior art, during TFT figures are lithographically derived using photoetching process, because each processing step is deposited
In inevitable defect, the TFT figures for finally giving are caused to be unsatisfactory for setting shape or size, that is to say, that photoetching treatment
The size of the TFT figures for obtaining is not up to standard, causes product yield relatively low.
In order to reduce the scale error of TFT figures so that the size of TFT with up to standard, and then can improve product yield, existing
Have in technology, the size of TFT figures can generally be compensated using following two methods, including：
First method：In the alignment exposure process of photoetching process, TFT is schemed by the exposure energy for adjusting photoresist
The size of shape is compensated.
Specifically, during being exposed to the glass substrate for being coated with photoresist using exposure machine, can basis
The size requirement of different product, the exposure of different number of times is carried out to whole glass substrate, to carry out four exposures to glass substrate,
Every time exposure area for glass substrate a quarter as a example by, when being exposed using exposure machine, can unrestricted choice it is each
The exposure energy that exposure is used：If existing TFT figures is oversized, exposure energy can be increased, be exposed with increasing
Photoresist size, and then reduce the size of TFT figures for ultimately forming, if existing TFT figures is undersized, can
To reduce exposure energy, to reduce the size of the photoresist being exposed, and then increase the size of the TFT figures for ultimately forming；Most
Afterwards, compensation is exposed to the TFT figures in other regions using identical method, is finally realized to TFT on whole glass substrate
The compensation of dimension of picture.
The second way：During the baking (soft baking and/or firmly baking) of photoetching process, by adjustment for adding for toasting
The temperature of hot plate block is compensated to the size of TFT figures.
By taking soft baking as an example, if existing TFT figures is oversized, the temperature of heating plate can be reduced, to reduce
The difficulty of follow-up exposure-processed, the size of the photoresist that increase is exposed, and then reduce the chi of the TFT figures for ultimately forming
It is very little；If existing TFT figures is undersized, the temperature of heating plate can be increased, to increase follow-up exposure-processed
Difficulty, the size of the photoresist that reduction is exposed, and then increase the size of the TFT figures for ultimately forming.
Both the above solution can realize the compensation to TFT dimension of picture, however, in actual applications, it is above-mentioned
At least there is following defect in two kinds of solutions：
For first method：Because the position of exposure machine is fixed, therefore, only can be with by way of adjusting exposure energy
Size to TFT figures in characteristic area is compensated；
For second method：Because the position of the heating plate for toasting is fixed, therefore, by adjusting heating plate
Temperature the size of TFT figures in characteristic area can only be compensated.
That is, above two method has the limitation of compensatory zone, cause what TFT dimension of picture was compensated
Effect on driving birds is not good.
Based on above-mentioned problem, the embodiment of the present application provides a kind of developing apparatus and developing method, and this shows
Image device includes：Developing nozzle, connecting line and developing box, wherein：The developing box is used to hold developer solution；The connection
Pipeline is used to connect the developing nozzle and the developing box, and the developer solution is delivered into the developing nozzle；The development
Nozzle is used to for the developer solution to be sprayed to target area to be developed, and the position of the developing nozzle is adjustable.
So, development treatment is carried out in the target area that development is treated using the developing apparatus, to show to TFT figures
When size is compensated, because the position of the developing nozzle for being used to spray developer solution in developing apparatus is adjustable, therefore, it can more
Neatly treating the target area of development carries out development treatment, and then size to TFT figures is compensated, and reduces TFT figures
Size difference.
For solution in above-mentioned two, the embodiment of the present application is using the developing apparatus to TFT figures
When size is compensated, because the position of the developing nozzle in the developing apparatus is adjustable, therefore, the size to TFT figures is entered
Can not be limited by compensatory zone during row compensation, the compensation to TFT dimension of picture is more flexible, and the free degree is higher.
Technical scheme is clearly and completely retouched with reference to the application specific embodiment and corresponding accompanying drawing
State.Obviously, described embodiment is only some embodiments of the present application, rather than whole embodiments.Based in the application
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made,
Belong to the scope of the application protection.
It should be noted that the developing apparatus and the developing method of the embodiment of the present application offer can be used
Development treatment in photoetching process, the embodiment of the present application carries out development treatment and obtains with the photoresist to covering on glass substrate
Illustrated as a example by TFT figures.
The developing method that the embodiment of the present application is provided, the glass base to be developed that can be used for after to exposure-processed
Plate carries out development treatment, it is also possible to for after carrying out development treatment to glass substrate and obtaining TFT figures, described in obtaining
TFT figures are carried out again or multidevelopment is processed, and are not specifically limited here.At the development provided using the embodiment of the present application
When reason method is carried out again to glass substrate or multidevelopment is processed, it is possible to achieve the size of the TFT figures to obtaining is mended
Repay.
In terms of existing technologies, in the developing apparatus for being used due to the developing method that the embodiment of the present application is provided
Developing nozzle position it is adjustable, therefore, the embodiment of the present application provide developing method can not receive target to be developed
The limitation in region, when the size of the TFT figures using the method to obtaining is compensated, the free degree is higher, and compensation effect is more
It is good.
Below in conjunction with accompanying drawing, the technical scheme that each embodiment of the application is provided is described in detail.
Embodiment 1
A kind of structural representation of developing apparatus that Fig. 1 is provided for the embodiment of the present application, the developing apparatus can be used for
The glass substrate for treating development carries out development treatment.The developing apparatus is as described below.
The developing apparatus that the embodiment of the present application is provided, including developing nozzle 11, connecting line 12 and developing box 13, its
In：
The developing box 13 is used to hold developer solution；
The connecting line 12 is used to connect the developing nozzle 11 and the developing box 13, and the developer solution is delivered to
The developing nozzle 11；
The developing nozzle 11 is used to for the developer solution to be sprayed to target area to be developed, and the developing nozzle 11
Position it is adjustable.
As shown in figure 1, the developer solution for carrying out development treatment, the connecting line can be held in the developing box 13
12 one end can be connected with the developing box 13, and the other end is connected with the developing nozzle 11, so, in the developing box 13
Developer solution can enter the developing nozzle 11 by the connecting line 12.
Can be glass substrate to be developed in the lower section of the developing nozzle 11, the glass substrate to be developed can be with
Comprising target area to be developed, (in the embodiment of the present application, the target area to be developed can be the to be compensated of TFT figures
Developing regional), the developer solution can be sprayed to the target area to be developed by the developing nozzle 11, with to described
Target area to be developed carries out development treatment.
Compared with prior art, the position of the developing nozzle 11 is adjustable for the embodiment of the present application, that is to say, that the development
Relative position between nozzle 11 and the target area to be developed is adjustable, so, can more neatly treat development
Target area carries out development treatment.In actual applications, to described when the target area developed carries out development treatment, it is described
The position of target area to be developed can be fixed, and by adjusting the position of the developing nozzle 11 to the area to be developed
Domain carries out development treatment.
In another embodiment that the application is provided, the developing apparatus also includes：Fixing device, wherein：The fixation
Device is used to fix the developing nozzle, and fixed position of the developing nozzle in the fixing device is adjustable.
In the embodiment of the present application, the purpose of the fixing device is mainly and is fixed the developing nozzle, and described
Fixed position of the developing nozzle in the fixing device is adjustable.Wherein, adjusted in the fixed position to the developing nozzle
When whole, specifically, can be adjusted according to the position of the target area to be developed, the result of adjustment can be：So that
The developer solution can be sprayed to the target area to be developed by the developing nozzle, for example, can spray the development
Mouth is adjusted to the surface of the target area to be developed so that the developing nozzle can vertically spray the developer solution
Drench to the target area to be developed.
In actual applications, in order that fixed position of the developing nozzle in the fixing device is adjustable, can be with
The material of the connecting line is designed for flexible material, so, can more easily to the fixing device of the developing nozzle
It is adjusted.
In the embodiment of the present application, used as a kind of alternatively mode, the fixing device can include：Support and locking are tied
Structure, wherein：
Under the non-locking state of the locking mechanism, the developing nozzle is adjusted to setting position, the setting position
It is set to position corresponding with the target area to be developed；
After developing nozzle regulation to the setting position, the locking mechanism locks to institute the developing nozzle
State setting position.
A kind of side view of fixing device that Fig. 2 (a) is provided for the embodiment of the present application.As shown in Fig. 2 (a), the fixation
Device includes support 21 and locking mechanism 22, and the fixing device is used to for the developing nozzle 23 to be fixed on the support 21
On.
A kind of top view of fixing device that Fig. 2 (b) is provided for the embodiment of the present application.As shown in Fig. 2 (b), the fixation
The support 21 that device includes can be straight trip slide rail, and the (not shown) of the developing nozzle 23 can be tied by the locking
Structure 22 is fixed on the optional position of the straight trip slide rail.
In the embodiment of the present application, when the developing nozzle adjusts fixed position on the bracket, the locking knot
Structure may be at non-locking state, and the developing nozzle is moved to setting position, the developing nozzle under non-locking state
After being moved to the setting position, the locking mechanism locks to the setting position developing nozzle.
In the embodiment of the present application, the setting position can be position corresponding with the target area to be developed, this
In position corresponding with the target area to be developed, can be that can be sprayed to for the developer solution by the developing nozzle
The position of the target area to be developed, for example, the setting position can be directly over the target area to be developed
Position.
It should be noted that in actual applications, the support includes but is not limited to above-mentioned straight trip slide rail, for example, institute
It can be circular slide rail, or polygon slide rail to state support, etc., can specifically be determined according to actual conditions, do not do here
Limit.The locking mechanism is included but is not limited to：Screw bolt and nut, is also not specifically limited here.
The developing apparatus based on above-mentioned record, as a kind of alternatively mode, the another embodiment that the application is provided
In, the connecting line can include at least one connecting interface, and the developing nozzle passes through one of them described connecting interface
It is connected with the connecting line.
A kind of structural representation of connecting line that Fig. 3 is provided for the embodiment of the present application.
As shown in figure 3, the connecting line can include 9 connecting interfaces, it is respectively 31,32 ... ....39, wherein, often
One connecting interface can be connected with the developing nozzle, as shown in figure 3, connecting interface 33 connects with developing nozzle 310
Connect.
In the embodiment of the present application, the developing nozzle is connected by one of them described connecting interface with the connecting line
Connect, specifically include：
The developing nozzle is adjusted to setting position, by the corresponding connecting interface in the setting position with it is described
Connecting line is connected, and the setting position is the position corresponding with the target area to be developed.
That is, when the developing nozzle is connected to one of them described connecting interface, it is possible, firstly, to determine described aobvious
Shadow nozzle is needed by fixed setting position；Secondly, it is determined that behind the setting position, it is determined that corresponding with the setting position
The connecting interface；Finally, the developing nozzle is connected to the connecting interface of determination.
Wherein, the setting position is identical with the setting position of above-mentioned record, and description is not repeated herein.
So, after the developing nozzle is connected to the connecting interface, the connecting interface can be by the developing nozzle
It is connected with the connecting line, and the developing nozzle is fixed, now, the developing nozzle can be by the developer solution
It is sprayed to the target area to be developed.
For example, as shown in Figure 3, it is known that target area to be developed, the developing nozzle 310 can be adjusted to described and treated
The surface of the target area of development, now, connecting interface corresponding with the position is 35, then, the development can be sprayed
Mouth 310 is connected to connecting interface 35, so, the center line of connecting interface 35, developing nozzle 310 and target area to be developed
Can point-blank, developer solution can be vertically sprayed to developing nozzle 310 target area to be developed.
It should be noted that the content based on above-mentioned record, in actual applications, the developing apparatus is by the development
When nozzle is fixed, fixed mode can be fixed using the fixing device, or by the connection
The multiple connecting interfaces included in pipeline are fixed, or are mutually tied by the fixing device and the connecting interface
The mode of conjunction is fixed, and is not specifically limited here.
A kind of structural representation of developing apparatus that Fig. 4 is provided for the embodiment of the present application.
In Fig. 4, the developing apparatus include developing nozzle 41, connecting line 42, developing box 43 and fixing device 44, its
In, developer solution is contained with inside developing box 43, developer solution enters developing nozzle 41 by connecting line 42, and connecting line 42 is included
Multiple connecting interfaces, developing nozzle 41 is connected with the connecting interface directly over target area to be developed, and developing nozzle 41 is consolidated
It is scheduled in fixing device 44.
Valve can also be included on connecting line 42 shown in Fig. 4, in the state of valve is in and opens, developer solution enters
Developer solution is sprayed to target area to be developed by developing nozzle 41, developing nozzle 41.
The developing apparatus that the embodiment of the present application is provided, when the target area for treating development carries out development treatment, due to aobvious
The position of the developing nozzle in image device for spraying developer solution is adjustable, therefore, it can more neatly treat the target of development
Region carries out development treatment；Development treatment is carried out in the target area for treating development, to realize the compensation to TFT dimension of picture
When, because the position of the developing nozzle for being used to spray developer solution in developing apparatus is adjustable, the free degree is higher, therefore, it can flexibly
Treat development the size of TFT figures of target area compensate, and then effectively reduce the size difference of TFT figures.
It should be noted that in the embodiment of the present application, in order to the target area that can more neatly treat development is entered
Row development treatment, the number of the developing nozzle can be more than 1, that is to say, that the number of the developing nozzle is at least 2,
Wherein, the position of at least two developing nozzle is adjustable.
Specifically, can be according to the target area to be developed neatly to the position of at least two developing nozzle
It is adjusted, the fixed position of at least two developing nozzle after adjustment can be with the position of the target area to be developed
Put corresponding, at the corresponding position, can be sprayed to for the developer solution described to be developed by the developing nozzle
Target area, for example, the fixed position of at least two developing nozzle after adjustment can be the target area to be developed
The surface in domain, in the surface of the target area to be developed, can be sprayed to for developer solution described by the developing nozzle
Target area to be developed.
In the embodiment of the present application, at least two developing nozzle is carried out according to the target area to be developed
After adjustment, the position relationship between at least two developing nozzle can at least include following several situations：
The first：The fixed position of at least two developing nozzle is adjacent；
Second：The fixed position of at least two developing nozzle is mutually non-conterminous；
The third：The fixed position even of developing nozzle described at least two is adjacent at least two developing nozzle.
So that the number of the developing nozzle is 3 as an example, if the target area to be developed is single region, that
, the position relationship between 3 developing nozzles after adjustment can be adjacent；If the target area to be developed is three
Mutual non-conterminous region, then, the position relationship between 3 developing nozzles after adjustment can be mutually non-conterminous, you can so that
A region is sprayed with a developing nozzle；If the target area to be developed is two regions, then, after adjustment 3
Position relationship between individual developing nozzle can be that the position between 2 developing nozzles is adjacent, the position of another developing nozzle
Position with the two developing nozzles is non-conterminous.
In the embodiment of the present application, for one of them described developing nozzle, the spray scope of the developing nozzle
Determined according to the target area to be developed.If for example, the Area comparison of the target area to be developed is small, then, can
It is small with the Area comparison for determining the developing nozzle；If the Area comparison of the target area to be developed is big, then, can be true
The Area comparison of the fixed developing nozzle is big.
It should be noted that in actual applications, in order to more neatly enter to the target area to be developed
Row spray, the area in the target area to be developed is larger, when the spray area of the developing nozzle is smaller, can also lead to
The mode of the number for increasing the developing nozzle is crossed, the development treatment to the target area to be developed neatly is realized.
The developing apparatus that the embodiment of the present application is provided, can include at least two developing nozzles, at least two development
The fixed position of nozzle neatly can be adjusted according to the target area to be developed, and so, use the development
The target area that device treats development can more flexibly, and then in the target area for treating development when carrying out development treatment
When the size of TFT figures is compensated, can not be limited by compensatory zone, the free degree of compensation is higher, compensation effect is more preferably.
Embodiment 2
A kind of schematic flow sheet of developing method that Fig. 5 is provided for the embodiment of the present application, the developing method
The developing apparatus that can be recorded by above-described embodiment 1 is realized.Methods described is as described below.
The embodiment of the present application to carry out to the glass substrate for being coated with photoresist (or repeatedly) development treatment again, to realize
The size of the TFT figures to having obtained is illustrated as a example by compensating.
Step 501：It is determined that target area to be developed.
In step 501, before needing to carry out development treatment again to the photoresist on glass substrate, it may be determined that need
Will development treatment again target area to be developed.In the embodiment of the present application, the target area to be developed can be institute
The size for stating the TFT figures on glass substrate does not reach target area.
In the embodiment of the present application, as a kind of alternatively mode, it is determined that target area to be developed, specifically includes：
Determine the actual size of destination object in setting regions；
By the actual size of the destination object and the destination object be sized contrasted；
Determine the destination object of the actual size with the difference being sized more than setting value, and will be described
Region where destination object is used as the target area to be developed.
In the embodiment of the present application, the destination object can be carried out after the treatment of photoetching process, it is necessary to the TFT figures for obtaining
Shape, the setting regions can be the region where the TFT figures included on glass substrate.
Specifically, after the treatment for carrying out photoetching process to glass substrate, it may be determined that the reality of the TFT figures for having obtained
Size, at this point it is possible to by the actual size of TFT figures and the TFT figures for needing to obtain be sized be compared, and calculate
Difference between obtaining actual size and being sized.
The embodiment of the present application, can be described after the difference between obtaining the actual size of TFT figures and being sized
Difference is compared with setting value, if the difference is more than the setting value, then can determine have more than the setting value
Size TFT figures, at this point it is possible to using the region where the TFT figures as the target area to be developed.
Wherein, the setting value can determine according to actual conditions, be not specifically limited here.
Step 502：The developing nozzle is adjusted to the position corresponding with the target area to be developed.
In step 502, it is determined that described wait behind the target area developed, can be aobvious by what is included in the developing apparatus
Shadow cut-out governing extremely position corresponding with the target area to be developed.
In the embodiment of the present application, the position corresponding with the target area to be developed can be the developing nozzle energy
Enough positions that developer solution is sprayed to the target area to be developed, for example, the developing nozzle can be adjusted to described
The surface of target area to be developed.
It should be noted that in the embodiment of the present application, can be according to the area of the target area to be developed and institute
The spray area of developing nozzle is stated, it is determined that the number of the developing nozzle of regulation is needed, if only needing to a development
Nozzle can just realize treating the spray of developing regional, then, the position of one developing nozzle can be adjusted；Such as
Fruit at least two developing nozzles of needs can just realize the spray to the target area to be developed, then, can be neatly
Position at least two developing nozzle is adjusted so that the position of the developing nozzle after regulation can be realized to described
The spray of target area to be developed.
Specifically, when being adjusted to the developing nozzle, can be carried out according to the fixed form of the developing nozzle
Adjustment determines, if for example, the developing nozzle is fixed in the fixing device described in embodiment 1, then, can be with
Adjust fixed position of the developing nozzle in the fixing device；If the developing nozzle is fixed in embodiment 1
On the connecting line comprising at least one connecting interface recorded, then, the developing nozzle can be adjusted with the company
The connecting interface connected on adapter road.
Step 503：Developer solution is sprayed into the target area to be developed using the developing nozzle is carried out at development
Reason.
In step 503, the developing nozzle is being adjusted to behind the position corresponding wait the target area developed, can
Developer solution is sprayed to the target area to be developed with using the developing nozzle, is realized to the target area to be developed
The development treatment in domain.
The embodiment of the present application, during development treatment is carried out to the target area to be developed, can supervise in real time
Whether the size for controlling TFT figures in the target area is up to standard, if up to standard, can adjust the developing nozzle to not reaching
The corresponding position of target TFT figures, so, can easily according to the size of the TFT figures after development treatment, flexible modulation
The position of the developing nozzle, and then more efficiently the size to TFT figures is compensated.
The developing method that the embodiment of the present application is provided, development treatment is carried out in pair target area to be developed for determining
When, the adjustable developing nozzle in position can be adjusted to the position corresponding with the target area to be developed, and use
Developer solution is sprayed to target area to be developed by the developing nozzle after adjusting position, and the aobvious of the target area of development is treated in realization
Shadow treatment.So, because the position of developing nozzle can be adjusted according to target area to be developed, therefore, it is aobvious treating
The target area of shadow carries out development treatment, during realizing compensating the size of TFT figures, more flexibly, and can not receive
The limitation of compensatory zone, compensation effect is more preferably.
Embodiments herein is the foregoing is only, the application is not limited to.For those skilled in the art
For, the application can have various modifications and variations.It is all any modifications made within spirit herein and principle, equivalent
Replace, improve etc., within the scope of should be included in claims hereof.
Claims (10)
1. a kind of developing apparatus, it is characterised in that the developing apparatus includes：Developing nozzle, connecting line and developing box, its
In：
The developing box is used to hold developer solution；
The connecting line is used to connect the developing nozzle and the developing box, and the developer solution is delivered into the development spray
Mouth；
The developing nozzle is used to for the developer solution to be sprayed to target area to be developed, and the position of the developing nozzle can
Adjust.
2. developing apparatus as claimed in claim 1, it is characterised in that the developing apparatus also includes：Fixing device, wherein：
The fixing device is used to fix the developing nozzle, and fixed position of the developing nozzle in the fixing device can
Adjust.
3. developing apparatus as claimed in claim 2, it is characterised in that the fixing device includes：Support and locking mechanism, its
In：
Under the non-locking state of the locking mechanism, the developing nozzle is adjusted to setting position, the setting position is
The position corresponding with the target area to be developed；
After developing nozzle regulation to the setting position, the developing nozzle is locked to described and set by the locking mechanism
Positioning is put.
4. the developing apparatus as described in any one of claims 1 to 3, it is characterised in that
The connecting line includes at least one connecting interface, and the developing nozzle passes through one of them described connecting interface and institute
State connecting line connection.
5. developing apparatus as claimed in claim 4, it is characterised in that the developing nozzle described is connect by one of them
Mouth is connected with the connecting line, including：
The developing nozzle is adjusted to setting position, by the corresponding connecting interface in the setting position and the connection
Pipeline is connected, and the setting position is the position corresponding with the target area to be developed.
6. the developing apparatus as described in claims 1 to 3,5 any one, it is characterised in that
The number of the developing nozzle is more than 1, the fixed position of at least two developing nozzle and the target to be developed
The position in region is corresponding.
7. developing apparatus as claimed in claim 6, it is characterised in that
The fixed position of at least two developing nozzle is adjacent；
Or, the fixed position of at least two developing nozzle is mutually non-conterminous；
Or, the fixed position even of developing nozzle described at least two is adjacent at least two developing nozzle.
8. developing apparatus as claimed in claim 7, it is characterised in that
The target area that the spray scope of the developing nozzle is to be developed according to determines.
9. the developing method of a kind of developing apparatus using as described in any one of claim 1 to 8, it is characterised in that wrap
Include：
It is determined that target area to be developed；
The developing nozzle is adjusted to the position corresponding with the target area to be developed；
Developer solution is sprayed into the target area to be developed using the developing nozzle carries out development treatment.
10. developing method as claimed in claim 9, it is characterised in that described to determine target area to be developed, bag
Include：
Determine the actual size of destination object in setting regions；
By the actual size of the destination object and the destination object be sized contrasted；
Determine the destination object of the actual size and the difference being sized more than setting value, and by the target
Region where object is used as the target area to be developed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710205380.6A CN106873318A (en) | 2017-03-31 | 2017-03-31 | A kind of developing apparatus and developing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710205380.6A CN106873318A (en) | 2017-03-31 | 2017-03-31 | A kind of developing apparatus and developing method |
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| Publication Number | Publication Date |
|---|---|
| CN106873318A true CN106873318A (en) | 2017-06-20 |
Family
ID=59160511
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710205380.6A Pending CN106873318A (en) | 2017-03-31 | 2017-03-31 | A kind of developing apparatus and developing method |
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| Country | Link |
|---|---|
| CN (1) | CN106873318A (en) |
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| CN111208714A (en) * | 2020-01-09 | 2020-05-29 | Tcl华星光电技术有限公司 | Developing apparatus and developing method |
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