CN106856213A - A kind of conductive backings of suitable scale volume production and preparation method thereof - Google Patents
A kind of conductive backings of suitable scale volume production and preparation method thereof Download PDFInfo
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- CN106856213A CN106856213A CN201710098200.9A CN201710098200A CN106856213A CN 106856213 A CN106856213 A CN 106856213A CN 201710098200 A CN201710098200 A CN 201710098200A CN 106856213 A CN106856213 A CN 106856213A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000011888 foil Substances 0.000 claims abstract description 138
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000000853 adhesive Substances 0.000 claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000012545 processing Methods 0.000 claims abstract description 20
- 239000002131 composite material Substances 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims description 33
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 24
- 238000007731 hot pressing Methods 0.000 claims description 18
- 239000012528 membrane Substances 0.000 claims description 16
- 238000013461 design Methods 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 13
- 229910052742 iron Inorganic materials 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 5
- 230000006641 stabilisation Effects 0.000 claims description 5
- 238000011105 stabilization Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 239000002313 adhesive film Substances 0.000 claims description 3
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229930000044 secondary metabolite Natural products 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000007514 turning Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 206010053615 Thermal burn Diseases 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013082 photovoltaic technology Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of conductive backings of suitable scale volume production and preparation method thereof; conductive foil is sticked to the composite structure for being formed on substrate and being bonded laminar substrate for conductive layer from top to down by adhesive linkage; enter row line processing to conductive foil by way of laser scoring again; conductive foil at circuit is neither destroyed nor cuts through conductive foil by laser scoring of the invention completely; but conductive foil is only carved into 30%~90% depth; designed in conjunction with special circuit, the later stage is quickly removed the part on conductive foil circuit by artificial or other modes.The present invention program substantially increases the utilization ratio of laser equipment, it is to avoid laser equipment turns into the limitation that conductive backings are quickly prepared, meanwhile, because laser process equipment price is high, this processing mode greatly reduces every piece of processing cost of conductive backings.
Description
Technical field
The invention belongs to area of solar cell, and in particular to a kind of conductive backings and preparation method thereof.
Background technology
The technique that photovoltaic module in existing market generally uses welding high-temperature soldering.The battery of this component is just
Negative electrode is located at the tow sides of battery, and the both positive and negative polarity of adjacent battery is weldingly connected by welding, then with face glass,
Back side backboard is encapsulated together.And the welding stress problem that this technique is caused can be produced during the follow-up long-term outdoor use of component
Security risk, such as high-temperature soldering easily makes the problems such as battery generation is hidden to be split.Therefore the back-contact of conductive backings is used
Solar cell module (hereinafter referred to as MWT components) is an important directions of current photovoltaic technology industrialization.In MWT components
Battery plus-negative plate is respectively positioned on cell backside, while eliminating the welding for series-connected cell, the substitute is with certain line
The conductive backings on road.Before component package, battery need to only be put the fixed position of conductive backings, then by conductive back
Plate, battery, face glass encapsulation.The various hiding wind brought to battery when one this technology avoids high-temperature soldering welding
Danger, two use the battery of same conversion efficiency, and the MWT components of equal area size can be than the traditional components work(of use welding
Rate is higher.But the conductive backings preparation process that can supply in the market is complicated, production capacity is low, high cost.Relatively conventional component,
The income that the power ascension of MWT component technologys is brought e insufficient to make up the increase of the cost brought by conductive backings, together
The production capacity of Shi Xianyou conductive backings is too low, is also the major reason for limiting MWT component scale volume productions.
Be based on background above, this technology propose it is a kind of for MWT components can scale, inexpensive volume production leads
Electric backboard and its mass production method.
The content of the invention
Goal of the invention：For problems of the prior art, the present invention proposes a kind of conduction of suitable scale volume production
Backboard and preparation method, improve the production capacity of conductive backings, reduce the production cost of conductive backings.
Technical scheme：The present invention proposes a kind of conductive backings of suitable scale volume production, including substrate, adhesive linkage, conduction
Paper tinsel, conductive foil is sticked on backboard by adhesive linkage, and it be from top to bottom the composite structure of conductive layer-adhesive linkage-substrate to be formed,
Circuit is portrayed on the conductive foil, the circuit portrays the depth of conductive foil 30%~90%, and this technique can ensure to lead
Electric paper tinsel is not cut through completely, prevents from damageeing substrate, while can increase substantially the efficiency of laser scoring again.
Preferably, a complete conductive foil divide into 60 pieces of square regions, every piece of square region by the circuit of portraying
Each region is divided into two parts by a piece of cell piece of correspondence, circuit thereon, and the two parts are by cell piece positive pole thereon
It is mutually isolated out with negative pole, two neighboring square region is connected with each other by conductive foil, is serially connected cell piece thereon, phase
Adjacent 4 circuits of square region form a joint for similar X-shaped in center corner, and X-shaped joint reduces additional lines
The quantity on road, while after reducing and having torn line, the possibility (residual can cause short circuit) of conductive foil residual at joint location.
Preferably, the circuit of portraying includes 3 positions of starting, and whole conductive foil only needs three lines, reduce tearing line
Difficulty and improve the speed of tearing line.
Preferably, the substrate is common photovoltaic back, including TPT, KPK, KPE or KPF；The adhesive linkage is with viscous
The glued membrane or glue of knot effect, including EVA adhesive film, PVB films, its thickness are 1 μm~500 μm；The conductive foil layer is metal
Paper tinsel, including Copper Foil, aluminium foil, aluminium copper facing or aluminium are silver-plated, and its thickness is 10 μm~200 μm, and the bonding force of the conductive backings is laminated
Before be 0~10N/cm, conductive foil is not departed from from substrate automatically easily can peel off from substrate again, conductive after lamination
The bonding force ＞ 10N/cm of backboard, to ensure more preferable packaging effect.
The present invention also proposes a kind of conductive backings preparation method of suitable scale volume production, when tack coat is glued membrane, bag
Include two kinds and prepare scheme：
The first scheme comprises the following steps：
Step 1：Conductive backings are combined：Glued membrane is layed onto the lower surface of conductive foil, preliminary compound is obtained, then will be tentatively multiple
With substrate be combined for it by way of hot pressing facing to substrate by compound glued membrane, 100 ± 30 DEG C of the hot pressing temperature, during hot pressing
Between 1~20s；
Step 2：Laser scoring：Conductive backings conductive foil after will be compound faces up and is placed on Laser Processing platform, presses
According to the quick groove that the circuit of design is not cut through to conductive foil, after having carved, a complete conductive foil is divided into
Need member-retaining portion and part to be stripped；
Step 3：Circuit is peeled off：Conductive foil to be stripped tears from conductive foil；
Step 4：Draw line position perforate in the back side：Conductive backings substrate after will be compound faces up, with band the rim of a bowl shape frock
Electric iron pressed in conductive backings, tweezer by scald under substrate and adhesive linkage；
Second scheme comprises the following steps：
Step 1：Conductive backings are tentatively combined：Glued membrane is layed onto the lower surface of conductive foil, preliminary compound is obtained；
Step 2：Laser scoring：Preliminary compound conductive paper tinsel is faced up and is placed on Laser Processing platform, according to design
The quick groove that is not cut through to conductive foil of circuit, after having carved, a complete conductive foil has been divided into needing to retain
Part and part to be stripped；
Step 3：Circuit is peeled off：Conductive foil to be stripped tears from conductive foil；
Step 4：Secondary compound and perforate：By preliminary compound glued membrane facing to substrate, by way of hot pressing by its with
Substrate is combined, then will it is compound after conductive backings substrate face up, pressed in conductive backings with the electric iron with the rim of a bowl shape frock
Pressure, tweezers the substrate and adhesive linkage under being scalded, 100 ± 30 DEG C of the hot pressing temperature, 1~20s of hot pressing time.
The preparation method comprises the following steps when tack coat is glue：
Step 1：Conductive backings are combined：Glue be applied on substrate, then conductive foil is covered the substrate for filling glue
On, three is sticky；
Step 2：Laser scoring：Conductive backings conductive foil after will be compound faces up and is placed on Laser Processing platform, presses
According to the quick groove that the circuit of design is not cut through to conductive foil, after having carved, a complete conductive foil is divided into
Need member-retaining portion and part to be stripped；
Step 3：Circuit is peeled off：Conductive foil to be stripped tears from conductive foil；
Step 4：Draw line position perforate in the back side：Conductive backings substrate after will be compound faces up, with band the rim of a bowl shape frock
Electric iron pressed in conductive backings, tweezer by scald under substrate and adhesive linkage.
Preferably, the specific method that the step 2 carries out laser scoring is：The circuit is portrayed by laser equipment and led
The depth of electric paper tinsel 30%~90%.
Preferably, a complete conductive foil divide into 60 pieces of square regions, every piece of side by the circuit of portraying of the step 2
Each region is divided into two parts by the shape region a piece of cell piece of correspondence, circuit thereon, and the two parts are by battery thereon
Piece positive pole is mutually isolated out with negative pole, and two neighboring square region is connected with each other by conductive foil, makes cell piece thereon mutual
Series connection, the circuit of adjacent 4 square regions forms a joint for similar X-shaped in center corner, and X-shaped joint is reduced
The quantity of additional wires, while after reducing and having torn line, (residual can cause short to the possibility of conductive foil residual at joint location
Road).
Preferably, the circuit of portraying of the step 2 includes 3 positions of starting, and whole conductive foil only needs three lines, reduce
The difficulty of tearing line and improve the speed of tearing line.
Preferably, the step 3 enter row line stripping specific method be：First by conductive foil to be stripped from position of starting
Place provokes, and is quickly lifted upwards along circuit, the conductive foil at circuit is separated with adhesive linkage, then by groove edge and conduction
Conductive foil between paper tinsel outer is peeled off.
Preferably, the step 4 carry out draw line position perforate specific method be：The rim of a bowl of the electric iron is a diameter of
5~15mm, temperature setting is 150~250 DEG C, after after temperature stabilization, 2~10s is pressed lightly in position with pores.
The present invention uses above-mentioned technical proposal, has the advantages that：
(1) conductive backings simple structure of the present invention and material selection is wide general, selected processing mode letter
Single, the common circuit processing method of conductive backings has the methods such as mechanical scraping, mechanical stamping, laser, chemical attack, chemical attack
Method is more complicated while have chemical liquids process problem, machining mode to the equipment requirement in terms of processing breadth uniformity compared with
Height, while easily producing mechanical damage to substrate in production process, the conventional processes of laser mode are typically a fixed width
Copper Foil in degree is directly destroyed, and three problems are primarily present in conventional machining：One is machining damage, and this processing mode is easily damaged
Hinder base material；Two is slow process velocity；Three is easily have copper cash, copper scale etc. to remain to cause component short circuit, is selected in this method
Be Laser Processing method, process employs the mode of quick repeatedly line, both improve uniformity, process without
Damage, while improve production efficiency without cutting through Copper Foil completely again.
(2) conductive foil circuit processing mode of the invention makes cost high greatly there is provided the utilization ratio of laser equipment
High laser equipment is fully utilized, and the advantage of this processing mode shows the lifting of process velocity and the control of cost
In system, conductive backings quickly prepare on a large scale by reduce every piece of production cost of conductive backings, the volume production of conductive backings and into
This decline makes it possible the volume production of MWT components, while making the cost advantage of MWT components more obvious.
Brief description of the drawings
Fig. 1 is conductive backings structural representation；
Fig. 2 is conductive foil front laser scoring line map；
Fig. 3 is circuit partial enlarged drawing；
Fig. 4 is conductive backings back side position of opening figure.
Specific embodiment
With reference to specific embodiment, the present invention is furture elucidated, it should be understood that these embodiments are merely to illustrate the present invention
Rather than limitation the scope of the present invention, after the present invention has been read, those skilled in the art are to various equivalences of the invention
The modification of form falls within the application appended claims limited range.
The conductive backings of suitable scale volume production as shown in Figure 1, including substrate 1, adhesive linkage 2, conductive foil 3, conductive foil 3
Sticked on backboard 1 by adhesive linkage 2, it be from top to bottom the composite structure of conductive layer-adhesive linkage-substrate to be formed, described to lead
Circuit 4 is portrayed on electric paper tinsel 3, the circuit 4 portrays the depth of conductive foil 330%~90%, and this technique can ensure conduction
Paper tinsel 3 is not cut through completely, prevents from damageeing substrate 1, while can increase substantially the efficiency of laser scoring again.The conduction for being used
Back board structure is simple, is mainly made up of substrate, adhesive linkage, conductive foil layer, and material selection is wide general, in trilaminate material selection
The most ripe product of industry can be selected, such as substrate 1 is from the conventional photovoltaic back of in the market (such as TPT, KPK, KPE, KPF
Back veneer material), adhesive linkage 2 is conductive from encapsulating material (such as EVA adhesive film, PVB films) or glue conventional in photovoltaic industry
The metal foil such as the layer choosing Copper Foil of paper tinsel 3, aluminium foil, aluminium copper facing, aluminium is silver-plated.The thickness control of the adhesive linkage 2 is in 1 μm~500 μm, institute
The thickness control of conductive foil 3 is stated between 10 μm~200 μm.
In addition except meeting basic environmental aging requirement of experiment, an important process technical characterstic of adhesive linkage of the present invention
It is processing of the bonding force weaker (0~10N/cm) before component lamination technique in order to copper foil circuit in conductive backings, after lamination
Bonding force become strong (＞ 10N/cm) to ensure more preferable packaging effect.
Embodiment 1
The present embodiment proposes a kind of conductive backings preparation method of suitable scale volume production, it is adaptable to which tack coat is glue
Situation, comprises the following steps：
Step 1：Conductive backings are combined：Together with 3 layers of compound sticking of substrate 1 and conductive foil, specifically：First will be such as glue
Water is coated to the surface of substrate 1；Then conductive foil 3 (such as Copper Foil) is layed onto above, after treating that adhesive linkage glue has been done, conductive back
Plate is just combined good；
Step 2：Laser scoring：Conductive backings conductive foil 3 after will be compound faces up and is placed on Laser Processing platform, presses
According to the quick groove that the circuit of design is not cut through to conductive foil 3, after having carved, a complete conductive foil 3 is divided into
Need member-retaining portion and part to be stripped, specifically：Using wavelength 1064nm, power 100w, 2000~4000mm/ of galvanometer speed
The laser equipment of s enters row line and portrays, and portrays the depth of conductive foil 3 30%~90%.Specifically portray circuit as shown in Fig. 2
Portray circuit and one complete conductive foil 3 be divide into 60 pieces of square regions, one piece of cell piece is put on each region, herein will
One piece of square region is referred to as a breadth.Due to the positive and negative electrode point of back contact battery be respectively positioned on cell piece the back side (i.e. with lead
The one side of electric backboard contact), thus one piece of battery when be positioned on the conductive foil 3 of conductive backings, it is necessary to by its positive pole with
Negative pole is mutually isolated out, and cell piece short circuit is prevented, as shown in figure 3, be divided into for the conductive foil 3 of the breadth by the circuit on each breadth
Two regions, cell piece is placed in when above, and positive and negative electrode is located exactly on the different conductive foil 3 in circuit both sides, reached
The purpose of isolation positive and negative electrode point has been arrived, and the upside of breadth 1 is to be connected with each other with the downside of breadth 2, electricity on such breadth 1
Negative pole (positive pole) of the positive pole (negative pole) of pond piece just with cell piece on breadth 2 is connected, and serves the effect of series cells.Separately
Outward, the circuit turning of breadth 1 contacts with each other to form a joint for similar X-shaped (figure center tap position with the circuit turning of breadth 3
Put 1), in fact the circuit of breadth 1 and breadth 3 is same circuit, the joint design of such X-shaped can greatly reduce volume
The quantity of outer circuit, while after considerably reducing and having torn line, (residual can be made the possibility of the residual of conductive foil 3 at joint location
Into short circuit).Additionally, the circuit of this programme design has 3 positions of starting, main part only needs single line (i.e. position of being started in Fig. 2
1 that root line for starting) conductive foil 3 can be demarcated, (two are respectively position of starting to the whole need three of conductive foil 3 line in addition
Put that root line of 2 and the beginning of position 3 of starting), such circuit design greatly reduces the difficulty of tearing line and improves tearing line
Speed.
Step 3：Circuit is peeled off：Conductive foil to be stripped tears from conductive foil 3, specifically：First by conductive foil to be stripped 3
Provoked from position of starting, quickly lifted upwards along circuit, the conductive foil 3 at circuit is separated with adhesive linkage 2, then will carved
Conductive foil between line edge and the outer of conductive foil 3 is peeled off.
Step 4：Draw line position perforate in the back side：Conductive backings substrate 1 after will be compound faces up, with band the rim of a bowl shape frock
Electric iron pressed in conductive backings, tweezer by scald under substrate 1 and adhesive linkage 2, aperture position as shown in figure 4,
Specifically：Carry out draw line position perforate specific method be：A diameter of 5~the 15mm of the rim of a bowl of the electric iron, temperature setting
It is 150~250 DEG C, after after temperature stabilization, 2~10s is pressed lightly in position with pores.
Embodiment 2：
The present embodiment proposes a kind of conductive backings preparation method of suitable scale volume production, it is adaptable to which adhesive linkage is glued membrane
Situation, comprises the following steps：
Step 1：Tack coat is tentatively combined with conductive foil：Glued membrane (such as EVA) is layed onto by (such as copper of conductive foil 3 using the tape casting
Paper tinsel) lower surface, combined strength bination will not be excessive, conductive foil 3 will not automatically from EVA depart from, again can easily from EVA shell
From.
Step 2：Laser scoring：The conductive foil 3 of preliminary compound is faced up and is placed on Laser Processing platform, according to setting
The quick groove that the circuit of meter is not cut through to conductive foil 3, after having carved, a complete conductive foil 3 has been divided into needing
Member-retaining portion and part to be stripped, specifically：Using wavelength 1064nm, power 100w, 2000~4000mm/s's of galvanometer speed
Laser equipment enters row line and portrays, and portrays the depth of conductive foil 3 30%~90%.Specifically circuit is portrayed as shown in Fig. 2 carving
One complete conductive foil 3 divide into 60 pieces of square regions by setting-out road, one piece of cell piece be put on each region, herein by one
Block square region is referred to as a breadth.Because the positive and negative electrode point of back contact battery is respectively positioned on the back side of cell piece (i.e. with conduction
The one side of backboard contact), thus one piece of battery when be positioned on the conductive foil 3 of conductive backings, it is necessary to by its positive pole with it is negative
Pole is mutually isolated out, and cell piece short circuit is prevented, as shown in figure 3, the circuit on each breadth divide into the conductive foil 3 of the breadth
Two regions, cell piece is placed in when above, and positive and negative electrode is located exactly on the different conductive foil 3 in circuit both sides, is reached
The purpose of isolation positive and negative electrode point, and the upside of breadth 1 is to be connected with each other with the downside of breadth 2, battery on such breadth 1
Negative pole (positive pole) of the positive pole (negative pole) of piece just with cell piece on breadth 2 is connected, and serves the effect of series cells.Separately
Outward, the circuit turning of breadth 1 contacts with each other to form a joint for similar X-shaped (figure center tap position with the circuit turning of breadth 3
Put 1), in fact the circuit of breadth 1 and breadth 3 is same circuit, the joint design of such X-shaped can greatly reduce volume
The quantity of outer circuit, while after considerably reducing and having torn line, (residual can be made the possibility of the residual of conductive foil 3 at joint location
Into short circuit).Additionally, the circuit of this programme design has 3 positions of starting, main part only needs single line (i.e. position of being started in Fig. 2
1 that root line for starting) conductive foil 3 can be demarcated, (two are respectively position of starting to the whole need three of conductive foil 3 line in addition
Put that root line of 2 and the beginning of position 3 of starting), such circuit design greatly reduces the difficulty of tearing line and improves tearing line
Speed.
Step 3：Circuit is peeled off：Conductive foil to be stripped tears from conductive foil 3, specifically：First by conductive foil to be stripped 3
Provoked from position of starting, quickly lifted upwards along circuit, the conductive foil 3 at circuit is separated with EVA, then by groove side
Conductive foil between edge and the outer of conductive foil 3 is peeled off.
Step 4：Perforate is compound with final：The EVA of preliminary compound is faced down first, with the mode of hot pressing by itself and base
Plate 1 is finally compound, 100 ± 30 DEG C of the hot pressing temperature, 1~20s of hot pressing time；Substrate 1 one is faced up again after compound, with band
The electric iron of the rim of a bowl shape frock is pressed on substrate, tweezer by scald under substrate and EVA, aperture position as shown in figure 4,
Specifically, the specific method of perforate is：A diameter of 5~the 15mm of the rim of a bowl of the electric iron, temperature setting is 150~250 DEG C, is treated
After temperature stabilization, 2~10s is pressed lightly in position with pores.
Embodiment 3：
The present embodiment proposes the conductive backings preparation method of another suitable scale volume production, it is adaptable to which adhesive linkage is glue
The situation of film, comprises the following steps：
Step 1：Conductive backings are combined：Glued membrane (such as EVA) is layed onto the following table of conductive foil 3 (such as Copper Foil) using the tape casting
Face, obtains preliminary compound, then with substrate 1 is combined for it by way of hot pressing facing to substrate 1 by preliminary compound EVA,
100 ± 30 DEG C of the hot pressing temperature, 1~20s of hot pressing time.
Step 2：Laser scoring：Conductive backings conductive foil 3 after will be compound faces up and is placed on Laser Processing platform, presses
According to the quick groove that the circuit of design is not cut through to conductive foil 3, after having carved, a complete conductive foil 3 is divided into
Need member-retaining portion and part to be stripped, specifically：Using wavelength 1064nm, power 100w, 2000~4000mm/ of galvanometer speed
The laser equipment of s enters row line and portrays, and portrays the depth of conductive foil 3 30%~90%.Specifically portray circuit as shown in Fig. 2
Portray circuit and one complete conductive foil 3 be divide into 60 pieces of square regions, one piece of cell piece is put on each region, herein will
One piece of square region is referred to as a breadth.Due to the positive and negative electrode point of back contact battery be respectively positioned on cell piece the back side (i.e. with lead
The one side of electric backboard contact), thus one piece of battery when be positioned on the conductive foil 3 of conductive backings, it is necessary to by its positive pole with
Negative pole is mutually isolated out, and cell piece short circuit is prevented, as shown in figure 3, be divided into for the conductive foil 3 of the breadth by the circuit on each breadth
Two regions, cell piece is placed in when above, and positive and negative electrode is located exactly on the different conductive foil 3 in circuit both sides, reached
The purpose of isolation positive and negative electrode point has been arrived, and the upside of breadth 1 is to be connected with each other with the downside of breadth 2, electricity on such breadth 1
Negative pole (positive pole) of the positive pole (negative pole) of pond piece just with cell piece on breadth 2 is connected, and serves the effect of series cells.Separately
Outward, the circuit turning of breadth 1 contacts with each other to form a joint for similar X-shaped (figure center tap position with the circuit turning of breadth 3
Put 1), in fact the circuit of breadth 1 and breadth 3 is same circuit, the joint design of such X-shaped can greatly reduce volume
The quantity of outer circuit, while after considerably reducing and having torn line, (residual can be made the possibility of the residual of conductive foil 3 at joint location
Into short circuit).Additionally, the circuit of this programme design has 3 positions of starting, main part only needs single line (i.e. position of being started in Fig. 2
1 that root line for starting) conductive foil 3 can be demarcated, (two are respectively position of starting to the whole need three of conductive foil 3 line in addition
Put that root line of 2 and the beginning of position 3 of starting), such circuit design greatly reduces the difficulty of tearing line and improves tearing line
Speed.
Step 3：Circuit is peeled off：Conductive foil to be stripped tears from conductive foil 3, specifically：First by conductive foil to be stripped 3
Provoked from position of starting, quickly lifted upwards along circuit, the conductive foil 3 at circuit is separated with EVA, then by groove side
Conductive foil between edge and the outer of conductive foil 3 is peeled off.
Step 4：Conductive backings substrate 1 after will be compound faces up, with the electric iron with the rim of a bowl shape frock in conductive backings
Upper pressing, tweezers the substrate 1 and adhesive linkage 2 under being scalded, as shown in figure 4, specifically：Carry out drawing line position perforate
Specific method is：A diameter of 5~the 15mm of the rim of a bowl of the electric iron, temperature setting is 150~250 DEG C, after after temperature stabilization,
Position with pores presses lightly on 2~10s.
It is from top to down conductive layer-adhesive linkage-substrate that conductive foil of the present invention is sticked to by adhesive linkage and formed on substrate
Composite structure, then enter row line processing to conductive foil by way of laser scoring.The laser scoring of the technical program and one
As the maximum difference of laser scoring mode be that this programme neither destroys nor by conductive foil the conductive foil at circuit completely
Cut through, but conductive foil be only carved into 30%~90% depth, designed in conjunction with special circuit, the later stage by artificial or
Other modes quickly remove the part on conductive foil circuit.By way of laser combines artificial or other stripping apparatuses
The utilization ratio of laser equipment can be greatly improved, it is to avoid laser equipment turns into the limitation that conductive backings are quickly prepared, and because
For laser process equipment price is high, so this circuit processing mode can substantially reduce being processed into for every piece of conductive backings
This.
Claims (10)
1. a kind of conductive backings of suitable scale volume production, it is characterised in that including substrate, adhesive linkage, conductive foil, conductive foil leads to
Cross adhesive linkage to stick on backboard, it be from top to bottom the composite structure of conductive layer-adhesive linkage-substrate, the conductive foil to be formed
On be decorated with circuit with laser incising, the circuit portrays the depth of conductive foil 30%~90%.
2. conductive backings of suitable scale volume production according to claim 1, it is characterised in that the circuit of portraying is by
Complete conductive foil divide into 60 pieces of square regions, every piece of square region a piece of cell piece of correspondence, circuit thereon by each
Region is divided into two parts, and with negative pole be mutually isolated out cell piece positive pole thereon by the two parts, two neighboring squared region
Domain is connected with each other by conductive foil, is serially connected cell piece thereon, and the circuit of adjacent 4 square regions is in center corner
Form a joint for similar X-shaped.
3. conductive backings of suitable scale volume production according to claim 1, it is characterised in that the circuit of portraying includes
3 positions of starting.
4. conductive backings of suitable scale volume production according to claim 1, it is characterised in that the substrate is common light
Volt backboard, including TPT, KPK, KPE or KPF；The adhesive linkage is glued membrane or glue with cementation, the glued membrane bag
EVA adhesive film, PVB films are included, its thickness is 1 μm~500 μm；The conductive foil layer is metal foil, including Copper Foil, aluminium foil, aluminium copper facing
Or aluminium is silver-plated, its thickness is 10 μm~200 μm, is 0~10N/cm, ＞ after lamination before the bonding force lamination of the conductive backings
10N/cm。
5. a kind of conductive backings preparation method of suitable scale volume production, it is characterised in that when tack coat is glued membrane, including two
Plant and prepare scheme：
The first scheme comprises the following steps：
Step 1：Conductive backings are combined：Glued membrane is layed onto the lower surface of conductive foil, preliminary compound is obtained, then by preliminary compound
With substrate be combined for it by way of hot pressing facing to substrate by glued membrane, 100 ± 30 DEG C of the hot pressing temperature, and hot pressing time 1~
20s；
Step 2：Laser scoring：Will it is compound after conductive backings conductive foil face up and be placed on Laser Processing platform, according to setting
The quick groove that the circuit of meter is not cut through to conductive foil, after having carved, a complete conductive foil has been divided into needing to protect
Stay part and part to be stripped；
Step 3：Circuit is peeled off：Conductive foil to be stripped tears from conductive foil；
Step 4：Draw line position perforate in the back side：Conductive backings substrate after will be compound faces up, with the electricity with the rim of a bowl shape frock
Flatiron is pressed in conductive backings, tweezers substrate and adhesive linkage under being scalded；
Second scheme comprises the following steps：
Step 1：Conductive backings are tentatively combined：Glued membrane is layed onto the lower surface of conductive foil, preliminary compound is obtained；
Step 2：Laser scoring：Preliminary compound conductive paper tinsel is faced up and is placed on Laser Processing platform, according to the line of design
The quick groove that road is not cut through to conductive foil, after having carved, a complete conductive foil has been divided into needing member-retaining portion
With part to be stripped；
Step 3：Circuit is peeled off：Conductive foil to be stripped tears from conductive foil；
Step 4：Secondary compound and perforate：By preliminary compound glued membrane facing to substrate, by itself and substrate by way of hot pressing
It is compound, then will it is compound after conductive backings substrate face up, press in conductive backings with the electric iron with the rim of a bowl shape frock, use
Tweeter falls the substrate and adhesive linkage under being scalded, 100 ± 30 DEG C of the hot pressing temperature, 1~20s of hot pressing time.
6. a kind of conductive backings preparation method of suitable scale volume production, it is characterised in that when tack coat is glue, including such as
Lower step：
Step 1：Conductive backings are combined：Glue be applied on substrate, then conductive foil is covered on the substrate for filling glue, will
Three is sticky；
Step 2：Laser scoring：Will it is compound after conductive backings conductive foil face up and be placed on Laser Processing platform, according to setting
The quick groove that the circuit of meter is not cut through to conductive foil, after having carved, a complete conductive foil has been divided into needing to protect
Stay part and part to be stripped；
Step 3：Circuit is peeled off：Conductive foil to be stripped tears from conductive foil；
Step 4：Draw line position perforate in the back side：Conductive backings substrate after will be compound faces up, with the electricity with the rim of a bowl shape frock
Flatiron is pressed in conductive backings, tweezers substrate and adhesive linkage under being scalded.
7. the conductive backings preparation method of the suitable scale volume production according to claim 5 or 6, it is characterised in that described
The specific method that step 2 carries out laser scoring is：The circuit portrays the depth of conductive foil 30%~90% by laser equipment
Degree.
8. the conductive backings preparation method of the suitable scale volume production according to claim 5 or 6, it is characterised in that described
One complete conductive foil divide into 60 pieces of square regions, every piece of square region a piece of battery of correspondence by the circuit of portraying of step 2
Each region is divided into two parts by piece, circuit thereon, and with negative pole be mutually separated by cell piece positive pole thereon by the two parts
Leave, two neighboring square region is connected with each other by conductive foil, is serially connected cell piece thereon, adjacent 4 squared regions
The circuit in domain forms a joint for similar X-shaped in center corner.
9. the conductive backings preparation method of the suitable scale volume production according to claim 5 or 6, it is characterised in that described
The circuit of portraying of step 2 includes 3 positions of starting.
10. the conductive backings preparation method of the suitable scale volume production according to claim 5 or 6, it is characterised in that described
Step 4 carry out draw line position perforate specific method be：A diameter of 5~the 15mm of the rim of a bowl of the electric iron, temperature setting is
150~250 DEG C, after after temperature stabilization, 2~10s is pressed lightly in position with pores.
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| CN114242844A (en) * | 2022-01-04 | 2022-03-25 | 南京日托光伏新能源有限公司 | Method for simultaneously producing multiple versions and multiple quantities of photovoltaic modules |
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Address after: 214028 Xishi Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jiangsu Rituo Photovoltaic Technology Co., Ltd. Address before: 210000 No. 29, bu Yue Road, Qiaolin street, Pukou District, Nanjing, Jiangsu. Patentee before: Nanjing day care PV Polytron Technologies Inc |
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Effective date of registration: 20190430 Address after: 221300 Binhu Avenue South, Xiangshan Road West, Pizhou High-tech Industrial Development Zone, Xuzhou City, Jiangsu Province Patentee after: Xuzhou Daycare New Material Technology Co., Ltd. Address before: 214028 Xishi Road, Xinwu District, Wuxi City, Jiangsu Province Patentee before: Jiangsu Rituo Photovoltaic Technology Co., Ltd. |